CN107690230A - A kind of method for making metallic circuit and metallic circuit component - Google Patents
A kind of method for making metallic circuit and metallic circuit component Download PDFInfo
- Publication number
- CN107690230A CN107690230A CN201710676200.2A CN201710676200A CN107690230A CN 107690230 A CN107690230 A CN 107690230A CN 201710676200 A CN201710676200 A CN 201710676200A CN 107690230 A CN107690230 A CN 107690230A
- Authority
- CN
- China
- Prior art keywords
- metallic circuit
- insulating barrier
- making
- glass
- substrate surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a kind of method for making metallic circuit and metallic circuit component, method to comprise the following steps：Insulating layer coating is applied in the substrate surface of glass or ceramics；Elective irradiation is carried out to the insulating barrier by laser；Chemical plating, which is carried out, in the surface of insulating layer forms metallic circuit.Insulating barrier be spraying, print, bat printing, dust or be coated with by way of be coated in the substrate surface on.This method can be realized makes electronic circuit on glass or ceramic material；It is by allowing glass or ceramic material to turn into the carrier of feature circuit, so as to save space；Cost is relatively low, and technique is relatively easy, improves processing yield.
Description
Technical field
The present invention relates to metallic circuit to make correlative technology field, more particularly to a kind of to be made on glass and ceramic material
The method and metallic circuit component of metallic circuit.
Background technology
On current electronic product, glass screen is simply as printing opacity and the guard block of outward appearance, merely on glass
Have no idea to make electronic circuit, based on existing technology, electronic circuit can not be produced on glass.Either electroplate
Or change plating, be required for carrier of the metal ion as circuit, glass composition itself is the inorganic material of silicates, can not
Direct Electroplating plates required electronic circuit.So glass can only be as structure member, and electronic circuit can be only arranged in
On other touch-screens or FPC；As other single device.
On current electronic product, many ceramic materials are intended only as structural member around high-frequency component.Or pass through
Complicated processing technology, by circuit package inside ceramic component, so as to form function element.Similarly, ceramics are inorganic material,
Plating and change plating equally directly can not form plating sandwich circuit in material surface in itself.
At present there is following major defect in the product of metal electron circuit：
1) glass is only used as structural detail, and part surface is because technique can not make, and can not arrange electronic circuit, wastes
Many available spaces；If making electronic circuit needs extra arrangement electronic component or special process, it is added significantly to
Processing cost.
2) application of some ceramic materials, a part is because smaller to high-frequency signal loss, as antenna surrounding enviroment knot
Component, not electronic circuit can arrange up, waste many spaces.Another part in itself, is passed through as electronic component
Complicated Flow is processed circuit inside ceramic material, increases in cost a lot.
The content of the invention
It is an object of the invention to provide a kind of method and metallic circuit for making metallic circuit, to solve existing metal
In line manufacturing process, metallic circuit can not be made on glass and ceramic material and caused by cost is higher, space waste, work
The problem of skill complexity.
To achieve the above object, the invention provides a kind of method for making metallic circuit, comprise the following steps：
Insulating layer coating is applied in the substrate surface of glass or ceramics；
Elective irradiation is carried out to the insulating barrier by laser；
Chemical plating, which is carried out, in the surface of insulating layer forms metallic circuit.
It is preferred that the plated film made by the non-conductive plating of NCVM is provided between base material and insulating barrier.
It is preferred that the thickness of the plated film is 2 μm.
It is preferred that when the material of the insulating barrier is paints, interconnection layer is additionally provided between the base material and insulating barrier.
It is preferred that the material of the interconnection layer is PEI, isocyanates, polybutadiene or polyurethane, Yi Jibiao
Face accelerator.
It is preferred that also include coupling agent in the material of the insulating barrier.
It is preferred that also include laser optics absorbent in the material of the insulating barrier.
It is preferred that also include changing plating accelerator in the material of the insulating barrier.
It is preferred that the insulating barrier be spraying, print, bat printing, dust or be coated with by way of be coated in the base material
On surface.
It is preferred that the making material of the insulating barrier is high polymer material.
It is preferred that the material main component of the insulating barrier includes synthetic resin and the additive of mediation, or be modified
Synthetic resin and the additive of mediation.
It is preferred that the additive includes emulsifying agent, plasticizer, drier, stabilizer, anti-blushing agent, curing agent, moistening
Agent, dispersant and/or colouring agent.
It is preferred that when applying insulating layer coating, have by being matched colors to the insulating barrier to be formed in the substrate surface
The back end of different colours or pattern.
Present invention also offers a kind of metallic circuit component, including：
The base material of glass or ceramics；
Insulating barrier coated on the substrate surface；
And the metallic circuit in the surface of insulating layer.
It is preferred that the plated film made by the non-conductive plating of NCVM is additionally provided between the base material and insulating barrier.
It is preferred that the thickness of the plated film is 2 μm.
It is preferred that when the material of the insulating barrier is paints, interconnection layer is additionally provided between the base material and insulating barrier.
It is preferred that the insulating barrier forms the back end with different colours or pattern in the substrate surface.
The invention has the advantages that：
(1) this method can be realized makes electronic circuit on glass or ceramic material；
(2) this method allows glass or ceramic material to turn into the carrier of feature circuit, so as to save space；
(3) this method does not need special painting insulating layer coating, it is not necessary to which any additive is in a insulating layer, you can realizes glass
Circuit on glass or ceramic material makes, and reduces cost；
(4) this method only needs the painting insulating layer coating on glass or ceramic material to realize that technique is relatively easy, carries
High processing yield.
Brief description of the drawings
Fig. 1 is the metallic circuit dimensional structure diagram that the preferred embodiment of the present invention makes；
Fig. 2 is the metallic circuit side, sectional structure chart that the preferred embodiment of the present invention makes；
Fig. 3 is the inventive method flow chart.
Embodiment
Below with reference to the accompanying drawing of the present invention, clear, complete description is carried out to the technical scheme in the embodiment of the present invention
And discussion, it is clear that as described herein is only a part of example of the present invention, is not whole examples, based on the present invention
In embodiment, the every other implementation that those of ordinary skill in the art are obtained on the premise of creative work is not made
Example, belongs to protection scope of the present invention.
For the ease of the understanding to the embodiment of the present invention, make further by taking specific embodiment as an example below in conjunction with accompanying drawing
Illustrate, and each embodiment does not form the restriction to the embodiment of the present invention.
As shown in Figures 1 and 2, a kind of metallic circuit component is present embodiments provided, including：
The base material 30 of glass or ceramic material；
Insulating barrier 10 coated on the surface of base material 30；
And the metallic circuit 20 in the surface of insulating layer.
The metallic circuit component realizes makes electronic circuit on glass or ceramic material, it is only necessary in glass or
Insulating layer coating is applied on ceramic material to be realized, simple in construction, improve processing yield.In addition, the gold that the present embodiment is provided
Category circuit can be applied to mobile terminal as needed, for example, handheld communication devices for example mobile phone, tablet personal computer, intelligent watch or
Other wearable devices etc. need to make in the equipment of electronic circuit, have wide range of applications.It the method achieve simultaneously and allow glass
Or ceramic material turns into the carrier of feature circuit, so as to save space, and the metallic circuit component may be such that circuit place
Equipment save the more device spaces.It should be appreciated that accompanying drawing 1 and accompanying drawing 2 are merely illustrative the metallic circuit of the present invention
The structure composition of component, the form of specific base material, the structure of metallic circuit, shape can be according to different usage scenarios, upper
On the architecture basics for stating three parts, adaptive change is carried out to the shape of base material, insulating barrier and metallic circuit, not limited here
It is the structure type shown in accompanying drawing 1 and accompanying drawing 2.
Wherein, insulating barrier be spraying, print, bat printing, dust or be coated with by way of be coated in the substrate surface on
's.
In a preferred embodiment, it is additionally provided between base material 30 and insulating barrier 10 and is made by the non-conductive plating of NCVM
Plated film.Wherein, the thickness of plated film is preferably 2 μm.In other preferred embodiments, the thickness of non-conductive plated film is usually 2 μm
Left and right.
When the material of insulating barrier is paints, interconnection layer is additionally provided between base material and insulating barrier.The material of interconnection layer is poly-
Etherimide, isocyanates, polybutadiene or polyurethane, and surface promoter.
In other preferred embodiments, in the material of insulating barrier also include coupling agent, laser optics absorbent and/or
Change plating accelerator.
In variant embodiment, the making material of insulating barrier is high polymer material.Wherein, the material main component of insulating barrier
Additive including synthetic resin and mediation, or modified synthetic resin and the additive of mediation.Here additive bag
Include emulsifying agent, plasticizer, drier, stabilizer, anti-blushing agent, curing agent, wetting agent, dispersant and/or colouring agent.
Insulating barrier forms the back end with different colours or pattern in the substrate surface.Specially applying insulating layer coating
When, form the back end with different colours or pattern in the substrate surface by being matched colors to the insulating barrier.
As shown in figure 3, the method for the making metallic circuit that the present embodiment provides, comprises the following steps：
S1：Insulating layer coating is applied in the substrate surface of glass material or ceramic material；
S2：Elective irradiation is carried out to the insulating barrier by laser；
S3：Chemical plating, which is carried out, in the surface of insulating layer forms metallic circuit.
Wherein, the method for the making metallic circuit realizes and electronic circuit is made on glass or ceramic material, and makes
Only need the painting insulating layer coating on glass or ceramic material to realize that technique is relatively easy during work, improve processing
Yield.In addition, the metallic circuit component obtained made by the method that the present embodiment is provided can be applied to movement as needed
Terminal, such as handheld communication devices such as mobile phone, tablet personal computer, intelligent watch or other wearable devices etc. need to make electronics
In the equipment of circuit, have wide range of applications.It the method achieve simultaneously and allow glass or ceramic material to turn into feature circuit
Carrier, so as to save space, and the equipment saving where the metallic circuit made by this method may be such that circuit is more set
Standby space.
With reference to shown in figure 1 and Fig. 2, specifically, insulating layer coating 10 is applied on the surface of base material 30 first, then, passes through laser pair
Insulating barrier 10 carries out elective irradiation, specially carries out radiation exposure to the land required for metallic circuit 20 to be produced,
So as to form irradiation area, finally, chemical plating is carried out in surface of insulating layer, form the metallic circuits 20 of needs, gold during chemical plating
Category particle can irradiate the irradiation area to be formed in above-mentioned laser and be deposited, and obtain metallic circuit, as electronic connecting line road or
Radiofrequency signal circuit.So as to realize electronic circuit is made on glass or ceramic material.It should here be understood that accompanying drawing 2 and Fig. 3 institutes
The metallic circuit structure and form that the making shown obtains are only herein used in example, but the making metallic circuit that the present embodiment provides
Method be applied to need the metallic circuit of any structure type made on ceramics or glass material.
This method for making metallic circuit then is made on the insulating layer by applying insulating layer coating on the surface of glass or ceramics
Make metallic circuit, realize the purpose that metallic circuit is made on glass and ceramic material.Meanwhile the preparation method is due to glass
Or ceramic material uses directly as base material, can directly arrange electronic circuit, take full advantage of the space residing for metallic circuit,
And the mode technique for setting up insulating barrier is simple, it is easy to accomplish, cost is relatively low.In addition, special process is not needed to carry out in this method
Apply insulating layer coating, it is not required that any additive is in a insulating layer, you can realize that the circuit on glass or ceramic material makes, drop
Low cost of manufacture.
In above-mentioned step S1, the base material of glass material or ceramic material first to needing to process metallic circuit is carried out
The processing of insulating barrier, when applying insulating layer coating, specifically can spraying, print, bat printing, dust or be coated with by way of by insulation material
On the substrate surface that material is formed coated in ceramics to be processed or glass material.
And in step s 2, the shape of the metallic circuit specially made as needed, it is by wavelength on the insulating layer
100~20000 nanometers of laser carries out the radiation exposure of selectivity to insulating barrier, so as to form irradiation area on the insulating layer,
Wherein, the surface of irradiation area is by laser damage, consequently facilitating metal deposit when subsequent chemistry is plated.
Then in step s3, the irradiation area to be formed is irradiated to laser using the chemical reagent with conductive metal ion to enter
Row metal ion is reduced and deposited, and because irradiation area surface is modified, rather than irradiation area is surface unmodified, therefore,
Only irradiation area can be with metal ions, and then final metallic circuit is formed by chemical plating.In some improved realities
Apply in example, with the improvement or change of insulating layer material, (material of such as insulating barrier is high-molecular compound and adds interface processing
During agent, now, dense film can be formed after insulating barrier coating on surface, the dense film can be destroyed after laser irradiation), then correspond to
, this step S3 also includes carrying out activation process, activation using chemical agent to the irradiation area obtained after laser radiation exposure
Metal activation and metal ion reduction are carried out after processing again, and then metallic circuit is formed by changing plating.
Wherein, in step sl, when being coated insulating barrier, specifically also include by being matched colors to insulating barrier, with reality
Present glass or ceramic substrate surface form the back end with different colours or pattern, and then are subsequent technique process such as progress
As reference when laser irradiates, so as to provide facility, difference color matching also increases the diversity and aesthetic property of product appearance.
In the present embodiment, the making material of above-mentioned insulating barrier is high polymer material.Specifically, the material master of insulating barrier
Wanting composition includes the additive of synthetic resin and mediation, or insulating barrier material main component include modified synthetic resin and
The additive of mediation.Wherein, additive here includes emulsifying agent, plasticizer, drier, stabilizer, anti-blushing agent, solidification
The compositions such as agent, wetting agent, dispersant and/or colouring agent.Modified synthetic resin can select as such as acrylic acid alkyd as needed
The materials such as resin, acrylated polyurethane resin.
One deformation embodiment in, when above-mentioned insulating barrier making material for paint when, then glass or ceramics
Interconnection layer is additionally provided between base material and insulating barrier.The interconnection layer is used to improve attachment of the paint in ceramics or the substrate surface of glass
Power, the adhesive force particularly on glass surface, to avoid subsequently during chemical plating the paint from occurring peeling off or bubble shows
As causing product bad.Here the material of interconnection layer can be PEI, isocyanates, polybutadiene or polyurethane, with
And the surface promoter being used cooperatively with above-mentioned different materials.
In the embodiment of another deformation, coupling agent is also included in the making material of above-mentioned insulating barrier.It is adopted here
Coupling agent effect and improve glass or ceramics base material and coated insulation interlayer adhesive force, so as to avoid absolutely
Due to being bonded making that is bad and influenceing metallic circuit and product quality between edge layer and base material.
In the embodiment of another deformation, laser optics absorbent is also included in the making material of above-mentioned insulating barrier, this
For sample when doing laser, the energy absorption of laser can more fully, can advantageously for material activation.It can also be with idol
Connection agent is used together.
In a further preferred embodiment, also set between the base material and coated insulating barrier that glass or ceramics are formed
There is the plated film made by the non-conductive plating of NCVM.Here by using NCVM technologies so that metal material is in vacuum environment
Under be converted into particle, so as to be attached to the product surface for needing plated film, form the non-conductive plated film of specific metallic character, this is not led
The thickness of electroplating film is usually 2 μm or so.This non-conductive film with metal color, can increase production on appearance color
The diversity of product.Preferably, the thickness of the plated film in the present embodiment is arranged to 2 μm.Plated film is relatively thin, while meets in coated substrate
Set the plated film of insulation to improve the effect of coating in order to the coating of insulating barrier before insulating barrier, avoid insulation displacement, come off or
Bubble.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those skilled in the art the invention discloses technical scope in, to the present invention deformation or replacement done, should all cover
Within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by described scope of the claims.
Claims (16)
- A kind of 1. method for making metallic circuit, it is characterised in that comprise the following steps：Insulating layer coating is applied in the substrate surface of glass or ceramics；Elective irradiation is carried out to the insulating barrier by laser；Chemical plating, which is carried out, in the surface of insulating layer forms metallic circuit.
- 2. the method according to claim 1 for making metallic circuit, it is characterised in that be provided between base material and insulating barrier The plated film made by the non-conductive plating of NCVM.
- 3. the method according to claim 2 for making metallic circuit, it is characterised in that the thickness of the plated film is 2 μm.
- 4. the method according to claim 1 for making metallic circuit, it is characterised in that when the material of the insulating barrier is oil During paint, interconnection layer is additionally provided between the base material and insulating barrier.
- 5. the method according to claim 4 for making metallic circuit, it is characterised in that the material of the interconnection layer is polyethers Acid imide, isocyanates, polybutadiene or polyurethane, and surface promoter.
- 6. the method according to claim 1 for making metallic circuit, it is characterised in that also wrapped in the material of the insulating barrier Include coupling agent, laser optics absorbent and/or personization plating accelerator.
- 7. it is according to claim 1 make metallic circuit method, it is characterised in that the insulating barrier be by spraying, Printing, bat printing, the mode dusting or be coated with are coated on the substrate surface.
- 8. the method according to claim 1 for making metallic circuit, it is characterised in that the making material of the insulating barrier is High polymer material.
- 9. the method for the making metallic circuit according to claim 1 or 8, it is characterised in that the material master of the insulating barrier Composition is wanted to include synthetic resin and the additive of mediation, or modified synthetic resin and the additive of mediation.
- 10. it is according to claim 9 make metallic circuit method, it is characterised in that the additive include emulsifying agent, Plasticizer, drier, stabilizer, anti-blushing agent, curing agent, wetting agent, dispersant and/or colouring agent.
- 11. the method according to claim 1 for making metallic circuit, it is characterised in that when applying insulating layer coating, by institute Insulating barrier is stated to be matched colors to form the back end with different colours or pattern in the substrate surface.
- A kind of 12. metallic circuit component, it is characterised in that including：The base material of glass or ceramics；Insulating barrier coated on the substrate surface；And the metallic circuit in the surface of insulating layer.
- 13. metallic circuit component according to claim 12, it is characterised in that also set between the base material and insulating barrier It is equipped with the plated film made by the non-conductive plating of NCVM.
- 14. metallic circuit component according to claim 13, it is characterised in that the thickness of the plated film is 2 μm.
- 15. metallic circuit component according to claim 12, it is characterised in that when the material of the insulating barrier is paint When, it is additionally provided with interconnection layer between the base material and insulating barrier.
- 16. metallic circuit component according to claim 12, it is characterised in that the insulating barrier is in the substrate surface shape Into the back end with different colours or pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710676200.2A CN107690230A (en) | 2017-08-09 | 2017-08-09 | A kind of method for making metallic circuit and metallic circuit component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710676200.2A CN107690230A (en) | 2017-08-09 | 2017-08-09 | A kind of method for making metallic circuit and metallic circuit component |
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| Publication Number | Publication Date |
|---|---|
| CN107690230A true CN107690230A (en) | 2018-02-13 |
Family
ID=61152566
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710676200.2A Pending CN107690230A (en) | 2017-08-09 | 2017-08-09 | A kind of method for making metallic circuit and metallic circuit component |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420300A (en) * | 2020-11-11 | 2021-02-26 | 昆山丰景拓电子有限公司 | Novel resistor and manufacturing method thereof |
| CN112770541A (en) * | 2020-12-07 | 2021-05-07 | 深圳市隆利科技股份有限公司 | Processing method for improving surface roughness of flexible circuit board and flexible circuit board |
| CN113099620A (en) * | 2021-03-29 | 2021-07-09 | 华南理工大学 | Method for preparing metal circuit on glass by utilizing laser plasma sputtering |
| CN113543503A (en) * | 2021-09-16 | 2021-10-22 | 新恒汇电子股份有限公司 | Preparation method of novel carrier band with conductive ceramic coating |
| WO2021232817A1 (en) * | 2020-05-18 | 2021-11-25 | 广东小天才科技有限公司 | Circuit manufacturing method and lds antenna |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021232817A1 (en) * | 2020-05-18 | 2021-11-25 | 广东小天才科技有限公司 | Circuit manufacturing method and lds antenna |
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| CN112770541A (en) * | 2020-12-07 | 2021-05-07 | 深圳市隆利科技股份有限公司 | Processing method for improving surface roughness of flexible circuit board and flexible circuit board |
| CN113099620A (en) * | 2021-03-29 | 2021-07-09 | 华南理工大学 | Method for preparing metal circuit on glass by utilizing laser plasma sputtering |
| CN113543503A (en) * | 2021-09-16 | 2021-10-22 | 新恒汇电子股份有限公司 | Preparation method of novel carrier band with conductive ceramic coating |
| CN113543503B (en) * | 2021-09-16 | 2021-12-10 | 新恒汇电子股份有限公司 | Preparation method of conductive ceramic coating carrier tape |
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