CN112770541B - Processing method for improving surface roughness of flexible circuit board and flexible circuit board - Google Patents
Processing method for improving surface roughness of flexible circuit board and flexible circuit board Download PDFInfo
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- CN112770541B CN112770541B CN202011431017.4A CN202011431017A CN112770541B CN 112770541 B CN112770541 B CN 112770541B CN 202011431017 A CN202011431017 A CN 202011431017A CN 112770541 B CN112770541 B CN 112770541B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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Abstract
The application relates to a processing method for improving the surface roughness of a flexible circuit board, which comprises the following steps: a processing method for improving the surface roughness of a flexible circuit board comprises the following steps: s1: providing a plurality of layers of base materials attached with copper foils, forming circuits on the surfaces of the copper foils after exposure and etching, and leaving gaps between adjacent circuits on the same layer to form a rough product of the flexible circuit board; s2: spraying a high-temperature insulating coating layer on the circuit; s3: hardening the dry film to expose the gap; s4: putting the flexible circuit board rough product into electrolyte for electrolysis; s5: putting the flexible circuit board rough product into electrolyte for electrolysis through a clamp, and filling gaps with a plating layer; s6: enabling the plasma to wash the surface of the flexible circuit board semi-finished product; s7: coating AD glue and covering a protective film on the surface of the flexible circuit board semi-finished product; s8: and baking the semi-finished flexible circuit board. This application has the effect of improving flexible circuit board surface roughness.
Description
Technical Field
The application relates to the field of flexible circuit board production, in particular to a processing method for improving the surface roughness of a flexible circuit board and a smooth flexible circuit board.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property.
Along with the development of science and technology, in order to meet the product requirement and improve the activation rate of the double-sided adhesive tape of the flexible circuit board, the surface roughness of the flexible circuit board is required to be low.
At present, a flexible circuit board comprises a base material and a copper foil electrolyzed on the base material, the exposed copper foil exposes a circuit, then the flexible circuit board is etched, and after an unnecessary part is removed, the circuit is formed on the surface of the copper foil. In order to ensure the reliability and stability between the circuits and avoid short circuit, a gap is reserved between the circuits on the same layer. In the double-layer or multi-layer circuit board, the upper surface of the copper foil is penetrated with a connecting hole, the substrate is penetrated with a through hole, and the connecting hole is communicated with the through hole and used for connecting circuits of different layers. And adhering the copper foil and the base material through AD glue after the circuit is formed, and filling the gaps, the through holes and the connecting holes.
In view of the above related technologies, the inventor believes that, because the size of the AD adhesive is 0.015mm to 0.02mm, gaps, through holes and communication holes are mainly filled with the AD adhesive, the maximum value of the surface roughness of the flexible circuit board is 0.015mm in the existing design, and the gaps, the through holes and the communication holes cannot be completely filled when the AD adhesive is coated, so that the flexible circuit board is not smooth enough after the AD adhesive is coated, and in the actual measurement of the surface roughness of the flexible circuit board, the roughness of the flexible circuit board is 0.05 mm to 0.08mm, and the surface roughness of the flexible circuit board required by the existing design cannot be achieved.
Disclosure of Invention
In order to improve the surface roughness of the flexible circuit board and smooth the surface of the flexible circuit board, the application provides a processing method for improving the surface roughness of the flexible circuit board and the flexible circuit board.
The processing method for improving the surface roughness of the flexible circuit board adopts the following technical scheme:
a processing method for improving the surface roughness of a flexible circuit board comprises the following steps:
s1: providing a plurality of layers of base materials attached with copper foils, forming circuits on the surfaces of the copper foils after exposure and etching, and leaving gaps between adjacent circuits on the same layer so as to form a rough product of the flexible circuit board;
s2: spraying a high-temperature insulating coating layer on the circuit and the periphery of the circuit, and naturally drying the circuit in a normal-temperature ventilation environment;
s3: after the high-temperature insulating coating layer is dried, a hardened dry film is attached to the high-temperature insulating coating layer and the surface of the side wall of the circuit board rough product by using a matched mould, and only the gap is exposed;
s4: putting the flexible circuit board rough product into electrolyte for electrolysis, and filling gaps with the plating layer;
s5: putting the flexible circuit board rough product into electrolyte for electrolysis through a clamp, and filling gaps with a plating layer;
s6: generating high-energy disordered plasma by a radio frequency power supply, and flushing the surface of the flexible circuit board semi-finished product by the plasma;
s7: coating AD glue and covering a protective film on the surface of the flexible circuit board semi-finished product, and then pressing;
s8: and baking the semi-finished flexible circuit board at 120-130 ℃ for 40-60 minutes.
Through adopting above-mentioned technical scheme, the cladding material is with the gap filling, high temperature insulation layer is with cladding material and circuit separation, prevent the short circuit, make cladding material surface and high temperature insulation layer surface be the coplanar, follow-up AD gluey process of scribbling, cladding material and high temperature insulation layer surface are scribbled to AD glue, thereby flexible circuit board surface still can keep level and smooth after AD is glued in the coating completion, promote flexible circuit roadside double faced adhesive tape activation rate, thereby promote the product yield, reduce the cell-phone backlight simultaneously and explode the lamp, bright dark uneven phenomenon, save manufacturing cost.
Optionally, the gap distance in S1 is not less than 0.15 mm.
By adopting the technical scheme, the circuit can be kept stable in work, and the short circuit of the flexible circuit board in the using process is reduced.
Optionally, the thickness of the wire in S1 is not less than 0.02 mm.
By adopting the technical scheme, the flexible circuit board has the advantages that in the using process, the circuit thickness is appropriate, so that the resistance of the circuit is small, the heating of the circuit is reduced when the circuit is electrified, and the waste is saved.
Optionally, the high-temperature insulating coating layer in S2 includes alumina, silicon nitride, and ceramic particles.
By adopting the technical scheme, the high-temperature insulating coating layer is used for separating the line and the coating layer, so that the line works stably, the high-temperature insulating layer has good electrical insulating property at high temperature, and excellent adhesiveness is achieved, so that the high-temperature insulating layer can be tightly attached to the line.
A smooth flexible circuit board comprises a plurality of layers of base materials and circuits attached to the surfaces of the base materials, wherein gaps are reserved between adjacent circuits on the same layer, and plating layers for filling the gaps are attached to the base materials.
Through adopting above-mentioned technical scheme, the cladding material is with the gap filling to make follow-up AD glue coating accomplish the back, AD glues the surface and still can keep level and smooth, thereby make flexible circuit board surface level and smooth, thereby promote flexible circuit board's double faced adhesive tape activation rate, and then promote the yield.
Optionally, the surface and the periphery of the circuit are coated with high-temperature insulating coating layers.
By adopting the technical scheme, the plating layer and the circuit are separated by the high-temperature insulating layer, so that the circuit and the plating layer can not be contacted, and the work of the circuit is kept stable.
Optionally, AD glue is coated on the surfaces of the high-temperature insulating layer and the plating layer, and a protective film is attached to the surface, far away from the base material, of the AD glue.
Through adopting above-mentioned technical scheme, AD glues and couples together substrate, copper foil and high temperature insulating layer more stable to guarantee flexible circuit board's stability, the protection film blocks the circuit with the circuit protection and keeps apart the foreign matter simultaneously by the oxidation.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the gap is filled by the plating layer, so that the plating layer and the surface of the high-temperature insulation protective film are in the same plane, after AD is coated subsequently, the surface of the AD adhesive tape keeps smooth, the surface roughness of the flexible circuit board is low, the activation rate of the double-sided adhesive tape of the flexible circuit board is improved, and the yield is improved.
2. The high-temperature insulating protective layer separates the circuit and the coating, so that the circuit is kept independent, and the stable work of the circuit is facilitated.
3. The high temperature insulating layer includes alumina, silicon nitride and ceramic particles with good adhesion so that it can be attached to the wiring closely.
Drawings
FIG. 1 is a flow chart of a method for demonstration according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of an embodiment of the present application showing a flexible circuit board rough product;
FIG. 3 is a top view of an embodiment of the present application showing a flexible circuit board blank;
FIG. 4 is a schematic cross-sectional view of an embodiment of the present application showing a semi-finished flexible circuit board;
FIG. 5 is an enlarged schematic view of an embodiment of the present application showing A in FIG. 4;
FIG. 6 is a schematic cross-sectional view of an embodiment of the present application showing a flexible circuit board;
fig. 7 is a top view of an embodiment of the present application showing a flexible circuit board blank.
Description of reference numerals: 1. a substrate; 11. a through hole; 2. copper foil; 21. a line; 22. a gap; 23. connecting holes; 3. plating; 4. a protective film; 5. a high temperature insulating coating layer; 6. a flexible circuit board crude product; 7. a flexible circuit board semi-finished product; 8. AD glue; 9. and hardening the dry film.
Detailed Description
The present application is described in further detail below with reference to figures 1-7.
The embodiment of the application discloses a processing method for improving the surface roughness of a flexible circuit board, which can enable the surface of the flexible circuit board to be smoother and improve the activation rate of double faced adhesive tapes of the flexible circuit board, thereby improving the yield of products. The phenomena of lamp explosion and uneven brightness of the backlight source of the mobile phone are reduced, and the production cost is saved.
Referring to fig. 1-7, the method includes the following steps:
s1, referring to the figures 2 and 3, providing a layer of base material 1, wherein a layer of copper foil 2 is respectively attached to the upper surface and the lower surface of the base material 1, after exposure and etching, a circuit 21 is formed on the surface of the copper foil 2, a gap 22 is left in the adjacent circuit 21 of the same layer, so that a flexible circuit board rough product 6 is formed, a connecting hole 23 penetrates through the surface of the copper foil 2, a through hole 11 communicated with the connecting hole 23 penetrates through the surface of the base material 1, the connecting hole 23 is positioned at the gap 22, the diameter of the through hole 11 is equal to that of the connecting hole 23, the diameter of the through hole 11 is 0.1mm-0.2mm, the distance of the gap 22 is not less than 0.15mm, and the thickness of the circuit 21 is not less than 0.02 mm;
s2, referring to FIG. 4, spraying a high-temperature insulating coating layer 5 on the circuit 21 and the periphery of the circuit 21, wherein the high-temperature insulating coating layer 5 is in full contact with the circuit 21, the high-temperature insulating coating layer 5 is a high-temperature film forming material prepared by using alumina and silicon nitride as fillers and ceramic particles as main ingredients, YA1308 produced by the Asian-Ampere insulating material factory in Henan province is adopted in the embodiment, and therefore the high-temperature insulating coating layer 5 has good electric insulating property and metal tightness;
s3: referring to fig. 4 and 5, after the high-temperature insulating coating layer 5 is dried in a normal-temperature ventilation environment, the hardened dry film 9 is attached to the surfaces of the high-temperature insulating coating layer 5 and the surface of the flexible circuit board crude product 6 through a matched mold, and only the gap 22 is exposed;
s4: referring to fig. 4, placing the flexible circuit board crude product 6 in an electrolyte through a fixture for electrolysis, so that the plating layer 3 completely fills the connecting holes 23, the via holes 11 and the gaps 22, thereby smoothing the surface, wherein the plating layer 3 is made of copper;
s5: referring to fig. 4 and 5, after the electrolysis is completed, the jig is lifted and the hardened dry film 9 is removed by manual stripping to obtain a smooth flexible circuit board semi-finished product 7;
s6: generating high-energy disordered plasma by using a radio frequency power supply, flushing the surface of the flexible circuit board semi-finished product 7 by using the plasma, and cleaning impurities on the surface of the flexible circuit board semi-finished product 7;
s7: coating AD glue 8 and covering a protective film 4 on the surface of the flexible circuit board semi-finished product 7, performing lamination to enable the protective film 4 to be stably attached to the surface of the flexible circuit board semi-finished product 7, and inspecting the quality of the flexible circuit board 7 semi-finished product after lamination;
s8: and (3) baking the flexible circuit board semi-finished product (7) at 125 ℃ for 50 minutes to enable the plating layer 3 to be tightly attached to the AD adhesive 8.
The copper foil 2 is fixed on the upper surface and the lower surface of the base material 1, the thickness of the circuit 21 is not less than 0.02mm and is used for ensuring circuit conduction, the distance between the gaps 22 is not less than 0.15mm so that the circuit 21 runs stably, short circuit is less, and the diameters of the connecting holes 23 and the through holes 11 are not less than 0.1mm so that the circuit conduction of adjacent layers is stable. And coating a high-temperature insulating coating layer 5 on the circuit 21 and the periphery of the circuit 21, wherein the high-temperature insulating coating layer 5 protects the circuit 21. Then, the substrate 1 and the copper foil 2 are covered with the cured dry film 9 to be protected by the cover portion, and then are electrolyzed in an electrolyte solution, and the gap 22, the connection hole 23, and the through hole 11 are filled with the plating layer 3. The plating layer 3 is isolated from the circuit 21 by the high-temperature insulating layer, the short circuit condition caused by the contact of the plating layer 3 and the circuit 21 is reduced, the plating layer 3 cannot be plated on the side wall of the base material 1 and the covered part of the copper foil 2 by the hardened dry film 9, so that the smooth surface is kept, and then the hardened dry film 9 is taken down to obtain the flexible circuit board semi-finished product 7 with the smooth surface.
Referring to fig. 6 and 7, a smooth flexible circuit board includes a substrate 1 and lines 21 electrolyzed on the upper and lower surfaces of the substrate 1, and a gap 22 is left between adjacent lines 21 of the same layer, and the gap 22 is not less than 0.15mm, so that the lines 21 can work stably, and short circuit can be reduced. The upper surface of the copper foil 2 is penetrated with a plurality of connecting holes 23, the connecting holes 23 are positioned at the gap 22, the surface of the substrate 1 is penetrated with a plurality of through holes 11, the through holes 11 are communicated with the connecting holes 23 and are in one-to-one correspondence, and the diameters of the through holes 11 and the connecting holes 23 are the same and are within 0.1mm-0.2 mm. The adjacent layer line 21 is communicated with the connection hole 23 through the through hole 11.
The surface of the circuit 21 and the periphery of the circuit 21 are coated with a layer of high temperature insulating coating 5, in this embodiment, the material of the high temperature insulating coating 5 is a ceramic coating, which has good electrical insulation and good adhesion, so that the high temperature insulating coating 5 is tightly adhered to the circuit 21.
The plating layer 3 is electrolyzed at the gap 22, the through hole 11 and the connecting hole 23 are filled by the plating layer 3, and the high-temperature insulating coating layer 5 and the upper end of the plating layer 3 are in the same plane, so that the surface of the flexible circuit board is kept smooth. The plating layer 3 is made of copper, the copper material is common and easy to obtain, and the cost performance is high in actual production. The high-temperature insulating coating layer 5 separates the plating layer 3 from the circuit 21, and prevents the circuit 21 from contacting the plating layer 3, so that the circuit 21 works stably.
A layer of AD glue 8 is adhered to the surfaces of the plating layer 3 and the high-temperature insulating coating layer 5, and the AD glue 8 plays a role in connection, so that the substrate 1, the circuit 21, the plating layer 3 and the high-temperature insulating coating layer 5 are tightly attached. The AD paste 8 further has a protective film 4 attached to the surface thereof remote from the base material 1, and in this embodiment, the protective film 4 is a white film to prevent oxidation of the wiring 21 and blocking of foreign matter.
The processing method for improving the surface roughness of the flexible circuit board and the implementation principle of the flexible circuit board are as follows: the coating 3 fills the gap 22, the through hole 11 and the connecting hole 23 to keep the surface of the flexible circuit board smooth, and when the AD glue 8 is coated subsequently, the AD glue 8 is not filled into the gap 22 to keep the surface of the AD glue 8 smooth, so that the surface roughness of the flexible circuit board is improved.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. A processing method for improving the surface roughness of a flexible circuit board is characterized by comprising the following steps:
s1: providing a plurality of layers of base materials (1) attached with copper foils (2), forming circuits (21) on the surfaces of the copper foils (2) after exposure and etching on the surfaces of the copper foils (2), and leaving gaps (22) between adjacent circuits (21) on the same layer so as to form a rough product (6) of the flexible circuit board;
s2: spraying a high-temperature insulating coating layer (5) on the circuit (21) and the periphery of the circuit (21), and naturally drying in a normal-temperature ventilation environment;
s3: after the high-temperature insulating coating layer (5) is dried, a hardening dry film (9) is attached to the surfaces of the high-temperature insulating coating layer (5) and the side wall of the circuit board rough product (6) by using a matched mould, and only the gap (22) is exposed;
s4: putting the flexible circuit board rough product (6) into electrolyte for electrolysis through a clamp, and filling the gap (22) with the plating layer (3);
s5: after the electrolysis is finished, lifting the clamp, and then manually stripping to remove the hardened dry film (9) to obtain a smooth flexible circuit board semi-finished product (7);
s6: generating high-energy disordered plasma by a radio frequency power supply, and flushing the surface of the flexible circuit board semi-finished product (7) by the plasma;
s7: coating AD glue (8) on the surface of the flexible circuit board semi-finished product (7) and covering the protective film (4), and then pressing;
s8: and baking the flexible circuit board semi-finished product (7) at the temperature of 120-130 ℃ for 40-60 minutes.
2. The processing method according to claim 1, characterized in that: the distance between the gaps (22) in the S1 is not less than 0.15 mm.
3. The processing method according to claim 1, characterized in that: the thickness of the line (21) in the S1 is not less than 0.02 mm.
4. The processing method according to claim 1, characterized in that: and the high-temperature insulating coating layer (5) in the S2 comprises aluminum oxide, silicon nitride and ceramic particles.
5. The processing method according to claim 1, characterized in that: and the material of the plating layer (3) in the S4 is copper.
6. A smooth flexible circuit board characterized by: the circuit comprises a plurality of layers of base materials (1) and circuits (21) attached to the surfaces of the base materials (1), wherein a gap (22) is reserved between the circuits (21) adjacent to each other on the same layer, the surfaces and the periphery of the circuits (21) are coated with high-temperature insulating coating layers (5), and plating layers (3) filling the gap (22) are attached to the surfaces of the base materials (1).
7. The smooth flexible circuit board of claim 6, wherein: the surface and the periphery of the circuit (21) are coated with a high-temperature insulating coating layer (5).
8. The smooth flexible circuit board of claim 7, wherein: the surface coating of high temperature insulating coating layer (5) and cladding material (3) has AD to glue (8), AD glues (8) and keeps away from the surface of substrate (1) and is attached one deck protection film (4).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011431017.4A CN112770541B (en) | 2020-12-07 | 2020-12-07 | Processing method for improving surface roughness of flexible circuit board and flexible circuit board |
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| CN202011431017.4A CN112770541B (en) | 2020-12-07 | 2020-12-07 | Processing method for improving surface roughness of flexible circuit board and flexible circuit board |
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| CN112770541B true CN112770541B (en) | 2022-02-22 |
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| CN113755929A (en) * | 2021-09-13 | 2021-12-07 | 深圳市精莞盈电子有限公司 | Processing method of FPC circuit board coating |
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