CN203708639U - Compression structure for flexible circuit board prepared by liquid crystal polymer polymeric materials - Google Patents
Compression structure for flexible circuit board prepared by liquid crystal polymer polymeric materials Download PDFInfo
- Publication number
- CN203708639U CN203708639U CN201320758547.9U CN201320758547U CN203708639U CN 203708639 U CN203708639 U CN 203708639U CN 201320758547 U CN201320758547 U CN 201320758547U CN 203708639 U CN203708639 U CN 203708639U
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- liquid crystal
- circuit board
- flexible circuit
- compression structure
- polymeric materials
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Abstract
The utility model relates to a compression structure for a flexible circuit board prepared by liquid crystal polymer polymeric materials. The compression structure comprises separation filling layers, mirror surface steel plates, bumper pads and support plates which are successively laminated from inside to outside and compressed on surfaces of two sides of a flexible circuit board product respectively; and each separation filling layer comprises an HDPE layer and aluminum sheets respectively laminated on surfaces of two sides of the HDPE layer, one side aluminum sheet is contacted with the flexible circuit board product, and the other side aluminum sheet is contacted with one mirror surface steel plate. According to the compression structure, heat conduction can be uniform during the compressing process, flowability and fillibility of colloid in the liquid crystal polymer polymeric materials are improved, so that glue flowing can be more flattening; gas between multiple laminated structures can be driven out, expansion and contraction of the product can be reduced, release of the product can be improved due to the aluminum sheets which are directly contacted with the product, and board explosion abnormity which happens during the compressing process can be effectively solved; and the compression structure is especially suitable for compressing the flexible circuit board prepared by the liquid crystal polymer polymeric materials.
Description
Technical field
The utility model relates to a kind of pressing structure of flexible circuit board, especially a kind of pressing structure of the flexible circuit board that adopts polymeric liquid crystal copolymer material.
Background technology
In soft printed circuit board industry, the existing pressing mode generally adopting is: flexible PCB (FPC) place respectively up and down TPX or diffusion barrier, then at the highest 180 DEG C, 50kg/mm
2condition under carry out pressing through amounting to the heating and cooling process of 120 minutes.But, this pressing structure and pressing mode can exert an influence for colloid mobility and the adhesion of polymeric liquid crystal copolymer material, there will be serious plate bursting etc. bad, the quality of the goods after pressing cannot be protected, thereby and not be suitable for the pressing that adopts the flexible PCB that polymeric liquid crystal copolymer material makes.
Summary of the invention
The purpose of this utility model is to provide a kind of pressing structure that is applicable to the flexible circuit board that adopts polymeric liquid crystal copolymer material.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of pressing structure of the flexible circuit board that adopts polymeric liquid crystal copolymer material, be applied to adopt the pressing of the flexible circuitry slab products that polymeric liquid crystal copolymer material makes make in and make it and form the folded structure of multilayer, it comprises respectively from inside to outside separation packed layer, mirror steel plate, cushion pad and support plate in the folded both side surface of establishing and be pressed on described flexible circuitry slab products successively; Described separation packed layer comprises HDPE layer and is stacked at respectively the aluminium flake in described HDPE layer both side surface, and the aluminium flake described in a side contacts with described flexible circuitry slab products, and the aluminium flake described in opposite side contacts with described mirror steel plate.
Because technique scheme is used, the utility model compared with prior art has following advantages: the separation packed layer that the utility model arranges respectively in the both sides of the flexible circuitry slab products that adopts polymeric liquid crystal copolymer material to make is as separating and filling, can make in pressing process heat conduction even, the mobility and the fillibility that promote colloid in polymeric liquid crystal copolymer material, reach the more smooth object of gummosis.Simultaneously, this structure can be driven the gas between the folded structure of multilayer out of and reduce the harmomegathus of goods, improve the release of goods by the aluminium flake directly contacting with goods, can effectively solve the plate bursting occurring in pressing abnormal, be particularly useful for adopting the pressing of the flexible circuit board that polymeric liquid crystal copolymer material makes.
Brief description of the drawings
The cross-sectional schematic that accompanying drawing 1 is pressing structure of the present utility model.
In above accompanying drawing: 1, flexible circuitry slab products; 2, separate packed layer; 3, mirror steel plate; 4, cushion pad; 5, support plate; 21, HDPE layer; 22, aluminium flake.
Embodiment
Below in conjunction with embodiment shown in the drawings, the utility model is further described.
Embodiment mono-: shown in accompanying drawing 1, be applied to adopt the pressing of the flexible circuitry slab products 1 that polymeric liquid crystal copolymer material makes make in and make it and form the pressing structure of the folded structure of multilayer, comprise respectively from inside to outside separation packed layer 2, mirror steel plate 3, cushion pad 4 and support plate 5 in the folded both side surface of establishing and be pressed on flexible circuitry slab products 1 successively.Wherein, " interior " refers to that side towards flexible circuitry slab products 1, and " outward " refers to deviate from that side of flexible circuitry slab products 1.
Separate that packed layer 2 comprises HDPE layer 21 and aluminium flake 22, the one side aluminium flakes 22 that are stacked at respectively in HDPE layer 21 both side surface contact with flexible circuitry slab products 1, opposite side aluminium flake 22 contacts with mirror steel plate 3.This separation packed layer 2 can make in pressing process heat conduction even, promote mobility and the fillibility of colloid in polymeric liquid crystal copolymer material, reach the more smooth object of gummosis, its aluminium flake 22 directly contacting with flexible circuitry slab products 1 can also improve the release of goods.
Above-mentioned pressing structure carries out pressing by following pressing condition: pressing time statistics 210 minutes.In whole section of pressing time, be divided into 10 sections according to the difference of pressing-in temp, pressing-in temp and duration in these 10 sections are respectively: 1. 50 DEG C continue 3 minutes; 2. 80 DEG C continue 6 minutes; 3. 80 DEG C continue 60 minutes; 4. 150 DEG C continue 12 minutes; 5. 150 DEG C continue 10 minutes; 6. 305 DEG C continue 40 minutes; 7. 305 DEG C continue 40 minutes; 8. 220 DEG C continue 14 minutes; 9. 100 DEG C continue 7 minutes; 10. 50 DEG C continue 20 minutes.And being divided into 5 sections according to the difference of pressure in whole section of pressing time, pressing pressure and duration in these 5 sections are respectively: 1. 0kg continues 73 minutes; 2. 40.8kg continues 1 minute; 3. 40.8kg continues 15 minutes; 4. 10.1kg continues 1 minute; 5. 10.1kg continues 120 minutes.
When adopting above-mentioned pressing structure, improve pressing-in temp, pressing time and pressing pressure, thereby can effectively avoid the goods that pressing forms to occur that plate bursting etc. is bad.
Above-described embodiment is only explanation technical conceive of the present utility model and feature, and its object is to allow person skilled in the art can understand content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences of doing according to the utility model Spirit Essence change or modify, within all should being encompassed in protection range of the present utility model.
Claims (1)
1. one kind adopts the pressing structure of the flexible circuit board of polymeric liquid crystal copolymer material, be applied to adopt the pressing of the flexible circuitry slab products that polymeric liquid crystal copolymer material makes make in and make it and form the folded structure of multilayer, it is characterized in that: it comprises respectively from inside to outside separation packed layer, mirror steel plate, cushion pad and support plate in the folded both side surface of establishing and be pressed on described flexible circuitry slab products successively; Described separation packed layer comprises HDPE layer and is stacked at respectively the aluminium flake in described HDPE layer both side surface, and the aluminium flake described in a side contacts with described flexible circuitry slab products, and the aluminium flake described in opposite side contacts with described mirror steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320758547.9U CN203708639U (en) | 2013-11-27 | 2013-11-27 | Compression structure for flexible circuit board prepared by liquid crystal polymer polymeric materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320758547.9U CN203708639U (en) | 2013-11-27 | 2013-11-27 | Compression structure for flexible circuit board prepared by liquid crystal polymer polymeric materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203708639U true CN203708639U (en) | 2014-07-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320758547.9U Expired - Fee Related CN203708639U (en) | 2013-11-27 | 2013-11-27 | Compression structure for flexible circuit board prepared by liquid crystal polymer polymeric materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203708639U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107231756A (en) * | 2017-07-20 | 2017-10-03 | 胜宏科技（惠州）股份有限公司 | A kind of linear high frequency sheet material path compression method |
| CN108156750A (en) * | 2018-01-11 | 2018-06-12 | 深圳市景旺电子股份有限公司 | A kind of flexible PCB and preparation method thereof |
| CN109511217A (en) * | 2019-01-07 | 2019-03-22 | 深圳市顺荣昌电路有限公司 | A kind of high reflectance energy conservation double-face backlight wiring board |
| CN111491452A (en) * | 2020-04-28 | 2020-08-04 | 深圳市信维通信股份有限公司 | L CP flexible circuit board and manufacturing method thereof |
-
2013
- 2013-11-27 CN CN201320758547.9U patent/CN203708639U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107231756A (en) * | 2017-07-20 | 2017-10-03 | 胜宏科技（惠州）股份有限公司 | A kind of linear high frequency sheet material path compression method |
| CN108156750A (en) * | 2018-01-11 | 2018-06-12 | 深圳市景旺电子股份有限公司 | A kind of flexible PCB and preparation method thereof |
| CN109511217A (en) * | 2019-01-07 | 2019-03-22 | 深圳市顺荣昌电路有限公司 | A kind of high reflectance energy conservation double-face backlight wiring board |
| CN111491452A (en) * | 2020-04-28 | 2020-08-04 | 深圳市信维通信股份有限公司 | L CP flexible circuit board and manufacturing method thereof |
| CN111491452B (en) * | 2020-04-28 | 2021-05-25 | 深圳市信维通信股份有限公司 | LCP flexible circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20161127 |