JP2000331865A - Laminated ceramic capacitor and manufacture of it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated ceramic capacitor wherein an internal electrode which is thinner than a conventional conductive paste and high in dimension precision (profile and thickness) is formed for smaller size and larger capacity while excellent in high-frequency characteristics. SOLUTION: A PET film 1 where, as a conductive process supporter, a conductive layer 2 is formed on its surface is provided with a resist 4, and the conductive layer 2 is covered except for an internal electrode formation pattern 3 where the conductive layer 2 is exposed. An electroplating film 10 is formed on the conductive layer 2 by electroplating, and then the electroplating film 10 is so arranged as an internal electrode as to overlap a non-sintered ceramic dielectrics layer while the PET film 1 is peeled off the electroplating film 10 for lamination.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic capacitor capable of realizing a multilayer structure, a small size and a large capacity by forming internal electrodes by electroplating, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, in manufacturing a ceramic multilayer electronic component having internal electrodes such as a multilayer capacitor, etc.
A metal-ceramic integrated firing technique is used. That is, a conductive paste is pattern-printed on a ceramic green sheet (unfired ceramic dielectric sheet) to form internal electrodes. Next, a plurality of ceramic green sheets on which internal electrodes are formed are laminated, and an appropriate number of ceramic green sheets on which no internal electrodes are printed are laminated on the upper and lower sides to obtain a ceramic laminate. Alternatively, the ceramic paste and the conductive paste are sequentially printed in a predetermined shape to obtain a ceramic laminate. Thereafter, the ceramic laminate obtained as described above is pressed in the thickness direction to bring the ceramic layers into close contact with each other. Thereafter, the ceramic laminate is fired to obtain a sintered body. Appropriate external electrodes are formed on the outer surface of the obtained sintered body to obtain a ceramic laminated electronic component.

[0003]

In recent years, further miniaturization of electronic components has been demanded, and miniaturization and thinning of ceramic laminated electronic components have also been strongly demanded. In order to reduce the size and thickness of ceramic multilayer electronic components, it is necessary to reduce the thickness of the ceramic layer sandwiched between the internal electrodes. Therefore, a ceramic laminate is manufactured using thinner ceramic green sheets. There must be.

[0004] However, there is a limit in reducing the thickness of the ceramic green sheet. If the thickness is too small, the ceramic green sheet cannot be handled alone. In addition, at the stage when the ceramic laminate is obtained, the portion where the internal electrodes overlap is thicker than the portion where the internal electrodes are not present (for example, a green sheet thickness of 2-3 μm and an internal electrode thickness of 1.about.3 μm). 5-2μ
m), a step is apt to occur between the two, and the step causes a stacking deviation during sheet stacking. Also, a large pressing pressure (about 1 ton / cm ² ) is required to bond the sheet and the internal electrode prior to sintering, and the above-mentioned step occurs when the ceramic laminate is pressed in the thickness direction. The upper and lower layers are pressurized only in the overlapping portions of the internal electrodes, and are not sufficiently pressurized in other regions, or the deformation after the pressurization is remarkable. As a result, a delamination phenomenon called delamination tends to occur in the sintered body. In addition, variation in capacity after firing due to deformation after pressing increases. Furthermore, the internal electrode swells due to the solvent in the ceramic green sheet, and an internal electrode having a desired shape may not be accurately formed. In addition, internal electrodes formed by pasting Ni powder by screen printing have large variations in electrode thickness due to powder aggregation after firing. In addition, ESL (equivalent series inductance) and ESR
Since the (equivalent series resistance) increases, the characteristics for high frequencies tend to deteriorate.

[0005] Further, with the miniaturization of ceramic laminated electronic parts, it is strongly required to improve the dimensional accuracy of internal electrodes. That is, an attempt has been made to increase the dimensional accuracy of the internal electrode to reduce the width of the insulating region around the region where the internal electrode is formed, thereby achieving miniaturization of the ceramic laminated electronic component. However,
In the conventional method of forming an internal electrode by printing a conductive paste, it is difficult to increase the dimensional accuracy of the internal electrode, and it is difficult to reduce the variation (R) to a set value of the internal electrode size of 20 μm or less. .

[0006] The above-mentioned problem is the same in a method of printing a ceramic paste and a conductive paste alternately to obtain a ceramic laminate.

Japanese Patent Application Laid-Open No. 6-302469 proposes a method of forming internal electrodes into a required film thickness by electroless plating after patterning the internal electrodes by vacuum deposition, but there is a problem that the process becomes complicated.

In view of the above, the present invention can form an internal electrode which is thinner and has higher dimensional accuracy (outer shape and thickness) than conventional conductive pastes, is suitable for miniaturization and large capacity, and has high frequency characteristics. An object of the present invention is to provide a good multilayer ceramic capacitor and a method for manufacturing the same.

Other objects and novel features of the present invention will be clarified in embodiments described later.

[0010]

In order to achieve the above object, a multilayer ceramic capacitor according to the invention of claim 1 of the present application has a metal electrodeposited plating film which can be co-fired with a ceramic dielectric layer and has internal electrodes. It is characterized in that it is formed and laminated with a ceramic dielectric layer interposed between adjacent internal electrodes.

In the multilayer ceramic capacitor according to a second aspect of the present invention, an electrodeposited plating film having substantially the same thickness as that of the first ceramic dielectric layer is provided in a missing portion of the first ceramic dielectric layer. An electrode is formed, and a second ceramic dielectric layer is laminated between adjacent internal electrodes, and the electrodeposited plating film can be co-fired with the first and second ceramic dielectric layers. It is characterized by being a metal material.

According to a third aspect of the present invention, in the method for manufacturing a multilayer ceramic capacitor, a resist is provided on a conductive treatment support having a conductive layer formed on a surface, and an internal electrode forming pattern exposing the conductive layer is left. After covering the conductive layer and forming an electrodeposited plating film on the conductive layer by electroplating, the electrodeposition plating film is arranged as an internal electrode so as to overlap with the unfired ceramic dielectric layer and the electrodeposition plating film is removed from the electrodeposition plating film. The conductive treatment support is peeled off and laminated.

According to a fourth aspect of the present invention, in the method for manufacturing a multilayer ceramic capacitor according to the third aspect, an adhesive layer is formed on the electrodeposited plating film by electrophoretic deposition, and the adhesive layer is formed by the adhesive layer. The present invention is characterized in that an electrodeposition plating film is adhered to the unfired ceramic dielectric layer.

According to a fifth aspect of the present invention, there is provided a method for manufacturing a multilayer ceramic capacitor, comprising: providing a first unfired ceramic dielectric layer also serving as a resist on a conductive processing support having a conductive layer formed on a surface thereof; After the conductive layer is covered except for the internal electrode formation pattern where the layer is exposed, an electrodeposited plating film is formed by electroplating on the conductive layer with substantially the same thickness as the first unfired ceramic dielectric layer. The electrodeposition plating film serving as an electrode and the first unfired ceramic dielectric layer and the second unfired ceramic dielectric layer are arranged so as to overlap with each other, and the electrodeposition plating film and the first unfired ceramic dielectric are arranged. The conductive treatment support is separated from the body layer and laminated.

According to a sixth aspect of the present invention, in the method for manufacturing a multilayer ceramic capacitor according to the fifth aspect, the unfired ceramic dielectric layer also serving as the resist uses a photosensitive polymer material as a binder. And forming an internal electrode formation pattern exposing the conductive layer by exposure and development processing.

A method of manufacturing a multilayer ceramic capacitor according to the invention of claim 7 is characterized in that an unfired ceramic dielectric layer serving also as the resist is formed on the conductive layer by electrophoretic deposition.

[0017]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a multilayer ceramic capacitor according to the present invention.

FIG. 1 shows a first embodiment of the present invention.
In this figure, in a conductive treatment step # 1, a surface of a PET film 1 as a flexible support is sputtered,
Conducting a conductive process for electroplating in the subsequent process by vapor deposition, electroless plating technology, etc., the electrodeposited plating film formed in the post process on the film surface is easily peeled off stainless steel, Cr, Cr-based alloy, Ti, Ti-based alloy, A conductive layer 2 such as ITO is formed.

Next, the conductive layer 2 is covered with the plating resist 4 except for the internal electrode forming pattern 3 from which the conductive layer 2 is exposed by a printing pattern method. That is, in a resist printing / drying step # 2, a plating resist 4 is screen-printed on a required portion on the conductive layer 2 of the film 1 by a screen printer 5 to expose the conductive layer 2 corresponding to the internal electrode forming pattern 3. (A large number of patterns 3 are formed simultaneously).

Then, on the conductive layer 2 exposed in the electroplating step # 3, an electroplating film 10 of a good conductor metal serving as an internal electrode is formed by an electroplating apparatus 11. Noble metals such as gold, silver and palladium can also be used as good conductor metals that can be simultaneously fired in the ceramic green sheet and the subsequent steps, but Ni and Cu are preferable in consideration of cost. The thickness of the electrodeposited plating film 10 is 0.1 to 1.5 μm.
0.7, especially when the purpose is to reduce the size and increase the capacity.
μm or less is desirable. The adhesive layer 13 is formed on the electrodeposited plating film 10 by the electrophoretic deposition method in the electrodeposition apparatus 12 in the adhesive layer electrodeposition step # 4. Here, the electrophoretic electrodeposition method is a method of adsorbing and aggregating charged particles by applying electricity by making particles to be attached into colloids and energizing electrodes,
Particles can be attached only to the electrode portion. In the electrodeposition apparatus 12 for forming the adhesive layer 13, an electrodepositive polymer material is colloidally electrodeposited. The thickness of the adhesive layer 13 is 0.1 to 0.5 μm.

Then, in a resist stripping step # 5,
The resist 4 is peeled and removed by a peeling device 15 using a solvent-based or alkaline-based peeling agent. Then, sheet forming step # 6
In the internal electrode transfer step # 7, the transfer device 23 is used for the ceramic green sheet (unfired ceramic dielectric sheet) 21 formed on the PET film 20 as another flexible support by the sheet forming device 22 The electrodeposited plating film 10 serving as an internal electrode is bonded and transferred onto the ceramic green sheet 21 using the adhesive layer 13.

Thereafter, in the current mass production laminating step # 8, the ceramic green sheets 2 with the internal electrodes
1 is laminated in a required number, and then heat-pressed. That is, in the cutting section 31 of the thermocompression bonding apparatus 30, the PE as an unnecessary support is removed from the ceramic green sheet 21 to which the internal electrode is transferred.
The T films 1 and 20 are peeled off (the conductive layer 2 is peeled off together with the PET film 1) and cut into a card shape in which a number of internal electrodes are arranged. The lamination accuracy is preferably within ± 5 μm), and thermocompression bonding is performed by the thermocompression bonding section 33. afterwards,
A sintered body formed by cutting into individual chips of a multilayer ceramic capacitor and then firing to form an internal electrode with an electrodeposited plating film, and a ceramic dielectric layer interposed between the adjacent internal electrodes and laminated. , And necessary external electrodes are formed thereon to obtain a product.

According to the first embodiment, the following effects can be obtained.

(1) Since the internal electrodes are formed by the electrodeposited plating film by the electrodeposition method, the internal electrodes are made thinner and the dimensional accuracy (outer and thickness) is reduced by the conventional method using a conductive paste. It is possible to increase. Therefore, it is suitable for miniaturization and large capacity.

(2) The step due to the difference in thickness between the region where the internal electrode is transferred to the ceramic green sheet and the region where no internal electrode is provided is reduced, the stacking deviation is reduced, and a large pressing pressure is not required. By reducing the press deformation, the capacitance variation of the fired capacitor is reduced.

(3) The electrodeposited plating film of the internal electrode is thin and uniform, and is denser than in the case where the conventional Ni powder or the like is simultaneously fired with a ceramic green sheet to form the internal electrode. An electrode can be used, and characteristics for high frequencies can be improved.

(4) A smaller multilayer ceramic capacitor can be stably manufactured by a relatively simple process.

The plating resist may be formed by an exposure process using a photoresist instead of screen printing.

FIG. 2 shows a second embodiment of the present invention.
In this case, the conductive processing step # 1 to the resist stripping step # 5
The steps up to this are the same as those of the first embodiment, and the subsequent steps are different. That is, the PET film 1 having the electrodeposited plating film 10 as an internal electrode obtained on the resist stripping step # 5 on the conductive layer 2 and the PET film 20 having the ceramic green sheet 21 obtained on the sheet forming step # 6. Is cut into a card shape by the laminating machine 24 in the precision laminating step # 10, and the electrodeposited plating film 1 is cut.
The thermocompression bonding is performed in a direction in which the ceramic film 21 faces the ceramic green sheet 21. Thereafter, the PET films 1 and 20 are peeled off (the conductive layer 2 is also peeled off together with the PET film 1), and an electrodeposition plating film 10 as an internal electrode is provided. The required number of ceramic green sheets 21 are laminated, and the entire laminate is heat-pressed. Subsequent processing is the same as in the first embodiment.

In the case of the second embodiment, the electrodeposited plating film 10 serving as an internal electrode and the ceramic green sheet 21
Since the PET films 1 and 20 on the outside are peeled off after the heat and pressure bonding, the ceramic green sheet is not deformed when the PET film is peeled off, and this is particularly effective when the ceramic green sheet 21 is thin. Other functions and effects are the same as those of the first embodiment.

FIG. 3 shows a third embodiment of the present invention.
In this case, the steps from the conductive processing step # 1 to the electroplating step # 3 are the same as those in the first embodiment, and the subsequent steps are different. That is, after depositing the electrodeposited plating film 10 in the electroplating step # 3, the resist 4 is stripped and removed by executing the resist stripping step # 5. Then, in the dielectric coating step # 11, the ceramic green sheet 26 is formed on the electrodeposited plating film 10 on the PET film 1 side by the sheet forming apparatus 25 so as to overlap. Thereafter, similarly to the first embodiment, in the current mass production laminating step # 8, the PET film 1 as an unnecessary support is peeled off, and the internal electrodes and the ceramic green sheets 26 arranged so as to overlap therewith are removed.
Is cut into a card shape in which many internal electrodes are arranged,
A required number of these are laminated, and then heat-pressed. After that, by cutting into individual chips of the multilayer ceramic capacitor and firing, the internal electrodes are formed by electrodeposition plating film,
A sintered body is formed by laminating a ceramic dielectric layer between the adjacent internal electrodes, and a required external electrode is formed thereon to obtain a product.

According to the third embodiment, the same function and effect as those of the first embodiment can be obtained.

FIG. 4 shows a fourth embodiment of the present invention.
In this figure, in a conductive treatment step # 1, the surface of the PET film 1 is subjected to a conductive treatment for electroplating in a later step by a sputtering, vapor deposition, electroless plating technique or the like, and an electrodeposition is formed on the film surface in a later step. Stainless steel, Cr, Cr-based alloy, Ti, Ti-based alloy, IT
A conductive layer 2 of O or the like is formed.

Next, the photosensitive layer is covered with a ceramic green sheet 40 to which a photosensitive polymer material and a plasticizer are added while leaving the internal electrode forming pattern 3 from which the conductive layer 2 is exposed by the photosensitive sheet photo pattern method. . That is, in the sheet forming step # 20, the ceramic green sheet 40 also serving as a plating resist is formed on the entire surface of the conductive layer 2 of the film 1 by the sheet forming apparatus 41, and the ceramic green sheet is left by the exposure apparatus 42 of the exposure step # 21. Only the portions are irradiated with ultraviolet rays (UV, DUV) through a photomask and exposed, and unnecessary portions are removed with a solvent or the like in a developing / fixing device 43 in a developing / fixing step # 22, and the portions are made conductive in correspondence with the internal electrode forming patterns 3. The layer 2 is exposed (a large number of patterns 3 are formed at the same time). In this case, the precision of the pattern can be reduced to about ± 3 μm by the precision photosensitive technique.

Using the patterned ceramic green sheet 40 as a mask, an electroplating process # 23
An electroplating film 10 of a good conductor metal serving as an internal electrode is formed on the conductive layer 2 exposed by the above process using an electroplating apparatus 45.
Noble metals such as gold, silver and palladium can also be used as good conductor metals that can be simultaneously fired in the ceramic green sheet and the subsequent steps, but Ni and Cu are preferable in consideration of cost. The electrodeposited plating film 10 is electrodeposited so as to have substantially the same height as the ceramic green sheet 40. In practice, it is desirable to lower the value by several percent in consideration of the subsequent thermocompression bonding to another ceramic green sheet (considering that the internal structure is completely stepless when a multilayer laminate is obtained). ). Here, the thicknesses of the electrodeposited plating film 10 and the ceramic green sheet 40 are approximately 2 μm. On the electrodeposited plating film 10 and the ceramic green sheet 40, a coating device (or spray device) 4 in an adhesive layer forming step # 24
At 6, an adhesive layer 47 is formed by coating or spraying. The thickness of the adhesive layer 47 is 0.1 to 0.5 μm.

Thereafter, in the sheet forming apparatus 22 of the sheet forming step # 6, the ceramic green sheet 21 is formed on the PET film 20 as another flexible support by the transfer (two-layer) step # 25. Using the transfer device 50, the ceramic green sheet 40 and its missing portion (the portion removed as an internal electrode forming pattern)
The electrodeposited plating film 10 serving as an internal electrode embedded in the ceramic green sheet 21 is adhered on the ceramic green sheet 21 via an adhesive layer 47 to be superposed.

Thereafter, in the current mass production lamination step # 8, the electrodeposited plating film 10 and the ceramic green sheet 40 as the internal electrodes and the ceramic green sheet 21
The required number of sheets obtained by laminating are laminated and heated and pressed. That is, the PET films 1 and 20 as unnecessary supports are peeled from the ceramic green sheets 21 and 40 at the cutting portion 31 of the thermocompression bonding device 30 and cut into a card shape in which a large number of internal electrodes are arranged. The required number of sheets are laminated by positioning at the positioning unit 32, and thermocompression bonding is performed at the thermocompression bonding unit 33. Thereafter, the chip is cut into individual chips of the multilayer ceramic capacitor and then fired, so that the first ceramic dielectric layer (the fired ceramic green sheet 40) is formed in the missing portion of the first ceramic dielectric layer. An internal electrode is formed by providing an electrodeposited plating film 10 having substantially the same thickness, and a second ceramic dielectric layer (fired ceramic green sheet 21) is interposed between the adjacent internal electrodes and laminated. Thus, a stepless sintered body is manufactured, and required external electrodes are formed on the sintered body to obtain a product.

According to the fourth embodiment, the following effects can be obtained.

(1) An internal electrode is formed on the electrodeposited plating film 10 by the electrodeposition method, and the ceramic green sheet 4
Since the internal electrode is located at the missing portion of 0 (the portion removed as the internal electrode forming pattern), the ceramic green sheets of each layer can be stacked in multiple layers without a complete step, and the stacking deviation is significantly reduced, and Large press pressure can be eliminated. Further, by reducing the press deformation, the variation in the capacitance of the capacitor after firing can be reduced.

(2) Since the ceramic green sheet 40, which also serves as a plating-resistant resist, uses a photosensitive polymer material as a binder, it can be finely processed by an exposure and development process using ultraviolet light, thereby improving the pattern accuracy of the dielectric layer. it can. Further, since the accuracy of the internal electrode pattern formed by electroplating is determined by the accuracy of the dielectric layer pattern, the accuracy of the internal electrode pattern is also improved. For example, the conventional screen printing method has a line width of about 100 μ and a variation of about 20%.
The pattern width is possible, and the variation can be 10% or less.

Other functions and effects are the same as those of the first embodiment.

FIG. 5 shows a fifth embodiment of the present invention.
In this case, the conductive processing step # 1, the sheet forming step # 20 to the adhesive layer forming step # 24 are the same as in the fourth embodiment, and the subsequent steps are different. That is, the PET film 1 having the electrodeposited plating film 10 and the ceramic green sheet 40 on the conductive layer 2 as the internal electrodes to which the adhesive layer 47 obtained in the adhesive layer forming step # 24 adheres, and the PET film 1 in the sheet forming step # 6. The obtained PET film 20 having the ceramic green sheets 21 is subjected to a precision laminating step #
At 10, each was cut into a card shape and heat-pressed in a direction in which the electrodeposited plating film 10 and the ceramic green sheet 40 face the ceramic green sheet 21, and then the PET films 1 and 20 were peeled off, respectively.
The ceramic green sheet 40 and the electrodeposited plating film 10 formed in the missing portion were
The required number of sheets are laminated and the whole of the laminate is heat-pressed. Subsequent processing is the same as in the fourth embodiment.

In the case of the fifth embodiment, the ceramic green sheet 40 and the electrodeposited plating film 1 serving as an internal electrode
0 and the ceramic green sheet 21 are heated and pressed to separate the PET films 1 and 20 on the outside.
There is no deformation of the ceramic green sheet when the film is peeled off, and this is particularly effective when the ceramic green sheet 21 is thin. Other functions and effects are the same as those of the above-described fourth embodiment.

FIG. 6 shows a sixth embodiment of the present invention.
In this case, the conductive processing step # 1, the sheet forming step # 20 to the electroplating step # 23 are the same as in the fourth embodiment, and the subsequent steps are different. That is, in the electroplating step # 23, after depositing the electrodeposited plating film 10 on the missing portion of the ceramic green sheet 40, the dielectric coating step #
In 11, the sheet forming apparatus 25 uses the PET film 1
Green sheet 2 on the side electrodeposited plating film 10
6 are formed one upon another. Thereafter, as in the fourth embodiment, in the current mass production laminating step # 8, a required number of ceramic green sheets 40 and internal electrodes and the ceramic green sheets 26 arranged so as to overlap with the ceramic green sheets 40 are laminated and heat-pressed. The PET film 1 as a support is peeled off, cut into a card shape in which a large number of internal electrodes are arranged, and a required number of these are laminated and heated and pressed.

According to the sixth embodiment, the same operation and effect as those of the fourth embodiment can be obtained.

FIG. 7 shows a seventh embodiment of the present invention.
In this figure, in a conductive treatment step # 1, the surface of the PET film 1 is subjected to a conductive treatment for electroplating in a later step by a sputtering, vapor deposition, electroless plating technique or the like, and an electrodeposition is formed on the film surface in a later step. Stainless steel, Cr, Cr-based alloy, Ti, Ti-based alloy, IT
A conductive layer 2 of O or the like is formed.

Next, the conductive layer 2 is covered with the ceramic green sheet 60 except for the internal electrode forming pattern 3 exposing the conductive layer 2 by a photo pattern / powder electrodeposition method.
That is, in the resist coating process # 30, a resist 62 is formed on the entire surface of the conductive layer 2 of the film 1 by the resist forming device 61, and the resist is left by the exposure device 63 in the exposure process # 31 (corresponding to the internal electrode forming pattern 3). Only the ultraviolet rays (UV, DUV) are irradiated through a photomask and exposed, and unnecessary portions are removed with a solvent or the like by a developing / fixing device 64 in a developing / fixing step # 32. A pattern is formed, and other portions of the conductive layer 2 are exposed. Then, the electrophoresis electrodeposition step # 3
In 3, ceramic powder to be the ceramic green sheet 60 is electrophoretically deposited on the exposed portion of the conductive layer 2. The electrophoretic deposition is performed by causing the ceramic powder to be dispersed and suspended by the electrodeposition device 65 and flowing a direct current to move the charged ceramic powder in the direction of the electrode (conductive layer 2) to be adsorbed and aggregated. It is feasible. Thereafter, in a resist stripping step # 34, the resist 62 is stripped and removed by a stripping device 66 using a solvent-based or alkali-based stripping agent to expose the conductive layer 2 corresponding to the internal electrode forming pattern 3.

Using the patterned ceramic green sheet 60 as a mask, an electroplating apparatus 45 is used to deposit a good conductive metal electrodeposited plating film 10 as an internal electrode on the conductive layer 2 exposed in the electroplating step # 23. Film. The steps following the electroplating step # 23 may be the same as those in the fourth, fifth, or sixth embodiment.

Also in the seventh embodiment, since the internal electrodes are formed on the electrodeposited plating film 10 by the electrodeposition method and the internal electrodes are located in the missing portions of the ceramic green sheet 60, Can be stacked in multiple layers without a complete step, and the same operation and effect as in the fourth embodiment can be obtained.

FIG. 8 shows an eighth embodiment of the present invention.
In this figure, in a conductive treatment step # 1, the surface of the PET film 1 is subjected to a conductive treatment for electroplating in a later step by a sputtering, vapor deposition, electroless plating technique or the like, and an electrodeposition is formed on the film surface in a later step. Stainless steel, Cr, Cr-based alloy, Ti, Ti-based alloy, IT
A conductive layer 2 of O or the like is formed.

Then, the inner electrode forming pattern 3 exposing the conductive layer 2 is covered with the ceramic green sheet 70 by a photosensitive powder electrodeposition / photo pattern method. In other words, in the electrophoresis electrodeposition step # 40, the electrodeposition apparatus 71 is used as an electrodeposition resist, a photosensitive polymer material, and a ceramic powder as a single particle to form a colloid and a direct current is applied to the conductive layer 2 as an energizing electrode. , Agglutinate. A region other than the internal electrode forming pattern 3 is irradiated with ultraviolet rays (UV, DUV) through a photomask and exposed by the exposure device 72 in the exposure process # 41, and is unnecessary with a solvent or the like by the developing / fixing device 73 in the development / fixing process # 42. The portion is removed, and the conductive layer 2 is exposed in accordance with the internal electrode forming pattern 3.

Using the thus patterned ceramic green sheet 70 as a mask, an electroplating apparatus 35 is used to form an electrodeposited plating film 10 of a good conductor metal as an internal electrode on the conductive layer 2 exposed in the electroplating step # 23. Film. The steps following the electroplating step # 23 may be the same as those in the fourth, fifth, or sixth embodiment.

In the eighth embodiment, almost all processes are of a wet type, and the number of steps is reduced.

In the first to third embodiments, the plating resistant resist was screen-printed before the electroplating step # 3. However, patterning for forming internal electrodes by exposing and developing the photoresist was performed. It may be used, or may be used as a patterning (permanent mask for cost reduction by reuse) of an insulating film such as SiO ₂ or Al ₂ O ₃ .

In the first or second embodiment, the adhesive layer is formed by the electrophoretic deposition method in the adhesive layer electrodeposition step # 4. However, the adhesive layer is formed only on the electrodeposited plating film using a mask. May be sprayed.

Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims. There will be.

[0057]

As described above, according to the present invention,
Since the internal electrodes are formed by the electrodeposited plating film by the electrodeposition method, the internal electrodes can be made thinner and the dimensional accuracy (outer shape and thickness) can be increased as compared with the method using the conventional conductive paste. . Also, reduce the step due to the thickness difference between the area where the internal electrode overlaps the ceramic green sheet and the area where the internal electrode does not exist, or reduce the step, reduce the stacking deviation and press deformation, and reduce the capacitance of the fired capacitor. Variation can be reduced. Further, the electrodeposited plating film of the internal electrode is thin and uniform, and is denser than the case where the conventional Ni powder or the like is simultaneously fired with the ceramic green sheet to form the internal electrode. Is possible, and the characteristics for high frequencies can be improved.

[Brief description of the drawings]

FIG. 1 is a process chart showing a first embodiment of a multilayer ceramic capacitor and a method of manufacturing the same according to the present invention.

FIG. 2 is a process chart showing a second embodiment of the present invention.

FIG. 3 is a process chart showing a third embodiment of the present invention.

FIG. 4 is a process chart showing a fourth embodiment of the present invention.

FIG. 5 is a process chart showing a fifth embodiment of the present invention.

FIG. 6 is a process chart showing a sixth embodiment of the present invention.

FIG. 7 is a process chart showing a seventh embodiment of the present invention.

FIG. 8 is a process chart showing an eighth embodiment of the present invention.

[Explanation of symbols]

1,20 PET film 2 conductive layer 3 internal electrode forming pattern 4 anti-plate resist 5 screen printing machine 10 electrodeposition plating film 11,45 electroplating device 12,65,71 electrodeposition device 13,47 adhesive layer 15,66 peeling device 21, 26, 40, 60, 70 Ceramic green sheets 22, 25, 41 Sheet forming device 23, 50 Transfer device 24 Laminating machine 30 Heating and pressing device 31 Cutting unit 32 Positioning unit 33 Heating and pressing unit 42, 63, 72 Exposure device 43, 64, 73 Developing / fixing device 46 Coating device 61 Resist forming device # 1 Conductive treatment process # 2 Resist printing / drying process # 3, # 23 Electroplating process # 4 Adhesive layer electrodeposition process # 5, # 34 Resist stripping Process # 6, # 20 Sheet forming process # 7 Internal electrode transfer process # 8 Current lamination mass production process # 10 Dense lamination process # 11 Dielectric coating process # 21, # 31, # 41 Exposure process # 22, # 32, # 42 Developing / fixing process # 24 Adhesive layer forming process # 30 Resist coating process # 33, # 40 Electrophoretic deposition Process

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01G 4/30 301 H01G 4/30 301E (72) Inventor Shunji Aoki 1-13-1 Nihonbashi, Chuo-ku, Tokyo No. F-term in TDK Corporation (reference) 5E001 AC04 AC09 AC10 AD00 AD04 AH03 AH06 AH07 AJ01 5E082 AB03 BC39 EE05 EE18 EE23 EE26 EE37 EE39 EE45 FF14 FF15 FG06 FG26 FG34 FG54 LL01 LL02 LL03 MM22

Claims (7)

[Claims] An internal electrode is formed of an electrodeposited plating film of a metal material that can be co-fired with a ceramic dielectric layer, and the ceramic dielectric layer is laminated between adjacent internal electrodes. Characteristic multilayer ceramic capacitor. 2. An internal electrode is formed by providing an electrodeposited plating film having substantially the same thickness as that of the first ceramic dielectric layer in a missing portion of the first ceramic dielectric layer. And a second ceramic dielectric layer interposed therebetween, wherein the electrodeposited plating film is a metal material that can be co-fired with the first and second ceramic dielectric layers. Capacitors. 3. A conductive treatment support having a conductive layer formed on its surface, a resist provided thereon to cover the conductive layer except for an internal electrode forming pattern exposing the conductive layer, and depositing an electrodeposited plating film by electroplating. After being formed on the conductive layer, the electrodeposition plating film is arranged as an internal electrode so as to overlap with the unfired ceramic dielectric layer, and the conductive treatment support is peeled off from the electrodeposition plating film and laminated. Manufacturing method of multilayer ceramic capacitor. 4. The lamination according to claim 3, wherein an adhesive layer is formed on the electrodeposited plating film by electrophoretic deposition, and the electrodeposited plating film is adhered to the unfired ceramic dielectric layer by the adhesive layer. Manufacturing method of ceramic capacitor. 5. A conductive treatment support having a conductive layer formed on a surface thereof, a first unfired ceramic dielectric layer serving also as a resist is provided, and the internal electrode forming pattern exposing the conductive layer is left. And forming an electrodeposited plating film by electroplating on the conductive layer with substantially the same thickness as the first unfired ceramic dielectric layer, and then depositing the electrodeposited plating film serving as an internal electrode and the first electrode. The fired ceramic dielectric layer and the second unfired ceramic dielectric layer are arranged so as to overlap with each other, and the conductive treatment support is peeled off from the electrodeposited plating film and the first unfired ceramic dielectric layer and laminated. A method for manufacturing a multilayer ceramic capacitor, comprising: 6. The method according to claim 1, wherein the unfired ceramic dielectric layer also serving as a resist uses a photosensitive polymer material as a binder, and forms an internal electrode formation pattern exposing the conductive layer by exposure and development. Item 6. The method for manufacturing a multilayer ceramic capacitor according to Item 5. 7. The method according to claim 5, wherein the unfired ceramic dielectric layer serving also as the resist is formed on the conductive layer by electrophoretic deposition.