USRE40947E1 - Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole - Google Patents

Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole Download PDF

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Publication number
USRE40947E1
USRE40947E1 US10/829,479 US82947990A USRE40947E US RE40947 E1 USRE40947 E1 US RE40947E1 US 82947990 A US82947990 A US 82947990A US RE40947 E USRE40947 E US RE40947E
Authority
US
United States
Prior art keywords
hole
substrate
layer
filler
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US10/829,479
Inventor
Motoo Asai
Kenichi Shimada
Kouta Noda
Takashi Kariya
Hiroshi Segawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP28049997 priority Critical
Priority to JP34018297A priority patent/JP3564981B2/en
Priority to JP34018097A priority patent/JPH11186728A/en
Priority to JP6706598A priority patent/JP3408417B2/en
Priority to PCT/JP1998/004584 priority patent/WO1999020090A1/en
Application granted granted Critical
Publication of USRE40947E1 publication Critical patent/USRE40947E1/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

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