CN104918411A - Orifice burr removing method and apparatus - Google Patents
Orifice burr removing method and apparatus Download PDFInfo
- Publication number
- CN104918411A CN104918411A CN201510249726.3A CN201510249726A CN104918411A CN 104918411 A CN104918411 A CN 104918411A CN 201510249726 A CN201510249726 A CN 201510249726A CN 104918411 A CN104918411 A CN 104918411A
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- China
- Prior art keywords
- grinding machine
- layer sheet
- plate
- machine
- aperture burr
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention belongs to the circuit board production technical field and relates to an orifice burr removing method and apparatus. The method of the invention mainly comprises the following steps that: an abrasive band grinding machine and a precision grinding machine are additionally adopted; the surface of a multilayer board is ground through the abrasive band grinding machine; the surface of the multilayer board is ground through the precision grinding machine; and then, the surface of the multilayer board is ground through a rough grinding machine. With the method of the invention adopted, the cutting output of a board grinding section can be increased, so that orifice burrs can be completely cut off assuredly, and therefore, problems such as hidden troubles in quality which are caused by inexistence of copper in orifices or cooper wire formation in the orifices which are further caused by a situation that a dry film is pierced in a following production process can be solved; and the abrasive band grinding machine and the precision grinding machine are in line connection with the rough grinding machine, so that the processing efficiency of the orifice burrs can be improved.
Description
Technical field
The present invention relates to circuit board making technical field, particularly relate to a kind of method and the device of removing aperture burr.
Background technology
PCB (Printed Circuit Board) is one of vitals of electronics industry, is the carrier of the supporter of electronic devices and components, electrical connection.Along with the continuous renewal of electronics applications technology and the perfect of function, design more and more precision, the densification and high performance of PCB.For multi-layer PCB, by holing and making hole metallization to realize circuit turn-on between layers, existing flow process generally: front operation makes multi-layer sheet → boring → kibbling mill nog plate → sink copper → electric plating of whole board → rear operation.But, on multilayer boards after boring, easily there is burr at aperture place, especially the multi-layer sheet that outer layers of copper is thicker, aperture burr situation is more serious, although can remove portion burr by kibbling mill nog plate, but because the polish-brush amount of kibbling mill nog plate is little, after nog plate, the burr at aperture place is still protruding, negative film technique makes in the process of outer-layer circuit, paste dry film and be easily punctured, thus there is the quality defects such as having no copper in the holes, or aperture place burr is not cut off but has been extruded in hole after kibbling mill nog plate, copper wire can be formed in hole after electric plating of whole board, there is quality hidden danger.
Summary of the invention
The method that the present invention is directed to existing making plated-through hole is difficult to remove aperture place burr completely and causes being formed in having no copper in the holes or hole the problem of the quality hidden danger such as copper wire, there is provided a kind of method that effectively can remove aperture place burr, and application the method removes the device of aperture place burr.
For achieving the above object, the present invention by the following technical solutions.
Remove a method for aperture burr, comprise the following steps:
After S1, on multilayer boards boring, to polish multiple-plate surface with amary tape grinding machine; Described multi-layer sheet comprises inner plating, prepreg and outer copper foil, and described inner plating and outer copper foil are integrated by prepreg pressing.
Preferably, abrasive band model is adopted to be that 600 object amary tape grinding machines are polished multiple-plate surface.
Preferred, adopt amary tape grinding machine polishing multiple-plate surface time, nog plate electric current is 4-5A, and wear scar width is 10-16mm.
S2, blow multi-layer sheet with blower fan, by the dust blowout in multi-layer sheet surface and hole.
S3, multiple-plate surface of polishing with precision lapping machine.
Preferably, described precision lapping machine is provided with four models is 320 object adhesive-bonded fabric polish-brushes.
Preferred, during surface multiple-plate with precision lapping machine polishing, nog plate electric current is 2.6-3.0A, and wear scar width is 10-16mm.
S4, multiple-plate surface of polishing with kibbling mill.
Preferably, the polish-brush of described kibbling mill comprises a circular shaft, and the surface of described circular shaft is fixed with nylon yarn.
Preferred, during surface multiple-plate with kibbling mill polishing, wear scar width is 10-16mm.
S5, wash multi-layer sheet clearly with water, then dry multi-layer sheet.
A kind of device applying said method removal aperture burr, comprise connect successively enter plate conveyer, dust cleaning mechanism, inspection body, kibbling mill, water washing mechanism and drier, describedly enter also to be provided with abrasive band grinding mechanism before plate conveyer, described abrasive band grinding mechanism comprises the first amary tape grinding machine and the second amary tape grinding machine, is provided with a panel turnover machine between described first amary tape grinding machine and the second amary tape grinding machine.
Preferably, a precision lapping machine is set between inspection body and kibbling mill.
Compared with prior art, the invention has the beneficial effects as follows: the present invention is by increasing amary tape grinding machine and precision lapping machine, first with amary tape grinding machine polishing multi-layer sheet surface, then to polish multiple-plate surface with precision lapping machine, and then to polish multiple-plate surface with kibbling mill, the cutting output of nog plate section can be increased, thus ensure that aperture burr is completely severed removing, solve dry film in rear operation manufacturing process and be punctured the problem causing forming the quality hidden danger such as copper wire in having no copper in the holes or hole.By amary tape grinding machine and precision lapping machine and kibbling mill line, the treatment effeciency of aperture burr can be improved.
Accompanying drawing explanation
Fig. 1 is the structural representation of the device removing aperture burr in embodiment;
Fig. 2 is the structural representation of the first amary tape grinding machine, the second amary tape grinding machine and panel turnover machine in embodiment in abrasive band grinding mechanism.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment
With reference to Fig. 1-2, the present embodiment provides a kind of method removing aperture burr, and applies the device that this kind of method removes aperture burr.
First, according to the board production process of prior art, the substrate that sawing sheet obtains for the preparation of each inner plating is carried out to base material.After conventional pre-treatment is carried out to substrate, successively by being coated with wet film, exposure, development on substrate, etching, moving back membrane process (negative film technique), substrate makes inner line figure, thus obtained each inner plating.Checked by internal layer AOI and assess the quality of each piece of inner plating.
Then, before adopting existing pressing, inner plating brown technique carries out brown process to inner plating, makes on inner plating, generate one deck brown oxide, makes the surface coarsening of inner plating.Then according to design data, inner plating, prepreg, outer copper foil are carried out walkthrough plate, then carries out pressing, inner plating and outer copper foil pressing are integrated, form multi-layer sheet.
Then, hole on multilayer boards according to design data.
Before multi-layer sheet being carried out to heavy copper and electric plating of whole board process and making hole metallization, first aperture burr process is gone to multi-layer sheet.
The method removing aperture burr comprises the following steps:
(1) to polish multiple-plate surface with amary tape grinding machine;
(2) multi-layer sheet is blown with blower fan, by the dust blowout in multi-layer sheet surface and hole;
(3) to polish multiple-plate surface with precision lapping machine;
(4) to polish multiple-plate surface with kibbling mill;
(5) multi-layer sheet is clearly washed with water, then dry multi-layer sheet.
Remove the device of aperture burr in conjunction with the following stated, go the concrete grammar of aperture burr as follows to the multi-layer sheet after boring:
The device removing aperture burr as shown in Figure 1, comprise connect successively first enters plate conveyer 1, abrasive band grinding mechanism 2, second enters plate conveyer 3, dust cleaning mechanism 4, inspection body 5, precision lapping machine 6, kibbling mill 7, water washing mechanism 8, drier 9 and ejecting plate conveyer 10.Shown abrasive band grinding mechanism 2 comprises the first amary tape grinding machine 21, second amary tape grinding machine 23 and panel turnover machine 22, as shown in Figure 2.
First enters plate conveyer 1 for automatic suction hanging machine, and automatic suction hanging machine moves on the first amary tape grinding machine 21 by negative pressure absorbing multi-layer sheet and by multi-layer sheet.Can realize automatically entering plate by automatic suction hanging machine, save manpower.
First amary tape grinding machine 21 and the second amary tape grinding machine 23 all use model to be 600 object abrasive bands.Multi-layer sheet when the first amary tape grinding machine 21, the first amary tape grinding machine 21 polish multiple-plate one surface; Then multi-layer sheet is through panel turnover machine 22, and panel turnover machine 22 overturns multi-layer sheet, and multiple-plate upper and lower surface is exchanged; Then multi-layer sheet through the second amary tape grinding machine 23, second amary tape grinding machine 23 polish multiple-plate another surface.When first amary tape grinding machine 21 and the second amary tape grinding machine 23 pairs of multi-layer sheet carry out polish-brush, nog plate Current Control is at 4-5A, and control point is 4.5A; Wear scar width controls at 10-16mm, and control point is 13mm.
Multiple-plate two surfaces all enter second and enter plate conveyer 3 after amary tape grinding machine polishing, second to enter plate conveyer 3 be a conveyer belt, one infrared inductor 31 is installed on the conveyor belt, multiple-plate thickness can be measured, the thickness of slab data adjustment precision grinder 6 that can measure according to infrared inductor 31 and the polish-brush electric current of kibbling mill 7 by infrared inductor 31.
Second enters plate conveyer 3 is delivered to dust cleaning mechanism 4 by multi-layer sheet.Be provided with high pressure positive blower in dust cleaning mechanism 4, multi-layer sheet, can by the dust blowout in multi-layer sheet surface and hole by high pressure positive blower through high pressure positive blower.
After dust cleaning mechanism 4 clears up dust, multi-layer sheet enters inspection body 5.In inspection body 5, by Manual Visual Inspection, adopt the mode of sampling observation, observe the situation of aperture burr on multi-layer sheet.
Multi-layer sheet on inspection mechanism 5 is transferred into precision lapping machine 6 after checking.It is 320 object adhesive-bonded fabric polish-brushes that precision lapping machine 6 is provided with four models, carries out height and cuts nog plate, remove aperture burr further by precision lapping machine 6 to multiple-plate upper and lower surface.When precision lapping machine 6 pairs of multi-layer sheet carry out polish-brush, nog plate Current Control is at 2.6-3.0A, and control point is 2.8A; Wear scar width controls at 10-16mm, and control point is 13mm.
Multi-layer sheet continues to be transferred into kibbling mill 7, and the polish-brush on kibbling mill 7 comprises a circular shaft, is fixed with nylon yarn on the surface of circular shaft, and model is 320 orders or 500 orders.By the polish-brush of the kibbling mill 7 that runs up, the dirt on multi-layer sheet surface can be scrubbed, make multi-layer sheet surface form uniform roughness, when making heavy copper, increase the adhesive force of copper on multi-layer sheet surface.When kibbling mill 7 pairs of multi-layer sheet carry out polish-brush, wear scar width controls at 10-16mm, and control point is 13mm, and be 320 object polish-brushes for model, nog plate Current Control is at 2.4-3.4A, and control point is 2.9A, and electric current is for reference only worth, and is as the criterion with wear scar width; Be 500 object polish-brushes for model, nog plate Current Control is at 2.0-3.0A, and control point is 2.5A, and electric current is for reference only worth, and is as the criterion with wear scar width.
Multi-layer sheet respectively through amary tape grinding machine 21,23, after precision lapping machine 6 and kibbling mill 7 polish, entering water washing mechanism 8, to carry out washing clean.Pressure (hydraulic) water washing trough, ultrasonic dip tank, water under high pressure washing trough, swing pressure (hydraulic) water washing trough and spray groove is provided with successively in water washing mechanism 8.Multi-layer sheet is through pressure (hydraulic) water washing trough, and the water pump in pressure (hydraulic) water washing trough is to multi-layer sheet injection water, and hydraulic pressure is 2.0-3.0Kg/cm
2, clean the residue in multi-layer sheet surface and hole; Multi-layer sheet embathes in ultrasonic dip tank, and the delivery efficiency of ultrasonic dip tank is 60-100%, is processed the residue in multi-layer sheet surface and hole by ultrasonic wave; Multi-layer sheet is through water under high pressure washing trough, and the high-pressure hydraulic pump in water under high pressure washing trough is to multi-layer sheet injection water, and hydraulic pressure is 10-20Kg/cm
2, clean the residue in multi-layer sheet surface and hole further; Then make multi-layer sheet enter swing pressure (hydraulic) water washing trough, utilize wiggly pressure (hydraulic) water to clean, hydraulic pressure is 70-80Kg/cm
2, the remnant in plate face and hole is rinsed; Finally make multi-layer sheet through spray groove, utilize clean clear water spray multi-layer sheet, discharge is 4-6L/min, ensures that multi-layer sheet is clean clean.
Multi-layer sheet, after water washing mechanism 8 cleans, enters drier 9.Be provided with in drier 9 that sponge sucks in water successively section, the high wind section of drying up and hot blast drying section.Sponge sucks in water, section utilizes water-absorbing sponge to draw the moisture on multi-layer sheet surface; In the high wind section of drying up, by air blast by wind to multi-layer sheet, make multi-layer sheet surface and hole in moisture be dried; In hot blast drying section, by air-heater, hot blast is blowed to multi-layer sheet, the temperature controlling hot blast is 70-80 DEG C, is dried up by the moisture in multi-layer sheet surface and hole further.
After multi-layer sheet drying mechanism 9 carries out abundant drying, complete the process of removing aperture burr.By ejecting plate conveyer 10, multi-layer sheet is sent in next production process, carries out rear operation processing.
After deburring process is carried out to multi-layer sheet, start to carry out heavy copper and electric plating of whole board process, make hole metallization, obtained plated-through hole.Make outer-layer circuit (positive blade technolgy) and solder mask on multilayer boards according to prior art again, and carry out the rear operations such as surface treatment, excision forming, quality testing successively, obtained PCB.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (9)
1. remove a method for aperture burr, it is characterized in that, comprise the following steps:
After S1, on multilayer boards boring, to polish multiple-plate surface with amary tape grinding machine; Described multi-layer sheet comprises inner plating, prepreg and outer copper foil, and described inner plating and outer copper foil are integrated by prepreg pressing;
S2, blow multi-layer sheet with blower fan, by the dust blowout in multi-layer sheet surface and hole;
S3, multiple-plate surface of polishing with precision lapping machine;
S4, multiple-plate surface of polishing with kibbling mill;
S5, wash multi-layer sheet clearly with water, then dry multi-layer sheet.
2. a kind of method removing aperture burr according to claim 1, is characterized in that, in step S1, adopts abrasive band model to be that 600 object amary tape grinding machines are polished multiple-plate surface.
3. a kind of method removing aperture burr according to claim 2, is characterized in that, in step S1, when adopting the multiple-plate surface of amary tape grinding machine polishing, nog plate electric current is 4-5A, and wear scar width is 10-16mm.
4. a kind of method removing aperture burr according to claim 1, it is characterized in that, in step S3, it is 320 object adhesive-bonded fabric polish-brushes that described precision lapping machine is provided with four models.
5. a kind of method removing aperture burr according to claim 4, is characterized in that, in step S3, during surface multiple-plate with precision lapping machine polishing, nog plate electric current is 2.6-3.0A, and wear scar width is 10-16mm.
6. a kind of method removing aperture burr according to claim 1, it is characterized in that, in step S4, the polish-brush of described kibbling mill comprises a circular shaft, and the surface of described circular shaft is fixed with nylon yarn.
7. a kind of method removing aperture burr according to claim 6, is characterized in that, in step S3, during surface multiple-plate with kibbling mill polishing, wear scar width is 10-16mm.
8. remove the device of aperture burr for one kind, comprise connect successively enter plate conveyer, dust cleaning mechanism, inspection body, kibbling mill, water washing mechanism and drier, it is characterized in that, describedly before entering plate conveyer, be also provided with abrasive band grinding mechanism, described abrasive band grinding mechanism comprises the first amary tape grinding machine and the second amary tape grinding machine, is provided with a panel turnover machine between described first amary tape grinding machine and the second amary tape grinding machine.
9. a kind of device removing aperture burr according to claim 8, is characterized in that, be provided with a precision lapping machine between described inspection body and kibbling mill.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510249726.3A CN104918411B (en) | 2015-05-15 | 2015-05-15 | A kind of method and device removing aperture burr |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510249726.3A CN104918411B (en) | 2015-05-15 | 2015-05-15 | A kind of method and device removing aperture burr |
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| CN104918411A true CN104918411A (en) | 2015-09-16 |
| CN104918411B CN104918411B (en) | 2019-02-12 |
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| CN201510249726.3A Active CN104918411B (en) | 2015-05-15 | 2015-05-15 | A kind of method and device removing aperture burr |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682379A (en) * | 2016-01-25 | 2016-06-15 | 东莞联桥电子有限公司 | Process for rapidly fabricating multi-layer circuit board |
| CN106061116A (en) * | 2016-06-23 | 2016-10-26 | 江西景旺精密电路有限公司 | Novel method for removing porthole flashing of PCB |
| CN107072046A (en) * | 2017-02-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of pcb board and its outer-layer circuit preparation method |
| CN108580407A (en) * | 2018-01-23 | 2018-09-28 | 滁州英诺信电器有限公司 | Base material cleaning procedure before printing |
| CN109587968A (en) * | 2018-12-11 | 2019-04-05 | 深圳崇达多层线路板有限公司 | One kind preventing consent or the undesirable PCB production method of plated hole |
| CN109968166A (en) * | 2019-03-19 | 2019-07-05 | 广州兴森快捷电路科技有限公司 | The grinding method and grinding device of circuit board plug socket resin |
| CN110831333A (en) * | 2019-10-22 | 2020-02-21 | 大连崇达电路有限公司 | Method for removing burrs of drilling hole |
| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
| CN111300218A (en) * | 2019-11-27 | 2020-06-19 | 电子科技大学中山学院 | Nail gun casting flash grinding process |
| CN111716172A (en) * | 2020-06-24 | 2020-09-29 | 夏春辉 | Novel grinding method for circuit board burrs |
| CN112492764A (en) * | 2021-01-27 | 2021-03-12 | 四川英创力电子科技股份有限公司 | Method for eliminating solder resist ink in through hole of printed circuit board |
| CN112631070A (en) * | 2020-12-23 | 2021-04-09 | 江苏高光半导体材料有限公司 | Method for removing burrs at hole edge on mask |
| CN116495449A (en) * | 2023-02-21 | 2023-07-28 | 广东金凯智能装备有限公司 | High-efficient circuit board turn-over stacking device |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682379A (en) * | 2016-01-25 | 2016-06-15 | 东莞联桥电子有限公司 | Process for rapidly fabricating multi-layer circuit board |
| CN106061116A (en) * | 2016-06-23 | 2016-10-26 | 江西景旺精密电路有限公司 | Novel method for removing porthole flashing of PCB |
| CN106061116B (en) * | 2016-06-23 | 2019-04-26 | 江西景旺精密电路有限公司 | A kind of method that pcb board removes aperture burr |
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| CN109968166A (en) * | 2019-03-19 | 2019-07-05 | 广州兴森快捷电路科技有限公司 | The grinding method and grinding device of circuit board plug socket resin |
| CN110831333A (en) * | 2019-10-22 | 2020-02-21 | 大连崇达电路有限公司 | Method for removing burrs of drilling hole |
| CN111300218B (en) * | 2019-11-27 | 2021-08-03 | 电子科技大学中山学院 | Nail gun casting flash grinding process |
| CN111300218A (en) * | 2019-11-27 | 2020-06-19 | 电子科技大学中山学院 | Nail gun casting flash grinding process |
| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
| CN111716172A (en) * | 2020-06-24 | 2020-09-29 | 夏春辉 | Novel grinding method for circuit board burrs |
| CN112631070A (en) * | 2020-12-23 | 2021-04-09 | 江苏高光半导体材料有限公司 | Method for removing burrs at hole edge on mask |
| CN112492764A (en) * | 2021-01-27 | 2021-03-12 | 四川英创力电子科技股份有限公司 | Method for eliminating solder resist ink in through hole of printed circuit board |
| CN112492764B (en) * | 2021-01-27 | 2021-04-20 | 四川英创力电子科技股份有限公司 | Method for eliminating solder resist ink in through hole of printed circuit board |
| CN116495449A (en) * | 2023-02-21 | 2023-07-28 | 广东金凯智能装备有限公司 | High-efficient circuit board turn-over stacking device |
| CN116495449B (en) * | 2023-02-21 | 2023-09-29 | 广东金凯智能装备有限公司 | High-efficient circuit board turn-over stacking device |
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| CN104918411B (en) | 2019-02-12 |
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