KR20030081879A - Fabrication process for multi layer aluminum printed wiring board - Google Patents

Fabrication process for multi layer aluminum printed wiring board Download PDF

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Publication number
KR20030081879A
KR20030081879A KR1020020020322A KR20020020322A KR20030081879A KR 20030081879 A KR20030081879 A KR 20030081879A KR 1020020020322 A KR1020020020322 A KR 1020020020322A KR 20020020322 A KR20020020322 A KR 20020020322A KR 20030081879 A KR20030081879 A KR 20030081879A
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KR
South Korea
Prior art keywords
aluminum
printed wiring
wiring board
hole
insulating layer
Prior art date
Application number
KR1020020020322A
Other languages
Korean (ko)
Inventor
김성일
이승준
이성재
Original Assignee
김성일
이승준
이성재
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김성일, 이승준, 이성재 filed Critical 김성일
Priority to KR1020020020322A priority Critical patent/KR20030081879A/en
Publication of KR20030081879A publication Critical patent/KR20030081879A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

PURPOSE: A process for manufacturing a multiple aluminum PCB(Printed Circuit Board) is provided to reduce the manufacturing process by anodizing an initial metal substrate to manufacture the multiple aluminum PCB. CONSTITUTION: A metal substrate(1) is anodized. After anodizing the metal substrate(1), an alumina insulating layer(6) is formed. An aluminum film(5) is deposited on the alumina insulating layer(6) through various methods such as depositing or printing. A through-hole(4) for use in a connection is formed on the aluminum film(5). The through-hole(4) is made of a metal without using an aluminum film as an electrical conductive material of a through-hole. A new aluminum film is deposited on the aluminum film(5).

Description

다층 알루미늄 인쇄 배선 기판 제조 공정 {Fabrication process for multi layer aluminum printed wiring board}Fabrication process for multi layer aluminum printed wiring board

본 발명은 다층 알루미늄 인쇄 배선 기판 제조 공정에 관한 것으로, 좀더 상세하게는 알루미늄 기판을 양극산화하여 알루미나 절연층을 형성하고 알루미늄으로 층간 연결을 위한 관통구멍을 형성하여 다층 인쇄 배선 기판을 가능하게 하는 제조공정에 관한 것이다.The present invention relates to a multi-layer aluminum printed wiring board manufacturing process, and more particularly to anodizing an aluminum substrate to form an alumina insulating layer and to form a through hole for interlayer connection with aluminum to enable a multi-layer printed wiring board. It is about process.

일반적으로 다층 인쇄 배선 기판은 금속기판(1)과 양면기판(7)은 절연층(2)을 이용하여 접착하여 형성한다.In general, the multilayer printed wiring board is formed by bonding the metal substrate 1 and the double-sided substrate 7 by using the insulating layer 2.

종래 다층 인쇄 배선 기판은 양면기판을 따로 제작한 후 절연층으로 이용되는 본딩쉬트(Bonding Sheet)를 사용하여 금속기판 상에 접착하므로 인하여 공정이 복잡하고 번거로운 문제점이 있었다.Conventional multilayer printed wiring boards have a complicated and cumbersome process because the double-sided board is manufactured separately and then bonded onto a metal substrate using a bonding sheet used as an insulating layer.

이에, 본 발명은 상기와 같은 종래의 문제점을 해소하기 위해 인출된것으로, 양면기판을 따로 제작하지 않고 알루미늄 금속기판을 양극산화하여 알루미나 절연층을 형성한 후 알루미늄 박막을 증착하고 이 알루미늄 박막을 이용하여 그 위에 형성될 알루미늄 박막과의 연결을 위한 관통구멍을 형성하여 다층 알루미늄 인쇄 배선 기판을 제조하는 공정에 관한 것이다.Thus, the present invention is drawn to solve the above-mentioned conventional problems, without forming a double-sided board separately, anodizing an aluminum metal substrate to form an alumina insulating layer and then depositing an aluminum thin film and using the aluminum thin film The present invention relates to a process of manufacturing a multilayer aluminum printed wiring board by forming a through hole for connection with an aluminum thin film to be formed thereon.

도 1은 종래기술에 따른 다층 인쇄 배선 기판 제조 방법을 설명하기 위한 개략도.1 is a schematic view for explaining a method for manufacturing a multilayer printed wiring board according to the prior art.

도 2는 본 발명에 따른 다층 인쇄 배선 기판 제조 방법을 설명하기 위한 개략도.2 is a schematic view for explaining a method for manufacturing a multilayer printed wiring board according to the present invention.

※ 도면의 주요 부분에 대한 부호의 설명 ※ Explanation of codes for main parts of drawing

1 : 금속기판 2 : 절연층1: metal substrate 2: insulating layer

3 : 동박 4 : 관통구멍(Via Hole)3: copper foil 4: through hole

5 : 알루미늄 6 : 알루미나5: aluminum 6: alumina

7 : 양면기판7: double sided board

이하, 첨부된 도면을 참조하여 본 발명에 따른 다중 알루미늄 인쇄 배선 기판 제조 공정을 상세히 설명하면 다음과 같다.Hereinafter, a multi-aluminum printed wiring board manufacturing process according to the present invention with reference to the accompanying drawings in detail as follows.

도 2는 본 발명에 따른 다층 알루미늄 인쇄 배선 기판 제조 공정을 설명하기 위한 개략도로서, 상기 도 2는 도시된 바와 같이, 본 발명에 따른 제조 공정은, 금속기판(1)을 양극산화하여 알루미나 절연층(6)을 형성한다.Figure 2 is a schematic diagram for explaining a manufacturing process of a multilayer aluminum printed wiring board according to the present invention, Figure 2 is a manufacturing process according to the present invention, as shown in Figure 2, an alumina insulating layer by anodizing the metal substrate (1) (6) is formed.

절연층 위에 증착이나 프린팅등 여러가지 방법을 사용하여 알루미늄 박막(5)을 입힌다. 이 알루미늄 박막 위에 절연층을 형성하는 연결할 관통구멍(4)을 형성한다.The aluminum thin film 5 is coated on the insulating layer by various methods such as deposition and printing. The through-holes 4 which form an insulating layer are formed on this aluminum thin film.

이 위에 새로운 알루미늄 박막(5)을 입혀서 다층 배선이 가능하게 한다.On top of this, a new aluminum thin film 5 is coated to enable multilayer wiring.

이상에서 설명한 바와 같이 본 발명에 따르면 기존 공정은 양면기판을 따로 제작하여 금속기판에 접착하는데 반하여, 최초의 금속기판을 양극산화하여 다층 알루미늄 인쇄 배선 기판을 제작하여 공정의 단순화와 저 공정비용을 얻는 효과가 있다.As described above, according to the present invention, a conventional double-sided substrate is separately manufactured and bonded to a metal substrate, whereas the first metal substrate is anodized to produce a multilayer aluminum printed wiring board to obtain a simplified process and a low process cost. It works.

Claims (2)

다층 알루미늄 인쇄 배선 기판 제조 공정에 있어서 알루미늄 금속기판을 양극산화하여 절연층을 형성하는 단계와 그 위에 알루미늄 박막을 입힌 뒤 절연층을 다시 형성하면서 관통구멍을 제조하는 단계 및 이 관통구멍을 형성하는 알루미늄 위에 다시 알루미늄 박막을 입혀 다층 기판을 적층하는 단계를 포함하여 구성된 것을 특징으로 하는 다층 알루미늄 인쇄 배선 기판 제조 공정.Anodizing an aluminum metal substrate to form an insulating layer in a multilayer aluminum printed wiring board manufacturing process, manufacturing a through hole while forming an insulating layer by coating an aluminum thin film thereon, and forming the through hole. And laminating a multilayer substrate by coating an aluminum thin film on the multilayer aluminum printed wiring board manufacturing process. 제 1 항에 있어서 알루미늄 박막을 관통구멍의 전기 전도용 재료로 사용하지 않고 다른 금속을 사용하여 관통구멍을 형성하는 인쇄 배선 기판 제조 공정.The process for producing a printed wiring board according to claim 1, wherein a through hole is formed using another metal without using the aluminum thin film as an electrically conductive material for the through hole.
KR1020020020322A 2002-04-15 2002-04-15 Fabrication process for multi layer aluminum printed wiring board KR20030081879A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726240B1 (en) * 2005-10-04 2007-06-11 삼성전기주식회사 Electronic components embedded PCB and the method for manufacturing thereof
KR100860533B1 (en) * 2007-03-23 2008-09-26 (주)웨이브닉스이에스피 Method of fabricating metal pcb
KR100907508B1 (en) * 2007-07-31 2009-07-14 (주)웨이브닉스이에스피 Package board and its manufacturing method
KR100907721B1 (en) * 2007-06-25 2009-07-14 박계찬 Circuit board and manufacturing method thereof
KR101045307B1 (en) * 2009-08-07 2011-06-29 주식회사 유앤비오피씨 Method for manufacturing metal core pcb
KR101109243B1 (en) * 2009-12-28 2012-01-30 삼성전기주식회사 Multi-layer circuit board and method of manufacturing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960001351A (en) * 1994-06-17 1996-01-25 김광희 Automatic snapper
JPH0918153A (en) * 1995-06-29 1997-01-17 Hitachi Chem Co Ltd Single sided metal base multilayer printed wiring board
JPH09199853A (en) * 1996-01-22 1997-07-31 Sanyo Electric Co Ltd Multilayer interconnection board and manufacture thereof
JPH10296908A (en) * 1997-04-25 1998-11-10 Hitachi Chem Co Ltd Manufacture of aluminum-sheet-base copper-clad laminated sheet

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960001351A (en) * 1994-06-17 1996-01-25 김광희 Automatic snapper
JPH0918153A (en) * 1995-06-29 1997-01-17 Hitachi Chem Co Ltd Single sided metal base multilayer printed wiring board
JPH09199853A (en) * 1996-01-22 1997-07-31 Sanyo Electric Co Ltd Multilayer interconnection board and manufacture thereof
JPH10296908A (en) * 1997-04-25 1998-11-10 Hitachi Chem Co Ltd Manufacture of aluminum-sheet-base copper-clad laminated sheet

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726240B1 (en) * 2005-10-04 2007-06-11 삼성전기주식회사 Electronic components embedded PCB and the method for manufacturing thereof
KR100860533B1 (en) * 2007-03-23 2008-09-26 (주)웨이브닉스이에스피 Method of fabricating metal pcb
KR100907721B1 (en) * 2007-06-25 2009-07-14 박계찬 Circuit board and manufacturing method thereof
KR100907508B1 (en) * 2007-07-31 2009-07-14 (주)웨이브닉스이에스피 Package board and its manufacturing method
KR101045307B1 (en) * 2009-08-07 2011-06-29 주식회사 유앤비오피씨 Method for manufacturing metal core pcb
KR101109243B1 (en) * 2009-12-28 2012-01-30 삼성전기주식회사 Multi-layer circuit board and method of manufacturing the same

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