CN105451465A - Manufacturing method for circuit board with embedded magnetic core - Google Patents
Manufacturing method for circuit board with embedded magnetic core Download PDFInfo
- Publication number
- CN105451465A CN105451465A CN201510946514.0A CN201510946514A CN105451465A CN 105451465 A CN105451465 A CN 105451465A CN 201510946514 A CN201510946514 A CN 201510946514A CN 105451465 A CN105451465 A CN 105451465A
- Authority
- CN
- China
- Prior art keywords
- magnetic core
- circuit board
- copper
- core
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
Abstract
The invention discloses a manufacturing method for a circuit board with an embedded magnetic core. The manufacturing method comprises the following steps: S1, performing a front process, and cutting a copper-coated core plate and a prepreg; S2, etching a copper foil, wherein the copper foil, close to the inner side of the circuit board, of the copper-coated core plate where the magnetic core is positioned is etched off; S3, milling a magnetic core slot in the copper-coated core plate in a depth-control manner, wherein the section of the magnetic core slot adopts a circular ring shape; S4, windowing the prepreg; S5, laminating; and S6, performing a back process. The laminating structure is adjusted; the magnetic core slot is milled from the copper-coated surface to the etching surface in the step of milling the magnetic core slot in the copper-coated core plate in a depth-control manner, so that the depth of the slot is accurate, and the condition that the magnetic core is fractured easily is reduced; and meanwhile, the inner circle diameter of the section circular ring of the magnetic core slot is less than the inner diameter of the magnetic core while the outer circle diameter of the section circular ring of the magnetic core slot is larger than the outer diameter of the magnetic core, so that a movable space is reserved for the magnetic core, and the limitation causing the condition that magnetic core is fractured easily is further reduced.
Description
Technical field
The invention belongs to printed circuit board manufacture technology field, relate in particular to a kind of manufacture method of burying magnetic core printed circuit board.
Background technology
Along with the high density, compact development trend of electronic hardware, the surface area of printed circuit board (PCB) is impelled more to reduce, but not anti-reflection is many for the element of simultaneously pasted on surface of circuit board, passive device (electric capacity, inductance, resistance etc.) accounts for the 70%-90% of component number in the circuit board, account for the 70%-80% of substrate area, for meet this kind of mount components density increase and to the high performance requirement of electronic product, develop technology passive device being imbedded circuit board inside at present, if technique widely uses, product size can significantly reduce further.
At present, burying magnetic core printed circuit board is that magnetic core is fixed on circuit board inside substantially, and can not rock, main Making programme is: (1) front operation; (2) eating away central layer one side copper; (3) on central layer, mill out the groove of accommodating magnetic core; (4) brown; (5) pressing; (6) operation afterwards.But there is following problem in this method: if remaining thick control is improper during central layer groove milling, easily cause magnetic core by pressure break during pressing; Further, the printed circuit board interiors of products magnetic core being embedded with magnetic core adopting this kind of technique to produce can not rock, and is solid product.
Summary of the invention
For this reason, technical problem to be solved by this invention is existingly to be embedded with in the printed circuit board Making programme of magnetic core, after central layer face copper is etched, mills out the groove of accommodating magnetic, then carry out pressing, obtained product magnetic core can not rock and easily in bonding processes, cause magnetic core to break; Thus a kind of manufacture method of burying magnetic core printed circuit board is proposed.
For solving the problems of the technologies described above, technical scheme of the present invention is:
The invention provides a kind of manufacture method of burying magnetic core printed circuit board, it comprises the steps:
S1, front operation, provide magnetic core, overlying copper core, prepreg, and carry out sawing sheet to overlying copper core and prepreg;
S2, etching Copper Foil, etch away the Copper Foil of the overlying copper core at magnetic core inside circuit board;
S3, overlying copper core control mill out magnetic core groove deeply, and by being etched the another side control dark groove milling of copper-clad surface to overlying copper core, the sectional view of described magnetic core groove is annulus;
S4, prepreg are windowed, and are windowed by corresponding for the prepreg between the overlying copper core layer at magnetic core described magnetic core groove;
S5, pressing, during lamination described magnetic core groove and described window in put into described magnetic core, then by overlying copper core and prepreg pressing;
S6, rear operation.
As preferably, in the cross section annulus of described magnetic core groove, circular diameter is less than described magnetic core internal diameter, and outside diameter is larger than described magnetic core external diameter.
As preferably, described prepreg window size is measure-alike or larger than described magnetic core groove size with described magnetic core groove.
As preferably, before described step S5, also comprise the operation of brown.
As preferably, described step S5 bonding processes comprises intensification section, soaking zone and temperature descending section, and pressing-in temp is 140-210 DEG C.
As preferably, described step S5 bonding processes comprises boosting section, pressurize section and step-down section, and pressing pressure is 0-380PSI/cm
2.
Technique scheme of the present invention has the following advantages compared to existing technology:
Manufacture method of burying magnetic core printed circuit board of the present invention, by adjustment pressing structure, adopt from covering copper face to the dark groove milling of etching face control in overlying copper core groove milling step, accurately groove depth, improve magnetic core easily by the situation of pressure break, under the prerequisite of magnetic core effect is buried in realization, improve the production yield containing magnetic core printed circuit panel products and improve its function; Simultaneously because in the cross section annulus of magnetic core groove, circular diameter is less than magnetic core internal diameter, outside diameter is larger than magnetic core external diameter, activity space has been reserved to magnetic core, magnetic core need not be fixed on circuit board inside, this kind hollow, and to bury Magnetic Core Design better than the conventional solid withstand voltage properties burying Magnetic Core Design product, further improves magnetic core easily by the limitation of pressure break.
Bury magnetic core printed circuit board can also reduce or not use the passive devices such as surperficial inductance, make the more integrated and systematization of circuit board, reduce holistic cost, and can wiring space be reserved to circuit board surface and vacate more surface mount space to active member, component pin inductance can be reduced thus improve performance and signal quality, the quantity of pad can also be reduced simultaneously, make printed circuit board performance more reliable.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is a kind of core plate structure schematic diagram burying magnetic core printed circuit board described in the embodiment of the present invention.
In figure, Reference numeral is expressed as: 1-first overlying copper core; 2-second overlying copper core; 3-Copper Foil; 4-magnetic core groove; 5-prepreg.
Embodiment
Embodiment
The present embodiment provides a kind of manufacture method of burying magnetic core printed circuit board, and it comprises the steps:
S1, front operation, magnetic core, overlying copper core, prepreg 3 are provided, and sawing sheet is carried out to overlying copper core and prepreg, cut out required size, as shown in Figure 1, in the present embodiment, described overlying copper core and prepreg 5 are FR4 material, comprise 2 pieces of overlying copper cores, namely the first overlying copper core 1, second overlying copper core 2, also comprises one piece of prepreg 5;
S2, etching Copper Foil, etch away the Copper Foil of overlying copper core layer inside circuit board at magnetic core, in the present embodiment, etch away lower floor's Copper Foil 3 of the first overlying copper core 1 and the upper strata Copper Foil 3 of the second overlying copper core 2;
S3, overlying copper core control mill out magnetic core groove 4 deeply, by being etched the another side control dark groove milling of copper-clad surface to overlying copper core, as shown in Figure 1, namely to be controlled dark groove milling to upper strata Copper Foil 3 direction by the first overlying copper core 1 lower floor Copper Foil 3, controlled dark groove milling by the second Copper Foil 2 upper strata Copper Foil 3 to lower floor's Copper Foil 3 direction, the sectional view of the magnetic core groove 4 milled out is annulus, the interior circular diameter of described annulus is less than the internal diameter of magnetic core, and outside diameter is greater than the external diameter of magnetic core, reserves the activity space of magnetic core;
S4, prepreg 5 are windowed, corresponding for prepreg 5 between overlying copper core layer at magnetic core described magnetic core groove 4 is windowed, window in the position corresponding to magnetic core groove 4 by the prepreg 5 between the first overlying copper core 1 and the second overlying copper core 2, described size of windowing and magnetic core groove 4 measure-alike, or larger than the size of described magnetic core groove 4;
S5, pressing, from the bottom to top that the second overlying copper core 2, prepreg 5 first overlying copper core 3 is superimposed before pressing, during lamination described magnetic core groove 4 and described window in put into described magnetic core, then by overlying copper core and prepreg 5 pressing; Bonding processes comprises intensification section, soaking zone and temperature descending section, and pressing-in temp is 140-210 DEG C; Also comprise boosting section, pressurize section and step-down section, pressing pressure is 0-380PSI/cm
2, specifically as shown in table 1:
Table 1
| Formula | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| Product initial temperature DEG C | 140 | 160 | 170 | 180 | 210 | 210 | 210 | 195 | 195 | 140 |
| Heating rate DEG C/min | 4 | 3 | 4 | 0 | 3 | 0 | 2 | 0 | 5 | 0 |
| Stage final temperature DEG C | 160 | 170 | 180 | 180 | 210 | 210 | 195 | 195 | 140 | 140 |
| Product initial pressure PSI/cm 2 | 75 | 75 | 100 | 250 | 380 | 380 | 380 | 380 | 380 | 0 |
| Pressure change rate PSI/min | 0 | 13 | 30 | 26 | 0 | 0 | 0 | 0 | 30 | 0 |
| Product final pressure PSI/cm 2 | 75 | 75 | 100 | 250 | 380 | 380 | 380 | 380 | 100 | 0 |
| Stage running time min | 5 | 5 | 8 | 10 | 10 | 50 | 12 | 60 | 10 | 1 |
S6, rear operation, conventionally carry out ectonexine pressing and other operation after core material pressing.
The present embodiment is by adjustment pressing structure, adopt from covering copper face to the dark groove milling of etching face control in overlying copper core groove milling step, accurately groove depth, improve magnetic core easily by the situation of pressure break, under the prerequisite of magnetic core effect is buried in realization, improve the production yield containing magnetic core printed circuit panel products and improve its function; Simultaneously because in the cross section annulus of magnetic core groove, circular diameter is less than magnetic core internal diameter, outside diameter is larger than magnetic core external diameter, reserved activity space to magnetic core, magnetic core need not be fixed on circuit board inside, further improves magnetic core easily by the limitation of pressure break.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (6)
1. bury a manufacture method for magnetic core printed circuit board, it is characterized in that, comprise the steps:
S1, front operation, provide magnetic core, overlying copper core, prepreg, and carry out sawing sheet to overlying copper core and prepreg;
S2, etching Copper Foil, etch away the Copper Foil of the overlying copper core at magnetic core inside circuit board;
S3, overlying copper core control mill out magnetic core groove deeply, and by being etched the another side control dark groove milling of copper-clad surface to overlying copper core, the sectional view of described magnetic core groove is annulus;
S4, prepreg are windowed, and are windowed by corresponding for the prepreg between the overlying copper core layer at magnetic core described magnetic core groove;
S5, pressing, during lamination described magnetic core groove and described window in put into described magnetic core, then by overlying copper core and prepreg pressing;
S6, rear operation.
2. manufacture method of burying magnetic core printed circuit board according to claim 1, is characterized in that, in the cross section annulus of described magnetic core groove, circular diameter is less than described magnetic core internal diameter, and outside diameter is larger than described magnetic core external diameter.
3. manufacture method of burying magnetic core printed circuit board according to claim 1 and 2, is characterized in that, described prepreg window size is measure-alike or larger than described magnetic core groove size with described magnetic core groove.
4. manufacture method of burying magnetic core printed circuit board according to claim 3, is characterized in that, also comprises the operation of brown before described step S5.
5. manufacture method of burying magnetic core printed circuit board according to claim 4, is characterized in that, described step S5 bonding processes comprises intensification section, soaking zone and temperature descending section, and pressing-in temp is 140-210 DEG C.
6. manufacture method of burying magnetic core printed circuit board according to claim 5, is characterized in that, described step S5 bonding processes comprises boosting section, pressurize section and step-down section, and pressing pressure is 0-380PSI/cm
2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510946514.0A CN105451465A (en) | 2015-12-16 | 2015-12-16 | Manufacturing method for circuit board with embedded magnetic core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510946514.0A CN105451465A (en) | 2015-12-16 | 2015-12-16 | Manufacturing method for circuit board with embedded magnetic core |
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| Publication Number | Publication Date |
|---|---|
| CN105451465A true CN105451465A (en) | 2016-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510946514.0A Pending CN105451465A (en) | 2015-12-16 | 2015-12-16 | Manufacturing method for circuit board with embedded magnetic core |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106848862A (en) * | 2017-01-19 | 2017-06-13 | 厦门弘诚复合材料有限公司 | A kind of composite flame-proof cardboard and preparation method thereof |
| CN107231756A (en) * | 2017-07-20 | 2017-10-03 | 胜宏科技（惠州）股份有限公司 | A kind of linear high frequency sheet material path compression method |
| CN108650804A (en) * | 2018-05-14 | 2018-10-12 | 深圳市深联电路有限公司 | A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods |
| CN113012902A (en) * | 2021-02-25 | 2021-06-22 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Planar inductor and manufacturing method thereof |
| CN115843158A (en) * | 2023-02-22 | 2023-03-24 | 遂宁睿杰兴科技有限公司 | Printed circuit board with embedded inductance magnetic core and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101018446A (en) * | 2007-02-09 | 2007-08-15 | 西安交通大学 | A passive base board for the switch power module and its making method |
| CN102933040A (en) * | 2012-10-23 | 2013-02-13 | 东莞生益电子有限公司 | Method for manufacturing printed circuit board (PCB) with buried inductance device |
| US20130104365A1 (en) * | 2011-10-31 | 2013-05-02 | Tripod Technology Corporation | Method of embedding magnetic component in substrate |
-
2015
- 2015-12-16 CN CN201510946514.0A patent/CN105451465A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101018446A (en) * | 2007-02-09 | 2007-08-15 | 西安交通大学 | A passive base board for the switch power module and its making method |
| US20130104365A1 (en) * | 2011-10-31 | 2013-05-02 | Tripod Technology Corporation | Method of embedding magnetic component in substrate |
| CN102933040A (en) * | 2012-10-23 | 2013-02-13 | 东莞生益电子有限公司 | Method for manufacturing printed circuit board (PCB) with buried inductance device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106848862A (en) * | 2017-01-19 | 2017-06-13 | 厦门弘诚复合材料有限公司 | A kind of composite flame-proof cardboard and preparation method thereof |
| CN106848862B (en) * | 2017-01-19 | 2019-07-16 | 厦门弘诚复合材料有限公司 | A kind of composite flame-proof cardboard and preparation method thereof |
| CN107231756A (en) * | 2017-07-20 | 2017-10-03 | 胜宏科技（惠州）股份有限公司 | A kind of linear high frequency sheet material path compression method |
| CN108650804A (en) * | 2018-05-14 | 2018-10-12 | 深圳市深联电路有限公司 | A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods |
| CN108650804B (en) * | 2018-05-14 | 2022-07-19 | 深圳市深联电路有限公司 | Method for manufacturing PDU high-voltage control circuit board of new energy automobile |
| CN113012902A (en) * | 2021-02-25 | 2021-06-22 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Planar inductor and manufacturing method thereof |
| CN115843158A (en) * | 2023-02-22 | 2023-03-24 | 遂宁睿杰兴科技有限公司 | Printed circuit board with embedded inductance magnetic core and manufacturing method thereof |
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Application publication date: 20160330 |