CN1520250A - Method for mutually connecting multolayer printed circuit board - Google Patents
Method for mutually connecting multolayer printed circuit board Download PDFInfo
- Publication number
- CN1520250A CN1520250A CNA031249361A CN03124936A CN1520250A CN 1520250 A CN1520250 A CN 1520250A CN A031249361 A CNA031249361 A CN A031249361A CN 03124936 A CN03124936 A CN 03124936A CN 1520250 A CN1520250 A CN 1520250A
- Authority
- CN
- China
- Prior art keywords
- underseal
- insulating barrier
- film
- metal layer
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
- B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
- B28C5/10—Mixing in containers not actuated to effect the mixing
- B28C5/12—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers
- B28C5/14—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis
- B28C5/148—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis the stirrer shaft carrying a plurality of radially extending mixing bars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
- B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
- B28C5/0806—Details; Accessories
- B28C5/0831—Drives or drive systems, e.g. toothed racks, winches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
- B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
- B28C5/10—Mixing in containers not actuated to effect the mixing
- B28C5/12—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers
- B28C5/14—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis
- B28C5/142—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis the stirrer shaft carrying screw-blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
- B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
- B28C5/10—Mixing in containers not actuated to effect the mixing
- B28C5/12—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers
- B28C5/14—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis
- B28C5/146—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis with several stirrers with parallel shafts in one container
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C19/00—Machines, tools or auxiliary devices for preparing or distributing paving materials, for working the placed materials, or for forming, consolidating, or finishing the paving
- E01C19/02—Machines, tools or auxiliary devices for preparing or distributing paving materials, for working the placed materials, or for forming, consolidating, or finishing the paving for preparing the materials
- E01C19/10—Apparatus or plants for premixing or precoating aggregate or fillers with non-hydraulic binders, e.g. with bitumen, with resins, i.e. producing mixtures or coating aggregates otherwise than by penetrating or surface dressing; Apparatus for premixing non-hydraulic mixtures prior to placing or for reconditioning salvaged non-hydraulic compositions
Landscapes
- Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Mechanical Engineering (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer exposed by the plating groove through a plating process to form connection protrusion, removing the etching resist layer, forming an insulation layer at the first metal layer and positioning a second metal layer at the surface of the insulation layer coupled to an end portion of the connection protrusion. By forming the connection protrusion through the plating process, a loss of material can be reduced and a strength of the connection protrusion can be increased. Further, a complexity of the fabrication process is reduced to reduce costs and increase productivity.
Description
Background of invention
Invention field
The present invention relates to multilayer board, the method for the multilayer board of the circuit pattern that relating in particular to is used to interconnect can be electrically connected multiple-level stack.
The description of background technology
Fig. 1 illustrates the print circuit plates making method of the routine techniques that is disclosed according to Korean Patent 203,540 (corresponding to United States Patent (USP) 5,600,103).
To 1 the print circuit plates making method that this Korean Patent 203,540 is disclosed be described with reference to the accompanying drawings.
The repeated using method for printing screen is coated in technology on the copper foil pattern 3 with conductive paste and obtains conical conductor projection 2 ' with the predetermined altitude growth, subsequently, the supporter 4 of the synthetic resin substrate of film shape is placed in that this conical conductor projection 2 ' is gone up and with compactings such as cylinders, thereby this conical conductor projection 2 ' can be penetrated and outstanding from the supporter 4 of synthetic resin substrate.
After this, with upper end and the compacting that Copper Foil places outstanding conductor projection 2 ',, thereby finish female connector 1 so that on Copper Foil, form circuit pattern.
But the shortcoming of above-mentioned print circuit plates making method is the technology of conductive paste coating must be repeated to form conductor projection 2 ' with certain altitude several times, and this causes this technology very complicated.
In addition, in order to increase the height of conductor projection 2 ', the base diameter of conductor projection 2 ' must keep greater than certain size.Subsequently, contiguous conductor projection keeps certain distance each other, thereby is difficult to form good circuit pattern and obtains compact printed circuit board (PCB).
In addition, in the technology that repeats the conductive paste coating, as long as with the conductive paste coating, just must carry out Alignment Process, this has just produced the problem that reduces productivity ratio and reduce the connection power between the conductive paste that repeats coating.
Fig. 2 A and 2B illustrate another example of the common process that the open 2001-111189 (corresponding to United States Patent (USP) 6,528,874) of Japan special permission disclosed.
The manufacture method of the printed circuit board (PCB) that the open 2001-111189 of Japan's special permission is disclosed is as follows.
At first, preparation base material 10.That is to say, when piling up the first bronze medal layer 11 and the second bronze medal layer 12 with underseal 13 betwixt, form base material 10 (with reference to figure 2A).
The first bronze medal layer 11 is used to form the connection outstanding 16 that is electrically connected the circuit pattern that piles up and forms thicklyer relatively.The second bronze medal layer 12 is used to form circuit pattern and forms thinlyyer relatively.
Upper surface and lower surface at base material 10 all form diaphragm 14.That is to say that the diaphragm 14 formation windows 15 of removing formation on the first bronze medal layer 11 form to connect gives prominence to 16, and forms the whole surface (with reference to figure 2B) that diaphragm 14 covers the second bronze medal layer 12.
In this state, when carrying out etch processes, etching solution infiltration has formed the part of window 15, removes copper layer 11 and keeps copper layer 11 in the part that is scribbling diaphragm 14, connects outstanding 16 (with reference to figure 2C) thereby form.
At this moment, because etching is sequentially carried out from the surface, therefore connect outstanding 16 and form the circular cone that diameter diminishes when it moves towards the end, this is called as etching factor (etching factor).
Therebetween, with reference to the second bronze medal layer 12, because it is with underseal 13 and diaphragm 14 protections, so etching solution can not permeate it.
After etch process was finished, diaphragm 14 was removed, and removed underseal 13 (with reference to figure 2D) by the etching solution that uses an etching underseal 13 subsequently.
After this, prepreg film 17 places to connect on outstanding 16 and with cylinder and suppresses.Subsequently, prepreg film 17 penetrates and connects outstanding 16 between connection outstanding 16, connects outstanding 16 end outstanding (with reference to figure 2E) on prepreg film 17 surfaces simultaneously.
By grinding the end of the connection outstanding 16 remove exposure, and hot pressing the 3rd bronze medal layer 18 forms circuit pattern.
Subsequently, the second bronze medal layer 12 is electrically connected (with reference to figure 2F) with the 3rd bronze medal layer 18 by being connected outstanding 16.
After this, on the second and the 3rd bronze medal layer 12 and 18, form circuit pattern 19, thereby finish printed circuit board (PCB) (with reference to figure 2G) by common method.
But this manufacture method according to the printed circuit board (PCB) of second common process has following problem.
At first, give prominence to 16 in order to form the connection with certain altitude, the first bronze medal layer 11 of formation is thicker, and this has produced a large amount of wastes of material.
The second, in form connecting outstanding 16 etching process, because the etching factor, connect outstanding 16 end diameter than little bottom it.Therefore, in order to have the particular value of end diameter, need to increase to connect and give prominence to 16 base diameter, but in this case, connecting the specific interval of necessary assurance between outstanding 16, thereby the gap turn narrow that is difficult to will connect between outstanding 16 forms good circuit pattern.
The 3rd, the second bronze medal layer 12 that forms circuit pattern has to form less than 20 microns thickness and connects the first outstanding bronze medal layer 11 and have about 100 microns thickness, and to connect outstanding 16 backs crooked forming thereby make the second bronze medal layer 12, thus be difficult to control it.
In addition, all use method for printing screen or etch process to form to connect outstanding according to the manufacture method of two kinds of printed circuit board (PCB)s of aforesaid two kinds of common process, this has produced increases spillage of material, reduce the problem that connects outstanding rigidity and reduce productivity ratio in a large number.
Summary of the invention
Therefore, an object of the present invention is to provide the method for the multilayer board that is used to interconnect, it can prevent to be formed with the metal level of circuit pattern the distortion such as bending, can be convenient to handle and can in the manufacturing process of printed circuit board (PCB), boost productivity by the intensity that increases base material.
Another object of the present invention provides the method for the multilayer board that is used to interconnect, and outstanding reduction spillage of material of connection and increase that it can adopt plating method (plating method) to form the circuit pattern that connects multilayer board are connected intensity of outburst.
Another purpose of the present invention provides the method for the multilayer board that is used to interconnect, and it can be made two circuit boards simultaneously by single treatment and boost productivity.
For purpose according to the present invention realizes these or other advantage, as concrete and description widely here, the method that is used to make multilayer board is provided, and it comprises: optionally expose the first metal layer forming underseal on the first metal layer and form a plurality of coating baths on this underseal; On the surface of the first metal layer that exposes by coating bath by plating technic make coating form connect outstanding; Remove underseal and form insulating barrier in first metal surface; And provide second metal level at surface of insulating layer, connect outstanding end so that be connected to.
In the method that is used for making multilayer board of the present invention, the first metal layer be made of copper and dry film (dry film) as underseal.
In the method that is used for making multilayer board of the present invention, coating bath is partly removed underseal by exposure/development process and is formed.
In the method that is used for making multilayer board of the present invention, insulating barrier is made by prepreg, if and this prepreg is a liquid, then it comes coating by method for printing screen, and in the situation of the prepreg film that uses the sheet type, suppress this prepreg film by the cylinder drawing method and make insulating barrier.
In the method that is used for making multilayer board of the present invention, second metal level is made of copper, and suppresses and be formed at insulator surface by using pressure setting (press).
In the method that is used for making multilayer board of the present invention, by grinding and smoothly forming the back at insulating barrier and form to be connected from the outstanding end of surface of insulating layer and give prominence to.
In order to realize the above object, the method that is used to make multilayer board also is provided, it comprises: be provided at base material that forms first sheet metal on two surfaces of substrate sheet and the underseal that forms on this first sheet metal; Optionally removing the underseal that is formed on the base material forms the groove that exposes first sheet metal and forms connection at the surface of first sheet metal that is exposed by groove filling metal level outstanding; On first sheet metal, remove underseal and form insulating barrier; Provide second sheet metal at surface of insulating layer and connect outstanding end so that be connected to; Separately be positioned at two substrates of substrate sheet both sides; And on first and second sheet metals that are formed on two substrates separately, form circuit pattern.
In the method that is used for making multilayer board of the present invention, discharging film (releasing film) puts between the substrate sheet and first sheet metal, so that first sheet metal separates with substrate sheet after finishing printed circuit board (PCB), and discharge film and form forr a short time, so that the edge of the substrate sheet and first metallic film is adhering to each other than substrate sheet.
In the method that is used for making multilayer board of the present invention, two substrates separate with substrate sheet in such a way, that is, a base material and a part discharge the edge of film and cut the part of removing substrate sheet and the adhesion of first metallic plate together.
In order to realize the above object, the method that is used to make multilayer board also is provided, it comprises: sequentially form sensitization insulating barrier and underseal on the surface of first metallic film; The groove that forms a plurality of platings on sensitization insulating barrier and underseal optionally exposes first metallic film; Forming coating on the first metallic film surface that is exposed by coating bath by plating technic forms to connect and gives prominence to; And remove underseal and second metallic film is placed surface of insulating layer so that be connected to the outstanding end of connection.
In being used to form the method for multilayer board of the present invention,, use polyimides liquid or film-type as the sensitization insulating barrier.
In order to realize above purpose, the method that is used to make multilayer board also is provided, it comprises:
Be provided at two surperficial underseals that form the base material of first sheet metals and form on the surface of first sheet metal subsequently of substrate sheet and sensitization insulating barrier; Optionally remove the sensitization insulating barrier and the underseal that are formed on the base material and form the groove that exposes first metallic film; It is outstanding to form connection at first metallic film surface filling metal level that is exposed by groove; Remove underseal and second metallic film is placed the surface of insulation film and connect outstanding end so that be connected to; Separately be positioned at two substrates of substrate sheet both sides; And on first and second metallic films that are formed on two substrates separately, form circuit pattern.
When in conjunction with the accompanying drawings, aforesaid and other purpose, characteristics, aspect and advantage of the present invention is by becoming more obvious in the following detailed description of the present invention.
Summary of drawings
Accompanying drawing has comprised the part of further understanding of the invention and combination and this specification of structure, embodiments of the invention also has been described and has been used from announcement principle of the present invention with description one.
In the accompanying drawings:
Fig. 1 illustrates an embodiment who is used for according to common process to make the schematic diagram of the method for printed circuit board (PCB);
Fig. 2 A to 2G illustrates the schematic diagram of sequence treatment process that another embodiment that is used for according to common process makes the method for printed circuit board (PCB);
Fig. 3 A to 3J is the schematic diagram that the sequence treatment process of the method that is used for making according to one embodiment of present invention printed circuit board (PCB) is shown; And
Fig. 4 A to 4G is the schematic diagram that the sequence treatment process of the method that is used for making according to another embodiment of the invention printed circuit board (PCB) is shown.
Embodiment
Now will be in detail with reference to preferred embodiment of the present invention, the example will illustrate in the accompanying drawings.
Fig. 3 A to 3J is the schematic diagram that the sequence treatment process of the method that is used for making according to one embodiment of present invention printed circuit board (PCB) is shown.
The method that is used for making according to one embodiment of present invention multilayer board is described referring now to Fig. 3 A to 3J.
At first, provide base material 50.Form this base material and be positioned at the both sides of substrate sheet 52 with specific thickness and intensity, adhere on it (with reference to figure 3A) and first metallic film 56 is stacked on the both sides of substrate sheet 52 and discharge film 54 so that discharge film 54.
Discharge that film 54 forms and less than substrate sheet 52 so that the edge of the first metal layer 56 directly adheres to the edge of substrate sheet 52, and the first metal layer 56 and substrate sheet 52 do not contact each other discharging the part that film 54 piles up.
The first metal layer 56 is preferably made of copper, and can be made by any other material, as long as this material has good electrical conductivity.
As discharging film 54, can adopt any material, as long as this material can prevent the adhesion between substrate sheet 52 and the first metal layer 56.The United States Patent (USP) 6,210,518 that has same applicant of the present invention to submit to has disclosed the method that is used to make base material.
It is center and symmetrical structure with substrate sheet 52 that base material 50 has top and lower part, so that treatment process subsequently can carry out simultaneously in the upper and lower part of substrate sheet 52.
After base material 50 is provided, partly removes dry film 58 by exposure/development process and form coating bath 60 (with reference to figure 3B).
After being used for, coating bath 60 on dry film 58, forms connection outstanding 68 so that the surface of the first metal layer 56 can expose.
On the surface of the first metal layer 56 that exposes by coating bath 60, carry out plating and form coating 62 (with reference to figure 3C) with certain altitude.This coating 62 is filled the surface that is formed at the coating bath 60 of dry film 58 and adheres to the first metal layer 56.
After forming coating 62, when removing dry film 58, only remaining coating 62 on the surface of the first metal layer 56, and coating 62 has formed outstanding 68 (with reference to the figure 3D) of connection.
After this, in connection outstanding 68, carry out soft etching (soft-etching), the base diameter little (with reference to figure 3E) of specific adhesion at the first metal layer 56 so that the end diameter of connection outstanding 68 becomes.
That is to say, connect outstanding 68 and have and cut circular cone that the upper end forms so that when from the bottom that sticks to the first metal layer 56 during to the end, its diameter reduces gradually.
Next, insulating barrier 70 is formed on the surface of the first metal layer 56, adheres on it (with reference to figure 3F) and connect outstanding 68.Insulating barrier 70 is made by prepreg, if and this prepreg is liquid, then it comes coating by using method for printing screen, and in the situation of using sheet type prepreg film, it can pass this prepreg film by the compacting of cylinder drawing method so that connect outstanding 68.
After insulating barrier 70 forms, grind the end of connection outstanding 68 and come the surface (with reference to figure 3G) of smooth connection outstanding 68.The end of this connection outstanding 68 is outstanding to a certain degree from the surface of insulating barrier 70.
After this, second metal level 70 piles up on the surface of insulating barrier 70 so that it can touch and connects outstanding 68 end (with reference to figure 3H).That is to say that second metal level 76 is placed in the surface of insulating barrier 70 and uses pressure setting to suppress.Subsequently, the first metal layer 56 is electrically connected by being connected outstanding 68 with second metal level 76.Second metal level 76 is preferably made of copper, and also can adopt any other material, as long as this material has good electrical conductivity.
When having piled up second metal level 76 fully, the edge that has piled up the base material 50 of the first metal layer 56 and second metal level 76 is cut (with reference to figure 3H) along the line of cut 71 that is illustrated by the broken lines.Because line of cut 71 is by discharging the part of film 54, base material 50 is along this line cutting, therefore this part that is stained with substrate sheet 52 and the first metal layer 56 is removed, so that first circuit board 80 and second circuit board 82 separate by the upside and the downside of release film 54 with substrate sheet 52, form two circuit boards 80 and 82 (with reference to figure 3I).
By on first and second circuit boards 80 and 82 that separate, forming circuit pattern 86 and 88, can obtain two printed circuit board (PCB)s (Fig. 3 J) by commonsense method.
Fig. 4 A to 4G is the schematic diagram that the sequence treatment process of the method that is used for making according to another embodiment of the invention printed circuit board (PCB) is shown.
The method that is used for making according to another embodiment of the invention multilayer board is described referring now to Fig. 4 A to 4G.
At first, provide base material 102.Form base material 102 so that discharge the both sides that film 106 is positioned at the substrate sheet of being made by prepreg 104, and the first metal layer 108 piles up on two surfaces that are stained with the substrate sheet 104 that discharges film 106 thereon.
Subsequently, sensitization insulating material 110 is stacked on the surface of the first metal layer 108, and dry film 112, and underseal is stacked on the surface of sensitization insulating material 110 (with reference to figure 4A).
Discharge that film 106 forms and littler than substrate sheet 104, so that the edge of the edge of the first metal layer 108 and substrate sheet 104 directly adheres to each other, and the first metal layer 108 and substrate sheet 104 have the part that discharges film 106 not adhere to each other piling up.
The substrate sheet of being made by prepreg 104 is reinforced to have enough rigidity in treatment process subsequently, so that enough support to be formed with the part of circuit pattern, so base material 102 can be easy to handle.
The first metal layer 108 is preferably made of copper, and also can adopt any other material, as long as this material has good electrical conductivity.
Discharging film 106 can be made by any material, as long as this material can prevent the adhesion between substrate sheet 104 and the first metal layer 108.
When having prepared base material 102, base material 102 comes part to remove dry film 112 through common exposure/development treatment and sensitization insulating barrier 110 forms coating bath 116 (with reference to figure 4B).
Carry out plating on the surface of the first metal layer 108 that exposes by coating bath 116 and form coating 120 (with reference to figure 4C).This coating 120 has been filled coating bath 116, sticks to the surface of the first metal layer 108, forms highlyer but not outstanding from the surface of dry film 112 than sensitization insulating barrier 110.
After having formed coating 120, remove dry film 112 so that at only remaining coating 120 in the surface of the first metal layer 108 and insulating material 110.This remaining coating 120 forms and connects outstanding 124 (with reference to figure 4D).
After this, second metal level 126 is stacked in the surface of insulating material 110, and contact connects outstanding 124 end (with reference to figure 4E).The first metal layer 108 that is to say that second metal level 126 is placed in the surface of sensitization insulating material 110 and is suppressed by pressure setting, so that can be electrically connected by being connected outstanding 124 with second metal level 126.
When second metal level 126 piled up fully, the edge that piles up by the base material 102 of the first metal layer 108 and second metal level 126 was cut (with reference to figure 4E) along the line of cut 111 that is illustrated by the broken lines.Because line of cut 111 is by discharging the part of film 106, base material 102 is along this line cutting, therefore this part that is stained with substrate sheet 104 and the first metal layer 108 is removed, so that first circuit board 130 and second circuit board 132 separate by the upside and the downside of release film 106 with substrate sheet 104, form two circuit boards 130 and 132 (with reference to figure 4F).
By on first and second circuit boards 130 and 132 that separate, forming circuit pattern 136 and 138, can obtain two printed circuit board (PCB)s (Fig. 4 G) by commonsense method.
As previously discussed, the method that is used to make multilayer board of the present invention has lot of advantages.
That is to say, at first,, thereby make base material can be easy to handle and can boost productivity because provide the substrate sheet of making by prepreg to make this base material have enough rigidity at the center of base material.
In addition, formation connects outstanding by plating technic electrical connection circuit pattern, compares and uses method for printing screen or etched situation can reduce spillage of material, and can also increase the rigidity that connection is given prominence to.
In addition, because printed circuit board (PCB) can be made at the upside and the downside of substrate sheet,, therefore, can boost productivity so can make two printed circuit board (PCB)s by the processing of producing once.
Can not deviate from its spirit and essential characteristic with several forms enforcements as the present invention, should be appreciated that unless otherwise, the above embodiments are not limited by above-mentioned any details, but should roughly in as claims, explain in defined its spirit and scope, therefore, whole variations and the modification in the equivalent of the boundary of claim and scope or these boundaries and scope is intended to be accepted by claims.
Claims (26)
1. the protuberance manufacture method of the circuit pattern of the multilayer board that is used to interconnect is characterized in that described method comprises:
On described underseal, form coating bath forming underseal on the first metal layer and optionally expose described the first metal layer;
Form coating on the surface of the described the first metal layer that exposes by described coating bath by plating technic and form the connection protuberance;
Remove described underseal and on described the first metal layer, form insulating barrier; And
Provide second metal level on the surface of described insulating barrier, so that be connected to the end of described connection protuberance.
2. the method for claim 1 is characterized in that, uses dry film as described underseal.
3. the method for claim 1 is characterized in that, described connection protuberance is outstanding from the surface of described underseal.
4. the method for claim 1 is characterized in that, partly removes described underseal by exposure/development process and forms described coating bath.
5. the method for claim 1 is characterized in that, also comprises: carry out soft etching on described connection protuberance, so that the end diameter specific adhesion of described connection protuberance its base diameter on described the first metal layer is little.
6. the method for claim 1 is characterized in that, described insulating barrier is made by prepreg.
7. method as claimed in claim 6, it is characterized in that if described prepreg is a liquid, then it is by the silk screen print method coating, and in the situation of using sheet type prepreg film, described prepreg film is suppressed by the cylinder pressing and is made described insulating barrier.
8. the method for claim 1 is characterized in that, described second metal level suppresses and be formed at the surface of described insulating barrier by pressure setting.
9. the method for claim 1 is characterized in that, after forming described insulating barrier, gives prominence to described the connection by grinding with smooth formation from outstanding end, the surface of described insulating barrier.
10. the method for the circuit pattern of the multilayer board that is used to interconnect is characterized in that described method comprises:
Be provided at base material that forms first sheet metal on two surfaces of substrate sheet and the underseal that on the surface of described first sheet metal, forms;
Optionally removing the described underseal that is formed on the described base material forms the groove of described first sheet metal of exposure and forms the connection protuberance on the surface of described first sheet metal that has described groove to expose by coating method filling metal level;
Remove described underseal and on described first sheet metal, form insulating barrier;
Provide second sheet metal on the surface of described insulating barrier, so that be connected to the end of described connection protuberance;
Two substrates that will be positioned at described substrate sheet both sides separate; And
On described first and second sheet metals that are formed on described two substrates that separate, form circuit pattern.
11. method as claimed in claim 10 is characterized in that, discharges film and is placed between described substrate sheet and described first sheet metal, so that described first sheet metal can separate with substrate sheet after finishing printed circuit board (PCB).
12. method as claimed in claim 11 is characterized in that, described release film forms less than described substrate sheet, so that the edge of the edge of described substrate sheet and described first sheet metal can be adhering to each other.
13. method as claimed in claim 10 is characterized in that, described substrate sheet is made by prepreg.
14. method as claimed in claim 10 is characterized in that, described underseal is formed by dry film.
15. method as claimed in claim 10 is characterized in that, described groove is partly removed described underseal by exposure/development process and is formed at described underseal.
16. method as claimed in claim 10 is characterized in that, forms coating by plating technic on the surface of described first metallic film that is exposed by described groove and makes described connection protuberance.
17. method as claimed in claim 10 is characterized in that, also is included on the described connection protuberance to carry out soft etching, so that the end diameter specific adhesion of described connection protuberance its base diameter on described first sheet metal is little.
18. method as claimed in claim 10 is characterized in that, after forming described insulating barrier, forms the described protuberance that is connected by grinding with smooth its from the outstanding end of described surface of insulating layer.
19. method as claimed in claim 10 is characterized in that, described insulating barrier is made by prepreg.
20. method as claimed in claim 10, it is characterized in that, described two substrates separate with described substrate sheet in such a way, that is, two edges of described base material and a part of described release film are cut the part of removing described substrate sheet and the adhesion of described first metallic plate together.
21. the circuit pattern protuberance manufacture method of the multilayer board that is used to interconnect is characterized in that described method comprises:
Form sensitization insulating barrier and underseal on the surface of first metallic film successively;
On described sensitization insulating barrier and described underseal, form coating bath and optionally expose described the first metal layer;
Form coating on the described the first metal layer surface that exposes by described coating bath by plating technic and form the connection protuberance; And
Remove described underseal and second metallic film is placed the surface of described insulating barrier so that be connected to the end of described connection protuberance.
22. method as claimed in claim 21 is characterized in that, the polyimides that uses liquid state or film-type is as described sensitization insulating barrier.
23. method as claimed in claim 21 is characterized in that, uses dry film as described underseal.
24. method as claimed in claim 21 is characterized in that, partly removes described sensitization insulating barrier and described underseal forms coating bath by exposure/development process.
25. method as claimed in claim 21 is characterized in that, described second metal level uses the pressure setting compacting and is formed on described surface of insulating layer.
26. method as claimed in claim 21 is characterized in that, also comprises:
Use described the first metal layer and described second metal level to form circuit pattern.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030007572A KR100442918B1 (en) | 2003-02-06 | 2003-02-06 | Multi-layer PCB making method |
| KR1020030007572 | 2003-02-06 | ||
| KR10-2003-0007572 | 2003-02-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1520250A true CN1520250A (en) | 2004-08-11 |
| CN1312966C CN1312966C (en) | 2007-04-25 |
Family
ID=34056753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031249361A Expired - Fee Related CN1312966C (en) | 2003-02-06 | 2003-09-15 | Method for mutually connecting multolayer printed circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3921595B2 (en) |
| KR (1) | KR100442918B1 (en) |
| CN (1) | CN1312966C (en) |
| TW (1) | TW592019B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101170874B (en) * | 2006-10-25 | 2011-04-06 | 三星电机株式会社 | Method for forming transcription circuit and method for manufacturing circuit board |
| CN102009513A (en) * | 2010-07-21 | 2011-04-13 | 广东生益科技股份有限公司 | Insulating reinforced plate and making method thereof |
| CN101990791B (en) * | 2008-02-29 | 2013-03-27 | Lg伊诺特有限公司 | Printed circuit board and method of manufacturing the same |
| CN109270716A (en) * | 2018-11-22 | 2019-01-25 | 京东方科技集团股份有限公司 | A kind of binding method of display device, display panel and display device |
| CN110691497A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110785017A (en) * | 2019-11-08 | 2020-02-11 | 深南电路股份有限公司 | Method for preparing printed circuit board |
| CN112770541A (en) * | 2020-12-07 | 2021-05-07 | 深圳市隆利科技股份有限公司 | Processing method for improving surface roughness of flexible circuit board and flexible circuit board |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006098207A1 (en) | 2005-03-14 | 2006-09-21 | Ricoh Company, Ltd. | Multilayer wiring structure and method of manufacturing the same |
| JP2007013048A (en) * | 2005-07-04 | 2007-01-18 | Daiwa Kogyo:Kk | Multilayer wiring board manufacturing method |
| KR100693146B1 (en) | 2005-07-26 | 2007-03-13 | 엘지전자 주식회사 | Multi-layer printed circuit board making method |
| JP4334005B2 (en) * | 2005-12-07 | 2009-09-16 | 新光電気工業株式会社 | Wiring board manufacturing method and electronic component mounting structure manufacturing method |
| TWI320963B (en) | 2006-12-06 | 2010-02-21 | Princo Corp | Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof |
| JP2009021435A (en) * | 2007-07-12 | 2009-01-29 | Sony Chemical & Information Device Corp | Manufacturing method of wiring board |
| JP4635033B2 (en) * | 2007-08-21 | 2011-02-16 | 新光電気工業株式会社 | Wiring board manufacturing method and electronic component mounting structure manufacturing method |
| KR100897668B1 (en) | 2007-09-18 | 2009-05-14 | 삼성전기주식회사 | Fabricating Method of Printed Circuit Board using the Carrier |
| US8238114B2 (en) | 2007-09-20 | 2012-08-07 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing same |
| KR100929839B1 (en) * | 2007-09-28 | 2009-12-04 | 삼성전기주식회사 | Substrate Manufacturing Method |
| JP2010080545A (en) * | 2008-09-24 | 2010-04-08 | Dainippon Printing Co Ltd | Method of manufacturing substrate sheet with conductive bump and method of manufacturing multilayer printed wiring board |
| KR101085576B1 (en) | 2009-05-15 | 2011-11-25 | 주식회사 심텍 | Method for fabricating printed-circuit-board using metal and printed-circuit-board fabricated using thereof |
| KR101077315B1 (en) | 2009-06-17 | 2011-10-26 | 주식회사 코리아써키트 | Method of manufacturing carrier board and method of manufacturing buried printed curcuit board using the carrier |
| KR101044117B1 (en) | 2009-11-02 | 2011-06-28 | 삼성전기주식회사 | Method of Fabricating Printed Circuit Board |
| KR101167422B1 (en) | 2010-09-15 | 2012-07-19 | 삼성전기주식회사 | Carrier member and method of manufacturing PCB using the same |
| JP6076653B2 (en) * | 2012-08-29 | 2017-02-08 | 新光電気工業株式会社 | Electronic component built-in substrate and manufacturing method of electronic component built-in substrate |
| KR20180010091A (en) * | 2016-07-20 | 2018-01-30 | 주식회사 내경전자 | Metal printed circuit board and method for manufacturing the same |
| CN107809857B (en) * | 2017-11-22 | 2023-08-01 | 苏州市亿利华电子有限公司 | Multilayer PCB board rubber coating compression fittings |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07302977A (en) * | 1994-04-28 | 1995-11-14 | Ibiden Co Ltd | Manufacture of multilayer printed-wiring board and copper-clad laminated board used for it |
| JPH1154930A (en) * | 1997-07-30 | 1999-02-26 | Ngk Spark Plug Co Ltd | Manufacture of multilayered wiring board |
| JPH1154932A (en) * | 1997-07-31 | 1999-02-26 | Ngk Spark Plug Co Ltd | Manufacture of multilayered wiring board |
| JP3884890B2 (en) * | 1999-10-08 | 2007-02-21 | キヤノン株式会社 | Image processing apparatus and method |
| TW512467B (en) * | 1999-10-12 | 2002-12-01 | North Kk | Wiring circuit substrate and manufacturing method therefor |
| JP4497613B2 (en) * | 2000-01-07 | 2010-07-07 | イビデン株式会社 | Manufacturing method of multilayer printed wiring board |
| JP2002337268A (en) * | 2001-05-21 | 2002-11-27 | Nitto Denko Corp | Metal foil laminate and its manufacturing method |
| JP2002374066A (en) * | 2001-06-14 | 2002-12-26 | Ibiden Co Ltd | Method for manufacturing multilayered printed circuit substrate |
-
2003
- 2003-02-06 KR KR1020030007572A patent/KR100442918B1/en not_active IP Right Cessation
- 2003-08-08 TW TW092121793A patent/TW592019B/en not_active IP Right Cessation
- 2003-08-26 JP JP2003301671A patent/JP3921595B2/en not_active Expired - Fee Related
- 2003-09-15 CN CNB031249361A patent/CN1312966C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101170874B (en) * | 2006-10-25 | 2011-04-06 | 三星电机株式会社 | Method for forming transcription circuit and method for manufacturing circuit board |
| CN101990791B (en) * | 2008-02-29 | 2013-03-27 | Lg伊诺特有限公司 | Printed circuit board and method of manufacturing the same |
| CN102009513A (en) * | 2010-07-21 | 2011-04-13 | 广东生益科技股份有限公司 | Insulating reinforced plate and making method thereof |
| CN102009513B (en) * | 2010-07-21 | 2013-03-06 | 广东生益科技股份有限公司 | Insulating reinforced plate and making method thereof |
| CN110691497A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110691497B (en) * | 2018-07-06 | 2024-04-23 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN109270716A (en) * | 2018-11-22 | 2019-01-25 | 京东方科技集团股份有限公司 | A kind of binding method of display device, display panel and display device |
| CN110785017A (en) * | 2019-11-08 | 2020-02-11 | 深南电路股份有限公司 | Method for preparing printed circuit board |
| CN112770541A (en) * | 2020-12-07 | 2021-05-07 | 深圳市隆利科技股份有限公司 | Processing method for improving surface roughness of flexible circuit board and flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3921595B2 (en) | 2007-05-30 |
| KR100442918B1 (en) | 2004-08-02 |
| TW592019B (en) | 2004-06-11 |
| JP2004363536A (en) | 2004-12-24 |
| TW200415975A (en) | 2004-08-16 |
| CN1312966C (en) | 2007-04-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1520250A (en) | Method for mutually connecting multolayer printed circuit board | |
| CN1236658C (en) | Monolithic ceramic electronic element and its producing method and electronic device | |
| CN1949467A (en) | Coreless substrate and manufacturing method thereof | |
| CN1575091A (en) | Wired circuit board | |
| CN1176567C (en) | Method of manufacturing multilayer wiring board | |
| CN1968576A (en) | Fabricating method of printed circuit board having embedded component | |
| CN1860833A (en) | Multilayer laminated circuit board | |
| CN1104404A (en) | Circuit elements and manufacture of same | |
| CN1798479A (en) | Printed circuit board including embedded chips and method of fabricating the same | |
| CN1615069A (en) | Multi-layer printed circuit board and fabricating method thereof | |
| CN1829416A (en) | Embedded chip printed circuit board and method of manufacturing the same | |
| CN1520704A (en) | Core substrate, and multilayer circuit board using it | |
| CN1177339C (en) | Inductor device and process of production thereof | |
| CN1146974C (en) | Method of manufacturing a multi-layered ceramic substrate | |
| CN1095176C (en) | Thin-film capacitor and its manufacturing method, and hybrid circuit substrate and its assembling method | |
| CN1185913C (en) | Wiring circuit board with projecture and its producing method | |
| CN1171300C (en) | Method for making wiring circuit board with convex point and method for forming convex point | |
| CN110798988A (en) | Additive process for manufacturing high-frequency antenna packaging substrate and AiP packaging antenna structure | |
| CN1925148A (en) | Multilayer wiring substrate and method for manufacturing same | |
| CN1993021A (en) | Method for manufacturing wiring board | |
| CN1751547A (en) | Multilayer board and its manufacturing method | |
| CN1565150A (en) | Interlayer connection structure and its building method | |
| CN101053287A (en) | Laminated ceramic component and method for manufacturing the same | |
| CN1174446C (en) | Laminated ceramic electronic parts and its mfg. method | |
| CN1585594A (en) | Double-sided wiring circuit board and process for producing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: LG INNOTEK CO., LTD. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20100618 Address after: Seoul, South Kerean Co-patentee after: IG Innotek Co., Ltd. Patentee after: LG Electronics Inc. Address before: Seoul, South Kerean Patentee before: LG Electronics Inc. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070425 Termination date: 20160915 |