CN107231756A - A kind of linear high frequency sheet material path compression method - Google Patents
A kind of linear high frequency sheet material path compression method Download PDFInfo
- Publication number
- CN107231756A CN107231756A CN201710593886.9A CN201710593886A CN107231756A CN 107231756 A CN107231756 A CN 107231756A CN 201710593886 A CN201710593886 A CN 201710593886A CN 107231756 A CN107231756 A CN 107231756A
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- China
- Prior art keywords
- pressing
- psi
- high frequency
- compression method
- sheet material
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The linear high frequency sheet material path compression method that the present invention is provided, pcb board is close to using aluminium flake in the design of pressing stack and improves heat transfer efficiency, strengthen heat capacity, and stitching surface is smooth when to press, and coordinate silicagel pad to be buffered in pressing, the problem of pressing depression and copper sheet wrinkle can effectively be prevented, and required for TU 933 and TU 933+ materials pressing-in temp and tie the special pressing formula of pressing stack design, and then improve the reliability after the pcb board pressing that TU 933 and TU 933+ materials are made.
Description
Technical field
Field, more particularly to a kind of linear high frequency sheet material path compression method are made the present invention relates to circuit board pressing.
Background technology
TU-933 and TU-933+ are a kind of hyperfrequency low loss line plate baseplate materials, and its high frequency grade is FR4 high frequency materials
Highest in material, can meet the demand up to 100GHz high frequency, applied to high-frequency high-speeds such as high-speed computer, communication, radio
Occasion, its electric property is suitable with PTFE, while good moisture resistance is also shown, superior chemical resistance, and it is extraordinary
Resistance to CAF performances, and there is obviously advantage to the design of high multilayer circuit and reliability.
But the resin properties in the baseplate material require that temperature rise is higher during pressing, and solidification temperature is higher, heating rate
In 3.2-4.2 DEG C/min, more than 200 DEG C of solidification temperature ＞ is, it is necessary to rapid, high volume heat supply；And this material glass cloth is thinner, it is easy to
There is pressing depression；Moreover, due to pursuing high frequency characteristics, few to the loss of signal, the copper foil of its copper face belongs to VLP, i.e., thick
The relatively low copper foil of rugosity, therefore have that relative binding capacity is poor, copper sheet easily wrinkles when being pressed for spacious area.
Therefore planting material and the pressing processing conditions in common material has very big difference, and common compression method can not meet this
Reliability requirement after the pressing of material.
The content of the invention
In view of the above-mentioned problems, the present invention provides a kind of linear high frequency specifically designed for TU-933 and TU-933+ baseplate materials
Sheet material path compression method, including step:
Pre- folded, the pcb board that TU933 or TU933+ materials are made is laminated by pressing stack design, in the upper surface of pcb board
Stack gradually aluminium flake, silicagel pad, steel plate from the inside to the outside, the lower surface of pcb board stack gradually from the inside to the outside aluminium flake, silicagel pad,
Steel plate；It is pre- it is folded after the completion of pressed.
It is preferred that, during pressing, using electric heating pump press.
Further, using 9 sections of pressing formulas during pressing, pressing pressure (psi) is followed successively by 70 psi, 200 psi, 350
psi、420 psi、420 psi、420 psi、420 psi、240psi、140psi；Pressing-in temp be followed successively by 120 DEG C, 140 DEG C,
160℃、180℃、220℃、220℃、220℃、180℃、140℃；Pressing time be followed successively by 5min, 5min, 5min, 5min,
8min、50min、120min、15min、10min。
It is preferred that, during pressing, using electric press, it presses parameter for heating rate 3.5-3.7/min when using electric press
(80-140 DEG C) high pressure temperature is 110-130 DEG C, and pressure is 400psi, and condition of cure is 200 DEG C of 120min maintained above.
The linear high frequency sheet material path compression method that the present invention is provided, is close in the design of pressing stack using aluminium flake
Pcb board improves heat transfer efficiency, strengthens heat capacity, and stitching surface is smooth when to press, and coordinates silicagel pad to make in pressing
Buffering, can effectively prevent the problem of pressing depression and copper sheet wrinkle, and will for the pressing-in temp of TU-933 and TU-933+ materials
Ask and tie pressing stack and design special pressing formula, experiment proves that, it can improve what TU-933 and TU-933+ materials were made
Reliability after pcb board pressing.
Brief description of the drawings
Fig. 1 is the folded structure schematic diagram of linear high frequency sheet material path compression method embodiment lamination that the present invention is provided.
Embodiment
The technology contents of the present invention are understood for convenience of those skilled in the art, below in conjunction with the accompanying drawings and embodiment is to this hair
It is bright to be described in further detail.
Embodiment 1, the pcb board progress that TU933 or TU933+ materials are made first is pre- folded, by TU933 or TU933+ materials
Expect that the pcb board being made is laminated by pressing stack design, its pressing stack is to stack gradually steel plate 1, silicagel pad from top to bottom
2nd, aluminium flake 3, pcb board 4, aluminium flake 5, silicagel pad 6, steel plate 7, as shown in figure 1, improving the capacity of heat transmission using aluminium flake, coordinate silicagel pad
So that pressing is smooth, pressing depression and copper sheet corrugation are prevented；It is pre- it is folded after the completion of pressed, during pressing, using electric heating pump press,
By repetition test, using 9 sections of pressing formulas, its pressing pressure (psi) is followed successively by 70 psi, 200 psi, 350 psi, 420
psi、420 psi、420 psi、420 psi、240psi、140psi；Pressing-in temp be followed successively by 120 DEG C, 140 DEG C, 160 DEG C, 180
℃、220℃、220℃、220℃、180℃、140℃；Pressing time be followed successively by 5min, 5min, 5min, 5min, 8min,
50min、120min、15min、10min.Quickly heated up when pressing for first 4 sections, meet TU933 or TU933+ materials institute
It is required that 3.2-4.2 DEG C of temperature rise/min again with 220 DEG C holding 120 min, so as to meet the temperature requirement of material solidification.
Embodiment 2, using pressing stack in the same manner as in Example 1, is pressed using electric press, and it presses parameter and set
It is set to for heating rate 3.5-3.7/min (80-140 DEG C), high pressure temperature is set as that pressure is 400psi for 110-130 DEG C；Gu
Change condition is 200 DEG C of 120min maintained above.
It is the specific implementation of the present invention above, it describes more specific and detailed, but can not therefore be interpreted as
Limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, not departing from this hair
On the premise of bright design, various modifications and improvements can be made, these obvious alternative forms belong to the present invention's
Protection domain.
Claims (4)
1. a kind of linear high frequency sheet material path compression method, including step:
Pre- folded, the pcb board that TU933 or TU933+ materials are made is laminated by pressing stack design, in the upper surface of pcb board
Stack gradually aluminium flake, silicagel pad, steel plate from the inside to the outside, the lower surface of pcb board stack gradually from the inside to the outside aluminium flake, silicagel pad,
Steel plate；It is pre- it is folded after the completion of pressed.
2. according to linear high frequency sheet material path compression method described in claim 1, it is characterised in that：During pressing, using electric heating pump
Press.
3. according to linear high frequency sheet material path compression method described in claim 2, it is characterised in that：Using 9 sections of pressings during pressing
Formula, pressing pressure (psi) is followed successively by 70 psi, 200 psi, 350 psi, 420 psi, 420 psi, 420 psi, 420
psi、240psi、140psi；Pressing-in temp be followed successively by 120 DEG C, 140 DEG C, 160 DEG C, 180 DEG C, 220 DEG C, 220 DEG C, 220 DEG C, 180
℃、140℃；Pressing time is followed successively by 5min, 5min, 5min, 5min, 8min, 50min, 120min, 15min, 10min.
4. according to linear high frequency sheet material path compression method described in claim 1, it is characterised in that：During pressing, using electric press,
It is 110-130 DEG C, pressure for heating rate 3.5-3.7/min (80-140 DEG C) high pressure temperature that it, which presses parameter, when using electric press
For 400psi, condition of cure is 200 DEG C of 120min maintained above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710593886.9A CN107231756A (en) | 2017-07-20 | 2017-07-20 | A kind of linear high frequency sheet material path compression method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710593886.9A CN107231756A (en) | 2017-07-20 | 2017-07-20 | A kind of linear high frequency sheet material path compression method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107231756A true CN107231756A (en) | 2017-10-03 |
Family
ID=59957134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710593886.9A Pending CN107231756A (en) | 2017-07-20 | 2017-07-20 | A kind of linear high frequency sheet material path compression method |
Country Status (1)
| Country | Link |
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| CN (1) | CN107231756A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966530A (en) * | 2018-08-15 | 2018-12-07 | 恩达电路(深圳)有限公司 | Rigid Flex is laminated production method |
| CN110557899A (en) * | 2019-08-28 | 2019-12-10 | 广合科技（广州）有限公司 | method for processing expansion and shrinkage of PCB finished board |
| CN113038739A (en) * | 2021-03-08 | 2021-06-25 | 浙江万正电子科技有限公司 | Press-fitting process of mixed-pressure high-frequency microwave multilayer circuit board and mixed-pressure high-frequency microwave multilayer circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966530A (en) * | 2018-08-15 | 2018-12-07 | 恩达电路(深圳)有限公司 | Rigid Flex is laminated production method |
| CN110557899A (en) * | 2019-08-28 | 2019-12-10 | 广合科技（广州）有限公司 | method for processing expansion and shrinkage of PCB finished board |
| CN113038739A (en) * | 2021-03-08 | 2021-06-25 | 浙江万正电子科技有限公司 | Press-fitting process of mixed-pressure high-frequency microwave multilayer circuit board and mixed-pressure high-frequency microwave multilayer circuit board |
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Application publication date: 20171003 |
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| RJ01 | Rejection of invention patent application after publication |