CN103517573B - A kind of processing method of circuit board - Google Patents
A kind of processing method of circuit board Download PDFInfo
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- CN103517573B CN103517573B CN201210204489.5A CN201210204489A CN103517573B CN 103517573 B CN103517573 B CN 103517573B CN 201210204489 A CN201210204489 A CN 201210204489A CN 103517573 B CN103517573 B CN 103517573B
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Abstract
The present invention provides a kind of processing method of circuit board, and the method sprays to insulating powder using electrostatic spraying device on the surface of circuit board piece, and under electrostatic interaction, powder can uniformly be adsorbed in plate surface, form insulating barrier；After insulating barrier solidifies by high-temperature baking, its effect is very excellent at the aspect such as mechanical strength, adhesive force, corrosion-resistant, ageing-resistant.After insulating barrier solidifies by high-temperature baking, using ceramic brush board or laser ablation, top layer is uniformly accurately flattened；Continuation forms new line layer in plate surface, reuses electrostatic spraying mode and forms new insulating barrier, and so moving in circles can realize that multilayer circuit board is processed.The method is easily controlled the thickness of insulating barrier, and cost is less expensive, the scope of application is more extensive, and reduces pollution, improves work situation, with prominent advantage.
Description
Technical field
The present invention relates to a kind of processing method of PCB.
Background technology
As electronic product is to the development in the directions such as portability, high-cooling property, compared to traditional circuit board, continuous volume
Outer increasing layer method is increasingly paid attention to by industry, but the implementation method of non-conductive insulating layer and remarkable between layers.
Traditional handicraft is all using lamination prepreg（PP）, silk-screen resin or injection moulding（molding）Technique.Lamination
PP methods are will to be soaked with to be cured to the material piece of interstage i.e. B b stage resin bs and be laminated, and the method flow is complicated, cost compared with
It is high.Silk-screen resin methods apply pressure by suitable medium by the mesh that has figure using scraper, but silk-screen resin is easy
Produce bubble, and the more difficult control of thickness evenness.Injection moulding（molding）Requirement of the technique to mould is higher, and city now
The existing mould in face is all partially thick, and the difficulty of reprocessing is larger.
Therefore, industry is expected to find out a kind of method that can solve the problem that above mentioned problem to realize in circuit board between layers
Non-conductive insulating layer.
The content of the invention
In order to solve the above-mentioned technical problem one object of the present invention, be, there is provided one kind is easily controlled thickness evenness
Board dielectric layer processing method.
Another object of the present invention, is that can provide that a kind of cost is less expensive, the scope of application is widely circuit
The preparation method that plate increases insulating barrier.
A further object of the present invention, is to provide one kind can according to actual needs and neatly, optionally make
The processing method for going out a variety of multilayer circuit boards.
Another object of the present invention, be provide one kind can reduce using organic solvent so as to reduce environmental pollution,
And the processing method for improving the board dielectric layer of labour health condition.
Another object of the present invention, is to provide a kind of adding for multilayer circuit board that can be applied to 3 D stereo encapsulation
Work method.
The present invention provides a kind of processing method of circuit board, and the method comprises the following steps：
Step A：Circuit board with least surface line layer is provided；
Step B：Insulating powder is sprayed to using electrostatic spraying device the surface of line layer, powder is equal under electrostatic interaction
The even surface for being adsorbed in line layer, forms new insulating barrier；
Step C：High-temperature baking is carried out to new insulating barrier, solidifies it；
Step D：The top layer of leveling solidification insulating barrier；
Step E：Surface of insulating layer after leveling sets new line layer；
Step F：Repeat step B-E, until realizing the multilayer circuit board of predetermined number of layers.
Further, in stepb, an electrostatic spraying can obtain the insulating barrier that thickness is 100~300 μm.
Further, in stepb, electrostatic spraying powder include epoxy resin, acrylic resin, polyethylene, polypropylene,
At least one in nylon, ink or coating.
Further, in step C, in curing oven, insulating barrier is heated to make a reservation for insulating barrier step by step in curing oven
After temperature, then predetermined temperature is kept into Preset Time.
Further, the predetermined temperature is 125-150 degree.
Further, the Preset Time is 4-6 hours.
Further, in step A or E, the copper post of protrusion is set on line layer.
Further, the method to set up of the copper post is：Dry film is sticked on line pattern, in dry film uplifting window, then is used
Plating is filled and led up and is opened a window, and dry film is removed afterwards, you can copper post protruding upward is obtained.
Further, in step D, solidification insulating barrier is flattened by the way of ceramic brush board and/or laser ablation
Top layer.
Further, by the way of ceramic brush board and/or laser ablation by the surface evening of insulating barrier to copper post table
Face flushes.
The method that processing line plate particularly sets insulating barrier in the present invention, it uses Electrostatic Spray Technology, in the present invention
Method be a kind of method that modern precision realizes insulating barrier processing, with lamination prepreg (PP), silk-screen resin or be molded into
Traditional processing methods such as type (molding) technique are compared, with obvious advantage：
1st, the method for the present invention is once sprayed can obtain thicker insulating barrier, for example, coat 100~300 μm of insulation
Layer, is extremely difficult to general PP and silk-screen resin.
2nd, the coatings that the method for the present invention is used are free of solvent, and three wastes public hazards improve labour health condition.
3rd, the method for the present invention is using new technologies, efficiency high such as electrostatic sprayings, it is adaptable to automatic streamline wire spraying, insulating powder
Last utilization rate is high, recyclable.
4th, the method for the present invention has the resistance to fat of substantial amounts of thermoplasticity can conduct in addition to heat cured epoxy, polyester, acrylic acid, still
Insulating powder, such as polyethylene, polypropylene, polystyrene, fluorinated polyether, nylon, polycarbonate and all kinds of fluorine resins, should
It is wide and with low cost with scope.
5th, the diameter of the Copper column structure of method of the present invention combination convex type and height are significantly larger than folded cellular type structure and are used for
The blind hole or through hole of interlayer conduction, its height space can imbed the devices such as chip and electric capacity, it is also possible to for welding tin ball is provided
One good support, is a kind of new way for realizing 3 D stereo encapsulation, is particularly well-suited to stacked elements encapsulation (package
On package, POP) structure.
Brief description of the drawings
Fig. 1 is the partial cutaway schematic view of first step corresponding line plate in first embodiment of the invention.
Fig. 2 is the partial cutaway schematic view of second step corresponding line plate in first embodiment of the invention.
Fig. 3 is the partial cutaway schematic view of third step corresponding line plate in first embodiment of the invention.
Fig. 4 is the partial cutaway schematic view of four steps corresponding line plate in first embodiment of the invention.
Fig. 5 is the partial cutaway schematic view of first step corresponding line plate in second embodiment of the invention.
Fig. 6 is the partial cutaway schematic view of second step corresponding line plate in second embodiment of the invention.
Fig. 7 is the partial cutaway schematic view of third step corresponding line plate in second embodiment of the invention.
Fig. 8 is the partial cutaway schematic view of four steps corresponding line plate in second embodiment of the invention.
Fig. 9 is the partial cutaway schematic view of first step corresponding line plate in third embodiment of the invention.
Figure 10 is the partial cutaway schematic view of second step corresponding line plate in third embodiment of the invention.
Figure 11 is the partial cutaway schematic view of third step corresponding line plate in third embodiment of the invention.
Figure 12 is the partial cutaway schematic view of four steps corresponding line plate in third embodiment of the invention.
The implication of reference is respectively used in each accompanying drawing：
101st, circuit substrate；102nd, first line layer；1021st, the first line visuals in first line layer；1022、
The second line pattern part in first line layer；1023rd, the tertiary circuit visuals in first line layer；103rd, the second line
Road floor；1031st, the first line visuals in the second line layer；1032nd, the second line pattern part in the second line layer；
1033rd, the tertiary circuit visuals in the second line layer；104th, copper post；105th, the first insulating barrier；106th, the second insulating barrier；
107th, tertiary circuit layer；1071st, the first line visuals in tertiary circuit layer；1072nd, the second line in tertiary circuit layer
Road visuals；1073rd, the tertiary circuit visuals in tertiary circuit layer；108th, the 4th line layer；1081st, the 4th line layer
In first line visuals；1082nd, the second line pattern part in the 4th line layer；1083rd, in the 4th line layer
Tertiary circuit visuals；
201st, circuit substrate；202nd, first line layer；2021st, the first line visuals in first line layer；2022、
The second line pattern part in first line layer；2023rd, the tertiary circuit visuals in first line layer；203rd, the second line
Road floor；2031st, the first line visuals in the second line layer；2032nd, the second line pattern part in the second line layer；
2033rd, the tertiary circuit visuals in the second line layer；2041st, the first copper post；2042nd, the second copper post；2051st, the 3rd bronze medal
Post；2052nd, the 4th copper post；206th, the first insulating barrier；207th, the second insulating barrier；208th, tertiary circuit layer；209th, the 4th line layer；
210th, the 5th copper post；211st, the 6th copper post；
301st, circuit substrate；302nd, first line layer；303rd, the second line layer；304th, plated through-hole；305th, the first insulation
Layer；306th, the second insulating barrier；307th, tertiary circuit layer；308th, the 4th line layer.
Specific embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.Art technology
Personnel are it is easily understood that following embodiments are only the exemplary illustration to the specific embodiment of the invention, and it is right to be not intended as
The restriction of the scope of the present invention.
First embodiment
Referring initially to Fig. 1-4, accompanying drawing 1-4 it is exemplary disclose the first embodiment of the present invention.
First step of first embodiment of the invention, first the wiring layout drawing shape according to designed by are shown in Fig. 1
The conductive materials of the conductive layer of (such as positive figure) on circuit substrate 101（Such as copper）It is etched, with needed for processing
The line pattern wanted（Surface and/or lower surface on the substrate 101）, and set with upper strata and/or lower floor junction needing to set
Put the copper post 104 for turning on up and down.
Specifically, provide the circuit substrate 101 of insulation first, have on the surface of circuit substrate 101 conductive layer (including
Upper surface and/or lower surface), for example can be specifically copper plate.It is being, for example, to plate according to designed wiring layout drawing shape
It is etched on the conductive layer of layers of copper, processing obtains first line the 102, second line layer 103 of layer, wherein first line layer 102
Circuit substrate 101 is separately positioned on the second line layer 103 not on the surface of homonymy, for example above and below.First line layer
There is different circuit packs, such as first line visuals 1021, the second line pattern part 1022, the 3rd line in 102
Road visuals 1023；In second line layer 103 also have different circuit packs, such as first line visuals 1031,
Second line pattern part 1032, tertiary circuit visuals 1033.Optionally, wherein first line layer 102 and second circuit
Can carry out electroplating the copper post for obtaining by through hole between layer and realize mutual conduction, so as to realize electrical connection.
Next, setting one layer of dry film on the surface of first line layer 102 and the second line layer 103, used on dry film
The mode of laser-induced thermal etching is opened a window, so as to obtain blind hole；Electroplated in blind hole, the blind hole is filled and led up；Dry film is removed again
Afterwards, you can the copper post 104 of the protrusion set on first line layer 102 and/or the second line layer 103 is obtained.The copper post 104
Several parts can for example be included, for example, be embedded in the part in substrate 101, the first line figure in embedded first line layer 102
Part in 1021, the part in the first line figure 1031 in embedded second line layer 103, expose first line layer 102
Part, expose the part of the second line layer 103.
Fig. 2 shows the second step of first embodiment of the invention, in this step, using using electrostatic spraying device handle
Insulating powder sprays to the surface of circuit substrate 101, and under electrostatic interaction, powder can uniformly be adsorbed in the upper table of substrate 101
Face and lower surface, form the first insulating barrier 105 of powder sedimentation state and the second insulating barrier 106 of powder sedimentation state.
Specifically, the spraying flow in the embodiment is carried out in ultra-clean chamber, clean operating environment will ensure to be processed
The quality of circuit board.Interchangeable, spraying process can be in the spray room with Powder Recovery function（Single-station or double）In
Carry out, the powder for falling is reclaimed by recovery system, can be used again after sieving.The present embodiment is carried out preferably in ultra-clean chamber.
Dusty spray can using the one kind in epoxy resin, acrylic resin, polyethylene, polypropylene, nylon etc. or
It is several, or even ink, coating can serve as electrostatic spraying powder and uses, range of application is widely.Due in insulant
Most of film forming matter is made up of macromolecular organic compound, mostly conductive dielectric, solvent be organic solvent, cosolvent,
The materials such as curing agent, electrostatic diluent and other various additives.This kind of solvent borne material is except benzene, dimethylbenzene, industrial naptha
Deng, it is mostly polar substances, resistivity is relatively low, there is certain conductive capability, and they can significantly improve the charging property of Insulating Materials
Energy.Insulating Materials spray after nozzle atomization, because connecing when the particulate being atomized passes through the pole pin of muzzle or sprays disk, the edge of spray cup
It is tactile and powered, when by gas ionization zone produced by corona discharge, will again increase its surface charge density.These bands
Under the electrostatic field of the Insulating microparticles of negative electrical charge, the plate surface motion of guide polarity, and it is deposited over shape in plate surface
Into uniform insulating barrier.
By the electrostatic potential that electrostatic spraying device adjustment is suitable.According to different electrostatic screen situations, the amount of dusting, dust away from
From, powder sort etc. parameter, electrostatic spraying device can be debugged into different electrostatic potentials, such as 8KV, 30KV, 50KV.
Should be under normal circumstances between 100-300mm.In actual production process, should be according to by spray actual conditions, at any time
Adjustment spray distance.Preferably, distance of dusting is arranged between 100-300mm.
In electrostatic spray process, it is preferred that by spraying condition selecting in constant current state.
In electrostatic spray process, it is preferred that powder bucket and ground are set into insulation.
In the electrostatic spraying step, once spraying can obtain thicker insulating barrier, for example, coat 100~300 μm
Insulating barrier.
Fig. 3 shows the third step of first embodiment of the invention, in this step, insulating barrier 105 by prebake conditions and
High-temperature baking solidifies, and then using ceramic brush board, uniformly accurately polishes top layer, realizes that height of the copper pillar is precisely controlled；
By taking epoxy resin as an example, will be coated with the epoxy powder with electrostatic circuit board be placed into curing oven (or
Person's baking oven, baking box) in, elder generation is slow, ramp up temperature to predetermined temperature so that powdered insulating powder is rendered as solid
The glassy state of liquid mixing, the pre-firing process can not only remove moisture therein, and can avoid circuit board
Stress is piled up, and improves the crudy of circuit board.
The predetermined temperature is, for example, 100-200 degree, preferably 120-180 degree, more preferably 125-150 degree.Plus
Hot mode can be selected using modes such as electrical heating, fuel Heating, gas heating, coal-fired heatings.
After powdery paints is heated into the temperature of regulation, then the predetermined time is incubated, is allowed to be completely melt and solidifies, protected
Such as 1-10 hour of the scheduled time held, preferably 4-6 hours.
Circuit board is taken out in blow-on afterwards, you can the circuit board after being solidified.
Afterwards, using ceramic brush board, uniformly accurately polish the first insulating barrier 105 and the second insulating barrier 106 is higher by copper post
104 surface part, realizes that height of the copper pillar is precisely controlled, until the height and copper of the first insulating barrier 105 and the second insulating barrier 106
Post 104 it is highly identical.
Using ceramic brush board, 20-50 μm can be brushed every time, different model can be selected according to different thickness to be brushed
Ceramic brush roll/brush rod, can thus brush the insulating barrier surface part outside copper post 104.
It is interchangeable, can be higher than copper using method burn off first insulating barrier 105 of laser ablation and the second insulating barrier 106
The part of post 104, the speed of this sample loading mode can reach 100 μm every time.
Preferably, it is exhausted to remove the first insulating barrier 105 and second by the way of ceramic brush board is combined using laser ablation
Edge layer 106 is higher by the surface part of copper post 104, and the height of copper post 104 is higher by the height of the insulating barrier 106 of insulating barrier 105 and second
When spending more, by the way of laser ablation；Treat that the height of the insulating barrier 106 of insulating barrier 105 and second is higher by the height of copper post 104
When being closer to, by the way of ceramic brush board, so, envisioned precision can be both reached, it is also possible to save man-hour and flow.
Fig. 4 shows the four steps of first embodiment of the invention, in this step, continues to set new one in plate surface
Sandwich circuit layer.
New insulating barrier and conductive layer is set up if desired, then sticks dry film on the line layer on top layer, process circuit
Copper post on figure, the mode for reusing electrostatic spraying obtains new insulating barrier, and so moving in circles can realize multilayer circuit
Plate is processed.
Specifically, setting new conductive layer on resulting circuit board in the last step.In the upper of the first insulating barrier 105
The conductive layers of Fang Zengshe the 3rd, go out tertiary circuit layer 107, wherein wrapping on the 3rd conductive layer according to the Butut circuit etching for designing
Include such as first line part 1071, the second circuit pack 1072, tertiary circuit part 1073 etc.；In the second insulating barrier 106
Lower section set up the 4th conductive layer, go out the 4th line layer according to the Butut circuit etching for designing on the 4th conductive layer 108
108, including such as first line part 1081, the second circuit pack 1082, tertiary circuit part 1083 etc..
Optionally, the process of the setting line layer in the step can also be set by sputtering or other modes.
Be further continued for setting up conductive layer and insulating barrier if desired, then can be in tertiary circuit the 107, the 4th line of layer set up
Dry film (not shown) is sticked on road floor 108, it forms one by that can be produced after ultraviolet irradiation with a kind of polymerisation
The material for planting stabilization is attached to plate face, and the function of plating and etching is stopped so as to reach.Filled and led up in dry film uplifting window and with plating,
Dry film is removed again, you can obtain the copper post of new protrusion；Electrostatic spraying is carried out again and obtains new insulating barrier, so repeat above-mentioned many
Individual step, you can be further added by new insulating barrier.So repeatedly, the circuit board of the number of plies is preset until obtaining.
Second embodiment
Fig. 5-Fig. 8 is referred to, its is exemplary to show the second embodiment of the present invention.
First step of first embodiment of the invention, first the wiring layout drawing shape according to designed by are shown in Fig. 5
The conductive materials of (such as positive figure) on circuit substrate 201 are etched, to process required line pattern（In base
The upper surface of plate 201 and/or lower surface）, and led with upper strata or lower floor needing to set to be set with upper strata and/or lower floor junction
Logical copper post 204,205.
Specifically, provide the circuit substrate 201 of insulation first, have on the surface of circuit substrate 201 conductive layer (including
Upper surface and/or lower surface), for example can be specifically copper plate.It is being, for example, to plate according to designed wiring layout drawing shape
It is etched on the conductive layer of layers of copper, processing obtains first line the 202, second line layer 203 of layer, wherein first line layer 202
Circuit substrate 201 is separately positioned on the second line layer 203 not on the surface of homonymy, for example above and below.First line layer
There is different circuit packs, such as first line visuals 2021, the second line pattern part 2022, the 3rd line in 202
Road visuals 2023；In second line layer 203 also have different circuit packs, such as first line visuals 2031,
Second line pattern part 2032, tertiary circuit visuals 2033.
In the present embodiment, copper post is set in the mode similar to first embodiment, in first line layer 202 or second
Dry film is pasted on line layer 203, is filled and led up in the mode of dry film uplifting window, then electricity consumption electrolytic plating and is opened a window, dry film is taken out afterwards, from
And the Copper column structure of protrusion is formed on line layer.The first line visuals on first line layer 202 of such as diagram
The second copper post 2042, the on the tertiary circuit visuals 2023 on the first copper post 2041, first line layer 202 on 2021
The 3rd copper post 2051 on first line visuals 2031 in two line layers 203, the tertiary circuit on the second line layer 203
The 4th copper post 2052 on visuals 2033.
Skilled addressee readily understands that, the circuit substrate for only having a layer insulating in the present embodiment can be replaced
It is that (row line is entered at the back side for example in one side with the circuit board of line layer to the circuit board product with more than one insulating barrier again
Butut and continue to set up new insulating barrier) or circuit boards half-finished product.
Fig. 6 shows the second step of second embodiment of the invention, in this step, using electrostatic spraying device insulation
Powder spray to the surface of circuit substrate 201, under electrostatic interaction, powder can uniformly be adsorbed in substrate 201 upper surface and
Lower surface, forms the first insulating barrier 205 of powdery and the second insulating barrier 206 of powdery.
Specifically, the spraying flow in the embodiment is carried out in ultra-clean chamber.
Dusty spray can be using at least in epoxy resin, acrylic resin, polyethylene, polypropylene, nylon etc.
Plant, or even ink, coating can serve as electrostatic spraying powder and uses.Because most of film forming matter in insulant is by high score
Sub- organic compound composition, mostly conductive dielectric, solvent be organic solvent, cosolvent, curing agent, electrostatic diluent and its
The materials such as his various additives.This kind of solvent borne material, except benzene, dimethylbenzene, industrial naptha etc., is mostly polar substances, resistance
Rate is relatively low, there is certain conductive capability, and they can significantly improve the chargeding performance of Insulating Materials.Insulating Materials are after nozzle atomization
Spray, it is powered because of contact when the particulate being atomized is by the pole pin of muzzle or spray disk, the edge of spray cup, when by corona discharge
During produced gas ionization zone, will again increase its surface charge density.The electrostatic of these negatively charged Insulating microparticles
Under field action, the motion of the plate surface of guide polarity, and be deposited in plate surface and form uniform insulating barrier.
In the electrostatic spraying step, once spraying can obtain thicker insulating barrier, for example, coat 100~300 μm
Insulating barrier.
Fig. 7 shows the third step of second embodiment of the invention, and in this step, the first insulating barrier 206, second insulate
Layer 207 solidifies by prebake conditions, high-temperature baking, then using ceramic brush board, uniformly accurately polishes top layer, realizes height of the copper pillar
It is precisely controlled；
By taking epoxy resin as an example, will be coated with the epoxy powder with electrostatic circuit board be placed into curing oven (or
Person's baking oven, baking box) in, elder generation is slow, ramp up temperature to predetermined temperature so that powdered insulating powder is rendered as solid
The glassy state of liquid mixing, the pre-firing process can not only remove moisture therein, and can avoid circuit board
Stress is piled up, and improves the crudy of circuit board.
The predetermined temperature is, for example, 100-200 degree, preferably 120-180 degree, more preferably 125-150 degree.Plus
Hot mode can be selected using modes such as electrical heating, fuel Heating, gas heating, coal-fired heatings.
After powdery paints is heated into the temperature of regulation, then the predetermined time is incubated, is allowed to be completely melt and solidifies, protected
Such as 1-10 hour of the scheduled time held, preferably 4-6 hours.
Circuit board is taken out in blow-on afterwards, you can the circuit board after being solidified.
Followed by, using ceramic brush board, the first insulating barrier 206 and the copper high of the second insulating barrier 207 are uniformly accurately polished
The surface part of post 2041,2042,2051,2052, realizes that height of the copper pillar is precisely controlled, until the first insulating barrier 206 and second
The height of insulating barrier 207 is highly identical with copper post 2041,2042,2051,2052.
Using ceramic brush board, 20-50 μm can be brushed every time, different model can be selected according to different thickness to be brushed
Ceramic brush roll, can thus brush the insulating barrier surface part outside copper post 2041,2042,2051,2052.
It is interchangeable, can be higher than copper using method burn off first insulating barrier 206 of laser ablation and the second insulating barrier 207
The part of post, the speed of this sample loading mode can reach 100 μm every time.
Preferably, it is exhausted to remove the first insulating barrier 206 and second by the way of ceramic brush board is combined using laser ablation
Edge layer 207 is higher by the surface part of copper post 2041,2042,2051,2052, in the first insulating barrier 206 and the second insulating barrier 207
Highly be higher by copper post 2041,2042,2051,2052 it is highly more when, by the way of laser ablation；Treat the He of insulating barrier 206
When the height that the height of the second insulating barrier 207 is higher by copper post 2041,2042,2051,2052 is closer to, using the side of ceramic brush board
Formula, so, can both reach envisioned precision, it is also possible to save man-hour and flow.
Fig. 8 shows the four steps of second embodiment of the invention, in this step, continues to set new one in plate surface
Sandwich circuit layer.
New insulating barrier and line layer is set up if desired, then in the circuit layer surface patch dry film on top layer, process figure
And copper post, the mode for reusing electrostatic spraying obtains new insulating barrier, and so moving in circles can realize that multilayer circuit board adds
Work.
Specifically, new sandwich circuit layer is set on the insulating barrier of resulting circuit board in the step 3, it is exhausted first
The 3rd conductive layer is set up in the top of edge layer 206, and tertiary circuit is gone out according to the Butut circuit etching for designing on the 3rd conductive layer
Layer 208, including such as first line part 2081, the second circuit pack 2082, tertiary circuit part 2083 etc.；
The 4th conductive layer is set up in the lower section of two insulating barriers 207, and the 4th is gone out according to the Butut circuit etching for designing on the 4th conductive layer
Line layer 209, including such as first line part 2091, the second circuit pack 2092, tertiary circuit part 2093 etc..
Be further continued for setting up conductive layer and insulating barrier if desired, then can be in tertiary circuit the 207, the 4th line of layer set up
Dry film (not shown) is sticked on road floor 208, it forms one by that can be produced after ultraviolet irradiation with a kind of polymerisation
The material for planting stabilization is attached to plate face, and the function of plating and etching is stopped so as to reach.Filled and led up in dry film uplifting window and with plating,
Dry film is removed again, you can obtain the copper post of new protrusion；Electrostatic spraying is carried out again obtains new insulating barrier.Repeat above-mentioned many
Individual step, you can obtain the circuit board of the default number of plies.
It is this to add especially it is noted that the first and second embodiment of the invention is all the copper post for processing convex type
Work mode is particularly suitable for stacked elements encapsulation (package on package, POP) structure.
Stacked elements encapsulation is a kind of 3D encapsulation solution, the encapsulation volume advantage that it is brought using stacking, reduce or
Keep the size of motherboard.It places component again on the component of bottom, and logic+storage is usually 2 to 4 layers, storage-type PoP
Up to 8 layers.Height of contour can be slightly higher, but each device can be tested individually before assembling, ensure yields higher,
Total stacking assembly cost can be minimized.The combination of device can by terminal user unrestricted choice, for 3G mobile phones,
Digital camera etc. this be preferred fit scheme.
The diameter of convex type Copper column structure and height are significantly larger than folded hole in first embodiment of the invention and second embodiment
Formula structure is used for the blind hole or through hole of interlayer conduction, and its height space can imbed the devices such as chip and electric capacity, it is also possible to be weldering
Connect tin ball and one good support is provided, be a kind of new way for realizing 3 D stereo encapsulation.
3rd embodiment
Referring next to Fig. 9-Figure 12, above-mentioned accompanying drawing it is exemplary show the third embodiment of the present invention.
First step of 3rd embodiment, provides circuit board or circuit base with an at least top layer insulating barrier first
Plate, such as circuit substrate 301；Conductive layer is set on the surface of top layer insulating barrier, according to designed wiring layout drawing shape (example
Such as positive figure) conductive materials of conductive layer on circuit substrate（Such as copper）It is etched, to process required line
Road figure, such as first line the 302, second line layer 303 of layer.
On the line pattern, directly take and for example drilled by way of mechanical controlled depth milling, obtain blind hole or through hole,
The mode for taking electrolysis to electroplate fills and leads up the blind hole or through hole, for example, connect the line layer 303 of first line layer 302 and second
Hole 304, forms plated through-hole 304 so that the circuit between different layers can electrically connect conducting after being plated.
The second step of the 3rd embodiment, in this step, sprays to insulating powder using electrostatic spraying device
The surface of line layer, under electrostatic interaction, powder can uniformly be adsorbed in the outer surface of line layer, form powder accumulation state
, new insulating barrier, such as the first insulating barrier 305, the second insulating barrier 306.
Specifically, the spraying flow in the embodiment is carried out in ultra-clean chamber, clean operating environment will ensure to be processed
The quality of circuit board.
Dusty spray can using the one kind in epoxy resin, acrylic resin, polyethylene, polypropylene, nylon etc. or
It is several, or even ink, coating can serve as electrostatic spraying powder and uses, range of application is widely.Due in insulant
Most of film forming matter is made up of macromolecular organic compound, mostly conductive dielectric, solvent be organic solvent, cosolvent,
The materials such as curing agent, electrostatic diluent and other various additives.This kind of solvent borne material is except benzene, dimethylbenzene, industrial naptha
Deng, it is mostly polar substances, resistivity is relatively low, there is certain conductive capability, and they can significantly improve the charging property of Insulating Materials
Energy.Insulating Materials spray after nozzle atomization, because connecing when the particulate being atomized passes through the pole pin of muzzle or sprays disk, the edge of spray cup
It is tactile and powered, when by gas ionization zone produced by corona discharge, will again increase its surface charge density.These bands
Under the electrostatic field of the Insulating microparticles of negative electrical charge, the plate surface motion of guide polarity, and it is deposited over shape in plate surface
Into uniform insulating barrier.
By the electrostatic potential that electrostatic spraying device adjustment is suitable.According to different electrostatic screen situations, the amount of dusting, dust away from
From, powder sort etc. parameter, electrostatic spraying device can be debugged into different electrostatic potentials, such as 8KV, 30KV, 50KV.
Should be under normal circumstances between 100-300mm.In actual production process, should be according to by spray actual conditions, at any time
Adjustment spray distance.Preferably, distance of dusting is arranged between 100-300mm.
In electrostatic spray process, it is preferred that by spraying condition selecting in constant current state.
In electrostatic spray process, it is preferred that powder bucket and ground are set into insulation.
In the electrostatic spraying step, once spraying can obtain thicker insulating barrier, for example, coat 100~300 μm
Insulating barrier.
3rd step of the 3rd embodiment, in this step, in this step, insulating barrier by prebake conditions and
High-temperature baking solidifies；
By taking epoxy resin as an example, will be coated with the epoxy powder with electrostatic circuit board be placed into curing oven (or
Person's baking oven, baking box) in, elder generation is slow, ramp up temperature to predetermined temperature so that powdered insulating powder is rendered as solid
The glassy state of liquid mixing, the pre-firing process can not only remove moisture therein, and can avoid circuit board
Stress is piled up, and improves the crudy of circuit board.
The predetermined temperature is, for example, 100-200 degree, preferably 120-180 degree, more preferably 125-150 degree.
Mode of heating can be selected using modes such as electrical heating, fuel Heating, gas heating, coal-fired heatings.
After powdery paints is heated into the temperature of regulation, then the predetermined time is incubated, is allowed to be completely melt and solidifies, it is described
The scheduled time is, for example, 1-10 hour, preferably 4-6 hours.
Circuit board is taken out in blow-on afterwards, you can the circuit board after being solidified.
Using ceramic brush board, 20-50 μm can be brushed every time, different model can be selected according to different thickness to be brushed
Ceramic brush roll, can thus brush the insulating barrier surface part of out-of-flatness.
It is interchangeable, can be using method burn off first insulating barrier 206 of laser ablation and the injustice of the second insulating barrier 207
Whole point, the speed of this sample loading mode can reach 100 μm every time.
In 4th step of third embodiment of the invention, continue to set new conductive layer in plate surface, and in conductive layer
On new line pattern is processed to form new line layer, such as the 307, the 4th line layer 308 of tertiary circuit layer.
New insulating barrier is set up if desired and line layer is led, then respectively in tertiary circuit the 307, the 4th line layer 308 of layer
On punched in the way of controlled depth milling, the depth in hole extends to next layer of line layer, and re-plating fills and leads up to form new plated through-hole.
Then the mode for reusing electrostatic spraying obtains new insulating barrier, so moves in circles, until reaching the default number of plies, this mode
The processing of multilayer circuit board can be realized.
Alternatively, first can be punched in the way of controlled depth milling on the insulating layer, the depth in the hole extends to the circuit of lower floor
Layer, re-plating fills and leads up to form new plated through-hole, sets line layer on the surface of insulating barrier and plated through-hole again afterwards, and such as the
On three line layers 307, the 4th line layer 308.Then the mode for reusing electrostatic spraying obtains new insulating barrier, so circulates past
Multiple, until reaching the default number of plies, this mode can realize the processing of multilayer circuit board.
Skilled addressee readily understands that, for 3rd embodiment in folded cellular type structure, not necessarily each
Will be drilled with connecting hole when setting up new insulating barrier and line layer, can according to the design of side circuit and actual demand,
Two or more insulating barriers and line layer are once drilled row metal of going forward side by side, or carries out other changes again to the method
Shape.
Know-why of the invention is described above in association with specific embodiment.These descriptions are intended merely to explain of the invention
Principle, and can not by any way be construed to limiting the scope of the invention.Based on explanation herein, the technology of this area
Personnel associate other specific embodiments of the invention by would not require any inventive effort, these modes fall within
Within protection scope of the present invention.
Claims (9)
1. a kind of processing method of circuit board, it is characterised in that the method comprises the following steps：
Step A：Circuit board with least surface line layer is provided；
Step B：Insulating powder is sprayed to using electrostatic spraying device the surface of line layer, powder is uniform under electrostatic interaction
Be adsorbed in the surface of line layer, form new insulating barrier, wherein, in spraying process, according to electrostatic screen situation, the amount of dusting,
Dust the different parameters value of distance or powder sort, be the suitable electrostatic potential of electrostatic spraying device adjustment；
Step C：High-temperature baking is carried out to new insulating barrier, solidifies it；
Step D：The top layer of the insulating barrier that leveling has cured；
Step E：Surface of insulating layer after leveling sets new line layer；
Step F：Repeat step B-E, until realizing the multilayer circuit board of predetermined number of layers；
Wherein, in step A or E, the copper post of protrusion is set on line layer.
2. method according to claim 1, it is characterised in that in stepb, it is 100 that an electrostatic spraying obtains thickness
~300 μm of insulating barrier.
3. method according to claim 1 and 2, it is characterised in that in stepb, electrostatic spraying powder includes asphalt mixtures modified by epoxy resin
At least one in fat, acrylic resin, polyethylene, polypropylene, nylon, ink or coating.
4. method according to claim 1, it is characterised in that in step C, insulating barrier is heated step by step in curing oven
To after predetermined temperature, then predetermined temperature is kept into Preset Time.
5. method according to claim 4, it is characterised in that the predetermined temperature in step C is 125-150 degree.
6. method according to claim 4, it is characterised in that the Preset Time in step C is 4-6 hours.
7. method according to claim 1, it is characterised in that the method to set up of the copper post is：Pasted on line pattern
Upper dry film, in dry film uplifting window, then fills and leads up the windowing with plating, and dry film is removed afterwards, you can the copper post of protrusion is obtained.
8. the method according to claim 1 or 7, it is characterised in that in step D, is burnt using ceramic brush board and/or laser
The mode of erosion solidifies the top layer of insulating barrier to flatten.
9. method according to claim 8, it is characterised in that will be exhausted by the way of ceramic brush board and/or laser ablation
The surface evening of edge layer is extremely flushed with copper post surface.
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| CN110868791A (en) * | 2018-08-27 | 2020-03-06 | 宁波舜宇光电信息有限公司 | Circuit board assembly and manufacturing method and application thereof |
| CN110366308A (en) * | 2019-08-02 | 2019-10-22 | 昆山丘钛微电子科技有限公司 | Route board fabrication method and wiring board |
| CN112770541B (en) * | 2020-12-07 | 2022-02-22 | 深圳市隆利科技股份有限公司 | Processing method for improving surface roughness of flexible circuit board and flexible circuit board |
| CN113464883A (en) * | 2021-06-29 | 2021-10-01 | 深圳市创迦照明有限公司 | COB integrated optical source high-pole lamp |
| CN114148108B (en) * | 2021-11-26 | 2022-09-16 | 东莞市启思达智能技术有限公司 | Efficient ink-jet method and system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1303230A (en) * | 1999-10-25 | 2001-07-11 | 张有常 | Technology for making printed circuit board with additional layers |
| CN1454043A (en) * | 2002-04-26 | 2003-11-05 | 耀华电子股份有限公司 | Manufacture of laser-burnt multilayered circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW431124B (en) * | 1999-05-06 | 2001-04-21 | World Wiser Electronics Inc | Manufacturing method of multi-layer printed circuit board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1303230A (en) * | 1999-10-25 | 2001-07-11 | 张有常 | Technology for making printed circuit board with additional layers |
| CN1454043A (en) * | 2002-04-26 | 2003-11-05 | 耀华电子股份有限公司 | Manufacture of laser-burnt multilayered circuit board |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |