CN105764271A - Manufacturing process for memory bank module circuit board - Google Patents
Manufacturing process for memory bank module circuit board Download PDFInfo
- Publication number
- CN105764271A CN105764271A CN201610273509.2A CN201610273509A CN105764271A CN 105764271 A CN105764271 A CN 105764271A CN 201610273509 A CN201610273509 A CN 201610273509A CN 105764271 A CN105764271 A CN 105764271A
- Authority
- CN
- China
- Prior art keywords
- carried out
- runner plate
- plate
- processing technology
- memory bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Abstract
The invention provides a manufacturing process for a memory bank module circuit board. The process comprises: (1), substrate stacking design is carried out by using a board thickness value of a golden finger as a reference; (2), material issuing/cutting are carried out; (3), an internal layer line is manufactured on the substrate and checking is carried out; (4), stitching is carried out; (5), drilling is carried out; (6), total plate electroplating is carried out; (7), an external layer line is manufactured; (8), external layer line graph detection is carried out; (9), sold mask processing; (10), hold melting is carried out; (11) moulding is carried out; (12) testing is carried out; and (13), visual inspection is carried out. According to the manufacturing process, problems that the production benefits are low and the production cost is low because the production flow is long and the plated gold thickness is required to be over 30 microns can be solved. And adverse phenomena of recessing and scratching of a golden finger can be avoided.
Description
Technical field
The present invention relates to and is specifically related to a kind of memory bar module board processing technology.
Background technology
Traditional printed circuit board (PCB) adopts plating finger mode to produce, this method not only production procedure length and the thick requirement of gold-plated gold, at more than 30um, cause that productivity effect is low, and production cost is high, and thin gold is tighter to golden finger appearance requirement, it is necessary to overcome the problems such as golden finger place depression, scratch.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of memory bar module board processing technology, overcomes the problems referred to above.
For solving above-mentioned technical problem, the present invention provides a kind of memory bar module board processing technology, including step: (1) is as the criterion with golden finger place thickness of slab and carries out the folded structure design of substrate；(2) issuance of materials/sanction plate；(3) make internal layer circuit on the substrate and and check；(4) pressing；(5) boring；(6) electric plating of whole board；(7) outer-layer circuit is made；(8) outer-layer circuit test pattern；(9) anti-welding；(10) gold is changed；(11) molding；(12) test；(13) visual inspection.
As a kind of preferred version of a kind of memory bar module board processing technology of the present invention, pressing described in step (4) comprises the steps:
A. runner plate is cleaned: first use scraper to be scraped by granule foreign body on runner plate, and with, after the non-dust cloth wiped clean of ethanol, re-using blue light torch and confirm runner plate clean condition, it is ensured that runner plate can be sent into after foreign overlapping room；
B. lamination: overlapping personnel are by runner plate lamination after overlapping indoor are cleaned with low viscosity dust-binding cloth 100% again；
C. runner plate cleans: by cleaning line, the runner plate of wiped clean is directly passed into dust free room；
D. rebuild and check runner plate: for runner plate pit portion, by whole for runner plate survey of repairs；
E. plate appearance test are torn open；
F. pressing produces.
As a kind of preferred version of a kind of memory bar module board processing technology of the present invention, anti-welding including described in step (9) is exposed after print last layer photosensitive-ink on half-finished product plate, develops, and is appeared by the copper face that client need to window.
As a kind of preferred version of a kind of memory bar module board processing technology of the present invention, described in step (10), change the copper face that gold includes exposing solder mask window, on described copper face, chemically plate last layer gold.
As a kind of preferred version of a kind of memory bar module board processing technology of the present invention, molding described in step (11) includes the drawing requirement according to client, cuts into the fitted position that client needs.
As a kind of preferred version of a kind of memory bar module board processing technology of the present invention, step (10) is 100% every paper operation to step (13).
As a kind of preferred version of a kind of memory bar module board processing technology of the present invention, step (13) visual inspection comprises the steps:
A., after taking plate under dustless condition, plank is every paper operation；
B. shipment amount drafting board is thick, and adjustment location is golden finger area.
Compared with prior art, a kind of memory bar module board processing technology that the present invention proposes, advantage is as follows:
1: new technology golden finger adopts immersion process to make, and production procedure is shortened, and golden finger THICKNESS CONTROL is at 3um, it is possible to significant increase production efficiency, the production cost of gold-plated finger gold is greatly reduced, the saving cost of gold reaches 90%；
2: through the improvement of process for pressing improvement and scratch scheme so that golden finger place is without quality abnormals such as depression, scratch, projections；
3: memory bar modular circuit panel products reduces the problems such as the ink residue that causes of the anti-welding pollution in golden finger place by the design of windowing of optimizing metal finger place；
4: shorten the technological process of production, remove gold-plated finger and goldfinger bevel flow process, production efficiency is high, shortens the production cycle.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with detailed description of the invention, the present invention is further detailed explanation.
First, " embodiment " or " embodiment " referred to herein refers to the special characteristic, structure or the characteristic that may be included at least one implementation of the present invention.Different local in this manual " in one embodiment " occurred not refer both to same embodiment, neither be independent or selective and that other embodiments are mutually exclusive embodiment.
Described a kind of memory bar module board processing technology, comprising:
1. design: being as the criterion with golden finger place thickness of slab and carry out folded structure design, thickness does not comprise anti-welding thickness；
2. issuance of materials/sanction plate；
3. internal layer/interior inspection: internal layer circuit makes and inspection；
4. pressing: when a. personnel clean runner plate: use scraper to be scraped by granule foreign body on runner plate, and with, after the non-dust cloth wiped clean of ethanol, re-using blue light torch and confirm runner plate clean condition, it is ensured that runner plate can be sent into after foreign overlapping room；B. overlapping personnel are when lamination, and again with low viscosity dust-binding cloth 100%, runner plate is cleaned first power in overlapping indoor can operation；C. increase runner plate cleaning equipment, the runner plate of wiped clean is directly passed into dust free room by cleaning line, it is prevented that surfaces of mirror plate is polluted again because of environmental factors；D. for runner plate pit portion, by outer for runner plate committee trimming, by just producing after checking；E. formulate and tear plate operation or work standard and appearance test standard open, all planks are examined by tearing plate personnel 100% open entirely when tearing plate open, defective products recessed position uses white board marker to draw a circle and is distinguish between (tow sides), and be positioned in thousand layers of frame of defective products by abnormal plate management and control and have the bad plate of depression to centrally dispose, adopt filling perforation plating to fill and lead up；F. according to testing best pressing formula production, pressing production front confirmation pressing surfaces of mirror plate is clean, smooth, foreign, depression, and runner plate just can produce after having foreign body cleaning totally.
5. boring: in boring, PIN uses foam to separate, and transfers every kraft paper after boring；
6. electric plating of whole board；
7. outer layer: the making of outer-layer circuit；
8. outer inspection: outer graphics detects；
9. anti-welding: to be exposed after printing last layer photosensitive-ink on half-finished product plate, develop, the copper face that client need to window is appeared；
A. anti-welding dust free room keeps clean, carries out equipment cleaning；B. before printing, ink must be filtered, and is fallen by impurity foreign body filtering；C. before printing, ink has to pass through deaeration, it is necessary to be sufficiently stirred for printing: carry out operation by engineering discipline and related request, it is impossible to have the bad phenomenon such as transmission, infiltration, pin hole, dry plate, viscous version；D. adopting spraying flow process operation, plank sprays, and after exposure, plank all adopts interpolation frame operation；E. confirm that plank is with or without scratch situation after walking with copper-clad plate examination before plank development, without scratch just can operation, if any extremely reason need to be confirmed, adjust after equipment tries away OK again and just can produce；F. all adopt interpolation frame operation after plank development with baking, plank shipment 100% carries out pad paper；
10. change gold: the copper face exposed by solder mask window, on described copper face, chemically plate last layer gold；
A. gold think gauge is more than or equal to 075um, and nickel think gauge, more than or equal to 2.0um, confirms that changing gold after gold salt concentration is more than 0.4 g/l just can produce；B. before producing normal panel, the method walked with copper-clad plate examination checks roller, equipment operation condition, and the copper-clad plate passed by carries out checking for scratch, polishing scratch etc., just can produce after confirming OK；C. 100% is changed after gold every paper flap；
11. molding: according to the drawing requirement of client, cut into the fitted position that client needs；
Add cover plate when a. producing and avoid scratch；B. molding plank 100% is every paper operations for forming, it is to avoid plank rubs up and down, personnel take the scratch that plate causes；C. walk with copper-clad plate examination before molding washing, just can operation after confirmation；
12. test: test initial workpiece magnifier inspection panel face can not have electrical measurement to prick trace, and after test, 100% every folder flap；
13. need to wear the dustless glove of cleaning when visual inspection: a. takes plate, plank, every paper operation, is handled with care according to regulation；B. shipment amount drafting board is thick, and adjustment location is golden finger area.
Those of ordinary skill in art it should be appreciated that, one of the feature or purpose of the present invention are in that: memory bar module board processing technology of the present invention, can effectively solve because production procedure length and the thick requirement of gold-plated gold are at more than 30um, the problem that the productivity effect caused is low, production cost is high, and the bad phenomenon of golden finger place depression, scratch.
It should be noted that, above example is only in order to illustrate technical scheme and unrestricted, although the present invention being described in detail with reference to preferred embodiment, it will be understood by those within the art that, technical scheme can be modified or equivalent replacement, without deviating from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of scope of the presently claimed invention.
Claims (7)
1. a memory bar module board processing technology, it is characterised in that include step:
(1) it is as the criterion with golden finger place thickness of slab and carries out the folded structure design of substrate；(2) issuance of materials/sanction plate；(3) make internal layer circuit on the substrate and and check；(4) pressing；(5) boring；(6) electric plating of whole board；(7) outer-layer circuit is made；(8) outer-layer circuit test pattern；(9) anti-welding；(10) gold is changed；(11) molding；(12) test；(13) visual inspection.
2. memory bar module board processing technology as claimed in claim 1, is characterized in that: pressing described in step (4) comprises the steps:
A. runner plate is cleaned: first use scraper to be scraped by granule foreign body on runner plate, and with, after the non-dust cloth wiped clean of ethanol, re-using blue light torch and confirm runner plate clean condition, it is ensured that runner plate can be sent into after foreign overlapping room；
B. lamination: overlapping personnel are by runner plate lamination after overlapping indoor are cleaned with low viscosity dust-binding cloth 100% again；
C. runner plate cleans: by cleaning line, the runner plate of wiped clean is directly passed into dust free room；
D. rebuild and check runner plate: for runner plate pit portion, by whole for runner plate survey of repairs；
E. plate appearance test are torn open；
F. pressing produces.
3. memory bar module board processing technology as claimed in claim 1, is characterized in that: anti-welding including described in step (9) is exposed after print last layer photosensitive-ink on half-finished product plate, develops, and is appeared by the copper face that client need to window.
4. memory bar module board processing technology as claimed in claim 1, is characterized in that: change the copper face that gold includes exposing solder mask window described in step (10), chemically plates last layer gold on described copper face.
5. memory bar module board processing technology as claimed in claim 1, is characterized in that: molding described in step (11) includes the drawing requirement according to client, cuts into the fitted position that client needs.
6. memory bar module board processing technology as claimed in claim 1, is characterized in that: step (10) is 100% every paper operation to step (13).
7. memory bar module board processing technology as claimed in claim 1, is characterized in that: step (13) visual inspection comprises the steps:
A., after taking plate under dustless condition, plank is every paper operation；
B. shipment amount drafting board is thick, and adjustment location is golden finger area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610273509.2A CN105764271A (en) | 2016-04-28 | 2016-04-28 | Manufacturing process for memory bank module circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610273509.2A CN105764271A (en) | 2016-04-28 | 2016-04-28 | Manufacturing process for memory bank module circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105764271A true CN105764271A (en) | 2016-07-13 |
Family
ID=56326197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610273509.2A Pending CN105764271A (en) | 2016-04-28 | 2016-04-28 | Manufacturing process for memory bank module circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN105764271A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110740584A (en) * | 2019-10-12 | 2020-01-31 | 西安金百泽电路科技有限公司 | method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel |
Citations (6)
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|---|---|---|---|---|
| CN101365299A (en) * | 2008-09-19 | 2009-02-11 | 深圳市和美精艺科技有限公司 | Manufacturing method for memory card series circuit board having thickened golden finger and memory card |
| CN101835351A (en) * | 2010-04-08 | 2010-09-15 | 梅州市志浩电子科技有限公司 | Manufacture process of sectional golden finger |
| CN102159028A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Manufacturing method of flexible printed circuit board for manufacturing bank card patterns |
| CN105282983A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Lead wire etching technology with gold fingers with three surfaces wrapped by gold |
| CN105407653A (en) * | 2015-12-02 | 2016-03-16 | 日彩电子科技(深圳)有限公司 | Manufacturing method of circuit board |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
-
2016
- 2016-04-28 CN CN201610273509.2A patent/CN105764271A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101365299A (en) * | 2008-09-19 | 2009-02-11 | 深圳市和美精艺科技有限公司 | Manufacturing method for memory card series circuit board having thickened golden finger and memory card |
| CN101835351A (en) * | 2010-04-08 | 2010-09-15 | 梅州市志浩电子科技有限公司 | Manufacture process of sectional golden finger |
| CN102159028A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Manufacturing method of flexible printed circuit board for manufacturing bank card patterns |
| CN105282983A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Lead wire etching technology with gold fingers with three surfaces wrapped by gold |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
| CN105407653A (en) * | 2015-12-02 | 2016-03-16 | 日彩电子科技(深圳)有限公司 | Manufacturing method of circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110740584A (en) * | 2019-10-12 | 2020-01-31 | 西安金百泽电路科技有限公司 | method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 224100 No. 9, Yong Sheng Road, Dafeng Development Zone, Yancheng City, Jiangsu. Applicant after: JIANGSU BOMIN ELECTRONICS CO., LTD. Address before: 224100 Electronic Information Industry Park, Yancheng City, Jiangsu. Applicant before: JIANGSU BOMIN ELECTRONICS CO., LTD. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160713 |
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| RJ01 | Rejection of invention patent application after publication |