CN117460173A - Structure and manufacturing method for ultrathin PCB embedded copper-based product - Google Patents
Structure and manufacturing method for ultrathin PCB embedded copper-based product Download PDFInfo
- Publication number
- CN117460173A CN117460173A CN202311604535.5A CN202311604535A CN117460173A CN 117460173 A CN117460173 A CN 117460173A CN 202311604535 A CN202311604535 A CN 202311604535A CN 117460173 A CN117460173 A CN 117460173A
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- Prior art keywords
- pcb
- copper
- plate
- film
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 59
- 239000010949 copper Substances 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000009713 electroplating Methods 0.000 claims abstract description 26
- 239000002131 composite material Substances 0.000 claims abstract description 20
- 238000005553 drilling Methods 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 230000008021 deposition Effects 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 5
- 238000004381 surface treatment Methods 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 229920002799 BoPET Polymers 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 11
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 30
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 30
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Abstract
The invention discloses a structure and a manufacturing method of an ultrathin PCB embedded copper-based product, which belong to the technical field of copper-based products, and are technically characterized in that: the method comprises a PCB and an auxiliary plate, and further comprises the following steps: mechanically drilling the PCB to obtain a through hole D, and mechanically drilling the auxiliary plate to obtain the through hole D; carrying out copper deposition treatment on the drilled PCB, and plating copper foil on the PCB; attaching the processed PCB and the auxiliary plate to form a composite plate, and performing conventional electroplating on the PCB and the auxiliary plate after attaching; opening blind grooves on the PCB, then, feeding a film on the PCB and the auxiliary plate, and electroplating and leveling the composite plate; tearing the film on the outer side of the composite board, and removing the attached auxiliary board after tearing the film; covering a graphic dry film on the PCB, and then etching the outer layer of the PCB; and (3) performing solder resist on the copper base and the PCB, and performing surface treatment after the solder resist is finished to obtain the composite board with the copper base, thereby having the advantage of solving the difficult problems that an ultra-thin plate cannot be processed and the thin plate cannot be electroplated.
Description
Technical Field
The invention relates to the technical field of copper-based products, in particular to an ultrathin PCB embedded copper-based product structure and a manufacturing method thereof.
Background
The copper-buried substrate is widely used for high-current and high-heat-conductivity products such as power amplifiers, communication, car lamps and the like; compared with a conventional PCB, the manufacturing process of the copper-based embedded PCB is a complex process, requires complex processing equipment with high precision, and requires a plurality of special management and control, and particularly, the batch manufacturing of the copper-based embedded PCB can not be realized by the existing equipment, so that a large amount of manual operation is required; complicated manufacturing process, high cost, low efficiency and the like; as electronic circuits are developed toward high, fine and thin, many ultra-thin copper-embedded products are gradually developed, and the existing conventional PCB processing equipment cannot process the ultra-thin copper-embedded products, which is mainly limited by operations such as thin plate electroplating, thin plate resin grinding, and thin copper-based embedding.
For common copper-embedded products, a slot hole with slightly larger copper base is generally formed in a position of an embedded copper base, then the copper base is embedded, the copper base which is formed by gumming the prepreg through high-temperature lamination is firmly combined with the PCB, or the double-sided board is solidified and formed through a plug resin after the copper base is embedded, and no matter PP filling or resin filling is adopted, mechanical grinding is needed after PP or resin filling.
When the plate is mechanically ground, the plate is affected by a thin plate, the plate is easily damaged and scrapped along with the rolling of a brush wheel, the rapid two-way extrusion grinding plate manufacturing cannot be realized, and the mass production is greatly restricted; the detachable substrate is adopted to be matched with the thin plate for electroplating, so that the electroplating processability is ensured.
Disclosure of Invention
Aiming at the defects existing in the prior art, the embodiment of the invention aims to provide an ultrathin PCB embedded copper-based product structure and a manufacturing method thereof, so as to solve the problems in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the structure comprises a PCB and an auxiliary plate, and further comprises the following steps:
step one: mechanically drilling the PCB to obtain a through hole D, and mechanically drilling the auxiliary plate to obtain the through hole D;
step two: carrying out copper deposition treatment on the drilled PCB, and plating copper foil on the PCB;
step three: attaching the processed PCB and the auxiliary plate to form a composite plate, and performing conventional electroplating on the PCB and the auxiliary plate after attaching;
step four: opening blind grooves on the PCB, then, feeding a film on the PCB and the auxiliary plate, and electroplating and leveling the composite plate;
step five: tearing the film on the outer side of the composite board, and removing the attached auxiliary board after tearing the film;
step six: covering a graphic dry film on the PCB, and then etching the outer layer of the PCB;
step seven: and placing the copper base on one side of the PCB, performing solder resist on the copper base and the PCB, and performing surface treatment after the solder resist is finished to obtain the composite board with the copper base.
As a further scheme of the invention, the PCB adopts a double-sided copper-clad plate, and the thickness of the auxiliary plate is more than or equal to 0.5mm.
As a further scheme of the invention, the side face of the auxiliary plate is provided with an adhesive material, and the adhesive material adopts ABF glue, PET film and PI film.
As a further aspect of the present invention, the size of the through hole D in the first step is 0.2 to 1.0mm larger than the size of the through hole D.
As a further scheme of the invention, the blind groove in the fourth step is grooved in a laser mode.
As a further scheme of the invention, the blind groove electroplating current density in the fourth step is selected to be 6-12A/dm 2 。
As a further scheme of the invention, the thickness of the PCB before copper deposition in the first step is 0.05-0.3 mm.
As a further scheme of the invention, the thickness of conventional electroplating in the third step is more than or equal to 18um and less than or equal to 30um.
In summary, compared with the prior art, the embodiment of the invention has the following beneficial effects:
solves the defect that the traditional method can not process the ultra-thin plate and solves the problem of electroplating the thin plate.
Compared with the traditional copper-buried product, the method does not need manual operation; the copper-based lattice has high consistency and higher importation.
In order to more clearly illustrate the structural features and efficacy of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the invention.
Fig. 2 is a schematic structural view of a copper foil according to an embodiment of the invention.
FIG. 3 is a schematic diagram of a copper-based structure in an embodiment of the invention.
Reference numerals: 1-PCB base plate, 2-accessory plate, 3-copper foil, 4-copper base.
Description of the embodiments
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Specific implementations of the invention are described in detail below in connection with specific embodiments.
In one embodiment, referring to fig. 1 to 3, an ultrathin PCB embedded copper-based product structure and a method for manufacturing the same, the structure comprises a PCB 1 and an auxiliary board 2, and further comprises the following steps:
step one: mechanically drilling the PCB 1 to obtain a through hole D, and mechanically drilling the auxiliary plate 2 to obtain the through hole D;
step two: copper deposition treatment is carried out on the PCB 1 after drilling, and copper foil 3 is plated on the PCB 1;
step three: attaching the processed PCB 1 and the auxiliary board 2 to form a composite board, and performing conventional electroplating on the PCB 1 and the auxiliary board 2 after attaching;
step four: opening blind grooves on the PCB 1, then, sticking films on the PCB 1 and the auxiliary board 2, and electroplating and leveling the composite board;
step five: tearing the film on the outer side of the composite board, and dismantling the attached auxiliary board 2 after tearing the film;
step six: covering a graphic dry film on the PCB 1, and then etching the outer layer of the PCB 1;
step seven: and placing the copper base 4 on one side of the PCB 1, performing solder resist on the copper base 4 and the PCB 1, and performing surface treatment after the solder resist is finished to obtain the composite board with the copper base 1.
Further, referring to fig. 1 to 3, the PCB board 1 is a double-sided copper-clad board, and the thickness of the auxiliary board 2 is greater than or equal to 0.5mm.
Further, referring to fig. 1 to 3, the side surface of the auxiliary board 2 is provided with an adhesive material, and the adhesive material adopts ABF glue, PET film and PI film.
Further, referring to fig. 1 to 3, the size of the through hole D in the first step is 0.2 to 1.0mm larger than the size of the through hole D.
Further, referring to fig. 1 to 3, the blind groove in the fourth step is grooved by adopting a laser method.
Further, referring to FIGS. 1 to 3, the blind groove plating current density in the fourth step is selected to be 6 to 12A/dm 2 。
Further, referring to fig. 1 to 3, in the first step, the thickness of the PCB board 1 is 0.05 to 0.3mm before copper deposition.
Further, referring to fig. 1 to 3, the thickness of the conventional electroplating in the third step is more than or equal to 18um and less than or equal to 30um.
In the embodiment, the PCB 1 is a double-sided copper-clad plate, and the thickness of the PCB 1 is 0.05-0.3 mm when copper is not contained; the thickness of the auxiliary plate is more than or equal to 0.5mm;
the auxiliary board 2 has adhesive property on the surface, can be adhered to the surface of the PCB 1, and has general adhesive strength, and can be peeled off by external force, such as ABF adhesive, PET film, PI film and other materials;
the PCB 1 is drilled, and a hole with the diameter d is designed; the auxiliary plate 2 is drilled with D, and D is 0.2-1.0 mm larger than D;
wherein the drilling holes of the PCB 1 and the auxiliary plate drilling holes are in one-to-one correspondence, and the alignment of the lines is limited by the plate edge marks, so that the dimension of the D holes is enlarged, and the enough safety space is ensured.
Copper is only deposited on the PCB 1, copper is not deposited on the auxiliary plate 2, and only the through hole d is metallized in the conventional electroplating process; the surface of the auxiliary plate 2 is not electroplated, so that the subsequent plate detachment and stripping are facilitated;
the blind opening groove adopts a laser mode, the blind opening groove is deeply drilled through the base material without damaging the bottom copper foil 3, and the bottom copper foil 3 is exposed, and the size and the required specification are equal;
when the film is stuck, only the blind slot holes are exposed, and other positions and drilling positions are covered by dry films;
the plate thickness is manufactured according to the normal PCB flow.
In conventional electroplating, the thickness of the hole copper is generally more than or equal to 18um; and is less than or equal to 30um;
when the blind groove is electroplated, copper at the bottom of the blind groove is required to be communicated with the negative electrode of the power supply; the current density is selected to be made of ultra-large electroplating density, and the current density is preferably selected to be 6-12A/dm < 2 > (ASD);
the blind groove electroplating thickness is flush with the copper foil surface of the window surface.
In one embodiment
Mechanically drilling the PCB 1 to obtain a through hole D, and mechanically drilling the auxiliary plate 2 to obtain a through hole D, wherein the size of the through hole D is 0.2-1.0 mm larger than that of the through hole D;
copper deposition treatment is carried out on the PCB 1 after drilling, and copper foil 3 is plated on the PCB 1;
attaching the processed PCB 1 and the auxiliary board 2, forming a composite board by the PCB 1 and the auxiliary board 2, and carrying out conventional electroplating on the PCB 1 and the auxiliary board 2 after attaching, wherein the electroplating thickness is more than or equal to 18um; and is less than or equal to 30um;
opening blind slots on the PCB 1, and selecting 8A/dm of electroplating current density of the blind slots 2 Then, film sticking is carried out on the PCB 1 and the auxiliary board 2, and the composite board is electroplated and filled;
tearing the film on the outer side of the composite board, and dismantling the attached auxiliary board 2 after tearing the film;
covering a graphic dry film on the PCB 1, and then etching the outer layer of the PCB 1;
placing copper base 4 on one side of PCB 1, arranging two copper bases 4, performing solder resist on copper base 4 and PCB 1, and performing surface treatment after the solder resist is finished to obtain the composite board with copper base 1.
The double-sided copper-clad plate realizes the processing of a single-sided blind groove cavity in a laser grooving mode, so that the inner side of the copper foil 3 on one side is exposed; and the position which does not need to be electroplated is protected by a dry film, and then the electroplating in the groove is filled up by a high-current electroplating technology to generate the local electroplated copper base 4.
Meanwhile, in order to solve the problem of plating of a large-sized thin plate, a support material having a separable function such as ABF (resin substrate of insulator), PET (polyethylene terephthalate), PI (polyimide), carrier Core (separable substrate) is attached to the back side of the plating filled copper-based groove. According to the method, through design optimization, the process of manually embedding copper base is avoided, the resin plug hole or the lamination glue filling flow is reduced, meanwhile, copper base 4 is directly generated in a groove with a designed size by means of electric conduction of copper foil 3, the crystal lattice is closer to the surface layer electroplated copper crystal lattice, and the current carrying and heat conducting effects are better.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (8)
1. The structure comprises a PCB and an auxiliary plate, and is characterized by further comprising the following steps:
step one: mechanically drilling the PCB to obtain a through hole D, and mechanically drilling the auxiliary plate to obtain the through hole D;
step two: carrying out copper deposition treatment on the drilled PCB, and plating copper foil on the PCB;
step three: attaching the processed PCB and the auxiliary plate to form a composite plate, and performing conventional electroplating on the PCB and the auxiliary plate after attaching;
step four: opening blind grooves on the PCB, then, feeding a film on the PCB and the auxiliary plate, and electroplating and leveling the composite plate;
step five: tearing the film on the outer side of the composite board, and removing the attached auxiliary board after tearing the film;
step six: covering a graphic dry film on the PCB, and then etching the outer layer of the PCB;
step seven: and placing the copper base on one side of the PCB, performing solder resist on the copper base and the PCB, and performing surface treatment after the solder resist is finished to obtain the composite board with the copper base.
2. The structure and the manufacturing method of the ultra-thin PCB embedded copper-based product according to claim 1, wherein the PCB adopts a double-sided copper-clad plate, and the thickness of the auxiliary plate is more than or equal to 0.5mm.
3. The structure and the manufacturing method of the ultra-thin PCB embedded copper-based product according to claim 1, wherein the side face of the auxiliary board is provided with an adhesive material, and the adhesive material adopts ABF glue, PET film and PI film.
4. The structure and manufacturing method of the ultra-thin PCB embedded copper-based product of claim 1, wherein the size of the through hole D in the first step is 0.2-1.0 mm larger than the size of the through hole D.
5. The structure and the manufacturing method of the ultra-thin PCB embedded copper-based product according to claim 1, wherein the blind groove in the fourth step is grooved in a laser manner.
6. The structure and manufacturing method of an ultra-thin PCB embedded copper-based product according to claim 5, wherein the blind slot electroplating current density in the fourth step is selected to be 6-12A/dm 2 。
7. The structure and the manufacturing method of the ultra-thin PCB embedded copper-based product according to claim 1, wherein the thickness of the PCB before copper deposition in the first step is 0.05-0.3 mm.
8. The structure and the manufacturing method of the ultra-thin PCB embedded copper-based product according to claim 1, wherein the conventional electroplating thickness in the third step is more than or equal to 18um and less than or equal to 30um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311604535.5A CN117460173A (en) | 2023-11-28 | 2023-11-28 | Structure and manufacturing method for ultrathin PCB embedded copper-based product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311604535.5A CN117460173A (en) | 2023-11-28 | 2023-11-28 | Structure and manufacturing method for ultrathin PCB embedded copper-based product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117460173A true CN117460173A (en) | 2024-01-26 |
Family
ID=89581926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311604535.5A Pending CN117460173A (en) | 2023-11-28 | 2023-11-28 | Structure and manufacturing method for ultrathin PCB embedded copper-based product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117460173A (en) |
-
2023
- 2023-11-28 CN CN202311604535.5A patent/CN117460173A/en active Pending
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