CN111132475B - Buried hole manufacturing method - Google Patents
Buried hole manufacturing method Download PDFInfo
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- CN111132475B CN111132475B CN201911380176.3A CN201911380176A CN111132475B CN 111132475 B CN111132475 B CN 111132475B CN 201911380176 A CN201911380176 A CN 201911380176A CN 111132475 B CN111132475 B CN 111132475B
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- hole
- soft material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of PCBs (printed circuit boards), and discloses a buried via manufacturing method, which comprises the following steps: for two first core plates positioned at two ends of a buried hole to be processed, respectively manufacturing metal hole rings in preset areas; respectively manufacturing anti-electroplating soft material layers on the surfaces of the two metal hole rings; pressing to form a multilayer board; drilling and wedge-shaped processing operations are carried out to manufacture a through hole, and the through hole is divided into an upper hole section, a middle hole section and a lower hole section by two soft material layers along the axial direction of the through hole; the metal hole ring is deformed into a wedge-shaped structure extruded towards the direction of the soft material layer so as to cover the soft material layer on the exposed area of the hole wall; depositing a conductive layer, and removing the metal layer covered outside the soft material layer to expose the soft material layer; electroplating; and removing the hole copper of the upper hole section and the lower hole section. The embodiment of the invention greatly simplifies the manufacturing process, improves the manufacturing efficiency, reduces the manufacturing cost and effectively improves the manufacturing precision.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a buried via manufacturing method.
Background
The PCB is an indispensable basic part of all electronic products, is a carrier of all electronic components, and is a main support body for electronic components during installation and interconnection.
There are three common PCB vias: through holes, blind holes and buried holes. The through hole is a through hole penetrating through the whole circuit board; the blind hole is a through hole for connecting the PCB inner layer wiring with the PCB surface layer wiring, and the hole does not penetrate through the whole circuit board; the buried via is the connection between any two or more adjacent appointed inner layers of the PCB, and the wiring on the surface layer is not needed, so that the signal transmission distance is shortened, and the influence of the surface layer and other layers on inner layer signals is eliminated.
For buried vias, the conventional fabrication process is: firstly, manufacturing a through hole by one-time pressing, drilling the through hole, electroplating and resin hole plugging; and then pressing again to change the through hole into a buried hole. The buried hole manufacturing method of firstly pressing to form the through hole and then pressing to form the buried hole for the second time needs to be carried out through multiple pressing operations, and has the advantages of long whole manufacturing process, low efficiency, high cost and low manufacturing precision.
Disclosure of Invention
The invention aims to provide a buried hole manufacturing method, which overcomes the defects of complex process and low manufacturing precision of the existing process.
In order to achieve the purpose, the invention adopts the following technical scheme:
a buried via fabrication method, comprising:
according to a preset lamination sequence, respectively manufacturing metal hole rings in preset areas for two first core plates positioned at two ends of a buried hole to be processed, wherein the preset areas correspond to drilling positions of the buried hole to be processed;
respectively manufacturing anti-electroplating soft material layers on the surfaces of the two metal hole rings;
stacking and pressing the two first core plates and other core plates according to a preset sequence to form a multilayer plate;
performing drilling operation and wedge-shaped processing operation on the multilayer board to form a through hole penetrating through all the metal hole rings and the soft material layers, wherein the through hole is divided into an upper hole section, a middle hole section and a lower hole section by the two soft material layers along the axial direction of the through hole; the metal hole ring is deformed into a wedge-shaped structure extruded towards the direction of the soft material layer so as to cover the soft material layer on the exposed area of the hole wall;
depositing a conductive layer on the inner wall of the through hole, and then removing the metal layer covering the outside of the soft material layer to expose the soft material layer;
electroplating the through hole to enable the hole walls of the upper hole section, the middle hole section and the lower hole section to be plated with copper layers;
and removing the pore wall copper layers of the upper pore section and the lower pore section.
Optionally, the step of performing the drilling operation and the wedge machining operation includes:
drilling a hole in the multilayer board, and forming a high-temperature environment not lower than a preset temperature threshold in the drilling process, wherein the preset temperature threshold is the lowest environment temperature at which the metal hole ring and the soft material layer reach a specified softening degree;
and simultaneously, in the drilling process, the metal hole ring is pulled by a drill so that the metal hole ring is extruded and deformed to form the wedge-shaped structure on one side of the soft material layer.
Optionally, the step of performing the drilling operation and the wedge machining operation includes:
drilling a hole in the multilayer board to form a through hole penetrating through the metal hole ring and the soft material layer;
after drilling, softening the metal hole ring and the soft material layer;
and pressing and transforming the softened metal hole ring to one side of the soft material layer by using a specified tool to form the wedge-shaped structure.
Optionally, after the step of electroplating the through hole, the method further includes: and removing all the soft material layer.
Optionally, the soft material layer includes a dry film, ink, or a film material.
Optionally, the method for manufacturing the dry film on the surface of the metal eyelet ring includes:
firstly, the dry film is pasted on the surface of the core plate with the metal hole ring;
and then, removing the dry film part covering the region outside the surface of the metal hole ring in an exposure and development mode, and only reserving the dry film part covering the surface region of the metal hole ring.
Optionally, the method for manufacturing the thin film material on the surface of the metal eyelet ring includes:
the surface of the core plate provided with the metal hole ring is pasted with the film material;
and then removing the film material part covering the area outside the surface of the metal hole ring in a windowing way such as laser cutting, and only reserving the film material part covering the surface area of the metal hole ring.
Optionally, the metal hole ring is 0.1mm-0.2mm larger than the single side of the hole diameter of the buried hole to be processed, and the soft material layer completely covers the metal hole ring.
Optionally, the thickness of the soft material layer is 30um-100 um.
Compared with the prior art, the invention has the beneficial effects that:
according to the buried hole manufacturing method provided by the embodiment of the invention, the metal hole rings and the anti-electroplating soft material layer are manufactured at two ends of the buried hole, the metal hole rings are firstly deformed into the wedge-shaped structures to cover the soft material layer, the copper layer is removed in a microetching mode after subsequent electroplating to expose the soft material layer, so that the hole wall copper plating layer is disconnected from two specified positions, the hole copper of the upper hole section and the hole copper of the lower hole section are removed, and the hole copper of the middle hole section is reserved to form the buried hole.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a flowchart of a buried via manufacturing method according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a buried via fabrication process according to an embodiment of the present invention;
fig. 3 is an enlarged view of a portion a of fig. 2.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and fig. 2, the method for forming a buried via according to the present embodiment specifically includes the following steps:
In practical application, the number of the to-be-processed buried holes is at least one, and for the to-be-processed buried holes with different processing requirements, corresponding core plates of the to-be-manufactured metal ring 1 need to be selected according to specific positions of the to-be-processed buried holes. And aiming at each buried hole to be processed, setting a specific manufacturing area of the metal hole ring 1 on the first core plate according to the drilling position of the buried hole to be processed on the plate surface. In order to ensure the processing quality, each metal hole ring 1 is 0.1mm-0.2mm larger than the single side of the aperture of the corresponding buried hole to be processed.
The metal ring 1 may be made of copper foil, and may be made simultaneously with the inner layer circuit pattern, or may be made step by step, and is not limited specifically.
And 102, respectively manufacturing the anti-electroplating soft material layers 2 covering the surfaces of the metal hole rings 1 on the two first core plates.
Soft material refers to a material which is soft in texture, resistant to high temperature and high pressure and can be removed in a certain manner. For example, the soft material may be a dry film, or may be ink that is not heat-curable, or other material as long as it has the above characteristics. The thickness of the soft material layer can be selected to be 30um-100 um.
When a dry film is adopted, the method for manufacturing the dry film covering the surface of the metal eyelet 1 may specifically include: firstly, a dry film is pasted on the surface of the first core plate on which the metal hole ring 1 is manufactured, then, the dry film part covering the area outside the surface of the metal hole ring 1 is removed in an exposure and development mode, and only the dry film part covering the surface area of the metal hole ring 1 is reserved.
When other thin film materials are adopted, the method for manufacturing the soft material layer 2 covering the surface of the metal hole ring 1 specifically comprises the following steps: a thin film material is pasted on the surface of the first core plate, on which the metal hole ring 1 is manufactured, and then the thin film material part covering the area outside the surface of the metal hole ring 1 is removed through windowing modes such as laser cutting, and only the thin film material part covering the surface area of the metal hole ring 1 is reserved.
And 103, stacking the two first core plates and other core plates according to a preset sequence, and then pressing to form the multilayer plate.
Specifically, before lamination, corresponding inner layer circuit pattern manufacturing needs to be respectively completed on other core boards; during pressing, prepregs are required to be stacked between adjacent layers of core boards, the core boards and the core boards are overlapped or copper foils are stacked on the outer surfaces of the outer layer core boards, and a high-temperature and high-pressure pressing mode is adopted to press the core boards and the core boards into a whole so as to form the multilayer board.
And step 104, drilling at a preset position of the drilling surface by taking any plate surface of the multilayer plate as the drilling surface to form a through hole penetrating through all the metal hole rings 1 and the soft material layers 2, wherein the through hole is divided into an upper hole section, a middle hole section and a lower hole section by the two soft material layers along the axial direction of the through hole.
Meanwhile, a high-temperature environment is formed in the drilling process, so that the metal hole ring 1 and the soft material layer 2 are softened to a certain degree; when a hole is drilled to a designated layer, the drill is used to pull the metal hole ring 1, so that the metal hole ring 1 is extruded and deformed to one side of the soft material layer 2 to form a wedge-shaped structure, and the soft material layer 2 is not exposed due to being covered by the metal hole ring 1, as shown in fig. 3.
In this embodiment, the soft material layer 2 is mainly made of polymer resin, and has strong plasticity; the metal ring 1 is mainly made of copper foil, and the plasticity is low; the base material of the multilayer board can be made of glass fiber, resin and inorganic solid filler, most of the base material is the glass fiber soaked with the resin, and the inorganic filler is added. Therefore, the plasticity of the base material is lower than that of the soft material layer 2 and higher than that of the metal hole ring 1.
In the drilling process, the rotation speed of the drill is controlled, so that a preset high-temperature environment (such as 200-300 ℃) is generated by friction between the high-speed cutting drill and the multilayer board, the base material, the metal hole ring 1 and the soft material layer 2 of the multilayer board are softened in the high-temperature environment, and meanwhile, based on the material characteristics, the metal hole ring 1 deforms under the rotary cutting extrusion and the heat effect of the drill and extrudes the softened base material and the soft material layer 2; after drilling is finished, the temperature is reduced, the base material and the soft material layer 2 recover to a rigid state, the metal hole ring 1 cannot recover to an original state after extrusion deformation due to low plasticity, the extrusion degree of the metal hole ring 1 to the soft material layer 2 is higher than that of the soft material layer 2 to the base material, and therefore the metal hole ring 1 located on a specified layer is formed into a wedge-shaped structure, namely a nail head shape, and the outer edge of the soft material layer 2 close to the hole wall is covered. And, the greater the thickness of the soft material layer 2, the higher the degree of wedge.
In the embodiment, a high-temperature environment is manufactured by using different characteristics of three materials (the base material, the metal hole ring 1 and the soft material layer 2), so that the metal hole ring 1 is deformed into the soft and plastic soft material layer 2 under the extrusion action of the drill to form an oriented wedge-shaped structure.
And 105, depositing a conductive layer on the plate surface of the multilayer plate and the inner wall of the through hole.
The conductive layer can be carbon powder or graphite, and is deposited on the plate surface and the hole wall of the multilayer plate in a physical adsorption mode. The conductive layer is positively charged, so that the conductive layer is mainly adsorbed and deposited on the negatively charged base material of the multilayer board, and the surface adsorption amount of the positively charged copper layer is very small or the conductive layer is easy to clean and fall off.
And 106, carrying out microetching on the multilayer board on which the conductive layer is deposited, removing the metal part of the metal hole ring 1, which covers the soft material layer 2, and simultaneously removing a small amount of conductive layer attached to the surface of the metal part so as to expose the soft material layer 2.
And 107, carrying out whole-board electroplating on the multilayer board, so that copper layers are plated on the hole walls of the upper hole section, the middle hole section and the lower hole section of the through hole.
In the electroplating process, the positions of the hole walls, which are provided with the conductive layers and the copper layers, are all plated with the copper layers, and the positions of the hole walls, which are provided with the soft material layers 2, cannot be plated with the copper layers. After the whole board is electroplated, the hole wall copper layer is disconnected at the corresponding position (namely the designated layer) of the soft material layer 2.
And step 108, removing all the soft material layer 2.
In this step, the soft material layer 2 at the designated layer position can be completely removed by adopting a conventional film removing process, and the details are not limited.
And step 109, removing the pore wall copper layers of the upper pore section and the lower pore section.
In this step, the following method may be adopted to remove the via copper of the upper via section and the lower via section (hereinafter, the via copper portions to be removed are collectively referred to as "ineffective via copper"), and simultaneously, the outer layer circuit pattern is manufactured, specifically including:
(1) both sides of the via are etched into isolated rings.
In particular, a tin plating method can be used to achieve: covering copper rings to be etched on two sides of the through hole through film pasting, exposure and development steps, and exposing the rest circuit parts; copper plating is carried out, and the step can be optionally carried out or not carried out according to the requirement of copper thickness; then tin plating and film stripping are carried out to expose the non-circuit part and cover the circuit part; then etching isolated hole rings on two sides of the through hole; finally, removing tin.
Or, a dry film sealing method is adopted to realize: after film pasting, exposure and development (exposing copper rings on two sides of the through hole to be etched and covering the rest parts), etching isolated hole rings on two sides of the through hole and removing the film.
(2) And (3) manufacturing an outer layer circuit pattern by adopting an addition method: firstly, pasting, exposing and developing to expose the circuit part and the metalized through hole and cover the non-circuit part; copper plating is carried out (the step can be selected or not according to the requirement of copper thickness); then tin plating and film stripping are carried out to expose the non-circuit part, and the tin layer covers the circuit part and the metalized through hole; etching to remove the non-circuit part and the ineffective hole copper; finally, removing tin to expose the outer layer circuit part.
In this embodiment, the wedge-shaped processing step of processing the metal eyelet 1 into the wedge-shaped structure from the conventional structure and the conventional drilling step of the signal via hole are implemented by synchronous operations, that is, in the drilling step, a high-temperature environment is generated by high-speed rotation friction of a drill to soften the metal eyelet 1 and the soft material layer 2, and the drill is used to extrude and deform the metal eyelet 1 and the soft material layer 2.
Indeed, in other embodiments, the two processes may also be performed in steps: the conventional drilling process is firstly carried out, and then the wedge-shaped processing process is carried out on the metal ring 1 at the designated layer position.
When the stepped operation mode is adopted, in the wedge-shaped processing procedure, a softening technology (not limited to a high-temperature softening mode, but also other softening liquid medicines can be applied to realize a softening effect, specifically, not limited) can be firstly adopted to soften the metal hole ring 1 and the soft material layer 2 on the appointed layer, and then tools such as a drill and the like which can realize the extruding or pulling functions are used for extruding and deforming the metal hole ring 1 to one side of the soft material layer 2 until a wedge-shaped structure meeting the requirements is formed.
To sum up, in the method for manufacturing a buried via according to the embodiment of the present invention, the metal hole ring and the anti-electroplating soft material layer are manufactured at two ends of the buried via, the metal hole ring is deformed into a wedge-shaped structure to cover the soft material layer, the copper layer is removed by microetching after the subsequent electroplating to expose the soft material layer, so that the copper plating layer on the hole wall is disconnected from two designated positions, the hole copper of the upper and lower hole sections is removed, and the hole copper of the middle hole section is retained to form the buried via.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A buried via manufacturing method is characterized by comprising the following steps:
according to a preset lamination sequence, respectively manufacturing metal hole rings in preset areas for two first core plates positioned at two ends of a buried hole to be processed, wherein the preset areas correspond to drilling positions of the buried hole to be processed;
respectively manufacturing anti-electroplating soft material layers on the surfaces of the two metal hole rings;
stacking and pressing the two first core plates and other core plates according to a preset sequence to form a multilayer plate;
performing drilling operation and wedge-shaped processing operation on the multilayer board to form a through hole penetrating through all the metal hole rings and the soft material layers, wherein the through hole is divided into an upper hole section, a middle hole section and a lower hole section by the two soft material layers along the axial direction of the through hole; the metal hole ring is deformed into a wedge-shaped structure extruded towards the direction of the soft material layer so as to cover the soft material layer on the exposed area of the hole wall;
depositing a conductive layer on the inner wall of the through hole, and then removing the metal layer covering the outside of the soft material layer to expose the soft material layer;
electroplating the through hole to enable the hole walls of the upper hole section, the middle hole section and the lower hole section to be plated with copper layers;
and removing the pore wall copper layers of the upper pore section and the lower pore section.
2. A method of making a buried via according to claim 1, wherein the step of performing a drilling operation and a wedge machining operation comprises:
drilling a hole in the multilayer board, and forming a high-temperature environment not lower than a preset temperature threshold in the drilling process, wherein the preset temperature threshold is the lowest environment temperature at which the metal hole ring and the soft material layer reach a specified softening degree;
and simultaneously, in the drilling process, the metal hole ring is pulled by a drill so that the metal hole ring is extruded and deformed to form the wedge-shaped structure on one side of the soft material layer.
3. A method of making a buried via according to claim 1, wherein the step of performing a drilling operation and a wedge machining operation comprises:
drilling a hole in the multilayer board to form a through hole penetrating through the metal hole ring and the soft material layer;
after drilling, softening the metal hole ring and the soft material layer;
and extruding and transforming the softened metal hole ring towards one side of the soft material layer to form the wedge-shaped structure.
4. The method of claim 1, further comprising, after the step of electroplating the via hole: and removing all the soft material layer.
5. The method according to claim 1, wherein the soft material layer comprises ink or a film material, and the film material comprises a dry film.
6. The method for fabricating a buried via according to claim 5, wherein the method for fabricating the dry film on the surface of the metal eyelet comprises:
firstly, the dry film is pasted on the surface of the core plate with the metal hole ring;
and then, removing the dry film part covering the region outside the surface of the metal hole ring in an exposure and development mode, and only reserving the dry film part covering the surface region of the metal hole ring.
7. The method of claim 5, wherein the step of forming the thin film material on the surface of the metal eyelet comprises:
the surface of the core plate provided with the metal hole ring is pasted with the film material;
and then removing the film material part covering the area outside the surface of the metal hole ring in a windowing mode of laser cutting, and only reserving the film material part covering the surface area of the metal hole ring.
8. The method as claimed in claim 1, wherein the metal hole ring is 0.1mm-0.2mm larger than the single side of the hole diameter of the buried hole to be processed, and the soft material layer completely covers the metal hole ring.
9. The method of claim 1, wherein the thickness of the soft material layer is 30um-100 um.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911380176.3A CN111132475B (en) | 2019-12-27 | 2019-12-27 | Buried hole manufacturing method |
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|---|---|---|---|
| CN201911380176.3A CN111132475B (en) | 2019-12-27 | 2019-12-27 | Buried hole manufacturing method |
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| CN111132475A CN111132475A (en) | 2020-05-08 |
| CN111132475B true CN111132475B (en) | 2021-01-12 |
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| CN114249600B (en) * | 2021-12-29 | 2023-03-21 | 中国航空制造技术研究院 | Ceramic matrix composite blind hole structure forming method |
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| JPH06338670A (en) * | 1993-05-31 | 1994-12-06 | Matsushita Electric Works Ltd | Printed wiring board |
| CN107249252B (en) * | 2017-07-27 | 2019-12-17 | 维沃移动通信有限公司 | manufacturing method of printed circuit board and printed circuit board |
| CN109862704A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of PCB production method and PCB containing buried via hole |
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