KR102638854B1 - Board for LED lighting apparatus and LED lighting apparatus having the same - Google Patents

Abstract

The present invention relates to an LED lighting device, and more specifically, to a substrate for an LED lighting device in which an LED element is installed on the upper surface and emits light, and to an LED lighting device.
The present invention is a substrate 10 for an LED lighting device on which a plurality of LED elements 20 are installed on the upper surface, and is electrically connected to each of the anode 21 and cathode 22 of the LED element 20 and electrically A copper pattern layer 100 including a plurality of separated electrical application patterns 110; A PCB layer 200 coupled to the bottom of the copper pattern layer 100; It includes a plurality of auxiliary heat dissipation pattern layers 130 that are coupled to the bottom of the PCB layer 200 to receive heat from the copper pattern layer 100 and dissipate heat, and the PCB layer 200 is the PCB layer ( 200), the heat generated by the LED element 20 is transferred from the copper pattern layer 100 to the auxiliary heat dissipation pattern layer 130 by the heat transfer unit 410 provided up and down, and the plurality of A substrate for an LED lighting device is disclosed, wherein the auxiliary heat dissipation pattern layers 130 correspond to each of the heat transfer units 410 and are electrically separated from each other.

Description

A board for an LED lighting device specialized for high voltage and high heat, an LED lighting device having the same {Board for LED lighting apparatus and LED lighting apparatus having the same}

The present invention relates to an LED lighting device, and more specifically, to a substrate for an LED lighting device in which an LED element is installed on the upper surface and emits light, and to an LED lighting device.

LED devices (Light Emitting Diodes) are attracting attention in the field of lighting technology due to their low power consumption, high luminous efficiency, semi-permanent lifespan, fast response speed, and environmentally friendly characteristics.

However, LED devices have the characteristic of consuming power as heat, so there is a problem in that the higher the power is applied to the LED device, the more heat is generated in the device.

Due to the heat generated from the LED device, the luminous efficiency of the LED device decreases, and this also affects reliability, causing the problem that the lifespan of the device is reduced as the junction temperature rises.

In other words, the heat generated when driving an LED device needs to be dissipated efficiently, which is a very important issue in LED device performance.

Meanwhile, as a structure for dissipating heat generated from LED devices, a structure in which a copper pattern for dissipating heat generated from LED devices is formed on the surface of the PCB has been proposed, as in Patent Document 1.

The substrate for an LED lighting device of Patent Document 1 has a heat dissipation pattern that receives heat from a heat dissipation portion formed on the bottom of the LED device among the copper pattern layers and dissipates heat, thereby effectively dissipating heat generated from the LED device.

However, the substrate for the LED lighting device of Patent Document 1 operates by applying a relatively high voltage when high output is required, such as a floodlight for sports, and the heat dissipation pattern is adjacent, so the insulation distance is short, resulting in a short circuit (see FIG. 11). ) or the LED element may be damaged.

In particular, when a high voltage is applied to an LED lighting device using the substrate for an LED lighting device of Patent Document 1, especially the substrate shown in FIG. 12 (a plurality of LED elements are installed in parallel in two serial lines), the abnormal voltage There is a problem in that a short circuit occurs due to the formation of , and after the LED elements (PKG) of one series line (upper side in the drawing) are damaged, the remaining serial lines (lower side in the drawing) are damaged.

For reference, in Figure 12, the yellow part indicates normal operation, the color indication such as the main navigation indicates abnormal operation, and the part without color indication indicates damage.

In other words, the DC voltage and power consumption are determined by the series and parallel arrangement of the LED elements. When the lighting device is turned on/off, a short circuit occurs in the LED elements due to a surge voltage and a current is lost in the internal circuit connecting the LED elements. The phenomenon of brushing occurs and the LED elements are damaged due to overcurrent.

On the other hand, the substrate for the LED lighting device of Patent Document 1 has a heat transfer hole (shown as 210) formed through the substrate, as shown in FIGS. 4A and 4B of Patent Document 1, and a conductive material formed on the bottom of the substrate. A structure that transfers heat from the heat dissipation pattern (shown at 120) to the second reinforcing layer (shown at 120) by filling it with a heat transfer material (shown at 410 in Patent Document 1) for heat transfer to the second reinforcing layer (shown at 320) made of phosphorus copper. has.

However, when a relatively high voltage such as 50V is applied to the LED lighting device having the structure of Patent Document 1, a large voltage difference is formed between the electric application pattern (shown as 110) formed on the upper surface of the substrate and the second reinforcement layer, as described above. Likewise, there is a problem in that the insulation distance is short, causing a short circuit (see FIG. 11) or damaging the LED element.

(Patent Document 1) KR 10-2259873 B1

The purpose of the present invention is to solve the problems of the prior art as described above, and maximize the lifespan and energy efficiency of the LED device by effectively dissipating heat generated from the LED device and solving the insulation problem even when high voltage is applied. The object is to provide a substrate for an LED lighting device and an LED lighting device having the same.

The present invention was created to achieve the object of the present invention as described above, and the present invention is a substrate 10 for an LED lighting device on which a plurality of LED elements 20 are installed on the upper surface, wherein the LED elements 20 a copper pattern layer 100 including a plurality of electrically separated electrical application patterns 110 that are electrically connected to each of the anode 21 and the cathode 22; A PCB layer 200 coupled to the bottom of the copper pattern layer 100; It includes a plurality of auxiliary heat dissipation pattern layers 130 that are coupled to the bottom of the PCB layer 200 to receive heat from the copper pattern layer 100 and dissipate heat, and the PCB layer 200 is the PCB layer ( 200), the heat generated by the LED element 20 is transferred from the copper pattern layer 100 to the auxiliary heat dissipation pattern layer 130 by the heat transfer unit 410 provided up and down, and the plurality of A substrate for an LED lighting device is disclosed, wherein the auxiliary heat dissipation pattern layers 130 correspond to each of the heat transfer units 410 and are electrically separated from each other.

The LED device 20 includes electrodes of an anode 21 and a cathode 22, and a heat dissipation portion 23 that radiates heat generated from the LED device 20, and the copper pattern layer 100 is , It is electrically separated from the electrical application pattern 110 and includes a plurality of heat dissipation patterns 120 coupled to each heat dissipation portion 23 of the LED element 20, and the electrical application pattern 110 includes the It is electrically connected to the electrode, and the auxiliary heat dissipation pattern layer 130 is arranged to correspond to each of the heat dissipation patterns 120, and is connected to the heat dissipation pattern 120 by the heat transfer unit 410 to form the heat dissipation pattern 120. Heat can be transferred from (120).

The auxiliary heat dissipation pattern layer 130 may be formed by overlapping the shapes of the heat dissipation pattern 120 vertically.

The heat dissipation pattern 120 may be formed in plurality with a preset separation distance (L1, L2) from the adjacent heat dissipation pattern 120 and the electric application pattern 110 corresponding to each LED element 20.

The horizontal distance between the heat dissipation pattern 120 and the adjacent heat dissipation pattern 120 corresponding to each LED element 20 is referred to as the first horizontal distance L1, and the electrical application pattern to which the heat dissipation pattern 120 is adjacent ( When the horizontal distance formed by 110) is referred to as the second horizontal distance (L2), the first horizontal distance (L1) may be formed to be larger than the second horizontal distance (L2).

The plurality of electric application patterns 110 and the plurality of heat dissipation patterns 120 may be arranged so that the plurality of LED elements 20 form one or more serial connections.

The LED element 20 includes electrodes of an anode 21 and a cathode 22, the electric application pattern 110 is electrically connected to each of the electrodes, and the auxiliary heat dissipation pattern layer 130 is , is disposed in correspondence with each of the heat dissipation electric application patterns 110 connected to one of the anode 21 and cathode 22 of the LED element 20, and the heat dissipation is performed by the heat transfer unit 410. It is connected to the electrical application pattern 110 for heat dissipation and can receive heat from the electrical application pattern 110 for heat dissipation.

The auxiliary heat dissipation pattern layer 130 may be formed by overlapping the shapes of the heat dissipation electric application pattern 110 vertically.

The electrical application patterns 110 connected to the cathode and anode of each LED element 20 are arranged in a double row, and the horizontal distance formed by the adjacent electrical application patterns 110 in the same row is referred to as the second horizontal distance L2. And, when the horizontal distance formed by a pair of electrical application patterns 110 in adjacent rows is referred to as the first horizontal distance (L1), the first horizontal distance (L1) is formed to be greater than the second horizontal distance (L2). It can be.

When the applied voltage is greater than 50V, the first horizontal distance (L1) is preferably greater than 0.381mm.

The copper pattern layer 100 may be formed by etching while a copper plate is attached to the PCB layer 200.

The auxiliary heat dissipation pattern layer 130 may be made of copper.

The auxiliary heat dissipation pattern layer 130 includes a first reinforcing layer 310 made of an insulating material coupled to the bottom of the PCB layer 200, and a second reinforcing layer made of copper bonded to the bottom of the first reinforcing layer 310. It may include (320).

The present invention also provides a substrate 10 for an LED lighting device having the above configuration; A plurality of LED elements (20) mounted on the copper pattern layer (100) formed on the LED lighting device substrate (10); Disclosed is an LED lighting device comprising a heat dissipation member 30 coupled to the bottom of the substrate 10 and dissipating heat generated from the LED element 20.

A thermally conductive interface layer 400 made of an electrical insulating material may be formed between the substrate 10 and the heat dissipation member 30 while transferring heat generated by the LED device 20.

The present invention also provides a substrate 10 for an LED lighting device having the above configuration; Disclosed is an LED lighting device including a plurality of LED elements (20) installed on the upper surface of the LED lighting device substrate (10).

The substrate for an LED lighting device according to the present invention, and the LED lighting device having the same, effectively dissipate heat generated from the LED device by increasing heat exchange with the heat dissipation portion formed in the LED device, thereby maximizing the lifespan and energy efficiency of the LED device. There are benefits to this.

In particular, by dividing the heat dissipation pattern made of copper that is connected to the heat dissipation part of the LED device, that is, the slug, to each LED device, the heat dissipation effect is maximized and the lifespan of the LED device can be improved to solve insulation problems even when high voltage is applied. There is an advantage in maximizing energy efficiency.

Furthermore, the substrate for an LED lighting device according to the present invention, and the LED lighting device having the same, have a heat dissipation structure that can maximize the heat dissipation effect, so that they can operate stably and extend the lifespan despite high voltage and high heat. There is an advantage.

In addition, the substrate for an LED lighting device according to the present invention, and the LED lighting device having the same, receive heat from the copper pattern layer containing the electric application pattern on which the LED elements are mounted by a heat transfer part penetrating the substrate and dissipate heat. By providing an auxiliary heat dissipation member on the bottom of the substrate body, there is an advantage in that heat generated from the LED device can be effectively dissipated.

In particular, the auxiliary heat dissipation member is installed in an electrically separated state corresponding to each heat transfer unit, so that multiple LED elements are connected in series and the applied voltage for operating the multiple LED elements is relatively large. Damage to the substrate can be prevented by avoiding high voltage formed between the member and the electrical application pattern.

In particular, the LED lighting device according to the present invention is DC 280V (DC 280V), which is used as a relatively high voltage compared to 24 ~ 36Vdc (indoor lighting) and 12 ~ 48Vdc (outdoor (landscape) lighting) in commonly used LED lighting. For 200Vdc ~ 300Vdc), the effects are as follows.

The LED lighting device according to the present invention was confirmed to have improved by 2 to 3% in terms of power consumption efficiency, and the circuit was strengthened (short-circuit prevention) against voltage drop depending on the distance between the power supply and the load (LED element). , the heat generation of the power supply device components is reduced by reducing the amount of current required, and the use of copper plates (copper plates) manufactured by dividing the heat dissipation member and/or the auxiliary heat dissipation member is reduced, which has the effect of reducing manufacturing costs. .

1 is a plan view showing an example of an LED lighting device according to a first embodiment of the present invention.
FIG. 2 is an equivalent circuit diagram of the substrate of FIG. 1.
Figure 3 is an enlarged view of portion A in Figure 1.
FIG. 4A is a cross-sectional view taken in the direction IV-IV in FIG. 3, and FIG. 4B is a cross-sectional view showing a modification of FIG. 4A.
FIG. 5A is a plan view showing an example of an auxiliary heat dissipation pattern in the substrate of FIG. 1, and FIG. 5B is an enlarged view of portion B in FIG. 5A.
Figure 6 is an exploded perspective view showing an example of an LED lighting device according to a third embodiment of the present invention.
Figure 7 is a plan view showing an example of an LED lighting device according to a second embodiment of the present invention.
Figure 8 is an enlarged view of portion C in Figure 1.
FIG. 9A is a cross-sectional view taken in the direction IV-IV in FIG. 8, and FIG. 9B is a cross-sectional view showing a modification of FIG. 9A.
FIG. 10A is a plan view showing an example of an auxiliary heat dissipation pattern in the substrate of FIG. 7, and FIG. 10B is an enlarged view of portion D in FIG. 10A.
Figure 11 is a photograph showing a case where a short circuit occurs in an LED lighting device having a conventional structure.

Hereinafter, a substrate for an LED lighting device according to the present invention and an LED lighting device having the same will be described with reference to the attached drawings.

The core feature of the present invention relates to an LED lighting device that performs a lighting function by installing a plurality of LED elements (20), and is a new concept LED lighting device that replaces the conventional PCB in which a plurality of LED elements (20) are installed. To provide a substrate for use.

Here, the LED lighting device to which the substrate for the LED lighting device according to the present invention is applied is a device that performs a lighting function using the light emission of the LED element, and can be configured in various ways depending on the usage environment and purpose.

As an example, an LED lighting device to which the substrate for an LED lighting device according to the present invention is applied, as shown in FIGS. 4A and 4B, includes a substrate 10 for an LED lighting device according to the present invention, and a substrate 10. It may be composed of a plurality of LED elements 20 installed in and a heat dissipation member 30 coupled to the bottom of the substrate 10 to dissipate heat generated from the LED elements 20.

The LED device 20 is a semiconductor device that emits light by an external power supply, and an LED device that emits monochromatic light such as blue, red, and green, or an LED device that emits tricolor light such as red, green, and blue may be used.

In addition, the type, installation number, and arrangement pattern of the LED elements 20 can be determined in various ways by considering the purpose and function of the LED lighting device.

Meanwhile, the LED device 20 may include electrodes of the anode 21 and the cathode 22 and a heat dissipation portion 23 that radiates heat generated from the LED device.

Here, the heat dissipation part 23 may have various types such as heat pipes and heat slugs, and may have various shapes such as pipe type, flat type, loop type, and rod type depending on the purpose. .

The heat dissipation member 30 is a component that is coupled to the bottom of the substrate 10 to dissipate heat generated from the LED device 20, and is made of any material that can emit heat generated from the LED device 20. It is also possible and can be made of materials such as aluminum and aluminum alloy.

Meanwhile, in the heat dissipation member 30, the substrate 10 is fixedly coupled to the substrate 10 using screws or the like, and a plurality of heat dissipation fins may be formed in the remaining portion to increase the heat dissipation effect.

Additionally, the heat dissipation member 30 may include a coupling plate to which the substrate 10 is coupled and a heat dissipation block coupled to the coupling plate to maximize heat dissipation.

Here, the heat dissipation block can have various configurations such as heat sinks and heat dissipation fins, and can have various cooling methods such as air cooling and water cooling.

A thermally conductive interface layer 400 made of an electrical insulating material may be formed between the substrate 10 and the heat dissipation member 30 while transferring heat generated by the LED device 20.

The thermally conductive interface layer 400 is made of an electrical insulating material and is formed between the substrate 10 and the heat dissipation member 30 to perform an electrical insulation function between the substrate 10 and the heat dissipation member 30. , it can improve heat dissipation effect as a thermally conductive thermal interface material (TIM).

At this time, the thermally conductive interface layer 400 may have the same material as the heat transfer unit 410, which will be described later, and further, the thermally conductive interface layer 400 is formed so that the heat transfer unit 410 is connected to the heat transfer hole 210. When filled, it may be formed by being applied to the bottom of the substrate 10.

Meanwhile, of course, the thermally conductive interface layer 400 can be made of an electrically conductive material such as silver when electrical insulation is not required between the substrate 10 and the heat dissipation member 30.

The substrate 10 for the LED lighting device is configured to have a plurality of LED elements 20 installed, and various configurations are possible.

In particular, the substrate 10 for an LED lighting device is a substrate for an LED lighting device according to the present invention, and will be described in detail below.

The substrate 10 for an LED lighting device according to the present invention is a substrate 10 for an LED lighting device on which a plurality of LED elements 20 are installed on the upper surface, as shown in FIGS. 1 to 5B, and the LED elements A copper pattern layer 100 including a plurality of electrically separated electrical application patterns 110 that are electrically connected to each of the anode 21 and the cathode 22 of (20); A PCB layer 200 coupled to the bottom of the copper pattern layer 100; It includes a plurality of auxiliary heat dissipation pattern layers 130 that are coupled to the bottom of the PCB layer 200 and receive heat from the copper pattern layer 100 to dissipate heat.

The board 10 for the LED lighting device can generally be configured in various ways, such as a single-sided board, a double-sided board, or a multi-layer board, depending on the number of wiring circuit surfaces.

In addition, the substrate 10 may have a solid form, a flexible form, or a combination of the two (rigid-flexible form) depending on the purpose.

Additionally, the substrate 10 may be surface coated to protect the top surface.

Meanwhile, the copper pattern layer 100 includes an electric application pattern 110 and a heat dissipation pattern 120, and various configurations are possible.

The copper pattern layer 100 may be made of copper, and in this case, oxygen-free copper, which has excellent thermal and electrical conductivity by reducing the oxygen content to less than 0.1%, may be used.

Of course, if the copper pattern layer 100 is not formed of copper, it can be formed of an electrically conductive material such as metal, such as gold or silver.

Additionally, the copper pattern layer 100 may have various thicknesses, for example, may have a thickness of 0.2T.

The electrical application pattern 110 is electrically connected to each of the anode 21 and cathode 22 of the LED element 20, and various configurations are possible.

The electrical application pattern 110 is electrically connected to each of the anode 21 and cathode 22 of the LED element 20, and may have various patterns depending on the circuit configuration.

And the electric application pattern 110 is arranged in series to correspond to the plurality of LED elements 20 installed in series.

Meanwhile, when a plurality of LED elements 20 are arranged in series, a first electrical application pattern 111 to which a first polarity is applied to each end and a first polarity to the first electrical application pattern 111 are applied to each end. It includes a second electric application pattern 112 in which a second polarity opposite to that of is applied.

The first electrical application pattern 111 and the second electrical application pattern 112 have different polarities and power is applied, and various configurations are possible.

The first electrical application pattern 111 and the second electrical application pattern 112 are connected to an external power source, such as an SMPS, to supply power to the LED element 20, or are composed of a rechargeable battery to supply external power for a certain period of time. Power can be supplied to the LED element 20 without supply.

In addition, the first electrical application pattern 111 and the second electrical application pattern 112 can be installed in various locations as long as they are installed in a location where power is easily supplied to the LED element 20.

Meanwhile, the LED element 20 may be directly connected to the first electrical application pattern 111 and the second electrical application pattern 112, but a separate electrical application pattern (not shown) is formed between the plurality of LED elements 20. ) can be indirectly connected by forming.

The heat dissipation pattern 120 is electrically separated from the electric application pattern 110 and receives heat from the heat dissipation portion 23 of the LED element 20, as shown in FIGS. 2 and 3. The electrical application patterns 110 are formed adjacent to each other in the horizontal direction with a second horizontal distance L2.

The heat dissipation pattern 120 is electrically separated from the electric application pattern 110 and has a configuration in which electricity does not flow. The purpose of the heat dissipation pattern 120 is to dissipate heat received from the heat dissipation portion 23 of the LED element 20. there is..

On the other hand, when the heat dissipation pattern 120 has an integrated structure as in Patent Document 1, in the case of a lighting device to which a high voltage is applied, a short circuit, etc. may occur, resulting in damage to the LED element 20 and a decrease in illuminance due to a voltage drop. There is a problem that arises.

Accordingly, as shown in FIGS. 1 to 3, the heat dissipation pattern 120 has a preset separation distance (L1) from the adjacent heat dissipation pattern 120 and the electric application pattern 110 corresponding to each LED element 20. , L2) and is preferably formed as a plurality.

In particular, the horizontal distance between the heat dissipation pattern 120 and the adjacent heat dissipation pattern 120 corresponding to each LED element 20 is referred to as the first horizontal distance L1, and the electric application pattern 110, especially the second electric When the horizontal distance formed with the applied pattern 113 is referred to as the second horizontal distance (L2), it is preferable that the first horizontal distance (L1) is formed to be larger than the second horizontal distance (L2).

This can correspond to the voltage difference applied between the heat dissipation patterns 120 adjacent to each other without significantly reducing the heat dissipation area by making the first horizontal distance L1 relatively large.

Meanwhile, as a result of an experiment on the first horizontal distance (L1), when the applied voltage is greater than 50V, the first horizontal distance (L1) is preferably greater than 0.381 mm.

Furthermore, the first horizontal distance L1 may be set to K×V. Here, K is a proportionality constant of 0.0035mm/V, and V is defined as the applied voltage.

Meanwhile, the applied voltage and applied voltage setting table are as follows.

The first horizontal distance and applied voltage First horizontal distance (mm) Withstand voltage (V AC peak, V DC peak) 0.127(50mil) 0 to 9 0.254(100mil) 10 to 30 0.381(150mil) 31 to 50 0.508(200mil) 51 to 150 0.762(300mil) 151~300 1.524(600mil) 301~500 0.00305mm/V When exceeding 500V

Meanwhile, the heat dissipation pattern 120 may have various pattern shapes, excluding the distance between the heat dissipation patterns 120 adjacent to each other, and the electric application pattern 110 as shown in FIGS. 1 and 3. It can be formed to surround the , and it is desirable to have a shape with a large surface area for more effective heat dissipation.

For example, the heat dissipation pattern 120 includes a channel portion 121 coupled to the bottom of the heat dissipation portion 23 of the LED element 20 by soldering, etc. between adjacent electrical application patterns 110, and the channel portion. It may include an extension portion 122 that is coupled to at least one of both ends of the portion 121 and is formed adjacent to the electrical application pattern 110 .

The channel portion 121 is a portion that is coupled to the bottom surface of the heat dissipation portion 23 of the LED element 20 between adjacent electrical application patterns 110 by soldering, etc., and is prevented from short-circuiting the adjacent electrical application patterns 110. It may have a gap that is not sufficient, that is, a second horizontal distance (L2).

The expansion portion 122 is a portion coupled to at least one end of the channel portion 121 and formed adjacent to the electric application pattern 110, and is formed integrally with the channel portion 121.

At this time, the expansion portion 122 has a gap, that is, a second horizontal distance (L2), that is sufficient to prevent short circuiting with the adjacent electric application pattern 110, and is located ahead of the adjacent heat dissipation pattern 120, that is, the expansion portion 122. As described, it is preferable that it is formed to have a first horizontal distance (L1).

Meanwhile, the expansion portion 122 may be formed along the edge of a pair of electrical application patterns 110 adjacent to each other with respect to the LED element 20, that is, the second electrical application pattern 113.

The copper pattern layer 100 having the above configuration, that is, the plurality of electric application patterns 110 and the plurality of heat dissipation patterns 120, as shown in FIG. 1, are connected to the plurality of LED elements 20. ) can be arranged to form one or more series connections.

Meanwhile, between the heat dissipation pattern 120 and the adjacent heat dissipation pattern 120, the heat dissipation pattern 120 and the electric application pattern 110 are formed by the first horizontal distance L1 and the first horizontal distance L2. A space is formed between them, and the space can be left empty or filled with an electrically insulating material with high thermal conductivity.

The PCB layer 200 is a structure in which the copper pattern layer 100 described above is formed on the upper surface and forms the main body of the entire LED board. Any PCB board on which the LED elements 20 are installed can be used.

In particular, the PCB layer 200 preferably has a high heat transfer rate so that the heat of the heat dissipation pattern 120 can be transmitted downward and the surface has an electrically insulating material for electrical insulation between the electrical application patterns 110.

The PCB layer 200 may have various materials such as metal materials such as aluminum and aluminum alloy, ceramic materials, FR-4, CEM, and synthetic resin.

Additionally, the PCB layer 200 may be made of a multilayer board in which the circuit pattern is made up of multiple layers.

Meanwhile, when the PCB layer 200 is made of a metal material, it needs to be electrically insulated to form the copper pattern layer 100 on the top surface.

Accordingly, at least one of the upper and lower surfaces of the PCB layer 200, especially the upper surface, is a prepreg layer (Prepreg) made of a prepreg structure in which glass fibers are impregnated with a polymer resin composition for electrical insulation and strengthening structural strength. 290) may be additionally formed.

The prepreg layer 290 is a layer made of prepreg in which glass fibers are impregnated with a polymer resin composition for electrical insulation, strengthening structural strength, strengthening bonding with the copper pattern, etc., and is a layer made of prepreg, the PCB. It is formed on the upper surface of the layer 200, and the copper pattern layer 100 described above is formed on the upper surface.

Meanwhile, the prepreg layer 290 may be made of Prepreg.P.P, a resin that combines epoxy resin and glass fiber.

The PCB layer 200 may have various thicknesses, for example, may have a thickness of 0.1T.

The plurality of auxiliary heat dissipation pattern layers 130 are coupled to the bottom of the PCB layer 200 to receive heat from the copper pattern layer 100 and dissipate heat, and various configurations are possible.

The auxiliary heat dissipation pattern layer 130 may have various thicknesses, for example, a thickness of 0.1T, and a metal with high thermal conductivity, such as copper, may be used.

In addition, it is preferable that the plurality of auxiliary heat dissipation pattern layers 130 correspond to each of the heat transfer units 410 and are physically and electrically separated from each other.

That is, the plurality of auxiliary heat dissipation pattern layers 130 are physically divided patterns and are arranged to correspond to each of the heat transfer units 410.

In addition, the auxiliary heat dissipation pattern layer 130 may be formed by overlapping the shapes of the heat dissipation pattern 120 vertically, that is, it may be disposed with the same shape overlapping up and down.

However, of course, the auxiliary heat dissipation pattern layer 130 corresponds to each of the heat transfer units 410, and the heat dissipation pattern 120 may be arranged in different shapes and positions.

On the other hand, when the auxiliary heat dissipation pattern layer 130 is formed so that the shape of the heat dissipation pattern 120 overlaps vertically, the auxiliary heat dissipation pattern layer 130 has each shape identical or similar to the heat dissipation pattern 120. It may be formed in plurality with a preset separation distance (L1, L2) from the projection area of the adjacent auxiliary heat dissipation pattern layer 130 and the electric application pattern 110 corresponding to the LED element 20.

At this time, the horizontal distance between the auxiliary heat dissipation pattern layer 130 and the adjacent auxiliary heat dissipation pattern layer 130 corresponding to each LED element 20 is referred to as a first horizontal distance (L1), and the auxiliary heat dissipation pattern layer 130 ), when the horizontal distance formed with the projection area of the adjacent electric application pattern 110 is referred to as the second horizontal distance (L2), the first horizontal distance (L1) can be formed to be larger than the second horizontal distance (L2). there is.

By the above-described configuration, the PCB layer 200 transfers heat generated from the LED element 20 to the copper pattern layer ( It is transmitted from 100) to the auxiliary heat dissipation pattern layer 130.

On the other hand, when one or more LED element groups in which a plurality of LED elements 20 are connected in series are arranged and a high voltage, for example, 50 V or more, is applied to each LED element group, the auxiliary heat dissipation pattern layer 130 is formed integrally. , a large voltage difference is formed between the copper pattern layer 100 installed on the upper surface of the substrate 10, especially the electric application pattern 110, and as described above, the insulation distance is short, which may cause a short circuit or damage the LED element. There is.

Accordingly, the auxiliary heat dissipation pattern layer 130 corresponds to each of the heat transfer units 410 and is physically and electrically separated to minimize the voltage difference with the copper pattern layer 100, especially the electric application pattern 110, thereby preventing short circuits. Problems that may occur or that may damage the LED element can be resolved.

For reference, when high voltage is applied, a large difference occurs in the potential difference between the electric application pattern 110 close to the + terminal and the electric potential difference 110 close to the - terminal, and the auxiliary heat dissipation pattern layer 130 is integrated. When formed, the voltage difference with the electric application pattern 110 may be large.

Meanwhile, the heat transfer unit 410 is provided to penetrate the PCB layer 200 vertically and connects the auxiliary heat dissipation pattern layer 130 from the heat dissipation pattern 120, Any configuration is possible as long as it can transfer heat to the heat dissipation pattern layer 130.

For example, the heat transfer part 410 is a heat transfer material inserted into the heat transfer hole 210, as shown in FIGS. 5A and 10A, and the heat dissipation composition presented in Patent Document 1 may be used.

In addition, the heat transfer part 410 is preferably connected in direct contact with the heat dissipation part 23 of the LED element 20. One or more through holes 123 are formed so that the heat transfer part 410 penetrates the heat dissipation pattern 120. ) can be formed.

The through hole 123 is a hole into which the heat transfer part 410 is inserted and is formed to directly contact the heat dissipation part 23 of the LED element 20, and various structures are possible.

In particular, the through hole 123 may be formed as one for one heat dissipating part 23, or may be formed in plural for one heat dissipating part 23 in consideration of the heat transfer effect.

Meanwhile, the heat transfer unit 410 may be composed of a heat transfer member inserted into the heat transfer hole 210, as shown in FIGS. 5B and 10B.

The heat transfer member is a member that penetrates the PCB layer 200 vertically and connects the auxiliary heat dissipation pattern layer 130 from the heat dissipation pattern 120, and a metal member with high thermal conductivity such as a copper member may be used.

Additionally, the heat transfer unit 410 may be formed integrally with the auxiliary heat dissipation pattern layer 130, as shown in FIGS. 5B and 10B.

Specifically, the heat transfer portion 410 may be formed as a hollow cylinder-shaped protruding portion by pressing the auxiliary heat dissipation pattern layer 130.

Figure 6 is a perspective view showing the second embodiment of the present invention, and compared to the first embodiment of the present invention referred to in Figures 1 to 5b, the copper pattern layer 100, that is, the electric application pattern 110, and the heat dissipation pattern. Only the patterns of 120 and the auxiliary heat dissipation pattern layer 130 are changed and include the technical gist of the substrate shown in FIGS. 1 to 5B.

Meanwhile, the LED element 10 mounted on the LED substrate 10 may include only the anode 21 and the cathode 22 and may not include the heat dissipation portion 23.

Accordingly, as a third embodiment of the present invention, the heat dissipation structure can be changed according to the structural change of the LED element while maintaining the main technical gist of the present invention.

Specifically, the substrate 10 for an LED lighting device according to the third embodiment of the present invention, when the LED element 20 includes electrodes of the anode 21 and the cathode 22, the electric application pattern ( 110) is electrically connected to each of the electrodes, and the auxiliary heat dissipation pattern layer 130 is a heat dissipation electrical device connected to any one of the anode 21 and the cathode 22 of the LED element 20. It is arranged to correspond to each of the applied patterns 110, and is connected to the electrically applied pattern 110 for heat dissipation by the heat transfer unit 410 to receive heat from the electrically applied pattern 110 for heat dissipation. .

That is, the third embodiment of the present invention removes the heat dissipation pattern 120 in the first embodiment, and replaces the function corresponding to the heat dissipation pattern 120 with the anode 21 and the cathode (21) of the LED element 20. 22) is replaced with an electrical application pattern 110 connected to one of the electrodes, that is, an electrical application pattern 110 for heat dissipation.

And the auxiliary heat dissipation pattern layer 130 is disposed in an electrically separated state corresponding to each of the heat transfer units 410, and corresponds to each of the heat dissipation electrical application patterns 110, and is electrically separated from each of the heat transfer units 410. It is connected to the electrical application pattern 110 for heat dissipation and is arranged to receive heat from the electrical application pattern 110 for heat dissipation.

Meanwhile, the auxiliary heat dissipation pattern layer 130 is configured similarly to the first embodiment, and may be formed by overlapping the shapes of the heat dissipation electric application pattern 110 vertically.

However, of course, the auxiliary heat dissipation pattern layer 130 corresponds to each of the heat transfer units 410 and the shape and position of the heat dissipation electric application pattern 110 may be arranged differently.

Meanwhile, the electrical application patterns 110 connected to each of the cathode and anode of each LED element 20 may be arranged in a double row, where the horizontal distance formed by the adjacent electrical application patterns 110 in the same row is defined as the second horizontal distance. Let's call it a distance (L2), and when the horizontal distance formed by a pair of electric application patterns 110 in adjacent rows is called a first horizontal distance (L1), the first horizontal distance (L1) is the second horizontal distance ( It can be formed larger than L2).

In addition, the heat transfer unit 410 is preferably connected in direct contact with the heat dissipation electrode 22 that dissipates heat on the bottom of the LED element 20. The heat transfer unit 410 is connected to the electric application pattern 110 for heat dissipation. One or more through holes 123 may be formed to penetrate.

The through hole 123 is a hole into which the heat transfer part 410 is inserted and is formed to directly contact the heat dissipation electrode 22 of the LED element 20, and various structures are possible.

The above description is merely an illustrative description of the present invention, and those skilled in the art will be able to make various modifications without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in this specification are for illustrative purposes rather than limiting the present invention, and the spirit and scope of the present invention are not limited by these embodiments. The scope of protection of the present invention shall be interpreted in accordance with the claims below, and all technologies within the equivalent scope thereof shall be construed as being included in the scope of rights of the present invention.

10: substrate 20: LED element
100: Copper pattern layer 200: Insulating layer
130: Auxiliary heat dissipation pattern layer 410: Heat transfer part

Claims (16)

A substrate 10 for an LED lighting device on which a plurality of LED elements 20 are installed on the upper surface,
a copper pattern layer 100 electrically connected to each of the anode 21 and cathode 22 of the LED device 20 and including a plurality of electrically separated electrical application patterns 110;
A PCB layer 200 coupled to the bottom of the copper pattern layer 100;
It includes a plurality of auxiliary heat dissipation pattern layers 130 that are coupled to the bottom of the PCB layer 200 to receive heat from the copper pattern layer 100 and dissipate heat,
The PCB layer 200 dissipates heat generated by the LED element 20 from the copper pattern layer 100 by a heat transfer unit 410 provided to penetrate the PCB layer 200 up and down. It is transmitted to the pattern layer 130,
The plurality of auxiliary heat dissipation pattern layers 130 are electrically separated in correspondence with each of the heat transfer units 410,
The copper pattern layer 100 is electrically separated from the electrical application pattern 110 and includes a plurality of heat dissipation patterns 120 coupled to each heat dissipation portion 23 of the LED element 20,
The LED device 20 includes electrodes of an anode 21 and a cathode 22, and a heat dissipation portion 23 that radiates heat generated from the LED device 20,
The electrical application pattern 110 is electrically connected to the electrode,
The heat dissipation pattern 120 includes a channel portion 121 coupled to the bottom of the heat dissipation portion 23 of the LED element 20 between the electrical application patterns 110 adjacent to each other, and the channel portion 121. It includes a pair of extensions 122 coupled to both ends of the and formed adjacent to the electrical application pattern 110,
The electrical application patterns 110 and the heat dissipation patterns 120 are arranged in a plurality of rows,
The separation distance between adjacent heat dissipation patterns 120 is referred to as a first horizontal distance (L1), and the separation distance between the heat dissipation pattern 120 and the adjacent electric application pattern 110 is referred to as a second horizontal distance (L2). When doing so, the first horizontal distance (L1) is formed to be larger than the second horizontal distance (L2),
A substrate for an LED lighting device, characterized in that the shape of the auxiliary heat dissipation pattern layer 130 is the same as the shape of the heat dissipation pattern 120. In claim 1,
The auxiliary heat dissipation pattern layer 130 is disposed to correspond to each of the heat dissipation patterns 120, and is connected to the heat dissipation pattern 120 by the heat transfer unit 410 to transfer heat from the heat dissipation pattern 120. A substrate for an LED lighting device characterized by receiving. delete delete delete In claim 2,
A substrate for an LED lighting device, wherein the plurality of electric application patterns 110 and the plurality of heat dissipation patterns 120 are arranged so that the plurality of LED elements 20 are connected in series. A substrate 10 for an LED lighting device on which a plurality of LED elements 20 are installed on the upper surface,
a copper pattern layer 100 electrically connected to each of the anode 21 and cathode 22 of the LED device 20 and including a plurality of electrically separated electrical application patterns 110;
A PCB layer 200 coupled to the bottom of the copper pattern layer 100;
It includes a plurality of auxiliary heat dissipation pattern layers 130 that are coupled to the bottom of the PCB layer 200 to receive heat from the copper pattern layer 100 and dissipate heat,
The PCB layer 200 dissipates heat generated by the LED element 20 from the copper pattern layer 100 by a heat transfer unit 410 provided to penetrate the PCB layer 200 up and down. It is transmitted to the pattern layer 130,
The plurality of auxiliary heat dissipation pattern layers 130 are electrically separated in correspondence with each of the heat transfer units 410,
The LED element 20 includes electrodes of an anode 21 and a cathode 22, and the electrical application pattern 110 is electrically connected to each of the electrodes,
The auxiliary heat dissipation pattern layer 130 is disposed to correspond to each of the heat dissipation electric application patterns 110 connected to either the anode 21 or the cathode 22 of the LED device 20, It is connected to the electrical application pattern 110 for heat dissipation by a heat transfer unit 410 and receives heat from the electrical application pattern 110 for heat dissipation,
Electrical application patterns 110 connected to each of the cathode and anode of each LED element 20 are arranged in a plurality of rows,
The separation distance formed by the adjacent electric application patterns 110 in the same row is called the second horizontal distance (L2), and the separation distance formed by the pair of electric application patterns 110 in adjacent rows is called the first horizontal distance (L2). A substrate for an LED lighting device, characterized in that the first horizontal distance (L1) is formed to be greater than the second horizontal distance (L2) when L1). In claim 7,
A substrate for an LED lighting device, characterized in that the shape of the auxiliary heat dissipation pattern layer 130 is the same as the shape of the electric application pattern 110 for heat dissipation. A substrate for an LED lighting device, characterized in that delete According to any one of claims 1 to 2 and claims 6 to 8,
A board for an LED lighting device, wherein when the applied voltage applied to the board 10 is greater than 50V, the first horizontal distance L1 is greater than 0.381mm. According to any one of claims 1 to 2 and claims 6 to 8,
The copper pattern layer 100 is,
A board for an LED lighting device, characterized in that it is formed by etching while a copper plate is attached to the PCB layer 200. According to any one of claims 1 to 2 and claims 6 to 8,
The auxiliary heat dissipation pattern layer 130 is a substrate for an LED lighting device, characterized in that it is made of copper. According to any one of claims 1 to 2 and claims 6 to 8,
The auxiliary heat dissipation pattern layer 130 includes a first reinforcing layer 310 made of an insulating material coupled to the bottom of the PCB layer 200, and a second reinforcing layer made of copper bonded to the bottom of the first reinforcing layer 310. A substrate for an LED lighting device comprising (320). A substrate 10 for an LED lighting device according to any one of claims 1 to 2 and claims 6 to 8;
A plurality of LED elements (20) mounted on the copper pattern layer (100) formed on the LED lighting device substrate (10);
An LED lighting device comprising a heat dissipation member (30) coupled to the bottom of the substrate (10) to dissipate heat generated by the LED element (20). In claim 14,
An LED lighting device, characterized in that a thermally conductive interface layer 400 made of an electrical insulating material is formed between the substrate 10 and the heat dissipation member 30 while transferring heat generated by the LED element 20. A substrate 10 for an LED lighting device according to any one of claims 1 to 2 and claims 6 to 8;
An LED lighting device including a plurality of LED elements (20) installed on the upper surface of the LED lighting device substrate (10).

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