KR102259873B1 - Board for LED lighting apparatus and LED lighting apparatus having the same - Google Patents

Abstract

The present invention relates to an LED lighting apparatus, and more specifically, to a substrate for an LED lighting apparatus with an LED element installed on an upper surface thereof to emit light, and the LED lighting apparatus. The present invention provides the substrate (10) for the LED lighting apparatus with one or more LED elements (20) installed on the upper surface. The substrate comprises: a copper pattern layer (100) including electric application patterns (111, 112, 113) electrically connected to each of an anode (21) and a cathode (22) of the LED element (20), and a heat dissipation pattern (120) electrically separated from the electric application pattern (110) and receiving heat from a heat dissipation part (23) of the LED element (20); and an insulating layer (200) made of an electrical insulation material, which is coupled to a bottom surface of the copper pattern layer (100) and has heat transfer holes (210) vertically formed therethrough and filled with a heat transfer material (410) to transfer heat, generated from the LED element (20), downward. The present invention can maximize the lifespan and energy efficiency of the LED element by effectively dissipating the heat generated from the LED element.

Description

Board for LED lighting apparatus, LED lighting apparatus having the same {Board for LED lighting apparatus and LED lighting apparatus having the same}

The present invention relates to an LED lighting device, and more particularly, to a substrate for an LED lighting device and an LED lighting device in which an LED element is installed on an upper surface to emit light.

LED (Light Emitting Diode) is attracting attention in the field of lighting technology due to its low power consumption, high luminous efficiency, semi-permanent lifespan, fast response speed, and environment-friendly characteristics.

However, the LED has a characteristic of consuming power as heat, so there is a problem in that the higher the power is applied to the LED device, the more heat is generated in the device.

Due to the heat generated by the LED, the luminous efficiency of the LED is lowered, and the reliability is also affected, so that the lifetime of the device decreases as the junction temperature rises.

That is, the heat generated during LED driving needs to be efficiently dissipated, which is a very important issue in LED performance.

An object of the present invention is to solve the problems of the prior art as described above, and to provide a substrate for an LED lighting device in which the lifespan and energy efficiency of the LED device are maximized by effectively dissipating heat generated from the LED device, and an LED lighting device having the same. is to provide

The present invention has been created to achieve the object of the present invention as described above, and the present invention is a substrate 10 for an LED lighting device in which one or more LED elements 20 are installed on the upper surface of the LED element 20. An electricity application pattern 110 electrically connected to each of the positive electrode 21 and the negative electrode 22 , and electrically separated from the electricity application pattern 110 , heat from the heat dissipation unit 23 of the LED element 20 . a copper pattern layer 100 including the received heat dissipation pattern 120; An electrical insulating material coupled to the bottom surface of the copper pattern layer 100 and having a heat transfer hole 210 filled with a heat transfer material 410 to transfer the heat generated from the LED element 20 downward. Disclosed is a substrate for an LED lighting device, characterized in that it comprises an insulating layer 200 of.

In the heat dissipation pattern 120 , a through hole 121 having the same or smaller size as the heat transfer hole 210 is formed at a position corresponding to the heat transfer hole 210 , and the through hole 121 is the heat transfer hole 210 . Material 410 may be filled.

When the heat transfer material 410 is filled in the heat transfer hole 210, it may be applied to at least a portion of the bottom surface of the substrate.

The heat transfer material 410 may be silver (Ag).

The heat transfer material 410 may be a fin member inserted into the heat transfer hole 210 .

In the copper pattern layer 100 , the electrical application pattern 110 and the heat dissipation pattern 120 may be formed by etching while the copper plate is attached to the insulating layer 200 .

One or more reinforcing layers 300 to be bonded to the bottom surface of the insulating layer 200 to prevent bending may be further included.

The reinforcing layer 300 may be made of FR-4 or copper.

The reinforcing layer 300 includes a first reinforcing layer 310 made of an insulating material coupled to the bottom surface of the insulating layer 200 and a second reinforcing layer 320 made of a copper material coupled to the bottom surface of the first reinforcing layer 310 . may include.

In addition, the present invention, one or more LED elements 20 mounted on the copper pattern layer 100 formed on the substrate 10 for the LED lighting device; A heat dissipation member 30 coupled to the bottom surface of the substrate 10 to dissipate heat generated by the LED device 20 may be included.

In addition, in the LED lighting device of the present invention, an interface layer 400 of an electrically insulating material may be formed between the substrate 10 and the heat dissipation member 30 while transferring the heat generated from the LED device 20 . have.

The interface layer 400 may have the same material as the heat transfer material 410 .

The interface layer 400 may be formed by being applied to the bottom surface of the substrate 10 when the heat transfer material 410 is filled in the heat transfer hole 210 .

The present invention also includes a substrate 10 for an LED lighting device on which one or more LED elements 20 are installed on the upper surface; and a heat dissipation member 30 coupled to the bottom surface of the substrate 10 to radiate heat generated by the LED device 20 , and between the substrate 10 and the heat dissipation member 30 , the LED device Disclosed is an LED lighting device characterized in that the interfacial layer 400 of an electrically insulating material is formed while transferring the heat generated in (20).

The substrate 10 for the LED lighting device includes an electric application pattern 110 electrically connected to each of the anode 21 and the cathode 22 of the LED element 20 , and the electric application pattern 110 and electrically a copper pattern layer 100 that is separated and includes a heat dissipation pattern 120 that receives heat from the heat dissipation unit 23 of the LED device 20; an insulating layer 200 of an electrically insulating material coupled to a bottom surface of the copper pattern layer 100; It may include a reinforcing layer 300 made of an aluminum material coupled to the bottom surface of the insulating layer 200 .

In the insulating layer 200 and the reinforcing layer 300 , a heat transfer hole 210 filled with a heat transfer material 410 may be formed vertically through the heat transfer material 410 to transfer the heat generated by the LED element 20 to the lower side. have.

The heat transfer material 410 may have the same material as the interface layer 400 .

The interface layer 400 may be formed by being applied to the bottom surface of the substrate 10 when the heat transfer material 410 is filled in the heat transfer hole 210 .

The interfacial layer 400 is a heat dissipation composition, and includes a surface-modified carbon nanotube, ceramic, alloy, polymer resin, and dispersant, wherein the carbon nanotube is a substituent represented by the following formula (1), a substituent represented by the following formula (2) The surface may be modified with a substituent, a substituent represented by the following formula (3), or a substituent represented by the following formula (4).

{In Formulas 1 to 4,

1) R is -COOH, -B(OH) ₂ , -OH, -NH ₂ or -SH,

2) n is an integer from 0 to 20,

3) x and y are each independently an integer from 1 to 10,

4) R' is -COOH, -CONH ₂ or -CONH(CH ₂ ) ₁₇ CH ₃ }

The carbon nanotube (CNT) is a single-walled carbon nanotube, a double-walled carbon nanotube, or a multi-walled carbon nanotube.

The substrate for an LED lighting device according to the present invention and an LED lighting device having the same can maximize the lifespan and energy efficiency of the LED device by effectively dissipating heat generated from the LED device by increasing heat exchange with the heat dissipation unit formed in the LED device. there is an advantage

In addition, the substrate for an LED lighting device according to the present invention, and an LED lighting device having the same, increase heat exchange with a heat dissipation unit formed in the LED device to effectively radiate heat generated from the LED device, thereby providing an excellent heat dissipation effect to electronic components such as LED devices. It has the advantage of extending the life of the device and obtaining reliability.

In addition, the substrate for an LED lighting device according to the present invention, and an LED lighting device having the same, have electrical insulation properties and thermal conductivity in effectively dissipating heat generated from the LED device by increasing heat exchange with a heat dissipation unit formed in the LED device. It is easy to manufacture by using a composition for heat dissipation of high material, and has the advantage of high heat dissipation effect.

1 is a plan view showing an example of a substrate for an LED lighting device according to the present invention.
FIG. 2 is an enlarged view of part A in FIG. 1 .
FIG. 3A is a cross-sectional view in the BB direction in FIG. 2 .
3B is a cross-sectional view showing a modified example of the structure shown in FIG. 3A.
FIG. 4A is a cross-sectional view taken in the CC direction in FIG. 1 .
4B is a cross-sectional view showing a modified example of the structure shown in FIG. 4A.
4C is a cross-sectional view showing another modified example of the structure shown in FIG. 4A.
5 is a partial cross-sectional view showing an example of the LED lighting device including the substrate for the LED lighting device according to the present invention shown in FIG.

Hereinafter, a substrate for an LED lighting device according to the present invention and an LED lighting device having the same will be described with reference to the accompanying drawings.

A key feature of the present invention relates to an LED lighting device in which one or more LED elements 20 are installed to perform a lighting function, and a new concept LED lighting device replacing the conventional PCB in which one or more LED elements 20 are installed. To provide a substrate for use.

Here, the LED lighting device to which the substrate for the LED lighting device according to the present invention is applied is a device that performs a lighting function by using the light emission of the LED element, and various configurations are possible according to the usage environment and purpose.

As an example, the LED lighting device to which the substrate for the LED lighting device according to the present invention is applied is, as shown in FIG. 5 , the substrate 10 for the LED lighting device according to the present invention, and is installed on the substrate 10 It may be composed of one or more LED elements 20 and a heat dissipation member 30 coupled to the bottom surface of the substrate 10 to radiate heat generated by the LED elements 20 .

The LED device 20 is a semiconductor device that emits light by an external power supply, and may be a single color light such as blue, red, or green, or an LED device of three colors of red, green, and blue light.

In addition, the type, number, and arrangement pattern of the LED element 20 may be variously determined in consideration of the purpose and function of the LED lighting device.

Meanwhile, the LED device 20 may include electrodes of the anode 21 and the cathode 22 , and a heat dissipation unit 23 emitting heat generated from the LED device.

Here, the heat dissipation unit 23 may have various types such as a heat pipe and a heat slug, and may have various shapes such as a pipe type, a flat type, a loop type, and a rod type depending on the purpose. .

The heat dissipation member 30 is coupled to the bottom surface of the substrate 10 to dissipate heat generated by the LED device 20 , and any material capable of dissipating the heat generated from the LED device 20 . Also, it may be made of a material such as aluminum or an aluminum alloy.

Meanwhile, in the heat dissipation member 30 , a plurality of heat dissipation fins may be formed in the substrate 10 to be fixedly coupled by screws or the like, and to increase the heat dissipation effect in the remaining portion.

In addition, the heat dissipation member 30 may include a coupling plate to which the substrate 10 is coupled and a heat dissipation block coupled to the coupling plate to maximize heat dissipation.

Here, the heat dissipation block may have various configurations such as a heat sink and a heat dissipation fin, and may have various cooling methods such as air cooling and water cooling.

An interface layer 400 made of an electrically insulating material may be formed between the substrate 10 and the heat dissipation member 30 while transferring the heat generated by the LED device 20 .

The interface layer 400 has an electrically insulating material, is formed between the substrate 10 and the heat dissipation member 30 to perform an electrical insulation function between the substrate 10 and the heat dissipation member 30, and is a thermoelectric As a thermal interface material (TIM), the heat dissipation effect can be improved.

In this case, the interface layer 400 may have the same material as the heat transfer material 410 to be described later, and further, the interface layer 400 may be formed of a substrate ( 10) may be formed by coating on the bottom surface.

In addition, the interface layer 400, the composition for heat dissipation according to another aspect of the present invention may be used.

On the other hand, as for the interface layer 400 , if electrical insulation is not required between the substrate 10 and the heat dissipation member 30 , an electrically conductive material such as silver may be used as a matter of course.

The substrate 10 for the LED lighting device is a configuration in which one or more LED elements 20 are installed, and various configurations are possible.

In particular, the substrate 10 for an LED lighting device is a substrate for an LED lighting device according to the present invention, and will be described in detail below.

The substrate 10 for an LED lighting device according to the present invention, as shown in FIGS. 1 to 5, is a substrate 10 for an LED lighting device in which one or more LED devices 20 are installed on the upper surface, the LED device ( 20), the electric application patterns 111, 112, 113 electrically connected to each of the anode 21 and the cathode 22, and the electric application pattern 110 and the heat dissipation part of the LED element 20 ( 23) a copper pattern layer 100 including a heat dissipation pattern 120 that receives heat from; An insulating layer of an electrically insulating material that is coupled to the bottom of the copper pattern layer 100 and has a heat transfer hole 210 filled with a heat transfer material 410 to transfer the heat of the heat radiation pattern 120 to the lower side. 200) may be included.

The substrate 10 for the LED lighting device may be configured in various ways, such as a single-sided board, a double-sided board, and a multi-layer board, depending on the number of wiring circuits in general.

In addition, the substrate 10 may have a solid shape, a flexible shape, or a combination of the two (Rigid-Flexible) depending on the use.

In addition, the substrate 10 may be a surface coating to protect the upper surface.

Meanwhile, the copper pattern layer 100 includes an electric application pattern 110 and a heat dissipation pattern 120 , and various configurations are possible.

The copper pattern layer 100 may have a copper material, and oxygen-free copper having excellent thermal and electrical conductivity may be used by reducing the oxygen content to less than 0.1%.

Of course, when the copper pattern layer 100 is not formed of copper, it may be formed of a material such as gold or silver having electrical conductivity such as metal.

In addition, the copper pattern layer 100 may have various thicknesses, for example, it may have a thickness of 0.2T.

The electric application pattern 110 is a configuration electrically connected to each of the anode 21 and the cathode 22 of the LED element 20, has different polarities, and first electric application patterns 111 and 112 to which power is applied. and a plurality of second electricity application patterns 113 having different polarities at both ends corresponding to the first electricity application patterns 111 and 112 and having different LED devices 20 installed at both ends thereof.

The electrical application pattern 110 is a configuration electrically connected to each of the anode 21 and the cathode 22 of the LED element 20, and may have various patterns according to the circuit configuration.

The first electricity application patterns 111 and 112 have different polarities and are configured to receive power, and various configurations are possible.

The first electricity application patterns 111 and 112 are connected to an external power source like an SMPS to supply power to the LED element 20, or are configured as a rechargeable battery to power the LED element 20 without external power supply for a certain period of time. can supply

In addition, when the first electricity application patterns 111 and 112 are installed at a position where it is easy to supply power to the LED device 20, they can be installed in various positions.

Meanwhile, the LED element 20 may be directly connected to the first electricity application patterns 111 and 112 , but may be indirectly connected by forming the second electricity application pattern 113 between the plurality of LED elements 20 .

The second electricity application pattern 113 has different polarities at both ends corresponding to the first electricity application patterns 111 and 112, and different LED devices 20 are installed at both ends, and various configurations are possible. Do.

For example, the second electricity application pattern 113 may be formed between adjacent LED elements 20 so that different LED elements 20 are installed at both ends.

At this time, since the second electricity application pattern 113 is formed between the adjacent LED elements 20 and serves to electrically connect the LED elements 20, both ends have different polarities.

In addition, the second electricity application pattern 113 may have various pattern shapes, and may be configured to have no external power source or rechargeable battery connected thereto, or may be selectively connected as needed.

On the other hand, the second electricity application pattern 113 may be made of a plurality, and if installed at a position where it is easy to supply power to the LED element 20, it can be installed in various positions.

The heat dissipation pattern 120 is electrically separated from the electrical application pattern 110 and receives heat from the heat dissipation unit 23 of the LED device 20, and as shown in FIGS. 2 to 3, It has a space S between the electric application patterns 111, 112, and 113 and is formed adjacent to each other.

The heat dissipation pattern 120 is electrically separated from the electrical application patterns 111 , 112 , and 113 so that electricity does not flow, and the heat transferred from the heat dissipation unit 23 of the LED element 20 is transferred to a heat transfer hole 210 , which will be described later. ) to transmit the

In this case, a space S may be formed between the electricity application patterns 111 , 112 , and 113 in order to be electrically separated from the electricity application patterns 110 .

The space (S) may be formed in various ways according to the manufacturing process, for example, may be formed by etching in a state in which a copper plate is attached to the insulating layer 200, as another example, the electric application pattern 110 And after the heat dissipation pattern 120 is formed in advance, it may be arranged to have the space (S).

In addition, it goes without saying that the space S may be filled with a material having an insulating function.

On the other hand, the heat dissipation pattern 120 may have various pattern shapes, and may be formed to surround the electric application pattern 110 as shown in FIG. 1 , and it is preferable to have a shape with a large surface area for more effective heat dissipation. Do.

The insulating layer 200 is coupled to the bottom surface of the copper pattern layer 100, and a heat transfer hole 210 filled with a heat transfer material 410 to transfer the heat of the heat radiation pattern 120 to the lower side is formed through the top and bottom. As the configuration of the electrical insulating material, various configurations are possible.

The insulating layer 200 may be any material, such as polypropylene resin, as long as it does not conduct electricity and has thermal conductivity. In general, a prepreg having a structure in which a polymer resin composition is impregnated into glass fibers is widely used. have.

For example, the polymer resin composition may be a phenol resin or an epoxy resin, and Prepreg.P.P, which is a resin in which an epoxy resin and a glass fiber are combined, may be used.

In addition, the insulating layer 200 may have various states, such as solid and liquid, according to the needs of the user, such as an insulating adhesive or an insulating sheet, and a heat dissipation composition to be described later may be used if necessary.

The insulating layer 200 may have various thicknesses, for example, it may have a thickness of 0.1T.

On the other hand, the heat emitted from the heat dissipation part 23 of the LED element 20 and transferred to the heat dissipation pattern 120 must be transmitted to the heat dissipation member 30 again to be discharged to the outside.

Accordingly, in the prior art, the heat dissipation part 23 and the heat dissipation member 30 were connected to transmit heat, but due to the limitation of the area and number of heat dissipation passages, a bottleneck of heat transfer occurred, resulting in low heat conduction efficiency.

Accordingly, in the present invention, a plurality of heat transfer holes 210 are formed vertically through the insulating layer 200 so that heat generated from the LED device 20 can be effectively transferred to the heat dissipation member 30 .

Specifically, as shown in FIGS. 4A to 4C , the heat transfer hole 210 is formed vertically through the insulating layer 200 to transfer the heat of the heat dissipation pattern 120 downward. , there is an advantage in that the heat conduction efficiency is increased by serving as a discharge path for the heat collected in the heat dissipation pattern 120 .

More specifically, the heat transfer hole 210 is formed between the heat dissipation pattern 120 and the heat dissipation member 30 to transfer the heat received by the heat dissipation pattern 120 to the heat dissipation member 30, The heat transfer material 410 is filled therein so that heat can be transferred.

In this case, the heat transfer hole 210 may have various shapes and sizes, and it is preferable to have a shape and size with a large surface area in order to improve heat conduction efficiency.

A plurality of the heat transfer holes 210 may be formed in the insulating layer 200 as shown in FIG. 1 , and may be formed in the substrate 10 in various embodiments.

For example, the heat transfer hole 210 penetrates not only the insulating layer 200 but also the reinforcing layer 300 to be described later as shown in FIG. 4A , or as shown in FIG. 4B , the copper pattern layer 100 . ) may be formed with a through hole 121 formed in the same size as or smaller than that of the heat transfer hole 210, and may be formed in various ways, such as being formed through the entire substrate 10, as shown in FIG. 4C. have.

Meanwhile, the heat transfer material 410 filling the inside of the heat transfer hole 210 may be a metal, for example, copper, silver, or aluminum, and various materials such as a heat dissipation composition to be described later may be used.

Here, it goes without saying that the heat transfer material 410 may also be filled in the through hole 121 .

Meanwhile, when the heat transfer material 410 is filled in the heat transfer hole 210 , it may be applied together on at least a portion of the bottom surface of the substrate 10 .

That is, as shown in FIGS. 3 to 4 , the heat transfer material 410 is applied between the substrate 10 and the heat dissipation member 30 , and a minute gap exists between the substrate 10 and the heat dissipation member 30 . The heat dissipation effect can be further improved by filling the gap.

In addition, when the heat transfer material 410 is applied to the bottom surface of the substrate 10 , as shown in FIG. 3B , the heat transfer material 410 protrudes upward to form the reinforcing layer 300 and the insulating layer 200 . There is an advantage that the heat dissipation pattern 120 and the heat dissipation member 30 can be easily connected by penetrating the heat dissipation pattern 120 to be connected.

Here, the portion where the heat transfer material 410 protrudes may be coated with silver nano-coating.

Meanwhile, the heat transfer material 410 may be a fin member inserted into the heat transfer hole 210 .

In this case, the material of the fin member may be any material as long as it can conduct heat, but may be a metal having high thermal conductivity, for example, gold, silver, copper, etc., and may be BN, ALN+BN, etc. as a ceramic-based material.

In addition, the pin member may be a silver nano coating.

Meanwhile, the substrate 10 may include one or more reinforcing layers 300 coupled to the bottom surface of the insulating layer 200 to prevent bending.

The reinforcing layer 300 is coupled to the bottom surface of the insulating layer 200 to prevent bending, and includes a first reinforcing layer 310 made of an insulating material coupled to the bottom surface of the insulating layer 200 and the first It may include a second reinforcing layer 320 made of a copper material coupled to the bottom surface of the reinforcing layer 310 .

The reinforcing layer 300 may have various thicknesses, for example, it may have a thickness of 0.1T.

In addition, the first reinforcing layer 310 may have an insulating material, FR-4, etc. may be used, and the second reinforcing layer 320 may be formed of a metal that conducts electricity, for example, copper, silver, etc. can

On the other hand, the above-described substrate for an LED lighting device 10, one or more LED elements 20 mounted on the copper pattern layer 100 formed on the substrate 10 for the LED lighting device;

It may be formed to include a heat dissipation member 30 coupled to the bottom surface of the substrate 10 to dissipate heat generated by the LED device 20 .

On the other hand, the substrate for LED lighting device and LED lighting device may include the following heat radiation composition in order to further improve the above-described heat radiation effect.

The composition for heat dissipation includes a surface-modified carbon nanotube, a ceramic, an alloy, a polymer resin, and a dispersant, wherein the carbon nanotube is a substituent represented by the following Chemical Formula 1, a substituent represented by the following Chemical Formula 2, and a substituent represented by the following Chemical Formula 3 It is characterized in that the surface is modified with a substituent or a substituent represented by the following formula (4).

{In Formulas 1 to 4,

1) R is -COOH, -B(OH) ₂ , -OH, -NH ₂ or -SH,

2) n is an integer from 0 to 20,

3) x and y are each independently an integer from 1 to 10,

4) R' is -COOH, -CONH ₂ or -CONH(CH ₂ ) ₁₇ CH ₃ }

The carbon nanotube (CNT) may be a single-walled carbon nanotube, a double-walled carbon nanotube, or a multi-walled carbon nanotube. have.

Further, in the present invention, by using the ceramic together, thermal conductivity and insulation properties are increased to further improve heat dissipation performance. The ceramic is boron nitride (BN), aluminum nitride (AlN), aluminum oxide (aluminum oxide; Al ₂ O ₃ ), silicon carbide (SiC), beryllium oxide (BeO) , magnesium oxide (MgO) and silicon nitride (Si ₃ N ₄ ) It is preferable that any one selected from the group consisting of, and more preferably may be boron nitride, the boron nitride is boron nitride nano It may be in the form of particles, boron nitride nanomesh, boron nitride nanotubes, boron nitride nanosheets or boron nitride airgel.

Boron nitride not only has stability at high temperature, strong hardness, excellent corrosion resistance to acid, a wide band gap of about 5.5 eV, high electrical insulation, but also has a layered structure similar to graphite, and 300 W/mK in the layer direction. Due to its high thermal conductivity, it is used not only as structural ceramics such as insulating fillers, heat dissipation tiles, and refractories, but also as heat dissipation substrates and heat conduction materials for electronic devices that emit a large amount of heat such as high-brightness LEDs. A boron nitride nanotube (BNNT) is a tube connected in a hexagonal lattice structure similar to a carbon nanotube, and is formed by alternately bonding boron and nitrogen atoms at carbon positions of the carbon nanotube. BNNTs have similar thermal conductivity and mechanical properties to CNTs, but are not electrically metallic, and have partial ionic properties due to the difference in electronegativity of boron and nitrogen in the BN bond, resulting in a band gap of ~5-6 eV. Therefore, it is electrically insulating. In addition to this, it has been demonstrated that BNNTs have various unique properties such as thermal stability, piezoelectricity, and high thermal neutron absorption along with high chemical stability.

The alloy is preferably composed of a combination of two or more selected from the group consisting of Ag, Al, Cu, Au, Mg, Cr, Ni, W, Zn, Mo, Ti, Co, In, Fe and Mn, more preferably Preferably, it may be a Cu-Al or Cu-Al-Zn alloy. By using the alloy together, it can have better thermal conductivity.

The Cu-Al alloy preferably contains 20 to 54 mass% of Cu (copper) and 46 to 80 mass% of Al (aluminum), and the Cu-Al-Zn alloy is 45 to 55 mass% of Cu (copper), It is preferable to contain 40 to 50 mass % of Al (aluminum) and 3 to 6 mass % of Zn (zinc).

The polymer resin is preferably at least one selected from the group consisting of phenol resins, epoxy resins, polyester resins, polyimide resins, polyurethane resins, melamine resins, silicone resins, urea resins, acrylic resins and alkyd resins, It is preferable to select and use the composition for heat dissipation according to the intended use. When the composition for heat dissipation is used as an insulating layer of a printed circuit board, it may preferably be a phenol resin, an epoxy resin, a polyester resin, a silicone resin, a urea resin, or a combination thereof, and an epoxy resin for the surface coating of the printed circuit board , a polyurethane resin, a melamine resin, a silicone resin, a urea resin, an alkyd resin, or a combination thereof, wherein the polymer resin serves as a binder to improve adhesion. In addition, when the composition for heat dissipation is used as a sheet of a printed circuit board, it may preferably be a phenol resin, an epoxy resin, or a combination thereof.

In addition, when a thermal conductive grease called thermal grease, thermal paste, or thermal compound is provided, the polymer resin is based on a silicone resin or oil, and the silicone resin/oil contains poly It is preferable to use dimethylsiloxane (polydimethylsiloxane) or polymethylphenylsiloxane (polymethylphenylsiloxane). When providing a thermally conductive adhesive, it is preferable to use it by mixing with various adhesive resins such as acrylic, urethane, epoxy, and rubber.

Examples of the resin are as follows, but not limited thereto.

For example, the phenolic resin may be a phenol-based, xyloc-based, bisphenol A-type or resorcinol-based resin, and the epoxy resin is a bisphenol A-type epoxy resin, a bisphenol F-type epoxy resin, a bisphenol S-type epoxy resin, and a phenol novolak-type resin. Epoxy resin, cresol novolak type epoxy resin, alkylphenol novolak type epoxy resin, bisphenol type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, triglycidyl isocyanate epoxy resin or acyclic epoxy resin, etc. can be used. have. Polyester resin is polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyglycolic acid (PGA), polylactic acid (PLA), poly(3-hydroxybutyrate) (PHB), poly((3- Hydroxybutyrate)-co-(3-hydroxyvalerate))(PHBV), poly((3-hydroxybutyrate)-co-(3-hydroxyhexanoate))(PHBH), poly((3) -hydroxybutyrate)-co-(4-hydroxybutyrate)) (P3/4HB), polybutylene succinate (PBS), polyethylene naphthalate (PEN), and the like. As the polyimide resin, BPDA-PDA (3,3',4,4'-biphenyltetracarboxylic dihydride-p-phenylenediamine) polyimide or PMDA-ODA (3,3',4,4) '-biphenyltetracarboxylic dianhydride-4,4'-oxydianiline) polyimide is exemplified, and as the polyurethane resin, polyester polyol or polyoxytetramethylene polyol is exemplified. The melamine resin includes monomethyl melamine, dimethiol melamine, trimethyl melamine, tetramethyl melamine, pentamethyl melamine, hexamethiol melamine, and the like, and the silicone resin includes polymethylhydrosiloxane, polydimethylsiloxane, Polymethylphenylsiloxane is exemplified. Examples of the urea resin include polyurea and polyurethane resin, and the alkyd resin includes an invertible alkyd resin modified with a condensate of a dibasic acid and a dihydric alcohol or a non-drying fatty acid, and a dibasic acid and a trivalent or higher An invertible alkyd resin which is a condensate of alcohol, etc. can be used.

The dispersant may be triton-x, a cellulose-based dispersant, or a polyvinyl-based dispersant. Examples of the cellulose-based dispersant include alkyl hydroxypropyl cellulose ether, hydroxypropyl methyl cellulose, carboxymethyl cellulose and hydroxyethyl cellulose, and the polyvinyl-based dispersant includes polyvinylpyrrolidone, polyvinyl alcohol and poly An example is vinyl butyral.

Based on 100 parts by weight of the composition for heat dissipation, 8 to 25 parts by weight of the carbon nanotube, 10 to 30 parts by weight of the ceramic, 5 to 15 parts by weight of the alloy, 20 to 40 parts by weight of the polymer resin, and 7 to 22 parts by weight of the dispersant It is preferable to include parts by weight. If it is out of the above range, properties such as thermal conductivity, electrical resistance, adhesion, viscosity, and uniformity of the coating layer may be deteriorated.

In addition, the composition for heat dissipation may further include a solvent and a curing agent, the solvent is for uniform dispersibility, water, an alcohol-based solvent, a ketone-based solvent, an amine-based solvent, an ester-based solvent, an amide-based solvent , a halogenated hydrocarbon-based solvent, an ether-based solvent and one or more selected from the group consisting of a furan-based solvent, wherein the curing agent is added for rapid curing of the heat dissipation coating composition, and an amine-based curing agent, imida It may be any one selected from a sol-based curing agent or an acid anhydride-based curing agent. For example, the amine-based curing agent includes benzyldimethylamine, triethanolamine, triethyl tetraamine, diethylenetriamine, triethyleneamine, dimethylaminoethanol, etc., and the imidazole-based curing agent includes imidazole, isoimi Dazole, 2-methylimidazole, butylimidazole, 2-heptadecenyl-4-methylimidazole, 2-undecenylimidazole, 1-vinyl-2-methylimidazole, 2-heptadecyl imidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-propyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, and the like. In addition, the acid anhydride-based curing agent includes phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, or methylhexahydride Loftalic anhydride and the like are exemplified.

In addition, the composition for heat dissipation may be used as an insulating layer of a printed circuit board of a printed circuit board, a surface coating of a printed circuit board, or a sheet of a printed circuit board.

When the composition for heat dissipation is used as an insulating layer of a printed circuit board, it is preferably formed on the surface of the substrate through physical or chemical surface treatment on the substrate. Examples of the physical surface treatment include sand blasting, dry ice blasting, bead blasting, shot blasting, grinding, and the like. this increases However, if the thickness of the substrate is thin, the material may be deformed or destroyed.

The chemical surface treatment includes degreasing, etching, chemical conversion treatment, anodization film, plasma electrolytic oxidation (PEO), microarc oxidation (MAO), chromate, phosphate film, discharge treatment (plasma), etc., and is used when the substrate is metal. , similarly, the adhesion with the substrate is improved and insulation, heat dissipation, and corrosion resistance are also improved, but the treatment cost is generally higher than the physical surface treatment.

When the composition for heat dissipation is coated on the surface of the substrate, a known method of coating the composition for heat dissipation on the substrate may be selected and used, and non-limiting examples thereof include spray, dip coating, silk screen, roll coating, and dip coating. Alternatively, it may be prepared by coating by a method such as spin coating. In addition, it may be dried by room temperature drying, hot air drying, oven drying, etc. after application.

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following examples are intended to illustrate the present invention, and the scope of the present invention is not limited thereto.

Preparation Example 1. Carbon nanotube surface modification

The surface modification of carbon nanotubes is performed by the following reaction formula.

First, carbon nanotube powder was added to a mixed solution of sulfuric acid and nitric acid in a 3:1 volume ratio, and dispersed by ultrasonication at room temperature for 2 hours, followed by cooling to room temperature. Thereafter, it was washed with a large amount of distilled water while filtering, washed until the pH of the filtered solution became neutral, and then dried.

1-1) In Formula 1, R is NH ₂ if

1,4-phenylene diamine (0.01 mol) was dissolved in 20 ㎖ of 0.22 M HCl aqueous solution, and then stirred while slowly adding 20 ㎖ of _{NaNO 2 (0.011 mol) in an ice bath.} Then, sodium tetrafluoroborate (0.01 M) was added and the reaction was completed and dried to obtain a diazonium salt. 2 g of the diazonium salt, K ₂ S ₂ O ₈ 0.08 g, 0.4 g of the dried carbon nanotubes, and 320 ml of distilled water were mixed, nitrogen was injected, stirred at 85° C. for 12 hours, and then dried to obtain carbon nanotubes with a modified surface.

1-2) When R in Formula 1 is COOH

4-aminobenzoic acid (0.01 mol) was dissolved in 20 ㎖ of 0.22 M HCl aqueous solution, and then stirred while slowly adding 20 ㎖ of _{NaNO 2 (0.011 mol) in an ice bath.} Then, sodium tetrafluoroborate (0.01 M) was added and the reaction was completed and dried to obtain a diazonium salt. 2 g of the diazonium salt, Azobisisobutyronitrile 0.3 g, 0.4 g of the dried carbon nanotube, and 80 ml of acetonitrile were mixed, nitrogen was injected, stirred at 60° C. for 7 hours, and dried to obtain a surface-modified carbon nanotube.

Carbon nanotubes surface-modified with a substituent represented by Formula 2, a substituent represented by Formula 3, and a substituent represented by Formula 4 were purchased from Sigma-Aldrich and used.

It was confirmed that the surface of the surface-modified carbon nanotube was successfully modified according to the evaluation method described in Korean Patent No. 10-1856665, and the surface-modified carbon nanotube, ceramic, and alloy were uniformly dispersed together with the resin to form the composition. It was confirmed that the acidity and stability were excellent. Considering that the dispersion force of alloys and ceramics, which could not be observed in carbon nanotubes without surface modification, occurred, amines or carboxylic acids introduced by surface modification and alloys and ceramics form weak hydrogen bonds or chelating to evenly disperse. It can be seen that the phenomenon has occurred.

Example 1. Preparation of composition for heat dissipation

15 parts by weight of carbon nanotubes surface-modified by the formula 1 (R = -COOH), 20 parts by weight of ceramic (boron nitride), 7 parts by weight of alloy (Cu-Al-Zn alloy), polymer resin (bisphenol A type epoxy resin) ) 27 parts by weight, 21 parts by weight of a solvent (methyl ethyl ketone:toluene 1:1 (v/v)), mixed and stirred for 3 hours, followed by 8 parts by weight of a dispersant (Triton X-100) and an amine curing agent (polypropylene) glycoldiamine) was added and stirred for 2 hours.

Example 2. Preparation of composition for heat dissipation

It was prepared in the same manner as in Example 1, except that the carbon nanotube surface-modified by Chemical Formula 2 was used instead of the carbon nanotube surface-modified by Chemical Formula 1 above.

Example 3. Preparation of composition for heat dissipation

It was prepared in the same manner as in Example 1, except that the carbon nanotubes surface-modified by Chemical Formula 3 were used instead of the carbon nanotubes surface-modified by Chemical Formula 1 above.

Example 4. Preparation of composition for heat dissipation

It was prepared in the same manner as in Example 1, except that the carbon nanotube surface-modified by Chemical Formula 4 (R' = -COOH) was used instead of the carbon nanotube surface-modified by Chemical Formula 1 above.

Example 5. Preparation of composition for heat dissipation

It was prepared in the same manner as in Example 1, except that the carbon nanotube surface-modified by _{Chemical Formula 4 (R' = -CONH 2} ) was used instead of the carbon nanotube surface-modified by Chemical Formula 1 above.

Example 6. Preparation of composition for heat dissipation

Prepared in the same manner as in Example 1, except that the carbon nanotube surface-modified by _{Chemical Formula 4 (R' = -CONH(CH 2} ) ₁₇ CH ₃ ) was used instead of the carbon nanotube surface-modified by Chemical Formula 1 did.

Comparative Example 1

It was prepared in the same manner as in Example 1, except that ordinary carbon nanotubes with non-modified surfaces were used instead of surface-modified carbon nanotubes.

Comparative Example 2

It was prepared in the same manner as in Example 1, except that ceramic was not added.

Comparative Example 3

It was prepared in the same manner as in Example 1, except that no alloy was added.

Test Example 1. Evaluation of heat dissipation performance

After coating the composition for heat dissipation according to Examples 1 to 6 and Comparative Examples 1 to 3 to a thickness of 20 to 30 μm on a copper substrate, an LED is mounted on the coated substrate, and a thermocouple is attached to measure the temperature change over time. did. Power was supplied to 20W, the results are shown in Table 1 and Figure 2 below.

Temperature over time (°C) 0 minutes 10 minutes 30 minutes 1 hours 4 hours Example 1 35.2 44.5 46.8 48.3 51.4 Example 2 35.2 46.7 49.7 52.2 54.8 Example 3 35.1 40.6 43.9 45.0 46.9 Example 4 35.2 43.8 46.5 49.1 51.2 Example 5 35.1 43.0 47.1 48.9 51.0 Example 6 35.2 44.1 47.1 47.8 49.2 Comparative Example 1 35.2 54.2 57.1 63.2 69.5 Comparative Example 2 35.2 55.6 58.6 62.8 72.0 Comparative Example 3 35.1 54.7 57.9 60.9 68.4

Referring to Table 1, Examples 1 to 6 had an average temperature of 50.8° C. after 4 hours, whereas Comparative Examples 1 to 3 exhibited a high average temperature of 70° C., so the Example showed a temperature change compared to the Comparative Example It can be seen that the heat dissipation performance is excellent. Among them, Example 3 showed the best result at 46.9°C. Comparing Examples 1 to 6 with Comparative Example 1, Examples 1 to 6 use modified carbon nanotubes, Comparative Example 1 uses unmodified carbon nanotubes, and in Examples 1 to 6, carbon By modifying the surface of the nanotubes, the dispersion power is improved compared to the unmodified carbon nanotubes, and it is considered that the carbon nanotubes in the coating composition are evenly dispersed, thereby exhibiting excellent performance. On the other hand, in Comparative Examples 2 and 3, ceramics or alloys are not added, and it can be seen that they show lower heat dissipation properties than Examples 1 to 6 in which carbon nanotubes, ceramics, and alloys are all included. It can be confirmed that nanotubes, ceramics, and alloys are used together to show a synergistic effect and thus have better heat dissipation performance.

Test Example 2. Evaluation of thermal radiation efficiency

After coating the composition for heat dissipation according to Examples 1 to 6 and Comparative Examples 1 to 3 to a thickness of 20 to 30 μm on a copper substrate having a width, length, and height of 35 mm × 35 mm × 1.5 mm, the coated substrate was applied After locating in the center of an acrylic chamber of 32 cm × 30 cm × 30 cm in width, length, and height, respectively, the temperature inside the chamber and the temperature of the copper substrate were adjusted to 25±0.2°C. Thereafter, a test specimen was prepared by attaching an LED of 20 mm × 20 mm in width and length to a copper substrate as a heat source using TIM (thermal conductive tape: 1W/mk). Heat was generated by applying an input power of 2.1W (DC 3.9V, 0.53A) to the heat source of the prepared specimen, and after maintaining it for 90 minutes, the temperature of the upper 5 cm point in the center of the copper substrate was measured to evaluate the thermal emissivity. . The thermal emissivity was calculated according to Equation 1 below based on the temperature measured under the same conditions for the substrate not provided with the heat dissipation coating layer.

[Equation 1]

Thermal radiation efficiency (%) = {(Temperature (°C) at 5 cm above the center of the copper substrate/temperature (°C) at 5 cm above the center of the uncoated copper substrate (°C)-1}×100 (%)

Thermal radiation efficiency (%) Example 1 92.6 Example 2 88.7 Example 3 96.5 Example 4 93.0 Example 5 93.0 Example 6 93.2 Comparative Example 1 61.8 Comparative Example 2 68.4 Comparative Example 3 72.2

Referring to Table 2, it can be confirmed that Examples 1 to 6 show excellent heat radiation efficiency, whereas Comparative Examples 1 to 3 showed lower heat radiation efficiency compared to Examples. In addition, it can be seen that the result of Example 3 is similar to the result of Test Example 1 as it shows the highest heat radiation efficiency of 96.5% among the Examples. As a result, it can be seen that the heat radiation efficiency varies depending on whether the carbon nanotubes are surface-modified and whether ceramics and alloys are added. It was confirmed that it can be performed.

Test Example 3. Insulation performance evaluation

After coating the composition for heat dissipation according to Examples 1 to 6 and Comparative Examples 1 to 3 to a thickness of 20 to 30 μm on a copper substrate, resistance value measurement was performed.

Resistance (Ω/sq.) Example 1 6.4×10 ¹² Example 2 2.1×10 ¹³ Example 3 8.1×10 ¹² Example 4 5.9×10 ¹² Example 5 6.3×10 ¹² Example 6 6.2×10 ¹² Comparative Example 1 2.5×10 ⁹ Comparative Example 2 1.8×10 ⁷ Comparative Example 3 7.2×10 ⁹

As shown in Table 3, it can be seen that the electrical resistance values of Examples 1 to 6 are much superior to those of Comparative Examples. On the other hand, Comparative Examples 1 to 3 show a lower electrical resistance value than that of Examples, and among them, Comparative Example 2 does not contain boron nitride having excellent insulation performance, so it is considered to show a lower resistance value than other Comparative Examples do.

Test Example 4. Adhesion evaluation

In order to test the adhesion according to Examples 1 to 6 and Comparative Examples 1 to 3, lines were drawn at intervals of 5 mm in width and length on the steel plate to make a total of 100 squares, and then the sample was applied to a thickness of 20 to 30 μm. After the tape was peeled off, adhesion was evaluated by the number of remaining squares. When peeling did not occur, adhesion was set as excellent, when peeling less than 5% was good, and when peeling more than 5% was bad, the evaluation criteria were set.

adhesive Example 1 Great Example 2 Great Example 3 Great Example 4 Great Example 5 Great Example 6 Great Comparative Example 1 bad Comparative Example 2 Good Comparative Example 3 Good

As shown in Table 4, in Examples 1 to 6, the coating layer did not peel off even after the tape was peeled, so the adhesion was very good, and Comparative Examples 2 and 3 showed relatively good adhesion. However, Comparative Example 1 had poor adhesion, which is thought to be due to the lowered dispersibility by using unmodified carbon nanotubes. On the other hand, Examples 1 to 6, Comparative Examples 2 and 3 showed excellent adhesion due to the surface-modified carbon nanotubes.

As described above, it was confirmed that the composition for heat dissipation according to the present invention has excellent heat dissipation, heat radiation, electrical resistance, and adhesive performance, thereby providing excellent heat dissipation and insulation performance when coated on the surface of a printed circuit board to form a heat dissipation coating layer can be expected to have In addition, by using this as an insulating layer, it is possible to obtain a printed circuit board having excellent heat dissipation performance. In view of this, in the present invention, a printed circuit board having excellent heat dissipation performance in the substrate itself was manufactured by using the composition for heat dissipation as a sheet of a printed circuit board.

Example 7. Fabrication of a printed circuit board comprising a composition for heat dissipation as a sheet

12 parts by weight of the carbon nanotubes surface-modified by the formula 1 (R = -COOH), 18 parts by weight of ceramic (boron nitride), 10 parts by weight of alloy (Cu-Al-Zn alloy), 10 parts by weight of dispersant (Triton X-100) After adding 12 parts by weight of a solvent (methyl ethyl ketone:toluene 1:1 (v/v)), mixing and stirring for 3 hours, 35 parts by weight of an epoxy resin and 2 parts by weight of an amine-based curing agent (polypropylene glycol diamine) are mixed And after stirring to form a sheet in a semi-hardened state, the substrate was prepared by molding it through hot press processing.

Example 8. Manufacturing of a printed circuit board comprising a composition for heat dissipation as a sheet

It was prepared in the same manner as in Example 7, except that the carbon nanotubes surface-modified by Chemical Formula 2 were used instead of the carbon nanotubes surface-modified by Chemical Formula 1 above.

Example 9. Manufacturing of a printed circuit board comprising a composition for heat dissipation as a sheet

It was prepared in the same manner as in Example 7, except that the carbon nanotubes surface-modified by Chemical Formula 3 were used instead of the carbon nanotubes surface-modified by Chemical Formula 1 above.

Example 10. Manufacturing of a printed circuit board comprising a composition for heat dissipation as a sheet

It was prepared in the same manner as in Example 7, except that the carbon nanotube surface-modified by Chemical Formula 4 (R' = -COOH) was used instead of the carbon nanotube surface-modified by Chemical Formula 1 above.

Example 11. Manufacturing of a printed circuit board comprising a composition for heat dissipation as a sheet

It was prepared in the same manner as in Example 7, except that the carbon nanotube surface-modified by _{Chemical Formula 4 (R' = -CONH 2} ) was used instead of the carbon nanotube surface-modified by Chemical Formula 1 above.

Example 12. Manufacturing of a printed circuit board comprising a composition for heat dissipation as a sheet

Prepared in the same manner as in Example 7, except that the carbon nanotube surface-modified by _{Chemical Formula 4 (R' = -CONH(CH 2} ) ₁₇ CH ₃ ) was used instead of the carbon nanotube surface-modified by Chemical Formula 1 did.

Test Example 5. Evaluation of heat dissipation performance of printed circuit boards

The heat dissipation characteristics when the printed circuit boards prepared in Examples 7 to 12 were applied to an LED lighting device were evaluated. That is, when DC 10.2V and 0.684A were applied in a state in which a printed circuit board was fabricated with a size of 10 cm×10 cm×3 mm, the temperature change with time is shown. In addition, an existing metal PCB (aluminum) was used as Comparative Example 4.

time (min) Example 7 Example 8 Example 9 Example 10 Example 11 Example 12 Comparative Example 4 0 18.6 18.5 18.5 18.4 18.5 18.4 18.5 5 24.9 28.1 22.5 25.0 25.4 25.0 38.2 10 36.5 42.6 36.2 39.8 37.5 37.2 53.7 30 46.5 52.7 44.8 48.4 46.3 46.5 60.9 60 51.9 55.2 50.0 53.2 52.7 52.6 68.4 90 52.6 56.1 51.1 54.6 53.4 53.9 70.2 150 53.7 56.9 51.9 55.1 54.5 54.2 74.2 200 54.9 57.7 52.6 55.2 55.3 55.0 79 300 55.5 58.8 52.7 55.8 55.7 55.5 79.4

As shown in Table 5, it can be seen that the printed circuit board manufactured with the composition for heat dissipation according to the present invention has superior heat dissipation performance compared to an aluminum plate that is a conventionally used metal PCB. All of Examples 7 to 12 showed exceptionally excellent performance, and among them, Example 9 had the best heat dissipation effect at 52.7°C. Accordingly, it may be used as a printed circuit board material having a more improved heat dissipation capability instead of the conventional metal PCB.

In summary, the composition for heat dissipation according to the present invention has excellent thermal conductivity and insulation, and has good adhesion, so it can be used as a surface coating for heat dissipation of a printed circuit board, and is used as an insulating layer between the substrate and the circuit layer It is possible to improve the heat dissipation performance of the printed circuit board. In addition, it may be used as a sheet of a printed circuit board to impart heat dissipation performance to the substrate itself, thereby manufacturing a printed circuit board having excellent heat dissipation performance. In addition, although a printed circuit board has been described as an example in the present invention, it can be applied and used not only to a printed circuit board but also to various electrical and electronic products, and can contribute to improving the performance and lifespan of, for example, LEDs.

On the other hand, the composition for heat dissipation can be used in various ways in the LED lighting device of the present invention.

For example, the composition for heat dissipation may be used as the insulating layer 200 of the bar substrate 10 having an excellent heat conduction effect.

In addition, the composition for heat dissipation has an excellent insulating effect, and has excellent dispersibility, solution stability, and adhesion, so that it can be applied to the bottom surface of the substrate 10 and used as a material for the interfacial layer 400 .

In addition, the composition for heat dissipation may be used for surface coating on the substrate 10 for a bar LED lighting device having an electromagnetic wave shielding effect and excellent heat dissipation performance.

In particular, since the composition for heat dissipation has excellent heat conduction effect, insulating effect and dispersibility, it can be used as a heat transfer material 410 and filled in the heat transfer hole 210 or the through hole 121 .

That is, when the heat dissipation composition is filled in the heat transfer hole 210 or the through hole 121, the heat dissipation composition is filled in the heat transfer hole 210 or the through hole 121 in powder form. , since the composition for heat dissipation can be cured through a sintering process, there is an advantage that a heat conductive material can be quickly and conveniently filled in the heat transfer hole 210 or the through hole 121 .

On the other hand, the composition for heat dissipation having the above composition maximizes the heat transfer effect, and of course, it can be applied to a conventional substrate for an LED lighting device other than the substrate for an LED lighting device having the configuration shown in FIGS. 1 to 5 .

For example, the LED lighting device according to the present invention includes: a substrate 10 for an LED lighting device on which one or more LED devices 20 are installed on the upper surface; It may include a heat dissipation member 30 coupled to the bottom surface of the substrate 10 to dissipate heat generated by the LED device 20 .

And it is characterized in that between the substrate 10 and the heat dissipation member 30, an interface layer 400 of an electrically insulating material is formed while transferring the heat generated by the LED device 20.

The substrate 10 for the LED lighting device is a configuration in which one or more LED elements 20 are installed on the upper surface, and any substrate on which one or more LED elements 20 can be installed on the upper surface is possible.

For example, the substrate 10 for the LED lighting device includes an electric application pattern 110 electrically connected to each of the anode 21 and the cathode 22 of the LED element 20 , and an electric application pattern 110 , and a copper pattern layer 100 that is electrically separated and includes a heat dissipation pattern 120 that receives heat from the heat dissipation unit 23 of the LED element 20; an insulating layer 200 of an electrically insulating material coupled to the bottom surface of the copper pattern layer 100; It may include a reinforcing layer 300 made of an aluminum material coupled to the bottom surface of the insulating layer 200 .

Since the copper pattern layer 100 is the same as or similar to the above-described copper pattern layer 100, a detailed description thereof will be omitted. However, the copper pattern layer 100 may be formed on the surface of the insulating layer 200 of a thin film to be described later by a printing method such as silk screen.

The insulating layer 200 is the same as or similar to that described above and the insulating layer 200 , and thus a detailed description thereof will be omitted.

However, the insulating layer 200 may have a minimum thickness capable of insulating the copper pattern layer 100 .

On the other hand, similar to the structure of the substrate 10 for an LED lighting device described with reference to FIGS. 1 to 5 described above, the insulating layer 200 and the reinforcing layer 300 transfer the heat generated by the LED device 20 to the lower side. The heat transfer hole 210 filled with the heat transfer material 410 may be formed vertically through the hole.

As described above, the heat transfer hole 210 is formed through the insulating layer 200 and the reinforcing layer 300 so as to transfer the heat generated by the LED device 20 to the lower side, and the heat transfer material 410 is filled. As a through hole, it is preferably formed to be connected to the above-described copper pattern layer 100 .

Here, of course, the heat transfer hole 210 may be formed through the copper pattern layer 100 .

In addition, the heat transfer material 410 may have the same material as the interface layer 400 .

The interfacial layer 400 may be formed by applying the interfacial layer 400 to the bottom surface of the substrate 10 when the heat transfer material 410 is filled in the heat transfer hole 210 .

The reinforcing layer 300 is formed on the surface of the insulating layer 200, is coupled to the bottom surface of the insulating layer 200, and is made of aluminum, and has various thicknesses such as 0.5T, 1.0T, 1.5T, etc. in consideration of the heat dissipation effect. can have

The heat dissipation member 30 is coupled to the bottom surface of the substrate 10 to dissipate heat generated by the LED device 20 , and any material capable of dissipating the heat generated from the LED device 20 . Also, it may be made of a material such as aluminum or an aluminum alloy.

Meanwhile, in the heat dissipation member 30 , a plurality of heat dissipation fins may be formed in the substrate 10 to be fixedly coupled by screws or the like, and to increase the heat dissipation effect in the remaining portion.

In addition, the heat dissipation member 30 may include a coupling plate to which the substrate 10 is coupled and a heat dissipation block coupled to the coupling plate to maximize heat dissipation.

Here, the heat dissipation block may have various configurations such as a heat sink and a heat dissipation fin, and may have various cooling methods such as air cooling and water cooling.

Meanwhile, the interface layer 400 is filled between the substrate 10 and the heat dissipation member 30 to transfer heat generated from the LED device 20 and is an electrically insulating material, and is formed of a heat dissipation composition having the composition described above. can be

The above description is merely illustrative of the present invention, and various modifications will be possible without departing from the essential characteristics of the present invention by those of ordinary skill in the art to which the present invention pertains. Accordingly, the embodiments disclosed in this specification are intended to illustrate, not to limit the present invention, and the spirit and scope of the present invention are not limited by these embodiments. The protection scope of the present invention should be construed by the following claims, and all technologies within the scope equivalent thereto should be construed as being included in the scope of the present invention.

10: substrate 20: LED element
30: heat dissipation member

Claims (19)

As a substrate 10 for an LED lighting device on which one or more LED elements 20 are installed on the upper surface,
The electric application pattern 110 electrically connected to each of the anode 21 and the cathode 22 of the LED element 20 , and the heat dissipation part of the LED element 20 electrically separated from the electric application pattern 110 . a copper pattern layer 100 including a heat dissipation pattern 120 receiving heat from (23);
An electrical insulating material coupled to the bottom surface of the copper pattern layer 100 and having a heat transfer hole 210 filled with a heat transfer material 410 to transfer the heat generated from the LED element 20 downward. Including an insulating layer 200 of
The electrical application pattern 110 and the heat dissipation pattern 120 are formed by etching a copper plate,
The electricity application pattern 110 has different LED elements 20 at both ends corresponding to the first electricity application patterns 111 and 112 to which power having different polarities are applied and the first electricity application patterns 111 and 112 . It includes a plurality of second electricity application patterns 113 that are installed,
The heat dissipation pattern 120 is formed to surround the electricity application pattern 110,
The insulating layer 200 includes a composition for heat dissipation,
The composition for heat dissipation is a composition for heat dissipation comprising a surface-modified carbon nanotube, a ceramic, an alloy, a polymer resin and a dispersant,
The surface of the carbon nanotube is modified with a substituent represented by the following formula (1), a substituent represented by the following formula (2), a substituent represented by the following formula (3), or a substituent represented by the following formula (4),
The alloy is a Cu-Al-Zn alloy comprising 45 to 55 mass% of Cu (copper), 40 to 50 mass% of Al (aluminum), and 3 to 6 mass% of Zn (zinc),
8 to 25 parts by weight of the carbon nanotube, 10 to 30 parts by weight of the ceramic, 5 to 15 parts by weight of the alloy, 20 to 40 parts by weight of the polymer resin, and 7 to 22 parts by weight of the dispersant based on 100 parts by weight of the heat dissipation composition A substrate for an LED lighting device comprising a part.

{In Formulas 1 to 4,
1) R is -COOH, -B(OH) ₂ , -OH, -NH ₂ or -SH,
2) n is an integer from 0 to 20,
3) x and y are each independently an integer from 1 to 10,
4) R' is -COOH, -CONH ₂ or -CONH(CH ₂ ) ₁₇ CH ₃ } The method according to claim 1,
In the heat dissipation pattern 120 , a through hole 121 having the same or smaller size as the heat transfer hole 210 is formed at a position corresponding to the heat transfer hole 210 ,
The through hole 121 is a substrate for an LED lighting device, characterized in that the heat transfer material 410 is filled. The method according to claim 1,
The heat transfer material 410 is
When the heat transfer hole (210) is filled, the substrate for an LED lighting device, characterized in that it is applied to at least a part of the bottom surface of the substrate. The method according to claim 1,
The heat transfer material 410 is a substrate for an LED lighting device, characterized in that silver The method according to claim 1,
The heat transfer material (410) is a substrate for an LED lighting device, characterized in that the pin member inserted into the heat transfer hole (210). The method according to claim 1,
The copper pattern layer 100,
The substrate for an LED lighting device, characterized in that the electrical application pattern (110) and the heat dissipation pattern (120) are formed by etching while the copper plate is attached to the insulating layer (200). The method according to claim 1,
The substrate for an LED lighting device, characterized in that it further comprises at least one reinforcing layer (300) coupled to the bottom surface of the insulating layer (200) to prevent bending. 8. The method of claim 7,
The reinforcing layer 300 is a substrate for an LED lighting device, characterized in that it has a FR-4 or copper material. 8. The method of claim 7,
The reinforcing layer 300 includes a first reinforcing layer 310 made of an insulating material coupled to the bottom of the insulating layer 200 and a second reinforcing layer 320 made of a copper coupled to the bottom of the first reinforcing layer 310 . A substrate for an LED lighting device comprising a. A substrate 10 for an LED lighting device according to any one of claims 1 to 9;
one or more LED elements 20 mounted on the copper pattern layer 100 formed on the substrate 10 for the LED lighting device;
and a heat dissipation member (30) coupled to the bottom surface of the substrate (10) to dissipate heat generated by the LED device (20). 11. The method of claim 10,
LED lighting device, characterized in that between the substrate (10) and the heat dissipation member (30), an interface layer (400) of an electrically insulating material is formed while transferring the heat generated by the LED device (20). 12. The method of claim 11,
The interface layer 400 is an LED lighting device, characterized in that it has the same material as the heat transfer material (410). 12. The method of claim 11
The interface layer (400), LED lighting device, characterized in that the heat transfer material (410) is formed by coating the bottom surface of the substrate (10) when the heat transfer hole (210) is filled. a substrate 10 for an LED lighting device on which one or more LED elements 20 are installed on the upper surface;
and a heat dissipation member 30 coupled to the bottom surface of the substrate 10 to dissipate heat generated by the LED device 20,
Between the substrate 10 and the heat dissipation member 30, an interface layer 400 of an electrically insulating material is formed while transferring the heat generated by the LED device 20,
The interfacial layer 400 includes a composition for heat dissipation,
The composition for heat dissipation is a composition for heat dissipation comprising a surface-modified carbon nanotube, a ceramic, an alloy, a polymer resin and a dispersant,
The surface of the carbon nanotube is modified with a substituent represented by the following formula (1), a substituent represented by the following formula (2), a substituent represented by the following formula (3), or a substituent represented by the following formula (4),
The alloy is a Cu-Al-Zn alloy comprising 45 to 55 mass% of Cu (copper), 40 to 50 mass% of Al (aluminum), and 3 to 6 mass% of Zn (zinc),
8 to 25 parts by weight of the carbon nanotube, 10 to 30 parts by weight of the ceramic, 5 to 15 parts by weight of the alloy, 20 to 40 parts by weight of the polymer resin, and 7 to 22 parts by weight of the dispersant based on 100 parts by weight of the heat dissipation composition LED lighting device comprising a part.

{In Formulas 1 to 4,
1) R is -COOH, -B(OH) ₂ , -OH, -NH ₂ or -SH,
2) n is an integer from 0 to 20,
3) x and y are each independently an integer from 1 to 10,
4) R' is -COOH, -CONH ₂ or -CONH(CH ₂ ) ₁₇ CH ₃ } 15. The method of claim 14,
The substrate 10 for the LED lighting device,
The electric application pattern 110 electrically connected to each of the anode 21 and the cathode 22 of the LED element 20 , and the heat dissipation part of the LED element 20 electrically separated from the electric application pattern 110 . a copper pattern layer 100 including a heat dissipation pattern 120 receiving heat from (23);
an insulating layer 200 of an electrically insulating material coupled to a bottom surface of the copper pattern layer 100;
LED lighting device comprising a reinforcing layer (300) made of an aluminum material coupled to the bottom surface of the insulating layer (200). 16. The method of claim 15,
The insulating layer 200 and the reinforcing layer 300,
The LED lighting device, characterized in that the heat transfer hole (210) filled with the heat transfer material (410) is formed through the top and bottom so as to transfer the heat generated by the LED element (20) to the lower side. 17. The method of claim 16,
The heat transfer material (410), LED lighting device, characterized in that having the same material as the interface layer (400). 18. The method of claim 17,
The interface layer (400), LED lighting device, characterized in that the heat transfer material (410) is formed by coating the bottom surface of the substrate (10) when the heat transfer hole (210) is filled. delete

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