CN108156750A - A kind of flexible PCB and preparation method thereof - Google Patents
A kind of flexible PCB and preparation method thereof Download PDFInfo
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- CN108156750A CN108156750A CN201810026609.4A CN201810026609A CN108156750A CN 108156750 A CN108156750 A CN 108156750A CN 201810026609 A CN201810026609 A CN 201810026609A CN 108156750 A CN108156750 A CN 108156750A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- 239000010410 layer Substances 0.000 claims abstract description 183
- 239000000463 material Substances 0.000 claims abstract description 59
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 42
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 39
- 239000012790 adhesive layer Substances 0.000 claims abstract description 33
- 230000005540 biological transmission Effects 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 79
- 239000010949 copper Substances 0.000 claims description 66
- 229910052802 copper Inorganic materials 0.000 claims description 66
- 239000000872 buffer Substances 0.000 claims description 28
- 238000003490 calendering Methods 0.000 claims description 26
- 238000003475 lamination Methods 0.000 claims description 26
- 238000003825 pressing Methods 0.000 claims description 17
- 229910000831 Steel Inorganic materials 0.000 claims description 15
- 239000010959 steel Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 10
- 238000005728 strengthening Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 6
- 230000002787 reinforcement Effects 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000003111 delayed effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 16
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 17
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 16
- 230000008054 signal transmission Effects 0.000 description 12
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 9
- 239000004810 polytetrafluoroethylene Substances 0.000 description 9
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 9
- -1 Poly tetra fluoroethylene Polymers 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 241000446313 Lamella Species 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- 239000004809 Teflon Substances 0.000 description 6
- 229920006362 Teflon® Polymers 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 4
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
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- 238000005868 electrolysis reaction Methods 0.000 description 2
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- 230000003287 optical effect Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000000275 quality assurance Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
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- 241000208340 Araliaceae Species 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 239000006173 Good's buffer Substances 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
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- 229920002647 polyamide Polymers 0.000 description 1
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- 229920005989 resin Polymers 0.000 description 1
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- 238000010792 warming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention belongs to flexible PCB technical fields, provide a kind of flexible PCB and preparation method thereof, flexible PCB includes the first flexible PCB and at least one second flexible PCB, first flexible PCB includes sequentially connected first signals layer, the first medium layer made by liquid crystal polymer material and the ground plane for shielding interference signal, second flexible PCB includes sequentially connected second signal layer and the second dielectric layer made by liquid crystal polymer material, and second dielectric layer is connect with ground plane by adhesive layer；Due to liquid crystal polymer material, not only flexibility is good, it is suitable for making flexible PCB, and the dielectric loss factor of liquid crystal polymer material is relatively low, when signal is when the first signals layer and second signal layer transmit, the loss smaller of signal meets the transmission requirement of high-frequency signal；The medium layer method that liquid crystal polymer material makes flexible PCB is simple, and product quality is stablized, and can improve the reliability of product.
Description
Technical field
The invention belongs to flexible PCB technical fields, are to be related to a kind of flexible PCB and its making more specifically
Method.
Background technology
Flexible printed circuit board (Flexible Printed Circuit Board, be abbreviated as FPC) is also known as flexible electrical
Road plate or flexible electric circuit board, be one kind using mylar or polyimides as base material, by be etched on copper foil formed circuit and
The manufactured printed circuit with height reliability, excellent flexibility.Flexible PCB has many rigid printed circuit boards not
The advantages of having, such as it can require arbitrary arrangement, and in three-dimensional space with free bend, winding, folding according to space layout
Between arbitrarily move and flexible, so as to reach the integration that components and parts assembling is connected with conducting wire.Electronics can be substantially reduced using FPC to produce
The volume of product is applicable in the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC is in space flight, army
Widely should it be obtained on the fields such as thing, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or electronic product
With.
The material of existing flexible PCB is usually based on polyimides (Polyimide, abbreviation PI), but polyamides is sub-
The water absorption rate of amine material is too big (2%), therefore the dielectric loss factor of its dielectric constant is relatively also larger (for 0.01), is carrying out
Its transmission loss is larger during high frequency signal transmission, therefore is not suitable for carrying out high frequency signal transmission.In resin material, polytetrafluoroethyl-ne
The dielectric constant (￡=2.55) of alkene (Poly tetra fluoroethylene, be abbreviated as PTFE) material and dielectric loss because
Sub (0.002) is smaller, is suitble to do the circuit board material for high frequency signal transmission, but polytetrafluoroethylene (PTFE) does not have preferable bending resistance
Folding endurance, therefore be not suitable for making flexible PCB.
More than it is insufficient, have much room for improvement.
Invention content
The purpose of the present invention is to provide a kind of flexible PCB, to solve polyimide material in the prior art
The technical issues of flexible PCB is not suitable for carrying out high frequency signal transmission.
To achieve the above object, the technical solution adopted by the present invention is：A kind of flexible PCB is provided, including the first flexibility
Circuit board and at least one second flexible PCB；
First flexible PCB includes sequentially connected the first signals layer for being used for transmission signal, by liquid crystal polymer
The first medium layer that material makes and the ground plane for shielding interference signal；
Second flexible PCB includes the sequentially connected second signal layer for being used for transmission signal and by polymerizable mesogenic
The second dielectric layer that object material makes；
The second dielectric layer is connect with the ground plane by adhesive layer.
Further, the adhesive layer is liquid crystalline polymer layer.
Further, the dielectric loss factor of the first medium layer is 0.0018~0.004；
The dielectric loss factor of the second dielectric layer is 0.0018~0.004；
The dielectric loss factor of the adhesive layer is 0.0018~0.004.
Further, first signals layer includes the first signal wire made of calendering copper and electro-coppering；
The second signal layer includes the second signal line made of calendering copper and electro-coppering；
The ground plane includes the ground signal line made of calendering copper.
Further, the flexible PCB further includes the strengthening course for improving integral strength, the strengthening course, described
First signals layer, the first medium layer and the ground plane are sequentially connected.
A kind of advantageous effect of flexible PCB provided by the invention is：Since first medium layer and second dielectric layer are equal
It being made by liquid crystal polymer material, not only flexibility is good for liquid crystal polymer material, is suitable for making flexible PCB, and
And the dielectric loss factor of liquid crystal polymer material is relatively low, and when signal is in the first signals layer and the transmission of second signal layer, signal
Loss smaller, meet the transmission requirement of high-frequency signal；Liquid crystal polymer material makes the dielectric layer side of flexible PCB simultaneously
Method is simple, and product quality is stablized, so as to effectively improve the reliability of product.
The present invention also aims to provide a kind of flexible circuit board manufacturing method, including：
Ground signal line is made, specially：The ground plane of first flexible PCB according to default pattern is etched, is obtained
Obtain the ground signal line；
First flexible PCB and the second flexible PCB are pressed, specially：First flexible PCB, bonding
Layer, second flexible PCB pressed by hot press so that the ground plane of first flexible PCB, adhesive layer and
The second dielectric layer of second flexible PCB is sequentially connected, and obtains flexible circuit boards half-finished product；
Drilling, specially：After first flexible PCB and second flexible PCB are mutually bonded, according to pre-
If pattern drilling obtains via hole；
Plating, specially：By the via hole, the first signals layer of first flexible PCB and second flexibility
The second signal layer of circuit board is electroplated so that the via hole, first signals layer and the second signal layer are equal
Equipped with electrolysis layers of copper；
Etching, specially：First signals layer according to default pattern is etched, obtains the first signal wire；By institute
It states second signal layer to be etched according to default pattern, obtains second signal line.
Further, it is described to include the first flexible PCB and the second flexible PCB adhesion step：
Prefabricating plate prepares, specially：First flexible PCB, adhesive layer, the second flexible PCB are stacked successively, formed
The prefabricating plate；
Pre- lamination prepares, specially：By the first high-temperature buffer pad, the first steel plate, first buffer layer, the prefabricating plate,
Two buffer layers, the second steel plate and the second high-temperature buffer pad stack successively, form the pre- lamination；
Pressing, specially：The pre- lamination is placed on the load plate of hot press, according to parameter preset to the pre- lamination
Perform pressing program.
Further, the parameter preset includes：
Pressure is made to increase to 4MPa within 25 minutes, and keep 4MPa pressure 5 minutes；
Then pressure drops to 1.5MPa；
It is 315 DEG C to press maximum temperature, and pressing time is 40 minutes under maximum temperature；
Overall pressing time 220 minutes.
Further, it is further included before the prefabricating plate preparation process：
Brown, specially：To calendering copper, the calendering copper of ground plane and the calendering copper of second signal layer of the first signals layer
Carry out copper face roughening.
Further, it is further included after the etching step：
Lamination reinforcement layer, specially：In the first signal layer surface lamination reinforcement layer.
A kind of advantageous effect of flexible circuit board manufacturing method provided by the invention is：Due to first medium layer and second
Dielectric layer is made by liquid crystal polymer material, and not only flexibility is good for liquid crystal polymer material, is suitable for making flexible
Circuit board, and the dielectric loss factor of liquid crystal polymer material is relatively low, when signal is passed in the first signals layer and second signal layer
When defeated, the loss smaller of signal meets the transmission requirement of high-frequency signal；Production method provided in this embodiment is obtained simultaneously
Product quality is stablized, so as to effectively improve the reliability of product.
Description of the drawings
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description be only the present invention some
Embodiment, for those of ordinary skill in the art, without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the structure diagram of flexible PCB provided in an embodiment of the present invention；
Fig. 2 is the structure diagram of the prefabricating plate of flexible PCB provided in an embodiment of the present invention；
Fig. 3 is the structure diagram one of the pre- lamination of flexible PCB provided in an embodiment of the present invention；
Fig. 4 is the structure diagram two of the pre- lamination of flexible PCB provided in an embodiment of the present invention；
Fig. 5 is structure diagram of the pre- lamination of flexible PCB provided in an embodiment of the present invention in bonding processes；
Fig. 6 is the production process figure one of flexible PCB provided in an embodiment of the present invention；
Fig. 7 is the production process figure two of flexible PCB provided in an embodiment of the present invention；
Fig. 8 is by the first flexible PCB and the second flexible circuit board compression moulding in flexible PCB provided in an embodiment of the present invention
The flow chart one of conjunction；
Fig. 9 is by the first flexible PCB and the second flexible circuit board compression moulding in flexible PCB provided in an embodiment of the present invention
The flowchart 2 of conjunction.
Wherein, each reference numeral in figure：
1- flexible PCBs；The first flexible PCBs of 11-；
110- strengthening courses；The first signals layers of 111-；
112- first medium layers；113- ground planes；
The second flexible PCBs of 12-；121- second signal layers；
122- second dielectric layer；13- adhesive layers；
200- prefabricating plates；The pre- laminations of 20-；
201- the first high-temperature buffer pads；The first steel plates of 202-；
203- first buffer layers；204- second buffer layers；
The second steel plates of 205-；206- the second high-temperature buffer pads；
First buffer layer among 207-；208- middle steel plates；
Second buffer layer among 209-；
30- load plates；31- cover boards.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
It should be noted that when element is referred to as " being set to " another element, it can be directly on another element
Or it is connected on another element.When an element is known as " being connected to " another element, it can directly be connected
It is connected to another element or is indirectly connected on another element.In addition, term " first ", " second " are only used for description mesh
, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.It limits as a result,
Surely there is " first ", one or more this feature can be expressed or be implicitly included to the feature of " second ".The present invention's
In description, " multiple " are meant that two or more, unless otherwise specifically defined.
Referring to Fig. 1, a kind of flexible PCB 1, including sequentially connected first flexible PCB 11 and at least one
Two flexible PCBs 12；First flexible PCB 11 includes sequentially connected the first signals layer 111 for being used for transmission signal, by liquid
The first medium layer 112 that crystalline polymer material makes and the ground plane 113 for shielding interference signal；Second flexible PCB 12
Including the sequentially connected second signal layer 121 for being used for transmission signal and the second dielectric layer made by liquid crystal polymer material
122；Second dielectric layer 122 is connect with ground plane 113 by adhesive layer 13.
Specifically, when the number of the second flexible PCB 12 be one when, then the first flexible PCB 11, adhesive layer 13 with
And second flexible PCB 12 be sequentially connected, form three layers of flexible PCB；When the number of the second flexible PCB 12 is multiple
When, then two neighboring second flexible PCB 12 connects (the second of i.e. previous second flexible PCB 12 by adhesive layer 13
Dielectric layer 122 is connect with the second signal layer 121 of the second flexible PCB of the latter 12 by adhesive layer), the first flexible circuit
The ground plane 113 of plate 11 is connect with the second dielectric layer 122 of the second adjacent flexible PCB 12 by adhesive layer 13, is formed more
Layer flexible PCB.
Since dielectric loss factor is lower, then loss of the signal in transmission process is fewer, is more advantageous to the transmission of signal,
And the dielectric loss factor of the dielectric constant of liquid crystal polymer material (Liquid Crystal Polymer are abbreviated as LCP) compared with
It is low, therefore be suitable for carrying out high frequency signal transmission.And the bending resistance of liquid crystal polymer material is also preferable, thus be suitable for
In flexible PCB.
The advantageous effect set in this way is：Since first medium layer 112 and second dielectric layer 122 are by liquid crystal polymer
Material is made, and not only flexibility is good for liquid crystal polymer material, is suitable for making flexible PCB, and liquid crystal polymer
The dielectric loss factor of material is relatively low, when signal is in the first signals layer 111 and the transmission of second signal layer 121, the loss of signal
Smaller meets the transmission requirement of high-frequency signal；The medium layer method of the flexible PCB of liquid crystal polymer material making simultaneously is simple,
Product quality is stablized, so as to effectively improve the reliability of product.
Further, adhesive layer 13 is liquid crystalline polymer layer, i.e. adhesive layer 13 is made of liquid crystal polymer material, so as to
To be further ensured that loss of the signal in transmission process is smaller, meet the transmission requirement of high-frequency signal.Specifically, due to second
Dielectric layer 122 is connect with ground plane 113 by adhesive layer 13, and using epoxy resin as binding material when can not meet high frequency letter
Number transmission requirement, and use liquid crystal polymer material make adhesive layer 13, maintain first medium layer 112, adhesive layer 13 with
And the consistency of 122 material of second dielectric layer, so as to ensure that the unification of dielectric constant and dielectric loss, signals transmission
In loss it is smaller, be conducive to high-frequency signal stablize transmission.
Further, the dielectric loss factor of first medium layer 113 is 0.0018~0.004, Jie of second dielectric layer 122
Matter fissipation factor is 0.0018~0.004, and the dielectric loss factor of adhesive layer 13 is 0.0018~0.004, therefore gathered by liquid crystal
The dielectric loss factor of first medium layer 113, second dielectric layer 122 and adhesive layer 13 made of object material is closed far below tradition
Polyimide material dielectric loss factor, it is and close with the dielectric loss factor of polytetrafluoroethylene material, so as to meet height
The requirement of frequency signal transmission.
Preferably, the dielectric loss factor of first medium layer 113 is 0.0018, the dielectric loss of second dielectric layer 122 because
Son is 0.0018, and the dielectric loss factor of adhesive layer 13 is 0.0018.Since dielectric loss factor is lower, then signals transmission
In loss it is smaller, therefore when the dielectric loss factor of first medium layer 113, second dielectric layer 122 and adhesive layer 13 is
When 0.0018, the loss of signals transmission is smaller, and then is more conducive to the transmission of high-frequency signal.
Further, the first signals layer 111 includes the first signal wire made of calendering copper and electro-coppering, second signal layer
121 include the second signal line made of calendering copper and cathode copper, and ground plane 113 includes the ground signalling made of calendering copper
Line.
Specifically, calendering copper be that copper foil is obtained by the method for extruding, have the characteristics that press-stretched it is good with it is resistant to bending spend it is good,
But its electric conductivity will be weaker than cathode copper；Cathode copper is obtained by electro-plating method, has better electric conductivity；And cathode copper
With copper microcrystallization structure, vertical line edge is readily formed in etching, is especially advantageous for the making of fine wire, separately
Outside since crystalline arrangement itself is neat, it is more smooth to form the surface formed after coating and final surface treatment.The one of cathode copper
Planting production method is：Slab is made as anode in advance in blister copper (copper content 99%), fine copper, which is laminated, makees cathode, with sulfuric acid
(H2SO4) and copper sulphate (CuSO4) mixed liquor as electrolyte.After energization, copper is moved from anodic solution into copper ion to cathode
It is dynamic, it will obtain electronics after reaching cathode and fine copper (also known as cathode copper) is precipitated at cathode, quality is high.
In the present embodiment, cathode copper is to be obtained on the surface of calendering copper by electric plating method.Due to the first signal
Cathode copper is equipped in layer 111 and second signal layer 121, cathode copper has better electric conductivity, therefore is more advantageous to high frequency
The transmission of signal.
In the present embodiment, the residual copper ratio in the first signals layer 111 is 30% or so.First signal wire is by etching away
What the layers of copper in the first signals layer 111 was obtained (including calendering copper and cathode copper), the copper stayed in the first signals layer 111 accounts for erosion
The ratio of layers of copper is residual copper ratio before quarter.It is used as signal transmission substantially through the first signal wire that overetch is obtained.Second signal
Residual copper ratio in layer 121 is more than 60%.Second signal line is by etching away the layers of copper in second signal layer 121 (including pressure
Prolong copper) it is obtained, the ratio that the copper stayed in second signal layer 121 accounts for layers of copper before etching is residual copper ratio.Through overetch institute
The second signal line obtained is also referred to as grounded big copper face, for shielding interference signal, so as to be conducive to the first signals layer 111 and second
Signal transmission in signals layer 121.
Preferably, the calendering copper thickness of the calendering copper of the first signal wire is 9 microns, and the plating copper thickness of the first signal wire is
25 microns；The calendering copper thickness of second signal line is 9 microns, and the plating copper thickness of second signal line is 25 microns；Ground signalling
The calendering copper thickness of line is 9 microns, is more conducive to the transmission of high-frequency signal.
Further, flexible PCB 1 further includes the strengthening course 110 for improving integral strength, strengthening course 110, first
Signals layer 111, first medium layer 112 and ground plane 113 are sequentially connected.Preferably, strengthening course 110 is epoxy resin board, is had
Higher mechanical strength and preferable electric property.Strengthening course 110 is set, is conducive to improve the integral strength of flexible PCB 1.
Referring to Fig. 6, the purpose of the present embodiment, which also resides in, provides a kind of flexible circuit board manufacturing method, including：
Step S10：Ground signal line is made, specially：By the ground plane 113 of the first flexible PCB 11 according to default figure
Sample is etched, and obtains ground signal line；
Step S20：First flexible PCB and the second flexible PCB are pressed, specially：First flexible PCB 11,
Adhesive layer 13, the second flexible PCB 12 are pressed by hot press so that the ground plane 113 of the first flexible PCB 11 bonds
The second dielectric layer 122 of 13 and second flexible PCB 12 of layer is sequentially connected；
Step S30：Drilling, specially：After the first flexible PCB 11 and the mutually bonding of the second flexible PCB 12, press
It drills according to default pattern and obtains via hole；
Step S40：Plating, specially：First signals layer 111 and second of via hole, the first flexible PCB 11 is soft
Property circuit board 12 second signal layer 122 be electroplated so that via hole, the first signals layer 111 and second signal layer 122 are equal
Equipped with electrolysis layers of copper；
Step S50：Etching, specially：First signals layer 111 according to default pattern is etched, obtains the first signal
Line；Second signal layer 122 according to default pattern is etched, obtains second signal line.
In the present embodiment, the first flexible PCB 11 in step S10 and step S20 and the second flexible PCB 12 are equal
It is made using the flexible PCB of double-sided copper-clad as raw material, before not being electroplated, the layers of copper of covering is calendering copper,
The thickness for rolling copper is 9 microns.Specifically, when making the first flexible PCB 11, to the flexible PCB of double-sided copper-clad
One side be etched according to default pattern, and the residual copper ratio for the layers of copper being etched be 60%, so as to obtain ground plane 113,
The first flexible PCB 11 made includes sequentially connected first signals layer 111 (being not etched layers of copper), first medium layer
112 and ground plane 113 (layers of copper being etched)；When making the second flexible PCB 12, to the flexible circuit of double-sided copper-clad
The one side of plate is etched according to default pattern so that the layers of copper is removed completely, is left behind dielectric layer and is not etched
Layers of copper, so as to obtain the second flexible PCB 12, the second flexible PCB 12 of making includes sequentially connected second signal layer
121 (being not etched layers of copper) and second dielectric layer 122.Preferably, first medium layer 112 and second dielectric layer 122 by
Liquid crystal polymer material is made, thus relatively low with relatively low dielectric loss factor, when signal is in the first signals layer 111 and second
When signals layer 121 transmits, the loss smaller of signal meets the transmission requirement of high-frequency signal.
A kind of advantageous effect of flexible circuit board manufacturing method provided in this embodiment is：Due to first medium layer 112
It being made with second dielectric layer 122 by liquid crystal polymer material, the dielectric loss factor of liquid crystal polymer material is relatively low, when
For signal when the first signals layer 111 and second signal layer 121 transmit, the loss smaller of signal, the transmission for meeting high-frequency signal will
It asks；The product quality that production method provided in this embodiment is obtained simultaneously is stablized, so as to effectively improve the reliable of product
Property.
Referring to Fig. 7, it further, before step S10, further includes：
Step S01：Flexible circuit board design, specially：Flexible PCB is designed according to signal transmission demand, together
When design the pattern of the first signals layer 111, ground plane 113 and second signal layer 122.
Further, in step slo, the ground plane 113 of the first flexible PCB 11 is lost according to default pattern
The step of quarter, includes：
Dry film after softening is adhering closely on copper face by pad pasting by heat pressure roller；
Exposure is met the characteristic of photopolymerization using dry film, dry film is irradiated by ultraviolet light, thus will be on egative film
Default pattern is transferred on dry film；
Development will be fallen so that the copper being etched is needed to expose without the dry film development polymerizeing；
Etching, the copper after will developing etch away；
It goes to touch, the dry film that will polymerize removes so that entire copper face is exposed, so as to obtain through overetched copper face.
After being etched, it is also necessary to optical check is carried out, using ordinary ray or laser light coupled computer program,
The visual inspection of appearance is carried out to circuit plate face, to replace the optical device of Manual Visual Inspection.
Fig. 2, Fig. 3 and Fig. 8 are please referred to, further, the first flexible PCB 11 and the second flexible PCB in step S20
12 pressings include：
Step S201：Prefabricating plate prepares, specially：By the first flexible PCB 11, adhesive layer 13, the second flexible PCB
12 stack successively, form prefabricating plate 200；
Step S202：Pre- lamination prepares, specially：By the first high-temperature buffer pad 201, the first steel plate 202, first buffer layer
203rd, prefabricating plate 200, second buffer layer 204, the second steel plate 205 and the second high-temperature buffer pad 206 stack successively, are formed pre- folded
Plate 20；
Step S203：Pressing, specially：Pre- lamination 20 is placed on the load plate 30 of hot press, according to parameter preset pair
Pre- lamination 20 performs pressing program.
Referring to Fig. 2, in step s 201, by the first flexible PCB 11, adhesive layer 13, the second flexible PCB 12 according to
It is secondary when stacking so that the ground plane 113 of the first flexible PCB 11, the second of 13 and second flexible PCB 12 of adhesive layer are situated between
Matter layer 122 contacts successively.And adhesive layer 13 is made of liquid crystal polymer material, so as to first medium layer 112, adhesive layer 13 and the
Second medium layer 122 is made of liquid crystal polymer material, ensure that the unification of dielectric constant and dielectric loss, signal transmission mistake
Loss in journey is smaller, and be conducive to high-frequency signal stablizes transmission.
In step S202, since the pressing-in temp of liquid crystal polymer material is up to 305 DEG C, and traditional padded coaming without
Method bears such high temperature, and the material of traditional separated type material is usually polyethylene (PE) or polyethylene terephthalate (PET), this
Class material typically up to heatproof also only has 170 DEG C or so, and when temperature is higher than this temperature, material can deform, and then can shadow
Buffering effect is rung, therefore traditional padded coaming and separated type material are not suitable for making in the bonding processes of liquid crystal polymer material
With.
In the present embodiment, the first high-temperature buffer pad 201 can 305 DEG C of high temperature resistant or more, thickness is preferably 1.6mm, is had
Excellent high temperature resistance and cushion performance can play good cushioning effect in bonding processes；Second high-temperature buffer pad 206
Can 305 DEG C of high temperature resistant or more, thickness is preferably 1.6mm, has excellent high temperature resistance and cushion performance, can be in bonding processes
In play good cushioning effect.First buffer layer 203 be Teflon lamella, i.e., material be polytetrafluoroethylene (PTFE), Teflon lamella
Thickness be 0.25 millimeter~0.8 millimeter.Teflon lamella has high temperature resistant (temperature is more than 305 DEG C) performance, at long-time
It will not deform under hot environment, weight will not be reduced, therefore with good buffering effect；Second buffer layer
204 be Teflon lamella, i.e., material is polytetrafluoroethylene (PTFE), and the thickness of Teflon lamella is 0.25 millimeter~0.8 millimeter.Teflon
Lamella has high temperature resistant (temperature is more than 305 DEG C) performance, and long-time, which is under hot environment, to deform, weight
It will not reduce, therefore with good buffering effect.First steel plate 202 and the second steel plate 205 are normal flexible circuit board pressure
Steel plate is shared, utilizes ready-made accessory, not only convenient material drawing, but also cheap.
In step S202, the quantity of prefabricating plate 200 can be set as needed in pre- lamination 20, be not limited in
Above-mentioned one.
Referring to Fig. 4, in one embodiment, pre- lamination 20 includes two prefabricating plates 200, the concrete structure of pre- lamination 20
For：By the first high-temperature buffer pad 201, the first steel plate 202, first buffer layer 203, prefabricating plate 200, intermediate first buffer layer 207,
Middle steel plate 208, intermediate second buffer layer 209, prefabricating plate 200, second buffer layer 204, the second steel plate 205 and the second high temperature
Cushion pad 206 stacks successively.So as to press two prefabricating plates 200 simultaneously during pressing, working efficiency is improved.
In one embodiment, pre- lamination 20 includes more than two prefabricating plates 200, stacks rule and can refer to including two
The situation of a prefabricating plate 200 is stacked, and so as to press multiple prefabricating plates 200 simultaneously during pressing, improves work
Make efficiency.
In step S203, due to harmomegathus control, filler and stripping of the liquid crystal polymer material in bonding processes by force
Degree etc. is differed with traditional epoxy resin or polyimide material；When the pressure of pressing is excessive, lasting warming high-pressure will
So that liquid crystal polymer material softening, causes gummosis excessive, the thickness in turn resulting in liquid crystal polymer material layer is uneven, cause by
The first medium layer 112 and second dielectric layer 122 that liquid crystal polymer material makes are partially thin.Therefore the ginseng in traditional bonding processes
Number is not appropriate for liquid crystal polymer material.
Referring to Fig. 5, further, in step S203, pre- lamination 20 is placed on the load plate 30 of hot press so that the
Two high-temperature buffer pads 206 are contacted with load plate 30, close the press doors of hot press, during pressing, the cover board 31 of hot press
It is contacted with the first high-temperature buffer pad 201.The parameter preset of pressing program includes：
Pressure is made to increase to 4MPa, and keeps 4MPa pressure 5 minutes within (1) 25 minute, then pressure drops to 1.5MPa, so as to
It can ensure that bubble is fully discharged in bonding processes, good buffer effect, while peel strength, filler and pressing harmomegathus control
Also it can be well controlled, while the planarization of flexible circuit board is more preferable.
(2) pressing maximum temperature is 315 DEG C, and pressing time is 40 minutes under maximum temperature；Overall pressing time 220 minutes
(including warming-up section, highest temperature soaking time and temperature descending section), thereby may be ensured that press very well.
Referring to Fig. 9, it further, is further included before step S201：
Step S200：Brown, specially：The calendering copper and the of calendering copper, ground plane 113 to the first signals layer 111
The calendering copper of binary signal layer 121 carries out copper face roughening, so as to ensure in subsequent step between layers of copper and liquid crystal polymer material (i.e.
Between first signals layer 111 and first medium layer 112, between first medium layer 112 and ground plane 113, ground plane 113 with bond
Between layer 13, between second dielectric layer 122 and second signal layer 121) there is enough binding forces, ensure that pressing is good.
Further, it is further included between step S20 and step S30：
Cutting edge and target practice, specially：The prefabricating plate 200 pressed from hot press is taken out, then carry out cutting edge and is beaten
Target refers to going out boring location hole by machine, is convenient for subsequent drill process wherein practicing shooting.
Referring to Fig. 7, it further, is further included after step S50：
Step S60：Lamination reinforcement layer, specially：In 111 surface lamination reinforcement layer 110 of the first signals layer.Preferably, it mends
Strong layer 110 is epoxy resin board, has higher mechanical strength and preferable electric property.Strengthening course 110 is set, is conducive to carry
The intensity of high first flexible PCB 11, and then be conducive to improve the integral strength of flexible PCB 1.
Further, further included after step S60 profile measurement, electric measurement, FQC (Final Quality Control,
That is final quality control) verification, FQA (Factory Quality Assurance, i.e. Plant quality assurance) verifications and packaging
Deng until final shipment.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of flexible PCB, it is characterised in that：Including the first flexible PCB and at least one second flexible PCB；
First flexible PCB includes sequentially connected the first signals layer for being used for transmission signal, by liquid crystal polymer material
The first medium layer of making and the ground plane for shielding interference signal；
Second flexible PCB includes the sequentially connected second signal layer for being used for transmission signal and by liquid crystal polymer material
Expect the second dielectric layer made；
The second dielectric layer is connect with the ground plane by adhesive layer.
2. flexible PCB as described in claim 1, it is characterised in that：The adhesive layer is liquid crystalline polymer layer.
3. flexible PCB as claimed in claim 2, it is characterised in that：
The dielectric loss factor of the first medium layer is 0.0018~0.004；
The dielectric loss factor of the second dielectric layer is 0.0018~0.004；
The dielectric loss factor of the adhesive layer is 0.0018~0.004.
4. flexible PCB as described in claim 1, it is characterised in that：
First signals layer includes the first signal wire made of calendering copper and electro-coppering；
The second signal layer includes the second signal line made of calendering copper and electro-coppering；
The ground plane includes the ground signal line made of calendering copper.
5. such as Claims 1 to 4 any one of them flexible PCB, it is characterised in that：The flexible PCB further includes use
In improve integral strength strengthening course, the strengthening course, first signals layer, the first medium layer and the ground plane according to
Secondary connection.
6. a kind of flexible circuit board manufacturing method, it is characterised in that：Including
Ground signal line is made, specially：The ground plane of first flexible PCB according to default pattern is etched, obtains institute
State ground signal line；
First flexible PCB and the second flexible PCB are pressed, specially：First flexible PCB, adhesive layer, institute
It states the second flexible PCB to press by hot press so that the ground plane of first flexible PCB, adhesive layer and described
The second dielectric layer of second flexible PCB is sequentially connected, and obtains flexible circuit boards half-finished product；
Drilling, specially：After first flexible PCB and second flexible PCB are mutually bonded, according to default figure
Sample drilling obtains via hole；
Plating, specially：By the via hole, the first signals layer of first flexible PCB and second flexible circuit
The second signal layer of plate is electroplated so that the via hole, first signals layer and the second signal layer are equipped with
It is electrolysed layers of copper；
Etching, specially：First signals layer according to default pattern is etched, obtains the first signal wire；By described
Binary signal layer is etched according to default pattern, obtains second signal line.
7. flexible circuit board manufacturing method as claimed in claim 6, it is characterised in that：It is described by the first flexible PCB and
Two flexible PCB adhesion steps include：
Prefabricating plate prepares, specially：First flexible PCB, adhesive layer, the second flexible PCB are stacked successively, described in formation
Prefabricating plate；
Pre- lamination prepares, specially：First high-temperature buffer pad, the first steel plate, first buffer layer, the prefabricating plate, second are delayed
It rushes layer, the second steel plate and the second high-temperature buffer pad to stack successively, forms the pre- lamination；
Pressing, specially：The pre- lamination is placed on the load plate of hot press, the pre- lamination is performed according to parameter preset
Press program.
8. flexible circuit board manufacturing method as claimed in claim 7, it is characterised in that：The parameter preset includes：
Pressure is made to increase to 4MPa within 25 minutes, and keep 4MPa pressure 5 minutes；
Then pressure drops to 1.5MPa；
It is 315 DEG C to press maximum temperature, and pressing time is 40 minutes under maximum temperature；
Overall pressing time 220 minutes.
9. flexible circuit board manufacturing method as claimed in claim 7, it is characterised in that：It is also wrapped before the prefabricating plate preparation process
It includes：
Brown, specially：The calendering copper, the calendering copper of ground plane and the calendering copper of second signal layer of first signals layer are carried out
Copper face is roughened.
10. such as claim 6~9 any one of them flexible circuit board manufacturing method, it is characterised in that：After the etching step
It further includes：
Lamination reinforcement layer, specially：In the first signal layer surface lamination reinforcement layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810026609.4A CN108156750A (en) | 2018-01-11 | 2018-01-11 | A kind of flexible PCB and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810026609.4A CN108156750A (en) | 2018-01-11 | 2018-01-11 | A kind of flexible PCB and preparation method thereof |
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| CN110149757A (en) * | 2019-05-30 | 2019-08-20 | 苏州福莱盈电子有限公司 | A kind of high frequency circuit board and preparation method thereof |
| CN111537863A (en) * | 2020-05-12 | 2020-08-14 | 深圳中富电路股份有限公司 | PCB signal loss calculation method based on flow adhesive stacking |
| WO2021035914A1 (en) * | 2019-08-23 | 2021-03-04 | 李龙凯 | Manufacturing method for multi-layer flexible circuit board, and product thereof |
| CN112770543A (en) * | 2020-12-10 | 2021-05-07 | 安捷利（番禺）电子实业有限公司 | Preparation method of FPC board |
| WO2021237772A1 (en) * | 2020-05-28 | 2021-12-02 | 瑞声声学科技(深圳)有限公司 | Circuit board, transmission line and electronic device |
| CN113823447A (en) * | 2021-09-24 | 2021-12-21 | 惠州Tcl移动通信有限公司 | Radio frequency transmission line and foldable terminal device |
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