TWI726225B - Method for manufacturing biochips - Google Patents
Method for manufacturing biochips Download PDFInfo
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- TWI726225B TWI726225B TW107124873A TW107124873A TWI726225B TW I726225 B TWI726225 B TW I726225B TW 107124873 A TW107124873 A TW 107124873A TW 107124873 A TW107124873 A TW 107124873A TW I726225 B TWI726225 B TW I726225B
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- 0 **C(C(C1C(C2)(C3)C4CC5CC6*)C3(CC*3CC(CC7)CCC7CCCC3)O)C3C12C45C6C3* Chemical compound **C(C(C1C(C2)(C3)C4CC5CC6*)C3(CC*3CC(CC7)CCC7CCCC3)O)C3C12C45C6C3* 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C40—COMBINATORIAL TECHNOLOGY
- C40B—COMBINATORIAL CHEMISTRY; LIBRARIES, e.g. CHEMICAL LIBRARIES
- C40B50/00—Methods of creating libraries, e.g. combinatorial synthesis
Abstract
Description
本發明是有關於一種晶片製作方法,特別是指一種生醫晶片製作方法。The present invention relates to a method for manufacturing a wafer, in particular to a method for manufacturing a biomedical wafer.
生醫晶片已被廣泛應用於採樣篩檢,可使用少量樣品而輕易地大量執行諸如高產量篩選、酶素測定等之疾病診斷以及實驗。生醫晶片往往需要多道繁複的程序來製作,例如:光罩、化學或光學蝕刻、清潔等處理。除了製作過程繁複之外,還伴隨產生廢棄物之問題。Biomedical chips have been widely used in sampling and screening, which can easily perform large-scale disease diagnosis and experiments such as high-yield screening and enzyme determination using a small number of samples. Biomedical wafers often require multiple complicated procedures to produce, such as photomask, chemical or optical etching, and cleaning. In addition to the complicated production process, there is also the problem of waste generation.
有鑑於此,本發明提出一種生醫晶片製作方法,包含:形成一導電層在複數板件中的至少一者上;去除該導電層之部分區域以形成一導電線路;及將該些板件接合在一起,而形成該生醫晶片。In view of this, the present invention provides a method for manufacturing a biomedical wafer, including: forming a conductive layer on at least one of a plurality of plates; removing a part of the conductive layer to form a conductive circuit; and the plates Join together to form the biomedical chip.
在一些實施例中,所述去除步驟是以電漿蝕刻方式去除導電層之部分區域。In some embodiments, the removing step is to remove a part of the conductive layer by plasma etching.
在一些實施例中,所述去除步驟更包含:以雷射薄化導電層。In some embodiments, the removing step further includes: thinning the conductive layer with a laser.
在一些實施例中,所述去除步驟是採用深紫外光雷射。In some embodiments, the removing step uses a deep ultraviolet laser.
在一些實施例中,所述雷射刻劃步驟是採用深紫外光雷射。In some embodiments, the laser scribing step uses a deep ultraviolet laser.
在一些實施例中,該至少一凹陷選擇性的橫跨導電層與板件,或者僅位於導電層。In some embodiments, the at least one recess selectively spans the conductive layer and the board, or is located only in the conductive layer.
在一些實施例中,橫跨導電層與板件的凹陷為一流道。In some embodiments, the depression across the conductive layer and the plate is a flow channel.
在一些實施例中,導電層是透過電鍍方式形成。In some embodiments, the conductive layer is formed by electroplating.
在一些實施例中,於雷射刻劃步驟中還於該些板件上形成位置相對應的複數定位標靶,以於接合步驟中,根據該些定位標靶對位該些板件。In some embodiments, in the laser scribing step, a plurality of positioning targets corresponding to the positions are formed on the plates, so that the plates are aligned according to the positioning targets in the bonding step.
根據本發明實施例之生醫晶片製作方法,利用雷射進行多項加工,包含刻劃、去除、接合等步驟,可提供簡易快速的加工製程。特別是採用深紫外光雷射進行加工,可避免板件碎裂或產生熱效應與污染物。並且,配合電漿蝕刻,可一併去除不要的導電層區域與清潔接合區域,利於後續的接合步驟。According to the method for manufacturing a biomedical wafer according to an embodiment of the present invention, a laser is used to perform multiple processing, including the steps of scribing, removing, and bonding, which can provide a simple and fast processing process. In particular, the use of deep ultraviolet lasers for processing can prevent the plate from chipping or generating thermal effects and pollutants. In addition, with plasma etching, unnecessary conductive layer regions and clean bonding regions can be removed at the same time, which facilitates subsequent bonding steps.
參照圖1,係為本發明一實施例之生醫晶片製作方法流程示意圖。首先,提供複數板件100。在此,以三個板件100a、100b、100c為例。所述板件100的材質可為相同,亦可不同,本發明實施例不特別限制。在一些實施例中,板件100的材質為聚二甲基矽氧烷(PMDS)。Referring to FIG. 1, it is a schematic flowchart of a method for manufacturing a biomedical chip according to an embodiment of the present invention. First, a plurality of plates 100 are provided. Here, three
在步驟S310中,形成一導電層200在複數板件中的至少一者(於此以板件100c為例)上。在此,可利用電鍍的方式形成導電層200。In step S310, a
在步驟S320中,執行一雷射刻劃步驟,以在其中至少一個板件100上形成至少一凹陷110。於此,是以在板件100a與板件100b上分別形成凹陷111、112。板件100a上的凹陷111是圓形的穿孔,但本發明實施例不限制凹陷110的形狀。板件100b上的凹陷112是依據所需導流道而構成對應形狀的槽道,於此形狀僅為例示,並非以此為限。槽道包含引入區120及從引入區120引流而出的二流路121、122。In step S320, a laser scribing step is performed to form at least one
在一些實施例中,雷射刻劃步驟是利用深紫外光雷射來實現。In some embodiments, the laser scribing step is implemented using a deep ultraviolet laser.
在此,雖是以對於未形成導電層200的板件100a、100b執行雷射刻劃步驟為例來說明,但本發明之實施例非限於此。在一些實施例中,仍可對於具有導電層200的板件100施以雷射刻劃步驟而在該板件100上形成凹陷110。Here, although the laser scribing step is performed on the
在步驟S330中,執行一去除步驟,去除導電層200之部分區域,使得未被去除的部份形成導電線路。在此,未被去除的部份是形成電極210,但本發明實施例非以此為限。導電線路還可包含其他需要導電的線路,如導線。在此,去除步驟是利用雷射去除。在一些實施例中,去除步驟是利用深紫外光雷射。In step S330, a removal step is performed to remove a part of the
在一些實施例中,去除步驟是利用電漿蝕刻方式去除部分的導電層200區域。在一些實施例中,在以電漿蝕刻之前,還可以雷射預先薄化導電層200,可降低電漿蝕刻深度,加快製程。電漿蝕刻除了用來去除導電層200部分區域之外,還可對板件100之間的接合區域進行清潔,在後續接合步驟前進行預處理。In some embodiments, the removing step is to remove part of the
參照圖2,係為本發明一實施例之生醫晶片示意圖。對於經過前述加工的板件100a、100b、100c,執行一接合步驟,以將板件100a、100b、100c接合在一起,而形成生醫晶片400。所述接合方式可利用雷射焊接技術。在一些實施例中,雷射焊接技術是採用深紫外光雷射來實現。在此,各板件100之間的對應位置可設置多個接合區域,以在此些板件100疊合後,針對此些接合區域進行前述接合步驟。Refer to FIG. 2, which is a schematic diagram of a biomedical chip according to an embodiment of the present invention. For the previously processed
在一些實施例中,接合方式還可利用黏合、熔接、銲接等技術達成。In some embodiments, the joining method can also be achieved by techniques such as bonding, welding, and welding.
在一些實施例中,在前述雷射刻劃步驟中,還可在此些板件100上以雷射刻劃多個定位標靶,以利於接合步驟中,輔助對位此些板件100。所述對位是利用攝影機進行視覺對位,因此可配合機械手臂或運動平台來調整板件100的位置。In some embodiments, in the aforementioned laser scribing step, a plurality of positioning targets can also be laser scribed on the plates 100 to facilitate the alignment of the plates 100 in the joining step. The alignment uses a camera to perform visual alignment, so the position of the plate 100 can be adjusted in conjunction with a robotic arm or a motion platform.
在一些實施例中,可省略前述板件100b,而在板件100c上形成導電層200,並雷射刻劃出如圖1所示的凹陷112,並將部分導電層200去除而形成電極210。最後將板件100a與板件100c接合。換言之,所述凹陷110可選擇性的橫跨導電層200與板件100,或者僅位於導電層200。在此例中,橫跨導電層200與板件100的凹陷100則形成流道,僅位於導電層200的凹陷100則為導電層200被去除的部份。In some embodiments, the
根據本發明實施例之生醫晶片製作方法,利用雷射進行多項加工,包含刻劃、去除、接合等步驟,可提供簡易快速的加工製程。特別是採用深紫外光雷射進行加工,可避免板件100碎裂或產生熱效應與污染物。並且,配合電漿蝕刻,可一併去除不要的導電層200區域與清潔接合區域,利於後續的接合步驟。According to the method for manufacturing a biomedical wafer according to an embodiment of the present invention, a laser is used to perform multiple processing, including the steps of scribing, removing, and bonding, which can provide a simple and fast processing process. In particular, the use of deep ultraviolet lasers for processing can prevent the plate 100 from breaking or generating thermal effects and pollutants. In addition, with plasma etching, the unnecessary
100、100a、100b、100c‧‧‧板件
110、111、112‧‧‧凹陷
120‧‧‧引入區
121、122‧‧‧流路
200‧‧‧導電層
210‧‧‧電極
S310、S320、330‧‧‧步驟
400‧‧‧生醫晶片
410‧‧‧滴血孔
100, 100a, 100b, 100c‧‧‧
[圖1]為本發明一實施例之生醫晶片製作方法流程示意圖。 [圖2]為本發明一實施例之生醫晶片示意圖。[Figure 1] is a schematic flow diagram of a method for manufacturing a biomedical chip according to an embodiment of the present invention. [Figure 2] is a schematic diagram of a biomedical chip according to an embodiment of the present invention.
100、100a、100b、100c‧‧‧板件 100, 100a, 100b, 100c‧‧‧plate
110、111、112‧‧‧凹陷 110、111、112‧‧‧Concavity
120‧‧‧引入區 120‧‧‧Introduction area
121、122‧‧‧流路 121、122‧‧‧Flow path
200‧‧‧導電層 200‧‧‧Conductive layer
210‧‧‧電極 210‧‧‧electrode
S310、S320、330‧‧‧步驟 S310, S320, 330‧‧‧Step
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Citations (5)
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TWI230257B (en) * | 2002-10-01 | 2005-04-01 | Univ Nat Cheng Kung | Integrated analytical biochip and manufacturing method thereof |
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TWM526073U (en) * | 2016-04-29 | 2016-07-21 | zhi-hui Li | Test strip with multi-functional detecting values |
TW201643430A (en) * | 2015-04-24 | 2016-12-16 | 梅薩生物科技股份有限公司 | Fluidic test cassette |
TWM559769U (en) * | 2017-12-21 | 2018-05-11 | 李俊豪 | Laser processing equipment |
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CA2441366A1 (en) * | 2001-03-24 | 2002-10-03 | Aviva Biosciences Corporation | Biochips including ion transport detecting structures and methods of use |
US20090004403A1 (en) * | 2007-06-29 | 2009-01-01 | Yonggang Li | Method of Providing Patterned Embedded Conducive Layer Using Laser Aided Etching of Dielectric Build-Up Layer |
CN101949946B (en) * | 2010-09-03 | 2012-11-07 | 东华大学 | Method for producing photoelectrochemical microfluidic detection chip of three-electrode system |
CN103232023B (en) * | 2013-04-22 | 2016-06-29 | 西安交通大学 | A kind of silicon microstructure processing method processed based on femtosecond laser with wet etching |
TWI514670B (en) * | 2013-05-21 | 2015-12-21 | Wistron Neweb Corp | Method for making an antenna |
TWI533929B (en) * | 2013-12-13 | 2016-05-21 | 財團法人國家實驗研究院 | Microfluidic channel detection system and manufacturing method thereof |
WO2016163339A1 (en) * | 2015-04-07 | 2016-10-13 | 二プロ株式会社 | Stent |
CN105548315A (en) * | 2016-02-02 | 2016-05-04 | 苏州甫一电子科技有限公司 | Polymer micro-fluidic chip and preparation method thereof |
CN107570245B (en) * | 2017-09-04 | 2019-09-24 | 清华大学深圳研究生院 | A kind of self-loopa micro-fluidic chip and its preparation method and application |
CN107855142A (en) * | 2017-11-01 | 2018-03-30 | 深圳市第二人民医院 | A kind of detection chip and detection device based on microflow control technique |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US7087181B2 (en) * | 2000-01-31 | 2006-08-08 | Diagnoswiss S.A. | Method for fabricating micro-structures with various surface properties in multi-layer body by plasma etching |
TWI230257B (en) * | 2002-10-01 | 2005-04-01 | Univ Nat Cheng Kung | Integrated analytical biochip and manufacturing method thereof |
TW201643430A (en) * | 2015-04-24 | 2016-12-16 | 梅薩生物科技股份有限公司 | Fluidic test cassette |
TWM526073U (en) * | 2016-04-29 | 2016-07-21 | zhi-hui Li | Test strip with multi-functional detecting values |
TWM559769U (en) * | 2017-12-21 | 2018-05-11 | 李俊豪 | Laser processing equipment |
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