CN102891359A - Manufacturing process of mobile phone built-in printed antenna - Google Patents

Manufacturing process of mobile phone built-in printed antenna Download PDF

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Publication number
CN102891359A
CN102891359A CN2011102060893A CN201110206089A CN102891359A CN 102891359 A CN102891359 A CN 102891359A CN 2011102060893 A CN2011102060893 A CN 2011102060893A CN 201110206089 A CN201110206089 A CN 201110206089A CN 102891359 A CN102891359 A CN 102891359A
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Prior art keywords
antenna
built
copper film
mobile phone
electroplating
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CN2011102060893A
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Chinese (zh)
Inventor
刘明胜
姜吉求
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Shenzhen Everwin Precision Technology Co Ltd
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Shenzhen Everwin Precision Technology Co Ltd
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Priority to CN2011102060893A priority Critical patent/CN102891359A/en
Publication of CN102891359A publication Critical patent/CN102891359A/en
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Abstract

The invention provides a manufacturing process of a mobile phone built-in printed antenna, and the manufacturing process comprises the following steps of: carrying out injection moulding on plastic raw materials to form a basic shape of the mobile phone built-in printed antenna, printing conductive ink at an appointed position on the plastic surface of the injection moulded antenna model by using a mobile printing process so as to prepare for the next copper film electroplating, electroplating a copper film at an appointed position on the plastic surface of the printed plastic antenna model by using an electroplating process to ensure that the antenna has a conduction function and a signal reception function, and electroplating nickel on the outer surface of the mobile phone antenna electroplated with the copper film except for the external-connection conduction positions of the anode and cathode end points of the built-in antenna so as to protect the electroplated copper film layer. Moreover, gold plating can be carried out at the external-connection conduction position of the grounding end point of the built-in antenna and actually required color can be coated on the surface of the electroplated built-in antenna. According to the manufacturing process, the antenna gain and the bandwidth are not reduced, the signal strength is good and the production cost is reduced.

Description

A kind of manufacture craft of embedded in mobile phone printed antenna
Technical field
The present patent application relates to a kind of manufacture craft of antenna, especially a kind of manufacture craft that is applied to the built-in printed antenna of small size of wireless terminal device.
Background technology
Along with the fast development of wireless communication technology, as the mobile phone of wireless communication terminal also towards the future development of volume miniaturization and functional diversities.Therefore size and the weight as the antenna (comprising radiant body and floor) of mobile phone important component part also needs to reduce accordingly, to satisfy the requirement of terminal equipment miniaturization.
At present antenna for mobile phone is mainly with regard to two kinds of built-in and external antennas, setting up of antenna all is as far as possible away from ground and building, when antenna approaches with reference to ground, most of energy will concentrate on antenna and with reference between the ground, and can't launch smoothly, so antenna transmission needs a space of opening as far as possible.And the mobile phone circuit version is exactly the reference ground of antenna for mobile phone, allows antenna away from other circuit of mobile phone, is the key that improves the antenna for mobile phone emission effciency.But be subject to the actual environment restriction and pursue requirement easy to carry, the design of mobile phone just must be made compromise aspect electric.In fact, the gain of the reception transtation mission circuit of all GSM mobile handset all can be regulated automatically according to environmental change, can pass through rational setting parameter, can the relevant loss of auto-compensation.So with regard to mobile phone generally speaking, in the relatively good situation of signal, internal antenna and outside antenna can not be found out difference.
In existing built-in aerial, all be the FPC built-in antenna of mobile phone that the FPC material is made mainly, FPC is flexible circuit board, built-in antenna of mobile phone designs, and uses FPC to make, and is attached to the mobile phone shell inboard, is connected with miscellaneous part with thimble with support.
Yet the existing method that reduces printed antenna usually is to reduce antenna gain and bandwidth is cost.Therefore, how when not reducing antenna gain and bandwidth, designing the good printed antenna of radiance with less area then is the pendulum problem that solves of needing in the field of business.
Summary of the invention
The present patent application namely is the defects that exists for present embedded in mobile phone printed antenna, and a kind of new built-in antenna of mobile phone product and process program are provided, and purpose is to adopt new antenna manufacturing process, plays saving, energy-saving and environmental protection effect.
The manufacture craft of the described embedded in mobile phone printed antenna of the present patent application is to realize by following technical scheme:
The technique of described built-in printed antenna comprises following step:
Step 1: injection mo(u)lding: adopt injection mo(u)lding, use the plastic cement raw material to be injection molded into the basic configuration of built-in antenna of mobile phone;
Step 2: printing conductive inks: the antenna prototype that injection mo(u)lding is good, use mobile printing technique, at the position of plastic surface appointment printing conductive inks, realize that by glue heading brush 3-D graphic can realize good antenna performance at the terminal structure of various complexity, for next step electroplating copper film ready;
Step 3: electroplating copper film: with the antenna plastic cement prototype that prints, use electroplating technology, at the position of plastic surface appointment electroplating copper film, make it to possess the function of conduction and signal reception.
Further, the technique of described built-in printed antenna also is included in the step that electroplating copper film increases an electronickelling afterwards, and described step is:
Electronickelling: the extexine re-plating nickel that will electroplate the antenna for mobile phone of copper film; but do not comprise the external conduction position of built-in aerial both positive and negative polarity end points; namely be commonly called as the position into " golden finger "; good copper film layer is electroplated in protection, prevents copper film layer generation oxidation and causes conducting electricity disappearance with signal receiving function.
Perhaps, the technique of described built-in printed antenna, also being included in electroplating copper film increases spraying printing ink and gold-plated step afterwards, and described step is:
Spraying printing ink: will electroplate the color of complete built-in aerial surface spraying actual needs, and except the golden finger that ground termination points exposes, block herein, spraying printing ink contact and residual can not be arranged;
Gold-plated processing: do gold-plated processing at the external conduction position of built-in aerial ground termination points.
Further, the technique of described built-in printed antenna can also be in the same place above-mentioned electronickelling, spraying printing ink with gold-plated treatment combination, after finishing the step of electroplating copper film, carry out successively electronickelling, spraying printing ink and gold-plated processing.
Further, can also be at the extexine of the antenna for mobile phone that will electroplate copper film before the electronickelling through chemical nickel plating again after the catalysis.
Wherein, injection mo(u)lding is that the material that melts that is heated is injected die cavity by high pressure, behind cooling curing, obtains the method for formed products, is quite ripe at present process.
Electrically conductive ink (electrically conductive printing ink) is by metallic conducting particle (silver, copper, carbon, be generally silver) be dispersed in a kind of conductive composite material that forms in the link stuff, after being printed onto on the stock, play the effect of wire, antenna and resistance.After the electrically conductive ink drying, because the distance between conducting particles diminishes, free electron moves the formation electric current along the extra electric field direction, has good electric conductivity.Comprise that mainly gold is that conductive ink, silver are that conductive ink, copper are that conductive ink, carbon series conductive China ink etc. have reached practical, be used for the materials such as printed circuit, electrode, plating bottom, keyboard contact, printed resistor.
Electrically conductive ink is comprised of electroconductive stuffing, binder, solvent and additive.Electroconductive stuffing uses silver powder and the copper powder of good conductivity, sometimes also uses bronze, graphite, carbon black, carbon fibre, nickel powder etc.; Synthetic resin as binder has epoxy resin, alkyd resins, acrylic resin, polyurethane resin, melamine resin, phenolic resins, vinyl chloride-vinyl acetate copolymer resin etc.; Solvent is mid-boiling point (120-230 ℃) solution that the silk-screen ink of these resins of dissolving is used; In addition, add as required the additives such as dispersant, slipping agent, coupling agent.
Golden finger is comprised of flavous conductive contact blade, because its surface gold-plating and conductive contact blade are arranged such as finger-shaped, so be called " golden finger ".Golden finger is actually in copper-clad plate and is covered with layer of gold by special process again, because the non-oxidizability of gold is extremely strong, and conductibility is also very strong.
The manufacture craft of the described embedded in mobile phone printed antenna of the present patent application does not reduce antenna gain and bandwidth, and signal strength signal intensity is good, and reduces production costs, the competitiveness of improving price.
Description of drawings
Fig. 1-Fig. 6 is the process flow diagram of the stages among the manufacture craft embodiment of the described embedded in mobile phone printed antenna of the present patent application;
Wherein, 1 is that phone cover, 2 is that conductive ink layer, 3 is that copper film layer, 4 is that electroless nickel layer, 5 is that the external conduction position of both positive and negative polarity end points, 6 is for spraying ink lay.
Embodiment
Be described below in conjunction with the manufacture craft of accompanying drawing to the described embedded in mobile phone printed antenna of the present patent application; purpose is better to understand the described technology contents of the present patent application for the public; rather than to the restriction of described technology contents; in fact; with the principle identical or approximate with the present invention; to the improvement of described manufacture craft, comprise the change of antenna pattern of process conditions, all within the present patent application technical scheme required for protection.
Embodiment one
The manufacture craft of the described embedded in mobile phone printed antenna of the present patent application is to realize by following technical scheme:
The technique of described built-in printed antenna comprises following step:
Step 1: as shown in Figure 1, adopt the basic configuration that is injection molded into built-in antenna of mobile phone, its shape can be independent antenna prototype, also can be attached to plastic shell or the plastic cellphone lid 1 of mobile phone, and concrete shape is finalized the design according to mobile phone actual design needs;
Step 2: as shown in Figure 2, the antenna prototype that injection mo(u)lding is good is used mobile printing technique, at the position of plastic surface appointment printing conductive inks layer 2, for next step electroplating copper film ready;
Step 3: as shown in Figure 3, with the antenna plastic cement prototype that prints, use electroplating technology, at the position of plastic surface appointment electro-coppering rete 3, make it to possess the function of conduction and signal reception.
Embodiment two
The technique of described built-in printed antenna comprises following step:
Step 1: as shown in Figure 1, adopt the basic configuration that is injection molded into built-in antenna of mobile phone, its shape can be independent antenna prototype, also can be attached to plastic shell or the plastic cellphone lid 1 of mobile phone, and concrete shape is finalized the design according to mobile phone actual design needs;
Step 2: as shown in Figure 2, the antenna prototype that injection mo(u)lding is good is used mobile printing technique, at the position of plastic surface appointment printing conductive inks layer 2, for next step electroplating copper film ready;
Step 3: as shown in Figure 3, with the antenna plastic cement prototype that prints, use electroplating technology, at the position of plastic surface appointment electro-coppering rete 3, make it to possess the function of conduction and signal reception;
Step 4: show such as Fig. 4; the extexine re-plating nickel dam 4 of the antenna for mobile phone of copper film will have been electroplated; but do not comprise the external conduction position of built-in aerial both positive and negative polarity end points; namely be commonly called as the position into " golden finger "; good copper film layer is electroplated in protection, prevents copper film layer generation oxidation and causes conducting electricity disappearance with signal receiving function.
Embodiment three
Step 1: as shown in Figure 1, adopt the basic configuration that is injection molded into built-in antenna of mobile phone, its shape can be independent antenna prototype, also can be attached to plastic shell or the plastic cellphone lid 1 of mobile phone, and concrete shape is finalized the design according to mobile phone actual design needs;
Step 2: as shown in Figure 2, the antenna prototype that injection mo(u)lding is good is used mobile printing technique, at the position of plastic surface appointment printing conductive inks layer 2, for next step electroplating copper film ready;
Step 3: as shown in Figure 3, with the antenna plastic cement prototype that prints, use electroplating technology, at the position of plastic surface appointment electro-coppering rete 3, make it to possess the function of conduction and signal reception;
Step 4: as shown in Figure 5, to electroplate the color of complete built-in aerial surface spraying actual needs---spraying ink lay 6, the external conduction position 5(of the both positive and negative polarity end points that ground termination points exposes is commonly called as " golden finger ") except, block herein, the contact of spraying printing ink can not be arranged with residual;
Step 5: as shown in Figure 6, do gold-plated processing at the external conduction position of built-in aerial ground termination points.
Embodiment four
Step 1: as shown in Figure 1, adopt the basic configuration that is injection molded into built-in antenna of mobile phone, its shape can be independent antenna prototype, also can be attached to plastic shell or the plastic cellphone lid 1 of mobile phone, and concrete shape is finalized the design according to mobile phone actual design needs;
Step 2: as shown in Figure 2, the antenna prototype that injection mo(u)lding is good is used mobile printing technique, at the position of plastic surface appointment printing conductive inks layer 2, for next step electroplating copper film ready;
Step 3: as shown in Figure 3, with the antenna plastic cement prototype that prints, use electroplating technology, at the position of plastic surface appointment electro-coppering rete 3, make it to possess the function of conduction and signal reception;
Step 4: show such as Fig. 4, the extexine re-plating nickel dam 4 of the antenna for mobile phone of copper film will have been electroplated, but do not comprise the external conduction position 5 of built-in aerial both positive and negative polarity end points, namely be commonly called as the position into " golden finger ", good copper film layer is electroplated in protection, prevents copper film layer generation oxidation and causes conducting electricity disappearance with signal receiving function;
Step 5: as shown in Figure 5, will electroplate the color of complete built-in aerial surface spraying actual needs, and except the golden finger that ground termination points exposes, block herein, and the contact of spraying printing ink can not be arranged with residual;
Step 6: as shown in Figure 6, do gold-plated processing at the external conduction position of built-in aerial ground termination points.
Embodiment five
Step 1: as shown in Figure 1, adopt the basic configuration that is injection molded into built-in antenna of mobile phone, its shape can be independent antenna prototype, also can be attached to plastic shell or the plastic cellphone lid 1 of mobile phone, and concrete shape is finalized the design according to mobile phone actual design needs;
Step 2: as shown in Figure 2, the antenna prototype that injection mo(u)lding is good is used mobile printing technique, at the position of plastic surface appointment printing conductive inks layer 2, for next step electroplating copper film ready;
Step 3: as shown in Figure 3, with the antenna plastic cement prototype that prints, use electroplating technology, at the position of plastic surface appointment electro-coppering rete 3, make it to possess the function of conduction and signal reception;
Step 4: show such as Fig. 4, to electroplate the extexine of antenna for mobile phone of copper film through chemical nickel plating re-plating nickel dam 4 again after the catalysis, but do not comprise the external conduction position of built-in aerial both positive and negative polarity end points, namely be commonly called as the position into " golden finger ", good copper film layer is electroplated in protection, prevents copper film layer generation oxidation and causes conducting electricity disappearance with signal receiving function;
Step 5: as shown in Figure 5, will electroplate the color of complete built-in aerial surface spraying actual needs, and except the golden finger that ground termination points exposes, block herein, and the contact of spraying printing ink can not be arranged with residual;
Step 6: as shown in Figure 6, do gold-plated processing at the external conduction position of built-in aerial ground termination points.

Claims (5)

1. the technique of a built-in printed antenna, it is characterized in that: described technique comprises following step:
Step 1: injection mo(u)lding: adopt injection mo(u)lding, use the plastic cement raw material to be injection molded into the basic configuration of built-in antenna of mobile phone;
Step 2: printing conductive inks: the antenna prototype that injection mo(u)lding is good, use mobile printing technique, at the position of plastic surface appointment printing conductive inks, realize that by glue heading brush 3-D graphic can realize good antenna performance at the terminal structure of various complexity, for next step electroplating copper film ready;
Step 3: electroplating copper film: with the antenna plastic cement prototype that prints, use electroplating technology, at the position of plastic surface appointment electroplating copper film, make it to possess the function of conduction and signal reception.
2. the technique of built-in printed antenna according to claim 1, it is characterized in that: increase the step of an electronickelling after electroplating copper film, described step is:
Electronickelling: will electroplate the extexine re-plating nickel of the antenna for mobile phone of copper film, but not comprise the external conduction position of built-in aerial both positive and negative polarity end points, good copper film layer is electroplated in protection, prevents copper film layer generation oxidation and causes conducting electricity disappearance with signal receiving function.
3. the technique of built-in printed antenna according to claim 1 is characterized in that: the technique of described built-in printed antenna, increase spraying printing ink and gold-plated step after also being included in electroplating copper film, and described step is:
Spraying printing ink: will electroplate the color of complete built-in aerial surface spraying actual needs, and except the golden finger that ground termination points exposes, block herein, spraying printing ink contact and residual can not be arranged;
Gold-plated processing: do gold-plated processing at the external conduction position of built-in aerial ground termination points.
4. the technique of built-in printed antenna according to claim 2 is characterized in that: after the step of electronickelling is finished, increase spraying printing ink and gold-plated step, described step is:
Electronickelling: will electroplate the extexine re-plating nickel of the antenna for mobile phone of copper film, but not comprise the external conduction position of built-in aerial both positive and negative polarity end points, good copper film layer is electroplated in protection, prevents copper film layer generation oxidation and causes conducting electricity disappearance with signal receiving function;
Spraying printing ink: will electroplate the color of complete built-in aerial surface spraying actual needs, and except the golden finger that ground termination points exposes, block herein, spraying printing ink contact and residual can not be arranged;
Gold-plated processing: do gold-plated processing at the external conduction position of built-in aerial ground termination points.
5. the technique of built-in printed antenna according to claim 4 is characterized in that: at the extexine of the antenna for mobile phone that will electroplate copper film before the electronickelling through chemical nickel plating again after the catalysis.
CN2011102060893A 2011-07-22 2011-07-22 Manufacturing process of mobile phone built-in printed antenna Pending CN102891359A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104377439A (en) * 2013-08-15 2015-02-25 德昌电机(深圳)有限公司 Antenna circuit and manufacturing method thereof
TWI578615B (en) * 2014-02-17 2017-04-11 富智康(香港)有限公司 Antenna structure, manufacture method of the antenna structure and electronic device using the same
CN106968005A (en) * 2017-03-16 2017-07-21 广东长盈精密技术有限公司 Terminal enclosure and preparation method thereof
CN108075230A (en) * 2018-01-08 2018-05-25 西安易朴通讯技术有限公司 Antenna module and electronic equipment
CN108631051A (en) * 2017-03-21 2018-10-09 中兴通讯股份有限公司 The production method of antenna structure, intelligent terminal and antenna structure
CN114512792A (en) * 2022-03-07 2022-05-17 成都九华圆通科技发展有限公司 Miniature broadband conformal antenna

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101719587A (en) * 2009-12-23 2010-06-02 余章军 Built-in antenna of mobile phone
CN102011161A (en) * 2010-11-05 2011-04-13 北京星汉特种印刷有限公司 Plating equipment and plating method for electronic antenna
CN201878208U (en) * 2010-11-29 2011-06-22 联想(北京)有限公司 Mobile communication device and shell therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101719587A (en) * 2009-12-23 2010-06-02 余章军 Built-in antenna of mobile phone
CN102011161A (en) * 2010-11-05 2011-04-13 北京星汉特种印刷有限公司 Plating equipment and plating method for electronic antenna
CN201878208U (en) * 2010-11-29 2011-06-22 联想(北京)有限公司 Mobile communication device and shell therefor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104377439A (en) * 2013-08-15 2015-02-25 德昌电机(深圳)有限公司 Antenna circuit and manufacturing method thereof
TWI578615B (en) * 2014-02-17 2017-04-11 富智康(香港)有限公司 Antenna structure, manufacture method of the antenna structure and electronic device using the same
US9876270B2 (en) 2014-02-17 2018-01-23 Shenzhen Futaihong Precision Industry Co., Ltd. Antenna structure, electronic device using same, and method for making same
CN106968005A (en) * 2017-03-16 2017-07-21 广东长盈精密技术有限公司 Terminal enclosure and preparation method thereof
CN108631051A (en) * 2017-03-21 2018-10-09 中兴通讯股份有限公司 The production method of antenna structure, intelligent terminal and antenna structure
CN108631051B (en) * 2017-03-21 2022-09-02 中兴通讯股份有限公司 Antenna structure, intelligent terminal device and manufacturing method of antenna structure
CN108075230A (en) * 2018-01-08 2018-05-25 西安易朴通讯技术有限公司 Antenna module and electronic equipment
CN114512792A (en) * 2022-03-07 2022-05-17 成都九华圆通科技发展有限公司 Miniature broadband conformal antenna

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Application publication date: 20130123