CN110785017B - Method for preparing printed circuit board - Google Patents
Method for preparing printed circuit board Download PDFInfo
- Publication number
- CN110785017B CN110785017B CN201911091880.7A CN201911091880A CN110785017B CN 110785017 B CN110785017 B CN 110785017B CN 201911091880 A CN201911091880 A CN 201911091880A CN 110785017 B CN110785017 B CN 110785017B
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- copper
- layer
- printed circuit
- circuit board
- clad plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention discloses a preparation method of a printed circuit board, which comprises the following steps: drilling holes on the surface of a substrate, and plating copper on the drilled substrate to obtain a copper-clad plate with a copper foil layer; pressing a dry film on the surface of the copper foil layer, attaching a positive film on the surface of the dry film, and exposing the copper-clad plate; developing the exposed copper clad laminate, and dissolving the unexposed dry film on the surface of the copper clad laminate; carrying out pattern electroplating on the copper-clad plate after development treatment and filling the drilled holes to form a pattern layer; and leveling the graphic layer, removing the film, processing the leveled copper-clad plate, and etching the copper-clad plate to obtain the printed circuit board. The technical scheme of the invention can improve the smoothness of the graphic layer and ensure the smooth subsequent routing processing of the printed circuit board.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a preparation method of a printed circuit board.
Background
With the development of electronic products in the light, thin and small directions, printed circuit boards are also developed in the directions of high density and high difficulty. In order to make the wiring space between the layers of the printed circuit board wider and the degree of freedom greater, the existing printed circuit board mostly adopts the copper electroplating plug hole process. The specific process for manufacturing the printed circuit board by the electro-coppering hole plugging process comprises the following steps: drilling holes on the surface of the substrate, and plating copper on the drilled substrate to form a copper-clad plate with a copper foil layer; pressing and coating a dry film on the copper foil layer, and transferring the pattern on the positive film to the copper foil layer through exposure and development; then, electroplating the copper-clad plate by using the pattern and filling the drilled holes to form a pattern layer; and finally, sequentially carrying out film removal treatment and etching treatment on the copper-clad plate to obtain the printed circuit board. Therefore, in the process of pattern electroplating, because the surface of the substrate is provided with the drill holes, the adsorption quantity of electroplating solution in the drill holes cannot be ensured, and an uneven pattern layer is formed by the pattern electroplating and has a height difference. With the development of the printed circuit board industry, higher and higher requirements are made on the smoothness of the graphic layer. Typically, the height difference of the graphics layer is less than 3 mm. However, the existing processing methods cannot meet this requirement.
Disclosure of Invention
The invention mainly aims to provide a preparation method of a printed circuit board, aiming at improving the smoothness of a pattern layer and ensuring the smooth subsequent routing processing of the printed circuit board.
In order to achieve the above purpose, the method for manufacturing a printed circuit board provided by the invention comprises the following steps:
drilling holes on the surface of a substrate, and plating copper on the drilled substrate to obtain a copper-clad plate with a copper foil layer;
pressing a dry film on the surface of the copper foil layer, attaching a positive film on the surface of the dry film, and exposing the copper-clad plate;
developing the exposed copper clad laminate, and dissolving the unexposed dry film on the surface of the copper clad laminate;
carrying out pattern electroplating on the copper-clad plate after development treatment and filling the drilled holes to form a pattern layer;
and leveling the graphic layer, removing the dry film exposed on the surface of the copper clad laminate, and etching the copper clad laminate to obtain the printed circuit board.
Optionally, the step of "flattening the graphics layer" comprises:
and leveling the pattern layer by adopting a ceramic brush plate, and grinding the protruded pattern layer.
Optionally, when the pattern layer filled in the drilled hole protrudes from the pattern layer on the surface of the copper foil layer, the step of "grinding the protruding pattern layer" is:
and grinding the pattern layer filled in the drill hole.
Optionally, when the pattern layer filled in the drilled hole is recessed in the pattern layer on the surface of the copper foil layer, the step of "grinding the protruding pattern layer" is:
and grinding the pattern layer deposited on the surface of the copper foil layer.
Optionally, the step of "performing pattern electroplating on the developed copper-clad plate and filling the drilled hole" includes:
and placing the copper-clad plate after development treatment in a copper plating solution, and electrolyzing the copper plating solution.
Optionally, the step of "plating copper on the substrate after drilling" includes:
and (3) depositing copper on the substrate after drilling by adopting a chemical plating process, and electroplating the substrate after copper deposition.
Optionally, the step of pressing a dry film on the surface of the copper foil layer further comprises:
and placing the copper-clad plate with the copper foil layer in a sodium persulfate solution so as to slightly corrode the copper foil layer by the sodium persulfate solution.
Optionally, the step of removing the dry film exposed on the surface of the copper-clad plate includes:
and placing the leveled copper-clad plate in an alkaline solution, and dissolving the dry film exposed on the surface of the copper foil layer.
Optionally, the step of etching the copper-clad plate includes:
and placing the copper-clad plate after the film is removed in etching solution so that the copper foil layer is etched by the etching solution.
Optionally, the step of "copper plating the substrate after drilling" comprises:
and cleaning the drill hole by using a potassium permanganate solution so as to remove the debris in the drill hole.
The invention provides a preparation method of a printed circuit board, which comprises the following steps of drilling holes on the surface of a substrate, and plating copper on the drilled substrate to obtain a copper-clad plate with a copper foil layer; pressing the dry film on the surface of the copper foil layer, attaching a positive film on the surface of the dry film, and exposing the copper-clad plate; developing the exposed copper clad laminate, and dissolving the unexposed dry film on the surface of the copper foil layer; carrying out pattern electroplating on the developed copper-clad plate and filling the drilled holes to form a pattern layer; and leveling the graphic layer, removing the dry film exposed on the surface of the copper-clad plate, and etching the copper-clad plate to obtain the printed circuit board. Therefore, the step of flattening the pattern layer is added, so that the height difference formed by the pattern electroplating process is reduced, and the flatness of the pattern layer is improved. The technical scheme of the invention can improve the smoothness of the graphic layer and ensure the smooth subsequent routing processing of the printed circuit board.
Drawings
FIG. 1 is a flow chart of a method for manufacturing a printed circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a process for manufacturing the printed circuit board of FIG. 1;
the reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Copper- |
200 | |
| 110 | |
300 | |
| 111 | |
400 | |
| 120 | Copper foil layer |
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The invention provides a preparation method of a printed circuit board.
Referring to fig. 1 to 2, in an embodiment of the present invention, a method for manufacturing a printed circuit board includes the following steps:
drilling holes on the surface of a substrate, and plating copper on the drilled substrate to obtain a copper-clad plate with a copper foil layer;
pressing a dry film on the surface of the copper foil layer, attaching a positive film on the surface of the dry film, and exposing the copper-clad plate;
developing the exposed copper clad laminate, and dissolving the unexposed dry film on the surface of the copper clad laminate;
carrying out pattern electroplating on the copper-clad plate after development treatment and filling the drilled holes to form a pattern layer;
and leveling the graphic layer, removing the dry film exposed on the surface of the copper clad laminate, and etching the copper clad laminate to obtain the printed circuit board.
The invention provides a preparation method of a printed circuit board, which comprises the following steps of drilling holes on the surface of a substrate, and plating copper on the drilled substrate to obtain a copper-clad plate with a copper foil layer; pressing the dry film on the surface of the copper foil layer, attaching a positive film on the surface of the dry film, and exposing the copper-clad plate; developing the exposed copper clad laminate, and dissolving the unexposed dry film on the surface of the copper foil layer; carrying out pattern electroplating on the developed copper-clad plate and filling the drilled holes to form a pattern layer; and leveling the graphic layer, removing the dry film exposed on the surface of the copper-clad plate, and etching the copper-clad plate to obtain the printed circuit board. Therefore, the step of flattening the pattern layer is added, so that the height difference formed by the pattern electroplating process is reduced, and the flatness of the pattern layer is improved. The technical scheme of the invention can improve the smoothness of the graphic layer and ensure the smooth subsequent routing processing of the printed circuit board.
It should be noted that the substrate may be drilled by using a laser, and the laser emitted by the laser is focused on the surface of the substrate, so that the laser ablates the substrate, thereby forming the drilled hole on the surface of the substrate. Of course, the drill holes can be through holes or blind holes, and electronic components are installed through different types of drill holes so as to realize the conduction of the electronic devices and the circuit. In addition, because the surface of the substrate is provided with the drill holes, the adsorption quantity of electroplating solution in the drill holes cannot be ensured during pattern electroplating, so that the pattern electroplating forms an uneven pattern layer. The invention improves the smoothness of the graphic layer by adding the step of flattening the graphic layer, thereby reducing the height difference of the graphic layer. Of course, in the embodiment of the invention, the graphic layer can be flattened by adopting the board brushing machine, so that the uneven graphic layer is changed into the flat graphic layer. It should be noted that the pattern layer may be a copper layer, and during the etching process, the etching solution may etch the copper layer, so as to form a fine circuit pattern, thereby facilitating the processing of a high-density and high-difficulty printed circuit board.
In an embodiment of the present invention, the step of "flattening the graphic layer" includes: and leveling the pattern layer by adopting a ceramic brush plate, and grinding the protruded pattern layer. The ceramic brush plate has high hardness, and can effectively grind high-hardness materials. When the pattern layer filled in the drill hole protrudes out of the pattern layer on the surface of the copper foil layer, the ceramic brush plate is ground and filled in the pattern layer of the drill hole, so that the height difference is reduced, and the smoothness of the pattern layer is improved; when the pattern layer filled in the drilling hole is sunken in the pattern layer on the surface of the copper foil layer, the ceramic brush plate grinds the pattern layer on the surface of the copper foil layer, and when the pattern layer is lower than a dry film, the ceramic brush plate can level the pattern layer by grinding the dry film, so that the leveling of the pattern layer is realized, and the height difference of the pattern layer is reduced.
In an embodiment of the present invention, when the pattern layer filled in the drilled hole protrudes from the pattern layer on the surface of the copper foil layer, the step of "grinding the protruding pattern layer" includes: and grinding the pattern layer filled in the drill hole. According to the embodiment of the invention, the protruding pattern layer is ground through the ceramic brush plate, so that the pattern layer filled in the drilled hole is ground to be on the same horizontal plane with the pattern layer on the surface of the copper foil layer, thereby reducing the height difference, improving the smoothness of the pattern layer and ensuring the smooth subsequent routing processing of the printed circuit board.
In an embodiment of the present invention, when the pattern layer filled in the drilled hole is recessed in the pattern layer on the surface of the copper foil layer, the step of "grinding the protruding pattern layer" includes: and grinding the pattern layer deposited on the surface of the copper foil layer. In the embodiment of the invention, the protruding graphic layer is ground by the ceramic brush board, so that the graphic layer on the surface of the copper foil layer is ground to be on the same horizontal plane with the graphic layer filled in the drilled hole, thereby reducing the height difference, improving the smoothness of the graphic layer and meeting the processing requirements of customers on the printed circuit board. Of course, when the graphic layer on the surface of the copper foil layer is sunken relative to the dry film, the graphic layer can be leveled by grinding the dry film through the ceramic brush board.
In an embodiment of the present invention, the step of "performing pattern electroplating on the developed copper-clad plate and filling the drilled hole" includes: and placing the copper-clad plate after development treatment in a copper plating solution, and electrolyzing the copper plating solution. According to the invention, copper ions in the copper plating solution are electrolyzed and then deposited on the surface of the copper clad plate to form the pattern layer of copper metal. When the copper clad laminate is etched, the etching solution etches and exposes the copper foil layer exposed on the pattern layer, simultaneously, copper metal on the surface of the pattern layer is also etched, and the pattern layer is deposited on the surface of the copper foil layer, so that the copper metal layer is thicker, and the copper foil layer covering the lower part of the pattern layer is retained in the etching process, thereby forming a fine circuit pattern, and further realizing the processing of the high-density and high-difficulty printed circuit board.
Referring to fig. 1 to 2, in an embodiment of the present invention, the step of "plating copper on the substrate after drilling" includes: and (3) depositing copper on the substrate after drilling by adopting a chemical plating process, and electroplating the substrate after copper deposition. Because the substrate is made of resin materials and does not have conductivity, and direct electroplating cannot be carried out, the method ensures that a thin copper layer is deposited on the surface of the substrate and in the drilled hole by a chemical plating method, and after the copper layer is deposited on the substrate, copper is plated by electrolytic reaction to ensure that copper is deposited on the surface of the copper layer, thereby being beneficial to the formation of subsequent circuit patterns while enhancing the conductivity.
Referring to fig. 1 to 2, in an embodiment of the present invention, the step of pressing the dry film on the surface of the copper foil layer further includes: and placing the copper-clad plate with the copper foil layer in a sodium persulfate solution so as to slightly corrode the copper foil layer by the sodium persulfate solution. The sodium persulfate solution is an aqueous solution of sodium persulfate. According to the embodiment of the invention, sodium persulfate is dissolved in water to form the sodium persulfate solution, so that when the copper-clad plate with the copper foil layer is placed in the sodium persulfate solution, the sodium persulfate has oxidability, and can oxidize the copper metal on the surface of the copper foil layer, so that the micro-etching on the copper foil layer is realized, the dry film can be flatly and tightly pressed on the surface of the copper foil layer, and the circuit pattern on the positive film is favorably transferred to the surface of the copper foil layer through subsequent exposure and development.
In an embodiment of the present invention, the step of removing the dry film exposed on the surface of the copper-clad plate includes: and placing the leveled copper-clad plate in an alkaline solution, and dissolving the dry film exposed on the surface of the copper foil layer. It should be noted that the alkaline solution may be sodium hydroxide, and when the leveled copper clad laminate is placed in the sodium hydroxide, the sodium hydroxide can dissolve the exposed dry film on the surface of the copper clad laminate, so that the circuit pattern on the positive film is transferred to the surface of the copper clad laminate.
In an embodiment of the present invention, the step of etching the copper-clad plate includes: and placing the copper-clad plate after the film is removed in etching solution so that the copper foil layer is etched by the etching solution. It should be noted that the etching solution may be an acidic etching solution, and under the strong oxidizing action of the acidic etching solution, the copper metal of the copper foil layer is continuously oxidized into copper ions, so as to implement etching of the copper foil layer. When the copper clad laminate is etched, the etching liquid etches and exposes the copper foil layer on the pattern layer, simultaneously, copper metal on the surface of the pattern layer is also etched, and the pattern layer is deposited on the surface of the copper foil layer, so that the copper foil layer covering the lower part of the pattern layer is reserved in the etching process, and a fine circuit pattern is formed, and the processing of the high-density and high-difficulty printed circuit board is realized.
Referring to fig. 1 to 2, in an embodiment of the present invention, the step of "plating copper on the substrate after drilling" includes: and cleaning the drill hole by using a potassium permanganate solution so as to remove the debris in the drill hole. Of course, the potassium permanganate solution is an aqueous solution of potassium permanganate. Potassium permanganate has strong oxidizing property, utilizes potassium permanganate's strong oxidizing property, can effectively get rid of the resin piece that remains in the drilling to this effect that reaches clean drilling, thereby copper metal can deposit in drilling perisporium through chemical plating, has improved the cohesion of copper metal and pore wall.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the present specification and directly/indirectly applied to other related technical fields within the spirit of the present invention are included in the scope of the present invention.
Claims (8)
1. A method for manufacturing a printed circuit board is characterized by comprising the following steps:
drilling holes on the surface of a substrate, and plating copper on the drilled substrate to obtain a copper-clad plate with a copper foil layer;
pressing a dry film on the surface of the copper foil layer, attaching a positive film on the surface of the dry film, and exposing the copper-clad plate;
developing the exposed copper clad laminate, and dissolving the unexposed dry film on the surface of the copper clad laminate;
carrying out pattern electroplating on the copper-clad plate after development treatment and filling the drilled holes to form a pattern layer;
leveling the graphic layer, removing the dry film exposed on the surface of the copper clad laminate, and etching the copper clad laminate to obtain a printed circuit board;
the step of "flattening the graphic layer" comprises:
leveling the pattern layer by adopting a ceramic brush plate, and grinding the protruded pattern layer;
when the pattern layer filled in the drilled hole is sunken in the pattern layer on the surface of the copper foil layer, the step of grinding the protruded pattern layer comprises the following steps:
and grinding the pattern layer deposited on the surface of the copper foil layer.
2. The method for manufacturing a printed circuit board according to claim 1, wherein when the pattern layer filled in the drilled hole protrudes from the pattern layer on the surface of the copper foil layer, the step of "grinding the protruding pattern layer" comprises:
and grinding the pattern layer filled in the drill hole.
3. The method for preparing a printed circuit board according to any one of claims 1 to 2, wherein the step of performing pattern plating on the developed copper-clad plate and filling the drilled holes comprises:
and placing the copper-clad plate after development treatment in a copper plating solution, and electrolyzing the copper plating solution.
4. The method for manufacturing a printed circuit board according to any one of claims 1 to 2, wherein the step of "copper-plating the substrate after drilling" comprises:
and (3) depositing copper on the substrate after drilling by adopting a chemical plating process, and electroplating the substrate after copper deposition.
5. The method for manufacturing a printed circuit board according to any one of claims 1 to 2, wherein the step of "laminating a dry film on the surface of the copper foil layer" further comprises:
and placing the copper-clad plate with the copper foil layer in a sodium persulfate solution so as to slightly corrode the copper foil layer by the sodium persulfate solution.
6. The method for preparing a printed circuit board according to any one of claims 1 to 2, wherein the step of removing the dry film exposed on the surface of the copper-clad plate comprises the following steps:
and placing the leveled copper-clad plate in an alkaline solution, and dissolving the dry film exposed on the surface of the copper foil layer.
7. The method for preparing a printed circuit board according to any one of claims 1 to 2, wherein the step of etching the copper-clad plate comprises:
and placing the copper-clad plate after the film is removed in etching solution so that the copper foil layer is etched by the etching solution.
8. The method for manufacturing a printed circuit board according to any one of claims 1 to 2, wherein the step of "copper plating the substrate after drilling" is preceded by:
and cleaning the drill hole by using a potassium permanganate solution so as to remove the debris in the drill hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911091880.7A CN110785017B (en) | 2019-11-08 | 2019-11-08 | Method for preparing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911091880.7A CN110785017B (en) | 2019-11-08 | 2019-11-08 | Method for preparing printed circuit board |
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| Publication Number | Publication Date |
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| CN110785017A CN110785017A (en) | 2020-02-11 |
| CN110785017B true CN110785017B (en) | 2021-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911091880.7A Active CN110785017B (en) | 2019-11-08 | 2019-11-08 | Method for preparing printed circuit board |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113194614A (en) * | 2021-05-06 | 2021-07-30 | 惠州市聚诚盛电子科技有限公司 | Circuit board processing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145230A (en) * | 1991-11-22 | 1993-06-11 | Fujitsu Ltd | Method of forming conductor pattern on glass-ceramic board |
| CN105517370A (en) * | 2015-11-27 | 2016-04-20 | 广州兴森快捷电路科技有限公司 | Circuit board pad machining method |
| CN109310008A (en) * | 2018-10-17 | 2019-02-05 | 欣强电子（清远）有限公司 | A kind of radium-shine two-sided processing Alignment Process |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE40947E1 (en) * | 1997-10-14 | 2009-10-27 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| KR100442918B1 (en) * | 2003-02-06 | 2004-08-02 | 엘지전자 주식회사 | Multi-layer PCB making method |
-
2019
- 2019-11-08 CN CN201911091880.7A patent/CN110785017B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145230A (en) * | 1991-11-22 | 1993-06-11 | Fujitsu Ltd | Method of forming conductor pattern on glass-ceramic board |
| CN105517370A (en) * | 2015-11-27 | 2016-04-20 | 广州兴森快捷电路科技有限公司 | Circuit board pad machining method |
| CN109310008A (en) * | 2018-10-17 | 2019-02-05 | 欣强电子（清远）有限公司 | A kind of radium-shine two-sided processing Alignment Process |
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| CN110785017A (en) | 2020-02-11 |
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