CN107960017B - Processing method of circuit board solder mask - Google Patents
Processing method of circuit board solder mask Download PDFInfo
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- CN107960017B CN107960017B CN201711425517.5A CN201711425517A CN107960017B CN 107960017 B CN107960017 B CN 107960017B CN 201711425517 A CN201711425517 A CN 201711425517A CN 107960017 B CN107960017 B CN 107960017B
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- Prior art keywords
- circuit board
- laser beam
- residual ink
- npth
- ink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention relates to a method for processing a solder mask of a circuit board. The processing method of the solder mask of the circuit board comprises the following steps: 1) spraying ink on the circuit board to form an ink layer; 2) flattening the ink layer on the circuit board; 3) sequentially carrying out exposure, development and curing treatment on the circuit board; 4) and (3) ablating residual ink in the NPTH holes of the circuit board and/or the residual ink of the target area by using a laser beam. According to the processing method of the circuit board solder mask, the residual ink in the NPTH hole and/or the residual ink in the target area of the circuit board are/is ablated by using the thermal effect of the laser beam, so that the residual ink in the NPTH hole or the residual ink in the target area can be thoroughly removed, and the ablation speed is high; further, the development speed does not need to be reduced, and the NPTH hole does not need to be back-drilled. Therefore, the reliability of the circuit board is not affected, the solder mask is prevented from cracking, and the hole position precision of the circuit board is not reduced.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method for processing a solder mask of a circuit board.
Background
Circuit boards are widely used as carriers of electronic components in various electronic products. With the development trend of miniaturization and multi-functionalization of electronic products, more integration and more precision of circuit boards are required.
However, in the actual production process of the circuit board, the ink easily enters NPTH holes (i.e. non-copper deposition holes) and cross target areas of the circuit board, and is difficult to remove in the subsequent processing procedures, so that residual ink is formed, and the defect of incomplete development of the product is caused.
At present, there are two methods for removing residual ink in NPTH holes and cross target areas. One approach is to reduce the development speed and thereby increase the development time for better removal of residual ink. However, this method reduces the production efficiency, and easily causes the solder resist to be over-etched, which affects the reliability of the circuit board, and cannot completely remove the residual ink. Another approach is to add a post-drilling step to the NPTH hole. The method is easy to cause the solder mask layer to break, and the hole position precision can not be ensured, thereby reducing the precision of the circuit board.
Disclosure of Invention
Based on this, it is necessary to provide a method for processing a solder mask layer of a circuit board, which can thoroughly remove residual ink in an NPTH hole and a target area, does not affect the reliability and the hole position accuracy of the circuit board, and can avoid the crack of the solder mask layer, in order to solve the problems that the prior art removes residual ink in the NPTH hole and the target area, which affects the reliability of the circuit board, easily causes the crack of the solder mask layer, reduces the hole position accuracy of the circuit board, and cannot thoroughly remove the residual ink.
The processing method of the circuit board solder mask comprises the following steps:
1) spraying ink on the circuit board to form an ink layer;
2) flattening the ink layer on the circuit board;
3) sequentially carrying out exposure, development and curing treatment on the ink layer of the circuit board to form a solder mask;
4) and (3) ablating residual ink in the NPTH holes at one side or two opposite sides of the circuit board and/or residual ink in a target area by using a laser beam.
According to the processing method of the circuit board solder mask, the residual ink in the NPTH hole and/or the residual ink in the target area of the circuit board are ablated by using the thermal effect of the laser beam, so that the residual ink in the NPTH hole or the residual ink in the target area is completely removed; further, it is not necessary to reduce the developing speed and to perform back drilling of the NPTH holes. Therefore, the reliability of the circuit board is not affected, the solder mask is prevented from cracking, and the hole position precision of the circuit board is not reduced.
In one embodiment, the step 4) specifically includes:
positioning a laser beam by using the NPTH hole;
ablating residual ink in the NPTH holes for positioning the laser beam by using the laser beam;
positioning the laser beam again using the NPTH hole from which residual ink was ablated;
and ablating residual ink of the circuit board by using a laser beam.
In one embodiment, the step 4) specifically includes the steps of:
positioning the laser beam by utilizing a positioning hole formed in the circuit board;
and ablating residual ink of the circuit board by using a laser beam.
In one embodiment, before positioning the laser beam by using the positioning hole formed on the circuit board, the method further comprises the following steps:
the circuit board is divided into at least two processing areas, and each processing area is provided with a positioning hole.
In one embodiment, in the step 4), the laser beam is moved in a circumferential direction at the hole wall of the NPTH hole while ablating residual ink in the NPTH hole with the laser beam.
In one embodiment, the step 4) specifically includes:
utilizing a laser beam to ablate residual ink in the NPTH hole and/or residual ink in the target area on one side of the circuit board;
overturning the circuit board;
and (3) ablating residual ink in the NPTH holes and/or residual ink in the target area on the other side of the circuit board by using a laser beam.
In one embodiment, in the step 4), when the residual ink in the NPTH hole is ablated, the spot diameter of the laser beam is 70-90 μm, and the distance between the spot center of the laser beam and the wall of the NPTH hole is 5-15 μm.
In one embodiment, the step 4) further comprises:
and ablating the ink layer in the preset area of the circuit board by using laser beams to realize windowing treatment of the circuit board.
In one embodiment, the laser beam employs CO2A laser beam.
In one embodiment, after the step 4), the method further comprises the steps of:
and washing the circuit board with water or plasma.
Drawings
Fig. 1 is a flowchart of a method for processing a solder resist layer of a circuit board according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, a method for processing a solder mask layer of a circuit board in an embodiment of the present invention includes the steps of:
s100: spraying ink on the circuit board to form an ink layer;
s200: flattening the ink layer on the circuit board;
s300: sequentially carrying out exposure, development and curing treatment on the ink layer of the circuit board to form a solder mask layer;
s400: and (3) ablating residual ink in the NPTH holes at one side or two opposite sides of the circuit board and/or residual ink in a target area by using a laser beam. Specifically, the flattening treatment adopts a vacuum flattening process. Laser beam using CO2A laser beam.
According to the processing method of the circuit board solder mask, the residual ink in the NPTH hole and/or the residual ink in the target area of the circuit board are ablated by using the thermal effect of the laser beam, so that the residual ink in the NPTH hole and the residual ink in the target area are thoroughly removed; further, it is not necessary to reduce the developing speed and to perform back drilling of the NPTH holes. Therefore, the reliability of the circuit board is not affected, the solder mask layer is prevented from being broken easily due to back drilling, and the hole position precision of the circuit board is not reduced.
Specifically, in step S400, while the residual ink in the NPTH hole is ablated with the laser beam, the laser beam moves in the circumferential direction at the hole wall of the NPTH hole. Thus, the portions of the residual ink connected to the walls of the NPTH holes are ablated, so that the residual ink is exfoliated.
Further, in step S400, when the residual ink in the NPTH hole is ablated, the spot diameter of the laser beam is 70 to 90 μm, and the distance between the spot center of the laser beam and the hole wall of the NPTH hole is 5 to 15 μm. Optionally, the spot diameter of the laser beam is 80 μm, and the distance between the spot center of the laser beam and the hole wall of the NPTH hole is 10 μm. Therefore, the laser beam can only ablate the residual ink and can not ablate the circuit board substrate.
In one embodiment, step S400 further includes:
and (3) ablating the ink layer in the preset area of the circuit board by using laser beams to realize windowing treatment of the circuit board. That is, the ink layer on the area needing to be windowed of the circuit board is ablated by a laser beam. Because the traditional method for windowing the circuit board through exposure and development treatment is influenced by an exposure machine and a developing solution, windowing with the width less than 80 mu m cannot be realized, and the design requirement cannot be met. Therefore, the window is opened by adopting a laser beam ablation mode, the window with the width less than 80 mu m can be opened, and the design requirement can be met. Furthermore, after the windowing treatment is carried out on the circuit board, solder balls can be implanted at the windowing position for forming the bonding pads.
In one embodiment, step S401 is further included after step S400:
and cleaning the circuit board.
Because the residual ink is ablated by adopting the laser beam, foreign matters such as glue residue and the like are remained in the NPTH hole, the metal surface of the target area or the metal surface of the windowing area, and the subsequent processes are seriously influenced. Therefore, foreign matters such as glue residues remained on the circuit board are removed through cleaning, so that the circuit board meets the requirements of subsequent processes, and the quality of the circuit board is further improved.
Further, step S401 specifically includes:
and carrying out water washing or plasma washing on the circuit board.
It will be appreciated that the cleaning requirements are higher due to the metal face of the target area and the metal face of the windowed area. Therefore, if only the residual ink in the NPTH holes of the wiring board is ablated in step S400, the wiring board may be water-washed in step S401. If step S400 includes ablation of residual ink in the target area with a laser beam or windowing of the wiring board, plasma cleaning may be performed in step S401.
In one embodiment, step S400 specifically includes:
the method comprises the following steps of (1) ablating residual ink in NPTH holes and/or residual ink in a target area on one side of a circuit board by using laser beams;
overturning the circuit board;
and (3) ablating residual ink in the NPTH holes and/or residual ink in the target area on the other side of the circuit board by using a laser beam.
Thus, residual ink in target areas on two sides of the circuit board is removed. In addition, for a thick circuit board, the NPTH hole is deep, and the residual ink in the NPTH hole can not be completely removed only by ablating the residual ink on one side of the NPTH hole, so that the residual ink in the NPTH hole is ablated from the other side of the circuit board by turning the circuit board upside down. Namely, the residual ink at both ends of the NPTH hole is ablated, so that the residual ink in the NPTH hole is further ensured to be thoroughly removed.
In one embodiment, step S400 specifically includes:
positioning the laser beam by utilizing the NPTH hole;
using a laser beam to ablate residual ink in the NPTH hole used for positioning the laser beam;
positioning the laser beam again by utilizing the NPTH hole with the ablated residual ink;
and (3) ablating residual ink of the circuit board by using a laser beam.
Residual ink is left in the NPTH hole and used as a positioning hole to influence the positioning precision of the laser beam, so that the residual ink in the NPTH hole or in a target area is not easy to ablate accurately. However, the present invention initially selects an NPTH hole, initially positions the laser beam, and ablates the residual ink in the hole by the laser beam. And then, accurately positioning the laser beam through the NPTH hole without residual ink, and further ablating other residual ink. Therefore, the positioning accuracy of the laser beam is ensured, and the situation that the laser beam ablates the solder mask to cause the circuit board to be poor is avoided.
In another embodiment, step S400 specifically includes:
the laser beam is positioned by utilizing the positioning hole formed on the circuit board,
and the laser beam is used for ablating residual ink of the circuit board.
The size of the target is small, the length of the target is 250-300 mu m generally, and the width of the target is 50-80 mu m, so that the positioning accuracy requirement on the laser beam is high. However, in the invention, the laser beam is positioned through the existing positioning hole on the circuit board, so that the positioning precision of the laser beam is improved.
Further, before positioning the laser beam by using the positioning hole formed on the circuit board, the method further comprises the following steps:
the circuit board is divided into at least two processing areas, and each processing area is provided with a positioning hole.
Therefore, the circuit board is divided into at least two processing areas, residual ink in each processing area is ablated by the laser beam in sequence, and positioning of the laser beam by the positioning hole in one processing area is further included before the residual ink in the processing area is ablated. Therefore, the influence of the deformation of the circuit board on the positioning precision of the laser beam is reduced. Specifically, the circuit board is divided into 4-10 processing areas.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. The processing method of the circuit board solder mask is characterized by comprising the following steps:
1) spraying ink on the circuit board to form an ink layer;
2) flattening the ink layer on the circuit board;
3) sequentially carrying out exposure, development and curing treatment on the ink layer of the circuit board to form a solder mask;
4) utilizing a laser beam to ablate residual ink in NPTH holes at one side or two opposite sides of the circuit board and/or the residual ink in a target area;
the step 4) specifically comprises the following steps: positioning a laser beam by using the NPTH hole; ablating residual ink in the NPTH holes for positioning the laser beam by using the laser beam; positioning the laser beam again using the NPTH hole from which residual ink was ablated; and ablating residual ink of the circuit board by using a laser beam.
2. A method for forming a solder resist layer according to claim 1, wherein in the step 4), the laser beam is moved in a circumferential direction on the wall of the NPTH hole while ablating residual ink in the NPTH hole with the laser beam.
3. A method for processing a solder resist layer according to claim 1, characterized in that the step 4) specifically comprises:
utilizing a laser beam to ablate residual ink in the NPTH hole and/or residual ink in the target area on one side of the circuit board;
overturning the circuit board;
and (3) ablating residual ink in the NPTH holes and/or residual ink in the target area on the other side of the circuit board by using a laser beam.
4. A method for forming a solder resist layer according to claim 1, wherein in the step 4), when the residual ink in the NPTH hole is ablated, the spot diameter of the laser beam is 70 to 90 μm, and the distance between the center of the spot of the laser beam and the wall of the NPTH hole is 5 to 15 μm.
5. A method for processing a solder resist layer according to claim 1, wherein said step 4) further comprises:
and ablating the ink layer in the preset area of the circuit board by using laser beams to realize windowing treatment of the circuit board.
6. A method for processing a solder resist layer according to claim 1, wherein said laser beam uses CO2A laser beam.
7. A method for processing a solder resist layer according to any one of claims 1 to 6, further comprising, after the step 4), the steps of:
and washing the circuit board with water or plasma.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711425517.5A CN107960017B (en) | 2017-12-25 | 2017-12-25 | Processing method of circuit board solder mask |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711425517.5A CN107960017B (en) | 2017-12-25 | 2017-12-25 | Processing method of circuit board solder mask |
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| CN107960017A CN107960017A (en) | 2018-04-24 |
| CN107960017B true CN107960017B (en) | 2020-12-18 |
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| CN108419378B (en) * | 2018-05-09 | 2019-12-20 | 深圳市百柔新材料技术有限公司 | Method for manufacturing protective layer of printed circuit board |
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| CN109275277B (en) * | 2018-10-17 | 2021-02-26 | 江门崇达电路技术有限公司 | Solder mask manufacturing method for preventing small holes of PCB from entering ink |
| CN111083871A (en) * | 2018-10-18 | 2020-04-28 | 北大方正集团有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN111299842B (en) * | 2018-12-11 | 2022-04-05 | 深圳市百柔新材料技术有限公司 | Method for high-precision laser engraving of solder mask |
| CN110337192A (en) * | 2019-07-04 | 2019-10-15 | 珠海崇达电路技术有限公司 | A kind of welding resistance layer manufacturing method thereof improving solder mask plug-hole |
| CN110324983A (en) * | 2019-07-29 | 2019-10-11 | 广州兴森快捷电路科技有限公司 | The production method of wiring board |
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| CN110933854B (en) * | 2019-12-24 | 2021-06-25 | 武汉华工激光工程有限责任公司 | Process and production system for removing materials in plug hole of PCB (printed circuit board) |
| CN113993294B (en) * | 2020-07-27 | 2024-03-22 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN114501833A (en) * | 2020-10-23 | 2022-05-13 | 深南电路股份有限公司 | Method for processing solder mask on circuit board |
| CN112672533B (en) * | 2020-12-09 | 2022-09-09 | 惠州市特创电子科技股份有限公司 | Circuit board, board body and windowing processing method thereof |
| CN112492763B (en) * | 2021-01-14 | 2021-06-01 | 深圳和美精艺半导体科技股份有限公司 | Solder-resisting laser windowing and ink-removing method for packaging substrate |
| CN115119416B (en) * | 2022-06-14 | 2023-11-21 | 湖北龙腾电子科技股份有限公司 | Method for solving problem of NPTH Kong Bianxian path oil thinning of PCB solder mask process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1454043A (en) * | 2002-04-26 | 2003-11-05 | 耀华电子股份有限公司 | Manufacture of laser-burnt multilayered circuit board |
| WO2012042846A1 (en) * | 2010-09-27 | 2012-04-05 | 太陽ホールディングス株式会社 | Method for forming solder resist |
| CN103052271A (en) * | 2012-12-17 | 2013-04-17 | 天津市德中技术发展有限公司 | Method for producing resistance soldering pattern and capable of conducting solderability treatment on surface of welding area |
| CN103917057A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Manufacturing method of printed circuit board small windowing pad |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101925257B (en) * | 2010-05-07 | 2012-07-04 | 竞华电子(深圳)有限公司 | Copper window manufacturing method of printed circuit board |
| KR20130012470A (en) * | 2011-07-25 | 2013-02-04 | 삼성전기주식회사 | Method for preparing bump, and substrate comprising the bump |
-
2017
- 2017-12-25 CN CN201711425517.5A patent/CN107960017B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1454043A (en) * | 2002-04-26 | 2003-11-05 | 耀华电子股份有限公司 | Manufacture of laser-burnt multilayered circuit board |
| WO2012042846A1 (en) * | 2010-09-27 | 2012-04-05 | 太陽ホールディングス株式会社 | Method for forming solder resist |
| CN103052271A (en) * | 2012-12-17 | 2013-04-17 | 天津市德中技术发展有限公司 | Method for producing resistance soldering pattern and capable of conducting solderability treatment on surface of welding area |
| CN103917057A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Manufacturing method of printed circuit board small windowing pad |
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