CN109511217A - A kind of high reflectance energy conservation double-face backlight wiring board - Google Patents
A kind of high reflectance energy conservation double-face backlight wiring board Download PDFInfo
- Publication number
- CN109511217A CN109511217A CN201910011296.XA CN201910011296A CN109511217A CN 109511217 A CN109511217 A CN 109511217A CN 201910011296 A CN201910011296 A CN 201910011296A CN 109511217 A CN109511217 A CN 109511217A
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- Prior art keywords
- layer
- wiring board
- compounded
- thermally conductive
- main body
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a kind of high reflectance energy conservation double-face backlight wiring boards, including wiring board main body, the upper surface of the wiring board main body is compounded with high reflection layer, and the lower surface of the wiring board main body is compounded with thermally conductive Withstand voltage layer, and the lower surface of the thermally conductive Withstand voltage layer is equally also compounded with high reflection layer.Total reflectivity of the high reflectance energy conservation double-face backlight wiring board mirror surface aluminum layer can reach 90%, regular reflection rate can reach 80%, it is capable of the reflectivity of enhancement line plate entirety, the reflection classification that aluminium film is electroplated in ABS is mirror-reflection, average reflectance can reach 94%, the range of reflection wavelength is wider simultaneously, it can be improved the reflectivity of wiring board, thermal conductivity laying has the good capacity of heat transmission and low resistance, silica gel thermally conductive sheet and heat conductive insulating elastic rubber layer have the good capacity of heat transmission and high-grade voltage endurance capability, it is not damaged to can be good at protection circuit plate, high reflectance and energy-efficient demand are met simultaneously.
Description
Technical field
The present invention relates to wiring board technology field, specially a kind of high reflectance energy conservation double-face backlight wiring board.
Background technique
Wiring board is divided into single sided board, the three big classification of dual platen and multilayer circuit board, single side if dividing by the number of plies
Plate, on most basic PCB, part concentrates one side wherein, and conducting wire then concentrates on another side, because conducting wire is only present in it
Middle one side, so this PCB is just claimed to be called one-sided circuit board, single sided board is usually made simply, low cost, but a disadvantage is that can not
Applied on too complicated product；Dual platen is the extension of single sided board, cannot meet when needing of electronic product when single layer is routed,
Will use dual platen, it is two-sided have cover copper and have cabling, and the route between two layers can be connected by via hole, be allowed to
Network connection required for being formed；Multi-layer board refers to the conductive pattern layer with three layers or more with insulating materials therebetween to be separated by
Be laminated, and the printed board that conductive pattern interconnects as required therebetween, multilayer circuit board be electronic information technology at high speed, it is more
The product that function, large capacity, small size, slimming, lightweight direction are developed, wiring board are divided into soft board if dividing by characteristic,
Hardboard, Rigid Flex, there is reflectivity requirements to be not achieved in actual use for existing backlight wiring board, power consumption height etc.
The problems such as, so needing a kind of high reflectance energy conservation double-face backlight wiring board now to solve the above problems.
Summary of the invention
The purpose of the present invention is to provide a kind of high reflectance energy conservation double-face backlight wiring boards, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the invention provides the following technical scheme: a kind of high reflectance energy conservation double-face backlight route
Plate, including wiring board main body, the upper surface of the wiring board main body are compounded with high reflection layer, the lower surface of the wiring board main body
It is compounded with thermally conductive Withstand voltage layer, the lower surface of the thermally conductive Withstand voltage layer is equally also compounded with high reflection layer；
The high reflection layer includes glass layer, and the lower surface of the glass layer is compounded with mirror surface aluminum layer, the mirror
The lower surface of face aluminum layer is compounded with ABS plating aluminium film；
The thermally conductive Withstand voltage layer includes thermal conductivity laying, and the lower surface of the thermal conductivity laying is compound flexible thermally conductive
The lower surface of pad, the flexibility heat conductive pad is compounded with heat conductive insulating elastic rubber layer.
Preferably, the making material of the wiring board main body is copper or aluminium.
Preferably, the high reflection layer with a thickness of 30 microns -50 microns, the thermally conductive Withstand voltage layer it is micro- with a thickness of 20
- 60 microns of rice.
Preferably, the thermal conductivity laying by 80%-90% micron grade aluminum oxide, the nanoscale magnesium of 3%-5%,
The high thermal conductivity carbon dust of 3%-6% and the zinc oxide of 2%-5% mix.
Compared with prior art, the beneficial effects of the present invention are: the high reflectance energy conservation double-face backlight wiring board, passes through
Total reflectivity of mirror surface aluminum layer can reach 90%, and regular reflection rate can reach 80%, be capable of enhancement line plate entirety
Reflectivity, the reflection classification that aluminium film is electroplated by ABS is mirror-reflection, and average reflectance can reach 94%, while reflection wavelength
Range it is wider, can be improved the reflectivity of wiring board, have the good capacity of heat transmission and low electricity by thermal conductivity laying
Resistance, the flexibility that capacity of heat transmission and material itself have can be good at the requirement of fitting heat dissipation, by silica gel thermally conductive sheet and
Heat conductive insulating elastic rubber layer has the good capacity of heat transmission and high-grade voltage endurance capability, not only meets wanting for energy-saving consumption-reducing
It asks, and can be good at that protection circuit plate is not damaged, meet the needs used.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Fig. 2 is the structural schematic diagram of high reflection layer of the present invention；
Fig. 3 is the structural schematic diagram of the thermally conductive Withstand voltage layer of the present invention.
In figure: 1, wiring board main body, 2, high reflection layer, 21, glass layer, 22, mirror surface aluminum layer, 23, ABS Electroplating Aluminum
Film, 3, thermally conductive Withstand voltage layer, 31, thermal conductivity laying, 32, silica gel thermally conductive sheet, 33, heat conductive insulating elastic rubber layer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1 please refers to Fig. 1-3, and the present invention provides a kind of technical solution: a kind of high reflectance energy conservation double-face backlight
The making material of wiring board, including wiring board main body 1, wiring board main body 1 is copper or aluminium, and the upper surface of wiring board main body 1 is compound
There is high reflection layer 2, the lower surface of wiring board main body 1 is compounded with thermally conductive Withstand voltage layer 3, and the lower surface of thermally conductive Withstand voltage layer 3 is equally also multiple
Conjunction has a high reflection layer 2, high reflection layer 2 with a thickness of 50 microns, thermally conductive Withstand voltage layer 3 with a thickness of 45 microns, high reflection layer 2 includes
Glass layer 21, the lower surface of glass layer 21 are compounded with mirror surface aluminum layer 22, and the lower surface of mirror surface aluminum layer 22 is compound
Have ABS be electroplated aluminium film 23, thermally conductive Withstand voltage layer 3 include thermal conductivity laying 31, thermal conductivity laying 31 by 85% micron order
Aluminium oxide, 4% nanoscale magnesium, 6% high thermal conductivity carbon dust and 5% zinc oxide mix, thermal conductivity laying 31
The compound flexible heat conductive pad 32 in lower surface, the lower surface of flexible heat conductive pad 32 is compounded with heat conductive insulating elastic rubber layer 33.
Embodiment 2 please refers to Fig. 1-3, and the present invention provides a kind of technical solution: a kind of high reflectance energy conservation double-face backlight
Wiring board, a kind of high reflectance energy conservation double-face backlight wiring board, including wiring board main body 1, the making material of wiring board main body 1
For copper or aluminium, the upper surface of wiring board main body 1 is compounded with high reflection layer 2, and the lower surface of wiring board main body 1 is compounded with thermally conductive pressure resistance
Layer 3, the lower surface of thermally conductive Withstand voltage layer 3 are equally also compounded with high reflection layer 2, high reflection layer 2 with a thickness of 30 microns, thermally conductive pressure resistance
Layer 3 with a thickness of 60 microns, high reflection layer 2 includes glass layer 21, and the lower surface of glass layer 21 is compounded with specular aluminium
Plate layer 22, the lower surface of mirror surface aluminum layer 22 are compounded with ABS plating aluminium film 23, and thermally conductive Withstand voltage layer 3 includes thermal conductivity laying
31, thermal conductivity laying 31 by 88% micron grade aluminum oxide, 3% nanoscale magnesium, 5% high thermal conductivity carbon dust and 4%
Zinc oxide mixes, the compound flexible heat conductive pad 32 in the lower surface of thermal conductivity laying 31, the following table of flexible heat conductive pad 32
Face is compounded with heat conductive insulating elastic rubber layer 33.
In the description of the present invention, it is to be understood that, term " coaxial ", " bottom ", " one end ", " top ", " in
The orientation of the instructions such as portion ", " other end ", "upper", " side ", " top ", "inner", " front ", " center ", " both ends " or position are closed
System is merely for convenience of description of the present invention and simplification of the description to be based on the orientation or positional relationship shown in the drawings, rather than indicates
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation；While unless otherwise
Specific regulation and restriction, the terms such as term " clamping ", " axis connects ", " grafting ", " welding ", " compound " shall be understood in a broad sense, example
Such as, it may be a fixed connection, may be a detachable connection, or is integral；It can be mechanical connection, be also possible to be electrically connected；
It can be directly connected, the connection inside two elements or two elements can also be can be indirectly connected through an intermediary
Interaction relationship unless otherwise restricted clearly for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (4)
1. a kind of high reflectance energy conservation double-face backlight wiring board, including wiring board main body (1), it is characterised in that: the route
The upper surface of plate main body (1) is compounded with high reflection layer (2), and the lower surface of the wiring board main body (1) is compounded with thermally conductive Withstand voltage layer
(3), the lower surface of the thermally conductive Withstand voltage layer (3) is equally also compounded with high reflection layer (2)；
The high reflection layer (2) includes glass layer (21), and the lower surface of the glass layer (21) is compounded with specular aluminium
Plate layer (22), the lower surface of the mirror surface aluminum layer (22) are compounded with ABS plating aluminium film (23)；
The thermally conductive Withstand voltage layer (3) includes thermal conductivity laying (31), and the lower surface of the thermal conductivity laying (31) is multiple
It closes flexible heat conductive pad (32), the lower surface of thermally conductive Withstand voltage layer (3) described in the lower surface of the flexibility heat conductive pad (32) is equally
It is compounded with high reflection layer (2) and is compounded with heat conductive insulating elastic rubber layer (33).
2. a kind of high reflectance energy conservation double-face backlight wiring board according to claim 1, it is characterised in that: the route
The making material of plate main body (1) is copper or aluminium.
3. a kind of high reflectance energy conservation double-face backlight wiring board according to claim 1, it is characterised in that: described high anti-
Penetrate layer (2) with a thickness of 30 microns -50 microns, the thermally conductive Withstand voltage layer (3) with a thickness of 20 microns -60 microns.
4. a kind of high reflectance energy conservation double-face backlight wiring board according to claim 1, it is characterised in that: described thermally conductive
Conductive spacer layer (31) by 80%-90% micron grade aluminum oxide, the nanoscale magnesium of 3%-5%, the high thermal conductivity carbon dust of 3%-6% and
The zinc oxide of 2%-5% mixes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910011296.XA CN109511217A (en) | 2019-01-07 | 2019-01-07 | A kind of high reflectance energy conservation double-face backlight wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910011296.XA CN109511217A (en) | 2019-01-07 | 2019-01-07 | A kind of high reflectance energy conservation double-face backlight wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109511217A true CN109511217A (en) | 2019-03-22 |
Family
ID=65756282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910011296.XA Pending CN109511217A (en) | 2019-01-07 | 2019-01-07 | A kind of high reflectance energy conservation double-face backlight wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109511217A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63128616A (en) * | 1986-11-19 | 1988-06-01 | 東洋メタライジング株式会社 | Manufacture of metallized film |
| CN201670042U (en) * | 2010-05-13 | 2010-12-15 | 江阴标榜装饰材料有限公司 | Hammer texture aluminum-plastic compound board |
| CN101943373A (en) * | 2010-08-01 | 2011-01-12 | 苏州达信科技电子有限公司 | Reflecting board and back light module using same |
| CN102033406A (en) * | 2009-09-25 | 2011-04-27 | 李彦明 | High gain screen |
| CN202281174U (en) * | 2011-11-10 | 2012-06-20 | 东莞市新东方光电技术有限公司 | Reflecting sheet for LED backlight source |
| CN102590906A (en) * | 2012-02-29 | 2012-07-18 | 北京化工大学 | Polymer-based composite structure diffuse reflection material |
| CN203708639U (en) * | 2013-11-27 | 2014-07-09 | 淳华科技(昆山)有限公司 | Compression structure for flexible circuit board prepared by liquid crystal polymer polymeric materials |
| CN205082042U (en) * | 2015-05-15 | 2016-03-09 | 何忠亮 | Reflection of light heat -conducting metal base PCB board |
| CN205467745U (en) * | 2016-01-21 | 2016-08-17 | 深圳市捷创新材料有限公司 | Novel TV plastic uptake backplate of metal tectorial membrane effect |
| CN106034865A (en) * | 2016-06-05 | 2016-10-26 | 周三春 | Silver reflective plastic film bag, and processing method and application thereof |
| WO2017206366A1 (en) * | 2016-06-03 | 2017-12-07 | 深圳创维－Rgb电子有限公司 | Backlight module and display device |
| CN206948705U (en) * | 2017-04-27 | 2018-01-30 | 太仓市何氏电路板有限公司 | A kind of high reflectance energy-saving backlight source wiring board |
-
2019
- 2019-01-07 CN CN201910011296.XA patent/CN109511217A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63128616A (en) * | 1986-11-19 | 1988-06-01 | 東洋メタライジング株式会社 | Manufacture of metallized film |
| CN102033406A (en) * | 2009-09-25 | 2011-04-27 | 李彦明 | High gain screen |
| CN201670042U (en) * | 2010-05-13 | 2010-12-15 | 江阴标榜装饰材料有限公司 | Hammer texture aluminum-plastic compound board |
| CN101943373A (en) * | 2010-08-01 | 2011-01-12 | 苏州达信科技电子有限公司 | Reflecting board and back light module using same |
| CN202281174U (en) * | 2011-11-10 | 2012-06-20 | 东莞市新东方光电技术有限公司 | Reflecting sheet for LED backlight source |
| CN102590906A (en) * | 2012-02-29 | 2012-07-18 | 北京化工大学 | Polymer-based composite structure diffuse reflection material |
| CN203708639U (en) * | 2013-11-27 | 2014-07-09 | 淳华科技(昆山)有限公司 | Compression structure for flexible circuit board prepared by liquid crystal polymer polymeric materials |
| CN205082042U (en) * | 2015-05-15 | 2016-03-09 | 何忠亮 | Reflection of light heat -conducting metal base PCB board |
| CN205467745U (en) * | 2016-01-21 | 2016-08-17 | 深圳市捷创新材料有限公司 | Novel TV plastic uptake backplate of metal tectorial membrane effect |
| WO2017206366A1 (en) * | 2016-06-03 | 2017-12-07 | 深圳创维－Rgb电子有限公司 | Backlight module and display device |
| CN106034865A (en) * | 2016-06-05 | 2016-10-26 | 周三春 | Silver reflective plastic film bag, and processing method and application thereof |
| CN206948705U (en) * | 2017-04-27 | 2018-01-30 | 太仓市何氏电路板有限公司 | A kind of high reflectance energy-saving backlight source wiring board |
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