CN111010824B - Manufacturing method of double-sided compression joint circuit board - Google Patents
Manufacturing method of double-sided compression joint circuit board Download PDFInfo
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- CN111010824B CN111010824B CN201911380148.1A CN201911380148A CN111010824B CN 111010824 B CN111010824 B CN 111010824B CN 201911380148 A CN201911380148 A CN 201911380148A CN 111010824 B CN111010824 B CN 111010824B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of PCBs (printed circuit boards), and discloses a method for manufacturing a double-sided compression joint circuit board, which comprises the following steps: respectively manufacturing metal hole rings in preset drilling areas for a first core plate positioned on a first specified layer and a second core plate positioned on a second specified layer; respectively manufacturing anti-electroplating soft material layers on the surfaces of the metal hole rings; pressing; drilling and wedge-shaped processing to form through holes penetrating through the two metal hole rings and the two soft material layers, wherein each metal hole ring is deformed into a wedge-shaped structure so as to cover the soft material layers in the exposed area of the hole wall; depositing a conducting layer on the multilayer board, and then covering the metal layer outside the two soft material layers to expose the two soft material layers; and (4) electroplating. The embodiment of the invention provides a method for separating the hole copper in the same through hole into two parts through conventional materials and simple procedures to form two isolated crimping networks, thereby simplifying the manufacturing procedures and reducing the manufacturing difficulty.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a manufacturing method of a double-sided compression joint Circuit Board.
Background
The double-sided compression joint circuit board has the effect of improving the wiring density of compression joint devices, so that the number of the compression joint devices can be obviously improved, and the effect of increasing the signal transmission capacity is achieved.
At present, the main manufacturing process of the double-sided compression joint circuit board is as follows: a large and small hole double-sided pressing process and an N + N double-sided blind pressing process. The large and small hole double-face pressing process needs drilling for multiple times, and has the problems of strict hole position precision requirement, limited aperture size and the like; the N + N double-sided blind pressing process needs multiple pressing plate operations and has the problems of long and complex manufacturing process, increased integral thickness of a circuit board and the like; therefore, the two manufacturing processes have obvious defects and limit the large-scale popularization and application of the double-sided compression joint circuit board.
Disclosure of Invention
The invention aims to provide a method for manufacturing a double-sided compression-joint circuit board, which overcomes the defects of complex flow, high operation difficulty and increased board thickness in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method of a double-sided compression joint circuit board comprises the following steps:
according to a preset lamination sequence, respectively manufacturing metal hole rings in preset drilling areas of crimping holes to be processed for a first core plate positioned on a first specified layer and a second core plate positioned on a second specified layer; the to-be-processed crimping hole comprises an upper crimping hole section with a metalized hole wall, a middle non-crimping hole section with an unmetallized hole wall and a lower crimping hole section with a metalized hole wall along the axial direction of the to-be-processed crimping hole; the first specified layer is the boundary position of the upper crimping hole section and the middle non-crimping hole section, and the second specified layer is the boundary position of the lower crimping hole section and the middle non-crimping hole section;
respectively manufacturing anti-electroplating soft material layers on the surfaces of the two metal hole rings;
stacking the first core board, the second core board and other core boards according to a preset sequence, and then pressing to form a multilayer board;
drilling and wedge-shaped processing to form through holes penetrating through the two metal hole rings and the two soft material layers, wherein each metal hole ring is deformed into a wedge-shaped structure extruded towards the direction of the adjacent soft material layer so as to cover the soft material layer on the exposed area of the hole wall;
depositing a conducting layer on the multilayer board, and then removing the metal layer covered outside the two soft material layers to expose the two soft material layers;
and electroplating the through hole to form a crimping hole capable of being crimped on two sides.
Optionally, the step of performing the drilling operation and the wedge machining operation includes:
drilling holes in the multilayer board;
forming a high-temperature environment which is not lower than a preset temperature threshold in the drilling process, wherein the preset temperature threshold is the lowest environment temperature which enables the metal hole ring and the soft material layer to reach a specified softening degree;
and simultaneously, in the drilling process, the metal hole ring is pulled by a drill so that the metal hole ring is extruded and deformed to form the wedge-shaped structure on one side of the soft material layer.
Optionally, the step of performing the drilling operation and the wedge machining operation includes:
drilling holes in the multilayer board to form through holes penetrating through the two metal hole rings and the two soft material layers;
after drilling, softening the two metal hole rings and the two soft material layers;
and pressing and transforming each softened metal hole ring to one side of the adjacent soft material layer by using a specified tool to form the wedge-shaped structure.
Optionally, after the step of electroplating the through hole, the method further includes: and removing the two soft material layers and the conducting layer of the middle non-compression joint hole section.
Optionally, the soft material layer includes a dry film, ink, or a film material.
Optionally, the method for manufacturing the dry film on the surface of the metal eyelet ring includes:
firstly, the surface of the first core plate/the second core plate, on which the metal hole ring is manufactured, is pasted with the dry film;
and then, removing the dry film part covering the region outside the surface of the metal hole ring in an exposure and development mode, and only reserving the dry film part covering the surface region of the metal hole ring.
Optionally, the method for manufacturing the thin film material on the surface of the metal eyelet ring includes:
the surface of the first core plate/the second core plate, on which the metal hole ring is manufactured, is coated with the film material;
and then removing the film material part covering the area outside the surface of the metal hole ring in a windowing way such as laser cutting, and only reserving the film material part covering the surface area of the metal hole ring.
Optionally, the metal hole ring is 0.1mm-0.2mm larger than the single edge of the signal via hole, and the soft material layer completely covers the metal hole ring.
Optionally, the thickness of the soft material layer is 30um-100 um.
Compared with the prior art, the invention has the beneficial effects that:
according to the manufacturing method of the double-sided crimping hole, the hole copper in the same through hole is separated into two parts through conventional materials and simple processes to form two isolated crimping networks, different crimping depths can be designed on the two sides, the manufacturing process is simplified, the manufacturing difficulty is reduced, and the thickness of a circuit board cannot be increased.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a flowchart of a method for manufacturing a double-sided compression-bonded circuit board according to an embodiment of the present invention;
fig. 2 is a schematic view of a manufacturing process of a double-sided compression-bonded circuit board according to an embodiment of the present invention;
fig. 3 is an enlarged view of a portion a of fig. 2.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and fig. 2, the method for manufacturing a double-sided compression-bonded circuit board according to the embodiment specifically includes the following steps:
In this embodiment, according to the processing requirement, the crimping hole to be processed can be divided into three hole sections along the axial direction: an upper compression joint hole section with a metalized hole wall, a middle non-compression joint hole section with an unmetallized hole wall and a lower compression joint hole section with a metalized hole wall. Based on this, the first designated layer is located at the boundary position of the upper crimping hole section and the middle non-crimping hole section, and the second designated layer is located at the boundary position of the lower crimping hole section and the middle non-crimping hole section.
In practical application, the number of the to-be-processed crimping holes is at least one, and for the crimping holes with different crimping depth processing requirements, the corresponding first core plate and the corresponding second core plate of the to-be-manufactured metal ring 1 need to be selected according to the boundary positions of adjacent hole segments. And specific manufacturing areas of the metal hole rings 1 on the first core plate and the second core plate are set according to the drilling positions of the crimping holes on the plate surface aiming at each crimping hole to be processed.
The metal ring 1 may be made of copper foil, and may be made simultaneously with the inner layer circuit pattern, or may be made step by step, and is not limited specifically.
In order to obtain higher product quality, each metal hole ring 1 is 0.1mm-0.2mm larger than the single side of the aperture of the corresponding pressure welding hole to be processed.
And 102, respectively manufacturing the anti-electroplating soft material layer 2 covering the surface of the metal hole ring 1 on the first core plate and the second core plate.
Soft material refers to a material which is soft in texture, resistant to high temperature and high pressure and can be removed in a certain manner. For example, the soft material may be a dry film, or may be ink that is not heat-curable, or other material as long as it has the above characteristics. The thickness of the soft material layer can be selected to be 30um-100 um.
When a dry film is adopted, the method for manufacturing the dry film covering the surface of the metal eyelet 1 may specifically include: firstly, a dry film is pasted on the surface of the first core plate/the second core plate, which is provided with the metal hole ring 1, then the dry film part covering the area outside the surface of the metal hole ring 1 is removed by adopting an exposure and development mode, and only the dry film part covering the surface area of the metal hole ring 1 is reserved.
When other thin film materials are adopted, the method for manufacturing the soft material layer 2 covering the surface of the metal hole ring 1 specifically comprises the following steps: and (3) pasting a film material on the surface of the first core plate/the second core plate on which the metal hole ring 1 is manufactured, removing the film material part covering the area except the surface of the metal hole ring 1 in a windowing mode such as laser cutting, and only keeping the film material part covering the surface area of the metal hole ring 1.
And 103, stacking the first core board, the second core board and other core boards according to a preset sequence, and then pressing to form the multilayer board.
Specifically, before lamination, corresponding inner layer circuit pattern manufacturing needs to be respectively completed on other core boards; during pressing, prepregs are required to be stacked between adjacent layers of core boards, the core boards and the core boards are overlapped or copper foils are stacked on the outer surfaces of the outer layer core boards, and a high-temperature and high-pressure pressing mode is adopted to press the core boards and the core boards into a whole so as to form the multilayer board.
And step 104, drilling at a preset position of the drilling surface by taking any plate surface of the multilayer plate as the drilling surface to form a through hole, wherein the through hole penetrates through the corresponding metal hole ring 1 and the corresponding soft material layer 2 on two specified layers.
Meanwhile, a high-temperature environment is formed in the drilling process, so that the metal hole ring 1 and the soft material layer 2 are softened to a certain degree; when the hole is drilled to the first/second designated layer, the drill is used to rotate and cut to generate an acting force on the metal hole ring 1, so that the metal hole ring 1 is extruded and deformed to one side of the soft material layer 2 to form a wedge-shaped structure, and the soft material layer 2 is not exposed due to being covered by the metal hole ring 1, as shown in fig. 3.
In this embodiment, the soft material layer 2 is mainly made of polymer resin, and has strong plasticity; the metal ring 1 is mainly made of copper foil, and the plasticity is low; the base material of the multilayer board can be made of glass fiber, resin and inorganic solid filler, most of the base material is the glass fiber soaked with the resin, and the inorganic filler is added. Therefore, the plasticity of the base material is lower than that of the soft material layer 2 and higher than that of the metal hole ring 1.
In the drilling process, the rotation speed of the drill is controlled, so that a preset high-temperature environment (such as 200-300 ℃) is generated by friction between the high-speed cutting drill and the multilayer board, the base material, the metal hole ring 1 and the soft material layer 2 of the multilayer board are softened in the high-temperature environment, and meanwhile, based on the material characteristics, the metal hole ring 1 deforms under the rotary cutting extrusion and the heat effect of the drill and extrudes the softened base material and the soft material layer 2; after drilling is finished, the temperature is reduced, the base material and the soft material layer 2 recover to a rigid state, the metal hole ring 1 cannot recover to an original state after extrusion deformation due to low plasticity, the extrusion degree of the metal hole ring 1 to the soft material layer 2 is higher than that of the soft material layer 2 to the base material, and therefore the metal hole ring 1 located on a specified layer is formed into a wedge-shaped structure, namely a nail head shape, and the outer edge of the soft material layer 2 close to the hole wall is covered. And, the greater the thickness of the soft material layer 2, the higher the degree of wedge.
In the embodiment, a high-temperature environment is manufactured by using different characteristics of three materials (the base material, the metal hole ring 1 and the soft material layer 2), so that the metal hole ring 1 is deformed into the soft and plastic soft material layer 2 under the extrusion action of the drill to form an oriented wedge-shaped structure.
And 105, depositing a conductive layer on the plate surface of the multilayer plate and the inner wall of the through hole.
The conductive layer can be carbon powder or graphite, and is deposited on the plate surface and the hole wall of the multilayer plate in a physical adsorption mode. The conductive layer is positively charged, so that the conductive layer is mainly adsorbed and deposited on the negatively charged base material of the multilayer board, and the surface adsorption amount of the positively charged copper layer is very small or the conductive layer is easy to clean and fall off.
And 106, carrying out microetching on the multilayer board on which the conductive layers are deposited, removing the metal part of each metal hole ring 1 covering the soft material layer 2, and simultaneously removing a small amount of conductive layers attached to the surface of the metal part along with the metal part, so that the soft material layers 2 of the first specified layer and the second specified layer are exposed outside.
And 107, carrying out whole-board electroplating on the multilayer board.
In the electroplating process, the hole wall is provided with a conductive layer and a copper layer, the copper layer is completely plated at the position communicated with the outer layer copper, and the copper layer cannot be plated at the position where the soft material layer 2 is formed on the hole wall; and because the middle non-crimping hole section, the upper crimping hole section and the lower crimping hole section are respectively disconnected through the soft material layer 2 and cannot be connected with the outer copper layer to pass current, the inner wall of the middle non-crimping hole section cannot be plated with a copper layer, and the inner walls of the upper crimping hole section and the lower crimping hole section are both plated with copper layers, so that the required double-sided crimping hole is obtained.
And step 108, removing the soft material layer 2 of the first specified layer and the second specified layer and the conductive layer of the middle non-compression joint hole section.
In this step, the flexible material layer 2 at the designated layer position and the conductive layer at the middle non-crimping hole section can be completely removed by adopting a conventional film removing process, which is not limited specifically.
In this embodiment, the wedge-shaped processing step of processing the metal eyelet 1 from the conventional structure into the wedge-shaped structure and the conventional drilling step are implemented by synchronous operation, that is, in the drilling step, a high-temperature environment is generated by high-speed rotation friction of a drill to soften the metal eyelet 1 and the soft material layer 2, and the drill is used to extrude and deform the metal eyelet 1 and the soft material layer 2.
Indeed, in other embodiments, the two processes may also be performed in steps: the conventional drilling process is performed, and then the wedge-shaped machining process is performed on the metal eyelet 1 at the first/second designated layer positions.
When the stepped operation mode is adopted, in the wedge-shaped processing procedure, a softening technology (not limited to a high-temperature softening mode, but also other softening liquid medicines can be applied to realize a softening effect, specifically, not limited) can be firstly adopted to soften the metal hole ring 1 and the soft material layer 2 on the first/second appointed layer, and then tools such as a drill and the like which can realize the functions of extrusion or pulling are used to extrude and deform the metal hole ring 1 to one side of the soft material layer 2 until a wedge-shaped structure meeting the requirements is formed.
In summary, the method for manufacturing the double-sided crimping hole provided by the embodiment of the invention adopts the existing common materials in the market and combines various mature processing technologies to separate the hole copper in the same through hole into two parts to form two isolated crimping networks, and the two surfaces can be designed with different crimping depths, so that the production cost is greatly reduced, a plurality of design and manufacturing limiting conditions are avoided, and the processing quality is effectively ensured.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A manufacturing method of a double-sided compression joint circuit board is characterized by comprising the following steps:
according to a preset lamination sequence, respectively manufacturing metal hole rings in preset drilling areas of crimping holes to be processed for a first core plate positioned on a first specified layer and a second core plate positioned on a second specified layer; the to-be-processed crimping hole comprises an appointed upper crimping hole section, an appointed middle non-crimping hole section and an appointed lower crimping hole section along the axial direction of the to-be-processed crimping hole; the first specified layer is the boundary position of the upper crimping hole section and the middle non-crimping hole section, and the second specified layer is the boundary position of the lower crimping hole section and the middle non-crimping hole section;
respectively manufacturing anti-electroplating soft material layers on the surfaces of the two metal hole rings;
stacking the first core board, the second core board and other core boards according to a preset sequence, and then pressing to form a multilayer board;
drilling and wedge-shaped processing to form through holes penetrating through the two metal hole rings and the two soft material layers, wherein each metal hole ring is deformed into a wedge-shaped structure extruded towards the direction of the adjacent soft material layer so as to cover the soft material layer on the exposed area of the hole wall;
depositing a conducting layer on the multilayer board, and then removing the metal layer covered outside the two soft material layers to expose the two soft material layers;
and electroplating the through hole to form a crimping hole capable of being crimped on two sides.
2. The method of manufacturing a double-sided compression-bonded wiring board according to claim 1, wherein the step of performing the drilling operation and the wedge-shaped machining operation includes:
drilling holes in the multilayer board;
forming a high-temperature environment which is not lower than a preset temperature threshold in the drilling process, wherein the preset temperature threshold is the lowest environment temperature which enables the metal hole ring and the soft material layer to reach a specified softening degree;
and simultaneously, in the drilling process, the metal hole ring is pulled by a drill so that the metal hole ring is extruded and deformed to form the wedge-shaped structure on one side of the soft material layer.
3. The method of manufacturing a double-sided compression-bonded wiring board according to claim 1, wherein the step of performing the drilling operation and the wedge-shaped machining operation includes:
drilling holes in the multilayer board to form through holes penetrating through the two metal hole rings and the two soft material layers;
after drilling, softening the two metal hole rings and the two soft material layers;
and pressing and transforming each softened metal hole ring to one side of the adjacent soft material layer by using a specified tool to form the wedge-shaped structure.
4. The method for manufacturing a double-sided compression-bonded wiring board according to claim 1, further comprising, after the step of plating the through-hole: and removing the two soft material layers and the conducting layer of the middle non-compression joint hole section.
5. The method of manufacturing a double-sided compression-bonded wiring board according to claim 1, wherein the soft material layer comprises ink or a film material, and the film material comprises a dry film.
6. The method of manufacturing a double-sided compression bonded wiring board according to claim 5, wherein the method of manufacturing the dry film on the surface of the metal grommet includes:
firstly, the surface of the first core plate/the second core plate, on which the metal hole ring is manufactured, is pasted with the dry film;
and then, removing the dry film part covering the region outside the surface of the metal hole ring in an exposure and development mode, and only reserving the dry film part covering the surface region of the metal hole ring.
7. The method for manufacturing a double-sided compression-bonded wiring board according to claim 5, wherein the method for manufacturing the film material on the surface of the metal grommet includes:
the surface of the first core plate/the second core plate, on which the metal hole ring is manufactured, is coated with the film material;
and then removing the film material part covering the area outside the surface of the metal hole ring in a windowing mode of laser cutting, and only reserving the film material part covering the surface area of the metal hole ring.
8. The method for manufacturing a double-sided compression joint circuit board according to claim 1, wherein the metal hole ring is 0.1mm to 0.2mm larger than a single side of the hole diameter of the compression joint hole to be processed, and the soft material layer completely covers the metal hole ring.
9. The method of manufacturing a double-sided compression-bonded circuit board according to claim 1, wherein the thickness of the soft material layer is 30um to 100 um.
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| CN201911380148.1A CN111010824B (en) | 2019-12-27 | 2019-12-27 | Manufacturing method of double-sided compression joint circuit board |
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| CN201911380148.1A CN111010824B (en) | 2019-12-27 | 2019-12-27 | Manufacturing method of double-sided compression joint circuit board |
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