CN110149757A - A kind of high frequency circuit board and preparation method thereof - Google Patents
A kind of high frequency circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN110149757A CN110149757A CN201910461079.0A CN201910461079A CN110149757A CN 110149757 A CN110149757 A CN 110149757A CN 201910461079 A CN201910461079 A CN 201910461079A CN 110149757 A CN110149757 A CN 110149757A
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- Prior art keywords
- signal
- layer
- circuit board
- high frequency
- frequency circuit
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- 238000002360 preparation method Methods 0.000 title abstract description 5
- 239000010410 layer Substances 0.000 claims abstract description 75
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 239000012528 membrane Substances 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 11
- 239000000428 dust Substances 0.000 claims abstract description 9
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052737 gold Inorganic materials 0.000 claims abstract description 6
- 239000010931 gold Substances 0.000 claims abstract description 6
- 239000004814 polyurethane Substances 0.000 claims abstract description 5
- 229920002635 polyurethane Polymers 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 238000010030 laminating Methods 0.000 claims description 6
- 230000002787 reinforcement Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
- 238000005488 sandblasting Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 9
- 230000008054 signal transmission Effects 0.000 abstract description 5
- 229920001577 copolymer Polymers 0.000 abstract description 2
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001657258 Pachycare flavogriseum Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of high frequency circuit board provided by the invention and preparation method thereof, including generate high-frequency signal signal line layer and above and below signal line layer two sides two ground planes, adhesive layer is fitted between the signal line layer and described two ground planes, the outside of described two ground planes is successively arranged signal coating and insulating layer；The signal line layer and the ground plane include the signal transmitting layer made of LCP material, and the adhesive layer is made of liquid crystal polyurethane membrane material.Chemical cleaning is carried out by first radium-shine cutting again in the production process, the then processes such as progress gold, reduce the process flow for wiping carbon dust, it improves efficiency, signal line layer and ground plane all use polymeric liquid crystal copolymer material in high frequency circuit board provided by the invention, increase its signal transmission effect again while promoting wiring board utilization rate.
Description
Technical field
The present invention relates to wiring board arts, and in particular to a kind of high frequency circuit board and preparation method thereof.
Background technique
LCP (polymeric liquid crystal copolymer) soft board has better flex capability, can be into compared to PI (polyimides) soft board
One step improves space utilization rate.At present LCP be mainly used in high-frequency circuit board, COF substrate, multi-layer board, IC package, u-BGA,
The fields such as high frequency connectors, antenna, loudspeaker substrate.With the rise of high-frequency high-speed application trend, LCP, which will substitute PI, becomes new
Soft board technique.
Flexible electronic can be further lightening using smaller crooked process radius, therefore is also miniaturization to flexible pursue
It embodies.Being greater than with resistance variations 10% is judgment basis, and under same experiment condition, LCP soft board can be with compared to traditional PI soft board
The more bending numbers of tolerance and smaller crooked process radius, therefore LCP soft board has better flex capability and product reliability.
Excellent flex capability allows the free design shape of LCP soft board, so that the small space in smart phone is made full use of, into one
Step improves space efficiency utilization, and for the soft board line across battery, LCP soft board perfect can be bonded, and traditional PI soft board
It can not preferably be bonded battery surface under the influence of spring-back effect, cause space waste.
The variation tendency of smart phone at present are as follows:
(1) comprehensive screen, which is not intended to mobile phone, more motherboard spaces, although mobile phone length and width become larger, thickness continues to decline.
(2) the integrated functional unit of smart phone is more and more, such as sensor and camera etc., has tied up valuable sky
Between.
(3) more screen sizes and more multifunctional module sharply increase the consumption of electricity, and cell density is usually annual
Only increase by 10%, increased electrical energy demands keep battery volume increasing.
It is above 3 points variation as a result, although smart phone is added into more radio-frequency enableds, the space of antenna
But it remains unchanged, or even is compressed.Therefore, demand of the smart phone manufacturer to high integration antenna modules is also more more and more intense,
Its signal transmission effect is increased while needing to be promoted wiring board utilization rate again, LCP becomes new soft board technique for PI is substituted.
Summary of the invention
In order to overcome the defects of the prior art, the embodiment of the invention provides a kind of high frequency circuit board and its production sides
Method, the integral manufacturing for promoting wiring board are horizontal.
The embodiment of the present application discloses: a kind of high frequency circuit board, the signal line layer including generating high-frequency signal, the signal
The two sides of line layer are equipped with ground plane, adhesive layer are fitted between the signal line layer and the ground plane, described twoly
The outside of line layer is successively arranged signal coating and insulating layer；
The signal line layer and the ground plane include that signal transmitting layer is made in LCP material, and the adhesive layer is liquid
Brilliant polyurethane film material is made.
Preferably, the insulating layer is made of covering membrane material.
Preferably, there is LCP material signal transmitting layer is made for a side of the signal line layer and the ground plane.
Preferably, the signal coating is copper plate of the plating on the outside of the ground plane, the signal coating
Upper copper-plated thickness≤28um.
Preferably, the signal coating is electroplated on the ground plane using chemical technology；Or, the signal covering
Layer is plated in the insulating layer inner wall by carrier of insulating layer, and then is coated on the ground plane.
Preferably, being equipped with the copper facing that can be realized signal conduction between the signal coating and the signal line layer
Hole, copper-plated thickness >=17um on the hole wall in the copper facing hole.
The embodiment of the present application also discloses a kind of production method of high frequency circuit board, including above-mentioned high frequency circuit board, institute
Stating production method, specific step is as follows:
The signal line layer being prepared by LCP material is cut；
Two sides are bonded the adhesive layer made of liquid crystal polyurethane membrane material above and below the signal line layer；
The ground plane being prepared by LCP material is set on the surface of the adhesive layer；
The ground plane outside copper electroplating layer as signal coating；
It is bonded the insulating layer made of covering membrane material on the surface of the signal coating, forms high frequency circuit board；
High-temperature laminating is carried out to the high frequency circuit board；
Radium-shine cutting is carried out using the high frequency circuit board shape of high-temperature laminating.
Preferably, the wiring board is carrying out chemical cleaning after radium-shine cutting, carbon can will be generated after radium-shine cutting
Powder cleans up.
Preferably, the wiring board is successively carrying out sandblasting after chemistry is clear, is changing gold, text, electrical measurement, reinforcement.
Preferably, the step " the ground plane outside copper electroplating layer as signal coating " in, pass through sudden strain of a muscle
Plating mode prepares copper plate on the ground plane, required for recycling the mode of etching to etch on the signal coating
Line construction.
Beneficial effects of the present invention are as follows: high frequency circuit board disclosed by the invention, wherein signal line layer and the ground plane
It is all made of LCP material, LCP is a kind of novel thermoplastic organic material, can be realized under the premise of guaranteeing higher reliability
High-frequency high-speed soft board.LCP has excellent electrical characteristic: (1) being almost able to maintain perseverance in whole radio-frequency regions of up to 110GHz
Fixed dielectric constant, consistency are good；(2) tangent loss is very small, and only 0.002, only increase in 110GHz
0.0045, it is very suitable to Millimeter Wave Applications；(3) thermal expansion character is very small.
It, should as having the signal transmitting layer made of LCP material on signal line layer and ground plane on only one side
The copper thickness of wiring board is thicker, therefore has better flex capability using wiring board made of LCP material, make wiring board when
Waiting line width can widen, and be more advantageous to signal transmission in this way, so as to promote wiring board utilization rate, while increasing its number again
According to laser propagation effect.
Production method through the invention will pass through the route that high-temperature high-pressure is got togather during making the high frequency circuit board
Plate shape first passes through radium-shine cutting, then carries out chemical cleaning, then successively carries out sandblasting, changes gold, text, electrical measurement, reinforcement, passes through
The wiring board that this method is produced can guarantee that radium-shine carbon dust can be effectively removed, and carbon dust removal effect is good, is not likely to produce carbon
The case where powder remains, reduce it is radium-shine in the prior art after wipe the process of carbon dust, and changing process to follow-up process with
And product quality will not impact, and well control work to the processing procedure in the manufacturing process for improving LCP wiring board, stable play
With it is good to improve production for reduction production cost.
For above and other objects, features and advantages of the invention can be clearer and more comprehensible, preferred embodiment is cited below particularly,
And cooperate institute's accompanying drawings, it is described in detail below.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of high frequency circuit board provided in an embodiment of the present invention.
In figure: 1, signal line layer；2, adhesive layer；3, ground plane；4, signal coating；5, insulating layer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention:
As shown in Figure 1, the present invention provides a kind of high frequency circuit board, including generating the signal line layer 1 of high-frequency signal and being located at
Two ground planes 3 of about 1 two sides of signal line layer, are respectively fitted with bonding between the signal line layer 1 and described two ground planes 3
Layer 2, the outside of described two ground planes 3 is successively arranged signal coating 4 and insulating layer 5；
The signal line layer 1 and described two ground planes 3 all include that signal transmitting layer, the bonding is made in LCP material
Layer 2 is made of liquid crystal polyurethane membrane material.
The signal transmitting layer made of LCP material is located on a side on signal line layer 1 and ground plane 3, due to letter
There is the signal transmitting layer made of LCP material, the copper of the wiring board is thick on number line floor 1 and ground plane 3 on only one side
Thicker, line width can widen when making wiring board, be more advantageous to signal transmission in this way, and LCP material has preferably flexible
Performance, and signal transmission effect is good, increases its data laser propagation effect while so as to promote wiring board utilization rate again.
In another embodiment, the insulating layer 5 is made of covering membrane material, and the signal coating 4 is that plating exists
The copper plate in described two 4 outsides of ground plane, copper plate are coated on the outside of described two ground planes 3 completely, can close institute
Signal line layer 1 and described two ground planes 3 are stated, can be effectively reduced in the hardened structure in circuit road and signal biography is carried out based on LCP material
High-frequency signal leakage problem caused by defeated, can make relevant electronic product avoid interfering with each other, and high-speed transfer makes safely
With then being coated on by insulating layer 5 outside of the signal coating 4, and then being capable of preferably signal line layer 1 and described two
Route on line layer 3 is protected.
Copper-plated thickness≤28um on the signal coating 4, the signal coating 4 and the signal line layer 1 it
Between be equipped with and can be realized the copper facing hole of signal conduction, copper-plated thickness >=17um on the hole wall in the copper facing hole.
In another embodiment, the signal coating 4 is that carrier is plated in 5 inner wall of insulating layer with insulating layer 5, in turn
It is coated on the ground plane 3.
The embodiment of the present application also discloses a kind of production method of high frequency circuit board, including above-mentioned high frequency circuit board, institute
Stating production method, specific step is as follows:
(1) plate being prepared by LCP material is cut as signal line layer；
(2) two sides are bonded the adhesive layer made of liquid crystal polyurethane membrane material above and below the signal line layer；
(3) ground plane being prepared by LCP material is set on the surface of the adhesive layer；
(4) one layer of layers of copper is electroplated as signal coating, by flash mode describedly in the outside of the ground plane
Copper plate is prepared on line layer, the mode of etching is recycled to etch required line construction on the signal coating, and
So that the route is without open circuit/short circuit；
(5) it is bonded the insulating layer made of covering membrane material on the surface of the ground plane, forms high frequency circuit board；
(6) high-temperature laminating is carried out to the high frequency circuit board；
(7) radium-shine cutting is carried out to by the high frequency circuit board shape of high-temperature laminating again；
(8) wiring board is carrying out chemical cleaning after radium-shine cutting, and carbon dust cleaning can will be generated after radium-shine cutting
Completely；
(9) wiring board is successively carrying out sandblasting after chemistry is clear, is changing gold, text, electrical measurement, reinforcement, completes high frequency
Wiring board production.
When making high frequency circuit board, the wiring board shape got togather by high-temperature high-pressure is first passed through into radium-shine cutting, then carry out
Chemical cleaning then successively carries out sandblasting, changes gold, text, electrical measurement, reinforcement, the wiring board produced by this method, Neng Goubao
Card completely removes radium-shine carbon dust, avoids after first reinforcement in the prior art that radium-shine cutting wiring board shape, outline edge have again
The problem of radium-shine carbon dust nigrescence situation, hardly possible are cleaned, and golden face pollution effect SMT assembling component is easily caused, also reduces existing skill
There is still a need for the processes for wipe carbon dust after radium-shine cutting for wiring board in the production method of art, and changing process is to subsequent system
Journey and product quality will not impact, and play good control to the processing procedure in the manufacturing process for improving LCP wiring board, stabilization
Effect reduces production cost, improves production yield.
Specific embodiment is applied in the present invention, and principle and implementation of the present invention are described, above embodiments
Explanation be merely used to help understand method and its core concept of the invention；At the same time, for those skilled in the art,
According to the thought of the present invention, there will be changes in the specific implementation manner and application range, in conclusion in this specification
Appearance should not be construed as limiting the invention.
Claims (10)
1. a kind of high frequency circuit board, which is characterized in that the signal line layer including generating high-frequency signal, the two sides of the signal line layer
It is equipped with ground plane, adhesive layer, the outside of described two ground planes are fitted between the signal line layer and the ground plane
It is successively arranged signal coating and insulating layer；
The signal line layer and the ground plane include that signal transmitting layer is made in LCP material, and the adhesive layer is poly- for liquid crystal
Urethane membrane material is made.
2. high frequency circuit board according to claim 1, which is characterized in that the insulating layer is made of covering membrane material.
3. high frequency circuit board according to claim 1, which is characterized in that one of the signal line layer and the ground plane
There is LCP material signal transmitting layer is made for side.
4. high frequency circuit board according to claim 1, which is characterized in that the signal coating is plating in the ground wire
The copper plate in layer outside, copper-plated thickness≤28um on the signal coating.
5. high frequency circuit board according to claim 4, which is characterized in that the signal coating is electroplated using chemical technology
On the ground plane；Or, the signal coating is plated in the insulating layer inner wall by carrier of insulating layer, and then it is coated on institute
It states on ground plane.
6. high frequency circuit board according to claim 4, which is characterized in that the signal coating and the signal line layer it
Between be equipped with and can be realized the copper facing hole of signal conduction, copper-plated thickness >=17um on the hole wall in the copper facing hole.
7. a kind of production method of high frequency circuit board, including high frequency circuit board as claimed in any one of claims 1 to 6, feature
It is, specific step is as follows for the production method:
The signal line layer being prepared by LCP material is cut；
Two sides are bonded the adhesive layer made of liquid crystal polyurethane membrane material above and below the signal line layer；
The ground plane being prepared by LCP material is set on the surface of the adhesive layer；
The ground plane outside copper electroplating layer as signal coating；
It is bonded the insulating layer made of covering membrane material on the surface of the signal coating, forms high frequency circuit board；
High-temperature laminating is carried out to the high frequency circuit board；
Radium-shine cutting is carried out using the high frequency circuit board shape of high-temperature laminating.
8. production method according to claim 7, which is characterized in that the wiring board is changed after radium-shine cutting
Cleaning is learned, can be cleaned up carbon dust is generated after radium-shine cutting.
9. production method according to claim 8, which is characterized in that the wiring board is successively carried out after chemistry is clear
Gold, text, electrical measurement, reinforcement are changed in sandblasting.
10. production method according to claim 7, which is characterized in that the step " is electroplated in the outside of the ground plane
Layers of copper is as signal coating " in, copper plate is prepared on the ground plane by flash mode, the mode of etching is recycled to exist
Required line construction is etched on the signal coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910461079.0A CN110149757A (en) | 2019-05-30 | 2019-05-30 | A kind of high frequency circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910461079.0A CN110149757A (en) | 2019-05-30 | 2019-05-30 | A kind of high frequency circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110149757A true CN110149757A (en) | 2019-08-20 |
Family
ID=67593518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910461079.0A Pending CN110149757A (en) | 2019-05-30 | 2019-05-30 | A kind of high frequency circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110149757A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111356298A (en) * | 2020-03-17 | 2020-06-30 | 景旺电子科技(龙川)有限公司 | Method for solving carbon powder residue in multilayer FPC (flexible printed circuit) manufacturing process based on front opening window process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111356298A (en) * | 2020-03-17 | 2020-06-30 | 景旺电子科技(龙川)有限公司 | Method for solving carbon powder residue in multilayer FPC (flexible printed circuit) manufacturing process based on front opening window process |
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