CN103281871A - Electronic circuit manufacturing method - Google Patents
Electronic circuit manufacturing method Download PDFInfo
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- CN103281871A CN103281871A CN2013102296180A CN201310229618A CN103281871A CN 103281871 A CN103281871 A CN 103281871A CN 2013102296180 A CN2013102296180 A CN 2013102296180A CN 201310229618 A CN201310229618 A CN 201310229618A CN 103281871 A CN103281871 A CN 103281871A
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Abstract
The invention provides an electronic circuit manufacturing method. A common circuit carrier made of high-molecular compounds is subjected to selective laser radiation and processing according to the following steps that the surface of the circuit carrier is subjected to chemical activation processing, and then undergoes an electroplating or chemical plating process, so that an electronic circuit is formed in an irradiated region. The electronic circuit manufacturing method has the advantages that the circuit carrier used in the electronic circuit manufacturing method does not contain a metal contact agent or a water repellent agent, so that the cost is low; moreover, metal components are not contained so that the performance of an antenna product cannot be affected; due to the fact that a palladium actuating reagent is used, the part not subjected to electromagnetic irradiation cannot form effective palladium metal at the time of palladium activation; the electronic circuit manufacturing method is concise in step, easy to implement and easy to popularize.
Description
Technical field
The invention belongs to the electronic circuit technology field, be specifically related to a kind of manufacture method of electronic circuit.
Background technology
The method of directly making circuit at present on working of plastics comprises:
(1) laser direct forming technology (Laser-Direct-Structuring, LDS), namely use the plastics circuit carrier that contains certain metal solvent, discharge metal by laser then, the metal exposed in the zone that needs is come out, change plating or electric plating method acquisition circuit again based on the metal solvent of these exposures.Its shortcoming is: thus this method increase cost owing to needs use metal solvent, and because this product contains metal, such as antenna product, metal solvent may have a negative impact to radio-frequency performance in some occasion.
(2) in the common plastics material, add laser selective plating or the plating of hydrophobic membrane, namely add one deck hydrophobic membrane on the surface of plastics circuit carrier, the part that needs with the laser selective irradiation lost efficacy the hydrophobic membrane of illuminated portion again, changed plating or plating again.Because do not have the hydrophobic membrane of the part of laser irradiation that hydrophobic effect is arranged, metal can't deposit, and has therefore formed required circuit.Its shortcoming: be to need the surface of plastics circuit carrier to add one deck hydrophobic membrane, increased cost and the complexity that has increased technology.
(3) on the common plastics product by changing the method that method that plating goes to plate again obtains circuit, namely at first on common plastics circuit carrier, shine the zone (abbreviation selective area) that needs with laser selective, again the circuit carrier is carried out chemical deposition metal or vacuum metallization, and then carry out the laser irradiation selective area and other Region Segmentation are opened, electroplate the metal level thickening with selective area again, and then go to plate, because the metal of selective area is thicker than the metal in non-selective zone, therefore under the prerequisite that keeps the selective area metal, the metal in non-selective zone is removed, change plating at last again or electroplate copper facing, nickel plating or gold-plated.Its shortcoming is: the technology more complicated, thereby cost increases the fraction defective increase.
Summary of the invention
Influence the defective of properties of product in order to solve cost height in the prior art and metal ingredient, the present invention aims to provide a kind of manufacture method of not using the electronic circuit of metal solvent or metal media, and concrete technical scheme is as follows:
A kind of manufacture method of electronic circuit comprises the steps:
(1) prepare a circuit carrier, wherein, the material of circuit carrier is macromolecular compound;
(2) the selective electromagnetic irradiation is carried out according to the shape of required electronic circuit in the surface of circuit carrier, thereby form irradiation area on the surface of circuit carrier;
(3) chemical activation is carried out on the surface of circuit carrier and handle, electroplate again or change depositing process, form electronic circuit at irradiation area.
As prioritization scheme, step (3) further comprises the steps:
(31) adopt the palladium activating reagent that the circuit carrier is carried out the palladium activation, Metal Palladium is attached in the irradiation area;
(32) by plating or chemical plating other metal materials are deposited on the palladium metal, form electronic circuit.
As prioritization scheme, other metal materials be in copper, nickel, the gold one or both or all.
As prioritization scheme, step (32) further comprises the steps:
At first, the circuit carrier is electroplated or chemical plating, at the palladium metal deposition first bronze medal layer;
Then, deposit the second bronze medal layer by plating or chemical plating at the first bronze medal layer, the thickness of the second bronze medal layer is greater than the thickness of the first bronze medal layer;
At last, deposit a nickel metal layer by plating or chemical plating at the second bronze medal layer, form electronic circuit.
As prioritization scheme, the circuit carrier by macromolecular compound by injection moulding, extrude or blow molding makes.
As prioritization scheme, macromolecular compound is plastics, fiber or rubber.
As prioritization scheme, what electromagnetic irradiation adopted is the mode of laser irradiation, and Wavelength of Laser is the 100-20000 nanometer.
Useful technique effect of the present invention is:
(1) not containing metal catalyst or water-repelling agent in the circuit carrier that adopts of the present invention are with low cost; And the present invention is the containing metal composition not, can the performance of antenna product not exerted an influence;
(2) because the present invention adopts the palladium activating reagent, when carrying out the palladium activation, palladium metal only can be deposited on the circuit carrier through the zone of electromagnetic irradiation, can not be attached to the part of not passing through electromagnetic irradiation, and the palladium metal of deposition is equivalent to the metal that electromagnetic irradiation discharges in the LDS technology; Realize the technique effect identical with the LDS technology, but greatly reduced cost;
(3) step of the present invention realizes and is easy to promoting succinctly, easily.
Description of drawings
By reference to the accompanying drawings, by the detailed description of stating hereinafter, can more be expressly understood above-mentioned and other feature and advantage of the present invention, wherein:
Fig. 1 is the structural representation of circuit carrier of the present invention;
Fig. 2 is the cutaway view of circuit carrier of the present invention;
Fig. 3 is the structural representation of irradiation area of the present invention;
Fig. 4 is the structure cutaway view of irradiation area of the present invention;
Fig. 5 is the structural representation of electronic circuit of the present invention;
Fig. 6 is the cutaway view of electronic circuit of the present invention;
Sequence number is among the last figure:
1-circuit carrier, 2-irradiation area, 3-electronic circuit.
Embodiment
The present invention is further illustrated below in conjunction with drawings and Examples.
Embodiment:
A kind of manufacture method of electronic circuit comprises the steps:
(1) prepare a circuit carrier 1, wherein, the material of circuit carrier 1 is macromolecular compound; Circuit carrier 1 by common macromolecular compound by injection moulding, extrude or blow molding, not containing metal catalyst or water-repelling agent, as depicted in figs. 1 and 2.In the present embodiment, macromolecular compound is plastics, but is not limited to plastics, also can be fiber or rubber.
(2) the selective electromagnetic irradiation is carried out according to the shape of required electronic circuit in the surface of circuit carrier 1, make the 1 surperficial respective regions alligatoring of circuit carrier, thereby form irregular male and fomale(M﹠F) not of uniform size on the surface of circuit carrier 1, be called irradiation area 2, and the shape of irradiation area 2 is consistent with the shape of required electronic circuit, as shown in Figure 3 and Figure 4.In the present embodiment, what electromagnetic irradiation adopted is the mode of laser irradiation, and Wavelength of Laser is the 100-20000 nanometer.
(3) chemical activation is carried out on the surface of circuit carrier 1 and handle, electroplate again or change depositing process, form electronic circuits 3 at irradiation area 2.
Step (3) further comprises:
(31) adopt the palladium activating reagent that circuit carrier 1 is carried out the palladium activation, Metal Palladium is attached in the irradiation area 2.Adopt commercially available palladium activating reagent in this step, owing to the rough surface of irradiation area 2 behind electromagnetic irradiation, palladium metal only can be attached in the irradiation area 2 of surface coarsening, can not be deposited on other zones of circuit carrier 1.
(32) by plating or chemical plating other metal materials are deposited on the palladium metal, form electronic circuit 3, as shown in Figure 5 and Figure 6.Wherein, electroplate or the mode of chemical plating all can realize the present invention, and the present invention is not restricted other metal materials, can in copper, nickel, the gold one or both or all.In the present embodiment, adopt the mode of chemical plating, the method that other metal materials are deposited on the palladium metal is specially:
At first, circuit carrier 1 is carried out chemical plating, at the palladium metal deposition first bronze medal layer;
Then, at first bronze medal layer deposition, the second bronze medal layer, the thickness of the second bronze medal layer is greater than the first bronze medal layer by chemical plating; Wherein, the thickness range of the first bronze medal layer is 1-2um, and the thickness range of the second bronze medal layer is 6-20um;
At last, at second bronze medal layer deposition, one nickel metal layer, form electronic circuit 3, as shown in Figure 5 and Figure 6 by chemical plating.
The technical scheme of present laser direct forming technology (LDS) is: adopt the circuit carrier that contains metal solvent, circuit carrier laser irradiation back is discharged metal, again the circuit carrier is carried out chemical plating or plating, make metal material such as copper be deposited on zone through the laser irradiation, wherein metal material such as copper is ground with the metal that discharges through laser irradiation back on the circuit carrier, growth expansion on this basis; The zone of process laser irradiation is not owing to discharge metal, and metal materials such as copper can not be attached to these zones.The scheme of adding metal solvent in the circuit carrier of the present invention with the technical scheme replacement LDS of step (31), the circuit carrier that is equivalent to LDS through the palladium metal that obtains after the step (31) shines the metal that discharges through laser.In the present embodiment, the first bronze medal layer is ground with the palladium metal, only can be deposited on the palladium metal, can not be deposited on other zones of circuit carrier 1; Then, the second bronze medal layer is ground with the first bronze medal layer, only can be deposited on the first bronze medal layer, can not be deposited on other zones of circuit carrier 1; Last nickel metal layer is ground with the second bronze medal layer, only can be deposited on the second bronze medal layer, can not be deposited on other zones of circuit carrier 1, thereby forms electronic circuit.
Thus, circuit carrier 1 of the present invention is that common macromolecular compound gets final product, and need not add metal solvent, provide cost savings, and containing metal composition not, can not influence end properties.And the palladium activating reagent that the present invention adopts is easy in market buy, and is with low cost and be easy to realize.
The present invention can be with many multi-form realizations, and should not be construed as the restriction of the embodiment that is subjected in this proposition.
Claims (7)
1. the manufacture method of an electronic circuit is characterized in that, comprises the steps:
(1) prepare a circuit carrier, wherein, the material of described circuit carrier is macromolecular compound;
(2) the selective electromagnetic irradiation is carried out according to the shape of required electronic circuit in the surface of described circuit carrier, thereby form irradiation area on the surface of described circuit carrier;
(3) chemical activation is carried out on the surface of described circuit carrier and handle, electroplate again or change depositing process, form described electronic circuit at described irradiation area.
2. the manufacture method of a kind of electronic circuit according to claim 1 is characterized in that, described step (3) further comprises the steps:
(31) adopt the palladium activating reagent that described circuit carrier is carried out the palladium activation, Metal Palladium is attached in the described irradiation area;
(32) by plating or chemical plating other metal materials are deposited on the described palladium metal, form electronic circuit.
3. the manufacture method of a kind of electronic circuit according to claim 2 is characterized in that, described other metal materials be in copper, nickel, the gold one or both or all.
4. the manufacture method of a kind of electronic circuit according to claim 2 is characterized in that, described step (32) further comprises the steps:
At first, described circuit carrier is electroplated or chemical plating, at the described palladium metal deposition first bronze medal layer;
Then, deposit the second bronze medal layer by plating or chemical plating at the described first bronze medal layer, the thickness of the described second bronze medal layer is greater than the thickness of the described first bronze medal layer;
At last, deposit a nickel metal layer by plating or chemical plating at the described second bronze medal layer, form electronic circuit.
5. according to the manufacture method of each described a kind of electronic circuit of claim 1-4, it is characterized in that, described circuit carrier by macromolecular compound by injection moulding, extrude or blow molding makes.
6. according to the manufacture method of each described electronic circuit of claim 1-4, it is characterized in that described macromolecular compound is plastics, fiber or rubber.
7. according to the manufacture method of each described a kind of electronic circuit of claim 1-4, it is characterized in that what described electromagnetic irradiation adopted is the mode of laser irradiation, described Wavelength of Laser is the 100-20000 nanometer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2013102296180A CN103281871A (en) | 2013-06-09 | 2013-06-09 | Electronic circuit manufacturing method |
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| CN2013102296180A CN103281871A (en) | 2013-06-09 | 2013-06-09 | Electronic circuit manufacturing method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105451456A (en) * | 2015-12-08 | 2016-03-30 | 昆山联滔电子有限公司 | Manufacturing method for non-conductive base material conductor circuit |
| CN107690230A (en) * | 2017-08-09 | 2018-02-13 | 上海安费诺永亿通讯电子有限公司 | A kind of method for making metallic circuit and metallic circuit component |
| CN107864565A (en) * | 2017-12-08 | 2018-03-30 | 上海安费诺永亿通讯电子有限公司 | The method and its metallic circuit of metallic circuit are made on epoxide resin material |
| CN108950526A (en) * | 2018-08-27 | 2018-12-07 | 合肥学院 | A method of the high-resolution metallized polymeric substrate based on chemical plating |
| CN111463564A (en) * | 2020-03-05 | 2020-07-28 | 上海阿莱德实业股份有限公司 | Preparation method of plastic antenna oscillator with high coating bonding strength |
| CN113005439A (en) * | 2021-02-24 | 2021-06-22 | 深圳市创智成功科技有限公司 | Chemical palladium plating process for electronic packaging carrier plate |
| CN114464992A (en) * | 2021-12-20 | 2022-05-10 | 深圳市思讯通信技术有限公司 | Antenna assembly for enhancing transparent visual area and manufacturing method of electronic product |
| CN114464999A (en) * | 2021-12-20 | 2022-05-10 | 深圳市思讯通信技术有限公司 | Manufacturing method and system based on fusion of laser antenna and shell processing |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105451456A (en) * | 2015-12-08 | 2016-03-30 | 昆山联滔电子有限公司 | Manufacturing method for non-conductive base material conductor circuit |
| CN107690230A (en) * | 2017-08-09 | 2018-02-13 | 上海安费诺永亿通讯电子有限公司 | A kind of method for making metallic circuit and metallic circuit component |
| CN107864565A (en) * | 2017-12-08 | 2018-03-30 | 上海安费诺永亿通讯电子有限公司 | The method and its metallic circuit of metallic circuit are made on epoxide resin material |
| CN108950526A (en) * | 2018-08-27 | 2018-12-07 | 合肥学院 | A method of the high-resolution metallized polymeric substrate based on chemical plating |
| CN111463564A (en) * | 2020-03-05 | 2020-07-28 | 上海阿莱德实业股份有限公司 | Preparation method of plastic antenna oscillator with high coating bonding strength |
| CN111463564B (en) * | 2020-03-05 | 2022-05-31 | 上海阿莱德实业股份有限公司 | Preparation method of plastic antenna oscillator with high coating bonding strength |
| CN113005439A (en) * | 2021-02-24 | 2021-06-22 | 深圳市创智成功科技有限公司 | Chemical palladium plating process for electronic packaging carrier plate |
| CN114464992A (en) * | 2021-12-20 | 2022-05-10 | 深圳市思讯通信技术有限公司 | Antenna assembly for enhancing transparent visual area and manufacturing method of electronic product |
| CN114464999A (en) * | 2021-12-20 | 2022-05-10 | 深圳市思讯通信技术有限公司 | Manufacturing method and system based on fusion of laser antenna and shell processing |
| CN114464992B (en) * | 2021-12-20 | 2023-09-29 | 深圳市思讯通信技术有限公司 | Antenna assembly for enhancing transparent visual area and manufacturing method of electronic product |
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Application publication date: 20130904 |