TW200415975A - Method for interconnecting multi-layer printed circuit board - Google Patents

Method for interconnecting multi-layer printed circuit board Download PDF

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Publication number
TW200415975A
TW200415975A TW092121793A TW92121793A TW200415975A TW 200415975 A TW200415975 A TW 200415975A TW 092121793 A TW092121793 A TW 092121793A TW 92121793 A TW92121793 A TW 92121793A TW 200415975 A TW200415975 A TW 200415975A
Authority
TW
Taiwan
Prior art keywords
layer
metal
item
scope
patent application
Prior art date
Application number
TW092121793A
Other languages
Chinese (zh)
Other versions
TW592019B (en
Inventor
Sung-Gue Lee
Jung-Ho Hwang
Joon-Wook Han
Sang-Min Lee
Tae-Sik Eo
Yu-Seock Yang
Original Assignee
Lg Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Electronics Inc filed Critical Lg Electronics Inc
Application granted granted Critical
Publication of TW592019B publication Critical patent/TW592019B/en
Publication of TW200415975A publication Critical patent/TW200415975A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
    • B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
    • B28C5/10—Mixing in containers not actuated to effect the mixing
    • B28C5/12—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers
    • B28C5/14—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis
    • B28C5/148—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis the stirrer shaft carrying a plurality of radially extending mixing bars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
    • B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
    • B28C5/0806—Details; Accessories
    • B28C5/0831—Drives or drive systems, e.g. toothed racks, winches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
    • B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
    • B28C5/10—Mixing in containers not actuated to effect the mixing
    • B28C5/12—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers
    • B28C5/14—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis
    • B28C5/142—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis the stirrer shaft carrying screw-blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
    • B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
    • B28C5/10—Mixing in containers not actuated to effect the mixing
    • B28C5/12—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers
    • B28C5/14—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis
    • B28C5/146—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis with several stirrers with parallel shafts in one container
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C19/00—Machines, tools or auxiliary devices for preparing or distributing paving materials, for working the placed materials, or for forming, consolidating, or finishing the paving
    • E01C19/02—Machines, tools or auxiliary devices for preparing or distributing paving materials, for working the placed materials, or for forming, consolidating, or finishing the paving for preparing the materials
    • E01C19/10—Apparatus or plants for premixing or precoating aggregate or fillers with non-hydraulic binders, e.g. with bitumen, with resins, i.e. producing mixtures or coating aggregates otherwise than by penetrating or surface dressing; Apparatus for premixing non-hydraulic mixtures prior to placing or for reconditioning salvaged non-hydraulic compositions

Abstract

A method for fabricating a multi-layer printed circuit board includes: forming an etching resist layer on a first metal layer and forming a plating groove on the etching resist layer to selectively expose the first metal layer; forming a plated layer at the surface of the first metal layer exposed by the plating groove through a plating process to form connection protrusion; removing the etching resist layer and forming an insulation layer at the first metal layer; and positioning a second metal layer at the surface of the insulation layer, so as to be connected to an end portion of the connection protrusion. A strength of the base material is increased so as to be easily handled and a productivity can be increased. By forming the connection protrusion through the plating process, a material loss can be reduced.

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200415975 玖、發明說明： 【發明所屬之技術領域】 本叙明係相關於一多層印刷電路板，並且更特別地相 關於一種用於互連多層印刷電路板之方法，該多層電路板 月b夠電氣地連接由多層所堆疊出之電路圖樣。 【先前技術】 圖1係說明一習知之印刷電路板製造方法，且該習知 技藝係揭露於韓國專利號203,540(該對應案為美國專利案 第 5, 600, 1 03 號）。 揭示於韓國專利案第203540號之製造印刷電路板的方 法將參照第1圖敘述於下。 篩選印刷將依導電膏塗覆在一銅箔圖案3上之製程係 一再重複實施，以獲得一圓錐導體凸塊（bump)2，，其以一 預定高度成長，並且一薄膜型之合成樹脂基礎之支撐體4 2被疋位在該圓錐導體凸塊2,上並且用一滾輪或類似物施 i，於疋該圓錐導體凸塊2,能從該合成樹脂基底之支撐體 4穿過及凸出。 口此 銅癌係放置於該導體凸塊2，之凸出的上終端 P處及予以施壓以形成在該銅箔處之電路圖案，因而完成 一内部連接器1。 二然而，前述印刷電路板製造方法之缺點係在於用於塗 ，，導電膏之製程必須被重複地執行數次以形成具有一特 疋阿度之導體凸塊2’，造成該製程變得複雜化。 ^uu41^975 ^卜為了彡曰加该導體凸塊2’之高度，該導體凸塊2, 方。卩伤的直徑應該被維持在一特定尺寸之上。然後 忒相郇^體凸塊係相互維持一距離，使得難以形成一細 線圖木，而難以獲得一精密細緻之印刷電路板。 甚而，在重複塗敷該導電膏之過程中，則不論何時塗 敷該導電膏，必須執行對準製程，造成生產力退化以及介 於该重複塗敷之導電膏之間的連接力亦退化等問題。 、圖2A及2B揭不另一習知技藝之範例，其揭露在曰本 ^開公告號2〇〇1-111189(其對應於美國專利 6, 528, 874)。 揭露在曰本公開公告號2001 _111189之印刷電路板製 w方法係如下所述。 首先’準備-基底材料10。意即，該基底材質1〇係 ==層11及-第二銅層&並且在該第一銅層與 / 7銅層之間係堆疊一抗姓刻層13(參考圖2A)。 該第一銅層π得用以你士 係用以形成一連接凸部16，以電性地 連接該堆疊之電路圖案，並且第一鋼層係相對較厚。該第 :二12係為了形成該電路圖案，並且該第二銅層係相 :抗1膜U係形成在該基底材料1〇之上部表面及 :二表：。思即雖然該抗㈣膜14爾覆蓋全部該第 —鋼層12之全部表面（夂去同 I衣面C簽考圖2B) ’但形成在該第一銅層 之表面的抗㈣膜14係被去除以形成窗15 連接凸部1 6。 200415975 在此-狀況，當完成-钮刻製程時，一敍刻溶液渗透 該窗15之形成處，去除該銅層n但在該抗蝕薄膜〗:被 塗敷之部份處仍保留該銅層u，因而形成該連接凸部16( 參考圖2C)。 /在此時，由於蝕刻從表面依序地執行，故該連接凸部 16係形成圓錐狀，且其直徑在朝向終端部份變成較小，這 就所謂該蝕刻因子。 同時，請參考該第二銅層12,由於其被該抗勒刻層Μ 及該抗蝕薄膜14所保護，故該蝕刻溶液並不會滲透 銅層12。 /一 在完成該蝕刻製程後，該抗蝕薄膜14係被去除，並且 該抗姓刻f 13係藉由使用—㈣溶液也接著被去除，且 該姓刻溶液可選擇性地僅敍刻該抗姓刻層13(參考圖 干因化欺Kprepreg) * 。/ W II 即敬罝在孩連据 6 i並使用—滾輪滾壓。接著，該半固化物薄膜Γ ◊，σ亥連接凸部丨6以定位在各連接凸部16 ^，且該連招 Ρ 1 6之終&部份係凸出在該半固化物薄膜1 7之表面上 (參考圖2Ε)。 一料露之連接凸部16的終端部分係被研磨而去除，逆 且-弟三銅層18係被熱壓印以形成一電路圖案。 」妾著，該第二銅層12及該第三銅層18係藉由該連接 凸邛16而電性地連接（參考圖2f)。 後 電路圖案係經由一般方法形成在該第二及第 jy / j 三鋼層12及 块 文-成了一印刷電路板（參考圖2g)。 根據該第二傳統技術之該印刷電路 ，、开下列問題。 乃凌 意即，首先為了形成具有特定高度之該連 。亥弟-鋼層U係較厚，而造成材料之大量損失。 ㈣接凸部16之_程中，在考慮該 接凸i °卩16之終端部份的直徑係小於該連 之底部直徑。因此’為了具有該終端部份之； η，則該連接…6之底部直徑需要增 寺 ，使得縮小介於：=:間必須保持一特定間隔 電路16之間的間隙以形成一精細 电路圖案係困難的。 20 f:乎Λ成忒電路圖案之第二鋼層12具有-厚度低於 :二产成該連接凸部之第一銅層11具有大約剛 :子X所Μ ’该第二鋼層1 2在經該連接凸部1 6形 成後則被f折，故造成處理的困難。 、 根據以上所述之兩種傳統技術之印刷電路板製 U β 選印刷方法或是該姓刻製程以形成該連接 凸部’造成-村科損失增加之問題，該連接凸部之硬度係 退化，而生產量係更嚴重惡化。 【發明内容】 □此本1明之一目的係提供用於互連一多層印刷電 路板之方法’ 1亥方法能夠防止形成電路圖案之金屬層的變 200415975 :，比如被彎折’該電路板並且能夠易於處理，以及能夠 猎由在-印刷電路板製造過程中增加基底材料之強度以辦 加一生產量。 曰 本發明之另一目的係提供用於互連一多層印刷電路板 之方法，並且該方法能夠減少材抖的損失，並且藉由錄一 電鍍方法形成該連接凸部連接一多層印刷電路板之電路圖 案以增加一連接凸部之強度。 本發明之尚-目的係提供用於互連一多層印刷電路板 之方法’該方法能夠藉由一次過程而同時製造兩個印刷電 路板而增加生產量。 為了根據本發明之目;告+ / 勺達成在此肢現及廣泛描述之上 述及其他優點’提供用於製造一多層印刷電路板之方法， ’、匕括.在第-金屬層上形成一抗钮刻層’並且在該抗蝕 刻層上形成多個電鍍凹槽以選擇性地曝露該第一金屬層； 經由一電錄製程在被該電鍍凹槽所曝露出之該第一金屬層 的表面處=成—電鍍層以形成連接凸部；移除該抗姓刻^ 並且在。亥帛金屬層處形成一絕緣層；以及在該絕緣層之 表面處提i、第一金屬層’以使得可被連接至該連接凸部 之一終端部份。 在用於製造本發明之多層印刷電路板的方法中，該第 金屬曰係由鋼所製成，並且使用一乾燥薄膜作為抗餘刻 層。 在用於製造本發明之多層印刷電路板的方法中，該電 鐘凹才曰係藉由-曝光/顯影製程而部份地移除該抗钱刻層 12 200415975 在用於製造本發明之多層印刷電路板的方法中， 緣層係由半固化物所製造 ^ 7表坆並且如果半固化物係為液辦， 則其經由一篩選印刷方夺 物镇⑽在使用—紙狀的半固化 、J 口化物薄膜係藉-滾輪壓印方法來壓住以 製造该絕緣層。 在用於製造本發明之多層印刷電路板方法中，該 金屬層係由銅所製点 t n -邑…1 …印子來壓印且形成在 你過緣層之一表面處。 一在用於製造本發明之多層印刷電路板之方法中，在形 成5亥絕緣層後，將自兮矣 肝目°亥、、、邑緣層表面凸出之終端部份研磨及 平坦化而形成該連接凸部。 為了達成上述目的，亦提供一種用於製造多層印刷電 Μ板之方法’丨包括·形成具有在一基底片之兩面處形成 弟-金屬薄板，及在該第一金屬薄板之表面處形成一抗蝕 刻層’選擇性地移除在該基底材料處形成之抗餘刻層以形 出該第一金屬薄板之凹槽，並且在該凹槽露出之第一 金屬薄板表面填入一金屬層以形成一連接凸部；移除該抗 ㈣層並在該第-金屬薄板處形成一絕緣層；在該絕緣層 之一表面處提供一第二金屬薄板以使得其連接至該連接凸 部之終端部份’·分開定位在該基底片之兩側之兩基板；以 及在形成於分開之兩基板處的第一及第二金屬薄板處形成 一電路圖案。 在用於製造本發明之多層印刷電路板的方法中，一分 13 200415975 離涛膜插入至該其u ^ ^ 土底片與弟一金屬薄板之間，使得在印刷 電路板凡成之後，帛_金屬薄板可以從該基底板處分開， 且該分離薄膜係較基底板小，於是該基底板的邊緣與第一 金屬薄膜之邊緣係彼此附著在一起。 在用於製造本發明之多層印刷電路板的方法中，藉由 。亥底材料之邊緣以及該分離薄膜之一部份係一起切割以移 除該基礎片與該第-金屬板附著之處，將該兩片基板與該 基底片分開。 為j達成上述目的5亦提供一種周於製造多層印刷電 路板之方法，#包括U_金屬薄膜之表面處依序地 形成-光敏感絕緣層及一抗餘刻I;在該光敏感絕緣層及 該抗餘刻層處形成多_電鐵凹槽以選擇性地曝冑第一金屬 薄膜；經由一電鍍製程在被該電鍍凹槽所曝露出之該第一 金屬薄膜的表面處形成一電鍍層以做為連接凸部；移除該 抗蝕刻層並且將第二金屬薄膜定位在絕緣層之表面處以2 得連接至該連接凸部之一終端部份。 在用於製造本發明之多層印刷電路板之方法中，使用 一液晶相或一薄型聚合物，如同光敏感絕緣層。 為了達成上述之目的，亦提供一種用於製造多層印刷 電路板之方法，其包括： 提供在一基底片之兩面處之一第—金屬薄板所形成之 基底材料以及光敏感絕緣層及一触刻阻擋層係依序形成 在該第一金屬薄板之一面；選擇地移除形成在該基底材料 處之光敏感絕緣層及一抗敍刻層以形成—凹槽，該凹样曝 14 200415975 露該第一金屬薄膜；埴入 寻膜異入该凹槽所曝露在該第一金屬薄膜 表面之金屬層以形成一遠 少 妾凸。p ;移除該抗I虫刻層並且將 一第一金屬薄膜定位在絕 s ^ ^ £緣/寻臈之表面處以使得其被連接 至该連接凸部之一级線却八 '、；分開定位在該基底片之兩側 处之兩基板；以及於該分 ^ 间之兩個基板處之第一及第二金 屬薄膜的地方形成一電路圖案。 本發明之前述及盆# ，、他目的，特點，觀點及優點將從下 列本發明之詳細描述並 细义工且荟考所附圖式而變得更明顯。 【實施方式] 、ϋ藉由本赉明之較佳實施例細節以及由所附圖式 所說明之範例而參考之。 圖3Α至3 J係顯示根據本發明之一施 一印刷電路板之方法的序向製程。 根據本^明之一貫施例，說明用於製造一印刷電路板 之方法現將參考圖3Α至3J而敘述之。 首先，提供一基底材料50。形成該基底材料5〇以使 得-分離薄® 54才皮定位在具有一特定厚度及強度之基底 片52之兩側處，並且堆疊第-金屬薄膜56在該基底板52 之兩側，而且該分離薄膜54附著至該基底片52(參考圖 3Α)。 該分離薄膜54小於該基底板52,以使得該第一金屬 層56之邊緣係直接地附著至該基底板52之邊緣，然而該 第一金屬層56及該基底片52在堆疊該分離薄膜54之處 15 200415975 並不會互相接觸。 以具有足夠硬度， 以利於處理該基底 並且能由任何其他 該基底丨52係、由半固化物所製成 使付其足夠支撐形成電路圖案 材枓50。 該第一金屬層56較佳由銅所製成 材料製造只要其具有良好電性傳導、。 做為分離薄膜54，口 | 皆.^ ，、要此夠防止介於該基底片52與 弟一金屬層56之間的附著，仁/ u μ制、 寸者任何材料都可使用。一種用 〜·製造該基底封料係祐噶電 ， —; "、破褐路在吴國專利帛6, 210, 518，盆 係和本發明之相同申請人申請。 /、 一乾燥薄膜58以及一抗姓刻 增係重璺在该弟一金屬層 之表面處。該乾燥薄膜58 接凸部為厚。 隹T 形成之一連 該基底材枓5 0具有一钍糂，—^ 兮戍，、有、、°構，遠結構之上部與下部係以 e亥底片52為中心對稱，所以 < 底片52之上部及下部。 “係同時實施在該基 "在提供該基底材枓5〇之後’該乾燥薄膜心系經由一 =)光/顯影製程而被部份移除以形成電鍍凹槽6。(參考圖 該電鍍凹槽60係用於後續形成在該乾燥薄臈μ 連接凸部，故該第一金屬層56之表面可以被曝露出。-^在經由電鍍凹槽60曝露之該第一金屬層56的表面上 貫施電鐘’以形成具有特定高度之電鑛層62(參考圖 。該電鑛層62係填人形成在該乾燥薄膜58之電鍍㈣^ 16 200415975 内並且附著在該第一金屬層56之表面處。 〃在①成電鍍層62後’且當移除該乾燥薄膜時，僅有該 電鐘層62仍保留該第一全屬風 千L亥第金屬層56的表面處，並且該電鍵 層62形成一連接凸部68(參考圖3D)。 凸邱之：，完成一軟蝕刻在該連接凸部68上以使得該連接 8之終端部份的直徑變成小於附著在該第一金屬層 之一底部部份的直徑（參考圖3E)。 一^、即’該連接&部具有—圓錐形狀，該圓雜形狀具有 一橫切上端部以使得其從附著至該第-金屬層56之底部 邛伤走向終端部份時，直徑係逐漸減少。 著之—絕緣層7G係形成在具有該連接凸部68所附 弟—金屬I 56#一表面上（參考圖3F)。該絕緣層 :;係由-半固化物所製成’並且如果preperg係在液體狀 4，/、可藉由一篩選印刷法來塗敷，但在使用一片型半固 化物薄膜之情況下，其被一滾輪塵印方法來遂印所以 接凸部6 8能穿透該半固化物膜。 在形成該絕緣層7〇後，該連接凸部68之終端部份被 研，以平坦化該連接凸部68之表面（參考圖％)。該連接 $部68之終端部份係從該絕緣層7〇之表面向外突出一特 定程度。 之後，一第二金屬層76係重疊在該絕緣層7〇之表面 處以使J旱其能與該連接凸部68之終端部份相接觸(參考圖 、。意即，該第二金屬層76係定位在該絕緣層Μ之表 面並且被-印㈣住。接著，該第—金屬^ Μ及第二^ 17 200415975 屬層76係藉琴$ # y μ連接凸部6 8而電性地诘M _ 76係較佳由銅所製成，而且只 ：苐二金屬層 何其他材料都能被採用。 以 < 電性導電度之任 當該第二金眉# 7 屬屏ς 、曰6係被完全地堆疊時，堆Α 屬層56及該第二屬 且該弟一金 線所干之+ ㈢ 之基底材料5〇的邊緣係沪著卢 踝所不之一切開 栉〜者虛 線Π之基底材料sn A開（參考圖3Η)。由於沿著該切開 I底材枓50的邊緣被 之一部份以及該基Μ /；；過“㈣膜54 〇亥弟一金屬層56相附著之邱 丨刀攸方丨佘，使得第一電路板〇0〇及第二 寸者之口 Ρ 片52之上部側與下 "乙從該基底 電路板㈣及82(參考圖31)。離㈣54分開’而形成兩 藉由在該分開之第一板Μ另筮_』〇 形成電路圖案86及88 . 一反2上以一般方法 3J)。 ^ ，可以獲得兩印刷電路板（參考圖 圖4A至4G係用於製造一 招i旨Ft P刺電路板之方法的序向製 私視圖，其根據本發明之另一實施例。 一種用於根據本發明另一杏 另貝鈿例之製造多層印刷電路 板的方法將參考圖4A至4G予以描述。 首先，提供-基底材料102。該基底材料ι〇2使得一 分離薄膜106置放在由半固化物所製成之-基底片104之 兩側處’並且該第一金屬層1Μ总 田 蜀增108係重豐在具有該分離薄膜 106附著其上之基底片1〇4的兩表面處。 之後，一光感絕緣材料110係堆疊在該第-金屬層 ⑽之表面，乾燥薄膜112以及一抗触刻層係堆疊在該光 18 200415975 感絕緣材料11 0之一表面上（參考圖4 A)。 &亥分離;4膜1 0 6係小於該基底片1 0 4，故該第一金廣 層108之一邊緣係與該基底片104之一邊緣直接互相附著 ，但是該第一金屬層108與該基底片1〇4在該分離薄膜 1 0 6被堆疊之部份並不相互附著。200415975 发明 Description of the invention: [Technical field to which the invention belongs] This description relates to a multilayer printed circuit board, and more particularly to a method for interconnecting multilayer printed circuit boards, the multilayer circuit board month b Enough to electrically connect circuit patterns stacked in multiple layers. [Prior Art] FIG. 1 illustrates a conventional printed circuit board manufacturing method, and the conventional technique is disclosed in Korean Patent No. 203,540 (the corresponding case is US Patent No. 5,600, 103). The method for manufacturing a printed circuit board disclosed in Korean Patent No. 203540 will be described below with reference to FIG. Screen printing will be repeatedly performed according to the process of applying a conductive paste on a copper foil pattern 3 to obtain a conical conductor bump 2 that grows at a predetermined height and a thin film type synthetic resin base The support body 4 2 is positioned on the conical conductor projection 2 and is applied with a roller or the like. The conical conductor projection 2 can pass through and project from the synthetic resin-based support body 4. Out. The copper cancer is placed at the protruding upper terminal P of the conductor bump 2 and is pressed to form a circuit pattern at the copper foil, thereby completing an internal connector 1. Second, however, the disadvantage of the aforementioned printed circuit board manufacturing method is that it is used for coating. The process of conductive paste must be repeatedly performed several times to form a conductive bump 2 ′ having a specific thickness, making the process complicated. Into. ^ uu41 ^ 975 ^ In order to increase the height of the conductor bump 2 ′, the conductor bump 2 is square. The diameter of the sting should be maintained above a certain size. Then, the bumps are maintained at a distance from each other, making it difficult to form a thin line drawing, and it is difficult to obtain a precise and detailed printed circuit board. Even in the process of repeatedly applying the conductive paste, no matter when the conductive paste is applied, an alignment process must be performed, which results in degradation of productivity and degradation of the connection force between the repeatedly applied conductive pastes. . Figures 2A and 2B disclose another example of a conventional technique, which is disclosed in Japanese Patent Publication No. 2000-1111189 (which corresponds to US Patent 6,528, 874). The method for manufacturing a printed circuit board disclosed in Japanese Laid-Open Publication No. 2001_111189 is as follows. First, 'prepare-base material 10'. That is to say, the base material 10 is = layer 11 and-the second copper layer & and an anti-resistive engraved layer 13 is stacked between the first copper layer and / 7 copper layer (refer to FIG. 2A). The first copper layer π is used to form a connection protrusion 16 for electrically connecting the stacked circuit patterns, and the first steel layer is relatively thick. The second and twelfth series are for forming the circuit pattern, and the second copper layer series is formed on the upper surface of the base material 10 and the second layer is formed with an anti-1 film and a U series. That is to say, although the anti-rust film 14 covers the entire surface of the first-steel layer 12 (see Figure 2B with the same coating as C), 'the anti-rust film 14 is formed on the surface of the first copper layer. It is removed to form the window 15 connecting convex portion 16. 200415975 In this situation, when the button-etching process is completed, a etch solution penetrates the formation of the window 15, removes the copper layer n but remains in the resist film: the copper remains in the coated part Layer u, thereby forming the connection protrusion 16 (refer to FIG. 2C). / At this time, since the etching is sequentially performed from the surface, the connection convex portion 16 is formed in a conical shape, and its diameter becomes smaller toward the terminal portion, which is called the etching factor. At the same time, please refer to the second copper layer 12, because it is protected by the anti-leak layer M and the resist film 14, the etching solution does not penetrate the copper layer 12. /-After the etching process is completed, the resist film 14 is removed, and the anti-resistive etching f 13 is subsequently removed by using the ytterbium solution, and the surname-etching solution may selectively etch only the Anti-surname engraved layer 13 (refer to the figure for stemming Kprepreg) *. / W II Respect your child's data 6 i and use—roller rolling. Next, the semi-cured film Γ ◊, σ and 连接 are connected to the convex portions 丨 6 to be positioned at the respective connected convex portions 16 ^, and the end & part of the continuous stroke P 1 6 is protruded from the semi-cured film 1 7 on the surface (refer to Figure 2E). A terminal portion of the exposed convex portion 16 is ground and removed, and the -three copper layer 18 is thermally embossed to form a circuit pattern. The second copper layer 12 and the third copper layer 18 are electrically connected by the connection bump 16 (refer to FIG. 2f). The rear circuit pattern is formed on the second and jy / j three steel layers 12 and blocks by a general method to form a printed circuit board (refer to FIG. 2g). According to the printed circuit of the second conventional technology, the following problems are opened. That is to say, first of all, to form the company with a certain height. The helium-steel layer U is relatively thick, causing a large amount of material loss. In the process of the projection 16, considering that the diameter of the terminal portion of the projection i ° 16 is smaller than the diameter of the bottom of the connection. Therefore, 'in order to have the terminal part; η, the bottom diameter of the connection ... 6 needs to be increased, so that the gap between: =: must be maintained between a certain spaced circuit 16 to form a fine circuit pattern system difficult. 20 f: The second steel layer 12 of the circuit pattern has a thickness lower than that: the first copper layer 11 produced by the connecting protrusions has approximately the rigidity: the second steel layer 1 2 After the connection convex portion 16 is formed, it is f-folded, which causes difficulty in handling. 2. According to the above two conventional technologies, the U β selection printing method of the printed circuit board or the process of engraving the last name to form the connection convex portion causes a problem of increased loss of the village branch, and the hardness of the connection convex portion is degraded. , And production is worsening. [Summary of the Invention] □ One of the purposes of this book is to provide a method for interconnecting a multilayer printed circuit board. The method can prevent changes in the metal layer forming the circuit pattern 200415975: such as being bent 'the circuit board And it can be easily handled, and can increase the production capacity by increasing the strength of the base material in the printed circuit board manufacturing process. Another object of the present invention is to provide a method for interconnecting a multi-layer printed circuit board, and the method can reduce the loss of material shake, and connect the multi-layer printed circuit by forming the connection protrusion by recording a plating method. The circuit pattern of the board increases the strength of a connecting protrusion. A still-object of the present invention is to provide a method for interconnecting a multi-layer printed circuit board 'which can increase the throughput by manufacturing two printed circuit boards at the same time in one process. For the purposes of the present invention; to achieve the above and other advantages described and broadly described herein, `` provide a method for manufacturing a multilayer printed circuit board, '' which is formed on the first metal layer. An anti-button engraving layer 'and forming a plurality of plating grooves on the anti-etching layer to selectively expose the first metal layer; the first metal layer exposed by the plating grooves through an electrical recording process At the surface = Cheng-electroplated layer to form a connecting protrusion; remove the anti-surname engraved ^ and at. An insulating layer is formed at the metal layer; and i, the first metal layer 'is provided at the surface of the insulating layer so as to be connected to a terminal portion of the connecting convex portion. In the method for manufacturing the multilayer printed circuit board of the present invention, the first metal is made of steel, and a dry film is used as an anti-etching layer. In the method for manufacturing the multilayer printed circuit board of the present invention, the electric bell recess is partially removed by the -exposure / development process. The anti-etching layer 12 200415975 is used for manufacturing the multilayer of the present invention. In the method of the printed circuit board, the edge layer is made of semi-cured material. Table 7 and if the semi-cured material is liquid, it is used by a screened printing process—paper-like semi-cured, The J film is pressed by a roller embossing method to make the insulating layer. In the method for manufacturing the multilayer printed circuit board of the present invention, the metal layer is embossed with copper dots t n -eup ... 1 ... stamps and is formed on one surface of your passivation layer. First, in the method for manufacturing the multilayer printed circuit board of the present invention, after forming the insulating layer, the terminal portions protruding from the surface of the edge layer are polished and flattened. This connection convex portion is formed. In order to achieve the above object, there is also provided a method for manufacturing a multi-layer printed electro-mechanical sheet. The method includes forming a thin-metal sheet having two substrates formed on both sides of a base sheet, and forming a primary antibody on the surface of the first metal sheet The etching layer 'selectively removes the anti-etching layer formed at the base material to form a groove of the first metal sheet, and a metal layer is filled in the surface of the first metal sheet exposed by the groove to form A connecting convex portion; removing the anti-knock layer and forming an insulating layer at the first metal sheet; providing a second metal thin plate at one surface of the insulating layer so that it is connected to the terminal portion of the connecting convex portion The two substrates are positioned separately on both sides of the base sheet; and a circuit pattern is formed at the first and second metal thin plates formed at the separated two substrates. In the method for manufacturing the multilayer printed circuit board of the present invention, one minute 13 200415975 is inserted between the u ^ ^ soil film and the first metal thin plate, so that after the printed circuit board is completed, 帛 _ The metal sheet can be separated from the base plate, and the separation film is smaller than the base plate, so the edge of the base plate and the edge of the first metal film are attached to each other. In the method for manufacturing the multilayer printed circuit board of the present invention, by. The edge of the bottom material and a part of the separation film are cut together to remove the place where the base sheet and the first metal plate are attached, and the two substrates are separated from the base sheet. In order to achieve the above objective 5, a method for manufacturing a multilayer printed circuit board is also provided. The method includes sequentially forming a light-sensitive insulating layer and an anti-resistance layer at the surface of the metal thin film; And a multi-electrode groove is formed at the anti-etching layer to selectively expose the first metal film; a plating process is performed on a surface of the first metal film exposed by the plating groove through a plating process Layer as the connection protrusion; remove the anti-etching layer and position the second metal film at the surface of the insulating layer to connect to a terminal portion of the connection protrusion. In the method for manufacturing the multilayer printed circuit board of the present invention, a liquid crystal phase or a thin polymer is used as a light-sensitive insulating layer. In order to achieve the above-mentioned object, a method for manufacturing a multilayer printed circuit board is also provided, which includes: providing a base material formed of a first metal sheet on one of both sides of a base sheet, a light-sensitive insulating layer, and a touch-etching The barrier layer is sequentially formed on one side of the first metal sheet; the light-sensitive insulating layer and an anti-etching layer formed on the base material are selectively removed to form a groove, and the concave sample is exposed. 14 200415975 A first metal thin film; a metal film is inserted into the metal layer on the surface of the first metal thin film exposed by the groove to form a far less convex. p; remove the anti-I insect engraving layer and position a first metal thin film at the surface of the edge / finding so that it is connected to the first-order line of the connecting convex portion, but separate Two substrates positioned at both sides of the base sheet; and a circuit pattern formed at the first and second metal thin films at the two substrates in the space. The foregoing and basin of the present invention, its purpose, characteristics, viewpoints, and advantages will become more apparent from the following detailed description of the present invention and detailed volunteering and examination of the drawings. [Embodiment], please refer to the details of the preferred embodiment of the present invention and the examples explained by the attached drawings. 3A to 3J show a sequential process of a method for applying a printed circuit board according to one of the present invention. A method for manufacturing a printed circuit board according to the present embodiment will now be described with reference to FIGS. 3A to 3J. First, a base material 50 is provided. The base material 50 is formed so that the -separation sheet 54 is positioned on both sides of the base sheet 52 having a specific thickness and strength, and the first metal film 56 is stacked on both sides of the base plate 52, and the A separation film 54 is attached to the base sheet 52 (refer to FIG. 3A). The separation film 54 is smaller than the base plate 52, so that the edge of the first metal layer 56 is directly attached to the edge of the base plate 52. However, the first metal layer 56 and the base sheet 52 are stacking the separation film 54. Place 15 200415975 does not touch each other. It has sufficient hardness to facilitate the processing of the substrate and can be made of any other 52-series, semi-cured material of the substrate so that it can be sufficiently supported to form a circuit pattern material 50. The first metal layer 56 is preferably made of a material made of copper as long as it has good electrical conductivity. As the separation film 54, it is necessary to prevent the adhesion between the base sheet 52 and the first metal layer 56. Any material can be used. A method for manufacturing the base sealing material by using the ~ is "Yoga Electric", "Broken Road" in Wu Guo Patent No. 6,210,518, and the same applicant for the basin system and the present invention. A dry film 58 and a primary antibody are engraved on the surface of the metal layer of the brother. The dry film 58 has a thick convex portion.隹 T forms one of the base materials 枓 50 and has a 钍 糂, —, 有, 、, ° structure, the upper part and the lower part of the far structure are symmetrical about the ehai film 52, so < Upper and lower. "At the same time, after the substrate" 50 "is provided, the dried film core is partially removed through a photo / development process to form a plating groove 6. (Refer to the figure, the plating The groove 60 is used for the subsequent formation of the dry thin μ connection protrusion, so the surface of the first metal layer 56 can be exposed.-^ On the surface of the first metal layer 56 exposed through the plating groove 60 Apply the electric clock 'to form an electric ore layer 62 having a specific height (refer to the figure. The electric ore layer 62 is filled in the electroplating layer ^ 16 200415975 of the dry film 58 and is attached to the first metal layer 56. At the surface 〃 after ① forming the electroplated layer 62 ′ and when the dry film is removed, only the electric clock layer 62 still retains the surface of the first metal layer 56 which is the first wind-thousand sea-level metal layer 56, and the electric key The layer 62 forms a connecting convex portion 68 (refer to FIG. 3D). Convex Qiu Zhi: Complete a soft etch on the connecting convex portion 68 so that the diameter of the terminal portion of the connection 8 becomes smaller than that attached to the first metal layer One of the diameters of the bottom portion (refer to FIG. 3E). The conical shape has a cross-cutting upper end portion so that the diameter decreases gradually as it marches from the bottom to the terminal portion attached to the first metal layer 56. The 7G insulation layer is formed on the The connecting protrusion 68 is attached to a surface of the metal—Metal I 56 # (refer to FIG. 3F). The insulating layer: is made of-semi-cured material, and if the preperg is in a liquid state 4, /, can be borrowed It is applied by a screen printing method, but in the case of using a one-piece semi-cured film, it is printed by a roller dust printing method so that the convex portion 68 can penetrate the semi-cured film. After the insulating layer 70, the terminal portion of the connection convex portion 68 is ground to flatten the surface of the connection convex portion 68 (refer to FIG.%). The terminal portion of the connection $ 68 is from the insulating layer 70. The surface protrudes outward to a certain degree. After that, a second metal layer 76 is superimposed on the surface of the insulating layer 70 so that it can contact the terminal portion of the connecting protrusion 68 (refer to the figure). That is, the second metal layer 76 is positioned on the surface of the insulating layer M and is imprinted. Therefore, the first metal ^ M and the second ^ 17 200415975 metal layer 76 are connected to the convex portion 6 by the piano $ # y μ and the 诘 M_76 series is preferably made of copper, and only: The two metal layers and any other materials can be used. When the second electric eyebrow # 7 metal screen is completely stacked, the A metal layer 56 and the second The edge of the base material 50, which is the same as that of the golden wire of the younger brother, is the same as the base material sn A of the dotted line Π (see Figure 3). Cut a part of the edge of the I substrate 枓 50 and the substrate M and 过; through the ㈣ film 54 〇, the metal layer 56 attached to the Qiu 丨 knife side 丨 佘, so that the first circuit board 〇0 The upper side and the lower side of the mouthpiece 52 of the second inch and the second inch are from the base circuit boards ㈣ and 82 (refer to FIG. 31). ㈣54 are separated 'to form two. Circuit patterns 86 and 88 are formed on the separated first plate M and _'〇. The general method is 3J). ^, Two printed circuit boards can be obtained (refer to FIGS. 4A to 4G are sequential private views of a method for manufacturing a Ft P thorn circuit board), according to another embodiment of the present invention. A method for manufacturing a multilayer printed circuit board according to another example of the present invention will be described with reference to FIGS. 4A to 4G. First, a base material 102 is provided. The base material ι02 allows a separation film 106 to be placed on the substrate. Made of semi-cured material-on both sides of the base sheet 104, and the first metal layer 1M Sumatsu 108 is a heavy metal on both surfaces of the base sheet 104 having the separation film 106 attached thereto. A photosensitive insulating material 110 is stacked on the surface of the first metal layer 干燥, and a dry film 112 and an anti-etching layer are stacked on one of the surfaces of the light 18 200415975 photosensitive insulating material 110 (refer to FIG. 4A). &Amp; Hai Separation; 4 film 106 is smaller than the base sheet 104, so one edge of the first gold layer 108 and one edge of the base sheet 104 are directly attached to each other, but the first metal layer 108 and the base sheet 104 are stacked on the separation film 106 Parts are not mutually adhered.

由半固化物製成之基底片104係被硬化以在接下來製 程中具有足夠剛度支撐形成電路圖案之部份，因而能易於 處理該基底材料102。 該第一金屬層108係較佳由銅所製成，而只要具有良 好電性導電度之任何材料皆可被採用。 該分離薄膜106能由任何材料所製成，只要該材料能 防止該基底片104與該第一金屬層1〇8之間的附著。 該光感絕緣材料110能由一液體相或是聚合物之一薄 膜型式所製成，且做為該印刷電路板之一絕緣層。 該基底材料102具有一結構，其中該基底片1〇4之上 部伤及下部份係對稱的，因此隨後之製程是同時實施在該 基底片1 0 4之上部份及下部份。 當該基底材料1G2準備好時，則該基底㈣102接 -典型曝光/顯影製程以部份地移除該乾燥薄们Μ及 光敏感絕緣層110以形成電鑛凹槽116(參考圖4B)。 該電鑛凹槽116係為了形成後續所做之連接凸部Γ 二二相槽被形成穿過該乾燥薄膜ιΐ2及該光敏感& 層110以曝露出該第一金屬層1〇8之 電鍍係執行在經由該電鍍凹槽116所曝露之該第， 19 200415975 屬層108之表面以形成該電鍍層12〇(參考圖4c) 電 鍍層1 20係填入該電鍍凹槽内，且附著至該第—金屬層 1 08，又該電鍍層形成時係較高於該光敏感絕緣層^ 〇二 並不較該乾燥薄膜112之表面突出。 一 在經形成該電鍍層120之後，該乾燥薄膜112係被除 去，僅在該第一金屬層108之表面處留下該電鍍層及 該絕緣層110。該剩下的電鍍層12〇形成該連接凸^部124( 參考圖4D)。 、便，该第二金屬層丨2g係堆疊在該絕緣材料11 〇之 表面處，且與該連接凸部124之終端部份相接觸（參考圖 4E)。思即，該第二金屬層126係定位在該光敏感絕緣層 110之一表面處並且該第二金屬層126能與該連接凸部 124電性連接。 σ亥第一金屬層126係由銅所製成，且只要具有極好電 性‘電度之任何材料皆可使用。The base sheet 104 made of the semi-cured material is hardened to have sufficient rigidity to support the portion forming the circuit pattern in the following process, so that the base material 102 can be easily processed. The first metal layer 108 is preferably made of copper, and any material having good electrical conductivity can be used. The separation film 106 can be made of any material as long as the material can prevent adhesion between the base sheet 104 and the first metal layer 108. The photosensitive insulating material 110 can be made of a liquid phase or a thin film of a polymer, and can be used as an insulating layer of the printed circuit board. The base material 102 has a structure in which the upper part and the lower part of the base sheet 104 are symmetrical, so the subsequent processes are performed simultaneously on the upper part and the lower part of the base sheet 104. When the base material 1G2 is ready, the base substrate 102 is connected to a typical exposure / development process to partially remove the dried thin film M and the light-sensitive insulating layer 110 to form a power mine groove 116 (refer to FIG. 4B). The electric ore groove 116 is formed to form the connection convex portion Γ. The two-phase groove is formed through the dry film ι2 and the light-sensitive & layer 110 to expose the electroplating of the first metal layer 108. It is performed on the surface of the metal layer 108 exposed through the plating groove 116 to form the plating layer 12 (see FIG. 4c). The plating layer 1 20 is filled in the plating groove and is attached to The first metal layer 108 and the electroplated layer are formed to be higher than the light-sensitive insulating layer ^ 02 and not protrude from the surface of the dry film 112. After the plating layer 120 is formed, the dry film 112 is removed, leaving only the plating layer and the insulating layer 110 on the surface of the first metal layer 108. The remaining plating layer 120 forms the connection protrusion 124 (refer to FIG. 4D). Then, the second metal layer 2g is stacked on the surface of the insulating material 110 and is in contact with the terminal portion of the connection convex portion 124 (refer to FIG. 4E). In other words, the second metal layer 126 is positioned at a surface of the light-sensitive insulating layer 110 and the second metal layer 126 can be electrically connected to the connection protrusion 124. The first metal layer 126 is made of copper, and any material may be used as long as it has excellent electrical properties.

田忒第一金屬層126被完全堆疊時，被該第一金屬層 108及该第二屬層126堆疊之基底材料1〇2的邊緣係沿著 如虛線所指示 該切割線1 1 1 之一切割線111切開（參考圖4Ε)。由於沿著 之基底材料1 〇 2的邊緣被切除，故通過該釋 放薄膜106之一部份以及該基底片1〇4與該第一金屬層 1 〇8相附著部份處被去除，使得第一電路板1 30及第二電 板13 2從該基底片丨〇 4之上部側與下部側被該釋放薄膜 分開 而形成兩電路板130及132 (參考圖4F)。 藉由以一般方法在該分開之第一及第二板13〇及132 20 200415975 之上形成電路圖案136及ι38，則能夠獲得兩印刷電路板（ 參考圖4G)。 直至目丽所描述的用於製造本發明之多層印刷電路板 的方法具有許多優點。 百先，因為由半固化物製造之基底片係在該基底材料 之中心給予該基底材料一足夠剛度，因此能容易地處理該 基底材料並且能增加一生產量。 此外，5玄連接凸部係經由該電鑛製程而形成以與該電 路圖案電性地連接，與使用該篩選印刷法或I虫刻之情況相 較則能夠減少材料損生，廿 、 並且该連接凸部之剛度亦能被增 加0 甚而’因為該印刷電路板能被製造在該基底片之上部 側處及在下部側處’故兩個印刷電路板能被一次製程而予 以製造，並且因此，生產量能夠增加。 因為本發明可以數錄 式具體化而不脫離本發明之精 神或其基本特性，JL亦庵田 /、…解到上述實施例並不受限於任 何前述細節，除非另有爱 於任 料由4轰^丨〜 他各疋，否則應被廣泛推論在所 附申㈣專利乾圍所界定之精 變及修改，或此種邊界之之内，且因而所有改 利範圍之内。 ，之4效物亦應包含在該附加申請專 【圖式簡單說明】 所附圖式係包括來提供更進而了解 構成此-說明書的部份，其解 二併至及 乂 a之貫施例並且解釋 21 200415975 本發明之原理。 (一）圖式部分 圖1係根據一習知技術之實施例顯示用於製造一印刷 電路板之方法的視圖； 圖2A至2G係視圖，其顯示根據習知技術另一實施例 之製造-印刷電路板之方法的順序製程； 圖3 A至3 J係視圖，发_ _ 員不根據本發明其中之一實施 例之用於製造—印刷電路板之方法的順' 圖4A至扎係視圖，其顯示根據 ，及 用於製造-印刷電路板之方法的順序製裎：另-實施例之 (二）元件代表符號 1 内部連接器 2， 圓錐導體腫塊 3 銅箔圖案 4 支撐體 10 基底材料 11 第一銅層 12 第二銅層 13 抗蝕刻層 14 抗蝕薄膜 15 窗 16 連接凸部 17 半固化物薄膜 18 弟—銅層 22 200415975 50 基底材料 52 基底片 54 分離薄膜 56 第一金屬薄膜 58 乾燥薄膜 60 電鍍凹槽 62 電鍍層 68 連接凸部 70 絕緣層 71 切割線 76 第二金屬層 80 第一電路板 82 第二電路板 102 基底材料 104 基底片 106 分離薄膜 108 第一金屬層 110 光敏感絕緣材料 112 乾燥薄膜 116 電鍍凹槽 120 電鍍層 124 連接凸部 126 第二金屬層 130 第一電路板When the Titian first metal layer 126 is completely stacked, the edge of the base material 102 stacked by the first metal layer 108 and the second dependent layer 126 is along one of the cutting lines 1 1 1 as indicated by the dotted line. The cutting line 111 is cut (refer to FIG. 4E). Since the edge of the base material 102 is cut away, a part of the release film 106 and the portion where the base sheet 104 and the first metal layer 108 are attached are removed, so that the first A circuit board 130 and a second electrical board 132 are separated from the upper side and the lower side of the base sheet by the release film to form two circuit boards 130 and 132 (refer to FIG. 4F). By forming circuit patterns 136 and ι38 on the separated first and second boards 130 and 132 20 200415975 by a general method, two printed circuit boards can be obtained (refer to FIG. 4G). The method described up to Mu Li for manufacturing the multilayer printed circuit board of the present invention has many advantages. Baixian, because a base sheet made of a semi-cured material gives the base material a sufficient rigidity in the center of the base material, the base material can be easily processed and a throughput can be increased. In addition, the 5xuan connection convex portion is formed through the electric mining process to be electrically connected to the circuit pattern. Compared with the case of using the screen printing method or the worm carving, the material damage can be reduced. The stiffness of the connecting protrusions can also be increased by 0 even 'because the printed circuit board can be manufactured at the upper side and the lower side of the base sheet', two printed circuit boards can be manufactured in one process, and therefore , Production can increase. Because the present invention can be embodied in digital form without departing from the spirit or basic characteristics of the present invention, JL also puts forth the above embodiments and is not limited to any of the foregoing details, unless otherwise 4 ^ 丨 ~ He should be inferred otherwise, it should be widely inferred that it is within the scope of the fine changes and modifications defined in the attached patent patents, or within such boundaries, and thus all the benefits. The 4 effects should also be included in the additional application [Simplified Description of Drawings] The drawings are included to provide a better understanding of the parts that constitute this-description, the solution of which is combined with the implementation examples of 乂 a And explain the principle of the present invention. (A) Schematic Part FIG. 1 is a view showing a method for manufacturing a printed circuit board according to an embodiment of a conventional technology; FIGS. 2A to 2G are views showing manufacturing according to another embodiment of the conventional technology- Sequential process of printed circuit board method; Figures 3 A to 3 are J-views, showing the method of manufacturing printed circuit boards according to one of the embodiments of the present invention. Figures 4A to 4D , Which shows the basis, and the sequential manufacturing method for the method of manufacturing-printed circuit boards: In addition-the second embodiment of the component (symbol) symbol 1 internal connector 2, conical conductor bump 3 copper foil pattern 4 support 10 base material 11 The first copper layer 12 The second copper layer 13 The anti-etching layer 14 The resist film 15 The window 16 The connecting protrusion 17 The prepreg film 18 The copper-copper layer 22 200415975 50 The base material 52 The base sheet 54 The separation film 56 The first metal film 58 Drying film 60 Plating groove 62 Plating layer 68 Connecting projection 70 Insulating layer 71 Cutting line 76 Second metal layer 80 First circuit board 82 Second circuit board 102 Base material 104 Base sheet 106 Separation film 108 First metal layer 110 Photosensitive insulating material 112 Dry film 116 Plating groove 120 Plating layer 124 Connection protrusion 126 Second metal layer 130 First circuit board

23 200415975 132第二電路板 136電路圖案 138電路圖案23 200415975 132 Second circuit board 136 Circuit pattern 138 Circuit pattern

Claims (1)

200415975 拾、申請專利範圍： ^ 1 ·種用於連接多層印刷電路板之電路圖案的凸部製 造方法，該方法特徵在於： y 、在第金屬層上形成一抗蝕刻層及在該抗蝕刻層上 形成電鍍凹槽以選擇地曝露該第一金屬層； 在該電鍍凹槽所曝露出之該第一金屬層的表面處經由 一電錢製程形成—電鑛層，以形成連接凸部； 去除該抗飿刻層並且在該第一金屬層處形成一絕緣 ;以及 在該絕緣層之表面處提供一第二金屬層，以使得可被 連接至該連接凸部之終端部份。 …2·如申清專利範圍帛1項所述之方法，其中-乾燥薄 膜係做為該抗餘刻層。 3_如申印專利範圍第1項所述之方法，其中該連接凸 部係從該抗蝕刻層之表面突出。 ” 4如申請專利範圍第i項所述之方法，其中藉由—曝 “ ’、、員製耘而部份地移除該抗蝕刻層來形成該電鍍凹槽 〇 5·如申請專利範圍第1項所述之方法，其進而包括： /連接凸σ卩上貫施軟蝕刻以使得該連接凸部之終端部份 之直徑係小於該連接凸部與該第一金屬層相附著之底部的 直徑。 ^ 6·如申請專利範圍第1項所述之方法，其中該絕緣層 係由半固化物所製造。 25 200415975 7·如申請專利範圍第6項所述之方法，其中如果該半 固化物係一液體，則其係經由一篩選印刷方法來塗敷，但 如果在使用-片型半固化物薄膜時，該半固化物薄膜係藉 由一滾輪壓印方法來壓印以製造該絕緣層。 8.如申請專利範圍第1項所述之方法，其中一利用印 模來壓印以在該絕緣層之一表面處的該第二金屬層。 9·如申請專利範圍第丨項所述之方法，其中在形成該 絕緣層之後，藉由將該絕緣層表面突出的終端部份研磨及 _ 平坦化而形成該連接凸部。 1 〇· —種用於連接一多層印刷電路板之線路圖案的方法 ’該方法特徵在於： 提供一基底材料於第一金屬薄板在一基底片之兩表面 處以及在該第一金屬薄板之一表面處形成的抗蝕刻層； 遥擇性地移除形成在該基底材料處之該抗蝕刻層以形 成曝露該第一金屬薄板之凹槽，並且在該凹槽所曝露之該 第一金屬薄板之表面處經由電鍍製程填入一金屬層以形成 _ 一連接凸部； 私除忒杬蝕刻層並且在該第一金屬薄板處形成一絕緣 層； 在該絕緣薄膜之一表面提供一第二金屬薄板使得其連 接至该連接凸部之一終端部份； 分開定位在該基底片之兩側處的兩基板； 在該分開之兩基板處之第一及第二金屬薄板處形成一 電路圖案。 26 200415975 11·如申請專利範圍第10項所述之方法，其中一分離 薄膜係插入在該基底片與該第一金屬薄板之間使得該第一 金屬薄板在一印刷電路板完成後可與該基底片分開。 1 2·如申請專利範圍第11項所述之方法，其中該分離 4膜係車又小於该基底片使得該基底片的邊緣與該第一金屬 薄板的邊緣能相互附著。 13·如申請專利範圍第1〇項所述之方法，其中該基底 片係由半固化物所製成。200415975 Patent application scope: ^ 1 A method for manufacturing a convex portion for connecting a circuit pattern of a multilayer printed circuit board, the method is characterized by: y, forming an anti-etching layer on the first metal layer, and forming an anti-etching layer on the anti-etching layer A plating groove is formed thereon to selectively expose the first metal layer; a surface of the first metal layer exposed by the plating groove is formed through an electric money process-an electric ore layer to form a connecting protrusion; removing The anti-etching layer forms an insulation at the first metal layer; and a second metal layer is provided at a surface of the insulation layer so as to be connectable to a terminal portion of the connection protrusion. … 2. The method described in item 1 of Shenqing Patent Scope, where-a dry film is used as the anti-resistance layer. 3_ The method according to item 1 of the scope of application for a patent, wherein the connection convex portion protrudes from the surface of the anti-etching layer. 4) The method described in item i of the scope of patent application, wherein the electroplating groove is formed by partially removing the anti-etching layer by “exposing”, “5,” as described in the scope of patent application The method according to item 1, further comprising: / applying soft etching on the connection protrusion σ 卩 so that a diameter of a terminal portion of the connection protrusion is smaller than that of a bottom of the connection protrusion and the first metal layer. diameter. ^ 6. The method according to item 1 of the scope of patent application, wherein the insulating layer is made of a semi-cured material. 25 200415975 7. The method according to item 6 of the scope of patent application, wherein if the semi-cured material is a liquid, it is applied through a screen printing method, but if a sheet-type semi-cured film is used The semi-cured film is embossed by a roller embossing method to manufacture the insulating layer. 8. The method according to item 1 of the patent application scope, wherein a stamp is used to emboss the second metal layer at one surface of the insulating layer. 9. The method according to item 丨 in the scope of patent application, wherein after the insulating layer is formed, the connecting convex portion is formed by grinding and flattening a terminal portion protruding from the surface of the insulating layer. 10. A method for connecting a circuit pattern of a multilayer printed circuit board. The method is characterized in that: a base material is provided on both surfaces of a base sheet of a first metal sheet and on the first metal sheet; An etch-resistant layer formed on a surface; the etch-resistant layer formed on the base material is selectively removed to form a groove exposing the first metal sheet, and the first metal exposed in the groove A metal layer is filled into the surface of the sheet through an electroplating process to form a connecting protrusion; the etched layer is removed and an insulating layer is formed at the first metal sheet; a second surface is provided on one surface of the insulating film The metal sheet is connected to a terminal portion of the connecting protrusion; two substrates positioned separately on both sides of the base sheet; a circuit pattern is formed on the first and second metal sheets of the separated two substrates . 26 200415975 11. The method according to item 10 of the scope of patent application, wherein a separation film is inserted between the base sheet and the first metal sheet so that the first metal sheet can be connected with the printed circuit board after completion The base sheet is separated. 1 2. The method as described in item 11 of the scope of patent application, wherein the separation 4 film car is smaller than the base sheet so that the edge of the base sheet and the edge of the first metal sheet can adhere to each other. 13. The method as described in claim 10, wherein the base sheet is made of a semi-cured material. 如申請專利範圍第10項所述之方法，其中該抗蝕 刻層係由一乾燥薄膜所形成。 I5·如申請專利範圍第10項所述之方法，其中藉由一 :光/顯影製程而部份地移除該抗蝕刻層以在該抗㈣層 處形成該凹槽。 =如中請專利範㈣1G項所述之方法，其中該連接The method as described in claim 10, wherein the etching resist layer is formed of a dry film. I5. The method according to item 10 of the scope of patent application, wherein the anti-etching layer is partially removed by a photo / developing process to form the groove at the anti-scratch layer. = The method as described in item 1G of the Chinese Patent Application, wherein the connection 、错自$鍍製程而在由該凹槽所曝露之該第一金屬 溥膜的表面上形成一電鍍層而製成。 17.如巾請專利範圍第1Q項所述之方法，其更進而 =連接凸部上執行軟㈣使得該連接凸部之終端部 徑徑父小於該連接凸部附著在該第一金屬薄板之底部的 凸部=/7請專利範圍帛1Q項所述之方法，其中該連接 矣、n亥絕緣層之後，藉由研磨及平坦化從該絕 、、象層表面突出之該連接凸部的終端部份而形成。 19.如中請專利範圍第1G項所述之方法，其中該絕緣 27 200415975 層係由半固化物所製成。 20·如申請專利範圍第1〇項所述之方法，其中該兩個 基板係以下列方^從該基底#處分開：該基底材料的邊 緣與$分離；4«之—部份—起切開以移除該基底片與該第 一金屬薄板相附著之部份。 21.種用於連接一多層印刷電路板的線路圖案之凸部 製造方法，該方法特徵在於： 在第金屬層之表面處依序地形成一光敏感絕緣層 及一抗餘刻層； 龟級凹槽以 在該光敏感絕緣層及一抗蝕刻層處形成 選擇性地曝露出該第一金屬層； 在由電鑛凹槽曝露出之第一金屬層的—表面經由一電 鍍製程形成-電鍍層以形成連接凸部；以及 移除該抗餘刻層並且將—第二金屬層定位在該絕緣層 之表面處使得被連接至該連接凸部之一終端部份。 22·如申請專利範圍第21項所述之凸部製造方法，苴 中一液相或薄膜型聚合物可被使用作為光敏感絕緣層。〃 23·如申請專利範圍第21項所述之凸部製造方法，苴 中-乾燥薄膜係被使用作為該抗蝕刻層。 ’、 24. 如申凊專利範圍第21項所述之凸部製造方法，其 :該凹槽係藉由—曝光/顯影製程而部份地移除該光敏感 絕緣層及該抗餘刻層而形成。 25. 如申請專利範圍第21項所述之凸部製造方法，其 中該第二金屬層係藉使用-印模而屢印並且形成在該絕緣 28 200415975 層之一表面。 26.如申請專利範圍第21項所述之凸部製造方法，其 進而包括： 藉由使用該第一金屬層及該第二金屬層而形成一電路 圖案。It is made by forming a plating layer on the surface of the first metal hafnium film exposed by the groove from the plating process. 17. The method as described in item 1Q of the patent application, which is further = soft embossing is performed on the connecting convex portion so that the diameter of the terminal portion of the connecting convex portion is smaller than that of the connecting convex portion attached to the first metal sheet. The convex part at the bottom = / 7 Please refer to the method described in item 1Q of the patent scope, wherein after the connecting layer, the insulating layer is polished and flattened, The terminal part is formed. 19. The method as described in item 1G of the patent scope, wherein the insulating layer 27 200415975 is made of a semi-cured material. 20. The method as described in item 10 of the scope of patent application, wherein the two substrates are separated from the substrate # in the following ways: the edge of the substrate material is separated from $; In order to remove the portion where the base sheet is attached to the first metal sheet. 21. A method for manufacturing a convex portion of a circuit pattern for connecting a multilayer printed circuit board, the method comprising: sequentially forming a light-sensitive insulating layer and an anti-etching layer on the surface of the second metal layer; The first groove is formed at the light-sensitive insulating layer and an anti-etching layer to selectively expose the first metal layer; the surface of the first metal layer exposed by the power mine groove is formed through an electroplating process- Electroplating a layer to form a connecting convex portion; and removing the anti-etching layer and positioning the second metal layer at a surface of the insulating layer so as to be connected to a terminal portion of the connecting convex portion. 22. According to the method for manufacturing a convex part described in item 21 of the scope of patent application, a liquid-phase or thin-film polymer in 苴 can be used as a light-sensitive insulating layer. 〃23. According to the method for manufacturing a convex portion described in item 21 of the scope of patent application, 苴 Middle-dry film is used as the anti-etching layer. '. 24. The method for manufacturing a convex portion as described in item 21 of the patent claim, wherein the groove is partially removed by the exposure / development process from the light-sensitive insulating layer and the anti-etching layer. And formed. 25. The method of manufacturing a convex portion as described in item 21 of the scope of patent application, wherein the second metal layer is repeatedly printed by using a stamper and formed on one surface of the insulating 28 200415975 layer. 26. The method of manufacturing a convex portion according to item 21 of the scope of patent application, further comprising: forming a circuit pattern by using the first metal layer and the second metal layer. 拾壹、圖式： 如次頁Pick up, schema: as the next page 2929
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