CN108650804B - Method for manufacturing PDU high-voltage control circuit board of new energy automobile - Google Patents
Method for manufacturing PDU high-voltage control circuit board of new energy automobile Download PDFInfo
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- CN108650804B CN108650804B CN201810467751.2A CN201810467751A CN108650804B CN 108650804 B CN108650804 B CN 108650804B CN 201810467751 A CN201810467751 A CN 201810467751A CN 108650804 B CN108650804 B CN 108650804B
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
Abstract
The invention provides a new energy automobile PDU high-voltage control circuit board manufacturing method, which comprises the following steps: manufacturing a copper bar; manufacturing an FR4 board; and manufacturing the PDU high-voltage control circuit board. The invention effectively solves the problem of layered glue flowing in the traditional manufacturing process by adjusting and changing the parameters of the pressing plate and replacing PP (polypropylene) with pure glue for pressing; in addition, the problem that the copper substrate is easy to break is solved by adjusting the drilling parameters. Compared with the prior art, the invention reduces the production process, improves the production efficiency and ensures the yield of products.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a manufacturing method of a PDU high-voltage control circuit board of a new energy automobile.
Background
Along with the rapid popularization and development of new energy automobiles, higher requirements are put forward on the performance of an electric automobile high-voltage Distribution box, the electric automobile high-voltage Distribution box is a high-voltage electricity large-current Distribution unit (PDU) of a pure electric automobile and a plug-in hybrid electric automobile, is an important component of a whole automobile control system of the electric automobile, and is mainly used for coordinating and driving the function conversion and energy Distribution of high-voltage accessories such as a motor control system, a battery management system, a charging management system, a braking system and the like.
Because the electric automobile high-voltage distribution box adopts a centralized power distribution scheme, the structural design is very compact, the requirement on the power distribution of the whole automobile system framework is very high, and the performance of the PDU high-voltage control circuit board as a PDU high-voltage control circuit board bearing the whole circuit design directly determines the service performance of the new energy electric automobile. The PDU high-voltage control circuit board is a special copper substrate, and if the PDU high-voltage control circuit board is manufactured by adopting a conventional PCB process, PCB drilling parameters cannot produce the copper substrate, so that the cutting is easy to break; and the PDU high-voltage control circuit board manufactured by the conventional PCB process has the problem of layering gummosis in the laminating process, so that the PDU high-voltage control circuit board cannot be manufactured by the conventional PCB process, and the performance of the automobile high-voltage distribution box and the service performance of the electric automobile are difficult to improve.
Disclosure of Invention
Therefore, the invention aims to provide a new energy automobile PDU high-voltage control circuit board manufacturing method capable of effectively improving the performance of an electric automobile high-voltage distribution box.
The purpose of the invention is realized by the following technical scheme.
A new energy automobile PDU high-voltage control circuit board manufacturing method comprises the following steps: manufacturing a copper bar; manufacturing an FR4 board; and manufacturing the PDU high-voltage control circuit board.
Preferably, the copper bar manufacturing comprises:
Cutting the copper substrate, drilling a positioning hole, and then routing the copper substrate to form a copper bar.
Preferably, the drilling parameters when drilling the positioning hole are as follows: the diameter of the cutter is 2.05 mm; spindle speed 25k rpm; the feed speed is 0.5 m/min; the tool retracting speed is 20 m/min; the number of drilling steps was 4.
Preferably, the FR4 board making comprises:
selecting an FR4 base material, and cutting the FR4 base material into FR4 base plates meeting the size requirement;
preprocessing the FR4 substrate, and then performing dry film pressing, exposure and development to manufacture an inner layer pattern;
then, carrying out inner layer etching on the FR4 substrate to form an inner layer circuit pattern;
then adhering pure glue on the upper and lower surfaces of the FR4 substrate, performing air compression once through a manual film drying machine, and conveying at the speed of 0.6 +/-0.1 m/min;
and finally, drilling holes in the FR4 substrate, and milling and grooving.
Preferably, the PDU high voltage control circuit board is manufactured, and includes:
putting the copper bar into a corresponding FR4 groove, carrying out first pressing, then carrying out wire drawing, frame routing and browning treatment;
and then carrying out second pressing, drilling, removing glue lines, plating copper plates, pre-treating volcanic ash, pasting films by a manual film drying machine, exposing and developing, carrying out outer layer graphic treatment, carrying out graphic electroplating, carrying out solder resistance, characters, routing boards, plating gold, pressing nuts, FQC, FQA, and packaging and discharging.
A new energy automobile PDU high-voltage control circuit board manufacturing method comprises the following steps:
cutting the copper substrate, then adopting a cutter with the diameter of 2.05mm, controlling the rotating speed of a main shaft to be 25k rpm, the feeding speed to be 0.5m/min and the retracting speed to be 20 m/min, drilling positioning holes on the copper substrate, and then routing the copper substrate to form the required copper bar;
selecting an FR4 base material, cutting the FR4 base material into an FR4 substrate meeting the size requirement, carrying out pretreatment processing on the FR4 substrate, pressing a dry film, exposing and developing to manufacture an inner layer pattern, and carrying out inner layer etching on the FR4 substrate to form an inner layer circuit pattern;
adhering pure glue to the upper surface and the lower surface of an FR4 substrate, performing air compression once through a manual film drying machine at a conveying speed of 0.6 +/-0.1 m/min, and then drilling and routing the FR4 substrate to form an FR4 substrate slot;
correspondingly embedding the copper bar into a groove of an FR4 substrate, then carrying out first pressing, then carrying out wire drawing, frame routing and browning treatment;
carrying out second pressing, drilling holes on the FR4 substrate, removing glue lines, depositing a copper plate, carrying out volcanic ash pretreatment, pasting a film by a manual film drying machine, exposing and developing, carrying out outer layer graphic treatment, carrying out graphic electroplating, carrying out solder resistance, carrying out characters, routing, depositing gold, pressing nuts, FQC, FQA, and packaging and discharging.
According to the PDU high-voltage control circuit board manufacturing method, the problem of layered gummosis existing in the traditional manufacturing process is effectively solved through adjustment and change of parameters of the pressing plate and pure glue replacing PP (polypropylene) for pressing; in addition, the problem that the copper substrate is easy to break is solved by adjusting the drilling parameters. Compared with the prior art, the invention reduces the production process, improves the production efficiency and ensures the yield of products.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
The invention provides a PDU high-voltage control circuit board of a new energy automobile, which greatly improves the production process of the PDU high-voltage control circuit board and improves the production efficiency by adjusting the parameters of a pressing plate, the drilling parameters and the pressing plate process.
The invention mainly comprises the following steps: a copper bar manufacturing process; FR4 substrate manufacturing process; and a main process for manufacturing the PDU high-voltage control circuit board.
The copper bar manufacturing process comprises cutting → drilling → routing.
The copper bar is a high-current conductive product, is suitable for electrical engineering such as high-low voltage electrical appliances, switch contacts, power distribution equipment, bus ducts and the like, and is also widely used for super-large current electrolytic smelting engineering such as metal smelting, electrochemical plating, chemical caustic soda and the like.
Wherein the process comprises the following steps: cutting the correct plate material to obtain small materials meeting the requirements; then, drilling according to normal drilling parameters; and performing a routing process after the browning is performed according to the normal browning requirement, and processing according to routing parameters of the copper plate.
The method comprises the steps of cutting a copper substrate, drilling a positioning hole in the copper substrate by adopting a cutter with the diameter of 2.05mm and controlling the rotating speed of a main shaft to be 25k rpm, the feeding speed to be 0.5m/min and the retracting speed to be 20 m/min, and then routing the copper substrate to form the required copper bar.
The FR4 substrate manufacturing process includes: cutting material → inner layer pattern → inner layer etching → inner layer pretreatment → pasting pure glue → drilling → routing board.
The specific process comprises the following steps: cutting small materials meeting the requirements according to the requirements by using correct plates according to normal parameters; then normally carrying out inner layer graphic processing such as inner layer pretreatment processing, film pressing, exposure and the like; adjusting etching parameters according to the copper thickness, carrying out inner layer chemical pretreatment on normal parameters, then pasting pure glue, carrying out air compression once by using a manual film drying machine, wherein the conveying speed is 0.6 +/-0.1 m/min, and other parameters are normally used; processing according to normal drilling parameters; and then routing and processing according to the normal routing parameters.
The core plate is mainly manufactured in the step, and in the embodiment, the core plate with the thickness of 2.0mm needs to be manufactured, and the core plate is correspondingly provided with the groove.
The PDU high-voltage control circuit board manufacturing main process comprises the following steps: primary pressing → wire drawing → routing frame → brown oxide → secondary pressing → drilling → glue removal → copper deposition → whole board electroplating → outer layer pattern → pattern electroplating → outer layer etching → etching QC → solder resist → character → routing board → gold deposition → pressing nut → FQC → FQA → packaging.
The specific process comprises the following steps: putting the copper bar into a corresponding FR4 groove; performing first pressing by using a pressing program of HTG001 → performing wire drawing by using a water mill wire drawing machine → routing a frame → performing browning by using normal parameters → performing second pressing between core plates → processing according to normal drilling parameters → processing according to normal parameters through glue removing lines → depositing copper according to normal parameters → performing electric treatment according to normal parameters → performing pretreatment of volcanic ash, pasting a film by using a manual film drying machine, exposing and developing to perform outer layer graphic processing → performing graphic electroplating according to normal parameters → performing solder resisting → characters → routing a gold → depositing → pressing nuts → FQC → FQA → packaging and discharging.
In the step, the manufactured copper bars are correspondingly embedded into the slots of the manufactured core board, then pure glue is respectively pasted on the upper surface and the lower surface of the core board, the thickness of the pure glue is 35 micrometers, then an FR4 substrate with a single-sided copper foil is covered on the outer side of the pure glue, and the smooth surface of the FR4 substrate is in contact with the pure glue, wherein the FR4 glass fiber plate of the FR4 substrate with the single-sided copper foil is 0.508mm in thickness, and the copper foil is 1OZ in thickness.
It should be noted that: the invention uses pure glue to replace PP to press and solve the technical scheme of layering gummosis, wherein the pressing and laminating method comprises the following steps: the core plate is subjected to browning treatment to increase the board surface binding force, the browning treatment is to perform copper surface treatment on the production board after the inner layer is cut, the inner layer is subjected to D/F and the inner layer is subjected to board etching, and an oxide layer is formed on the surface of the inner layer copper foil to improve the joint between the copper foil and the epoxy resin when the multilayer circuit board is pressed. And then tearing off the protective films of the FR4 pure rubber surfaces of the front and back surfaces, stacking the FR4 and the core plate of the front and back surfaces, and aligning rivets according to the outer positioning holes at the four corners. The pure rubber surface protective film can not be leaked and torn during material stacking, the two sides FR4 and the core plate can not have displacement and stacking phenomenon, wherein two release films are respectively placed on the two sides of the working plate, and one silica gel is respectively placed on the two sides of each release film.
The parameters of the bonding program of the HTG001 are as follows:
in conclusion, the technical scheme solves the problem that the new energy automobile PDU high-voltage control circuit board cannot be produced by the previous process, and the quality of the product produced smoothly reaches the standard by the technical scheme.
The above description is intended to be illustrative of the preferred embodiment of the present invention and should not be taken as limiting the invention, but rather, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
Claims (1)
1. A new energy automobile PDU high-voltage control circuit board manufacturing method is characterized by comprising the following steps: the copper bar manufacturing process comprises cutting → drilling → routing; cutting a copper substrate by using a cutter with the diameter of 2.05mm, controlling the rotation speed of a main shaft to be 25k rpm, the feed speed to be 0.5m/min and the withdrawal speed to be 20m/min, drilling positioning holes in the copper substrate, and then routing the copper substrate to form the required copper bar;
FR4 substrate fabrication process, comprising: cutting material → inner layer pattern → inner layer etching → inner layer pretreatment → pasting pure glue → drilling → routing;
the specific process comprises the following steps: cutting small materials meeting the requirements according to the requirements by using correct plates according to normal parameters; then normally carrying out inner layer pretreatment processing, pressing and drying the film, and exposing to carry out inner layer pattern processing; adjusting etching parameters according to the copper thickness, carrying out inner layer chemical pretreatment on normal parameters, then pasting pure glue, carrying out air compression once by using a manual film drying machine, and carrying out conveying at the speed of 0.6 +/-0.1 m/min; processing according to normal drilling parameters; then routing and processing according to normal routing parameters; manufacturing a core plate with the thickness of 2.0mm by using a manufacturing process of an FR4 substrate;
PDU high-voltage control circuit board manufacturing procedure includes: one-time pressing → wire drawing → routing frame → brown oxide → two-time pressing → drilling → glue removal → copper deposition → whole board plating → outer layer pattern → pattern plating → outer layer etching → etching QC → solder resist → character → routing board → gold deposition → pressing nut → FQC → FQA → packaging;
The specific process comprises the following steps: placing the copper bar into a corresponding FR4 groove: performing first pressing by using a pressing program of HTG001 → performing wire drawing by using a water mill wire drawing machine → routing frames → performing browning by using normal parameters → performing second pressing between core plates → processing according to normal drilling parameters → processing according to normal parameters through glue removing lines → copper deposition according to normal parameters → processing according to normal parameter plate electricity → volcanic ash, pasting a film by using a manual film drying machine, exposing and developing to perform outer layer graphic processing → graphic electroplating according to normal parameters → welding → characters → routing plates → gold deposition → pressing nuts → FQC → FQA → packaging and discharging; the manufactured copper bar is correspondingly embedded into a groove of a manufactured core board, then pure glue is pasted on the upper surface and the lower surface of the core board respectively, the thickness of the pure glue is 35 micrometers, then an FR4 substrate with a single-sided copper foil is covered on the outer side of the pure glue, and the smooth surface of the FR4 substrate is in contact with the pure glue, wherein the FR4 glass fiber plate of the FR4 substrate with the single-sided copper foil is 0.508mm in thickness, and the copper foil is 1OZ in thickness;
wherein the parameters of the bonding program of the HTG001 are shown in the following table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810467751.2A CN108650804B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing PDU high-voltage control circuit board of new energy automobile |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810467751.2A CN108650804B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing PDU high-voltage control circuit board of new energy automobile |
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| Publication Number | Publication Date |
|---|---|
| CN108650804A CN108650804A (en) | 2018-10-12 |
| CN108650804B true CN108650804B (en) | 2022-07-19 |
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| CN201810467751.2A Active CN108650804B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing PDU high-voltage control circuit board of new energy automobile |
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| CN112930024B (en) * | 2021-01-25 | 2022-05-03 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
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| CN201928514U (en) * | 2011-03-01 | 2011-08-10 | 梅州博敏电子有限公司 | Embedded strong-current and large-power PCB (printed circuit board) |
| CN105430941A (en) * | 2015-11-02 | 2016-03-23 | 深圳崇达多层线路板有限公司 | Technology for improving thick copper board stitching white edge |
| CN105451465A (en) * | 2015-12-16 | 2016-03-30 | 深圳崇达多层线路板有限公司 | Manufacturing method for circuit board with embedded magnetic core |
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| CN106550558A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of pressing preparation method of embedding ceramic pcb board |
| CN107041077A (en) * | 2017-04-27 | 2017-08-11 | 广东依顿电子科技股份有限公司 | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity |
| CN107613647B (en) * | 2017-08-21 | 2023-05-05 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of new energy intelligent charging system circuit board |
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|---|---|---|---|---|
| CN201928514U (en) * | 2011-03-01 | 2011-08-10 | 梅州博敏电子有限公司 | Embedded strong-current and large-power PCB (printed circuit board) |
| CN105430941A (en) * | 2015-11-02 | 2016-03-23 | 深圳崇达多层线路板有限公司 | Technology for improving thick copper board stitching white edge |
| CN105451465A (en) * | 2015-12-16 | 2016-03-30 | 深圳崇达多层线路板有限公司 | Manufacturing method for circuit board with embedded magnetic core |
Non-Patent Citations (1)
| Title |
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| 多层板压合参数介绍;hbyxb944166;《道客巴巴》;20120328;正文第3-5页 * |
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