WO2012122684A1

WO2012122684A1 - Method for manufacturing flexible printed circuit board for producing pattern of bank card

Info

Publication number: WO2012122684A1
Application number: PCT/CN2011/000808
Authority: WO
Inventors: 万永东
Original assignee: 珠海元盛电子科技股份有限公司
Priority date: 2011-03-15
Filing date: 2011-05-09
Publication date: 2012-09-20
Also published as: CN102159028B; CN102159028A

Abstract

A method for manufacturing flexible printed circuit board for producing pattern of bank card is disclosed by the invention. The method produces a flexible printed circuit board with a pattern by a special PCB processing technology, then forming a pattern on the bank card by compressing technique. The method for manufacturing the flexible printed circuit board includes the following steps: rough shape cutting -> electro-coppering -> pasting a protective dry film->etching and striping the film->pasting gum->fast pressing->pasting a dry film->exposure imaging->etching and striping the film->depositing of nickel and gold->molding；and then bonding and pressing the flexible printed circuit board and substrate of the bank card together by using the exposed gum as a pre-bonding agent, finally obtaining the bank card with embossed pattern.

Description

Method for manufacturing flexible printed circuit board for making bank card pattern

The present invention relates to a method of fabricating a flexible printed circuit board for making a bank card pattern.

Background technique

At present, the pattern of an ordinary bank card is generally printed, and the designed pattern is printed on the substrate of the bank card, and the pattern is flat without a three-dimensional concave and convex feeling. High-end bank cards for different customer requirements, the bank cards with three-dimensional patterns proposed and designed on the market, the patterns and characters have three-dimensional concave and convex feeling, such a structure can not be completed by ordinary printing process, and this kind of The design of the bank card requires true gold, high quality, and meets the bank's demand for high-end bank card customers. It is called the real "golden card"; it is understood that there is no mature and feasible such a class on the market. The production process of bank card patterns, therefore, there is an urgent need to propose a production method that can mass-produce such bank card patterns.

Summary of the invention

The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a method for fabricating a flexible printed circuit board for making a bank card pattern by first using a special printed circuit board for a desired pattern. The processing technology produces a sturdy printed circuit board, and then press-forms to form a pattern on the bank card substrate, which has obvious three-dimensional concave and convex feeling, and meets the customer's demand for high-end bank cards.

The technical solution adopted by the present invention is as follows: The method proposed by the invention is fabricated by using a substrate of a double-sided flexible board, and the manufacturing method thereof comprises the following steps:

A: 幵, the substrate of the double-sided flexible copper clad laminate and the same size of the backing material;

B: electroplating copper on the entire substrate of the double-sided flexible copper clad laminate to form a double-sided flexible copper clad laminate;

C: a single-sided protective dry film is applied to the double-sided flexible copper clad laminate to expose another copper surface;

D: etching the exposed copper surface to expose the substrate, and removing the protective dry film;

E: affixing the backing on the copper-free surface of the copper foil etched and pressing;

F: Apply a dry film on the copper surface, expose the film, and make a pattern according to the film;

G: etching and stripping, removing excess copper foil to form the desired pattern;

H: It is treated with nickel-plated gold and finally molded to retain the adhesive package. Further, in the step B, before the copper-plated substrate of the double-sided flexible copper-clad laminate is subjected to electroplating, it is necessary to perform surface treatment on both sides of the substrate to ensure smooth progress of the electroplated copper. Instruction manual

Further, in the step F, before the copper-coated dry film is exposed and developed, the copper surface is subjected to surface treatment and drying. Further in actual production, the nickel-gold treatment process in the step H is automatically completed by the nickel-plated gold wire, and after the nickel-plating process, the surface treatment of the plate is required, and then the gold-filling process is performed, specifically including the following operations. Step: The upper plate is degreased, washed with water, pre-soaked, activated, washed with pure water, then immersed in a pure water, washed with a nickel plate, and then immersed in a pure water, a plate, a nickel, and a soaking cylinder. Cylinder one sink gold one pure water wash one anti-oxidation one pure water wash plate a washing machine to clean and dry. In the nickel-gold gold treatment process of the step H, the micro-etching step is skipped on the nickel-gold wire and the activation time is extended. In the above-described nickel-gold gold treatment process, the residence time between the surface treatment of the lap plate after the nickel immersion process and the immersion gold process is not more than 20 minutes. Between the nickel-gold processing processes of the step H, surface pre-treatment is also required, and the steps include: first performing a water washing operation after de-oiling for 3 minutes; then micro-etching for 10 to 15 minutes; finally, the surface is subjected to a rubbing treatment and drying. Further, in the electroplating copper process of the step B, the current density is controlled at 10 to 13 ASF, and the thickness of the electroplated copper is controlled to be 8 to 12 um.

The invention has the beneficial effects that: since the invention adopts the substrate of the double-sided flexible board to produce a single-sided pattern, the back side of the uncoated side is provided with the backing glue, and the exposed adhesive is used as the pre-sticking when pressed with the bank card. When pressed onto the bank card substrate, only the pattern is golden and the rest is still transparent. In the whole process, a layer of copper is firstly plated between the nickel and gold to ensure the brightness of the gold surface; after the nickel is deposited, the surface is ground and then immersed in gold, and the surface of the plate after the nickel deposition process is treated to sink. The residence time between the gold steps is not more than 20 minutes, preventing oxidation, and further ensuring the brightness of the gold surface.

DRAWINGS

Figure i is a specific flow chart of an embodiment of the present invention.

detailed description

In this embodiment, the bank card with a bird's nest pattern is taken as an example to further illustrate the present invention. The specific flow chart shown in FIG. 1 is as follows: Instruction manual

The first is to prepare the work, design the bank card for the size of the nest pattern, 12 one fight (considering the processing efficiency and equipment to adapt to the workpiece size), the laser draws the negative film, the film stretches 0.3%, the following enters the specific production process

Step (1): Unloading, according to 250X316 cutting, the substrate of double-sided flexible copper clad laminate is opened, and the adhesive material is opened at the same time, and the size is consistent with the material of the copper clad laminate.

Step (2): Surface treatment requires grinding on both sides to ensure that the surface of the board is bright, free from oxidation and other debris; special care should be taken to prevent wrinkles during tooling, and the surface of the board is required to be free from irregularities.

Step (3): Electroplating copper. When copper plating, the whole plate is required to be electroplated with a small current. The current density is controlled at 10- 13 ASF, and the thickness of the electroplated copper is controlled at 8-12 um. When the upper plate is used, it is necessary to ensure that the hanger clamps are not loosened to prevent the plate surface from wrinkling during the production process. After electroplating, it must be dried. After drying, the film is used to remove the film to prevent the surface from being wiped and wrinkled.

Step (4): Apply a dry film, protect the dry film on one side, protect one side of the copper, and expose the other copper surface.

Step (5): Etching and stripping: Etching off one side of the copper to expose the substrate, and removing the film to remove the protective film on the other side. The side with the protective dry film cannot be etched. In production, with guides, can not be stuck, to prevent wrinkles.

Step (6): Stick the adhesive, stick it on the copper-free surface, protect the substrate, and strengthen the strength of the board; correspondingly paste on the edge of the board, wipe the air, and ensure that there is no air bubble in the middle of the board.

Step (7): Quickly press, the board must be flat when releasing the board, to prevent the board from wrinkling when pressing fast, pre-press for 20 seconds, real pressure for 170 seconds, 185 °C, 12iV!Pa _; There is residual glue, and the film is separated by the film after the quick pressing.

Step (8): Grind the plate, only the copper surface, to ensure that the board surface is bright and free of oxidation and other debris. Pay special attention to prevent wrinkles when grinding the plate, and the plate surface is not required to be uneven. After the plate is ground, the drying section must be passed through and dried thoroughly. The film separator is taken out.

Step (9): Apply a dry film. In the case of a single-sided sticker that needs to be patterned, it must be compacted without bubbles.

Step (10): Exposure development, according to normal production parameters, film compensation, make the pattern of the nest; prevent the surface of the board from wrinkling during the process, do not under the adhesive.

Step (U): Etching and stripping, removing excess copper thin to form a bird's nest pattern; controlling various process parameters to prevent abnormalities such as jamming. Special care must be taken when pulling the lower plate. Take care to prevent wrinkles (not allowed for slight wrinkles) and use the film separator to remove the adhesive. Instruction manual

Step (12): Surface pretreatment, water washing after 3 minutes of degreasing, then microetching for 10-15 seconds, grinding the plate twice, and finally drying.

Step (13): Sink nickel gold, skip the micro-etching step, and extend the activation time to 3 min _{. The} nickel-gold gold treatment process is automatically completed by the nickel-plated gold wire. After the nickel-plating process, the surface of the plate is required to be dried. The gold process, specifically includes the following steps: On the board, one oil removal, one water wash, one pre-dip, one activation, one pure water wash, one dipping, one pure water, one sinking nickel, one plate, one plate, one immersed in pure water, one plate, one nickel plated. Before and after dip tank, before sinking gold, pure water washing tank, sinking gold, pure water, washing, anti-oxidation, pure water washing, washing machine, cleaning, drying; in the above step (12) and in this step, the grinding process needs to be adjusted. Pressure, the grinding plate is used four times each time. When grinding the plate, fix it with a single-side tape on the light-loading plate, and rub the plate forward without fixing the edge;

The above requirements for nickel sinking are: 81 - 82. C, 20min, the requirements for the immersion gold are: 88- 90 ° C, 7.5 min. After the nickel is immersed, the residence time between the grinding plate and the immersion gold should not exceed 20 minutes to prevent oxidation. When cleaning, clean it with a gold washer. After drying, use a film separator to remove the next step.

Step (14): Forming, retaining the adhesive, and cutting the shape according to the size of 316 X 245 on the sides of the L-shaped side of the film, and sending the FQC for full inspection.

Step (15): FQC/QA, the board surface must be free of wrinkles, no residual copper, pits, or debris. The gold surface cannot be rubbed, and the characters cannot be missing.

Step (16): Packing, with a dry film protective film, cut into 316 X 245 as a separator material, vacuum packed, with adhesive backing.

In summary, the manufacturing method of the specific flexible circuit board proposed by the present invention differs from that of the general FPC board in that:

1. Making single-sided graphics from double-sided materials, different from double-sided or single-sided FPC-like processes;

2. Differentiating the drilling, boring and electroplating process of the double-sided FPC board, the present invention does not require drilling or boring, but direct plating;

3. Differentiating the single-sided FPC board from direct filming, exposure, and etching processes, and the present invention requires two films and two etchings;

4. Different from the process of sinking nickel gold in a general FPC board, the present invention needs to skip the micro-etching step, and after adding nickel, adding a grinding plate to process the gold;

5. In the invention, the surface treatment and the pre-treatment need to use special tooling to ensure that the surface of the board is free from wrinkles, unevenness and pitting.

Claims

Claim

A method of fabricating a flexible printed circuit board for forming a bank card pattern, the flexible printed circuit board being press-formed on a bank card substrate to form a pattern, wherein the flexible printing The circuit board is fabricated by using a substrate of a double-sided flexible board, and the manufacturing method thereof comprises the following steps:

A: Cutting, opening the substrate of double-sided flexible copper clad laminate and the same size of adhesive material;

H: It is treated with nickel-plated gold and finally molded to retain the adhesive package.

2. The method for fabricating a flexible printed circuit board for making a bank card pattern according to claim 1, wherein in the step B, the substrate of the double-sided flexible copper clad laminate Before the electroplating of copper, it is necessary to surface-treat the both sides of the substrate.

3. The method for fabricating a flexible printed circuit board for making a bank card pattern according to claim 1, wherein in the step F, before the copper surface is coated with a dry film, before exposure and development The surface of the copper plate needs to be surface treated and dried.

4. The method for fabricating a flexible printed circuit board for making a bank card pattern according to claim 1, wherein the nickel-gold processing process in the step H is automatically completed by a nickel-gold wire. After the nickel plating process, the surface treatment of the grinding plate is required, and then the gold immersion process is performed.

The method for fabricating a flexible printed circuit board for manufacturing a bank card pattern according to claim 4, wherein in the nickel-gold processing process of the step H, on the nickel-gold wire Skip the microetching step.

6. A method of fabricating a flexible printed circuit board for making a bank card pattern according to claim 4, wherein the residence time between the surface treatment of the grinding plate after the nickel plating process and the gold filling process No more than 20 minutes.

7. The method of fabricating a flexible printed circuit board for making a bank card pattern according to claim 1, wherein surface pretreatment is required between the nickel-gold processing processes of step H , steps The claim - including: First, the water is washed after 3 minutes of degreasing; then microetched for 10 to 15 minutes; finally the surface is subjected to a grinding process and dried.

8 . The method of manufacturing a flexible printed circuit board for manufacturing a bank card pattern according to claim 1 , wherein in the copper plating process of step B, the current density is controlled at 10 to 13 ASF. The thickness of the electroplated copper is controlled at 8 to 12 um.