JPS63278752A - Polishing device for printed circuit board - Google Patents

Abstract

PURPOSE:To enable even a small and extremely thin printing circuit board to be secured firmly to a conveyor belt and polished properly and automatically by adsorbing the board to the conveyor with an adsorption device. CONSTITUTION:A printing circuit board P is carried on a conveyor belt 4 and when the board P under carriage reaches the position of an adsorption device 12, the adsorption force thereof reaches the board P via many openings 11 of the conveyor belt 4, and the board P is adsorbed to the conveyor belt 4 by the adsorption force. And the board P under carriage is polished with an abrasive member 7 and rust, scratches, stains and the like are properly removed from the surface of the P. Furthermore, the board P is smoothed, activated, roughness treated and aligned. Even if the printing circuit board P is small and extremely thin, the leading end thereof is free from being entrapped, kicked off and thrown away by the rotating abrasive member 7. Also, the board P is entirely free from being torn off, bent, fractured and damaged otherwise. Consequently, proper and automatic polishing can be ensured.

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a substrate polishing apparatus. For example,
The present invention relates to a mechanical polishing device used in the manufacturing process of printed wiring boards.

"Conventional technology" In recent years, with the remarkable progress in miniaturization and weight reduction of electronic devices,
The circuit patterns are also becoming more dense, and printed wiring boards are also rapidly becoming smaller and thinner. In addition, ceramic, ferrite, and glass materials, which are relatively expensive but have good heat dissipation and high heat resistance, are now being used instead of conventional epoxy and phenolic resins. There is. Printed wiring boards made of these materials are also characterized by their small size, several tens of millimeters.

In this way, higher density, lighter weight, and smaller size.

In the manufacturing process of printed layout IIA boards, which are becoming increasingly thinner, rust, dirt, etc. on the surface of the copper foil after cutting and etching the board material are removed using polishing materials such as puffs and brushes, thereby smoothing the outer surface. Polishing equipment that performs activating, roughening, and finishing processes is extremely important.

That is, if such processing is inadequate, the circuit pattern on the printed wiring board may become disconnected, short-circuited, blurred, etc., and this may cause a large loss to the heart of the circuit.

Therefore, conventional polishing apparatuses for printed wiring boards, etc., are as follows, for example.

FIG. 4 is a front view of the conventional example, and FIG. 5 is an enlarged front view of the main parts thereof.

In other words, the conventional polishing apparatus includes a conveyor belt 4 which is driven by a motor which is a drive source and which runs over a platen plate 3 in the direction of the arrow through a rotating roller 2, and a motor which is a drive source 5 and is located opposite to the conveyor belt 4. Each polishing member 7 was attached to a roll shaft 6 rotated by the polishing member 7, and presser rolls 8 were provided on both the front and rear sides of each polishing member 7.

The printed wiring board P carried in from the carry-in section 9 is
Conveyor belt) 417) As it travels, it is conveyed in the direction of the arrow, and while being pressed onto the conveyor belt 4 by at least one of the presser rolls 8 and conveyed, it is polished by the rotating polishing member 7, and the conveyor belt 417 is polished by the rotating polishing member 7. It was about to be removed from the city.

"Problems to be Solved by the Invention" By the way, the following problems have been pointed out in such conventional polishing apparatuses for printed wiring boards P, etc.

Since the previous printed wiring board P was manufactured with a relatively large cutting size partly due to productivity issues, the conventional polishing equipment could be used to cope with the problem, and there were no particular problems.

However, as mentioned above, electronic devices have become smaller in recent years.

Along with the reduction in weight, the printed wiring board P has also become smaller.

It has been pointed out that conventional polishing equipment cannot effectively meet the current demand for ultra-thin materials.

That is, in the conventional polishing apparatus, due to its structure, the presser rolls 8 cannot be disposed close to the polishing member 7 within its diameter. Therefore, printed wiring boards P that have been miniaturized in recent years with extremely small cut dimensions, for example, 150 mm or less on the side, cannot be held down even if you try to polish them while being held down by the presser roll 8, and are thrown off, making polishing difficult. It had become. In particular, since it is extremely thin, there is a problem in that polishing is often not carried out because the end portion of the polishing member 7 is flipped up or blown away by the rotation of the polishing member 7. Moreover, it is a relatively expensive ceramic type.

Curling, bending, breakage, etc. occurred at the front and rear ends of the printed wiring board P made of ferrite, glass, etc., and there were other problems in performing sufficient smooth polishing.

Therefore, by reducing the diameter of the polishing member 7, the distance d between the centers of both presser rolls 8 is reduced, resulting in a distance of 150 mm.
Although it was considered to be compatible with the printed wiring board P which has become smaller and ultra-thin, a certain diameter corresponding to the diameter of the roll shaft 5 and the core metal diameter of the polishing member 7 is required, and the above-mentioned center distance It is considered difficult to approach the distance d to 150 mm or less, and the above-mentioned problem has not been solved.

As described above, it has been difficult to polish a printed wiring board P having a size of, for example, 150 mm or less using a conventional polishing apparatus.

Therefore, this type of printed wiring board P has been partially polished by hand with a scrubber-like abrasive material, but it has been pointed out that there is a problem that stability of quality and mass production cannot be ensured.

Such a problem has been pointed out in the conventional example.

In view of these circumstances, the present invention has been made to solve the problems of the conventional methods described above.The present invention has been made in order to solve the above-mentioned problems of the conventional method. The object of the present invention is to propose a substrate polishing device that can be securely fixed on a conveyor belt and can be polished reliably and automatically.

"Means for Solving the Problems" The technical means of the present invention to achieve this objective are as follows.

This substrate polishing apparatus polishes a substrate being transported by a polishing member attached to a rotating roll shaft, and includes a transport belt and a suction device.

The conveyor belt conveys the substrate and is provided with a large number of holes.

The suction device is located opposite to the polishing member via the conveyor belt.

"Function" Since the substrate polishing apparatus according to the present invention comprises such means, it functions as follows.

First, the substrate is transported by a transport belt.

When the substrate being transported reaches the position of the suction device, the suction force of the suction device is applied to the substrate through the many holes in the transport belt.

As a result, the substrate is attracted to the conveyor belt by the suction force and is conveyed, while being polished by the polishing member, thereby ensuring that rust, scratches, dirt, etc. are removed from the outer surface, and the surface is smoothed, activated, and roughened. processed and arranged.

Even if the board is made smaller and thinner in this way,
The front and rear ends of the polishing member are rolled up by rotation of the polishing member,
There is no possibility of the material being thrown up or blown away, and occurrences of curling, bending, breakage, etc. are also eliminated, making reliable and automatic polishing possible.

"Example" The present invention will be described in detail below based on the example shown in the drawings.

First, the configuration will be explained.

1, 2, and 3 show an embodiment of the substrate polishing apparatus according to the present invention, and FIG. 1 is an enlarged front sectional view of the main part thereof;
FIG. 2 is a front view of the entire structure, and FIG. 3 is a schematic plan view thereof.

First, an outline of the polishing device will be described.

This polishing apparatus is used, for example, in a circuit forming process during the manufacturing process of printed wiring board P.

That is, the circuit forming process involves sequentially carrying out the steps of cutting the material, polishing the outer surface of the copper foil, printing two circuits, drying, etching, removing the printing resist, polishing, cleaning, and drying. This polishing apparatus is used in a polishing process which is a pre-processing and a post-processing process in the circuit forming process.

This polishing device polishes a printed wiring board P being conveyed by a conveyor belt 4 using a polishing member 7 attached to a rotating roll shaft 6.

The polishing member 7 is made of a roll-shaped integral object having a circular cross section, such as a puff or a brush, and is attached to a roll shaft 6 rotated by a drive source 5. The polishing member 7 rotates and comes into contact with the front or back surface of the printed wiring board P being transported to perform mechanical polishing. The printed wiring board P to be polished by the polishing member 7 is made of a copper-clad laminate, ceramics, etc. as a base material, and can be of any size and thickness, but in particular, a printed wiring board P with a side of 150 mm or less, for example, 50 mm. .40. A miniaturized and ultra-thin printed wiring board P with a size of about 30 mm and a wall thickness of 1 mm or less is planned.

The conveyor belt 4 is driven by the drive source 1 and is driven by the rotating roller 2 in the direction indicated by the arrow. A suitable number of rotatable presser rolls 8 are disposed in front and behind the polishing member 7, facing the conveyor belt 4.

In addition, this polishing apparatus uses a conveyor belt 4. in order to polish the front surface and the back surface of the printed wiring board P using the same conveyor module. Polishing member 7. The presser rolls 8 and the like are composed of two sets, each of which is vertically reversed.

The polishing device is roughly like this.

Next, the conveyor belt 4 and the suction device will be described in detail.

The conveyor belt 4 is provided with a large number of holes 11 necessary for suction.

That is, the openings 11 are, for example, small circular through holes, and are formed in large numbers at a predetermined pitch in a straight line or in random arrays in the longitudinal and width directions of the conveyor belt 4. Note that the diameter of the apertures 11, the number of apertures 11 per unit area, the pitch of each aperture 11, etc. are determined by the size of the printed wiring board P to be polished. Moreover, the shape of the opening 11 is
It is possible to take various shapes other than circular.

The suction device 12 is located opposite the polishing member 7 via the conveyor belt 4.

That is, this suction device 12 is composed of a rectangular box-shaped vacuum box, for example, which has an opening on the conveyor belt 4 side as a suction port 13, and the long side of the suction port 13 is at least connected to a presser foot disposed on both the front and rear sides of the polishing member 7. It is longer than the distance d between the centers of the rolls 8 (see Fig. 5), and its short side is the width of the conveyor belt 4, and a bridge is provided in the center of the suction port 13. There is. Further, a platen plate 3 may be attached to the upper edge of the suction port 13 facing upstream and downstream in the conveying direction as shown in the figure. In such a case, there is an advantage that it can more reliably handle a printed wiring board P of any size.

Further, the side wall of the suction device 12 is provided with an exhaust port 14 connected to a vacuum pump (not shown).

A pressure reducing valve is provided between the exhaust port 14 and the vacuum pump, and the pressure reducing valve adjusts the vacuum pressure according to the size of the printed wiring board P, the pressure of the polishing member 7, the rotational force of the polishing member 7, etc. That is, the suction force of the suction device 12 is adjusted as appropriate.

Note that the suction device 12 may be any device that exerts a suction force, and is of course not limited to one that utilizes a vacuum as shown in the illustrated example, and other ventilation means or the like may also be used.

The conveyor belt 4 and the suction device 12 are constructed as described above.

The polishing device looks like this.

Next, its operation etc. will be explained.

First, the printed wiring board P carried out from the previous process is carried into the carry-in section 9. Then, the printed wiring board P is conveyed in the direction of the arrow by the conveyor belt 4 and the presser roll 8.

Then, when the tip of the printed wiring board P approaches the polishing member 7 for surface polishing and reaches the suction port 13 of the suction device 12,
The suction device 12 exerts a suction force on the printed wiring board P through a large number of holes 11 in the conveyor belt 4 .

Therefore, the printed wiring board P is conveyed while its back surface is attracted and fixed to the conveyor belt 4 by the suction force, and its front surface is polished by the rotating polishing member 7.

As a result, rust, scratches, dirt, etc. on the surface caused by cutting and etching in the previous process are reliably removed, and the surface is smoothed.

Activated, roughened and polished.

When the polishing of the surface of the printed wiring board P is completed in this way and the rear end of the printed wiring board P passes through the suction port 13 of the suction device 12, the printed wiring board P is released from the suction force by the suction device 12. It is further conveyed downstream.

Then, the printed wiring board P is transported by the transport belt 4 and the presser roll 8, approaches the polishing member 7 for polishing the back surface, and when its tip reaches the suction port 13 of the suction device 12, the printed wiring board P is transported as described above. The front surface of the printed wiring board P is attracted to the conveyor belt 4, and the back surface of the printed wiring board P is polished by a polishing member 7 for polishing the back surface. After finishing such back polishing, the printed wiring board P is carried out from the carry-out section 10 and headed for the next process.

In this way, even if the printed wiring board P is miniaturized and extremely thin to 150 mm or less, its front and rear ends are rolled up by the rotation of the polishing member 7.

Bounced up, not blown away, turned over again 9
The occurrence of bending, breakage, etc. is eliminated, and reliable and automatic polishing becomes possible. Therefore, in the circuit pattern formed on the printed wiring board P, disconnections, short circuits, blurring, etc. are eliminated, and its quality is significantly improved.

In the above-mentioned embodiment, a polishing apparatus for polishing both the front and back surfaces of the printed wiring board P has been described, but it is of course possible to use a polishing apparatus for single-sided polishing for polishing only one side, such as the front surface.

The above is the explanation of the operation, etc.

Note that the polishing apparatus according to the present invention may be further developed and applied as follows.

First, it is conceivable to provide such a suction device 12 between the conveyor belts 4. That is, such a suction device 12 is provided between the conveyor belts in each process or at each transfer section between the conveyor belts in each process, thereby exerting a suction force on the substrates etc. that are being transferred, thereby downsizing, It is possible to prevent accidents such as extremely thin substrates falling from any of the conveyor belts. In this case, the suction port 13 of the suction device 12 may be fitted with a top cover having an opening similar to the opening 11 described above, or the opening 11 may be provided on the conveyor belt in the same manner as described above. It is necessary to keep it.

For example, in the above-mentioned embodiment, the conveyor belt 4 attached to the polishing member 7 for polishing the front surface, the conveyor belt 4 attached to the polishing member 7 for polishing the back surface, the vicinity of the carry-in section 9, the vicinity of the discharge section 10, and the conveyor belt 4 attached to the polishing member 7 for polishing the front surface. It is conceivable to further provide a suction device 12 near and below the delivery section between the two.

Secondly, contrary to the above-described suction device 12, it is also conceivable to add a jetting means of air or the like. That is, a jetting means such as air is provided on the conveyor belt of each process or especially at the unloading part of the conveyor belt within each process, and the jetting force thereof promotes the separation of the substrates, etc. to be conveyed out from the conveyor belt, etc. As a result, miniaturized and extremely thin substrates and the like do not stick to the conveyor belt due to static electricity, and can be carried out reliably and easily. In this case as well, the injection means is provided with a large number of fine air injection holes.

For example, in the above-mentioned embodiment, it is conceivable to provide the injection means on the discharge section 10.

"Effects of the Invention" As explained above, the substrate polishing apparatus according to the present invention has the following features:
By attracting the substrate to the conveyor belt using a suction device, even if the substrate is downsized or extremely thin, the leading and trailing ends of the substrate will not be caught, thrown up, or blown away by the rotation of the polishing member. In addition, the occurrence of curling, bending, breakage, etc. is eliminated, and it becomes possible to polish reliably and automatically, ensuring stable quality and mass production, which eliminates the problems that existed in conventional examples of this type. Especially in recent years, when relatively expensive materials such as ceramics and ferrites are used, the effects of this technology are remarkable and significant.

[Brief explanation of drawings]

1, 2, and 3 show a substrate polishing apparatus according to the present invention, and FIG. 1 is an enlarged front sectional view of the main part thereof, and FIG.
The figure is a front view showing a part of the whole in section, and FIG. 3 is a schematic plan view of the same. 4 and 5 show a conventional substrate polishing apparatus,
Figure 4 is a front view showing a partial cross section of the whole, Figure 5
The figure is an enlarged front sectional view of the main part. 4... Conveyor belt 6... Roll shaft 7... Polishing member 11... Opening hole 12... Suction device P... Printed wiring board Figure 1 Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] A substrate polishing device that polishes a substrate being transported by a polishing member attached to a rotating roll shaft, comprising: a conveyor belt with a large number of holes for conveying the substrate; A substrate polishing apparatus comprising: a suction device located opposite to the polishing member via the conveyor belt.