JP2006222117A - Conveying apparatus of substrate material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To propose a conveying apparatus of a substrate material, which first realizes stable conveying of a extremely thinned substrate material, secondly, more specifically, enables stable conveying of a substrate material having a thickness of not more than 0.5 mm, and thirdly moreover can realize this in terms of cost. <P>SOLUTION: This transfer apparatus 7 is used in a surface processing apparatus 6 for performing surface processing while transferring the substrate material A, wherein transfer rollers 9, 10 are arranged with a step, and the substrate material A is transferred in a curvature manner. That means, in this substrate material A, circuits are formed on both the front and rear surfaces. The transfer rollers 9, 10 are vertically paired and arranged in many arrays front/rear and right/left; and they do not contact the circuit surface of the substrate material A, but will contactly rotate with portions other than the circuit surface sandwiched from above and below. The surface treatment is performed by jetting a treatment liquid B from upper and lower spray nozzles 5. The transfer rollers 9, 10 are vertically arranged like a step for the front and rear or the right and left, thereby transferring the substrate material A in the front and rear or the right and left so as to make a curvature manner. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate material transfer apparatus. That is, the present invention relates to a transport device for a surface treatment apparatus that is used in a circuit board manufacturing process and performs surface treatment while transporting a substrate material.

《Technical background》
As electronic devices become more sophisticated, more functional, smaller and lighter, printed circuit boards and other circuit boards are becoming more accurate, finer, thinner, and more diverse, resulting in higher circuit density. , The miniaturization is remarkable. For example, printed wiring boards having circuits formed on both front and back surfaces have been made extremely thin, and those having a thickness of 0.5 mm or less have also appeared.
In such a circuit board manufacturing process, a surface processing apparatus is used in each process, and the surface processing apparatus processes the substrate material for the double-sided substrate conveyed by the conveying apparatus from above and below. The liquid is ejected, and thus the substrate material is subjected to chemical treatment and cleaning treatment. For example, for a substrate material, a processing solution such as a developing solution, an etching solution, a stripping solution, and a cleaning solution is sequentially ejected, and surface treatments such as development, etching, stripping, and cleaning are sequentially performed to form a circuit, and a circuit board. Is manufactured.

<Conventional technology>
FIGS. 6A and 6B are provided for explaining the conventional substrate material transfer apparatus of this type. FIG. 6A is a schematic front view, FIG. 6B is a schematic plan view of the substrate material to be transferred, and FIG. FIG.
As shown in the figure, in this type of surface treatment device 1 such as a developing device, an etching device, a peeling device, and a cleaning device, the substrate material A is upper and lower transport rollers attached to the shaft 4 of the transport device 2. 3, while being transported in a horizontal plane, the processing liquid B is sprayed from the spray nozzle 4, so that a surface treatment such as a predetermined chemical processing or cleaning treatment is performed, and the circuit D is formed on the circuit surface C on both the front and back surfaces. Formed and a circuit board was manufactured.
And the conveyance roller 3 of the conveyance apparatus 2 of such a surface treatment apparatus 1 makes up-and-down pair, and many rows are arranged in the front and rear, right and left at the same height level, and such a conveyance roller 3 is a board | substrate material. The circuit board C on the front and back sides of A is not contacted, and the left and right end lines E other than the circuit surface C and further the center line F are contacted and rotated from above and below, thereby holding the substrate A in a flat plate shape on a horizontal plane. Was carrying. Further, the spray nozzle 5 was sprayed with the processing liquid B so as to be opposed to the upper and lower sides of the substrate material A to be conveyed.

《Information on prior art documents》
Examples of such a conventional surface treatment apparatus 1 and transport apparatus 2 include those shown in the following Patent Document 1.
JP 2002-009420 A

By the way, the following problems were pointed out about the conveying apparatus 2 of the surface treatment apparatus 1 of this kind of conventional example.
<About the first problem>
First, a. As described above, this type of substrate material A has an extremely thin tendency, is weak and soft. And b. The treatment liquid B is sprayed onto the substrate material A with spray pressure and weight. C. The upper and lower transport rollers 3 are only in line contact with each other than the circuit surface C.
Therefore, these a. b. c. If the processing liquid B is sprayed from the upper and lower spray nozzles 5 while horizontally transporting the substrate material A by the transport roller 3 of the transport device 2, the substrate material A is smoothly held by the transport roller 3. However, various conveyance troubles G occurred frequently and became a problem.
That is, with respect to the substrate material A, adhesion to the conveying roller 3, winding, winding, sucking, bending, turning, wrinkling, bending, folding, crease, waist folding, slipping, catching, dropping, scratching, There were many transport troubles G such as damage (see FIG. 6 (3)). As described above, in the conventional example, it is often difficult to achieve stable conveyance, and there has been an urgent need to realize smooth conveyance such as hindering the surface treatment of the substrate material A that requires high accuracy.

About the second problem
Secondly, specifically, in this type of conventional transfer device 2, for the stable transfer of the substrate material A having the circuit surfaces C on both the front and back surfaces, the thickness of the substrate material A is, for example, 0. It was necessary to exceed about 5 mm.
For the substrate material A whose thickness is extremely reduced to, for example, about 0.5 mm or less, stable conveyance has been regarded as difficult. On the other hand, the needs for the substrate material A and the circuit board that have been made extremely thin in this way are increasing more and more recently.

<< About the third problem >>
Thirdly, with the aim of stable conveyance of the substrate material A thus thinned, the number of arrangements in the left and right width direction K of the conveyance roller 3 holding the substrate material A is four, five, and six. It was also tried to increase.
That is, for the substrate material A, in addition to the left and right end lines E and the center line F, a line other than the circuit surface C is provided between the end lines E and the center line F, and each such line is transferred to the transport device. Attempts have also been made to carry the paper sandwiched between two transport rollers 3.
However, with respect to such an attempt, a problem has been pointed out that the circuit plane C is greatly reduced and the cost is increased. That is, with respect to the substrate material A, the imposition area of the circuit surface C on which the circuit D is formed becomes small in area and also decreases in total, and the manufacturing cost of the substrate material A and the circuit substrate increases. It was happening.

<< About the present invention >>
In view of such a situation, the substrate material transfer apparatus of the present invention has been made as a result of the inventor's diligent research efforts to solve the problems of the conventional example.
In the transport apparatus of the surface treatment apparatus, the transport rollers that rotate in contact with the substrate surface other than the circuit surface are arranged in steps in the front-rear transport direction or the left-right width direction. → As a result, the substrate material is conveyed in a curved shape. Therefore, the substrate material is characterized in that it has a strength that can withstand the pressure and weight of the sprayed processing liquid.
Therefore, according to the present invention, first, stable conveyance of a substrate material that is extremely thinned is realized, and secondly, specifically, a substrate material having a thickness of 0.5 mm or less can be stably conveyed. And it aims at proposing the conveyance apparatus of a board | substrate material by which this is implement | achieved excellent in the cost side.

<< About Claims 1 and 2 >>
The technical means of the present invention for solving such a problem is as follows. First, claim 1 is as follows.
The substrate material transfer device according to claim 1 is used in a circuit board manufacturing process, and relates to a surface treatment device transfer device that performs surface treatment while transferring a substrate material. Further, the transport roller is provided with a step, and the substrate material is transported in a curved shape.
Claim 2 is as follows. According to a second aspect of the present invention, there is provided the substrate material transfer apparatus according to the first aspect, wherein circuit surfaces are formed on both the front and back surfaces of the substrate material. The transport rollers are attached to a shaft, and are arranged in multiple pairs on the front, back, left, and right, and in contact with the circuit surface of the substrate material. To do.
The surface treatment is performed by spraying a developing solution, an etching solution, a stripping solution, a cleaning solution, or other processing solution from spray nozzles disposed above and below. The upper and lower transport rollers are respectively provided with steps in the front-rear or left-right direction, so that the substrate material is transported in a curved shape curved in a substantially arc shape in the front-rear or left-right direction. And

<< Claims 3, 4, 5, and 6 >>
Claim 3 is as follows. The substrate material transfer apparatus according to claim 3 is the substrate material transfer device according to claim 2, wherein the substrate material is sprayed from the spray nozzle according to a curved transfer posture, although the thickness is extremely thin and the waist is weak and flexible. Further, the strength is such that it can withstand the pressure and weight of the treatment liquid.
Claim 4 is as follows. According to a fourth aspect of the present invention, there is provided the substrate material conveying device according to the third aspect, wherein the upper and lower conveying rollers are rotated in contact with each other by sandwiching at least both end lines of the left and right side edges other than the circuit surface of the substrate material from above and below. Further, if necessary, the center line other than the circuit surface of the substrate material is also rotated by being sandwiched from above and below.
Claim 5 is as follows. According to a fifth aspect of the present invention, there is provided the substrate material conveying apparatus according to the fourth aspect, wherein the conveying roller is repeatedly arranged in steps up and down in the front and rear conveying directions, and the height level between which the substrate material is sandwiched is gradually increased from the horizontal at a constant cycle. Set to high and gradually low. Thus, the substrate material is conveyed in a wave-like curved shape.
Claim 6 is as follows. The substrate material conveying device according to claim 6 is the substrate material conveying device according to claim 4, wherein the conveying roller is provided with a step difference in the vertical direction in the left-right width direction, and a height level sandwiching a central line of the substrate material is It is set higher than the height level that sandwiches both end lines. Accordingly, the substrate material is conveyed in a curved shape having a high center and low left and right ends.

<Features of the present invention>
As described above, the substrate material conveying apparatus of the present invention is configured such that, in the conveying device of the surface treatment apparatus, the conveying roller that rotates in contact with the substrate surface other than the circuit surface is moved in the front-rear conveying direction or the left-right width direction. Is provided with a step. → As a result, the substrate material is conveyed in a curved shape. Therefore, the substrate material is characterized in that it has a strength that can withstand the pressure and weight of the sprayed processing liquid.
Therefore, the board | substrate material conveying apparatus of this invention exhibits the following effect.

<< First effect >>
First, the conveyance trouble is eliminated in the surface treatment apparatus, and the stable conveyance of the substrate material that is extremely thin is realized.
That is, in the board | substrate material conveying apparatus of this invention, since the board | substrate material provided with the circuit surface on both front and back was curved and reinforced by the level | step difference arrangement | positioning of a conveyance roller, stable conveyance is implement | achieved. That is, the substrate material is a. Ultra thinning is extremely weak and soft, b. Treatment liquid is injected with pressure and weight, c. The upper and lower transport rollers are merely in line contact with each other than the circuit surface, but are transported without transport trouble.
As mentioned above in this conventional example of horizontal conveyance, adhesion, winding, winding, sucking, bending, turning, wrinkling, bending, folding, folding, waist folding, slipping, catching, etc. Drops, scratches, damages, etc. are reliably prevented, and highly accurate surface treatment is realized.

<< Second effect >>
Second, specifically, even a substrate material that has been extremely thinned to a thickness of, for example, about 0.5 mm or less can be stably conveyed.
That is, in the board | substrate material conveyance apparatus of this invention, as mentioned above, the smooth stable conveyance of the board | substrate material provided with the circuit surface on both front and back was implement | achieved, for example, it was thinned to about 0.5 mm or less in thickness. With respect to the substrate material as well as the substrate material that has been extremely thinned to a thickness of about 0.1 mm, it has been possible to reliably and stably convey the substrate material.
Unlike the conventional example of this type described above, it is not difficult to transport a substrate material having a thickness of 0.5 mm or less, and it can sufficiently meet the recent needs for ultra-thin circuit boards.

《Third effect》
Thirdly, these are realized with excellent cost. That is, in the board | substrate material conveying apparatus of this invention, the stable conveyance mentioned above is implement | achieved by the level | step difference arrangement | positioning of a conveyance roller.
As attempted in this type of conventional example, the number of conveyance rollers arranged in the left-right width direction is not increased, and the imposition area of the circuit surface of the substrate material is not reduced small. Realized. Therefore, stable conveyance of the substrate material is realized without increasing the manufacturing cost of the substrate material and the circuit board.
As described above, the effects exerted by the present invention are remarkably large, such as all the problems existing in this type of conventional example are solved.

《About drawing》
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a substrate material conveying apparatus according to the present invention will be described in detail based on the best mode for carrying out the invention shown in the drawings.
FIG. 1 is an explanatory side view of the first example. FIGS. 2A and 2B are plan explanatory views of the first example, in which FIG. 2A shows an upper conveyance roller, and FIG. 2B shows a lower conveyance roller. FIG. 3 is an explanatory front view of the first example.
FIG. 4 is an explanatory side view of the second example. FIG. 5 is an explanatory front view of the third example. FIG. 7 is a schematic plan view of a substrate (substrate material).

<< About circuit board H >>
The transfer device 7 of the surface treatment apparatus 6 for the substrate material A is used in the manufacturing process of the circuit board H. First, an outline of the circuit board H will be described with reference to FIG.
The circuit board H is used for electrical connection in AV equipment, personal computers, mobile phones, digital cameras, and other various electronic equipment, and the circuit D pattern for connecting parts is formed on the outer surface of the insulating layer, It is formed inside.
The circuit board H can be divided into a single-sided board and a double-sided board, as well as a multi-layer board (including the recent build-up method) and other various types, such as a rigid rigid board and a film-like flexible board. Also divided. And this surface treatment apparatus 6 makes object the double-sided board, ie, the double-sided board in which the circuit D, ie, the circuit surface C, is formed in the outer surface of both front and back.
As part of such a circuit board H, a module board (semiconductor integrated package board) in which semiconductor parts such as ICs, LSI elements, passive parts, driving parts, capacitors and the like are integrated with the circuit D, A glass substrate in which a semiconductor component is embedded in a glass base together with a circuit D, that is, a glass substrate for a plasma display PDP, a glass substrate for a liquid crystal LCD, CSP, PBGA, and the like have also appeared. Of course, in the present specification, the circuit board H includes a wide variety of such circuit boards in addition to the conventional printed wiring board.

With the increase in performance, functionality, and size and weight of electronic devices, circuit boards H have become more accurate, finer, and thinner, more flexible, more multilayered, and more diverse. The circuit D formed on the front surface (front surface and back surface), and further, the circuit D formed inside is remarkably increased in density and miniaturization.
The circuit board H, for example, a printed wiring board, has a vertical and horizontal cut size of about 500 mm × 500 mm, for example. The thickness of the insulating layer (core material) is extremely thin from the conventional 1.6 mm to about 1.0 mm to 60 μm, and recently from about 50 μm to about 10 μm. The thickness of the circuit D portion (copper foil portion) is also extremely thinned to 75 μm to 35 μm, and recently, around 16 μm to 10 μm. The width of the circuit D and the space between the circuits D are also about 30 μm to 15 μm, and in recent years, there is a tendency toward miniaturization of about 10 μm.
And the circuit board H of the double-sided board has also been made extremely thin, and those with a thickness of 0.5 mm or less have also appeared.
The circuit board H is roughly like this.

<< One Example of Manufacturing Method of Circuit Board H >>
Next, a method for manufacturing the circuit board H in which the surface treatment apparatus 6 and the transfer apparatus 7 for the substrate material A are used will be described with reference to FIG. First, the manufacturing method of the first example will be described. In this manufacturing method, the circuit board H, for example, a printed wiring board, is manufactured by following the following steps.
First, a substrate material that is a copper-clad laminate, in which a copper foil is bonded to the outer surface of an insulating layer (core material) made of glass cloth, ceramics, polyimide, or other film-like resin by hot pressing or the like A is prepared.
And about the board | substrate material A prepared in this way, after the surface roughening process (soft etching) which roughens the paste | laminated copper foil surface is performed, it cut | disconnects to each leaf of a short work size. The surface roughening treatment is conventionally performed by mechanical polishing, but recently, it is frequently performed by spraying the treatment liquid B.
In many cases, drilling for through holes is performed using a laser or the like. The through holes are formed of fine through holes between both outer surfaces of the substrate material A (circuit board H), and several hundreds of extremely small diameters are formed on one sheet, and the diameter is 0.5 mm to 0.00 mm. The number is about 2 mm or less. The through-holes are used for conductive connection between the circuits D (copper foil) on both outer surfaces and between the circuits D (copper foil) on the multilayer substrate, and for mounting semiconductor components mounted on the circuit D.
Recently, instead of through-holes that require drilling, bumps that are contact points in the form of small protrusions and substantially frustoconical shapes have been formed. Has been developed. The bumps are manufactured following the development process, the etching process, and the film removal process according to the circuit D.

After that, a photosensitive resist is applied or pasted on the outer surface of the copper foil of the substrate material A in the form of a film. Then, by applying and exposing a negative film of circuit D, that is, a circuit D photograph previously designed for circuit D, the resist on the outer surface is left exposed and cured circuit D forming part, and other unnecessary parts are processed. It is dissolved and removed by spraying the developer as the liquid B.
Then, such a copper foil of the substrate material A leaves a circuit D forming portion where the resist is cured and coated, and an unnecessary portion exposed by dissolving and removing the resist by development is treated with an etching solution (chlorinated chloride). It is removed and etched by injection of cupric, ferric chloride, and other corrosive liquids. Then, the remaining resist of the circuit D forming portion is stripped by spraying the stripping liquid as the processing liquid B, and the predetermined circuit D is formed on the outer surface of the substrate material A with the copper foil of the remaining circuit D forming portion. The circuit D of the conductor pattern is formed, and the circuit board H is manufactured.
Further, in the above-described development process, etching process, and film removal process, a washing liquid, a neutralizer liquid, and other cleaning liquids are used as the processing liquid B for the post-processing, or for the post-processing after the film-forming process. A cleaning process for injecting water is attached. In this cleaning step, the processing liquid B such as the developing solution, the etching solution, and the stripping solution that has adhered to the outer surface of the substrate material A (including the inside of the through hole) is cleaned and removed.
Furthermore, a drying process is attached after the cleaning process. That is, the outer surface of the substrate material A cleaned in the cleaning process (including the inside of the through hole) is attached with the cleaning liquid or other cleaning liquid as the processing liquid B, and their moisture, for preventing oxidation. In order to remove these, a drying process is performed immediately after the fact in the drying step.
The manufacturing method of the first example includes such a wet process method. The manufacturing method of the first example is as described above.

<< Other Examples of Manufacturing Method of Circuit Board H >>
Next, a manufacturing method of the second example will be described. As a method for manufacturing a circuit board H, for example, a printed wiring board, the wet process method of the first example described above is representative, but the semi-additive method of the second example is also being used frequently.
In this semi-additive method, first, electroless copper plating is applied to the outer surface of the substrate material A on which through holes have been previously formed. Then, after applying or pasting a photosensitive resist to the electroless copper plating, a circuit D film as a circuit D film is applied and exposed. The resist remains exposed and hardened, and the other part, that is, the circuit D forming part is dissolved and removed by spraying the developing solution as the processing liquid B.
Thereafter, electrolytic copper plating is applied to the circuit D formation portion, that is, the plating pattern portion where the resist is dissolved and removed by development, that is, the portion where the electroless copper plating is exposed, and the circuit D is formed. → The remaining resist other than the hardened circuit D forming portion is removed by spraying the stripping liquid as the processing liquid B, and the exposed electroless copper plating is quick by spraying the etching liquid as the processing liquid B. Etched and melted away. → In addition, as a post-treatment for each process, a cleaning process using the cleaning liquid as the processing liquid B and a drying process are provided according to the above-described place.
In the semi-additive method of the second example, the circuit D is thus formed by electrolytic copper plating, and thus the circuit board H is manufactured. The manufacturing method of the second example is as described above.
By the way, the manufacturing method of printed circuit boards and other circuit boards H has been increasingly diversified recently, and various methods have been developed and used in addition to the first and second examples described above. Of course, the present invention is also applied to the manufacturing method of such various circuit boards H.
The manufacturing method of the circuit board H is as described above.

<< About the surface treatment apparatus 6 >>
First, the surface treatment apparatus 6 in which the transfer apparatus 7 for the substrate material A of the present invention is used will be described with reference to FIG. 1, FIG. 2, FIG. 3, FIG. The surface treatment apparatus 6 is used in the manufacturing process of the circuit board H, and performs surface treatment while conveying the substrate material A.
That is, the surface treatment apparatus 6 is used in, for example, a surface roughening step, other pretreatment steps, a development step, an etching step, a film removal step, a cleaning step, and other post-treatment steps in the manufacturing process of the circuit board H. Used as a surface roughening device, a developing device, an etching device, a peeling device, or a cleaning device. Thus, for example, a surface roughening solution, a developing solution, an etching solution, a stripping solution, or a cleaning solution B such as a cleaning solution is sprayed on the substrate material A to be transported, so that the substrate material A is treated with a chemical solution, a cleaning treatment, etc. Surface treatment.
Then, the surface treatment apparatus 6 includes a transport apparatus 7 that is a conveyor that transports the substrate material A in the transport direction J into a chamber 8 that is a processing chamber, and a spray nozzle 5 that sprays the processing liquid B onto the transported substrate material A. And have.

The spray nozzle 5 is opposed to the substrate material A to be transported, and sprays a processing liquid B such as a surface roughening solution, a developing solution, an etching solution, a stripping solution, or a cleaning solution. In other words, the spray nozzles 5 are arranged with a vertical interval above and just below the substrate material A conveyed by the conveyance rollers 9 and 10 of the conveyance device 7. A large number of them are arranged at predetermined pitch intervals across the front and rear conveyance direction J and the left and right width direction K.
Therefore, the processing liquid B is pumped from the liquid tank 11 to each spray nozzle 5 via the pump 12 and the pipe 13 and sprayed onto the substrate material A. And after surface-treating the outer surface of the board | substrate material A, flowing toward the left direction or the right direction of the width direction K, it flows down from both the right and left sides of the board | substrate material A, and is collect | recovered by the liquid tank 11 again. Also used in circulation.
The surface treatment apparatus 6 is as described above.

<< Conveying device 7 >>
Hereinafter, the transfer device 7 of the surface treatment device 6 will be described with reference to FIGS. 1, 2, 3, 4, and 5.
First, the transport device 7 for the substrate material A is used in the chamber 8 of the surface treatment device 6 for the substrate material A during the manufacturing process of the circuit board H, and includes a large number of transport rollers 9 and 10. The transport rollers 9 and 10 are used in pairs at the top and bottom, rotate in contact with each other at the top and bottom, and transport the substrate material A having the circuit surface C on both the front and back surfaces by contact rotation while sandwiching and holding the substrate material A.
That is, the transport device 7 includes an upper transport roller 9 group and a lower transport roller 10 group, and the upper and lower transport rollers 9 and 10 are made of a resin having a substantially short column shape, a wheel shape, or a wheel shape, A plurality of pieces are respectively attached to the upper and lower shafts 14 and 15 arranged horizontally in the left and right width direction K. The upper and lower shafts 14 and 15 are arranged in a large number in the front-rear transport direction J, and a plurality of upper and lower transport rollers 9 and 10 are provided in the left-right width direction K, respectively. A large number of rows are arranged in J with a slight space between them.

Further, in the transport device 7, the upper and lower transport rollers 9, 10 are not in contact with the circuit surface C of the substrate material A, and rotate in contact with each other except the circuit surface C from above and below.
The transport rollers 9 and 10 that make up and down pair rotate at least the both end lines E of the left and right side edges other than the circuit surface C on the front and back sides of the substrate material A from above and below, and further, if necessary, of the substrate material A. The center line E other than the circuit surface C also rotates while being sandwiched from above and below.
That is, the substrate material A to be conveyed (see FIGS. 2 (1), 2 (2), 6 (2)), the left and right side edge portions in the width direction K on both the front and back surfaces are the circuit D. This is not a circuit surface C on which is formed, but is a both-ends line E (so-called frame portion, ridge portion) along the conveyance direction J. In many cases, the center portion of the substrate material A in the width direction K is not the circuit surface C on which the circuit D is formed, but is a center line F along the transport direction J.
The upper and lower transport rollers 9 and 10 rotate in contact with each other while sandwiching only both end lines E and center line F of the substrate material A from above and below. The conveyance rollers 9 and 10 in the example shown in FIG. 2 are attached to the upper and lower shafts 14 and 15, respectively, so as to sandwich the left and right end lines E and the center line F from above and below.
It should be noted that two shafts may be attached to the shafts 14 and 15 so that only the left and right end lines E are sandwiched and the center line F is not sandwiched, regardless of the illustrated example.

At least the lower conveying roller 10 is connected to a driving mechanism such as a motor via a shaft 15 and a driving gear 16 as shown in FIG. 2 (2), FIG. 3, FIG. And is driven to rotate. That is, the lower conveying roller 10 is composed of a fixed and driving roller fixed to the shaft 15.
On the other hand, the upper conveying roller 9 may be a fixed or driving roller fixed to the shaft 14 according to the lower conveying roller 10 as described above, but may be a fixed roller that is not connected to the driving mechanism.
Furthermore, the upper transport roller 9 may be a so-called free roller. That is, if the diameter of the shaft hole of the upper transport roller 9 is set slightly larger than the diameter of the shaft 14 and the upper transport roller 9 can be freely rotated, the sandwiching followability of the substrate material A is improved. There is also.
The transport device 7 is as described above.

<< About the step arrangement of the transport rollers 9, 10 >>
Next, the step arrangement of the transport rollers 9 and 10 will be described. In the transport device 7, as shown in FIGS. 1, 4 and the like, the transport rollers 9 and 10 are provided with steps, so that the substrate material A is transported in a curved shape.
That is, the upper and lower transport rollers 9 and 10 are stepped up and down with respect to the front and rear transport direction J or the left and right width direction K, respectively, so that the substrate material A has the front and rear transport direction J or the left and right widths. In the direction K, the sheet is conveyed in a curved shape curved in a substantially arc shape.
Therefore, the substrate material A is extremely thin and has a low waist and is flexible. However, the substrate material A can withstand the pressure and weight of the processing liquid B sprayed from the spray nozzle 5 by such a curved conveying posture. Strength is given.
The transport rollers 9 and 10 are thus stepped.

<< Examples shown in FIGS. 1, 2, 3, and 4 >>
Such step arrangement of the transport rollers 9 and 10 will be described in further detail. First, the example shown in FIGS. 1, 2, and 3 will be described.
In the conveying device 7 of this illustrated example, the upper and lower conveying rollers 9 and 10 are stepwise arranged repeatedly up and down in the front and rear conveying directions J, respectively, and the height level between which the substrate material A is sandwiched is constant from the horizontal. Is set to gradually higher and lower gradually. Accordingly, the substrate material A to be transported is transported in a wave-like and repeatedly curved manner by the arrangement of the steps above and below the transport rollers 9 and 10.
That is, the lower conveying roller 10 of the conveying device 7 employs three types of different diameter rollers, large, medium, and small, and is attached to the shaft 15 having the same height level (see FIG. 1, see FIG. 2 (2)). And the conveyance roller 10 of the same diameter is attached to the same axis | shaft 15, and a diameter is small, small, medium, large, medium, small, small, medium, large, ... along the conveyance direction J in order. Repeatedly arranged alternately.
On the other hand, all of the upper transport rollers 9 are rollers having the same diameter, and the height level of the shaft 14 is set so as to be successively changed in height so as to be pressed against the lower transport roller 10 described above. (See FIGS. 1 and 2 (1)).

As described above, in the illustrated transport apparatus 7, the upper and lower transport rollers 9, 10 are arranged stepwise in the vertical direction along the front-rear transport direction J. The upper conveying roller 9 having the same diameter changes the height between the shafts 14, and the lower conveying roller 10 having a different diameter changes the diameter between the conveying directions J by changing its diameter. Is formed.
Therefore, the height level at which the substrate material A is sandwiched between the upper and lower transport rollers 9 and 10 is set to be high and low from the horizontal at a constant cycle along the transport direction J.
Accordingly, the substrate material A has a wave-like curved shape with a constant period from the horizontal, is transported in the transport direction J, and is transported in a flat plate shape in a horizontal plane (see FIGS. 6A and 6B). ), The strength is reinforced and improved by the curved shape.

Note that there are various types of arrangement of the upper and lower steps in the conveying direction J of the conveying rollers 9 and 10 in addition to the examples shown in FIGS.
For example, both the upper and lower transport rollers 9 and 10 can be realized by using different diameter rollers while aligning the height levels of the shafts 14 and 15. Further, as in the example shown in FIG. 4, both the upper and lower transport rollers 9 and 10 can be realized by changing the height levels of the shafts 14 and 15 while using the same diameter roller.
Furthermore, in the case of using different diameter rollers, in addition to three kinds of diameters of large, medium and small, those having intermediate diameters thereof may be used, and therefore, four or more kinds of different diameter rollers may be used. Alternatively, it is possible to use two types of different diameter rollers having large and small diameters.
Note that the period and pitch interval of the waves formed on the substrate material A should be set as large as possible in consideration of the conveyance follow-up property of the substrate material A.
The examples shown in FIGS. 1, 2, 3 and 4 are as described above.

<< Example shown in FIG. 5 >>
Next, the example shown in FIG. 5 will be described. In the conveying apparatus 7 of this illustrated example, the conveying rollers 9 and 10 are stepped up and down in the left and right width direction K, and the height level sandwiching the center line F of the substrate material A is at both ends of the substrate material A. The height level is set higher than the level at which the line E is sandwiched. Therefore, the substrate material A to be conveyed is conveyed in a curved shape having a high center and low both left and right ends due to the arrangement of the upper and lower steps of the conveying rollers 9 and 10.
That is, this board | substrate material A is equipped with the both ends line E which is not the circuit surface C, and the center line F which is not the circuit surface C similarly on both front and back, and the upper and lower conveyance rollers 9 and 10 Three pieces are attached to each of the shafts 14 and 15 so as to sandwich the end line E and the center line F from above and below.
And the conveyance rollers 9 and 10 which pinch | interpose the both ends line E of the board | substrate material A are set to the same height level, On the other hand, the conveyance rollers 9 and 10 which pinch | interpose the center line F are set to a higher height level than these. Has been. In the conveyance rollers 9 and 10 sandwiching the center line F in the illustrated example, the upper conveyance roller 9 has a small diameter and the lower conveyance roller 10 has a large diameter, and rollers having different diameters are used.
A number of such transport rollers 9 and 10 are arranged in the transport direction J.

As described above, in the conveyance device 7 in the illustrated example of FIG. 4, the upper and lower conveyance rollers 9 and 10 are stepped in the vertical direction in the left and right width direction K. The left and right transport rollers 9 and 10 and the central transport rollers 9 and 10 are stepped by changing their height positions. Therefore, the height level at which the substrate material A is sandwiched between the upper and lower transport rollers 9 and 10 is set to be low in the left and right and high in the center in the width direction K.
Accordingly, the substrate material A is conveyed in an arc-shaped curved shape in which the center is gradually increased in the width direction K and the left and right are gradually decreased, and the substrate material A is conveyed in a flat plate shape on a horizontal plane ((1) in FIG. 6). , (3) see the figure), the strength is reinforced and improved by the curved shape.
Note that various arrangements of the upper and lower steps in the width direction K of the transport rollers 9 and 10 are possible in addition to the example shown in FIG. For example, both the upper and lower transport rollers 9 and 10 can be realized by changing the height levels of the left and right and the center while using the same diameter roller. Moreover, about the center conveyance rollers 9 and 10, it is also possible to use a circumferential shape with a rounded shape or to use a plurality of them.
The example shown in FIG. 5 is like this.

《Action etc.》
The board | substrate material A conveying apparatus 7 of this invention is comprised as demonstrated above. Therefore, it becomes as follows.
(1) The transfer device 7 is used in various surface treatment processes such as various chemical treatment processes and cleaning processes during the manufacturing process of printed circuit boards and other circuit boards H. For example, it is used in a surface treatment device 6 such as a surface roughening device, a developing device, an etching device, a peeling device, or a cleaning device (see FIGS. 1, 2, 3, 4, 5, etc.).
And this conveying apparatus 7 is arrange | positioned with the spray nozzle 5 in the chamber 8 of the surface treatment apparatus 6. FIG. Each spray nozzle 5 sprays a processing liquid B such as a surface roughening solution, a developing solution, an etching solution, a stripping solution, or a cleaning solution onto the substrate material A for a double-sided substrate to be conveyed.

  (2) The transport device 7 includes a large number of transport rollers 9 and 10, and the transport rollers 9 and 10 are used in pairs at the top and bottom, and are transported by rotating in contact with the substrate material A interposed therebetween. Transport in direction J (see FIGS. 1 and 4).

(3) In the chamber 8 of the surface treatment apparatus 6, the substrate material A conveyed by the conveyance rollers 9 and 10 of the conveyance apparatus 7 is subjected to surface treatment.
That is, in the surface treatment device 6 for the chemical solution treatment process and the cleaning treatment process, that is, the surface roughening device, the developing device, the etching device, the peeling device, and the cleaning device, the spray nozzle 5 is provided on the circuit surface C on both the front and back surfaces of the substrate material A. The processing liquid B is sprayed, so that the circuit surface C of the substrate material A is subjected to chemical processing or cleaning processing (see FIGS. 1, 3, 4, 5, etc.).

(4) By the way, a. The printed wiring board material and other circuit board material A for the circuit D are remarkably progressed in ultrathinning, and are extremely thin, weak and soft and rich in flexibility.
And b. In this way, the processing liquid B is sprayed with an injection pressure to the extremely thin and soft substrate material A, and the processing liquid B sprayed from the upper side flows with a weight on the substrate material A.
C. The upper and lower transport rollers 9 and 10 are only in contact with both end lines E and the center line F other than the circuit surface C on the front and back of the substrate material A. That is, the transport rollers 9 and 10 only contact, hold, and support only a very small area of the substrate material A in a line.

(5) Therefore, in the transport device 7 of the surface treatment device 6, in consideration of these a, b, and c, the transport rollers 9 and 10 are stepped, and thus the substrate material A has a curved shape. The strength to withstand the pressure and weight of the liquid B is imparted to the substrate material A.
That is, for example, the transport rollers 9 and 10 are stepped in the up and down direction with respect to the front and rear transport direction J (see FIGS. 1 and 4), so that the substrate material A has a constant period in the transport direction J. → The substrate material A is reinforced with load resistance and greatly improved in strength compared to the case of flat plate conveyance on a horizontal plane. Yes.
Further, for example, the transport rollers 9 and 10 are arranged in a stepwise manner in the left and right width direction K, with the left and right ones being low and the middle one being high (see FIG. 5). In the direction K, it is conveyed in a substantially arc-shaped curved shape with a high center. → By applying this curved shape, the substrate material A has reinforced load resistance as compared with the case of flat plate-shaped conveyance on a horizontal plane. The strength is greatly improved.

(6) Now, in the transfer device 7 of the present invention, the stepped arrangement of the transfer rollers 9 and 10 makes the substrate material A curved, which is sufficient for loads such as the spray pressure and weight of the processing liquid B. Tolerable strength is given.
Therefore, the substrate material A is stably conveyed as expected despite the above-described conditions a, b, and c. That is, although the substrate material A is an extremely thin and soft substrate, and the substrate material A is only held by the transport rollers 9 and 10 except for the circuit surface C, the influence of the injection pressure and weight of the processing liquid B is affected. Without being received, without being wound or bent on the transport rollers 9 and 10, and without being dropped from between the transport rollers 10, can be stably transported.
According to the surface treatment device 6 adopting the transport device 7, the substrate material A for double-sided substrate (including copper foil and resist for circuit formation on the outer surface) adheres to the transport rollers 9, 10 and is wound. Various conveyance troubles G (Fig. 6 (3)) such as winding, sticking, bending, turning, wrinkling, bending, bending, folding, folding, waist folding, slipping, catching, dropping, scratching, damage, etc. Is prevented from occurring in advance and is stably conveyed.

(7) Specifically, the substrate material A for a double-sided substrate that has been extremely thinned to a thickness of, for example, about 0.5 mm or less is also smoothly and stably conveyed.
For example, in the example shown in FIGS. 1, 2, and 3, when a wide-angle full cone nozzle is used as the spray nozzle 5 and the processing liquid B is injected at an injection pressure of about 31 kg, the substrate material A having a thickness of 0.24 mm is obtained. It was possible to carry it stably and reliably. Of course, the substrate material A having a thickness of 0.5 mm could be reliably and stably conveyed.

(8) These are realized by arranging the transport rollers 9 and 10 of the transport device 7 in steps. That is, this is realized without increasing the number of the conveying rollers 9 and 10 in the left-right width direction K to (3), 4, 5, and 6.
Therefore, as in the case where the number of arrangements is increased, in order to avoid contact with the increased conveying rollers 9 and 10, the imposition area of the circuit surface C on the front and back of the substrate material A is significantly reduced accordingly. There is no end to it.
Each circuit surface C obtained from the substrate material A is not set to be small in terms of area, nor is the total area reduced by the increase in contact area.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side explanatory view of a first example for explaining a best mode for carrying out the invention of a substrate material conveying apparatus according to the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory plan view of a first example for explaining the best mode for carrying out the invention. (1) FIG. 1 shows an upper transport roller, (2) FIG. 2 shows a lower transport roller. . FIG. 2 is a front explanatory view of a first example for explaining the best mode for carrying out the invention. It is an explanatory side view of a second example for explaining the best mode for carrying out the invention. FIG. 5 is a front explanatory view of a third example for explaining the best mode for carrying out the invention. This kind of conventional substrate material conveying device will be described, wherein (1) is a schematic front view, (2) is a schematic plan view of the substrate material to be conveyed, and (3) is a schematic side view. It is. It is plane explanatory drawing which modeled the circuit board (board | substrate material).

Explanation of symbols

1 Surface treatment equipment (conventional example)
2 Transport device (conventional example)
3 Transport roller (conventional example)
4-axis (conventional example)
5 Spray nozzle 6 Surface treatment device (present invention)
7 Conveying device (present invention)
8 Chamber 9 Transport roller (present invention)
10 Conveying roller (present invention)
11 Liquid tank 12 Pump 13 Piping 14 Shaft (present invention)
15 shafts (present invention)
16 Drive gear A Substrate material B Processing liquid C Circuit surface D Circuit E Lines at both ends F Center line G Transport trouble H Circuit board J Transport direction K Width direction

Claims (6)

A transport device for a surface treatment apparatus that is used in a circuit board manufacturing process and that performs surface treatment while transporting a substrate material,
A transport device for a substrate material, characterized in that a transport roller is provided in steps, and the substrate material is transported in a curved shape. The substrate material has circuit surfaces formed on both front and back surfaces, and the transport rollers are attached to a shaft, and are arranged in multiple rows in front and rear, left and right, and without contact with the circuit surface of the substrate material. , Contact rotation while holding the circuit surface other than the top and bottom,
The surface treatment is performed by spraying a developing solution, an etching solution, a stripping solution, a cleaning solution, or other processing solution from spray nozzles disposed above and below,
The upper and lower transport rollers are respectively provided with steps in the front-rear or left-right direction, so that the substrate material is transported in a curved shape curved in a substantially arc shape in the front-rear or left-right direction. The substrate material transfer apparatus according to claim 1.   The substrate material has an extremely thin wall thickness, is weak and flexible, but has a strength capable of withstanding the pressure and weight of the processing liquid sprayed from the spray nozzle due to the curved conveyance posture. The board | substrate material conveyance apparatus of Claim 2 characterized by the above-mentioned.   The conveying rollers forming a pair of upper and lower parts rotate at least both end lines on the left and right side edges other than the circuit surface of the substrate material from above and below, and if necessary, a central line other than the circuit surface of the substrate material The substrate material conveying apparatus according to claim 3, wherein the substrate material is rotated by being sandwiched from above and below.   The transport roller is repeatedly stepped up and down in the front and rear transport directions, and the height level between which the substrate material is sandwiched is set to be gradually higher and lower at regular intervals from the horizontal. The substrate material conveying apparatus according to claim 4, wherein the substrate material is conveyed in a wavy shape.   The transport rollers are arranged stepwise up and down in the left and right width direction, and the height level that sandwiches the center line of the substrate material is set higher than the height level that sandwiches both end lines of the substrate material, 5. The substrate material conveying apparatus according to claim 4, wherein the substrate material is conveyed in a curved shape having a high center and low left and right ends.

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