CN1454043A - Manufacture of laser-burnt multilayered circuit board - Google Patents
Manufacture of laser-burnt multilayered circuit board Download PDFInfo
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- CN1454043A CN1454043A CN 02118801 CN02118801A CN1454043A CN 1454043 A CN1454043 A CN 1454043A CN 02118801 CN02118801 CN 02118801 CN 02118801 A CN02118801 A CN 02118801A CN 1454043 A CN1454043 A CN 1454043A
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- dielectric material
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Abstract
A preparing method is featured as the follows. A dielectric material of dry film or oil ink is coated on a base plate with copper face circuit and to have the dielectric material polymerization-formed on the base plate by baking. The sand belt or grinding brush is applied for levelling process of the dielectric material to let the finally formed circuit board face have better evenness but with coarse effect to raise its combinability. The electric light shooting beam is used to scorify holes at connection points of the diectric material to expose copper face circuit on the base plate. An upper layer copper circuit is formed by electroplating, chemical etching and face metallizing of the dielectric material and a multilayer circuit board with interlayer conduction can be obtained by conducting two copper circuits.
Description
Technical field
The present invention relates to a kind of multilayer circuit board fabrication method, particularly a kind of multilayer circuit board fabrication method of laser-burnt formula.
Background technology
The electrical equipment article can be reached gently, approach, short and small purpose of design in order to make for many years, have made the interior employed circuit board of electrical equipment article develop into the multilayer circuit plate structure that can layer ask conducting.And with the professional manufacturing technology of present circuit board, but had multiple different manufacture method to make the multilayer circuit board of interlayer conduction, and various manufacture methods have specific manufacturing step respectively, and respectively be configured to complete and complete making apparatus and cooperate production, beginning is enough to reach the economic benefit of this manufacture method, in other words, individual steps is to be configured to particular device beginning foot respectively finish in the manufacture method, more indivedual particular device groups is constituted complete equipment always to finish whole production method; Therefore in the manufacture method included individual steps once setting, although the processing procedure that is adopted in the individual steps can other conventional process of mat replaces the displacement of also having no way of, otherwise promptly depart from former inventive features that has of this production method and effect.
Summary of the invention
Technical problem to be solved by this invention is, at the above-mentioned deficiency of prior art and a kind of multilayer circuit board fabrication method of laser-burnt formula is provided.
Above-mentioned technical problem of the present invention is realized by following technical scheme.
A kind of multilayer circuit board fabrication method of laser-burnt formula comprises:
(1a), being coated in one with the dielectric material of dry film or printing ink has on the substrate of copper face circuit;
(1b), again dielectric material is toasted, make this dielectric material polymerization forming on substrate:
(1c), utilize abrasive band or polish-brush mode that dielectric material is done leveling processing again, make dielectric material have preferable evenness, make the end product surface not have uneven phenomenon, and have cleaning surfaces and matsurface effect concurrently, to improve the associativity of upper strata copper face circuit;
(1d), the tie point position on this dielectric material reveals the copper face circuit on this substrate 1 with laser beam scorification pore-forming again;
(1e), last again in the surface metalation and the plating of dielectric material, and form a upper strata copper circuit through chemical etching, make tie point position default in this upper strata copper circuit must with the copper circuit conducting on the substrate.
Above-mentioned technical problem of the present invention also can be realized by following another technical scheme.A kind of multilayer circuit board fabrication method of laser-burnt formula comprises:
(2a), being coated in one with the ground floor dielectric material of dry film or printing ink has on the substrate of ground floor copper face circuit;
(2b), again first dielectric material is toasted, this ground floor dielectric material polymerization is formed in above the substrate;
(2c), utilize abrasive band or polish-brush mode that dielectric material is done leveling processing again, make dielectric material have preferable evenness, make the end product surface not have uneven phenomenon, and have cleaning surfaces and matsurface effect concurrently, to improve the associativity of second layer copper face circuit;
(2d), in the surface of this ground floor dielectric material its metallization and plating are formed second layer copper face circuit again, and on this second layer copper face circuit, be reserved with the position, hole that connects ground floor copper face circuit;
(2e), be coated on the second layer copper face circuit with the second layer dielectric material of dry film or printing ink again; Again it is toasted, this second layer dielectric material polymerization is formed in above the second layer copper face circuit;
(2f), utilize abrasive band or polish-brush mode that dielectric material is done leveling processing again, make dielectric material have preferable evenness, make the end product surface not have uneven phenomenon, and have cleaning surfaces and matsurface effect concurrently, to improve the associativity of upper strata copper face circuit;
(2g), the tie point position on this second layer dielectric material reveals this ground floor copper face circuit and second layer copper face circuit with laser beam scorification pore-forming again;
(2h), last again in the surface metalation and the plating of second layer dielectric material, and form a upper strata copper circuit through chemical etching, make this upper strata copper circuit must with ground floor copper face circuit and second layer copper face circuit turn-on.
The invention has the advantages that:
The present invention mainly is the multilayer circuit board fabrication method that a kind of laser-burnt formula is provided at multilayer circuit board, and its whole manufacture method all has suitable otherness with present existing manufacture method, and has the value of industry.
For making the present invention clear and definite more full and accurate, enumerate a specific embodiment now and cooperate each figure to describe in detail as the back:
Description of drawings
Fig. 1 is a manufacturing process schematic diagram of the present invention.
Fig. 2 is that of the present invention another implemented the manufacturing process schematic diagram.
Embodiment
At first seeing also Fig. 1 the present invention is by each manufacturing step as described below, now that its division is as follows:
(1a), being coated in one with the dielectric material 2 of dry film or printing ink has on the substrate 1 of copper face circuit 11:
(1b), again dielectric material 2 is toasted, make these dielectric material section 2 polymerization formings on substrate 1;
(1c), utilize abrasive band or polish-brush mode that dielectric material 2 is done leveling processing again, make dielectric material 2 have preferable evenness, make the end product surface not have uneven phenomenon, and have cleaning surfaces and matsurface effect concurrently, to improve the associativity of upper strata copper face circuit 4;
(1d), the tie point position on this dielectric material 2 reveals the copper face circuit 11 on this substrate with laser beam 3 scorification pore-formings again;
(1e), last again in the surface metalation and the plating of dielectric material 2, and form a upper strata copper circuit 4 through chemical etching, make tie point position default in this upper strata copper circuit 4 must with copper circuit 11 conductings on the substrate 1.
According to above-mentioned manufacture method, because own moulding in advance on the copper face circuit 11 on the substrate 1, reshape one deck dielectric material 2 thereon and through leveling processing, and then in default tie point position with laser beam scorification pore-forming on dielectric material 2, make the copper face circuit 11 on the substrate 1 to reveal, the last copper face that forms whole piece again in the surface metalation of dielectric material 2 and plating, and through chemical etching, and form a upper strata copper circuit 4, make this upper strata copper circuit 4 the tie point position can with copper circuit 11 conductings on the substrate 1, but and the manufacturing moulding of reaching the two-tier circuit plate of an interlayer conduction.
See also Fig. 2 again, the present invention also can make more multi-layered circuit board as following manufacture method, and is now that its division is as follows:
(2a), being coated in one with the ground floor dielectric material 5 of dry film or printing ink has on the substrate of ground floor copper face circuit 12;
(2b), again first dielectric material 5 is toasted, these ground floor dielectric material 5 polymerizations are formed in above the substrate 1:
(2c), utilize abrasive band or polish-brush mode that dielectric material 5 is done leveling processing again, make dielectric material 5 have preferable evenness, make the end product surface not have uneven phenomenon, and have cleaning surfaces and matsurface effect concurrently, to improve the associativity of second layer copper face circuit 6;
(2d), in the surface of this ground floor dielectric material 5 its metallization and plating are formed second layer copper face circuit 6 again, and on this second layer copper face circuit 6, be reserved with position, the hole 61s that connects ground floor copper face circuit 12
(2e), be coated on the second layer copper face circuit 6 with the second layer dielectric material 7 of dry film or printing ink again; Again it is toasted, these second layer dielectric material 7 polymerizations are formed in above the second layer copper face circuit 6;
(2f), utilize abrasive band or polish-brush mode that dielectric material 7 is done leveling processing again, make dielectric material 7 have preferable evenness, make the end product surface not have uneven phenomenon, and have cleaning surfaces and matsurface effect concurrently, to improve the associativity of upper strata copper face circuit 4 ';
(2g), the tie point position on this second layer dielectric material 7 (being 61 corresponding positions, preformed hole position) again) with laser beam 3 scorification pore-formings, this ground floor copper face circuit 12 and second layer copper face circuit 6 are revealed;
(2h), last again in the surface metalation and the plating of second layer dielectric material 7, and form a upper strata copper circuit 4 ' through chemical etching, make this upper strata copper circuit 4 ' must with ground floor copper face circuit 12 and 5 conductings of second layer copper face circuit.
According to above-mentioned manufacture method, then can be made into more multi-layered circuit board, thereby reached the purpose of dwindling circuit board more.
Claims (2)
1, a kind of multilayer circuit board fabrication method of laser-burnt formula comprises:
(1a), being coated in one with the dielectric material of dry film or printing ink has on the substrate of copper face circuit;
(1b), again dielectric material is toasted, make this dielectric material polymerization forming on substrate:
(1c), utilize abrasive band or polish-brush mode that dielectric material is done leveling processing again, make dielectric material have preferable evenness, make the end product surface not have uneven phenomenon, and have cleaning surfaces and matsurface effect concurrently, to improve the associativity of upper strata copper face circuit;
(1d), the tie point position on this dielectric material reveals the copper face circuit on this substrate 1 with laser beam scorification pore-forming again;
(1e), last again in the surface metalation and the plating of dielectric material, and form a upper strata copper circuit through chemical etching, make tie point position default in this upper strata copper circuit must with the copper circuit conducting on the substrate.
2, a kind of multilayer circuit board fabrication method of laser-burnt formula comprises:
(2a), being coated in one with the ground floor dielectric material of dry film or printing ink has on the substrate of ground floor copper face circuit;
(2b), again first dielectric material is toasted, this ground floor dielectric material polymerization is formed in above the substrate;
(2c), utilize abrasive band or polish-brush mode that dielectric material is done leveling processing again, make dielectric material have preferable evenness, make the end product surface not have uneven phenomenon, and have cleaning surfaces and matsurface effect concurrently, to improve the associativity of second layer copper face circuit;
(2d), in the surface of this ground floor dielectric material its metallization and plating are formed second layer copper face circuit again, and on this second layer copper face circuit, be reserved with the position, hole that connects ground floor copper face circuit;
(2e), be coated on the second layer copper face circuit with the second layer dielectric material of dry film or printing ink again; Again it is toasted, this second layer dielectric material polymerization is formed in above the second layer copper face circuit;
(2f), utilize abrasive band or polish-brush mode that dielectric material is done leveling processing again, make dielectric material have preferable evenness, make the end product surface not have uneven phenomenon, and have cleaning surfaces and matsurface effect concurrently, to improve the associativity of upper strata copper face circuit;
(2g), the tie point position on this second layer dielectric material reveals this ground floor copper face circuit and second layer copper face circuit with laser beam scorification pore-forming again;
(2h), last again in the surface metalation and the plating of second layer dielectric material, and form a upper strata copper circuit through chemical etching, make this upper strata copper circuit must with ground floor copper face circuit and second layer copper face circuit turn-on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02118801 CN1454043A (en) | 2002-04-26 | 2002-04-26 | Manufacture of laser-burnt multilayered circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02118801 CN1454043A (en) | 2002-04-26 | 2002-04-26 | Manufacture of laser-burnt multilayered circuit board |
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| Publication Number | Publication Date |
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| CN1454043A true CN1454043A (en) | 2003-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 02118801 Pending CN1454043A (en) | 2002-04-26 | 2002-04-26 | Manufacture of laser-burnt multilayered circuit board |
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| CN (1) | CN1454043A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101134190A (en) * | 2006-08-31 | 2008-03-05 | 欣兴电子股份有限公司 | Jet printing technique for the metal surface treatment |
| WO2009155794A1 (en) * | 2008-06-23 | 2009-12-30 | 华为技术有限公司 | A multilayer circuit board and a manufacturing of the multilayer circuit board |
| CN101925257A (en) * | 2010-05-07 | 2010-12-22 | 竞华电子(深圳)有限公司 | Copper window manufacturing method of printed circuit board |
| CN102413646A (en) * | 2010-09-21 | 2012-04-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board |
| CN103517573A (en) * | 2012-06-20 | 2014-01-15 | 深南电路有限公司 | Processing method of circuit board |
| CN107960017A (en) * | 2017-12-25 | 2018-04-24 | 广州兴森快捷电路科技有限公司 | The processing method of wiring board solder mask |
| CN108697002A (en) * | 2018-04-24 | 2018-10-23 | 深圳市斯普莱特激光科技有限公司 | A kind of laser processing formula high-precision circuit board manufacture craft |
| CN109196963A (en) * | 2016-06-17 | 2019-01-11 | 株式会社村田制作所 | The manufacturing method of resin multilayer substrate |
| CN110366308A (en) * | 2019-08-02 | 2019-10-22 | 昆山丘钛微电子科技有限公司 | Route board fabrication method and wiring board |
-
2002
- 2002-04-26 CN CN 02118801 patent/CN1454043A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101134190A (en) * | 2006-08-31 | 2008-03-05 | 欣兴电子股份有限公司 | Jet printing technique for the metal surface treatment |
| WO2009155794A1 (en) * | 2008-06-23 | 2009-12-30 | 华为技术有限公司 | A multilayer circuit board and a manufacturing of the multilayer circuit board |
| CN101925257A (en) * | 2010-05-07 | 2010-12-22 | 竞华电子(深圳)有限公司 | Copper window manufacturing method of printed circuit board |
| CN102413646A (en) * | 2010-09-21 | 2012-04-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board |
| CN102413646B (en) * | 2010-09-21 | 2013-08-28 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board |
| CN103517573B (en) * | 2012-06-20 | 2017-06-16 | 深南电路有限公司 | A kind of processing method of circuit board |
| CN103517573A (en) * | 2012-06-20 | 2014-01-15 | 深南电路有限公司 | Processing method of circuit board |
| CN109196963A (en) * | 2016-06-17 | 2019-01-11 | 株式会社村田制作所 | The manufacturing method of resin multilayer substrate |
| CN109196963B (en) * | 2016-06-17 | 2020-12-04 | 株式会社村田制作所 | Method for manufacturing resin multilayer substrate |
| CN107960017A (en) * | 2017-12-25 | 2018-04-24 | 广州兴森快捷电路科技有限公司 | The processing method of wiring board solder mask |
| CN107960017B (en) * | 2017-12-25 | 2020-12-18 | 广州兴森快捷电路科技有限公司 | Processing method of circuit board solder mask |
| CN108697002A (en) * | 2018-04-24 | 2018-10-23 | 深圳市斯普莱特激光科技有限公司 | A kind of laser processing formula high-precision circuit board manufacture craft |
| CN110366308A (en) * | 2019-08-02 | 2019-10-22 | 昆山丘钛微电子科技有限公司 | Route board fabrication method and wiring board |
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