KR20180010091A - Metal printed circuit board and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a metal printed circuit board with an excellent heat release effect and a manufacturing method thereof. According to the present invention, the metal printed circuit board comprises: a metal base plate having at least one heat transfer protrusion protruding from one surface thereof; an insulation sheet which has a through hole into which the heat transfer protrusion is inserted, and is laminated on one surface of the metal base plate to allow the heat transfer protrusion to be inserted into the through hole; a metal sheet which has a through hole into which the heat transfer protrusion is inserted, and is laminated on an upper surface of the insulation sheet to allow the heat transfer protrusion to be inserted into the through hole; and a circuit layer plated on an upper surface of the heat transfer protrusion and the metal sheet to be formed. The circuit layer includes: a heat transfer protrusion pattern to etch the metal sheet and the circuit layer around the heat transfer protrusion to electrically separate the heat transfer protrusion from the circuit layer; and a circuit pattern formed around the heat transfer protrusion pattern by etching.

Description

Technical Field [0001] The present invention relates to a metal printed circuit board and a method of manufacturing the same,

The present invention relates to a metal printed circuit board and a method of manufacturing the same.

In order to secure the performance and reliability of various electronic components such as semiconductor devices, transistors, and light emitting diodes (LEDs), it is necessary to effectively cool the heat generated from the electronic components. Recently, LED devices have been increasing in output and integration. Especially effective cooling is indispensable for high power high integration of LED devices.

A metal core printed circuit board (MCPCB) is used to efficiently discharge heat generated from a high heat generating semiconductor device such as an LED. The MCPCB includes a metal core having excellent thermal conductivity, and receives heat generated from a semiconductor device mounted on the surface and emits the heat to the outside.

Korean Patent Registration No. 10-784351 (the name of the invention, a light emitting element including a metal core) discloses a technique relating to a metal core printed circuit board. A method of manufacturing a metal core printed circuit board disclosed in the above patent is a method of forming a through hole in a printed circuit board by filling a through hole with a metal having high thermal conductivity such as copper.

On the other hand, Korean Patent No. 10-1575127 (name of the invention, metal core printed circuit board and its manufacturing method) also discloses a method for manufacturing a metal core printed circuit board. The method of manufacturing the metal core disclosed in the above patent is a method of forming a metal core through a multi-step corrosion of a metal plate such as a copper plate.

The methods of manufacturing a metal core printed circuit board disclosed in the above patent documents have a disadvantage in that a method of forming a metal core is complicated and a large number of defects are caused and a manufacturing cost is high. In addition, the printed circuit board manufactured by the method disclosed in the above patent documents has a structure in which heat transferred from the semiconductor element to the metal core is transmitted to the outside and is difficult to be emitted.

BACKGROUND ART [0002] With the progress of high output and high integration of semiconductor materials, technological progress is required for a metal printed circuit board to more effectively transfer heat generated from semiconductor devices to the outside. In addition, there is a demand for a technological advance for a metal printed circuit board that can be manufactured at a low cost, while exhibiting excellent heat radiation effect.

It is an object of the present invention to provide a new metal printed circuit board which is excellent in heat radiation effect and can be manufactured at low cost and a method of manufacturing the same.

A method of manufacturing a metal printed circuit board in accordance with one aspect of the present invention is provided. In order to manufacture a metal printed circuit board according to the present invention, a metal base plate is prepared. Although it is preferable to use a copper base plate as the metal base plate, an aluminum base plate may be used if necessary. Next, one surface of the metal base plate is pressed by a relief mold having a protruding portion to protrude a part of the metal base plate to form a heat transfer protrusion (heat transfer protrusion forming step).

Next, the insulating sheet having the through holes for inserting the heat transfer protrusions is laminated on the surface of the metal base plate on which the projections are formed so that the heat transfer protrusions are inserted into the through holes (insulating sheet laminating step). As the insulating sheet, a ceramic insulating sheet excellent in thermal conductivity and electrical insulating property can be used. Next, a metal sheet having through holes for inserting the heat transfer protrusions is stacked on the upper surface of the insulating sheet so that the heat transfer protrusions are inserted into the through holes (metal sheet stacking step). The metal sheet may be a copper or aluminum sheet. Next, the metal sheet is heat-pressed at the same time as the metal base plate, the insulating sheet, and the metal sheet are closely contacted to each other (thermo-compression bonding step). When the metal sheet is pressed, a pressing tool having a hole for inserting the heat transfer protrusion is used to press the heat transfer protrusion in a state in which the heat transfer protrusion is aligned to be inserted into the hole.

Next, the upper surface of the metal sheet of the base-insulating sheet-metal sheet assembly formed in close contact by thermocompression is polished (polishing step) to planarize. The polishing step is a step of grinding the upper surface of the metal sheet and the heat transfer protrusions to planarize the surfaces at the same height, and to process the surface roughness of the planarized surface appropriately for plating. Next, a metal layer is plated on the upper surface of the base-insulating sheet-metal sheet assembly planarized by the polishing process to form a circuit layer (circuit layer forming step). The circuit layer is preferably formed by an electroless copper plating process. Next, a circuit pattern is formed by etching a circuit layer and a metal sheet layer around the heat transfer protrusion at the same time to electrically isolate the circuit layer from the circuit layer and a circuit layer around the heat transfer protrusion pattern Forming step).

Next, in order to protect the circuit pattern, a PSR (Photo Solder Resist) may be applied to the upper surface of the circuit pattern to form a circuit pattern protective layer. The ink is inserted into the space formed by the etching around the heat transfer protrusion pattern to reinforce the insulation between the heat transfer protrusion and the circuit pattern.

Next, the electrode terminal layer may be formed by printing or by plating the circuit pattern with gold to display the type of parts mounted on the circuit pattern and the electrode polarity of the parts.

According to another aspect of the present invention, a metal printed circuit board is provided. A metal printed circuit board according to the present invention includes a metal base plate on which at least one heat transfer protrusion protruding from one surface is formed and a through hole for inserting the heat transfer protrusion, A metal sheet laminated on an upper surface of the insulating sheet so that the heat transfer protrusions are inserted into the through holes; And a circuit layer formed by plating on an upper surface of the heat transfer protrusion, wherein the circuit layer includes a heat transfer protrusion pattern formed by etching a circuit layer and a metal sheet around the heat transfer protrusion so that the heat transfer protrusion is electrically separated from the circuit layer, And a circuit pattern formed by etching around the protrusion pattern.

According to another aspect of the present invention, a method of manufacturing a metal printed circuit board is provided. A method of manufacturing a metal printed board according to the present invention includes a heat transfer protrusion forming step of pressing a surface of a metal base plate with a metal to protrude a part of the metal base plate to form heat transfer protrusions, An insulating sheet lamination step of laminating an insulating sheet having a through hole for inserting the heat transfer protrusions on a surface thereof formed thereon; a through hole for inserting the heat transfer protrusions on an upper surface of the insulating sheet; A step of laminating the single-sided printed circuit board on the printed circuit board so that the heated metallic base plate and the insulating sheet are brought into close contact with the single-sided printed circuit board, And a base-insulating sheet-single-sided printing process To include abrasive planarizing by grinding the heat transfer protrusions protruding to the upper surface of the circuit board assembly.

According to another aspect of the present invention, there is provided a metal printed circuit board which is excellent in cooling effect of a semiconductor device such as an LED and can be manufactured at low cost.

A metal printed circuit board according to the present invention includes a metal base plate on which at least one heat transfer protrusion protruded from one surface is formed and a through hole through which the heat transfer protrusion is inserted is formed on a surface of the metal base plate on which the heat transfer protrusion is formed And a single-sided printed circuit board having a laminated insulating sheet, through holes for inserting the heat-conducting projections, and a circuit pattern formed on the insulating sheet so that the circuit pattern faces upward. In particular, the heat transfer protrusions of the metal base plate are protrusions formed by pressing the metal base plate with a metal mold, and the metal base plate, the insulation sheet, and the single-sided printed circuit board are in close contact with each other by thermocompression bonding.

An LED package or an LED bear chip can be mounted on a metal printed circuit (PCB) according to the present invention. When the LED package or the bare chip is mounted, the heat generating portion is mounted in contact with the heat transfer protrusion pattern. In addition, a heat generating portion of a device such as a high heat generating semiconductor device, for example, a FET, may be provided on the metal printed circuit board according to the present invention so as to be in contact with the heat transfer protrusion pattern. The heat transferred to the heat transfer protrusion pattern by contact with the semiconductor element is directly transferred to the metal base plate to achieve an excellent heat radiation effect. The rear surface of the metal base plate may be brought into contact with a separate heat sink so that heat generated by the semiconductor element can be released more effectively.

The method of manufacturing a metal printed circuit board according to the present invention makes it possible to mass-produce a printed circuit board having excellent heat radiation performance at low cost. Particularly, productivity is excellent in comparison with a method of forming a hole in a printed circuit board, filling a hole formed in the printed circuit board with a metal to form a core, or a method of forming a core by multi-step etching.

In addition, according to the method of the present invention, a heat transfer protrusion that directly contacts a semiconductor device and transfers heat generated in the semiconductor device to a metal base plate is electrically separated from a circuit pattern by etching, have.

1 is a plan view of an embodiment of a metal printed circuit board according to the present invention;
2 is a cross-sectional view taken along line AA of the embodiment disclosed in Fig. 1
Fig. 3 is a sectional view taken along the line BB of Fig. 1
FIG. 4 is a cross-sectional view illustrating a part of the manufacturing process of the metal printed circuit board of the embodiment shown in FIG.
FIG. 5 is a cross-sectional view of a part of the manufacturing process of the metal printed circuit board of the embodiment shown in FIG.
6 is a view for explaining another method of manufacturing a metal printed circuit board according to the present invention.

Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments with reference to the accompanying drawings.

Hereinafter, a metal printed circuit board according to the present invention and a method of manufacturing the same will be described with reference to the accompanying drawings.

FIG. 1 is a plan view of an embodiment of a metal printed circuit board according to the present invention, FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1, and FIG. 3 is a cross-sectional view taken along line B-B of FIG.

The printed circuit board (100) includes a metal base plate (100). The base plate is made of copper or aluminum plate. On the upper surface of the base plate, a plurality of heat transfer protrusions 112 are formed by press working of a positive metal mold. An insulating sheet 120 is laminated on the upper surface of the base plate 110. The insulating sheet 120 uses a sheet of ceramic material excellent in thermal conduction and insulation effect. The insulating sheet 120 is provided with through holes for inserting the heat transfer protrusions, and the heat transfer protrusions are inserted into the through holes at the time of stacking. A metal sheet 130 is laminated on the insulating sheet 120. The metal sheet 130 uses a copper sheet. The copper sheet 130 is provided with a through hole through which the heat transfer protrusion 112 is inserted, and the heat transfer protrusion is fitted into the through hole at the time of stacking. The metal base plate 110, the insulating sheet 120, and the metal sheet 130 are pressed together by thermocompression to form a base-insulating sheet-metal sheet assembly.

On top of the heat transfer protrusions 112, there is a heat transfer pattern 141 formed by etching a plated metal circuit layer. In this embodiment, the metal circuit layer is a copper plating layer and is formed by electroless copper plating on the copper sheet 130. Also, on the upper portion of the metal sheet 130, there is a circuit pattern 142 formed by etching a plated metal circuit layer. The heat transfer pattern 141 and the heat transfer protrusions 112 are electrically separated by the metal sheet 130 and the circuit pattern 142 and the insulation gap 114 caused by the etching. The insulating gap 114 may be filled with the ink for protecting the circuit pattern in the step of forming the circuit pattern protective layer 160. An electrode terminal layer 150 formed by gold plating is formed on the circuit pattern 141. The electrode terminal layer 150 electrically connects the circuit board to the electronic component 200 mounted on the upper portion of the metal printed circuit board 100.

A circuit pattern protective layer 160 is formed on a portion of the circuit pattern 141 where the electrode terminal layer 150 is not formed. The circuit pattern protective layer 160 is formed by a known PSR (Photo Solder Resist) process. The ink used in the PSR process is filled in the insulation gap 114 when the circuit pattern protective layer 160 is formed so that the electrical insulation between the heat transfer protrusions 112 and the circuit pattern 142 and the metal sheet 130 is reinforced do. The circuit pattern protective layer 160 is also applied to the upper surface of the insulating sheet 120 on which the metal sheet 130 is etched and exposed.

The heat generating part of the LED package 200 directly contacts the heat transfer pattern 141 and the terminal of the LED package 200 is bonded to the electrode terminal layer 150 do. Heat generated from the LED package is quickly transferred to the base plate 110 through the heat transfer protrusions 112 to be dissipated.

4, a method of manufacturing a metal printed circuit board according to the present invention will be described in detail. 4 is a manufacturing process diagram of the metal printed circuit board 100 of the embodiment shown in Fig.

In order to manufacture the metal printed circuit board according to the present invention, a metal base plate 110 as shown in Fig. 4 (a) is prepared. The metal base plate 110 preferably uses a copper base plate, but an aluminum base plate may be used if necessary. One surface of the metal base plate 110 is pressed by a relief mold 300 having a protruding portion to protrude a part of the metal base plate 110 to form a heat transfer protrusion 112 (heat transfer protrusion forming step). The height of the heat transfer protrusions 112 is formed to be in a range of about 150 to 250 micrometers (占 퐉) as needed.

4 (b), an insulating sheet 120 having a through hole 122 for inserting the heat transfer protrusions 112 of the metal base plate 110 is prepared, and the heat transfer protrusions 112 are inserted into the through holes 122 122 and laminated on the surface of the metal base plate 120 on which the heat transfer protrusions 112 are formed (insulating sheet laminating step). As the insulating sheet 120, a ceramic insulating sheet having excellent thermal conductivity and electrical insulating property can be used.

4 (c) and 4 (d), a metal sheet 130 having a through hole 132 for inserting the heat transfer protrusions 112 therein is prepared, and the heat transfer protrusions 112 are formed in the through holes 132 The metal sheet 130 is laminated on the upper surface of the insulating sheet so as to be sandwiched between the metal sheets 130 (metal sheet laminating step). The metal sheet 130 may be a copper or aluminum sheet.

4 (e), a pressing plate 400 having a hole 410 for inserting the heat transfer protrusion 112 is prepared, and the position of the heat transfer protrusion 112 is adjusted so that the heat transfer protrusion 112 is inserted into the hole 410 do. The metal sheet 130 is compressed by the pressing plate 400 so that the metal base plate 110, the insulating sheet 120, and the metal sheet 130 are closely contacted with each other. At this time, the metal base plate 110, the insulating sheet 120, and the metal sheet 130 are heated and pressed together (thermocompression step). The insulating sheet 120 laminated between the metal base plate 110 and the metal sheet 130 is completely adhered to the metal base plate 110 and the metal sheet 130 by thermocompression to prevent the laminate from being peeled off.

5F, the upper surface of the metal sheet of the base-insulating sheet-metal sheet assembly 600 formed in close contact by thermocompression is polished using the polishing tool 500 and planarized (polishing step) . In the polishing step, the upper surface of the metal sheet 130 and the protruding portion of the metal sheet 130 of the heat transfer protrusion 112 are ground to uniformly planarize the surface, and the roughness of the planarized surface is treated .

Referring to FIG. 5 (g), a circuit layer 140 is formed by plating a metal layer on the upper surface of the base-insulating sheet-metal sheet assembly 600 planarized by the polishing step (circuit layer forming step). The circuit layer 160 is preferably formed by an electroless copper plating process.

Referring to FIG. 5 (h), a heat transfer protrusion pattern 141 and a circuit pattern 142 are formed on the circuit layer 160 by a known etching process (pattern formation step). The heat transfer protrusion pattern 114 is formed by simultaneously etching the circuit layer 140 and the metal sheet 130 around the heat transfer protrusions 112 so that the heat transfer protrusions 112 and the heat transfer protrusion patterns 141 are formed on the circuit layer 140 And is formed to be electrically separated. That is, the insulating cavities 114 are formed by etching the heat transfer protrusions 112 and the heat transfer protrusion patterns 141. The circuit pattern 142 is formed by etching the circuit layer 140 and the metal sheet 130 around the heat transfer protrusion pattern 141. The metal sheet 130 around the circuit pattern 142 is also etched to leave the metal sheet 130 under the circuit pattern 142 when the circuit pattern 142 is etched.

Referring to FIG. 5 (i), the electrode terminal layer 150 is formed by gold plating on the circuit pattern 142. The step of forming the electrode terminal layer 150 by gold plating is a technique that is obvious to those skilled in the art. Although not shown, a PSR (Photo Solder Resist) may be applied to the upper surface of the circuit pattern 142 to protect the circuit pattern 142 to form a circuit pattern protective layer. The ink is inserted into the insulation gap 114 formed by etching around the heat transfer protrusion pattern to reinforce the insulation between the heat transfer protrusion 112 and the circuit pattern 142. [

6 is an explanatory view of another method of manufacturing a metal printed circuit board according to the present invention.

The method for manufacturing a metal printed circuit board according to the present invention differs from the method for manufacturing a metal printed circuit board shown in Figs. 4 and 5 in that a single-sided printed circuit board on which circuits are printed is stacked, Which simplifies the process.

First, a metal base plate 110 as shown in Fig. 6 (a) is prepared. The metal base plate 110 preferably uses a copper base plate, but an aluminum base plate may be used if necessary. One surface of the metal base plate 110 is pressed by a relief mold 300 having a protruding portion to protrude a part of the metal base plate 110 to form a heat transfer protrusion 112 (heat transfer protrusion forming step). The height of the heat transfer protrusions 112 is formed to be in the range of about 250 to 300 micrometers (占 퐉) as needed.

6 (b), an insulating sheet 120 having a through hole 122 for inserting the heat transfer protrusions 112 of the metal base plate 110 is prepared, and the heat transfer protrusions 112 are inserted And is laminated on the surface of the metal base plate 120 on which the heat transfer protrusions 112 are formed (insulating sheet laminating step). As the insulating sheet 120, a ceramic insulating sheet or a general insulating sheet excellent in thermal conductivity and electrical insulation can be used.

6 (c), a single-sided printed circuit board 600 having a through-hole 612 for inserting the heat transfer protrusions 112 therein is prepared, and the heat transfer protrusions 112 are inserted into the through holes 6122 A single-sided printed circuit board 700 is laminated on the upper surface of the insulating sheet 120 (single-sided printed circuit board lamination step). The single-sided printed circuit board 700 is stacked on the upper portion of the insulating sheet 120 such that the circuit pattern 711 is formed in advance and the surface on which the circuit pattern 711 is formed is positioned on the upper side. In the single-sided printed circuit board 700, a circuit pattern 711 is formed on the upper surface of the synthetic resin board 710 by a known etching process. The laminated single-sided printed circuit board 600 uses a single-sided printed circuit board having a thickness in the range of about 150 to 170 micrometers (mu m), preferably about 170 micrometers (mu m). The circuit pattern 711 is electrically separated from the heat transfer protrusions 112 by the through holes 712.

Next, as shown in FIG. 6 (d), a pressing plate 400 having a hole 410 for inserting the heat transfer protrusion 112 is prepared, and the heat transfer protrusion 112 is inserted into the hole 410 So that the position is aligned. The single-sided printed circuit board 700 is compressed by the pressing plate 400 so that the metal base plate 110, the insulating sheet 120, and the single-sided printed circuit board 700 are closely contacted. At this time, the metal base plate 110, the insulating sheet 120, and the single-sided printed circuit board 700 are pressed while being heated (thermo-compression bonding step). The insulating sheet 120 laminated between the metal base plate 110 and the single-sided printed circuit board 700 is brought into close contact with the metallic base board 110 and the single-sided printed circuit board 700 by thermocompression, ≪ / RTI >

6E, the upper surface of the heat transfer protrusion 112 protruding to the upper portion of the base-insulating sheet-single-sided printed circuit board assembly 800 formed in close contact by thermocompression is removed by using the polishing tool 500 And then planarized (polishing step). The circuit pattern 711 of the single-sided printed circuit board 700 as well as the upper surface of the heat transfer protrusion 112 of the single-sided printed circuit board 700 may be thinly polished.

6F, the upper surface of the heat transfer protrusion 112 is polished so that when the height of the upper surface of the heat transfer protrusion 112 is equal to the height of the circuit pattern 711 of the single-sided printed circuit board 700, A semiconductor device 200 such as an LED is mounted on the circuit pattern 112 and the circuit pattern 711 and the semiconductor device 200 is electrically connected to the circuit pattern 711 to drive the semiconductor device. Heat generated from the semiconductor device 200 is quickly transferred to the metal base plate 110 through the heat transfer protrusions 112 and is then discharged to the outside.

When the single-sided printed circuit board 700 having the circuit pattern 711 formed thereon in place of the metal sheet 130 shown in Figs. 4 and 5 is used as in the present invention, the metallic layer 140 is plated and the circuit patterns 141, 142 may be removed to reduce manufacturing costs.

Referring to Fig. 6 (f), a metal printed circuit board having a novel structure according to the present invention is provided. The metal printed circuit board according to the present invention includes an insulating sheet 120 laminated on a metal base plate 110 and a metal base plate, and a single-sided printed circuit board 700 laminated on the insulating sheet. At least one heat transfer protrusion 112 protruding from one surface of the metal base plate 110 is formed. The insulating sheet 120 is formed with through holes through which the heat transfer protrusions 112 are inserted, and the heat transfer protrusions 112 are interposed between the through holes. A through hole and a circuit pattern 711 are formed in the single-sided printed circuit board 700 for inserting the heat transfer protrusions 112 therein. Particularly, the heat transfer protrusions 112 of the metal base plate 110 are protrusions formed by pressing the metal base plate 110 with a metal mold. The metal base plate 110, the insulating sheet 120, The circuit board 700 is closely contacted by thermocompression bonding.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

110 metal base plate
112 heat transfer projection
114 Insulation Clearance
120 insulating sheet
130 metal sheet
140 circuit layer
141 Heat transfer pattern
142 Circuit pattern

Claims (9)

A heat transfer protrusion forming step of pressing one surface of the metal base plate with a metal to protrude a part of the metal base plate to form a heat transfer protrusion;
An insulating sheet stacking step of stacking an insulating sheet having through holes for inserting the heat transfer protrusions on a surface of the metal base plate on which heat transfer protrusions are formed;
A metal sheet stacking step of stacking a metal sheet having through holes for inserting the heat transfer protrusions on an upper surface of the insulating sheet;
A heat pressing step of pressing the metal sheet so that the heated metal base plate, the insulating sheet, and the metal sheet are brought into close contact with each other, the pressing plate having holes for inserting the heat transfer protrusions,
An assembly top surface polishing step of polishing and planarizing the upper surface of the metal sheet of the base-insulating sheet-metal sheet assembly formed by the thermocompression step and the heat transfer protrusions,
A circuit layer forming step of forming a circuit layer by plating a metal layer on the polished upper surface of the base-insulating sheet-metal sheet assembly;
And a pattern forming step of forming a circuit pattern by etching a circuit layer around the heat transfer protrusion pattern and a heat transfer protrusion pattern electrically isolated from the circuit layer by simultaneously etching the circuit layer and the metal sheet around the heat transfer protrusion A method of manufacturing a metal printed circuit board. The method according to claim 1,
And forming an electrode terminal layer on the top of the circuit pattern electrically separated from the heat transfer protrusion by gold plating. The method according to claim 1,
Further comprising the step of forming a circuit pattern protective layer on top of a circuit pattern electrically isolated from the heat transfer protrusions. The method according to claim 1,
Wherein the metal base plate is a copper plate and the metal sheet is a copper sheet. A metal base plate having at least one heat transfer protrusion protruded from one surface thereof,
An insulating sheet having through holes for inserting the heat transfer protrusions and stacked on one surface of the metal base plate so that the heat transfer protrusions are inserted into the through holes,
A metal sheet laminated on an upper surface of the insulating sheet so that the heat conducting protrusions are inserted into the through holes,
And a circuit layer formed on the upper surface of the metal sheet and the heat transfer protrusion,
Wherein the circuit layer includes a heat transfer protrusion pattern formed by etching a circuit layer and a metal sheet around the heat transfer protrusion so that the heat transfer protrusion is electrically separated from the circuit layer and a circuit pattern formed by etching around the heat transfer protrusion pattern Metal printed circuit board. 6. The method of claim 5,
Further comprising an electrode terminal layer formed by gold plating on an upper portion of the circuit layer electrically separated from the heat transfer protrusions. 6. The method of claim 5,
Further comprising a circuit pattern protective layer applied on top of a circuit layer electrically isolated from the heat transfer protrusions. A heat transfer protrusion forming step of pressing one surface of the metal base plate with a metal to protrude a part of the metal base plate to form a heat transfer protrusion;
An insulating sheet stacking step of stacking an insulating sheet having through holes for inserting the heat transfer protrusions on a surface of the metal base plate on which heat transfer protrusions are formed;
A single-sided printed circuit board lamination step of laminating a single-sided printed circuit board on a top surface of the insulating sheet, the through-hole for inserting the heat-
A thermal pressing step of pressing the end face printed circuit board so that the heated metal base plate and the insulating sheet come into close contact with the end face printed circuit board,
And a polishing step of polishing and planarizing the heat transfer protrusions protruding from the upper surface of the base-insulating sheet-single-sided printed circuit board assembly formed by the thermo-pressing step. A metal base plate having at least one heat transfer protrusion protruded from one surface thereof,
An insulating sheet laminated with through holes for inserting the heat transfer protrusions on the surface of the metal base plate on which the heat transfer protrusions are formed,
And a single-sided printed circuit board having a through-hole for inserting the heat transfer protrusion and a circuit pattern formed thereon and stacked on the insulating sheet such that the circuit pattern faces upward,
The heat transfer protrusion of the metal base plate is a protrusion formed by pressing the metal base plate with a metal to protrude,
Wherein the metal base plate, the insulating sheet, and the single-sided printed circuit board are brought into close contact by thermocompression bonding.

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