CN111356298A - Method for solving carbon powder residue in multilayer FPC (flexible printed circuit) manufacturing process based on front opening window process - Google Patents
Method for solving carbon powder residue in multilayer FPC (flexible printed circuit) manufacturing process based on front opening window process Download PDFInfo
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- CN111356298A CN111356298A CN202010186021.2A CN202010186021A CN111356298A CN 111356298 A CN111356298 A CN 111356298A CN 202010186021 A CN202010186021 A CN 202010186021A CN 111356298 A CN111356298 A CN 111356298A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Abstract
The invention discloses a method for solving carbon powder residue in a multilayer FPC (flexible printed circuit) manufacturing process based on a front opening window process, and relates to the technical field of circuit board production. In the multilayer FPC manufacturing process based on the front window design, the operation of removing carbon powder is added, and the problem that the carbon powder is adsorbed on the inner layer plate and is difficult to remove due to the fact that liquid medicine is left in the process of shading is solved. According to the invention, different processing flows and parameters are set according to different positions of the residual carbon powder, so that the condition that the color difference of the surface of the covering film is different and the product quality is influenced is avoided. The manufacturing method of the multilayer FPC provided by the invention is based on the process design of the front opening window, can remove the residual carbon powder in the black shadow process, ensures the product quality and enlarges the application range of the process design of the front opening window.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a method for solving carbon powder residue in a multilayer FPC (flexible printed circuit) manufacturing process based on a front opening window process.
Background
In the 21 st century, along with the continuous development of electronic technology, the functional requirements of consumers on electronic products are gradually comprehensive, and in order to meet different functional requirements, the printed circuit board can be correspondingly adjusted on the product structure, and multilayer boards with different stacking structures are more and more common.
In the design of the FPC multilayer board, a structure needing to be uncovered is often adopted, and two different manufacturing processes of front uncovering and rear uncovering are adopted in the corresponding FPC manufacturing process. For the design of the front uncovering cover, the design can adopt a method of simultaneously windowing by thermosetting adhesive and single-sided copper foil, and also adopts a method of windowing by thermosetting adhesive and etching pure copper foil. And the rear window is designed by adopting a laser machine, and the energy is adjusted to control the depth for window opening.
In the front windowing design, shadow treatment is needed when the outer layer of the FPC multilayer board is electroplated, the exposed part of the inner layer can directly contact shadow liquid medicine due to a windowing structure, so that carbon powder is adsorbed on a covering film PI and/or a base material PI of the inner layer, and the residual carbon powder cannot be removed by the conventional electroplating and graphic process flow. This drawback limits the application of the front opening window process.
Disclosure of Invention
The invention aims to solve the technical problem that in the design of a front window, the inner layer is difficult to remove due to adsorption of carbon powder caused by a window structure.
In order to solve the above problems, the present invention proposes the following technical solutions:
in a first aspect, the invention provides a solution to carbon powder residue in the process of manufacturing a multilayer FPC based on a front windowing process, wherein the carbon powder removing step is carried out on the front windowed multilayer FPC after an outer layer pattern; the multilayer FPC is manufactured by pressing a single-sided board and an inner-layer board;
wherein the single panel is provided with a first windowing region; the inner layer plate is provided with a covering film attaching area;
and if the first windowing area is positioned in the covering film attaching area and the covering film PI is exposed, the step of removing the carbon powder is first sand blasting.
The further technical proposal is that the spraying pressure of the first sand blasting treatment is 1.2 plus or minus 0.2kg/cm2The linear velocity was 2.0. + -. 0.2 m/min.
The technical scheme is that the inner layer plate is further provided with a cover film windowing area, and the cover film windowing area exposes the substrate PI;
if the first windowing area is the same as the cover film windowing area and the substrate PI is exposed, the step of removing the carbon powder is first plasma → second sand blasting.
The further technical scheme is that in the first plasma operation step, the flow rate of the carbon tetrafluoride is 250 plus or minus 25cc/min, and the action time of the plasma gas is 18 plus or minus 2 min.
The further technical proposal is that the second sand blasting treatment isThe spraying pressure is 1.2 plus or minus 0.2kg/cm2The linear velocity was 2.5. + -. 0.2 m/min.
The technical scheme is that the inner layer plate is further provided with a cover film windowing area, and the cover film windowing area exposes the substrate PI;
if the cover film attaching area and the cover film windowing area exist in the first windowing area and the cover film windowing area expose the cover film PI and the base material PI, the step of removing the carbon powder is third sand blasting → second plasma → acid cleaning treatment.
The further technical proposal is that the spray pressure of the third sand blasting treatment is 1.2 plus or minus 0.2kg/cm2The linear velocity was 2.0. + -. 0.2 m/min.
The further technical scheme is that in the second plasma operation step, the flow rate of carbon tetrafluoride is 200 plus or minus 20 cc/min; the action time of the plasma gas is 12 +/-2 min.
The further technical scheme is that the acid washing is to wash by adopting the concentration of 5 +/-1% of sulfuric acid.
In a second aspect, the present invention provides a method for manufacturing a multilayer FPC, comprising the steps of:
s1, window opening is carried out after the single panel and the thermosetting adhesive are attached in advance, and the window opening position is set as a first window opening area;
s2, attaching a cover film to the inner-layer plate after completing an inner-layer circuit;
s3, laminating according to the stack of the single panel, the thermosetting adhesive, the cover film and the inner layer plate to obtain a multilayer FPC;
s4 shading the multilayer FPC → outer layer electroplating → outer layer pattern → removing carbon powder → AOI; thus obtaining the multilayer FPC;
the carbon powder removing step is the first aspect of the carbon powder residue solving method in the multilayer FPC manufacturing process based on the front opening window process.
Compared with the prior art, the invention can achieve the following technical effects: in the multilayer FPC processing procedure based on the design of windowing before, increase and remove the carbon dust operation, solve during the shadow liquid medicine and remain, lead to the carbon dust to adsorb at the inner plating, be difficult to get rid of the problem. Because the cover film PI is smooth, the binding force of the carbon powder and the carbon powder is poor, the carbon powder can be completely cleaned by physical acting force of sand blasting, the cover film PI structure cannot be damaged, and the product quality is ensured.
Furthermore, different processing flows and parameters are set according to different positions of residual carbon powder, so that the condition that the color difference of the surface of the covering film is different and the product quality is influenced is avoided. By comparing the difference of the characteristics of the carbon powder remained on the cover film PI and the base material PI (the cover film PI is smooth and has weaker bonding force with the carbon powder; the base material PI is rough and has stronger bonding force with the carbon powder), different process flows are set in a targeted manner to remove the remained carbon powder; by adjusting the flow and the process parameters, the bad generation of the color difference of the covering film is avoided, the PI bite amount is reduced, and the product quality is more reliably guaranteed.
The manufacturing method of the multilayer FPC provided by the invention is based on the process design of the front opening window, can remove the residual carbon powder in the black shadow process, ensures the product quality and enlarges the application range of the process design of the front opening window.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a first structure of carbon powder residue in a multi-layer FPC manufacturing process based on a front opening window process;
FIG. 2 is a schematic diagram of a second structure of carbon powder residue in a multi-layer FPC manufacturing process based on a front opening window process;
FIG. 3 is a schematic diagram of a third structure of carbon powder residue in a multi-layer FPC process based on a front-opening window process.
Reference numerals
The single-sided board comprises a single-sided board 1, a covering film 2, an inner-layer board 3, a first windowing area 4, a covering film attaching area 5, a covering film windowing area 6 and carbon powder 7.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The embodiment of the invention provides a solution to carbon powder residue in the process of manufacturing a multilayer FPC based on a front windowing process, wherein the carbon powder removing step is carried out on the front windowed multilayer FPC after an outer layer graph; the multilayer FPC is manufactured by pressing a single-sided board and an inner-layer board;
wherein the single panel is provided with a first windowing region; the inner layer plate is provided with a covering film attaching area;
and if the first windowing area is positioned in the covering film attaching area, exposing the covering film PI, wherein the step of removing the carbon powder is first sand blasting.
For the multilayer FPC, the cover film includes a cover film PI and an adhesive, and the inner layer board is a double-sided board, for example, and has a structure of a cover film PI-adhesive-copper substrate-substrate PI-copper substrate. The cover film is used for protecting an inner layer circuit structure of the inner layer plate, so that the surface of the cover film PI is smooth; the substrate PI is used for combining two copper substrates, the surface roughness is beneficial to improving the binding force with the copper substrates, and therefore the surface of the substrate PI is rough.
In this embodiment, since the first windowing region is located in the cover film attaching region (as shown in fig. 1), and the cover film PI is smooth, the carbon powder is poorly bonded to the cover film PI, and the carbon powder removing step is performed after the outer layer pattern, so that the residual carbon powder can be removed by the first sand blasting treatment, and the cover film PI structure is not lost, thereby ensuring the product quality.
In one embodiment, the pressure of the first sand blasting is 1.2 +/-0.2 kg/cm2The linear velocity was 2.0. + -. 0.2 m/min.
Note that, in the case of the blast treatment: the product needs to determine the sand blasting face according to the structural characteristics, the residual face of the carbon powder is opened for sand blasting, and the spray pressure is adjusted to 1.2 +/-0.2 kg/c square meter; the linear velocity of sand blasting is adjusted to be 2.0 +/-0.2 m/min, and the sand blasting operation on the residual surface of the carbon powder is ensured.
In another embodiment, the inner layer board is provided with a cover film windowing area besides a cover film attaching area, and the cover film windowing area exposes the substrate PI;
if the first windowing area is the same as the cover film windowing area and the substrate PI is exposed, the step of removing the carbon powder is first plasma → second sand blasting.
It can be understood that, in the specific implementation, according to different inner layer circuit designs of the inner layer board, the substrate etching and the cover film windowing are performed, the substrate and the cover film are pressed to expose the substrate PI of the inner layer board, the windowing part of the cover film is the cover film windowing area, if the first windowing area is the same as the cover film windowing area (as shown in fig. 2), since the substrate PI is left after the inner layer board etches the copper substrate after making the inner layer pattern, the surface of the substrate PI is rough, and carbon powder can be tightly and uniformly combined with the substrate PI to cover the substrate PI, so that the carbon powder cannot be removed by simply using a sand blasting method; it is processed in combination with plasma.
In the embodiment, the substrate PI is etched by using plasma gas, so that the binding force between the substrate PI and the carbon powder is reduced, and then the carbon powder is thoroughly cleaned by using a physical sand blasting mode.
In specific implementation, in the first plasma operation step, the flow rate of the carbon tetrafluoride is 250 plus or minus 25cc/min, and the action time of the plasma gas is 18 plus or minus 2 min.
The first plasma parameters are set as shown in the following table 1, the plasma operation is carried out in three stages, and the carbon powder removing surface of the product is placed upwards. The plasma treatment mainly controls the action time of the second stage and the flow rate of the carbon tetrafluoride, and the plasma gas of the carbon tetrafluoride plays a role of etching PI.
TABLE 1 first plasma parameter settings Table
In specific implementation, the spraying pressure of the second sand blasting treatment is 1.2 +/-0.2 kg/cm2The linear velocity was 2.5. + -. 0.2 m/min.
In other embodiments, for the product structure design shown in fig. 2, the operation of "sand blasting → plasma → acid cleaning" can be used to remove carbon powder in the manufacturing process, but this operation is added with an acid cleaning process compared to the operation of "plasma → sand blasting".
In another embodiment, the inner layer board is provided with a cover film windowing area besides the cover film attaching area, and the base material PI is exposed from the cover film windowing area;
if the cover film attaching area and the cover film windowing area exist in the first windowing area and the cover film windowing area expose the cover film PI and the base material PI, the step of removing the carbon powder is third sand blasting → second plasma → acid cleaning treatment.
It can be understood that, in the specific implementation, according to different inner layer circuit designs of the inner layer board, substrate etching and cover film windowing are performed, the substrate and the cover film are pressed to expose the substrate PI of the inner layer board, the windowing portion of the cover film is the cover film windowing area, if the first windowing area has both the cover film attachment area and the cover film windowing area (as shown in fig. 3), the cover film PI and the substrate PI are simultaneously exposed by the first windowing area, when the "plasma + sandblasting" flow is used, because the bonding force between the cover film PI and the carbon powder is poor, the cover film exposed carbon powder PI is not completely filled, the plasma etching amount of the part of the carbon powder-free area is larger than that of the carbon powder-containing area, and after the cover film is cleaned by sandblasting, the cover film PI has color difference due to the inconsistent etching amount, thereby generating color difference, and further causing poor appearance.
Therefore, in the embodiment, the carbon powder is removed by adopting a third sand blasting → a second plasma → acid cleaning treatment, and the carbon on the cover film PI is completely cleaned by sand blasting, so that a part of the carbon powder remained on the inner layer plate substrate PI is also cleaned; then, the substrate PI is etched through plasma treatment, and the binding force of the carbon powder and the substrate PI is reduced; and finally, removing the oxide layers of the carbon powder and the copper surface by adopting an acid washing mode to achieve the aim of completely removing the carbon powder.
In a specific implementation, the spray pressure of the third sand blasting treatment is 1.2 +/-0.2 kg/cm2The linear velocity was 2.0. + -. 0.2 m/min.
In specific implementation, in the second plasma operation step, the flow rate of the carbon tetrafluoride is 200 plus or minus 20 cc/min; the action time of the plasma gas is 12 +/-2 min.
The second plasma parameter setting is as the following table 2, the plasma operation is carried out in three stages, and the carbon powder removing surface of the product is placed upwards. The plasma processing mainly controls the action time of the second stage and the flow rate of carbon tetrafluoride, and the plasma gas of carbon tetrafluoride plays a role of etching PI (here, the plasma intensity may be weaker than that in the first plasma processing).
TABLE 2 second plasma parameter setup Table
In specific implementation, the acid washing is carried out by adopting a sulfuric acid concentration of 5 +/-1%. The pickling can be carried out by adopting a pickling tank, the sulfuric acid concentration of the pickling tank is controlled to be 5 +/-1%, the linear speed of the cleaning line is controlled to be 2.0 +/-0.2 m/min, and the cleaning of the product is carried out, and whether the carbon powder and the copper surface oxide layer on the substrate PI are cleaned or not is observed.
The invention also provides a method for manufacturing the multilayer FPC in an embodiment, which comprises the following steps:
s1, window opening is carried out after the single panel 1 and the thermosetting adhesive are attached in advance, and the window opening position is set as a first window opening area 4;
s2, attaching the cover film 2 to the inner-layer plate 3 after completing the inner-layer circuit;
s3, laminating according to the stack of the single panel 1-thermosetting adhesive-cover film 2-inner layer plate 3 to obtain a multilayer FPC;
s4 shading the multilayer FPC → outer layer electroplating → outer layer pattern → removing carbon powder → AOI; thus obtaining the multilayer FPC;
the step of removing carbon powder adopts the method for solving the carbon powder residue in the multilayer FPC manufacturing process based on the front opening window process in any embodiment.
Referring to fig. 1-3, it can be understood that the three different states of the carbon powder residue caused by the different design structures of the multi-layer FPC product based on the front window are corresponding to different carbon powder removing methods:
as shown in fig. 1, for the first windowing region 4 located in the cover film attaching region 5, the carbon powder 7 remains only on the surface of the cover film PI of the front windowing region, and the carbon powder removing process is "sand blasting": the cover film PI is smooth, so that the binding force between the carbon powder and the cover film PI is poor, the carbon powder can be completely cleaned through the physical acting force of sand blasting, and the PI structure cannot be damaged;
as shown in fig. 2, for the first windowing region 4 and the cover film windowing region 6, the carbon powder 7 remains only on the surface of the substrate PI of the front windowing region, and the flow of carbon powder removal is "plasma → sand blasting": firstly, the PI surface layer is eroded by plasma gas, so that the binding force of PI and carbon powder is weakened; and then passes through a sand blasting cleaning line, and residual carbon powder is removed by using the physical force action of sand blasting.
Referring to fig. 3, for both the cover film attaching area 5 and the cover film windowing area 6 in the first windowing area 4, carbon powder 7 remains on the surface of the cover film PI and the surface of the substrate PI of the front windowing, and the flow of removing the carbon powder is "sand blasting + plasma + acid washing": because the surface of the covering film PI is smooth, the binding force of the carbon powder and the covering film PI is poor, the residual carbon powder on the covering film PI is firstly removed by using the physical force of sand blasting, if the covering film PI is not cleaned, the sand blasting can be repeated for a plurality of times, and meanwhile, part of the carbon powder on the upper surface layer of the substrate PI can be removed; then, plasma gas bites the substrate PI by adjusting plasma parameters (the process flow of 'sand blasting → plasma → acid washing' relative to the plasma strength 'plasma → sand blasting' can be weakened properly due to the fact that sand blasting can wash away carbon powder on the surface layer), and the bonding force between the plasma gas and the carbon powder is reduced; finally, a degreasing and pickling line is used for washing away residual carbon powder and copper surface oxidation.
In combination of the above, the method has the advantages of,
1. in the case of the structure one (figure 1) of carbon powder residue, the product can be cleaned by directly using sand blasting.
2. In the case of the carbon powder residue is the structure II (shown in figure 2), the product can be cleaned by two processes of plasma → sand blasting and sand blasting → plasma → acid washing.
3. In the case of the carbon powder residue is the structure III (figure 3), the product can be cleaned only by the process flow of 'sand blasting → plasma → acid cleaning', but not by the process flow of 'plasma → sand blasting'. The reason is that when the front window comprises a cover film PI and a base material PI, the cover film PI is smooth, the binding force of the carbon powder and the base material PI is poor, the exposed cover film cannot be completely paved by the carbon powder after shading, the base material PI is left after the copper base material is etched when an inner layer graph is made on an inner layer plate, the surface of the base material PI is rough, and the carbon powder can be tightly and uniformly bound with the base material PI. When the plasma processing is directly used, the substrate PI can be uniformly bitten and eroded, and the position without carbon powder on the part of the covering film PI is excessively bitten and eroded due to uneven distribution of the carbon powder; after sand blasting cleaning, the covering film PI has different colors due to different bite degrees (roughness) on the covering film PI, the appearance of a finished product is influenced, and the color difference cannot be eliminated.
According to the invention, different process flows are set according to different positions of carbon powder residues by comparing the characteristic difference between the covering film PI and the base material PI (the covering film PI is smooth and has weaker bonding force with carbon powder, and the base material PI is rough and has stronger bonding force with the carbon powder). By adjusting the flow and the process parameters, the bad color difference of the covering film PI is avoided, the bite etching amount of the covering film PI and/or the base material PI is reduced, and the product quality is more reliably guaranteed.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A solution to carbon powder residue in the process of manufacturing a multilayer FPC based on a front windowing process is characterized in that the carbon powder removing step is carried out on the front windowed multilayer FPC after an outer layer graph; the multilayer FPC is manufactured by pressing a single-sided board and an inner-layer board;
wherein the single panel is provided with a first windowing region; the inner layer plate is provided with a covering film attaching area;
and if the first windowing area is positioned in the covering film attaching area and the covering film PI is exposed, the step of removing the carbon powder is first sand blasting.
2. The method for solving the carbon powder residue in the process of manufacturing the multi-layer FPC based on the front opening window process as claimed in claim 1, wherein the spraying pressure of the first sand blasting is 1.2 +/-0.2 kg/cm2The linear velocity was 2.0. + -. 0.2 m/min.
3. The method for solving the carbon powder residue in the process of manufacturing the multilayer FPC based on the front opening window process as claimed in claim 1, wherein the inner layer board is further provided with a cover film window area, and the cover film window area exposes the substrate PI;
if the first windowing area is the same as the cover film windowing area and the substrate PI is exposed, the step of removing the carbon powder is first plasma → second sand blasting.
4. The method for solving carbon powder residue in the process of manufacturing the multi-layer FPC based on the front opening window process as claimed in claim 3, wherein in the first plasma operation step, the flow rate of carbon tetrafluoride is 250 ± 25cc/min, and the action time of plasma gas is 18 ± 2 min.
5. The method for solving the carbon powder residue in the process of manufacturing the multi-layer FPC based on the front opening window process as claimed in claim 3, wherein the spraying pressure of the second sand blasting is 1.2 +/-0.2 kg/cm2The linear velocity was 2.5. + -. 0.2 m/min.
6. The method for solving the carbon powder residue in the process of manufacturing the multilayer FPC based on the front opening window process as claimed in claim 1, wherein the cover film of the inner layer board is further provided with a cover film opening area, and the cover film opening area exposes the substrate PI;
if the cover film attaching area and the cover film windowing area exist in the first windowing area and the cover film windowing area expose the cover film PI and the base material PI, the step of removing the carbon powder is third sand blasting → second plasma → acid cleaning.
7. The method for solving the carbon powder residue in the process of manufacturing the multi-layer FPC based on the front opening window process as claimed in claim 6, wherein the spray pressure of the third sand blasting is 1.2 +/-0.2 kg/cm2The linear velocity was 2.0. + -. 0.2 m/min.
8. The method for solving carbon powder residue in the process of manufacturing the multi-layer FPC based on the front opening window process as recited in claim 6, wherein in the second plasma operation step, the flow rate of carbon tetrafluoride is 200 ± 20 cc/min; the action time of the plasma gas is 12 +/-2 min.
9. The method for solving the carbon powder residue in the process of manufacturing the multilayer FPC based on the front opening window process as recited in claim 6, wherein the acid cleaning is performed by using a sulfuric acid concentration of 5 +/-1%.
10. A manufacturing method of a multi-layer FPC is characterized by comprising the following steps:
s1, window opening is carried out after the single panel and the thermosetting adhesive are attached in advance, and the window opening position is set as a first window opening area;
s2, attaching a cover film to the inner-layer plate after completing an inner-layer circuit;
s3, laminating according to the stack of the single panel, the thermosetting adhesive, the cover film and the inner layer plate to obtain a multilayer FPC;
s4 shading the multilayer FPC → outer layer electroplating → outer layer pattern → removing carbon powder → AOI; thus obtaining the multilayer FPC;
wherein the step of removing carbon powder is the method for solving the carbon powder residue in the process of manufacturing the multilayer FPC based on the front opening window process as claimed in any one of claims 1 to 9.
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| CN110191598A (en) * | 2019-06-12 | 2019-08-30 | 景旺电子科技(龙川)有限公司 | A kind of multiple-plate manufacturing technique method of FPC |
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