JP2003101199A - Cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning device with which the inside of a blind via hole of a printed wiring board is sufficiently and surely cleaned, the printed wiring board is stably carried in the case of cleaning and moisture or drops of water are removed without being stuck and left inside the blind via hole after cleaning. SOLUTION: In a cleaning device 1, first of all, a brush 4 and a suction 5 are adopted while being combined in a cleaning liquid F. Concerning the blind via hole, after the cleaning liquid F is called by the brush part 4, the cleaning liquid F is made to flow in, spouted and removed by suction by a slit-shaped suction port 20 in the suction 5 curving and inclining front and rear sides. Secondly, the slit-shaped suction port 20 is arranged to distribute a suction power or suction power is controlled by a control unit 25. Thirdly, a liquid removing device 32 combining a brush 35 and a suction 36 is added on the downstream side, and moisture or drops of water in the blind via hole are removed.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a cleaning device. That is, the present invention relates to a cleaning device that is used in a manufacturing process of a multilayer type printed wiring board and cleans the inside of a blind via hole formed in a printed wiring board material.

[0002]

<Technical Background> A multilayer printed wiring board has a structure in which circuits and the like are laminated, and a build-up method is known as a manufacturing method thereof. In the build-up method, an insulating layer and a circuit are sequentially laminated on the outer surface of the printed wiring board material, and a connection between the laminated circuits is performed by forming a blind via hole in each insulating layer and plating. Done by.

That is, a multilayer type printed wiring board is manufactured by a build-up method, in which a printed wiring board material to be a core board is manufactured, → an insulating layer is laminated on the printed wiring board material, and a blind via hole is formed in the insulating layer. Formation (drilling), → smoothing with a chemical solution in the blind via hole (desmear), → cleaning in the blind via hole, → drying in the blind via hole, → plating in the blind via hole, followed by steps such as circuit formation. Then, by further laminating an insulating layer, sequentially performing the above steps 1 to 4, and repeating such steps as necessary, a multilayer type print in which an insulating layer and a circuit are laminated on a printed wiring board material which is a core substrate. A wiring board is manufactured.

<< Prior Art >> The blind via hole shown in the above step is formed by making a hole in a resin insulating layer using a laser or the like. Therefore, burrs, burnt residue of resin, fine dust, etc. are generated in the blind via hole formed in this way.
It is attached. Therefore, in order to remove these, the inside of the blind via hole was cleaned in the step, and then the inside of the blind via hole in the step was plated. In this type of conventional example, the cleaning of the inside of the blind via hole in the step is carried out by spraying a cleaning liquid or high-pressure air from a spray nozzle while the printed wiring board material is being conveyed by a conveyor.

[0005]

<Problem to be Solved by the Invention><FirstProblem> The following problems have been pointed out in such a conventional example. Firstly, the cleaning of the blind via hole becomes insufficient and uncertain, and after that, plating is performed with burrs, burnt residue, fine dust, etc. remaining in the blind via hole, which often causes defective plating. Was pointed out. In the above-described conventional example of this type, due to such a plating defect, defective products are likely to occur in the manufacturing process of the multilayer type printed wiring board, the yield is poor, and a problem in cost has been pointed out. .

The inadequacy / uncertainty of cleaning in this type of conventional example will be described in more detail below. a. A large number of blind via holes are formed in the insulating layer laminated on the outer surface of the printed wiring board material, and have a very small diameter and only one surface is opened. That is, the blind via hole has a diameter of 100 μm to 10 μm, which is a very small diameter, and is a so-called blind hole in which only the front surface is open and the back surface is closed by a circuit or an insulating layer. b. Air exists in such blind via holes. c. Therefore, in order to clean the inside of the blind via hole due to these a and b, as in the conventional example of this kind, the method of spraying the cleaning liquid with the spray nozzle is as follows.
It is pointed out that the liquid film (water film) formed between the air and the cleaning liquid in the blind via hole becomes an obstacle, and the cleaning liquid does not sufficiently penetrate and reach the blind via hole, making cleaning difficult and the cleaning efficiency poor. there were. Further, as in the conventional example of this kind, in the method of blowing high-pressure air into the blind via hole instead of the cleaning liquid, the presence of the internal air becomes an obstacle in accordance with the above, and the cleaning power of the high-pressure air is lower than that of the cleaning liquid. Therefore, it was pointed out that the cleaning becomes difficult and the cleaning efficiency is poor. d. Therefore, plating is performed with burr, burnt residue, fine dust and the like remaining in the blind via hole, which causes a problem of plating failure as described above.

<Regarding the Second Problem> Secondly, it has been pointed out that the printed wiring board material transported for cleaning is likely to suffer a waist break accident or an untransportable accident. That is, the printed wiring board has a remarkable tendency to be extremely thin, and the multilayer type printed wiring board is also extremely thinned to a total thickness of about 1.0 mm to 0.4 mm. The thickness of the board material is
Naturally, the thickness is less than that. Therefore, as in the above-mentioned conventional example of this kind, while conveying the printed wiring board material by the conveyor, in order to clean the inside of the blind via hole, spraying a cleaning liquid or high-pressure air with a spray nozzle causes the injection pressure to change. As a result, the ultra-thin printed wiring board material often receives a pressing force, and is often bent or untransportable. In this type of conventional example, stable transportation may be hindered as described above, and a multilayer type printed wiring board manufactured also from this aspect,
It has been pointed out that defective products are liable to be produced and yield is poor, and cost is a problem.

<Regarding Third Problem> Thirdly, in the above-mentioned conventional example of the system in which the cleaning liquid is further sprayed, after the cleaning, the cleaning liquid and its liquid content such as water and water drops are contained in the blind via hole. It was easy to remain attached and remained, and it was pointed out that defective plating occurred also from this aspect. That is, the adhered and residual liquid components are liable to cause plating defects. From this aspect as well, in this type of conventional example, defective products are liable to occur in the multilayer type printed wiring board, the yield is low, and there is a problem in cost. It was pointed out.

<< Regarding the Present Invention >> The cleaning apparatus of the present invention is
In view of such circumstances, the inventors have made earnest research efforts in order to solve the problems of the conventional example.
And firstly, a brush part and a suction part are used in combination in the cleaning liquid, and therefore, with respect to the blind via hole of the printed wiring board material, after the cleaning liquid is drawn in at the tip of the brush part, the front and back are inclined due to bending or the like. The slit-shaped suction port of the suction unit is configured to perform inflow, jet flow, and suction removal of the cleaning liquid. Secondly, the slit-shaped suction port of the suction unit is divided and formed in a plurality of stages with little overlap, or at a slight inclination, or the control unit controls the solenoid valve or ejector pump. It is characterized by controlling. Thirdly, on the downstream side of the cleaning device, a liquid component removing device that employs a combination of a brush part and a suction part is attached to remove liquid components such as water and water droplets that are attached to and remain in the blind via hole. What to do is characterized. Therefore, according to the present invention, firstly, the inside of the blind via hole of the printed wiring board material is sufficiently and surely cleaned, and secondly, the printed wiring board material is stably conveyed during cleaning, and thirdly, the cleaning is performed. It is an object of the present invention to propose a cleaning device that removes liquid components in a blind via hole afterward without adhering and remaining.

[0010]

<< About Each Claim >> The technical means of the present invention for solving such a problem are as follows. First, claim 1 is as follows. The cleaning device according to the first aspect is used in a manufacturing process of a multilayer type printed wiring board, and cleans the inside of the blind via hole of the printed wiring board material. A liquid tank for the cleaning liquid, a conveyer disposed in the cleaning liquid in the liquid tank for sandwiching and carrying the printed wiring board material, and a brush section arranged to face the printed wiring board material to be conveyed, And a suction portion which is located on the downstream side of the brush portion and which is arranged to face the conveyed printed wiring board material.

Claim 2 is as follows. Claim 2
In the cleaning device according to the first aspect of the present invention, a large number of the blind via holes are formed with an extremely small diameter in the insulating layer laminated on the outer surface of the printed wiring board material. The brush portion has a substantially circular cross section and is rotatable by coming into contact with the printed wiring board material being conveyed, and the tip end thereof is sequentially placed in the blind via hole of the printed wiring board material as it rotates. It is characterized in that the cleaning liquid is inserted to stir the air inside, break the liquid film at the boundary, and direct the cleaning liquid toward the blind via hole. Claim 3
About: According to a third aspect of the present invention, in the cleaning apparatus according to the second aspect, the suction section causes the cleaning solution to flow into the blind via hole while removing air based on its suction force, and by the jet flow of the cleaning solution generated by the inflow. Clean the inside of the blind via hole, and
The cleaning liquid after cleaning is sucked and removed from the blind via hole without staying. Claim 4 is as follows. According to a fourth aspect of the cleaning apparatus, in the third aspect, the suction section includes a slit-shaped suction port.
The slit-shaped suction ports are arranged so as to cover the entire width of the printed wiring board material, not along the front-rear transportation direction but along the left and right lateral width directions. The front and rear forming surfaces are gradually inclined forward and backward due to bending while having the slit-shaped suction port as a top, so that the blind via hole is formed between the front and rear surfaces and the printed wiring board material that is horizontally conveyed. Inflow spaces from the front and the rear of the cleaning liquid into the inside are formed.

Next, claim 5 is as follows. According to a fifth aspect of the present invention, in the cleaning apparatus according to the fourth aspect, the slit-shaped suction ports of the suction unit are divided into a plurality of portions at regular intervals in the left-right lateral width direction and are arranged in a plurality of stages in the front-rear transport direction. Has been done. Further, a small overlap is set between the front and rear slit-shaped suction ports for the purpose of dispersing suction force and preventing suction of the printed wiring board material being conveyed. Claim 6 is as follows. According to a sixth aspect of the present invention, in the cleaning apparatus according to the fourth aspect, the slit-shaped suction port of the suction section is provided on the right and left at right angles to the front-rear transport direction for the purpose of dispersing suction force and preventing adsorption to the printed wiring board material being transported. From the width direction of
It is characterized in that it is arranged with a slight inclination toward the transport direction.

Claim 7 is as follows. Claim 7
In the cleaning device of the present invention, in claim 4, the slit-shaped suction port of the suction portion is provided with a group of top members in close contact with each other. Each of the top members is attached to a shaft and is rotatable in the carrying direction, and the slit-shaped suction ports are normally closed. While passing through, the opposing top members of the printed wiring board material are pushed and rotated, and the opposing slit-shaped suction ports are opened toward the printed wiring board material. Characterize. Claim 8 is as follows. Claim 8
The cleaning device according to claim 4, further comprising: an ejector which is connected to the suction part through a pipe to generate a suction pressure which is a suction force; a pressure sensor which detects the suction pressure generated by the ejector; When the suction pressure and the suction force detected by the pressure sensor exceed the risk value that the printed wiring board material to be conveyed is adsorbed, a control unit that outputs a control signal and the pipe are installed. And a solenoid valve for decompression which is switched to open based on a control signal from the control unit. Claim 9 is as follows. According to a ninth aspect of the present invention, in the cleaning device of the eighth aspect,
Instead of the solenoid valve, the pump for the ejector is characterized in that the rotation speed of the pump for the ejector is changed to a lower setting based on a control signal from the control unit.

Claim 10 is as follows. In the cleaning device according to claim 10, in claim 3, a liquid content removing device is attached to the downstream side of the cleaning device, and the liquid content removing device is provided in the blind via hole accompanying the cleaning by the cleaning device. The adhering and remaining water content of the cleaning liquid and water droplets are removed. The liquid content removing device includes a chamber chamber, a conveyor that is disposed in the chamber chamber and transports the printed wiring board material sandwiched therebetween, and a brush portion that is disposed to face the transported printed wiring board material. And a suction portion located on the downstream side of the brush portion and arranged to face the conveyed printed wiring board material. The brush portion has a substantially circular cross section, and is rotatable by contact with the conveyed printed wiring board material, and the tip of the brush portion is sequentially inserted into the blind via hole in association with the rotation so that the cleaning liquid inside is Stir the liquid and direct air into the blind via hole. The suction unit causes air to flow into the blind via hole based on its suction force, and causes the jet flow of the air generated by the inflow to mix the liquid content of the cleaning liquid in the blind via hole into the air. , Sucking and removing from the blind via hole. Claim 11 is as follows. The cleaning apparatus of claim 11 is characterized in that in claim 1, water or an aqueous solution in which a chemical is dissolved is used as the cleaning liquid. Each claim is as such.

<Regarding Operation> Since the present invention is configured as described above, it is as follows. This cleaning device is used in a manufacturing process of a multi-layer type printed wiring board, and cleans the blind via holes of extremely small diameter formed in large numbers in the insulating layer on the outer surface of the printed wiring board material by following the steps below. The printed wiring board material is immersed in the cleaning liquid in the liquid tank and is conveyed by a conveyor. The cleaning liquid consists of water or an aqueous solution of a drug. The printed wiring board material conveyed first passes through the brush section. The brush part rotates in contact with the printed wiring board material, and the tip is sequentially inserted into the blind via hole. → The internal air is agitated and the liquid film is broken, → The cleaning liquid is in the blind via hole. Be called into. Then, the printed wiring board material passes through the suction section.
The suction unit is a. Let the cleaning liquid flow into the blind via hole, and → b. After cleaning the inside with a jet of cleaning liquid, → c. Aspirate the washing solution. Following these steps, the burr in the blind via hole,
Burned dust, fine dust, etc. are sufficiently and reliably washed and removed.

[0016] First, the suction part is provided with a slit-shaped suction port, and the slit-shaped suction port is arranged in the lateral width direction on the left and right of the printed wiring board material, and its front and rear forming surfaces form the slit-shaped suction port. It is tilted back and forth due to the curving and bending. Therefore, an inflow space for the cleaning liquid is formed, and the inflow is promoted. Secondly, the slit-shaped suction port is provided with an assembly of top members facing each other, and each of the top members normally closes the slit-shaped suction port, but when the printed wiring board material passes through. Causes the opposing top member to rotate in the transport direction and opens the opposing slit-shaped suction port toward the printed wiring board material. Therefore, the suction force efficiently acts on the blind via hole without waste, and since only the slit-shaped suction port corresponding to the width size of the printed wiring board material is opened, it is possible to support various width sizes. . Thirdly, the slit-shaped suction ports are divided and formed at regular intervals in the lateral width direction on the left and right sides, and a plurality of suction units provided with such slit-shaped suction ports are arranged in the front and rear transport directions. It is advisable to set a small overlap between the front and rear slit-shaped suction ports. Further, the slit-shaped suction port may be slightly tilted from the lateral width direction on the left and right sides in the front-rear transport direction. By doing so, the suction force is dispersed, and the extremely thin printed wiring board material can be stably transported without being adsorbed to the slit-shaped suction port. Fourth, the suction pressure of the ejector is detected by the pressure sensor, and → if the suction pressure and the suction force exceed the risk value that the printed wiring board material is sucked into the slit-shaped suction port, →
In the control unit, the electromagnetic valve for pressure reduction is switched to open, or the rotation speed of the pump for the ejector is set low.
By doing so, the extremely thin printed wiring board material can be stably conveyed without being adsorbed.

The printed wiring board material cleaned by the cleaning device is supplied to the liquid component removing device and conveyed by the conveyor in the chamber chamber thereof, while passing through the brush part and the suction part and into the blind via hole. The liquid content such as water and water droplets of the cleaning liquid that has adhered and remained is removed. That is, the brush portion rotates in contact with the printed wiring board material, and its tip is sequentially inserted into the blind via hole to stir the residual liquid content of the cleaning liquid inside and draw in air. The suction unit is a. Allow air to flow into the blind via hole, → b. The residual liquid content of the cleaning liquid is mixed in the generated jet flow, and → c. Remove by suction.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION
A detailed description will be given based on an embodiment of the invention shown in the drawings. 1, FIG. 2, FIG. 3, FIG. 4 and the like serve to explain the embodiment of the present invention. FIG. 1 is a side cross-sectional explanatory view of the whole. 2A and 2B are side cross-sectional explanatory views of a main part, FIG. 1A is an example of a brush part, FIG. 2B is an example of a suction part, and FIG.
The figure shows another example of the suction unit. 3 (1) is a side sectional view of the top member in the closed position, FIG. 2 (2) is a side sectional view of the top member in the open position, and FIG. 3 (3) is a plan view of the top member. Is. 4A and 4B are plan explanatory views of the slit-shaped suction port of the suction unit, FIG. 1A shows one example, FIG. 2B shows another example, and FIG. 3C shows another example. FIG. 5 shows an example of a manufacturing process of a multi-layer type printed wiring board. (1) FIG. 1 shows a first step, (2) a second step,
(3) shows the third step, (4) shows the fourth step, (5) shows the fifth step, and (6) shows the sixth step. FIG. 6 is a plan view of a printed wiring board (material).

<< Regarding Printed Wiring Board A >> First, the presumed printed wiring board A will be briefly described with reference to FIG. As electronic equipment has become more sophisticated, more functional, smaller and lighter, its printed wiring board A has also become more precise, finer, ultra-thin, and more flexible. Or both), the density of the circuit B formed in (or both) and the progress of miniaturization are remarkable,
As part of that, CS related to semiconductor chips and packages
P and PBGA have also appeared. The printed wiring board A, which is also called an electronic circuit, has, for example, 500 mm × 5 mm in length and width
00 mm, 250 mm x 330 mm, and the thickness of the insulating base material made of resin or glass cloth is about 1.0 mm to 60 µm, and the circuit B part made of copper foil is about 50 µm to 10 µm. Even in the case of a multi-layer substrate, the total thickness is being extremely thinned to about 1.0 mm to 0.4 mm. The width and spacing of circuit B is also 0.1
mm or less, 70 μm to 20 μm, which is a tendency toward miniaturization.

The printed wiring board A is manufactured by following the following steps, as is well known. First, a copper-clad laminate in which a copper foil is attached to an insulating base material made of resin or glass cloth is prepared. Then, a photosensitive resist is applied or attached in a film form on the outer surface of the printed wiring board material C which is the prepared copper-clad laminate. Then, a circuit photograph, which is a negative film of the circuit B, is applied to the printed wiring board material C and exposed. As a result, the photosensitive resist covering the outer surface of the printed wiring board material C leaves the exposed portion of the circuit B forming portion that has been exposed and cured, and the other unnecessary portion is dissolved and removed by spraying the developing solution. Thereafter, the copper foil on the outer surface of the printed wiring board material A leaves a portion where the photosensitive resist hardens and is covered and protected by the circuit B, and the unnecessary portion where the photosensitive resist is dissolved and removed is a corrosive liquid. It is dissolved, removed and etched by jetting. Then, the remaining hardened photosensitive resist of the circuit B forming portion is dissolved and removed by spraying the stripping liquid, so that the remaining copper foil of the circuit B forming portion is formed on the outer surface of the printed wiring board material C by a predetermined amount. The circuit B is formed, and thus the printed wiring board A is manufactured. The printed wiring board A is manufactured in this way. The printed wiring board A is roughly as described above.

<< About Multi-Layered Printed Wiring Board A >> Next, regarding the multi-layered printed wiring board A,
This will be described with reference to FIG. The multilayer-type printed wiring board A has a structure in which a plurality of circuits B are laminated in multiple layers, and a so-called build-up method has recently been frequently used as a manufacturing method thereof. In the build-up method, the insulating layer D and the circuit B are sequentially stacked one by one on at least one outer surface of the printed wiring board material C that is the core board (core layer). The connection between the multi-layered circuits B is performed by forming blind via holes E in each insulating layer D and plating F on the inner wall thereof.

That is, the manufacture of the multilayer type printed wiring board A by the build-up method is performed by following the steps below. First, as shown in FIG. 5 (1), a printed wiring board material C to be a core board is manufactured and prepared by following the known steps described above. The printed wiring board material C in the illustrated example has circuits B formed on both front and back surfaces. Then, as shown in FIG. 5 (1), an insulating layer D made of resin is laminated on the outer surface of the printed wiring board material C having the circuit B which is the core board by adhesion or another joining method. It Thereafter, as shown in FIG. 5B, a large number of blind via holes E having a very small diameter are formed in the insulating layer D by using a laser or the like. So-called photolithographic processing may be performed instead of the laser. Next, the inner wall of the formed blind via hole E is smoothed by a chemical solution (desmear). (In this case also, the point that the cleaning device 1 can be used will be described in detail later.) Then, the blind via hole E is cleaned.
That is, each blind via hole E formed in the insulating layer D laminated on the outer surface of the printed wiring board material C which is the core board is cleaned using the cleaning device 1.

Then, the inside of the blind via hole E is dried. Then, as shown in FIG. 5C, plating P of the blind via hole E and formation of the circuit B are performed.
That is, the circuit B (conductor pattern) is formed on the outer surface of the insulating layer D by following the known steps described above, for example. Along with this, the inner wall of the blind via hole E in which the circuit B thus formed and the circuit B (circuit B of the printed wiring board material C) already formed under the insulating layer D are interposed between each other. Are electrically connected and connected by plating P with a conductive material. Then, the insulating layer D shown in FIG. 5 (4) is laminated, the blind via hole E shown in FIG. 5 (5) is formed, and the plating P treatment shown in FIG. 5 (6) is performed. The steps are sequentially carried out according to the above-mentioned steps 1 to 3. Afterwards, such steps are repeated as necessary.

By following the above steps, a multilayer type printed wiring board A in which the insulating layer D and the circuit B are sequentially laminated on the printed wiring board material C which is the core substrate is manufactured. In the manufactured multilayer type printed wiring board A, the circuits B are laminated in, for example, 4 to 6 layers, and further about 8 layers. A large number of blind via holes E are formed, for example, about 30,000 per board substrate.
The diameter is about 100 μm (0.1 mm) to 10 μm
It has a very small diameter. The blind via hole (via hole) E is formed in the insulating layer D laminated in multiple layers on the printed wiring board material C, and only the surface is opened during the manufacture of the multilayer type printed wiring board A. The back surface is formed by a so-called blind hole which is closed and closed by the circuit B or another insulating layer D. That is, in the course of manufacturing, the blind via hole E is a hole having only one surface opened (multilayer type printed wiring board A
When the manufacturing is completed, both sides are normally closed by the circuit B and the insulating layer D). The blind via hole E has a function of electrically connecting the circuits B in the upper and lower layers, and also functions as a base mounting portion of a thin component mounted on the circuit B and is used. The multilayer type printed wiring board A is manufactured in this manner.

<< Outline of Cleaning Device 1 >> The cleaning device 1 of the present invention will be described in detail below with reference to FIGS. 1, 2, 3, and 4. This cleaning device 1 is used in the manufacturing process of the multilayer type printed wiring board A by the above-mentioned build-up method, and cleans the blind via hole E of the printed wiring board material C at the stage of the manufacturing process. Then, the liquid tank 2 of the cleaning liquid F, the conveyor 3 that is disposed in the cleaning liquid F of the liquid tank 2 and that conveys the printed wiring board material C having the blind via holes E formed therebetween, and the printed wiring board material that is conveyed. The brush part 4 arranged to face the C, and the suction part 5 located downstream of the brush part 4 and arranged to face the conveyed printed wiring board material C.
And. Hereinafter, these will be described in more detail.

First, the cleaning apparatus 1 is, as shown in FIG.
A processing chamber 6 is provided. Inside the processing chamber 6, a liquid tank 2 is arranged at an upper part and a storage tank 7 as a circulation tank is arranged at a lower part.
The liquid tank 2 and the storage tank 7 are filled with the cleaning liquid F, respectively. Water is typically used as the cleaning liquid F, but an aqueous solution (chemical solution) in which a drug is dissolved may be used. Then, the cleaning liquid F in the upper liquid tank 2 is appropriately flowed down to and collected in the lower storage tank 7 via the recovery pipe 8. Then, the cleaning liquid F in the lower storage tank 7 is appropriately supplied to the upper liquid tank 2 via the supply pipe 9 and the pump 10. Liquid tank 2
A liquid supply pipe (not shown) for the fresh cleaning liquid F is also attached to the storage tank 7, and a drain pipe 1 for the old cleaning liquid F is stored in the storage tank 7.
1 is attached.

Further, the storage tank 7 is provided with a circulation pipe 12. That is, in the circulation pipe 12 whose one end is connected to the lower portion of the storage tank 7, the opening / closing valve 13, the pump 14 (pump for the ejector 15), the filter 16, the ejector 15 are provided.
Etc. are sequentially interposed, and the other end of the circulation pipe 12 is connected to the upper part of the storage tank 7. First, a filter 16 is interposed in the circulation pipe 12. Therefore, as the blind via hole E of the printed wiring board material C is cleaned in the liquid tank 2, burrs, burnt dust, fine dust, etc., which are contained in the cleaning liquid F, are transferred to the storage tank 7 via the recovery pipe 8. Even if collected, it is collected and removed by the filter 16. Therefore, burr, burnt residue, and the like in the cleaning liquid F supplied from the storage tank 7 to the liquid tank 2 via the supply pipe 9 and the pump 10.
It does not contain fine dust, etc.
In the inside, the situation of reattachment to the blind via hole E of the printed wiring board material C is reliably prevented. In addition,
The function of the ejector 15 of the circulation pipe 12 will be described later.

The conveyor 3 arranged in the cleaning liquid F in the liquid tank 2 is as follows. That is, in the illustrated conveyor 3, one of the upper and lower ones of the transport rollers 17 using the pinch roll is for driving and the other is for the driven roller from the group of the transport rollers 17 forming an upper and lower pair. Many are arranged while placing. Of course, the conveyor 3 is not limited to the system using the illustrated conveyance rollers 17 group, and for example, a system using overlapping wheel groups in the conveyance direction G is also possible. The printed wiring board material C is immersed in the cleaning liquid F, and is horizontally conveyed in the conveyance direction G while being sandwiched between the conveyance rollers 17 of the conveyor 3. The cleaning device 1 is roughly as described above.

<< Regarding Brush Section 4 >> Next, the cleaning device 1
The brush section 4 will be described in more detail with reference to FIGS. 1 and 2 (1). The brush portion 4 has a substantially circular cross section, is arranged to face the printed wiring board material C conveyed in the cleaning liquid F, and can rotate by contacting the printed wiring board material C. And with the rotation, the tip,
The cleaning liquid F is introduced into the blind via hole E of the printed wiring board material C sequentially to stir the air inside, break the liquid film at the boundary, and draw the cleaning liquid F into the blind via hole E. That is, in the illustrated brush portion 4, the brush 19 is planted on the horizontal shaft 18 along the lateral width direction J, and is freely rotatable. Then, the tip of the brush 19 contacts the printed wiring board material C to rotate, and is elastically and sequentially inserted into the blind via hole E sequentially. Then, the tip of the inserted brush 19 stirs the air in the blind via hole E and breaks the liquid film at the boundary between the air and the cleaning liquid F. Therefore,
The cleaning liquid F in the liquid tank 2 is directed from the surroundings into the blind via hole E and begins to be drawn in (see the arrow in FIG. 2A). The brush part 4 is configured in this way.

<< Suction Part 5 >> Next, the suction part 5 of the cleaning apparatus 1 will be described with reference to FIGS. 1, 2 (2), (3),
Further details will be described with reference to FIG. The suction unit 5 is arranged so as to face the printed wiring board material C that is transported in the cleaning liquid F, and on the basis of its suction force, the cleaning liquid F first flows into the blind via hole E while removing air. Then, based on the suction force, the inside of the blind via hole E is cleaned by the jet of the cleaning liquid F generated,
Further, the cleaning liquid F after cleaning is suctioned and removed from the blind via hole E without staying.

That is, the suction unit 5 sucks the inside of the blind via hole E based on the suction force,
First, a. A flow of the cleaning liquid F in the liquid tank 2 is formed toward the blind via hole E, so that the cleaning liquid F is allowed to flow into the blind via hole E while removing the air that has been present in the blind via hole E (FIG. 2).
(See the arrows in (2) and (3)). Then, the suction unit 5 is based on its suction force and then b. By sucking the inside of the blind via hole E, a jet jet is generated in the blind via hole E by the inflowing cleaning liquid F. That is, the cleaning liquid F is intensively caused to flow into the small blind via hole E to form a rapid jet flow mixed with air. Accordingly, such a jet of the cleaning liquid F separates and releases burrs, burnt residue, fine dust, and the like that have adhered to the inner wall of the blind via hole E. In this way, the inside of the blind via hole E is cleaned. Then, the suction unit 5 is further c. By sucking the inside of the blind via hole E, the cleaning liquid F in the blind via hole E after cleaning is sucked and removed to the suction portion 5 together with peeling, loose burrs, burnt residue, fine dust and the like without being accumulated. .

Now, the suction unit 5 in the illustrated example is provided with a slit-shaped suction port 20. This slit-shaped suction port 20 is
The printed wiring board material C is not arranged in the front and rear direction G but in the lateral width direction J on the left and right to cover the entire width. Further, the front and rear forming surfaces 21 of the slit-shaped suction port 20 are gradually inclined forward and backward due to a curve or the like while having the slit-shaped suction port 20 as a top, and thus, the printed wiring board material C to be conveyed is provided. In the meantime, a space for inflowing the cleaning liquid F into the blind via hole E from the front and the rear is formed.

That is, first, as shown in FIG. 4, the slit-shaped suction ports 20 are arranged along a horizontal width direction J which is perpendicular to the front-back conveyance direction G of the printed wiring board material C on a horizontal plane. Alternatively, it is disposed so as to be slightly inclined from the lateral width direction J toward the transport direction G. In any case, the slit-shaped suction port 20 is arranged so as to cover the entire width of the printed wiring board material C in the lateral width direction J. Along with this, the front-rear forming surface 21 of the slit-shaped suction port 20 is, as shown in FIGS. 2 (2) and (3) in FIG.
In the illustrated example, the slit-shaped suction port 20 is provided at the top, and due to the bending, the slit-shaped suction port 20 is gradually inclined along the front-rear transport direction G. That is, when the slit-shaped suction port 20 is arranged above the printed wiring board material C and opens downward, the front-rear forming surface 21 is gradually inclined forward and backward,
In addition, a slit-shaped suction port 2 is provided below the printed wiring board material C.
When 0 is arranged and opened upward, the front and rear forming surface 21
Are gradually descending forward and backward.

As described above, the front and rear forming surfaces 21 forming the front and rear portions of the slit-shaped suction port 20 formed by cutting out along the left and right lateral width direction J toward the front and rear conveyance direction G.
Is inclined upward or downward from the horizontal when viewed from the front. Therefore, a flat printed wiring board material C with a blind via hole E that is transported horizontally is used.
And the front and rear forming surface 2 which is not flat but inclined like this.
An inflow space 22 is formed between the first and second slits 1, the vertical width of which gradually decreases toward the slit-shaped suction port 20 side. By passing through such an inflow space 22, the cleaning liquid F acting on the suction force first easily flows from the inside of the liquid tank 2 into the blind via hole E from the front and back, and at the same time,
The flow velocity gradually increases and becomes a jet flow, and suddenly becomes a jet flow.

Next, referring to FIG. 4, an arrangement mode of the slit-shaped suction port 20 on a horizontal plane will be described. First, the slit-shaped suction port 20 of the suction unit 5 shown in FIG.
While keeping a constant interval in the lateral direction J on the left and right, for example, 7
The suction part 5 is divided into a plurality of parts such as eight and is provided with a plurality of slit-shaped suction ports 20 in this way, and the plurality of stages such as two stages in the illustrated example are arranged in the front-rear transport direction G. There is. Then, the slit-shaped suction ports 20 of the front and rear suction units 5
During the interval, the overlap K is applied so that the suction force to the conveyed printed wiring board material C is dispersed and adsorption is prevented.
Is set low. That is, the slit-shaped suction ports 20 of the suction unit 5 on the upstream side of the transport direction G and the slit-shaped suction ports 20 of the suction unit 5 on the downstream side of the transport direction G each have a dimensional overlap K in the transport direction J. Is set to have a small positional relationship and a dimensional relationship, and the other is almost arranged in one division interval, that is, the relationship is not substantially intersected in the transport direction G and is almost alternately arranged.

Further, the slit-shaped suction port 20 of the suction portion 5 shown in FIG. 4B is so arranged that the suction force for the conveyed printed wiring board material C is dispersed and adsorption is prevented.
It is arranged so as to be slightly inclined toward the conveyance direction G from the left and right lateral width directions J that are perpendicular to the front and rear conveyance direction G. Note that FIG.
In the example shown in FIG. (2), the suction part 5 has only one step and the slit-shaped suction port 20 has only one step. Or a plurality of slit-shaped suction ports 20 may be arranged.
In combination with the example shown in FIG. 1A, the slit-shaped suction port 20 may be divided and formed in the lateral width direction J. In contrast,
The slit-shaped suction port 20 shown in (3) of FIG. 4 extends along the left and right lateral width directions J, which are perpendicular to the front-rear transport direction G, and
The suction unit 5 having such a slit-shaped suction port 20 is
It is arranged in two stages. In the example shown in FIG. 4 (3), the slit-shaped suction port 20 is not divided and formed in the lateral width direction J, and moreover, is exactly along the lateral width direction J on the left and right sides, so that the suction force is strong. Depending on the situation, there is a possibility that the printed wiring board material C being conveyed may be adsorbed to the slit-shaped suction port 20. The suction unit 5 has such a configuration.

<< About the top member 23 >> Next, the top member (sealing top) 23 attached to the suction portion 5 of the cleaning apparatus 1 will be described with reference to FIG. Note that FIG. 1, FIG. 2, and FIG.
Etc., the illustration of the top member 23 is omitted. At the slit-shaped suction port 20 of the suction portion 5, a group of top members 23 are arranged in close contact with each other, and each top member 23 is attached to a shaft 24 and is rotated in the transport direction G. It is possible to move.

That is, the top member 23 is made of, for example, a rubber roller-shaped member having elasticity and is attached to the shaft 24 arranged in the lateral width direction J on the left and right. The top members 23 are closely arranged in the lateral width direction J, and are individually rotatable in the transport direction G. Then, each of the top members 23 is disposed so as to face the slit-shaped suction port 20. That is, when the slit-shaped suction port 20 is disposed above the printed wiring board material C and opens downward, the aggregate of the top members 23 is located at the lower position and is opposed to the slit-shaped suction port. When 20 is disposed below the printed wiring board material C and opens upward, it is disposed above and opposite to the upper side. The slit-shaped suction ports 20 are arranged in a number and in a direction sufficient to cover the lateral width direction J.
Then, for example, when the suction portions 5 each having the slit-shaped suction port 20 are arranged in a plurality of stages in the transport direction G, the respective top members 23 and the shafts 24 are also arranged in a plurality of stages. Further, when the slit-shaped suction port 20 is inclined as shown in FIG. 4 (2), each top member 23 and the shaft 24 are also inclined. Therefore, such an assembly of the top members 23 seals and closes the slit-shaped suction ports 20 at all times when the printed wiring board material C does not pass through the slit-shaped suction ports 20 ((1 in FIG. 3). )
See figure). Each top member 23 has a front-back width sufficient to close the slit suction port 20 in this manner.

On the other hand, while the conveyed printed wiring board material C is passing through the slit-shaped suction port 20, the top member 23 of the area facing the printed wiring board material C is opposed.
Is pushed and rotated, and the slit-shaped suction ports 20 in the opposing area are opened toward the printed wiring board material C interposed between the slit member 20 and the top member 23 (see FIG. 3B). ). That is, when the printed wiring board material C reaches the slit-shaped suction port 20, the top member 23 in the area pushed by the printed wiring board material C rotates. At the same time, the top member 23 in this area releases the closing (sealing) of the slit-shaped suction port 20 until then, and the slit-shaped suction port 20 which has been closed until then is directed toward the printed wiring board material C. Let it open. The configuration of the top member 23 is not limited to the illustrated example. For example, the top member 23 is made of hard resin instead of rubber, and is attached to the shaft 24 through vertically long control holes to print. It may be configured to be moved up and down by a spring interposed with the wiring board material C. That is, in view of the ultra-thin flexible printed wiring board material C, it is made of a lightweight resin and can be displaced in the direction in which the printed wiring board material C is swung to open the slit suction port 20. At the same time, when the printed wiring board material C passes, it is possible to displace the slit-shaped suction port 20 in the direction to close it again by the urging force of the spring. The top member 23 has such a structure.

<< Regarding the Ejector 15 and the Control Unit 25 >> Next, the ejector 15, the control unit 25 and the like used in the cleaning apparatus 1 will be described with reference to FIG. First, as described above, the circulation pipe 12 attached to the storage tank 7 includes a pump 14 and an ejector 16 in the circulation pipe 12.
Is installed. As is well known, the ejector 16 is
By injecting the cleaning liquid F that is pumped at a high pressure through the circulation pipe 12 by the pump 14, a vacuum pressure and a suction pressure that are lower in fluid pressure are generated in the suction pipe 26. In the suction pipe 26, for example, air decompressed close to a vacuum exists. The suction pipe 26 is thus the ejector 1
One end is connected to 6 and the other end is branched and connected to each suction part 5 and the slit-shaped suction port 20.

By the way, the suction portion 5 of the illustrated example is composed of a linear suction tube having a circle or a corner, and as described above, the suction portion 5 is disposed in the lateral width direction J and is conveyed to the printed wiring board material C. The slit-shaped suction port 20 that is located opposite to is linearly cut out in the lateral width direction J. In the example shown in FIG. 2B, the slit-shaped suction port 20 formed between the front and rear forming surfaces 21 is directly formed in the suction portion 5. On the other hand, in the example shown in FIG. 2 (3), the interposition part 27 is vertically arranged between the suction part 5 and the front-rear forming surface 21 forming the slit-shaped suction port 20. In addition, a conduction hole 28 is formed in this interposed portion 27.
In any case, the suction force acts on the inside of the suction pipe 26 based on the suction pressure of the ejector 16 described above, so that the cleaning liquid F in the liquid tank 2 is transferred to the slit-shaped suction port 20, the suction portion 5, the suction pipe 26, and the like. It is sucked through and is led from the ejector 15 to the circulation pipe 12 and the storage tank 7.

The circulation pipe 12 is further provided with the following pressure sensor 29, control unit 25, solenoid valve 30 and the like. First, in the illustrated example, the pressure sensor 29 is attached to the suction pipe 26 near the ejector 15, and detects the suction pressure generated by the ejector 15, that is, the suction pressure value that is the suction force. The control unit 25 includes, for example, a microcomputer, and the suction pressure value and the suction force value detected and input by the pressure sensor 29 suck the printed wiring board material C to be conveyed by the slit-shaped suction port 20. If the dangerous value is exceeded, a control signal is output.
That is, the suction pressure value and suction force value, which are dangerous values, are read in advance in the control unit 25, and when the actual suction pressure value and suction force sent from the pressure sensor 29 exceed this danger value, A control signal is output to the solenoid valve 30.

The solenoid valve 30 is a solenoid valve that is attached to the suction pipe 26, functions as a pressure reducing valve, and is switched to open based on a control signal from the control section 25. That is, the solenoid valve 30 is normally set to be closed, and when the control signal is sent from the control unit 25, the solenoid valve 30 is switched to open and the suction pipe 2
6 is slightly opened to the atmosphere to reduce the pressure in the suction pipe 26, so that the suction pressure and the suction force are reduced to a value at which there is no risk of suction at the slit-shaped suction port 20. After the fact,
When the pressure sensor 29 stops detecting such a dangerous value, the control signal from the control unit 25 is stopped and the solenoid valve 30 is returned to the normally closed state. It is also conceivable to control the solenoid valve 30 to remain open after the signal is output.

By the way, instead of such a solenoid valve 30,
Regarding the pump 14 for the ejector 15, the control unit 25
The rotation speed may be set lower based on the control signal from the. That is, the rotational speed of the pump 14 may be changed to a lower setting based on the control signal without additionally providing the solenoid valve 30. In this case, the pressure of the cleaning liquid F supplied to the ejector 15 in the circulation pipe 12 is reduced from the high pressure to a lower pressure, so that the suction pressure and the suction force generated in the ejector 15 with respect to the suction pipe 26 are absorbed. Reduces to a non-hazardous value.
After that, when the pressure sensor 29 no longer detects such a dangerous value, the control signal from the control unit 25 is stopped from being sent, and the pump 14 normally returns to a higher rotational speed. However, once the control signal is output, it is also conceivable to control the pump 14 to remain at a lower rotation speed after the fact. In the figure, 29 is an electric wiring. The ejector 15, the control unit 25, and the like are configured in this way.

<< Regarding Liquid Removal Device 32 >> Next, the liquid removal device 32 attached to the cleaning device 1 will be described with reference to the right part of FIG. That is, a liquid removing device 32 is attached to the downstream side of the cleaning device 1, and the liquid removing device 32 adheres to and remains in the blind via hole E due to the cleaning by the cleaning device 1. Remove water, water droplets, and other liquids. Then, the chamber chamber 33, the conveyer 34 which is arranged in the chamber chamber 33 and conveys the printed wiring board material C sandwiched therebetween, and the brush portion 35 which is arranged so as to face the conveyed printed wiring board material C.
And a suction section 36 located on the downstream side of the brush section 35 and facing the printed wiring board material C being conveyed.

The liquid removing device 32 will be described in more detail. In the space inside the chamber 33, a conveyor 34 including a pair of upper and lower conveying rollers 37 is arranged. As a result, the printed wiring board material C from the cleaning device 1 is sandwiched between the transport rollers 37 of the conveyor 34 and moves in the transport direction G in the space inside the chamber 33.
Be transported horizontally. The other configurations and functions of the conveyer 34 of the liquid content removing device 32 are the same as those described above for the conveyer 3 of the cleaning device 1, and therefore the description thereof is omitted.

Next, the brush portion 3 of the liquid removing device 32.
5 has a substantially circular cross section, and is rotatable by contact with the printed wiring board material C being conveyed, and the tip of the brush 38 is sequentially inserted into the blind via hole E as it rotates and adheres to the inside. , The remaining cleaning liquid F is agitated and air is directed into the blind via hole E. Other configurations, functions, and the like of the brush portion 35 and the brush 38 of the liquid content removing device 32 are the same as those described above for the brush portion 4 and the brush 19 of the cleaning device 1, and therefore description thereof will be omitted.

Next, the suction part 36 of the liquid removing device 32.
Is provided with a slit-shaped suction port 39, and the air in the chamber 33 is made to flow through the insulating layer D laminated on the printed wiring board material C based on the suction force from the attached suction pipe 26.
It is allowed to flow into the blind via hole E of. And
Due to the jet of air generated by the inflow, the liquid component of the cleaning liquid F attached and remaining in the blind via hole E is mixed into the jet and sucked and removed from the blind via hole E, so that the slit-shaped suction port 39, Suction section 36,
It is led from the ejector 15 to the circulation pipe 12 and the storage tank 7 via the suction pipe 26 and the like. In addition, regarding the suction part 36, the slit-shaped suction port 39, and the like of the liquid content removing device 32,
Other configurations and functions such as the front-rear forming surface 21, the inflow space 22, the arrangement mode of the slit-shaped suction port 39, the top member 23, the ejector 15, the control unit 25, and the like are the suction unit 5 of the cleaning device 1. Since the slit-shaped suction port 20 and the like are similar to those described above, description thereof will be omitted. The liquid content removing device 32 has such a configuration.

<< Regarding Operation and the Like >> Cleaning Device 1 of the Present Invention
Is configured as described above. Therefore, it becomes as follows. This cleaning device 1 is used in a manufacturing process of a multilayer type printed wiring board A, and cleans a blind via hole E formed by using a laser or the like in a predrilling step of a printed wiring board material C. (Refer to (2) and (5) of FIG. 5), and supply for the plating process of the subsequent step (refer to (3) and (6) of FIG. 5). A large number of blind via holes E are formed in the insulating layer D laminated on the outer surface of the printed wiring board material C with a very small diameter. The blind via hole E is formed by using a laser or the like, and burrs, burnt residue, fine dust and the like adhere and remain inside. The cleaning of the blind via hole E by the cleaning device 1 is performed by following the steps below.

First, the printed wiring board material C is immersed in the cleaning liquid F in the liquid tank 2 of the cleaning device 1 and is horizontally conveyed while being sandwiched by the conveyor 3 (the left part of FIG. 1, FIG. (See Fig. 5 (2)). As the cleaning liquid F, water or an aqueous solution in which a drug is dissolved is used. The printed wiring board material C conveyed in this way
First, they pass through the brush portions 4 arranged opposite to each other. The brush portion 4 has a substantially circular cross section, and is made of a printed wiring board material C.
When the brush 19 rotates, the tip of the brush 19
It is sequentially inserted into the blind via hole E of the printed wiring board material C, → the air in the blind via hole E is agitated, the liquid film at the boundary is broken, and → the cleaning liquid F is directed into the blind via hole E and called in. (Fig. 1
(See Figure (1) in the left part of Figure 2). Then, the printed wiring board material C is conveyed to the downstream side of the brush section 4 and passes through the suction section 5 arranged oppositely.
The suction unit 5 is a.
The cleaning liquid F is caused to flow into the blind via hole E which has already been imparted with hydrophilicity by the brush portion 4 while removing air, and → b. After cleaning the inside of the blind via hole E with the jet of the cleaning liquid F generated by the inflow,
c. The cleaning liquid F after cleaning is suctioned and removed from the blind via hole E to the suction pipe 26 without staying (see the left part of FIG. 1, FIGS. 2 (2) and 2 (3)). Then, the printed wiring board material C is supplied for the subsequent process.

First, the suction portion 5 is provided with, for example, a slit-shaped suction port 20.
0 is arranged so as to cover the entire width along the lateral width direction J on the left and right instead of the conveying direction G before and after the printed wiring board material C to be conveyed, and the front and rear forming surface 21 thereof forms the slit-shaped suction port 20. While leaning, it gradually inclines forward and backward due to bending or the like (see FIGS. 2 (2) and 3 (3)). Therefore, the inflow space 22 from the front to the rear of the cleaning liquid F toward the blind via hole E is gradually wide between the inclination of the front and rear forming surface 21 and the printed wiring board material C conveyed horizontally. It is formed and secured so as to narrow it down. Therefore, in the steps described above, a. The inflow of the cleaning liquid F into the blind via hole E and the formation of a jet flow are further facilitated.

Secondly, in the slit-shaped suction port 20 of the suction portion 5, for example, an assembly of top members 23 is disposed so as to face each other, and the top members 23 are closely attached to the shaft 24. It is attached and rotatable in the transport direction G (see (3) in FIG. 3). Each top member 23 normally seals and closes the slit-shaped suction port 20 (see (1) of FIG. 3), but the printed wiring board material C to be conveyed has the slit-shaped suction port 20. While passing through 20, the top member 23 in the area facing the printed wiring board material C is pushed and rotated, and the slit-shaped suction port 20 in the area facing the printed wiring board material C is moved to the printed wiring board material C. (See (2) in Fig. 3). As a result, the suction force of the slit-shaped suction port 20 of the suction portion 5 acts efficiently on the printed wiring board material C and the blind via hole E without waste. In addition, the slit-shaped suction port 2 corresponding to the width size of the printed wiring board material C
Only 0 is opened, and printed wiring board materials C of various widths can be supported. That is, the top-side members 23 on both sides, which are not too wide in the width of the printed wiring board material C to be conveyed, are not pushed by the printed wiring board material C, and the slit-shaped suction ports 20 in the opposing areas are provided.
Remains sealed and closed.

Thirdly, the slit-shaped suction port 20 of the suction unit 5 is divided into a large number, for example, at regular intervals in the left-right lateral width direction J, and the suction unit 5 is conveyed back and forth. A configuration is conceivable in which a plurality of stages are arranged in the direction G and the front and rear slit-shaped suction ports 20 are set to have a small overlap K (see (1) of FIG. 4). Further, for example, a configuration is conceivable in which the slit-shaped suction port 20 is arranged so as to be slightly inclined from the left and right lateral width directions J perpendicular to the front-rear transport direction G toward the transport direction G ((2 in FIG. 4). ) See figure). With this configuration,
The suction force from the slit-shaped suction port 20 of the suction unit 5 is dispersed to the printed wiring board material C conveyed for cleaning without becoming too strong.

Fourthly, regarding the ejector 15 which is connected to the suction portion 5 through the suction pipe 26 and generates a suction pressure which becomes a suction force, the generated suction pressure is detected by the pressure sensor 2.
9, the detected suction pressure and the detected suction force cause the printed wiring board material C to be conveyed to have a slit-shaped suction port 20.
When the dangerous value of being adsorbed on is exceeded, the control unit 25 outputs a control signal, and the solenoid valve 30 for depressurization provided in the suction pipe 26 is switched to open or for the ejector 15. A control system in which the rotational speed of the pump 14 of FIG. When such a control system is adopted, the suction force applied from the slit-shaped suction port 20 to the printed wiring board material C conveyed for cleaning is not excessively strong and is kept below the dangerous value, which is a dangerous value. Automatically controlled to less than.

The printed wiring board material C whose interior of the blind via hole E has been cleaned by the cleaning device 1 in this manner is supplied to the liquid removing device 32 attached downstream. The liquid component removing device 32 removes liquid components such as water and water droplets of the cleaning liquid F attached and remaining in the blind via hole E accompanying the cleaning by the cleaning device 1 (FIG. 1).
See the right part of). That is, the printed wiring board material C after cleaning is conveyed while being sandwiched between the conveyors 34 in the chamber 33 of the liquid content removing device 32, passes through the brush portions 35 arranged oppositely, and then on the downstream side, It passes through the suction section 36 which is disposed so as to face each other. First, the brush portion 35 has a substantially circular cross-section, contacts the printed wiring board material C to be rotated, and rotates, and the tip of the brush 38 is sequentially inserted into the blind via hole E in accordance with the rotation, thereby The residual liquid of the cleaning liquid F is stirred and the air is directed into the blind via hole E and drawn. Next, the suction unit 36 performs a.
Let air flow into the blind via hole E, and → b.
The residual liquid content of the cleaning liquid F in the blind via hole E is mixed in the jet of air generated by the inflow, and → c. The air mixed with the residual liquid is sucked and removed from the blind via hole E.

<< Regarding Each Operation >> Now, according to the cleaning apparatus 1, the following first, second, and third aspects are obtained.
Firstly, in the cleaning device 1, the blind via hole E can be obtained by following the steps described above.
Burrs, burnt residue, fine dust, etc. inside are thoroughly and reliably cleaned and removed. That is, the cleaning device 1 includes the brush portion 4 that imparts hydrophilicity and the suction portion 5 that exerts suction force.
And the cleaning liquid F are used in combination, the suction unit 5 performs the cleaning by the suction method instead of the spraying method, and as described above, the suction unit 5 bends for the inflow space 22, It is provided with an inclined front and rear forming surface 21. Therefore, even though the blind via hole E has a blind hole shape with a very small diameter and does not penetrate and air is present inside, the inside of the blind via hole E can be sufficiently and surely cleaned.

Secondly, although the printed wiring board material C is extremely thinned, there is no possibility that the printed wiring board material C will be attracted to the slit-shaped suction port 20 of the suction portion 5 due to the suction force, so that it can be stably transported. become. That is, in the cleaning device 1, as described above, the suction force from the slit-shaped suction port 20 is dispersed or automatically controlled to be less than the dangerous value. Therefore, the printed wiring board material C transported for cleaning is
Ultra-thin and highly flexible, but slit-shaped suction port 2
Adsorption to 0 is reliably prevented.

Thirdly, the liquid components such as water and water droplets of the cleaning liquid F that have been adhered and remained in the blind via hole E due to the cleaning by the cleaning device 1 are surely removed after the fact, and the plating process of the next process is performed. Will be supplied to. That is, the cleaning device 1 is provided with a liquid content removing device 32, and the liquid content removing device 32 includes a predetermined brush portion 35 and a suction portion 36 according to the cleaning device 1. Therefore, the blind via hole E has a blind hole shape with an extremely small diameter, and the cleaning liquid F remaining inside is adhered so as to stick to it.
The remaining cleaning liquid F is surely removed.

<< Others >> First, in the cleaning apparatus 1 shown in FIG. 1, the brush section 4 and the suction section 5 are arranged opposite to the upper surface and the lower surface of the printed wiring board material C to be conveyed. However, the present invention is not limited to this. For example, it is conceivable to dispose the printed wiring board material C, which is to be conveyed, facing only one of the upper surface and the lower surface.
In particular, the blind via hole E is the printed wiring board material C.
It is conceivable to adopt such a configuration when it exists only on the upper surface or the lower surface of the.

Secondly, in the cleaning apparatus 1 shown in FIG. 1, the brush section 4 and the suction section 5 are arranged so as to face each other on the upper surface and the lower surface of the printed wiring board material C being conveyed. However, the present invention is not limited to this. For example, it is conceivable to dispose two or more sets of the upper and lower surfaces of the conveyed printed wiring board material C so as to face each other. Of course, it is also possible to dispose two or more sets facing each other on only one of the upper surface and the lower surface.

Thirdly, in the cleaning apparatus 1 shown in each drawing of FIG. 4, only one slit-shaped suction port 20 is provided in the one-stage suction section 5 which is a linear suction tube in the lateral width direction J. Although formed in the lateral width direction J, the present invention is not limited to this. For example, for the one-stage suction unit 5, 2
You may make it form the slit-shaped suction port 20 more than a book. Further, the suction part 5 having one slit-shaped suction port 20 shown in each drawing of FIG. 4 and the suction part 5 having two or more slit-shaped suction ports 20 thus formed are mixed. It is also possible to adopt it afterwards.

Fourthly, of course, what has been described above is also applied to the liquid content removing device 32. That is, as described above, the brush portion 4 and the suction portion 5 of the cleaning device 1 are applied to the brush portion 35 and the suction portion 36 of the liquid content removing device 32. Therefore, the above-mentioned first and second upper surfaces or only the lower surface thereof are opposed to each other, the above-described second two or more sets of opposed arrangements, and the above-described third two or more slit-shaped suction ports 20 are formed. Of course, the above can also be applied to the liquid content removing device 32.

Fifth, in the example shown in FIG. 1, the suction force of the suction portion 5 was based on the vacuum pressure and suction pressure generated by the ejector 16, but the present invention is not limited to this. Not a thing. For example, with respect to the suction pipe 26, a blower or a vacuum pump is connected instead of the ejector 16.
Therefore, the generated suction force may be transmitted to the suction portion 5 and the slit-shaped suction port 20 via the suction pipe 26. Of course, the same applies to the suction unit 36 of the liquid content removing device 32.

Sixth, this cleaning apparatus 1 is used for cleaning the blind via hole E of the printed wiring board material C in the manufacturing process of the multilayer type printed wiring board A, and the cleaning liquid F is water or As described above, the aqueous solution (drug) in which the drug is dissolved is used. The cleaning device 1 is also applicable to smoothing the blind via hole E (so-called desmear). In the illustrated example described above, the cleaning device 1 is used for cleaning in a narrow sense, but the cleaning device 1 of the present invention is not limited to this, of course, and can be applied to desmear by a cleaning method using a chemical solution. Is. That is, burrs, burnt residue of resin, fine dust, and the like are attached to the inner wall of the blind via hole E formed by using a laser or the like, and the inner wall surface is rough and rough. 1 and a cleaning solution F made of a chemical solution for smoothing treatment
It is made smooth and smooth by washing with. Then, as the next step, the remaining burr, the burnt residue of the resin, the fine dust, etc. are completely cleaned by using the cleaning device 1 as shown in the above-described example (as the cleaning liquid F in this case). Is often used).

[0065]

<Characteristics of the Invention> As described above, the cleaning apparatus according to the present invention firstly employs a predetermined brush part and a suction part in combination in the cleaning liquid, and secondly, The slit-shaped suction port of the suction unit is arranged so that the suction force is dispersed, and the control unit controls the suction force.
In addition, a liquid content removing device having a combination of a brush portion and a suction portion is additionally provided on the downstream side. Therefore, the present invention exhibits the following effects.

<< Regarding the First Effect >> First, the inside of the blind via hole of the printed wiring board material is sufficiently and surely cleaned. That is, this cleaning device
The brush part and the suction part are adopted in combination in the cleaning liquid, and therefore, for the blind via hole, after the cleaning liquid is drawn in at the tip of the brush part, at the slit-shaped suction port of the suction part whose front and back are inclined due to bending, Inflow, jet flow, and suction removal of cleaning solution. Therefore, although it is a blind via hole with an extremely small diameter and only one surface is open and air is present inside, burr, burnt residue, fine dust, etc. inside are
Sufficient and reliable cleaning and removal will be achieved without remaining. As compared with the above-mentioned conventional example of this type which employs a spraying method using a spray nozzle or a high-pressure air blowing method, the cleaning efficiency is dramatically improved.
Therefore, the plating in the blind via hole performed after the fact can be performed without any defect. Then, the multilayer printed wiring board can be manufactured with few defectives and high yield, and can be mass-produced while being excellent in cost.

<Regarding the Second Effect> Secondly, the printed wiring board material can be stably transported without accident during cleaning. That is, in this cleaning device, the slit-shaped suction ports of the suction unit are formed separately, the overlap is reduced, and the slit-shaped suction ports are arranged in a plurality of stages. Controls the solenoid valve and ejector pump. Therefore, the suction force applied from the slit-shaped suction port of the suction unit is dispersed or is controlled to a predetermined value or less with respect to the printed wiring board material conveyed for cleaning the inside of the blind via hole. Therefore, there is no fear that the printed wiring board material conveyed for cleaning is adsorbed to the slit-shaped suction port by the suction force, and the printed wiring board material is stably conveyed. That is, although it is a printed wiring board whose progress of ultra-thinning is remarkable, the occurrence of an accident in which the printed wiring board material that is transported for cleaning is broken or cannot be transported as in the conventional example of this kind described above, Prevented in advance. Therefore, also from this aspect, the multilayer-type printed wiring board to be manufactured can be mass-produced while the number of defective products is small, the yield is good, and the cost is excellent.

<Third Effect> Thirdly, the liquid component in the blind via hole after cleaning is removed without adhering or remaining. That is, in this cleaning device,
On the downstream side, a liquid component removing device, which employs a combination of a brush unit and a suction unit, is attached to remove liquid components such as water and water droplets attached and left in the blind via hole. Therefore, although it is a blind via hole having an extremely small diameter and only one surface is opened, the cleaning liquid and the liquid component thereof do not remain attached and remain after cleaning as in the conventional example of this type described above. Therefore, from this aspect as well, the plating in the blind via hole, which is performed after the fact, can be performed without any defect. Then, the multilayer type printed wiring board can be manufactured with a small number of defective products and a good yield, and can be mass-produced while being excellent in cost. As described above, the effects of the present invention are remarkably large, such that all the problems existing in this type of conventional example are solved.

[Brief description of drawings]

FIG. 1 is an overall side cross-sectional explanatory view of a cleaning device according to the present invention, which is used for explaining an embodiment of the present invention.

FIG. 2 is a side cross-sectional explanatory view of a main part for explaining the embodiment of the present invention, and FIG. 2 (1) is an example of a brush part,
FIG. (2) shows one example of the suction section, and (3) shows another example of the suction section.

FIG. 3 is a side cross-sectional explanatory view of a top member or the like in a closed position, and (2) is a side cross-sectional explanatory view of the top member or the like in an open position. , (3) are plan views of the top member.

FIG. 4 is a plan explanatory view of the slit-shaped suction port of the suction portion, which is used for the description of the embodiment of the present invention, in which (1) is an example thereof and (2) is another example. , (3) shows still another example.

FIG. 5: 1 of manufacturing process of multilayer type printed wiring board
For example, FIG. 1 shows the first step, FIG. 2 shows the second step, and FIG. 3 shows the third step.
FIG. 4 (4) shows the fourth step, FIG. 5 (5) shows the fifth step, and FIG. 6 (6) shows the sixth step.

FIG. 6 is a plan view of a printed wiring board (material).

[Explanation of symbols]

1 cleaning device 2 liquid tank 3 conveyors 4 Brush section 5 Suction section 6 processing room 7 storage tanks 8 collection tubes 9 supply pipes 10 pumps 11 drainage pipe 12 Circulation piping 13 open / close valve 14 pumps 15 ejector 16 filters 17 Conveyor roller 18 axes 19 brushes 20 Slit suction port 21 Front and back forming surface 22 Inflow space 23 Top members 24 axes 25 Control unit 26 Suction piping 27 Interposer 28 Conduction hole 29 Pressure sensor 30 solenoid valve 31 signal wiring 32 Liquid removal device 33 chamber room 34 Conveyor 35 Brush 36 Suction section 37 Transport roller 38 brushes 39 Slit suction port A printed wiring board B circuit C printed wiring board material D insulating layer E Blind Beer Hall F cleaning liquid G transport direction J width direction K overlap P plating

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 H05K 3/46 YF term (reference) 3B116 AA02 AB16 BA02 BA14 BB72 BB78 3B201 AA02 AB16 BA02 BA14 BB72 BB78 BB92 5E343 AA02 AA07 AA12 BB08 BB22 BB61 BB71 DD21 EE03 EE04 EE20 FF23 GG20 5E346 AA43 BB01 CC01 CC31 DD01 DD31 EE31 FF03 FF04 GG16 HH07 HH33

Claims (11)

[Claims] 1. A cleaning device for cleaning a blind via hole of a printed wiring board material, which is used in a manufacturing process of a multi-layer type printed wiring board, comprising: a cleaning liquid tank; and a cleaning liquid in the cleaning tank. And a conveyer that sandwiches and conveys the printed wiring board material, a brush portion that is arranged to face the conveyed printed wiring board material, and the printed wiring board material that is located downstream of the brush portion and that is conveyed. And a suction unit disposed opposite to the cleaning unit. 2. The cleaning device according to claim 1,
A large number of the blind via holes are formed in an insulating layer laminated on the outer surface of the printed wiring board material with an extremely small diameter, and the brush portion has a substantially circular cross section, and the printed wiring board to be transported is formed. It can be rotated by touching the plate,
Along with the rotation, the tip is sequentially inserted into the blind via hole of the printed wiring board material, the air inside is agitated, the liquid film at the boundary is broken, and the cleaning liquid is directed into the blind via hole, Cleaning device characterized by. 3. The cleaning apparatus according to claim 2,
Based on its suction force, the suction unit causes the cleaning liquid to flow into the blind via hole while removing air, and also causes the jet flow of the cleaning liquid generated by the inflow to clean the inside of the blind via hole, and after cleaning, A cleaning device, wherein the cleaning liquid is suctioned and removed from the blind via hole without staying. 4. The cleaning device according to claim 3,
The suction portion is provided with a slit-shaped suction port, and the slit-shaped suction port is arranged along the lateral width direction on the left and right instead of the front-back transportation direction of the printed wiring board material to be transported, and is arranged to cover the entire width. The front and rear forming surfaces are gradually inclined forward and backward due to bending while having the slit-shaped suction port as a top, and thus the blind is formed between the front and rear surfaces and the printed wiring board material conveyed horizontally. A cleaning device, characterized in that spaces for inflowing the cleaning liquid into and out of the via hole are formed. 5. The cleaning apparatus according to claim 4,
The slit-shaped suction ports of the suction section are divided into a plurality of parts at regular intervals in the left-right lateral width direction, and are arranged in multiple stages in the front-rear transport direction. Is a cleaning device having a small overlap so as to disperse suction force and prevent adsorption to the printed wiring board material being conveyed. 6. The cleaning device according to claim 4,
The slit-shaped suction port of the suction unit is used to disperse the suction force on the conveyed printed wiring board material and to prevent suction,
A cleaning device, characterized in that the cleaning device is disposed so as to be slightly inclined toward the transport direction from the left and right lateral width directions that are perpendicular to the front and rear transport directions. 7. The cleaning device according to claim 4,
At the slit-shaped suction port of the suction section, a group of top members are arranged facing each other in close contact with each other, and each top member is attached to a shaft and rotatable in the carrying direction, Respectively close the slit-shaped suction ports, but while the printed wiring board material being conveyed passes through the slit-shaped suction ports, the frame members facing each other in the printed wiring board material are While being pushed and rotated,
A cleaning device, characterized in that the slit-shaped suction ports facing each other are opened toward the printed wiring board material. 8. The cleaning device according to claim 4,
Further, an ejector connected to the suction unit via a pipe to generate a suction pressure that serves as a suction force, a pressure sensor for detecting the suction pressure generated by the ejector, a suction pressure detected by the pressure sensor, and Suction power
A control unit that outputs a control signal when the dangerous value of adsorbing the conveyed printed wiring board material is exceeded, and the control unit that is interposed in the pipe and switches to open based on the control signal from the control unit And a solenoid valve for decompressing the cleaning device. 9. The cleaning apparatus according to claim 8,
A cleaning device in which the pump for the ejector is set to a lower rotational speed based on a control signal from the control unit instead of the electromagnetic valve. 10. The cleaning device according to claim 3, wherein a liquid content removing device is attached to the downstream side of the cleaning device, and the liquid content removing device is provided with the blind via hole accompanying the cleaning by the cleaning device. The cleaning liquid that has adhered and remains inside is removed, such as water and water droplets, and a chamber chamber, and a conveyer that is disposed inside the chamber chamber and conveys the printed wiring board material while sandwiching it. A brush portion disposed opposite to the printed wiring board material; and a suction portion disposed on the downstream side of the brush portion and facing the conveyed printed wiring board material, the brush comprising: The section has a substantially circular cross section and is rotatable by contact with the conveyed printed wiring board material, and the tip of the section is sequentially inserted into the blind via hole along with the rotation and the liquid content of the cleaning liquid inside Stir the air The suction part draws air into the blind via hole, and the suction part causes air to flow into the blind via hole based on its suction force, and the jet flow of the air generated by the inflow causes a liquid content of the cleaning liquid in the blind via hole. Is mixed with the air and suctioned and removed from the blind via hole. 11. The cleaning apparatus according to claim 1, wherein the cleaning liquid is water or an aqueous solution in which a chemical is dissolved.