CN110831333A - Method for removing burrs of drilling hole - Google Patents
Method for removing burrs of drilling hole Download PDFInfo
- Publication number
- CN110831333A CN110831333A CN201911008095.0A CN201911008095A CN110831333A CN 110831333 A CN110831333 A CN 110831333A CN 201911008095 A CN201911008095 A CN 201911008095A CN 110831333 A CN110831333 A CN 110831333A
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- Prior art keywords
- plate
- production
- board
- grinding
- water washing
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a method for removing burrs of a drill hole, which comprises the following steps: polishing the orifices on the upper and lower surfaces in the copper deposition pretreatment after the production plate is drilled; then, grinding and coarsening the whole plate surface of the production plate through an abrasive belt; and carrying out pressurized spraying and water washing treatment on the production plate, and pausing for 5-10s when the whole production plate moves to a working position of the pressurized spraying and water washing so that the pressurized spraying water can fully clean the hole opening and the inside of the hole. The method can avoid the problems that the prior manual polishing deburring effect is uneven, the polishing is missed in individual holes, the reverse board is often placed in a single-sided machine grinding board, and the like, effectively ensures the deburring effect of the drilling hole, and avoids the copper-free defects of copper wires in the holes and dry film broken holes in the post-processing.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for removing burrs of a drilling hole.
Background
The traditional PCB hole flash removing method mainly comprises the following two steps:
1. and (3) manual polishing: front process → drilling → manual sanding (grinding plate using manual sander) → pre-rough grinding for copper deposition → rear process;
2. and (3) machine grinding: the front process → drilling → machine grinding (single-sided grinding plate) → coarse grinding before copper deposition → rear process.
The existing method for removing the burr of the drilling hole has the hidden trouble that the burr is not removed completely, and an in-hole copper wire is formed after the copper plate is electrically plated, so that a dry film broken hole type hole is easy to have no copper if a negative film process product is produced; the main reasons are as follows:
1. the manual polishing usually adopts a polishing plate provided with a 400# sand paper manual polisher, and the burr removing effect is uneven or polishing is missed in individual holes, so that the burr is not completely removed;
2. machine is polished for the single face generally, in the actual production process, often appears putting the reverse plate phenomenon, and only polish the bottom plate usually, gets rid of the drilling and drapes over one's shoulders the cutting edge of a knife or a sword effect and can't 100% guarantee.
And the existing method for removing the burr of the drill hole needs a special polishing process (manual polishing/machine polishing), the process is long, the efficiency is low, the operation cost of an enterprise is increased, and the aim of lean production cannot be achieved.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for removing burrs of a drilling hole, which can avoid the problems that the conventional manual polishing and burr removing effect is uneven, or a reverse plate is often arranged in a single-sided machine grinding plate and the like due to the missed polishing of individual holes, effectively ensure the burr removing effect of the drilling hole, and prevent the copper-free defects of copper wires and dry film broken holes in the hole from occurring in the post-processing process.
In order to solve the above technical problem, the present invention provides a method for removing burrs of a drill hole, comprising the following steps:
s1, grinding the orifices on the upper and lower surfaces in the copper deposition pretreatment after the production plate is drilled;
s2, grinding and coarsening the whole board surface of the production board through a sand belt;
and S3, performing pressurized spraying water washing treatment on the production plate, and stopping for 5-10S when the whole production plate moves to a working position of the pressurized spraying water washing so that the pressurized spraying water can fully wash the orifices and the inner parts of the holes.
Further, in step S1, the openings on the upper and lower surfaces of the production board are ground by a double-sided board grinder.
Further, in step S3, the production board is moved to the working position of the pressurized spray water washing by the production line, and the production line is stopped for 5-10S while the production board is entirely moved to the working position of the pressurized spray water washing.
Further, in step S3, the pressure of the pressurized spray water is 0.8-2.5kg/cm2。
Further, the following steps are included between steps S1 and S2:
and S11, performing dust removal treatment on the production board to remove dust on the board surface and in the holes.
Further, step S3 is followed by the following steps:
and S4, sequentially washing and drying the production board.
Further, the plate grinding device for grinding the plate in the step S1, the dust removing device for removing dust, the plate grinding device for grinding the plate in the step S2, the water washing device for twice water washing, and the drying device for drying are sequentially arranged on the same production line, so that full-automatic plate grinding and copper deposition pretreatment plate grinding are realized.
Furthermore, the production board is a multilayer board formed by pressing an inner core board and an outer copper foil into a whole through a prepreg.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the plate grinding process is carried out twice, and the orifices at the upper and lower exemptions of the production plate are ground during the first plate grinding, so that the problems that the existing manual grinding and burr removing effect is uneven or individual holes are missed to be ground, and reverse plates are often placed during the single-side machine plate grinding can be avoided, the burr removing effect of the drilled orifice is effectively ensured, and then the copper surface is uniformly ground after the secondary plate surface grinding, so that the quality of the PCB is ensured; through dust removal treatment and pressurized spraying water washing treatment, the adhesion between the flash and the plate can be effectively broken by using a high-pressure water column, so that dust and flash in the hole opening and the hole can be further removed, and the defect that copper wires and dry film hole-breaking holes in the hole have no copper in the post-processing procedure is avoided; the plate grinding device for twice plate grinding, the dust removal device for dust removal, the washing device for twice washing and the drying device for drying are sequentially arranged on the same production line (namely the production line for copper precipitation pretreatment), plate surface cleaning, copper surface roughening and orifice burr removing operation can be finished by directly passing through one production line, and a special flow for removing the orifice burr of the drilled hole is cancelled, so that the flow is simplified, the whole operation process is automatic operation, manual carrying actions can be reduced, the production efficiency is improved, and the aim of lean production is fulfilled.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
In the manufacturing method of a circuit board shown in this embodiment, the method can effectively remove the aperture flash, and sequentially includes the following processing steps:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layers on the two surfaces of the core board is 0.5 OZ.
(2) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And (3) laminating: and (3) brown-oxidizing at the speed of brown-oxidizing according to the thickness of the bottom copper, sequentially laminating the core plate, the prepreg and the outer copper foil according to requirements, and then pressing the laminated plate by selecting proper lamination conditions according to the Tg of the plate to form the production plate.
(4) Drilling: according to the existing drilling technology, drilling processing is carried out on the production plate according to design requirements.
(5) Copper precipitation pretreatment: the method comprises the following steps:
a. polishing the orifices on the upper and lower surfaces of the production plate by adopting a double-sided plate polishing machine for removing burrs at the orifices;
b. carrying out dust removal treatment on the production board for removing dust on the board surface and in the holes; specifically, the dust can be removed by blowing with high-pressure air or by sucking air.
c. Then, grinding and coarsening the whole plate surface of the production plate by using an abrasive belt grinding machine;
d. carrying out pressurized spraying and water washing treatment on the production plate, moving the production plate to a working position of pressurized spraying and water washing by using a production line, pausing for 5-10s when the whole production plate moves to the working position of pressurized spraying and water washing, and continuously washing the production plate by using pressurized water so that the pressurized spraying water fully washes orifices and the inside of the orifices to ensure the washing effect; specifically, the water pressure of the pressurized spraying and water washing is 0.8-2.5kg/cm2；
e. And then sequentially carrying out cleaning and drying treatment on the production plate.
In the above, the plate grinding device (i.e. the double-sided plate grinding machine) for grinding the plate in the step a, the dust removing device for removing dust, the plate grinding device (i.e. the abrasive belt grinding machine) for grinding the plate in the step c, the washing device for twice water washing (i.e. pressurized spray water washing and clear water washing), and the drying device for drying are sequentially arranged on the same production line, so that the full-automatic plate grinding and the plate grinding before copper precipitation are realized; in practice, the production line is also provided with a plate placing device in front of the double-sided plate grinding machine, and a plate collecting device behind the drying device.
(6) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(7) Electroplating the whole plate: and performing full-plate electroplating for 120min at the current density of 18ASF to increase the thickness of the hole copper and the plate surface copper layer.
(8) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(9) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(10) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(11) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(12) And forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(13) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(14) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(15) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (8)
1. A method for removing burrs of a drilling hole is characterized by comprising the following steps:
s1, grinding the orifices on the upper and lower surfaces in the copper deposition pretreatment after the production plate is drilled;
s2, grinding and coarsening the whole board surface of the production board through a sand belt;
and S3, performing pressurized spraying water washing treatment on the production plate, and stopping for 5-10S when the whole production plate moves to a working position of the pressurized spraying water washing so that the pressurized spraying water can fully wash the orifices and the inner parts of the holes.
2. The method of claim 1, wherein in step S1, the holes on the upper and lower surfaces of the production board are ground by a double-sided board grinder.
3. The method of claim 1, wherein in step S3, the production board is moved to the working position of the pressurized spray water washing by the production line, and the production line stops for 5-10S when the production board is moved to the working position of the pressurized spray water washing.
4. The method of claim 3, wherein the water pressure of the pressurized spraying water washing in step S3 is 0.8-2.5kg/cm2。
5. The method of claim 1, further comprising the steps between steps S1 and S2 of:
and S11, performing dust removal treatment on the production board to remove dust on the board surface and in the holes.
6. The method of claim 5, further comprising the following steps after step S3:
and S4, sequentially washing and drying the production board.
7. The method for removing the burrs of the hole of a drilled hole according to claim 6, wherein the plate grinding device for grinding the plate, the dust removing device for removing the dust in step S1, the plate grinding device for grinding the plate in step S2, the water washing device for twice water washing, and the drying device for drying are sequentially arranged on the same production line, so as to realize the full-automatic plate grinding and the plate grinding before copper precipitation.
8. The method according to claim 1, wherein the production board is a multi-layer board formed by laminating an inner core board and an outer copper foil together by a prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911008095.0A CN110831333A (en) | 2019-10-22 | 2019-10-22 | Method for removing burrs of drilling hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911008095.0A CN110831333A (en) | 2019-10-22 | 2019-10-22 | Method for removing burrs of drilling hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110831333A true CN110831333A (en) | 2020-02-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911008095.0A Pending CN110831333A (en) | 2019-10-22 | 2019-10-22 | Method for removing burrs of drilling hole |
Country Status (1)
| Country | Link |
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| CN (1) | CN110831333A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739018A (en) * | 2020-12-14 | 2021-04-30 | 深圳市瀚鼎电路电子有限公司 | Processing method of printed circuit board for 5G antenna |
| CN114206004A (en) * | 2021-11-18 | 2022-03-18 | 昆山万源通电子科技股份有限公司 | CEM-1 plate drilling burr improving process |
| CN114599162A (en) * | 2022-03-25 | 2022-06-07 | 景旺电子科技(龙川)有限公司 | Circuit board burr processing method and circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102416587A (en) * | 2011-09-29 | 2012-04-18 | 东莞生益电子有限公司 | Board grinding method for removing orifice burrs of printed circuit board (PCB) |
| CN102883558A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Manufacturing method of single plating hole copper |
| CN104918411A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Orifice burr removing method and apparatus |
-
2019
- 2019-10-22 CN CN201911008095.0A patent/CN110831333A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102416587A (en) * | 2011-09-29 | 2012-04-18 | 东莞生益电子有限公司 | Board grinding method for removing orifice burrs of printed circuit board (PCB) |
| CN102883558A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Manufacturing method of single plating hole copper |
| CN104918411A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Orifice burr removing method and apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739018A (en) * | 2020-12-14 | 2021-04-30 | 深圳市瀚鼎电路电子有限公司 | Processing method of printed circuit board for 5G antenna |
| CN114206004A (en) * | 2021-11-18 | 2022-03-18 | 昆山万源通电子科技股份有限公司 | CEM-1 plate drilling burr improving process |
| CN114599162A (en) * | 2022-03-25 | 2022-06-07 | 景旺电子科技(龙川)有限公司 | Circuit board burr processing method and circuit board |
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Application publication date: 20200221 |