CN209314138U

CN209314138U - A kind of Multi-layer PCB structure of dielectric layer uniform, controllable

Info

Publication number: CN209314138U
Application number: CN201821587515.6U
Authority: CN
Inventors: 余斌
Original assignee: Shanghai Fast-Pcb Circuit Technology Corp Ltd
Current assignee: Shanghai Fast-Pcb Circuit Technology Corp Ltd
Priority date: 2018-09-27
Filing date: 2018-09-27
Publication date: 2019-08-27
Anticipated expiration: 2028-09-27

Abstract

The utility model relates to a kind of Multi-layer PCB structures of dielectric layer uniform, controllable, including steel plate layer, cover layer, core layer and layer of prepreg, the layer of prepreg is symmetrical arranged relative to the upper and lower surface of the core layer, the steel plate layer is symmetrical above and below to be covered in the layer of prepreg, the cover layer is symmetrical above and below to be covered in the steel plate layer, the surface of the layer of prepreg is equipped with multiple half elliptic blob of viscoses, and the upper and lower surface of the core layer is equipped with multiple hexagon shrinkage pool structures.Compared with prior art, the advantages that the utility model has dielectric layer error small, and thickness is thin, and precision is high, and circuit transmission performance is good.

Description

A kind of Multi-layer PCB structure of dielectric layer uniform, controllable

Technical field

The utility model relates to a kind of multi-layer PCB boards, hardened more particularly, to a kind of multi-layer PCB of dielectric layer uniform, controllable Structure.

Background technique

Thin type multilayer board since the 1990s, due to electronic product sharply move towards light weight it is (small-sized) change, it is multi-functional Change portability, it is therefore desirable to which corresponding member component must move towards light, thin, short, smallization, such as thin minimized and densification member component (such as various snap-gauges, mobile phone board ... are until current for (TSOP, TQFP, BGA, PBGA ...) and Bao little Yu portable electronic product IPAD/Iphone etc.) continuous appearance, push PCB development and progress significantly.Such as JEIDA (Japan Electronics industry in 1993 Association) standardized by PCMCIA since, greatly pushed slim and ultrathin multiple-plate rapid development.6 plate overall thickness are 0.30~0.46mm, 8 laminate overall thickness are 0.45mm~0.60mm, or even require thin to 0.26mm, and for another example 20 laminate thickness are small In 2.0mm, 46 laminate thickness are less than 3.6mm ....Therefore, since 1994 since thin base-material sales volume have rapidly Increase, current slim and ultrathin multi-layer board (especially 4-10 layers) has become the mainstream of PCB industry.

However, multi-layer PCB board in the fabrication process, often will appear the uneven thickness due to the upper and lower surface of core plate at present Even problem, it is bad so as to cause the characteristic impedance control of monolith pcb board, cause high-speed signal transmission to go out in the process with terminal Phenomena such as now loss loss, attenuation distortion, signal overlap is mixed and disorderly.

Utility model content

The purpose of this utility model is exactly to overcome the problems of the above-mentioned prior art and to provide a kind of dielectric layer equal Even controllable Multi-layer PCB structure.

The purpose of this utility model can be achieved through the following technical solutions:

A kind of Multi-layer PCB structure of dielectric layer uniform, controllable, including steel plate layer, cover layer, core layer and prepreg Layer, the layer of prepreg are symmetrical arranged relative to the upper and lower surface of the core layer, and the steel plate layer is symmetrical above and below to be covered in In the layer of prepreg, the cover layer is symmetrical above and below to be covered in the steel plate layer, which is characterized in that the semi-solid preparation The surface of lamella is equipped with multiple half elliptic blob of viscoses, and the upper and lower surface of the core layer is equipped with multiple hexagon shrinkage pool knots Structure.

Preferably, the cover layer is the cover layer using CCL material.

Preferably, the curing time standard of the cover layer is 170 DEG C >=60min.

Preferably, cushion is additionally provided between the steel plate layer and the cover layer.

Preferably, the cushion is pressed by 30 brown paper.

Preferably, the width of each edge of the hexagon shrinkage pool structure is 10mil~15mil.

Preferably, the tensile strength of the steel plate layer is 8.0Mpa~13Mpa.

Preferably, the heatproof temperature of the cushion is -50 DEG C~250 DEG C.

Preferably, the buried via hole for positioning welding is additionally provided in the steel plate layer.

Compared with prior art, the utility model has the advantage that

(1) matched by the way that multiple half elliptic blob of viscoses are arranged in core plate with the hexagon shrinkage pool structure being set in core layer It is more stable to close the heated dielectric layer that is formed by later, it is thinner, it is not in problem in uneven thickness.

(2) by setting the curing time standard of cover layer as 170 DEG C >=60min, the liter of core layer and layer of prepreg Warm rate is 1.0 DEG C/min~1.5 DEG C/min, and then makes entire multiple-plate machine-shaping speed faster.

(3) pass through the tensile strength for setting steel plate layer as 8.0Mpa~13Mpa, the heatproof temperature of cushion is -50 DEG C ~250 DEG C, makes the multiple-plate physical characteristic finally produced more preferably, can adapt to more application environments.

Detailed description of the invention

In order to further elucidate the utility model each embodiment the above and other advantages and features, will with reference to attached drawing come The more specific description of each embodiment of the utility model is presented.It is appreciated that these attached drawings only describe the allusion quotation of the utility model Type embodiment, therefore be not to be regarded as being restriction on its scope.Also, the relative position of various pieces shown in the accompanying drawings and Size is exemplary, and is not to be construed as the position uniquely determined between various pieces or size relationship.

Fig. 1 is the overall structure diagram of the utility model；

Fig. 2 is the surface texture schematic diagram of the core layer of the utility model；

Drawing reference numeral explanation:

1 is steel plate layer；2 be cover layer；3 be layer of prepreg；4 be core layer；5 be cushion.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model It clearly and completely describes, it is clear that described embodiment is a part of the embodiment of the utility model, rather than is all implemented Example.Based on the embodiments of the present invention, those of ordinary skill in the art institute without making creative work The every other embodiment obtained all should belong to the range of the utility model protection.

Embodiment

It is as depicted in figs. 1 and 2 the surface texture schematic diagram of the overall structure diagram of the utility model and its core layer, Including steel plate layer 1, tensile strength is 8.0Mpa~13Mpa, cover layer 2, and material uses CCL material, curing time standard For 170 DEG C >=60min, core layer 4 and layer of prepreg 3, layer of prepreg 3 is symmetrically set relative to the upper and lower surface of core layer 4 It sets, steel plate layer 1 is symmetrical above and below to be covered in layer of prepreg 3, and cover layer 2 is symmetrical above and below to be covered in the steel plate layer 1, and half is solid The surface for changing lamella 3 is equipped with multiple half elliptic blob of viscoses, and the upper and lower surface of core layer 4 is equipped with multiple hexagon shrinkage pool knots Structure, the width of each edge of hexagon shrinkage pool structure are 10mil~15mil, wherein in lamination process, due to ectonexine and heat Source is apart from variant, it is therefore necessary to influence of the temperature difference to layer of prepreg 3 and core layer 4 is investigated, so prepreg The heating rate of layer 3 and core layer 4 is 1.0 DEG C/min~1.5 DEG C/min, multi-layer board or backing material plate when pressing (lamination), Brown paper is adopted to be used as heat transfer buffer more.It is to be placed on it between hot plate (Platern) of pressing machine and steel plate, to mitigate Closest to the heating curve of scattered material.Make between multiple substrates to be pressed or multi-layer board.Further the temperature difference of its each laminate material as far as possible Different, general common specification is 90 pounds to 150 pounds.Since fiber has been pressed down in its paper after high temperature and pressure, no longer there is toughness And be difficult to function, therefore must try to renew.Such brown paper is to boil pine and the mixed liquor of various highly basic altogether, is waved to it After sending out object runaway and removing acids, is washed and precipitated immediately；After its become paper pulp after, can it is re-compacted and become it is coarse just Therefore suitable paper wood is additionally provided with cushion 5 between steel plate layer 1 and cover layer 2, pressed by 30 brown paper, resistance to Temperature is -50 DEG C~250 DEG C, and the buried via hole for positioning welding is additionally provided in steel plate layer 1.

The hexagon shrinkage pool structure in semicircle blob of viscose structure and core layer in the utility model cooperates, heated Under conditions of, the colloid of multiple-plate dielectric layer of final molding is controllably in hexagon shrinkage pool structure, so that entire more The performance of laminate is greatly improved.

Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to In this, anyone skilled in the art within the technical scope disclosed by the utility model, can be readily occurred in various Equivalent modifications or substitutions, these modifications or substitutions should be covered within the scope of the utility model.Therefore, this is practical Novel protection scope should be subject to the protection scope in claims.

Claims

1. a kind of Multi-layer PCB structure of dielectric layer uniform, controllable, including steel plate layer (1), cover layer (2), core layer (4) and Layer of prepreg (3), the layer of prepreg (3) are symmetrical arranged relative to the upper and lower surface of the core layer (4), the steel plate (1) is symmetrical above and below is covered on the layer of prepreg (3) for layer, and the cover layer (2) is symmetrical above and below to be covered in the steel plate layer (1) on, which is characterized in that the surface of the layer of prepreg (3) is equipped with multiple half elliptic blob of viscoses, the core layer (4) upper and lower surface is equipped with multiple hexagon shrinkage pool structures.

2. a kind of Multi-layer PCB structure of dielectric layer uniform, controllable according to claim 1, which is characterized in that described Cover layer (2) is the cover layer using CCL material.

3. a kind of Multi-layer PCB structure of dielectric layer uniform, controllable according to claim 1 or 2, which is characterized in that described Cover layer (2) be curing time standard 170 DEG C >=60min cover layer.

4. a kind of Multi-layer PCB structure of dielectric layer uniform, controllable according to claim 1, which is characterized in that described Cushion (5) are additionally provided between steel plate layer (1) and the cover layer (2).

5. a kind of Multi-layer PCB structure of dielectric layer uniform, controllable according to claim 4, which is characterized in that described slow Bed course (5) is rushed to be pressed by 30 brown paper.

6. a kind of Multi-layer PCB structure of dielectric layer uniform, controllable according to claim 1, which is characterized in that described The width of each edge of hexagon shrinkage pool structure is 10mil~15mil.

7. a kind of Multi-layer PCB structure of dielectric layer uniform, controllable according to claim 1, which is characterized in that described Steel plate layer (1) is steel plate layer of the tensile strength in 8.0Mpa~13Mpa.

8. a kind of Multi-layer PCB structure of dielectric layer uniform, controllable according to claim 4 or 5, which is characterized in that described Cushion (5) be cushion of the heatproof temperature at -50 DEG C~250 DEG C.

9. a kind of Multi-layer PCB structure of dielectric layer uniform, controllable according to claim 1 or claim 7, which is characterized in that described Steel plate layer (1) on be additionally provided with buried via hole for positioning welding.