TW556459B - Substrate processing equipment - Google Patents
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- TW556459B TW556459B TW92101122A TW92101122A TW556459B TW 556459 B TW556459 B TW 556459B TW 92101122 A TW92101122 A TW 92101122A TW 92101122 A TW92101122 A TW 92101122A TW 556459 B TW556459 B TW 556459B
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556459 , 玖、發明說明 (發明說明應敘明:發明所屬之技術領域、先前技術、內容、實施方式及圖式簡單說明) 【發明所屬之技術領域】 本發明係有關一種基板處理裝置。亦即,係關於使用在 印刷線路基板之製造程序,一邊搬送印刷線路基板材料而 一邊進行處理之基板處理裝置。 【先前技術】 《技術性背景》 伴隨著電子機器的高性能化、高機能化、小型輕量化, 印刷線路基板亦朝著高精度化、細緻化、極薄化前進,形 成於其表面或裏面之電路的高密度化、細微化之進展亦爲 顯著。而在此種印刷線路基板之製造程序的各程序方面, 相對於所搬送之印刷線路基板材料,係進行有下述之各種 處理。 例如,依次噴射顯像液—蝕刻液—剝離液等,因而藉由 依次進行顯像蝕刻-剝離等之處理,而形成電路。又例 如,依次進行浸漬於無電解銅電鍍液^顯像液之噴射浸 漬於電解銅電鍍液—剝離液之噴射等,因而,藉由依次進 行化學銅電鍍處理—顯像^電氣銅電鍍-> 剝離等之處理,而 形成電路。更甚者,作爲該等各處理之前後處理,而進行 有噴射水洗液等藉以進行洗淨處理。 《習知技術》 接下來,於此種印刷線路基板之製造程序之各程序中, 印刷線路基板材料係被分別供給至基板處理裝置,而由輸 556459 送裝置以水平姿勢進行搬送的同時進行各種處理。 第5圖係用以提供爲此種習知例的基板處理裝置(雙面 基板用)之說明,(1)圖係爲局部側面圖,(2)圖所示係沿著(1) 圖之K-K線剖面而由箭頭所視之斷面圖。第6圖係用以提 供爲此種習知例的基板處理裝置(單面基板用)之說明,(1) 圖係爲其1例之局部側面圖,(2)圖所示係爲電路形成面之 局部平面圖(底面圖),(3)圖所示係其他例之局部側面圖。 如該等圖面所示,在前述顯像處理、蝕刻程序、剝離程 序、洗淨程序等程序中,在各個基板處理裝置1中,爲進 行有,—將印刷線路基板材料P藉由輸送裝置2之輥輪3 或輪1 3而以水平姿勢進行搬送,—對於表面Q或裏面F之 電路形成面R,係將處理液S由噴射噴嘴部4噴射,—進 而以進行所定之處理。 亦即,如第5圖所示,例如,在表面Q或裏面F上已具 備有電路形成面R之印刷線路基板材料P用的基板處理裝 置i、亦即爲在雙面基板用之基板處理裝置1中,爲進行 有’-將印刷線路基板材料P載置於輸送裝置2之輪i 3上, —同時對於表面Q及裏面F之電路形成面R,爲由被配設 在上下兩側之噴射噴嘴部4噴射處理液S,-進而用以處 理電路形成面R。 此外’如第6圖之(1)圖或(3)圖所示,例如,在僅於表 面Q上具備電路形成面R之印刷線路基板材料P用的基板 處理裝置1、亦即爲在單面基板用之基板處理裝置1中, 爲進行有,—將印刷線路基板材料P以輸送裝置2之輪1 3 556459 進行搬送’>且對於表面Q之電路形成面R,爲由被配設 在上側之噴射噴嘴部4噴射處理液S,->進而用以處理電 路形成面R。 〔發明所欲解決之問題〕 《有關於第1問題點》 不過,在此種習知例之基板處理裝置1中,卻被指摘有 下述之問題點。 第1,有關於第5圖之基板處理裝置ι(雙面基板用)或第 6圖之(1 )圖的基板處理裝置1 (單面基板用),係具有在印刷 線路基板材料P之表面Q或裏面F之電路形成面R上,容 易產生亂流T或儲液U之問題。 亦即,被噴射至電路形成面R之處理液S (即,在第5圖 之例中爲被噴射至表面Q及裏面F之處理液S,而在第6 圖之(1)圖之例中爲被噴射至表面Q之處理液S)係形成爲, 在電路形成面R上,流入與前後搬送方向V正交之左右的 寬度方向W而進行處理後,便由左右兩側流下。 然而,全數的處理液S並無法如上所期望的均朝寬度方 向W流動。即,如第6圖之(2)圖等圖所示,處理液S係 次要的在第5圖之例中爲表面Q或裏面F之電路形成面R 上、而在第6圖之(1)圖之例中爲表面Q之電路形成面R上, 形成有散亂且朝前後搬送方向V之亂流T、或是在中央部 上形成儲液U而容易造成停滯。此係起因於一面搬送印刷 線路基板材料P、一面噴射處理液S的結果。556459, 发明. Description of the invention (The description of the invention should state: the technical field, prior art, contents, embodiments, and drawings of the invention are briefly described. [Technical field to which the invention belongs] The present invention relates to a substrate processing apparatus. That is, it relates to a substrate processing apparatus that uses a manufacturing process for a printed wiring board and performs processing while conveying printed wiring board materials. [Previous technology] "Technical background" With the increase in performance, functionality, and weight of electronic equipment, printed circuit boards are also becoming more precise, thinner, thinner, and formed on the surface or inside. The progress of higher density and miniaturization of the circuit is also remarkable. In each of the procedures of the manufacturing process of such a printed wiring board, various processes described below are performed with respect to the printed wiring board material to be conveyed. For example, the developing liquid-etching liquid-stripping liquid is sequentially sprayed, and the circuit is formed by sequentially performing processing such as developing etching-stripping. For another example, the spraying of the electrolytic copper plating solution ^ development solution is immersed in sequence. The electrolytic copper plating solution-the spraying of the stripping solution is immersed in sequence. Therefore, the chemical copper plating treatment is performed in sequence-development ^ electric copper plating- > Peeling, etc. to form a circuit. Furthermore, as a pre- and post-treatment of each of these processes, a washing process such as spraying with a washing liquid is performed. << Knowledge Technology >> Next, in each of the procedures of the manufacturing process of such a printed circuit board, the printed circuit board materials are separately supplied to a substrate processing apparatus, and various kinds of conveyance are carried out in a horizontal posture by a conveying apparatus 556459. deal with. Fig. 5 is used to provide a description of such a conventional substrate processing apparatus (for a double-sided substrate), (1) is a partial side view, and (2) is shown along (1) A cross-sectional view taken along the line KK and viewed by an arrow. Fig. 6 is a description of a conventional substrate processing apparatus (for a single-sided substrate). (1) is a partial side view of one example, and (2) is a circuit formation. Partial plan view of the surface (bottom view), (3) is a partial side view of other examples. As shown in these drawings, in the aforementioned development processing, etching procedure, peeling procedure, cleaning procedure and the like, in each substrate processing apparatus 1, in order to carry out,-the printed wiring substrate material P is passed through a conveying device The rollers 3 or 2 of 2 are conveyed in a horizontal posture—for the circuit formation surface R of the surface Q or the inner surface F, the processing liquid S is sprayed from the spray nozzle portion 4—and then the predetermined processing is performed. That is, as shown in FIG. 5, for example, a substrate processing device i for a printed circuit substrate material P that has a circuit formation surface R on the surface Q or the back surface F, that is, a substrate processing for a double-sided substrate. In the device 1, in order to carry out '-the printed circuit board material P is placed on the wheel i 3 of the conveying device 2-at the same time, the surface R and the circuit F on the surface Q are formed on the surface R, and are arranged on the upper and lower sides The spray nozzle portion 4 sprays the processing liquid S, and further processes the circuit formation surface R. In addition, as shown in (1) or (3) of FIG. 6, for example, a substrate processing apparatus 1 for a printed circuit board material P provided with a circuit formation surface R only on the surface Q is In the substrate processing apparatus 1 for a surface substrate, the printed circuit board material P is conveyed by the wheel 1 3 556459 of the conveying device 2 '> The processing liquid S is sprayed from the upper spray nozzle 4 to process the circuit formation surface R. [Problems to be Solved by the Invention] "About the first problem point" However, the substrate processing apparatus 1 of this conventional example is accused of the following problem points. First, the substrate processing apparatus 1 (for a double-sided substrate) shown in FIG. 5 or the substrate processing apparatus 1 (for a single-sided substrate) shown in (1) of FIG. 6 is provided on the surface of the printed wiring substrate material P The circuit formation surface R of Q or inner F is prone to the problem of turbulent flow T or liquid storage U. That is, the processing liquid S sprayed onto the circuit formation surface R (that is, the processing liquid S sprayed onto the surface Q and the back surface F in the example of FIG. 5, and the example of FIG. 6 (1) The processing liquid S) sprayed onto the surface Q is formed so that the circuit forming surface R flows into the width direction W orthogonal to the front-to-rear conveyance direction V for processing, and then flows down from the left and right sides. However, the entire treatment liquid S cannot flow in the width direction W as expected. That is, as shown in (2) in FIG. 6 and the like, the processing liquid S is secondary on the circuit forming surface R of the surface Q or the inner surface F in the example of FIG. 5, and 1) In the example shown in the figure, the circuit formation surface R on the surface Q is formed with a turbulent flow T that is scattered and conveyed in the forward-backward direction V, or a storage liquid U is formed in the central portion, which is likely to cause stagnation. This is because the printed circuit board material P is conveyed while the processing liquid S is ejected.
而當產生有此種亂流T或儲液U時,便會妨礙處理液S 556459 之更新,產生處理的速度延遲、過或不足,使處理之均勻 化受到阻礙而造成顯著地處理不均,進而在形成均勻電路 方面產生阻礙。 對此朝電路之高密度化、細微化前進之印刷線路基板材 料而言’此種事態的產生係造成精度上的缺陷。 《有關於第2問題點》 第2,在第5圖之基板處理裝置1(雙面基板用)中,係於 印刷線路基板材料P之裏面F的電路形成面R上、而在第 6圖之(3)圖之基板處理裝置1(單面基板用)中則於印刷線路 基板材料P之表面Q的電路形成面R上,則指摘有分別頻 頻產生有傷痕等麻煩的問題。 首先,第5圖之基板處理裝置1(雙面基板用)係爲,在 下側之輸送裝置2之輪1 3上,係已載置、接觸、搬送有在 表面Q連同於裏面F均已具備有電路形成面R之印刷線路 基板材料P。 此外,作爲搬送僅在表面Q上具備有電路形成面R之印 刷線路基板材料P之基板處理裝置1 (單面基板用)的輸送裝 置2,如第6圖之(3)圖中所示,使輥輪3由上下接觸、壓 接至印刷線路基板材料P,以作爲夾持傳送之物來使用。 再者,搬送係與前述第6圖之(1)圖的例子相同,爲在下 側之輸送裝置2之輥輪3上藉由載置印刷線路基板材料p 來進行,不過,應可阻止前述亂流T或儲液U,如第6圖 之(3)圖中所示,亦使用有在上側已配設限制輥輪3’之基板 處理裝置1 (單面基板用)。亦即,所噴射之處理液S並非於 556459 前後方向流動,而是在上側之前後配設有壓接至印刷線路 基板材料P之電路形成面R的輥輪3,以如所期望般地朝向 左右之寬度方向W流動來使用。 然而,在該等基板處理裝置1中,藉由與上側之輥輪3、 限制輥輪3 ’、或下側之輪1 3之間的接觸、壓接,而容易 在印刷線路基板材料P之電路形成面R上產生接觸傷或擦 傷等。在表面Q或裏面F之電路形成面R之感光性防蝕層、 銅箔、電鍍、電路上,易產生壓壞、凹陷、變形等傷害。 而此種傷害等之發生,係對於朝電路之高密度化、細微 化前進之印刷線路基板而言爲形成較大的不良原因,且造 成成品率惡化的問題。特別是在模組化基板的情況下,有 鑑於將半導體構件預先呈一體的組裝至細微電路上,不良 之產生係造成極大之問題,且趨於100%之成品率的提昇 係形成爲主要目標。 《有關於本發明》 本發明之基板處理裝置係有鑑於上述實情,而用以解決 上述習知例之課題,係爲發明者深入硏究之努力的成果。 而在印刷線路基板之製造程序中,其特徵爲,將印刷線 路基板材料之表面或裏面之電路形成面以無接觸狀態進行 搬送,同時由噴射噴嘴部噴射處理液的同時,由前後的限 制液吹出部噴出限制液,以形成朝向左右寬度方向之處理 液的流路。 故而,本發明之目的爲提案一種基板處理裝置,係爲, 第1,防止亂流或儲液,以提昇印刷線路基板之精度,同 -11 - 556459 、 時,第2,防止傷害等麻煩,以大幅減少印刷線路基板之 不良。 【發明內容】 〔用以解決問題之手段〕 《有關於各申請專利範圍》 用以解決此種問題之本發明的技術性手段係如同下列所 述。首先,申請專利範圍第1項係如下所述。亦即,申請 專利範圍第1項之基板處理裝置係被使用在印刷線路基板 之製造程序。 而其特徵爲具有:輸送裝置,爲將印刷線路基板以無接 觸於電路形成面上之狀態下進行搬送;噴射噴嘴部,爲將 處理液噴射至該印刷線路基板;限制液吹出部,係將限制 液噴出至該印刷線路基板。 申請專利範圍第2項係如下所示。亦即,申請專利範圍 第2項之基板處理裝置(雙面基板用)係爲,於申請專利範 圍第1項中,該輸送裝置係爲,將在表面或裏面上具備有 該電路形成面之該印刷線路基板,在維持裏面之該電路形 成面之兩外側的同時並以水平姿勢進行搬送。 該噴射噴嘴部係被配設在所搬送之該印刷線路基板之上 下兩側,而對於該電路形成面噴射該處理液。該限制液吹 出部係爲’被配設在所搬送之該印刷線路基板材料之上下 兩側的同時,被配設在該噴射噴嘴部之前後,且對於該電 路形成面噴出該限制液者,係爲其特徵。 申請專利範圍第3項係如下所示。申請專利範圍第3項 556459 之基板處理&置(雙面基板用)係爲,於申請專利範圍第2 項中,該搬送裝置係爲,將該印刷線路基板材料連同框座 進fj Jk达而私:框座係爲,使該印刷線路基板材料之電路 形成面由中央開口露出的同時,載置、且呈固定性的維持 g亥印刷線路基板材料裏面之邊緣,而使在兩側下方上配設 有該輸送裝置之輥輪者,係爲其特徵。 申請專利範圍第4項係如下所示。亦即,申請專利範圍 第4項之基板處理裝置(單面基板用)係爲,於申請專利範 圍第1項中’該搬送裝置係爲,載置有僅在表面上具備該 電路形成面之該印刷線路基板材料,維持、接觸裏面的同 時並以水平姿勢進行搬送。 該噴射噴嘴部係被配設在所搬送之該印刷線路基板之上 側,而對於該電路形成面噴射該處理液。該限制液吹出部 係爲,被配設在所搬送之該印刷線路基板材料之上側的同 時,被配設在該噴射噴嘴部之前後,且對於該電路形成面 噴出該限制液者,係爲其特徵。 申請專利範圍第5項係如下所示。亦即,申請專利範圍 第5項之基板處理裝置係爲,於申請專利範圍第2或4項 中,該噴射噴嘴部係被配設在噴管上,而該噴管係應覆蓋 該印刷線路基板材料之全寬、且被配設在左右之寬度方向。 該限制液吹出部係被配設在限制液管上,該限制液管係應 覆蓋該印刷線路基板材料之全寬、且被配設在寬度方向的 同時,於與該噴管呈平行的搬送方向之前後形成爲被配設 成對者,係爲其特徵。 -13- 556459 申請專利範圍第6項係如下所示。亦即,申請專利範圍 第6項之基板處理裝置係爲,於申請專利範圍第5項中, 由該限制液吹出部所噴出之該限制液應具有下列機能’即, 由該噴射噴嘴部所噴射之該處理液係在該印刷線路基板材 料之電路形成面上,用以限制、防止在前後之搬送方向上 形成亂流或形成儲液等,係爲其特徵° 申請專利範圍第7項係如下所示。亦即,申請專利範圍 第7項之基板處理裝置係爲’於申請專利範圍第6項中, 由該限制液吹出部所噴出之該限制液係爲’在該印刷線路 基板材料之電路形成面上,沿著左右之寬度方向形成限制 液區域,由該噴射噴嘴部所噴射之該處理液係以夾持、限 制前後之該限制液區域,藉此而在該電路形成面上沿著寬 度方向形成流路者,係爲其特徵。 申請專利範圍第8項係如下所示。亦即,申請專利範圍 第8項之基板處理裝置係爲,於申請專利範圍第7項中, 爲該印刷線路基板材料之顯像程序、蝕刻程序、或是剝膜 程序所使用,該噴射噴嘴部係將顯像液、蝕刻液、或是剝 離液等藥液作爲該處理液來進行噴射,該限制液吹出部係 將該藥液或其他液體作爲該限制液而進行噴射者,係爲其 特徵。 申請專利範圍第9項係如下所示。申請專利範圍第9項 之基板處理裝置係爲,於申請專利範圍第7項中,爲該印 刷線路基板材料之洗淨程序所使用,該噴射噴嘴部係將水 洗劑、中和劑、其他洗淨劑作爲該處理液而進行噴射,該 -14- 556459 限制液吹出部亦將該洗淨液作爲該限制液而進行噴射者, 係爲其特徵。 申請專利範圍第1 0項係如下所示。亦即,申請專利範 圍第1 〇項之基板處理裝置係爲,於申請專利範圍第7項中, 該限制液吹出部係由在左右之寬度方向上呈直線狀的縫狀 吹出口所形成,以將該限制液呈幕狀吹出的進行噴出動作 者,爲其特徵。 申i靑專利範圍第1 1項係如下所不。亦即,申請專利範 圍第11項之基板處理裝置係爲,於申請專利範圍第7項中, 該限制液吹出部係由在左右之寬度方向上並列設置之多數 吹出孔之集合體所形成,且將該限制液以整體性的呈連續 幕狀吹出的進行噴出動作者,爲其特徵。 申請專利範圍第1 2項係如下所示。亦即,申請專利範 圍第1 2項之基板處理裝置係爲,於申請專利範圍第7項中, 係以模組化基板之製造程序所使用,該印刷線路基板材料 係爲,在電路形成面上形成有細微電路的同時,呈一體性 的裝入有半導體構件,而在事後被積層使用者,爲其特徵。 《有關於作用》 本發明係構成如上,因而形成爲如下所述。 Φ此種基板處理裝置係爲,在印刷線路基板(例如,模組 化基板)之製造程序中,爲適用於各種程序。例如,被使用 在顯像程序、蝕刻程序、剝膜程序、或是洗淨程序。 ②而印刷線路基板材料係在表面或裏面上具備有電路形 成面,藉由輸送裝置而以水平姿勢所搬送。在雙面基板用 -15- 556459 之印刷線路基板材料之情況下,係被載置於框座上,裏面 之電路形成面之兩外側爲以輸送裝置所維持。單面基板用 之印刷線路基板材料之情況下,裏面係由輸送裝置所維持。 ③而此種印刷線路基板材料係爲,因電路形成面爲在輸 送裝置上以無接觸狀態所搬送,故無在電路形成面上產生 傷害等之虞。 ©並且,相對於此種所搬送之印刷線路基板材料之電路 形成面,由噴射噴嘴部係將顯像液、蝕刻液、剝離液等藥 液、或是水洗液等洗淨液作爲處理液而噴射。噴射噴嘴部 係被配設在寬度方向之噴管上。 ⑤ 同時,限制液係由噴射噴嘴部前後之限制液吹出部而 被噴出至電路形成面上。限制液吹出部係被配設在與噴管 呈平行且形成一對的限制液管上,且藉由直線縫狀之吹出 口或呈列設之吹出孔的集合體所形成,而將限制液以幕狀 吹出。 作爲限制液,當使作爲處理液之藥液由噴射噴嘴部噴射 的情況下,雖是以使用相同種類的藥液爲具代表性,不過, 亦可使用其他之液體。另外,在使作爲處理液之水洗液或 其他洗淨液由噴射噴嘴部噴射的情況下,雖是以使用該洗 淨液爲具代表性,不過,亦可使用其他的洗淨液。 ⑥ 而被噴出至印刷線路基板材料之限制液係爲,將限制 液區域形成在電路形成面之寬度方向,因此處理液係以前 後之限制液區域所限制,而沿著寬度方向形成流路。 ⑦如此,處理液係如所期望般地,在將電路形成面於寬 556459 度方向流動、進行處理後,便由左右兩側流出、流下,而 不致形成亂流或儲液。 ⑧在此,藉由此種基板處理裝置後,針對印刷線路基板 材料之電路形成面係促進處理液之更新、阻止處理之速度 延遲、過或不足,而可實現無不均且均勻化的處理。 【實施方式】 《有關於圖面》 以下,係將本發明依據圖面所示之發明之實施例而進行 詳細說明。第1、2、3、4圖等,係提供關於本發明之基板 處理裝置之實施例之說明。 而第1圖係用以提供作爲該1例(雙面基板用)之說明,(1) 圖係爲局部側面圖’(2 )圖係爲沿者(1 )圖之J - J線剖面而由 箭頭所視之斷面圖,(3)圖係爲印刷線路基板材料或框座之 局部平面圖(底面圖)。 第2圖係用以提供作爲該其他例(單面基板用)之說明, 第2圖之(1 )圖係爲局部側面圖,(2 )圖係爲沿著(1 )圖之A -A線剖面而由箭頭所視之斷面圖,(3)圖係爲沿著(1)圖之B-B 線剖面而由箭頭所視之斷面圖,而第3圖係爲局部平面斷 面圖。 第4圖之(1)圖係爲印刷線路基板材料之電路形成面之局 部平面圖(底面圖),(2 )圖係爲限制液吹出部之1例的底面 圖(平面圖),(3)圖係爲限制液吹出部之其他例的底面圖(平 面圖)。此外,第7圖係爲印刷線路基板(材料)之平面(底面) 說明圖。 -17- 556459 《有關於印刷線路基板c》 此種基板處理裝置5係爲被使用在印刷線路基板C之製 造程序。在此,首先參照第7圖而一面槪略說明印刷線路 基板C。 印刷線路基板C係被廣泛應用在各種電子機器用上,而 具有單面基板、雙面基板、多層基板(包含有最近之疊層法 之物)等各種基板。而作爲此種印刷線路基板C之一環,亦 出現有呈一體性的組裝有1C、LSI元件、被動元件、驅動 構件、電容等半導體構件的模組化基板(半導體封裝基板)、 或是電漿顯示器PDP、液晶LCD或CSP、PBGA等的出現。 當然,在本說明書中,所謂的印刷線路基板C亦包含有如 上述之物。 而印刷線路基板C係伴隨於電子機器之高性能化、高機 能化、小型輕量化而朝向高精度化、細緻化、極薄化、多 層化等前進,且被形成在外表面、亦即爲表面Q或裏面F 之一方或是雙方,電路D之高密度化、細微化係相當顯著。 印刷線路基板C係藉由,例如縱橫方向由5 00mmx 5 00mm 程度所形成,肉厚係爲,絕緣層部分係爲1 . 0 m m〜6 0 // m 程度’電路D部分爲75//m〜35/zm,近來則是極薄化至25 μ m〜1 0 // m前後程度爲止。即使在多層基板的情況下,整 體肉厚係極薄化至1.0mm〜0.4mm程度爲止。而電路D寬 度或電路D間之空間(間隔)亦有3 5 # m〜2 5 // m程度之細微 化傾向。 印刷線路基板C係槪略形成爲如此。 -18- 556459 《關於印刷線路基板c之製造方法〉〉 接著’使用此種基板處理裝置5,針對印刷線路基板c 之製造方法進行敘述。首先,針對其第1例之製造方法進 行敘述。在第1例之製造方法中,印刷線路基板C係經由 接下來之步驟所製造。 首先,於樹脂、玻璃纖維布或陶瓷製之絕緣層(核心材 料)之外表面上’準備有將銅箔藉由熱衝壓等而張貼、作爲 貼銅積層板之印刷線路基板材料p。而通孔用之穿孔加工 係爲使用雷射等進行實施。 通孔係由印刷線路基板材料p (印刷線路基板c)之兩外 表面(表面Q與裏面F)間之貫通孔所形成,針對於1枚上 係形成有大約數百個以上極小徑値之物,其徑値係爲〇. 5 m m 〜Ο · 2mm程度以下之物爲多。而被使用以作爲兩外表面間 或多層基板之電路D間之連接用、或是被實裝至電路d之 構件的安裝用。 此外在最近’係以小突起狀之接點來作爲突塊來使用、 而取代貫通孔,因而藉由突塊,而開發出具有與貫通孔相 同之機能而無須進行穿孔加工便可實現的技術、亦開發出 Ν Μ B I方法。 而在此之後,便在印刷線路基板材料Ρ之銅箔外表面(表 面Q、裏面F之一方或雙方)上,呈膜狀塗覆或張貼感光性 光阻。爰此,將電路D之底片(naga film)作爲電路相片, 藉由進行曝光而使外表面之感光性光阻曝光、僅殘餘已硬 化之電路D形成部分,其他不要部分則藉由顯像液之噴射 -19- 556459 而溶解去除。 之後,此種印刷線路基板材料p之銅箔係爲,硬化感光 性光阻、殘留已被覆之電路D形成部分’藉由顯像而溶解 去除感光性光阻、已露出之不要部分則藉由蝕刻液(氯化 銅、氯化鐵、以及其他之腐蝕液)之噴射而溶解去除、進行 蝕刻。 自此,使殘餘之電路D形成部分之感光性光阻藉由剝離 液之噴射而剝膜去除,藉由殘留之電路D形成部分之銅箔 而在印刷線路基板材料P之外表面(表面Q、裏面F之一方 或雙方)上形成所定之電路D,藉此而製造出印刷線路基板 C 〇 此外,在上述顯像程序、蝕刻程序、剝離程序中,分別 在後處理用中附設有噴射水洗液、中和劑液、其他洗淨液 之洗淨程序,藉此而將附著在印刷線路基板材料P之外表 面上的顯像液、蝕刻液、剝離液等洗淨、除去。第1例之 製造方法係爲藉由此種濕式製程法所形成。 第1例之製造方法係形成爲如此。 其次’針對第2例之製造方法進行敘述。作爲印刷線路 基板C之製造方法,雖然已知係以上述第1例之濕式製程 法爲具代表性,不過,亦多被採用由濕式製程法所形成之 弟 2 例之半添加法(semi-additive process)。 在此種半添加法中,首先,使無電解銅電鍍實施在已預 先形成貫通孔之印刷線路基板材料P之外表面(表面Q、裏 面F之一方或雙方)上。—之後,將感光性光阻呈膜狀塗覆 -20- 556459 或是張貼至該無電解銅電路上之後,—將作爲電路D薄膜 充當爲電路寫真而進行曝光。—之後,使感光性光阻曝光 而殘留已硬化之部分,其他部分、亦即爲電路D之形成部 分係藉由顯像液之噴射而使其溶解去除。 之後,·-對於電路D形成部分、亦即爲藉由顯像而使感 光性光阻溶解去除之電鍍圖型部分、換言之爲已露出無電 解銅電鍍部分,爲用以實施電解銅電路’—而使電路D形 成。 此外,殘留已硬化之電路D形成部分以外之感光性光 阻,係藉由剝離液之噴射而剝膜去除,—已露出之無電解 銅電路係藉由蝕刻液之噴射而被快速蝕刻、溶解去除。— 此外,係附設有洗淨程序來作爲各程序之後處理之用。 在第2例之半添加法中,係藉由如此而以電解銅電路來 形成電路D,藉此製造出印刷線路基板C。第2例之製造 方法係形成爲如此。 不過,印刷線路基板C之製造方法最近係逐漸趨向多樣 化,除了上述第1例、第2例以外,仍開發、使用有各種 方法。當然,本發明亦被使用於此種各式的印刷線路基板 C之製造方法中。 印刷線路基板c之製造方法係形成爲如此。 《關於基板處理裝置5之槪要》 以下,針對本發明之基板處理裝置5,參照第1圖至第 4圖等進行詳細說明。 此種基板處理裝置5係適用於印刷線路基板C之製造程 -21 - 556459 序’雖然爲各個程序用之基板處理裝置5所使用,然而, 該等基板處理裝置5係均爲搬送印刷線路基板材料p而進 行處理。 亦即’此種基板處理裝置5係爲,被使用在上述印刷線 路基板C之製造方法之各程序中、亦即爲被使用在其顯像 程序 '蝕刻程序、剝離程序、或是洗淨程序等之中。而各 基板處理裝置5均呈共通的具有輸送裝置2、噴射噴嘴部4、 限制液吹出部6等。 亦即,爲具有:輸送裝置2,係將印刷線路基板材料p 以無接觸至表面Q之電路形成面R的狀態下進行搬送;噴 射噴嘴部4,係將處理液S噴射至印刷線路基板材料p ;限 制液吹出部6,係將限制液e噴出至印刷線路基板材料p。 《關於輸送裝置2》 首先’針對輸送裝置2進行敘述。如第1圖所示,雙面 基板用之基板處理裝置5之輸送裝置2係爲,將在表面q 與裏面F之表裏兩面具備有電路形成面r之印刷線路基板 材料P維持在裏面F之電路形成面R之兩外側,並且以水 平姿勢進行搬送。When such turbulent flow T or storage liquid U is generated, it will hinder the update of the processing liquid S 556459, and the processing speed will be delayed, over, or insufficient, which will hinder the uniformity of the processing and cause significant processing unevenness. Further, there is an obstacle in forming a uniform circuit. In the case of printed circuit board materials which are moving toward higher density and miniaturization of circuits, the occurrence of such a situation causes a defect in accuracy. "About the second problem" Second, in the substrate processing apparatus 1 (for a double-sided substrate) shown in Fig. 5, the circuit formation surface R on the back surface F of the printed circuit board material P is shown in Fig. 6 In the substrate processing apparatus 1 (for a single-sided substrate) shown in (3), on the circuit formation surface R of the surface Q of the printed circuit board material P, it is pointed out that there are problems such as frequent occurrence of scratches. First, the substrate processing apparatus 1 (for a double-sided substrate) shown in FIG. 5 is such that the wheels 13 of the lower conveying device 2 are mounted, contacted, and transported. A printed circuit board material P having a circuit formation surface R. In addition, as the conveying device 2 for conveying the substrate processing device 1 (for a single-sided substrate) having the printed circuit substrate material P provided with the circuit formation surface R only on the surface Q, as shown in FIG. 6 (3), The roller 3 is brought into contact with and pressed against the printed circuit board material P from above and below, and is used as an object to be held and conveyed. In addition, the conveyance is the same as the example in FIG. 6 (1), and is performed by placing the printed circuit board material p on the roller 3 of the lower conveying device 2; however, it is necessary to prevent the disorder As shown in (3) of FIG. 6, the flow T or the liquid storage U is also a substrate processing apparatus 1 (for a single-sided substrate) having a restriction roller 3 ′ provided on the upper side. That is, the sprayed treatment liquid S does not flow in the front-rear direction, but is provided with rollers 3 which are crimped to the circuit forming surface R of the printed circuit board material P before and after the upper side so as to face as desired. The right and left width direction W flows and is used. However, in these substrate processing apparatuses 1, contact and pressure contact with the upper roller 3, the restricting roller 3 ', or the lower roller 1 3 facilitates contact between the printed circuit board material P and the substrate. Contact damage, abrasion, and the like occur on the circuit formation surface R. On the surface Q or the inner surface of the circuit, the photosensitive anti-corrosion layer on the surface R, the copper foil, the plating, and the circuit are easy to cause damage such as crushing, dents, deformation, and the like. The occurrence of such damages is a major cause of failure for printed circuit boards that are moving toward higher density and finer circuits, and the problem that yields deteriorate. Especially in the case of a modular substrate, in view of the fact that semiconductor components are integrated into fine circuits in advance, the generation of defects causes great problems, and the improvement of 100% yield is the main goal. . << About the present invention >> The substrate processing apparatus of the present invention is a result of intensive research by the inventors in order to solve the problems of the conventional examples in view of the above-mentioned facts. In the manufacturing process of the printed circuit board, it is characterized in that the surface of the printed circuit board material or the circuit-forming surface inside is conveyed in a non-contact state, while the processing liquid is sprayed from the spray nozzle portion, and the front and rear restriction liquids are used. The blow-out portion sprays the restricting liquid to form a flow path of the processing liquid in the left-right width direction. Therefore, the object of the present invention is to propose a substrate processing device. The first is to prevent turbulence or liquid storage to improve the accuracy of printed circuit boards. The same as -11-556459, 2nd, to prevent troubles such as injury, To greatly reduce the defects of printed circuit boards. [Summary of the Invention] [Means for Solving the Problems] The technical means of the present invention for solving such problems in the "Scope of Patent Application for Each Application" are as described below. First of all, the first item of patent application scope is as follows. That is, the substrate processing apparatus of the scope of patent application No. 1 is used in a manufacturing process of a printed circuit board. It is characterized by having: a conveying device for conveying the printed circuit board without contacting the circuit formation surface; an injection nozzle section for ejecting a processing liquid onto the printed circuit board; a restricting liquid blowing section for The restriction liquid is ejected to the printed wiring board. The second item of patent application scope is shown below. That is, the substrate processing device (for double-sided substrates) in the second patent application scope is that in the first patent application scope, the conveying device is such that the circuit forming surface is provided on the surface or inside thereof. The printed wiring board is transported in a horizontal posture while maintaining both outer sides of the circuit formation surface on the inside. The spray nozzles are arranged on the upper and lower sides of the printed circuit board being conveyed, and spray the processing liquid on the circuit forming surface. The restricting liquid blowing section is the one that is disposed on the upper and lower sides of the printed circuit board material being conveyed, is disposed before and after the ejection nozzle section, and ejects the restricting liquid to the circuit forming surface, Is its characteristic. The third item of patent application scope is shown below. The substrate processing & placement (for double-sided substrate) in the scope of patent application No. 3 is 556459. In the scope of patent application scope No. 2, the conveying device is to feed the printed circuit board material together with the frame into fj Jk to reach The private: frame is to allow the circuit forming surface of the printed circuit board material to be exposed through the central opening, and to maintain and maintain the inner edge of the printed circuit board material in a fixed manner so that it is below the sides. The rollers equipped with the conveying device are its characteristics. The fourth item of patent application scope is shown below. That is, the substrate processing device (for single-sided substrates) in the scope of the patent application No. 4 is that in the first scope of the patent application, 'the transfer device is that the circuit formation surface is provided only on the surface. This printed wiring board material is conveyed in a horizontal posture while maintaining and contacting the inside. The spray nozzle unit is disposed on the printed circuit board above the conveyed circuit board, and sprays the processing liquid on the circuit forming surface. The restriction liquid blowing section is arranged on the printed circuit board material being conveyed above the conveyed circuit board material, and is arranged before and after the spray nozzle section, and the restriction liquid is sprayed on the circuit forming surface. Its characteristics. The fifth item of patent application scope is shown below. That is, the substrate processing apparatus of the scope of application for patent No. 5 is that, in the scope of the scope of application for patents No. 2 or 4, the spray nozzle unit is arranged on the nozzle, and the nozzle should cover the printed circuit. The full width of the substrate material is arranged in the left and right width directions. The restricting liquid blowing part is arranged on the restricting liquid pipe, and the restricting liquid pipe should cover the full width of the printed circuit board material and be arranged in the width direction while being transported in parallel with the nozzle. The direction is formed as a pair, which is its characteristic. -13- 556459 The 6th scope of patent application is shown below. That is, the substrate processing apparatus of the patent application scope item 6 is that, in the patent application scope item 5, the restriction liquid ejected by the restriction liquid blowing part should have the following functions, that is, the ejection nozzle part The sprayed treatment liquid is on the circuit formation surface of the printed circuit board material to restrict and prevent the formation of turbulent flow or the formation of storage liquid in the forward and backward conveying directions, which are its characteristics. As follows. That is, the substrate processing device of the seventh patent application scope is' In the sixth patent application scope, the restriction liquid ejected by the restriction liquid blowing part is' on the circuit formation surface of the printed circuit board material ' A restriction liquid region is formed along the left and right width directions, and the treatment liquid sprayed by the spray nozzle unit clamps and restricts the restriction liquid regions before and after, thereby along the width direction on the circuit formation surface. Those who form the flow path are its characteristics. The eighth item of patent application scope is shown below. That is, the substrate processing device of the eighth scope of the patent application is, in the seventh scope of the patent scope of the application, the jet nozzle is used for the development process, etching process, or peeling process of the printed circuit board material. The part sprays a chemical liquid such as a developing liquid, an etching liquid, or a peeling liquid as the processing liquid, and the restricting liquid blowing part ejects the chemical liquid or other liquid as the restricting liquid and sprays it. feature. The 9th scope of the patent application is shown below. The substrate processing device in the scope of the patent application No. 9 is used in the scope of the patent application in the seventh scope, which is used for the cleaning process of the printed circuit board material, and the spray nozzle unit is made of water detergent, neutralizer and other cleaning agents. Detergent is sprayed as the treatment liquid, and the -14-556459 restriction liquid blowing section also sprays the cleaning liquid as the restriction liquid, which is characteristic. The 10th scope of the patent application is shown below. That is, the substrate processing apparatus of the scope of application for the patent No. 10 is that, in the scope of the scope of the patent for the seventh application, the restriction liquid blowing part is formed by a slit-shaped blowing outlet that is linear in the width direction from left to right. It is characterized by a discharge operator who blows out this restriction liquid in a curtain shape. The 11th item in the patent application scope is as follows. That is, the substrate processing apparatus of the scope of patent application No. 11 is that, in the scope of patent application No. 7, the restricting liquid blowing part is formed by an assembly of a plurality of blowing holes arranged side by side in the left and right width direction. It is also characterized by a person who ejects the restriction liquid in a continuous continuous curtain. The 12th scope of the patent application is shown below. That is, the substrate processing device in the scope of patent application No. 12 is used in the scope of patent application No. 7 in the manufacturing process of modular substrates, and the printed circuit board material is on the circuit formation surface It is characterized in that a micro-circuit is formed thereon, and a semiconductor component is integrally mounted, and the user is laminated afterwards. << About the effect >> The present invention is structured as described above, and is thus formed as follows. Φ Such a substrate processing apparatus is applicable to various processes in the manufacturing process of a printed wiring board (for example, a modular substrate). For example, it is used in a development process, an etching process, a peeling process, or a cleaning process. ② The printed circuit board material is provided with a circuit-forming surface on the surface or the inside, and is conveyed in a horizontal posture by a conveying device. In the case of a printed circuit board material of -15-556459 for a double-sided substrate, it is placed on a frame base, and both outer sides of the circuit formation surface inside are maintained by a conveying device. In the case of a printed circuit board material for a single-sided substrate, the inside is maintained by a conveying device. ③ In this printed circuit board material, the circuit formation surface is transported in a non-contact state on the transmission device, so there is no risk of causing damage to the circuit formation surface. In addition, with respect to the circuit formation surface of the printed circuit board material thus conveyed, the spray nozzle unit uses a chemical liquid such as a developing liquid, an etching liquid, a peeling liquid, or a cleaning liquid such as a water washing liquid as a processing liquid. injection. The spray nozzle unit is arranged on a nozzle in the width direction. ⑤ At the same time, the restriction liquid is ejected onto the circuit formation surface from the restriction liquid blowing portion before and after the spray nozzle portion. The restricting liquid blowing part is arranged on the restricting liquid pipe which is parallel to the nozzle and forms a pair, and is formed by a linear slit-shaped blowing outlet or an assembly of blowing holes arranged in order to restrict the restricting liquid. Blow out like a curtain. As the limiting liquid, when the chemical liquid as the processing liquid is sprayed from the spray nozzle portion, it is typical to use the same type of chemical liquid, but other liquids may be used. In addition, in the case where a water washing liquid or other washing liquid as a treatment liquid is sprayed from the spray nozzle portion, the washing liquid is typically used, but other washing liquids may be used. ⑥ The restriction liquid system ejected to the printed circuit board material is such that the restriction liquid region is formed in the width direction of the circuit formation surface. Therefore, the treatment liquid system is restricted by the restriction liquid region before and after, and a flow path is formed along the width direction. In this way, the processing liquid is flowed in a direction of 556459 degrees wide as the circuit forming surface is processed as desired, and then flows out and flows down from the left and right sides without causing turbulence or storage liquid. ⑧Here, with this substrate processing device, the circuit formation surface of the printed circuit board material promotes the updating of the processing liquid and prevents the processing speed from being delayed, over, or insufficient, and can achieve non-uniform and uniform processing. . [Embodiment] "About the Drawing" Hereinafter, the present invention will be described in detail based on the embodiment of the invention shown in the drawing. Figures 1, 2, 3, 4 and the like provide descriptions of embodiments of the substrate processing apparatus of the present invention. The first figure is to provide an example (for a double-sided substrate). (1) The figure is a partial side view. '(2) The figure is a section along line J-J of (1). The sectional view viewed from the arrow, (3) is a partial plan view (bottom view) of the printed circuit board material or frame base. Figure 2 is used to provide an explanation of this other example (for a single-sided substrate). Figure 1 (1) is a partial side view, and (2) is A-A along (1) (3) is a cross-sectional view viewed by the arrow along the BB line of (1), and FIG. 3 is a partial plan cross-sectional view. (1) of FIG. 4 is a partial plan view (bottom view) of a circuit forming surface of a printed circuit board material, and (2) is a bottom view (plan view) of an example of a restricting liquid blowing part, and (3) This is a bottom view (plan view) of another example of the restriction liquid blowing part. In addition, FIG. 7 is a plan (bottom) explanatory diagram of a printed wiring board (material). -17- 556459 "Printed wiring board c" This type of substrate processing apparatus 5 is a manufacturing process used for printed wiring board C. Here, the printed circuit board C will be briefly described with reference to FIG. 7. The printed circuit board C is widely used in various electronic devices, and includes various substrates such as a single-sided substrate, a double-sided substrate, and a multilayer substrate (including the latest lamination method). As a ring of such a printed circuit board C, there is also a modular substrate (semiconductor package substrate), or a plasma, in which semiconductor components such as 1C, LSI elements, passive components, driving components, and capacitors are integrated. The emergence of display PDP, liquid crystal LCD or CSP, PBGA and so on. Of course, in this specification, the so-called printed wiring board C also includes the above-mentioned ones. The printed circuit board C is accompanied by higher performance, higher performance, smaller size, and lighter weight of electronic equipment, and is moving toward higher precision, thinner, thinner, and multilayered, and is formed on the outer surface, that is, the surface One or both of Q or F inside, the density and miniaturization of circuit D is quite remarkable. The printed circuit board C is formed by, for example, about 500 mm × 500 mm in the vertical and horizontal directions, and the thickness of the insulation layer is 1.0 mm to 6 0 // m. The degree of the circuit D portion is 75 // m. ~ 35 / zm, recently it has been extremely thinned to about 25 μm ~ 1 0 // m. Even in the case of a multilayer substrate, the overall meat thickness is extremely thinned to about 1.0 mm to 0.4 mm. The width of the circuit D or the space (interval) between the circuits D also tends to be finer than 3 5 # m ~ 2 5 // m. The printed circuit board C is formed as described above. -18- 556459 "Manufacturing method of printed circuit board c"> Next, using this substrate processing apparatus 5, the manufacturing method of printed circuit board c will be described. First, the manufacturing method of the first example will be described. In the manufacturing method of the first example, the printed wiring board C is manufactured through the following steps. First, on the outer surface of an insulating layer (core material) made of resin, fiberglass cloth, or ceramics, a printed circuit board material p is prepared by attaching a copper foil by hot stamping or the like as a copper-clad laminated board. The perforation process for through holes is performed using a laser or the like. The through-hole is formed by a through-hole between the two outer surfaces (surface Q and inner F) of the printed circuit board material p (printed circuit board c). For one piece, there are hundreds or more of extremely small diameters. The diameter of the object is more than 0.5 mm to 0 · 2 mm. It is used for the connection between the two outer surfaces or between the circuits D of the multilayer substrate, or for the mounting of a component mounted on the circuit d. In addition, recently, a small protruding contact was used as a protruding block instead of a through hole. Therefore, by using the protruding block, a technology that has the same function as a through hole without having to be perforated has been developed. Also developed the NM BI method. After that, on the outer surface (one or both of the surface Q and the inner surface F) of the copper foil of the printed circuit board material P, a photosensitive photoresist is applied or filmed. Here, the negative film of circuit D is used as the photo of the circuit. The photosensitive photoresist on the outer surface is exposed by exposure. Only the hardened circuit D remains, and the other unnecessary parts are formed by the developer. Spray -19- 556459 and dissolve and remove. Thereafter, the copper foil of the printed circuit board material p is formed by curing the photosensitive photoresist and leaving the covered circuit D to form a portion. The photosensitive photoresist is dissolved and removed by development, and the exposed unnecessary portion is removed by Etching solution (copper chloride, ferric chloride, and other corrosive solutions) is sprayed to dissolve, remove, and perform etching. From then on, the photoresist of the remaining circuit D forming portion is peeled off by spraying of the stripping solution, and the copper foil of the remaining circuit D forming portion is removed from the surface (surface Q) of the printed circuit board material P (One or both of F inside, F), thereby forming a printed circuit board C. In addition, in the above-mentioned development process, etching process, and peeling process, spray water washing is additionally provided for post-processing. The cleaning procedure of the liquid, the neutralizer liquid, and other cleaning liquids thereby cleans and removes the developing liquid, etching liquid, peeling liquid, and the like adhered to the outer surface of the printed circuit board material P. The manufacturing method of the first example is formed by such a wet process method. The manufacturing method of the first example is formed as described above. Next, the manufacturing method of the second example will be described. As the manufacturing method of the printed circuit board C, although the wet process method of the first example described above is known as a representative method, the semi-additive method of the two cases formed by the wet process method is often used ( semi-additive process). In this semi-additive method, first, electroless copper plating is performed on the outer surface (one or both of the surface Q and the back surface F) of the printed wiring board material P in which a through-hole is formed in advance. —Later, after coating the photosensitive photoresist in a film form -20- 556459 or post it on the electroless copper circuit, it will be exposed as a circuit D film as a circuit photo. -After that, the photosensitive photoresist is exposed and the hardened part remains, and the other part, that is, the forming part of the circuit D is dissolved and removed by spraying the developing solution. After that,-for the circuit D forming part, that is, the electroplating pattern part that dissolves and removes the photosensitive photoresist by development, in other words, the electroless copper plating part has been exposed, and is used to implement the electrolytic copper circuit'— Instead, the circuit D is formed. In addition, the remaining photoresist other than the hardened circuit D forming part is removed by spraying the stripping solution. The exposed electroless copper circuit is quickly etched and dissolved by spraying the etching solution. Remove. — In addition, a washing program is attached for subsequent processing of each program. In the semi-additive method of the second example, the printed circuit board C is manufactured by forming the circuit D with an electrolytic copper circuit in this manner. The manufacturing method of the second example is formed as described above. However, the manufacturing method of the printed wiring board C has recently been gradually diversified. In addition to the above-mentioned first and second examples, various methods have been developed and used. Of course, the present invention is also used in such various methods for manufacturing a printed circuit board C. The manufacturing method of the printed wiring board c is formed as described above. "About the substrate processing apparatus 5" Hereinafter, the substrate processing apparatus 5 of the present invention will be described in detail with reference to Figs. 1 to 4 and the like. This type of substrate processing device 5 is suitable for the manufacturing process of printed circuit board C. -21-556459 Sequence 'Although it is used for the substrate processing device 5 for each process, however, these substrate processing devices 5 are all printed circuit substrates. Material p. That is, 'this type of substrate processing apparatus 5 is used in each process of the above-mentioned method of manufacturing the printed wiring board C, that is, used in its development process' an etching process, a peeling process, or a cleaning process. Wait. In addition, each substrate processing apparatus 5 includes a conveying device 2, an ejection nozzle section 4, a restriction liquid blowing section 6, and the like in common. In other words, the conveying device 2 conveys the printed circuit board material p without contacting the circuit forming surface R of the surface Q; and the ejection nozzle section 4 ejects the processing liquid S onto the printed circuit board material. p; the restricting liquid blowing part 6 is for discharging the restricting liquid e to the printed circuit board material p. "About Conveying Device 2" First, the conveying device 2 will be described. As shown in FIG. 1, the conveying device 2 of the substrate processing apparatus 5 for a double-sided substrate is to maintain the printed circuit substrate material P provided with the circuit forming surface r on both the front and back surfaces of the surface q and the back surface F. Both sides of the circuit formation surface R are conveyed in a horizontal posture.
圖式例之印刷線路基板材料p係爲,連同被載置於框座 Μ之框座1 4而以輸送裝置2所搬送,框座1 4係在中央形 成有較廣之開口 1 5,爲由略呈口字狀的框板所形成。而印 刷線路基板材料P係爲,將表面Q與裏面F之電路形成面 R’藉由該開口 15而呈朝上方及下方露出之位置關係,進 以被載置於框座14上,被形成在裏面F之電路形成面R -22- 556459 外周之邊緣Υ(參照第7圖)係被載置於框座1 4上,例如爲 利用已形成階段部或所介設之帶,而呈被預先維持呈固定 並且,使輸送裝置2所旋轉驅動之輥輪1 6配設、接觸 於此種框座1 4之兩側下、亦即爲形成略呈口字狀之框座i 4 的左右兩側下。此種輥輪1 6係形成爲左右肉厚較薄之略輪 狀’而不致接觸至印刷線路基板材料p之裏面F之已露出 的電路形成面R,而將電路形成面r之左右兩外側經由框 座1 4來維持、搬送。 其次’如第2圖所示,單面基板用之基板處理裝置5之 輸送裝置2係載置有印刷線路基板材料p,接觸、維持裏 面F的同時並以水平姿勢所搬送。 亦即,在此種基板處理裝置5之處理室內,輸送裝置2 所旋轉驅動之輥輪3或輪,係被列設於朝向前後之搬送方 向v °而印刷線路基板材料P係於表面Q上形成有電路形 成面R’且在裏面F上則未形成,因此,在輸送裝置2方 面則是以無接觸狀態下進行搬送。 輸送裝置2係形成爲如此。 《關於噴射噴嘴部4》The printed circuit board material p of the illustrated example is transported by the conveying device 2 together with the frame base 14 placed on the frame base M, and the frame base 14 is formed with a wide opening 15 in the center. It is formed by a slightly rectangular frame. The printed circuit board material P is such that the surface Q and the circuit formation surface R 'of the inner F are exposed in a positional relationship upward and downward through the opening 15 and are placed on the frame base 14 and formed. The circuit-forming surface R -22- 556459 on the inside F (see Fig. 7) is placed on the frame base 14 and, for example, is formed by using the formed stage or the intervening belt. It is fixed in advance and the rollers 16 driven by the conveying device 2 are arranged in contact with the sides of such a frame base 14, that is, the left and right sides of the frame base i 4 forming a slightly rectangular shape. Down the sides. This roller 16 is formed in a slightly round shape with a thin left and right flesh, so as not to contact the exposed circuit forming surface R of the inside F of the printed circuit board material p, and the left and right outer sides of the circuit forming surface r It is maintained and transported through the frame base 14. Next, as shown in Fig. 2, the conveying device 2 of the substrate processing device 5 for a single-sided substrate is loaded with the printed wiring substrate material p, and is conveyed in a horizontal posture while contacting and maintaining the back surface F. That is, in the processing chamber of such a substrate processing apparatus 5, the rollers 3 or wheels driven by the conveying device 2 are arranged in the forward and backward conveying direction v °, and the printed wiring substrate material P is on the surface Q. Since the circuit formation surface R 'is formed and not formed on the back surface F, the conveying device 2 is conveyed in a non-contact state. The conveying device 2 is formed as described above. << About the spray nozzle part 4 >>
其次,針對噴射噴嘴部4進行敘述。此種基板處理裝置 5之噴射噴嘴部4係爲,對於所搬送之印刷線路基板材料P 而言’在第1圖之雙面基板用之基板處理裝置5中爲呈對 @配置在其上側與下側,在第2圖之單面基板用之基板處 理裝置5中則呈對向配置在上側,且對於表面Q或裏面F -23- 556459 , 之電路形成面R而言,將處理液S在圖式例中爲以斜向噴 射。 而圖式例之噴射噴嘴部4係爲,對於搬送方向V爲朝向 左右之寬度方向W(左方向或右方向)的同時,被配設呈以 朝向左方向或右方向之任一方傾斜之傾斜角度。亦即,此 種噴射噴嘴部4係被固定在斜向於左右之寬度方向W之噴 射角度,已噴射之處理液S係爲,斜向於左方向或右方向、 且被噴射至印刷線路基板材料P。 此外,此種噴射噴嘴部4係爲,在被用於顯像程序的情 況下係將顯像液作爲處理液S而進行噴射,而在被用於蝕 刻程序的情況下則將蝕刻液作爲處理液S而進行噴射,在 被用於剝膜程序的情況下爲將剝離液作爲處理液S而進行 噴射,在被用於洗淨程序的情況下,則是將水洗液、中和 劑液、其他洗淨液作爲處理液S而進行噴射。 針對此種噴射噴嘴部4進行更加詳細之描述。如第1圖 至第3圖所示,在基板處理裝置5之處理室內,噴管7對 於印刷線路基板材料P爲存有所定高度之間隔,在第1圖 之例中係被配設在上下兩側,而在第2圖之例中則被配設 在上側。 同時,在上側或下側中之噴管7,係應覆蓋印刷線路基 板材料P之全幅寬度,在沿著左右之寬度方向W而被配設 的同時,多根係於前後之搬送方向V上存有前後間隔、且 被呈多段的配設。 而在此種噴管7中,爲使噴射噴嘴部4配設至朝印刷線 -24- 556459 ▲ 路基板材料p對向面(下面或上面)上,在圖式例中,呈多 段被配設在搬送方向V上之噴管7,均是被配設呈依次交 互地形成於左方向之物與傾斜於右方向之物。例如,在第 1根噴管7方面爲使用朝左方向傾斜之噴射噴嘴部4,在第 2根噴管7方面爲使用朝右方向傾斜之噴射噴嘴部4,在第 3根噴管7方面爲使用朝左方向傾斜之噴射噴嘴部4,在第 4根噴管7方面爲使用朝右方向傾斜之噴射噴嘴部4,以下 則依此形式重複。 此外,作爲噴射噴嘴部4,係採用如第3圖所示之列設 於寬度方向W之多數吹出孔之集合體形式、或是未於圖式 中所揭示之例,而採用於寬度方向W呈直線狀之1根縫狀 吹出口形式之物。 而處理液S係如第1圖至第3圖等所示,當使其由處理 液配管8朝各噴管7壓送後,—便由已傾斜之各噴管7之 噴射噴嘴部4、朝向以水平姿勢所搬送之印刷線路基板材 料P進行噴射。在此,—處理液S係如第4圖之(1)所示, 將其表面Q或裏面F之電路形成面R朝向右方向或左方向 之寬度方向W流動後,—便由左右之兩側流出、流下,-朝向下部之液槽而被回收。—在液槽中被回收之處理液S 係爲,—事後以泵浦朝處理液配管8壓送、用以循環使用。 此外,被噴射至裏面F之電路形成面R的處理液S,雖 藉由重力而將若干量直接朝下方流下,不過,大部分係如 所期望般地,爲藉由噴射壓而將電路形成面R朝向左右之 寬度分向W流動後,便到達兩側,藉由噴射壓以抗拒重力 -25- 556459 而流下。 噴射噴嘴部4係形成爲如此。 《關於限制液吹出部6》 其次,針對限制液吹出部6進行描述。此種基板處理裝 置5之限制液吹出部6係爲,對於所搬送之印刷線路基板 材料P,在第1圖之雙面基板用之基板處理裝置5方面係 被對向配置在其上側與下側,而在第2圖之單面基板用之 基板處理裝置5方面則被對向配置在上側。 此外,此種限制液吹出部6係爲在上側或下側中,被配 設在後述之噴射噴嘴部4之前後的同時,爲對於印刷線路 基板材料P之表面Q或裏面F之電路形成面R來噴出限制 液E。並且所噴出之限制液e係如第4圖之(丨)所示,針對 於印刷線路基板材料P之電路形成面R,爲形成沿著寬度 方向W之限制液區域G。 在此,由噴射噴嘴部4所噴射之處理液s係以此種前後 之限制液區域G所夾持、限制,進而在電路形成面R中沿 著寬度方向W而形成流路η。從而,處理液s係以印刷線 路基板材料Ρ之電路形成面R來限制、防止在搬送方向V 上形成亂流T、儲液U等(參照第5圖之(丨)圖、第6圖之(!) 圖、(2)圖等)。 針對此種限制液吹出部6進行更詳細的描述。如第丨圖 至第3圖所示,在基板處理裝置5之處理室內,限制液管 9係對於印刷線路基板材料p存有所定高度之間隔(而藉以 由則述噴管7而較靠近印刷線路基板材料ρ之高度位準), 556459 在第1圖之例中係被配設於上下兩側,在第2圖之例中則 被配設於上側。 同時,限制液管係在上側或下側中,應被覆印刷線路基 板材料P之全幅寬度,且使其沿著寬度方向W所配設的同 時,被配設在與噴管7呈平行之搬送方向V之前後。亦即, 限制液管9係以2根爲1組所形成,且呈平行地被配設在 噴管7之前後。 而在此種各限制液管9中,在朝向印刷線路基板材料P 之對向面(上面或下面)上,係分別配設有限制液吹出部6。 作爲限制液吹出部6係如第3圖或第4圖之(2)所示,爲由 沿著寬度方向W而呈直線狀之1根縫狀吹出口 1 0所形成, 以將限制液E呈幕狀吹出、噴出之形式之物,或是如第4 圖之(3)圖所示,爲由在寬度方向W呈直線性列設之吹出孔 1 1之集合體所形成,而將限制液E於整體性地呈連續的作 爲幕狀而吹出、噴出之形式之物。 不過,作爲此種限制液E係採用有接下來之液體。首先, 當基板處理裝置5爲顯像程序、蝕刻程序、或是剝膜程序 等所使用的情況下,便由其噴射噴嘴部4將顯像液、蝕刻 液、或是剝離液等藥液作爲處理液S所噴射。而在此情況 下,係採用已對應之其藥液、亦即爲顯像液、蝕刻液、或 是剝離液(亦即爲與處理液S相同之液體)來作爲限制液E, 進而由限制液吹出部6所噴出。不過,亦可不採用於此, 而將其他藥液、甚至是將水洗液等其他洗淨液等液體作爲 限制液E來使用,來進行噴出動作。 556459 , 此外,在使用顯像液、蝕刻液、或是剝離液等藥液(亦 即爲與處理液S相同之液體)來作爲限制液e之情況下,爲 採用下列構造,即,由在液槽中爲經由泵浦所連接之處理 液配管8之途中而分歧限制液E用之限制液配管1 2,朝限 制液管9以及限制液吹出部6連接之構造。在此情況下, 使用過之限制液E爲與前述使用過之處理液S —同被回收 至液槽中以循環使用。作爲限制液E,而在使用其他液體 的情況下則不限於此,爲使用其他手段而使限制液E朝限 制液配管1 2壓送、供給。 其次,當基板處理裝置5以洗淨程序所使用的情況下, 係由其噴射噴嘴部4將水洗液或其他洗淨液作爲處理液S 所噴射。而在此情況下,爲採用已對應之其洗淨液(亦即爲 相同液體)來作爲限制液E,藉此而由限制液吹出部6所噴 出。不過亦可不採用此種方式,而將其他種類之洗淨液作 爲限制液E來使用,以進行噴出動作。 此外,針對於在使用相同液體的情況下、或是關於其他 情況之配管構造之藥液爲作爲限制液E所使用的情況下, 係以上述內容爲基準,故而省略說明。此外,在將洗淨液 作爲限制液E所使用的情況下,使用過之限制液E或處理 液S並非被回收、循環使用,而是以將其形成廢液者佔較 多數。Next, the injection nozzle unit 4 will be described. The ejection nozzle portion 4 of such a substrate processing apparatus 5 is such that the printed circuit board material P to be conveyed is arranged in a pair @ on the upper side of the substrate processing apparatus 5 for a double-sided substrate shown in FIG. 1 and On the lower side, the substrate processing apparatus 5 for a single-sided substrate shown in FIG. 2 is disposed on the upper side in an opposite direction, and for the circuit formation surface R of the surface Q or the inner surface F -23- 556459, the processing liquid S In the illustrated example, the injection is performed in an oblique direction. In contrast, the injection nozzle portion 4 in the figure is arranged so that the conveying direction V is a width direction W (left or right) toward the left and right, and is arranged to be inclined toward either the left or right direction. angle. That is, the spray nozzle portion 4 is fixed at a spray angle obliquely to the width direction W of the left and right, and the sprayed treatment liquid S is slanted to the left or right and is sprayed onto the printed circuit board. Material P. In addition, the spray nozzle unit 4 sprays a developing solution as the processing solution S when used in a developing program, and uses an etching solution as a processing when used in an etching program. The liquid S is sprayed. In the case of being used in a peeling process, the peeling liquid is sprayed as the treatment liquid S. In the case of being used in a washing process, a water washing liquid, a neutralizer liquid, The other cleaning liquid is sprayed as the processing liquid S. The spray nozzle portion 4 will be described in more detail. As shown in FIGS. 1 to 3, in the processing chamber of the substrate processing apparatus 5, the nozzles 7 are arranged at a predetermined height for the printed circuit substrate material P. In the example of FIG. 1, the nozzles 7 are arranged above and below. Both sides are arranged on the upper side in the example in FIG. 2. At the same time, the nozzles 7 in the upper or lower side should cover the full width of the printed circuit board material P. While being arranged along the left and right width direction W, a plurality of nozzles 7 are arranged in the forward and backward conveying direction V. There is a multi-segment arrangement with back and forth intervals. In this type of nozzle 7, the spray nozzle portion 4 is arranged to face the printing line -24- 556459 ▲ road substrate material p opposite surface (lower or upper surface). In the example of the figure, it is arranged in multiple stages. The nozzles 7 provided in the conveying direction V are all objects arranged to be alternately formed in the left direction and objects inclined in the right direction in this order. For example, the first nozzle 7 uses an injection nozzle portion 4 inclined to the left, the second nozzle 7 uses an injection nozzle portion 4 inclined to the right, and the third nozzle 7 In order to use the injection nozzle portion 4 inclined to the left, the fourth nozzle 7 is to use the injection nozzle portion 4 inclined to the right, and the following is repeated in this manner. In addition, as the injection nozzle portion 4, an assembly form of a plurality of blowout holes arranged in the width direction W as shown in FIG. 3 or an example not disclosed in the drawing is adopted, and the width direction W is adopted. It is a straight slit-shaped blowout. The processing liquid S is shown in Figs. 1 to 3, etc. When the processing liquid S is pressure-fed from the processing liquid pipe 8 to the nozzles 7, the nozzles 4 and 4 of the nozzles 7 are tilted. It sprays toward the printed wiring board material P conveyed in a horizontal attitude. Here, as shown in (1) in FIG. 4, the treatment liquid S flows the circuit formation surface R on the surface Q or the inner surface F toward the right or left width direction W, and then the left and right Side outflow and downflow,-collected towards the lower tank. —The treatment liquid S recovered in the liquid tank is as follows——Afterwards, it is pumped to the treatment liquid pipe 8 by a pump for recycling. In addition, although the processing liquid S sprayed onto the circuit formation surface R on the inside F directly flows downward by a certain amount by gravity, most of the processing liquid S is formed by spraying pressure as expected. After the surface R flows toward the left and right widths and flows toward W, it reaches both sides, and flows down by resisting gravity -25-556459 by spray pressure. The injection nozzle portion 4 is formed as described above. << About the restriction liquid blowing part 6 >> Next, the restriction liquid blowing part 6 is demonstrated. The restricting liquid blowing section 6 of the substrate processing apparatus 5 is such that the printed circuit board material P to be transported is disposed opposite to the substrate processing apparatus 5 for the double-sided substrate shown in FIG. 1 on the upper side and the lower side. On the other hand, the substrate processing apparatus 5 for a single-sided substrate shown in FIG. 2 is disposed opposite to the upper side. In addition, such a restricting liquid blowing section 6 is arranged on the upper side or the lower side, and is arranged before and after the spray nozzle section 4 to be described later, and is a circuit forming surface for the surface Q or the back F of the printed wiring board material P. R to spray the restriction liquid E. In addition, as shown in FIG. 4 (丨), the ejection of the restriction liquid e is for the circuit formation surface R of the printed circuit board material P to form a restriction liquid region G along the width direction W. Here, the processing liquid s ejected from the ejection nozzle section 4 is held and restricted by the restriction liquid region G before and after such, and a flow path η is formed along the width direction W in the circuit formation surface R. Therefore, the treatment liquid s is restricted by the circuit formation surface R of the printed circuit board material P to prevent the formation of a turbulent flow T, a storage liquid U, and the like in the conveying direction V (refer to FIG. 5 (丨), FIG. 6 (!) Diagram, (2) diagram, etc.). The restriction liquid blowing section 6 will be described in more detail. As shown in FIG. 丨 to FIG. 3, in the processing chamber of the substrate processing device 5, the restricting liquid pipe 9 is spaced at a predetermined height for the printed circuit substrate material p (and the nozzle 7 is closer to the printing by this The height level of the circuit board material ρ), 556459 is arranged on the upper and lower sides in the example in FIG. 1 and is arranged on the upper side in the example in FIG. 2. At the same time, the liquid pipe is restricted in the upper side or the lower side, and it should cover the full width of the printed circuit board material P and be arranged along the width direction W, and it is arranged to be transported in parallel with the nozzle 7 Direction V before and after. In other words, the restricting liquid pipes 9 are formed in groups of two, and are arranged in front of and behind the nozzles 7 in parallel. In each of the restricting liquid pipes 9 described above, the restricting liquid blowing portions 6 are respectively provided on the facing surfaces (upper or lower) facing the printed wiring board material P. As the restricting liquid blowing part 6, as shown in (2) of FIG. 3 or FIG. 4, the restricting liquid E is formed by a slit-shaped blowing port 10 that is linear in the width direction W. Objects that are blown out or ejected in the form of a curtain, or as shown in (3) of FIG. 4, are formed by a collection of blowout holes 11 arranged linearly in the width direction W, and will be limited. Liquid E is continuously blown out and ejected as a curtain. However, as the limiting liquid E, the following liquid is used. First, when the substrate processing apparatus 5 is used in a development program, an etching program, or a peeling program, the spray nozzle portion 4 uses a chemical solution such as a developing liquid, an etching liquid, or a peeling liquid as the liquid. The treatment liquid S is sprayed. In this case, the corresponding corresponding chemical liquid, that is, a developing liquid, an etching liquid, or a stripping liquid (that is, the same liquid as the processing liquid S) is used as the limiting liquid E. The liquid blowing portion 6 is discharged. However, instead of using this, other liquid medicines, or even other washing liquids such as water washing liquids, may be used as the restriction liquid E to perform the ejection operation. 556459, In addition, in the case of using a chemical liquid such as a developing liquid, an etching liquid, or a peeling liquid (that is, the same liquid as the processing liquid S) as the limiting liquid e, the following structure is adopted, that is, The liquid tank has a structure in which the restriction liquid pipe 12 for the restriction liquid E is diverged through the processing liquid pipe 8 connected to the pump, and is connected to the restriction liquid pipe 9 and the restriction liquid blowing section 6. In this case, the used restriction liquid E is recovered to the liquid tank in the same manner as the previously-used treatment liquid S for recycling. The restriction liquid E is not limited to the case of using other liquids, and the restriction liquid E is pressure-fed and supplied to the restriction liquid pipe 12 in order to use other means. Next, when the substrate processing apparatus 5 is used in a cleaning program, the spray nozzle portion 4 sprays a water washing liquid or other cleaning liquid as the processing liquid S. In this case, in order to use the corresponding cleaning liquid (that is, the same liquid) as the restricting liquid E, the restricting liquid blowing section 6 ejects it. However, instead of using this method, another type of cleaning liquid can be used as the restricting liquid E to perform the ejection operation. In addition, in the case where the same liquid is used or the chemical liquid of the piping structure in other cases is used as the restricting liquid E, the above contents are used as a reference, so the description is omitted. When the cleaning solution is used as the restriction solution E, the used restriction solution E or the treatment solution S is not recovered and recycled, but a majority of them are formed into a waste solution.
並且,以泵浦等所加壓之限制液E係爲,—經由限制液 配管1 2而朝各限制液管9所壓送。—自此,限制液E係由 各限制液管9之限制液吹出部6朝向印刷線路基板材料P 556459 進行噴出。—限制液E係形成膜狀而對於印刷線路基板材 料P爲,在第1圖之例中,係被噴出至表面Q與裏面F之 電路形成面R,在第2圖之例中則是被噴出至裏面F之電 路形成面R。 亦即,—在印刷線路基板材料P之上位空間或下位空間 中,於噴射噴嘴所噴射之處理液S前後,爲形成有由兩限 制液吹出部6所吹出之限制液E之膜。 並且,—已到達印刷線路基板材料P之電路形成面r的 限制液E係爲,—如第4圖之(1)圖所示,在第1圖之例中, 爲在表面Q之電路形成面R上與裏面F之電路形成面R之 正下方,分別沿著具有前後一定寬度之左右寬度方向W來 形成限制液區域G,在第2圖之例中,爲在表面Q之電路 形成面R上,沿著具有前後一定寬度之左右寬度方向W來 形成限制液區域G。->亦即,將已噴射之1道噴射區域之 處理液S夾入其中,在其前後形成有2道之限制液區域G。 在此,—於印刷線路基板材料P之表面Q或裏面F之電 路形成面R中,爲藉由噴射區域之處理液S而形成有沿著 左右之寬度方向W的流路Η,—處理液S係爲,流路Η寬 度爲被限制呈一定,爲朝向左方向或右方向與左右兩側流 動。此外,作爲限制液Ε,係爲使用40°C〜50°C程度之熱 限制液者、例如爲形成與蝕刻液之溫度略呈同溫狀者較佳。 限制液吹出部6係形成爲如此。 《關於作用等》 有關本發明之基板處理裝置5係如以上說明所構成。在 -29- 556459 此,係形成如下。 此種基扳處理裝置5係爲被印刷線路基板C之製造程序 所使用,且將印刷線路基板P進行搬送、處理。例如,爲 被模組化基板之製造程序所使用,且在電路形成面R上除 了細微電路還組裝有半導體構件,以提供爲在事後呈多段、 多層所積層使用之印刷線路基板C之製造。 ① 首先,此種基板處理裝置5係爲,被使用在印刷線路 基板C之製造程序之各程序,例如爲被使用在顯像程序、 蝕刻程序、剝膜程序、洗淨程序。 ② 而被投入、供給至基板處理裝置5之印刷線路基板材 料P係由雙面基板用或單面基板用所形成,藉由輸送裝置 而以水平姿勢所搬送。 亦即,在第1圖之雙面基板用之基板處理裝置5中,在 表面Q(上面)或裏面F(下面)上具備有電路形成面R之印刷 線路基板材料P爲被載置於框座14,裏面F(下面)之電路 形成面R之兩外側爲以輸送裝置2之輥輪1 6所維持。此 外’在第2圖之單面基板用之基板處理裝置5中,在表面 Q(_h面)上具備電路形成面R之印刷線路基板材料P爲被載 置於有輸送裝置2之輥輪3上,且使其裏面F(下面)接觸、 維持。 也就是,在該等輸送裝置2中,爲接觸、壓接至印刷線 路基板材料P之表面Q或裏面F之電路形成面R,且不採 用輪1 3 (參照第5圖)、按壓用輥輪3、或是處理液s之流 動限制輥輪V(參照第6圖之(3)圖)等。 556459 , ③ 如此,在此種基板處理裝置5中,印刷線路基板材料 P係爲,表面Q或裏面F之電路形成面R係對於輸送裝s 2爲以無接觸狀態下所搬送。在此,對於電路形成面R係 不致有產生與輸送裝置2之間的接觸傷或擦傷等麻煩& 虞。而在電路形成面R之感光性光阻、銅箔、電鍍、電足各 D等之上,係不會產生壓壞、凹陷、變形等傷害。 ④ 而在此種基板處理裝置5中,對於如此所搬送之印刷 線路基板材料P,爲使處理液S由噴射噴嘴部4所噴射。 噴射噴嘴部4係被配設在印刷線路基板材料P之上側m 下側,且將處理液S對於電路形成面R進行噴射。例如, 將顯像液、蝕刻液、剝離液等藥液或是水洗液之其他洗淨 液作爲處理液S來進行噴射。 而噴射噴嘴部4係被配設在噴管7上,噴管7係被配設 在印刷線路基板材料P之左右寬度方向W上,此種附噴射 噴嘴部4之噴管7係爲,在前後之搬送方向V上存有間隔 而被配設呈多段。 ⑤ 同時,在此種基板處理裝置5中,係採用有將限制液 E噴出至印刷線路基板材料P上之限制液吹出部6。 此種限制液吹出部6係被配設在所搬送之印刷線路基板 材料P之上側或下側的同時,亦被配設在噴射噴嘴部4之 前後,且將限制液E噴出至印刷線路基板材料P之電路形 成面R。 而限制液吹出部6係被配設在限制液管9上,限制液管 9係被配設在印刷線路基板材料P之寬度方向W上的同時, -31 - 556459 與噴管7呈平行、並成對配設在噴管7之前後。而此種附 限制液吹出部6之限制液管9係以2根爲1組,於搬送方 向V上存有間隔而呈多段配設。 此外,限制液吹出部6係由縫狀吹出口 1 0形式(參照第 3圖、4圖之(2)圖)、或是由吹出口 Π之集合體形式(參照 第4圖之(3))所形成,而呈幕狀的吹出、噴出限制液E。 作爲此種限制液E,在由噴射噴嘴部4噴射作爲處理液 S之藥液的情況下、亦即將基板處理裝置5使用在顯像程 序、蝕刻程序、剝膜程序等情況下以代表性的使用該藥液, 不過亦可使用其他液體。另外,由噴射噴嘴部4噴射作爲 處理液S之水洗液之其他洗淨液的情況下、亦即將基板處 理裝置5使用在洗淨程序的情況下,係採用該洗淨液或其 他洗淨液以作爲限制液E。 ⑥而在此種基板處理裝置5中,所噴出之限制液E係針 對於印刷線路基板材料P之電路形成面R,而沿著寬度方 向W形成限制液區域G(參照第4圖之(1)圖)。 亦即,在雙面基板用之基板處理裝置5之情況下(參照 第1圖),爲使限制液區域G分別形成在印刷線路基板材料 P之表面Q之電路形成面R上、以及裏面F之電路形成面 R之正下方。在單面基板用之基板處理裝置5之情況下(參 照第2圖),爲使限制液區域G形成在表面Q之電路形成 面R上。In addition, the restriction liquid E pressurized by a pump or the like is pressure-fed to the respective restriction liquid pipes 9 through the restriction liquid pipes 12. — Since then, the restricting liquid E is ejected from the restricting liquid blowing portion 6 of each restricting liquid pipe 9 toward the printed circuit board material P 556459. —The restriction liquid E is formed into a film shape. For the printed circuit board material P, in the example of FIG. 1, the circuit formation surface R is ejected to the surface Q and the back F, and in the example of FIG. 2, it is The circuit forming surface R ejected to the inside F. That is, in the upper space or lower space of the printed circuit board material P, the film of the restriction liquid E blown by the two restriction liquid blowing portions 6 is formed before and after the treatment liquid S sprayed by the spray nozzle. Moreover, the restricting liquid E which has reached the circuit formation surface r of the printed circuit board material P is, as shown in (1) of FIG. 4. In the example of FIG. 1, the circuit is formed on the surface Q. The circuit forming surface on the surface R and the surface F are directly below the surface R, and the restricted liquid region G is formed along the width direction W with a certain width in the front and back. In the example in FIG. 2, the circuit is formed on the surface Q. On R, a restricted liquid region G is formed along a left-right width direction W having a constant width from front to back. -> That is, the treatment liquid S of one shot area that has been sprayed is sandwiched therein, and two-line restriction liquid area G is formed before and after it. Here, —on the circuit formation surface R of the printed circuit board material P on the surface Q or the inner surface F, a flow path 沿着 along the width direction W of the left and right is formed by the treatment liquid S in the spray region, and the treatment liquid In the S system, the width of the flow path 为 is restricted to be constant, and flows toward the left or right direction and the left and right sides. In addition, as the limiting liquid E, a thermal limiting liquid having a temperature of about 40 ° C to 50 ° C is used, and for example, it is preferably formed at a temperature almost equal to the temperature of the etching liquid. The restriction liquid blowing portion 6 is formed as described above. << About Actions >> The substrate processing apparatus 5 related to the present invention is configured as described above. At -29- 556459, the system is formed as follows. This type of substrate processing device 5 is used in the manufacturing process of the printed wiring board C, and the printed wiring board P is transported and processed. For example, it is used for a manufacturing process of a modular substrate, and semiconductor components are assembled in addition to fine circuits on the circuit formation surface R to provide the manufacture of a printed circuit board C used in a multi-stage, multi-layer buildup afterwards. ① First, such a substrate processing apparatus 5 is a process used in a manufacturing process of a printed circuit board C, for example, it is used in a development process, an etching process, a peeling process, and a cleaning process. ② The printed wiring board material P, which is fed into and supplied to the substrate processing apparatus 5, is formed of a double-sided substrate or a single-sided substrate, and is conveyed in a horizontal posture by a conveying device. That is, in the substrate processing apparatus 5 for a double-sided substrate shown in FIG. 1, the printed circuit substrate material P having the circuit formation surface R on the surface Q (upper surface) or the back surface F (lower surface) is placed on a frame. The seat 14 and the two outer sides of the circuit formation surface R on the inside F (lower side) are maintained by the rollers 16 of the conveying device 2. In addition, in the substrate processing apparatus 5 for a single-sided substrate shown in FIG. 2, the printed circuit board material P having the circuit formation surface R on the surface Q (_h surface) is the roller 3 placed on the conveying device 2. Up, and keep the inside F (bottom) in contact. That is, in these conveying devices 2, the circuit formation surface R is in contact with or crimped to the surface Q or the back surface F of the printed circuit board material P, and the wheels 1 3 (see FIG. 5) and pressing rollers are not used. The wheel 3, or the flow restricting roller V of the processing liquid s (refer to FIG. 6 (3)) and the like. 556459, ③ In this way, in this type of substrate processing apparatus 5, the printed circuit board material P is the circuit forming surface R on the surface Q or the back F, and is conveyed in a non-contact state with respect to the conveying device s 2. Here, the circuit formation surface R is free from any trouble & The photoresist, copper foil, electroplating, and electric foot D on the circuit formation surface R will not cause damage such as crushing, dents, deformation, etc. ④ In such a substrate processing apparatus 5, the processing liquid S is ejected from the ejection nozzle section 4 with respect to the printed wiring board material P thus conveyed. The spray nozzle portion 4 is disposed on the printed circuit board material P above the lower side m, and sprays the processing liquid S on the circuit formation surface R. For example, a chemical liquid such as a developing liquid, an etching liquid, a peeling liquid, or another cleaning liquid such as a water washing liquid is sprayed as the processing liquid S. The injection nozzle portion 4 is arranged on the nozzle 7 and the nozzle 7 is arranged on the left and right width direction W of the printed circuit board material P. The nozzle 7 with the injection nozzle portion 4 is as follows: There are intervals in the forward and backward conveying direction V, and they are arranged in multiple stages. ⑤ At the same time, in this type of substrate processing apparatus 5, a restriction liquid blowing section 6 that ejects the restriction liquid E onto the printed wiring substrate material P is used. Such a restricting liquid blowing section 6 is arranged on the upper or lower side of the printed circuit board material P being conveyed, and is also arranged before and after the ejection nozzle section 4 and discharges the restricting liquid E to the printed circuit board. The circuit of material P forms a surface R. The restricting liquid blowing section 6 is arranged on the restricting liquid pipe 9. The restricting liquid pipe 9 is arranged in the width direction W of the printed circuit board material P, and -31-556459 is parallel to the nozzle 7. They are arranged in pairs before and after the nozzle 7. On the other hand, the restricting liquid pipes 9 with the restricting liquid blowing section 6 are arranged in a plurality of sections with two spaces as a group, and there are spaces in the conveying direction V. In addition, the restricting liquid blowing part 6 is formed by a slit-shaped blowing port 10 (refer to FIG. 3 and FIG. 4 (2)) or an assembly form of the blowing port Π (refer to FIG. 4 (3)). ), And the curtain-shaped discharge and discharge restriction liquid E is formed. As such a limiting liquid E, when the chemical liquid as the processing liquid S is sprayed from the spray nozzle section 4, that is, when the substrate processing apparatus 5 is used in a development program, an etching program, a peeling program, etc., it is representative. This solution is used, but other liquids can also be used. In addition, when other cleaning liquids, which are water washing liquids of the processing liquid S, are sprayed from the spray nozzle unit 4, that is, when the substrate processing apparatus 5 is used in a cleaning program, the cleaning liquid or other cleaning liquid is used. Let's use it as the limiting liquid E. ⑥ In this type of substrate processing apparatus 5, the discharged restriction liquid E is directed to the circuit formation surface R of the printed circuit board material P, and a restriction liquid region G is formed along the width direction W (refer to FIG. 4 (1) ) Figure). That is, in the case of the substrate processing apparatus 5 for a double-sided substrate (refer to FIG. 1), the restricted liquid regions G are formed on the circuit formation surface R and the back surface F of the surface Q of the printed circuit substrate material P, respectively. The circuit formation plane R is directly below. In the case of the substrate processing apparatus 5 for a single-sided substrate (see Fig. 2), the restricted liquid region G is formed on the circuit formation surface R of the surface Q.
在此,所噴射之噴射區域之處理液S係爲,以夾持前後 之限制液區域G而藉此在表面Q或裏面F之電路形成面R -32- 556459 * 1 中使流動受到限制,進而將前後幅度限制呈一定,且沿著 寬度方向W形成流路Η而進行流動。藉此來阻止、限制亂 流Τ或儲液υ(參照第6圖之(2)圖等)之產生。 此外,在第1圖之雙面基板用之基板處理裝置5的情況 下’在將上下限制液吹出部6經由印刷線路基板材料ρ而 於上下呈對向放置後,藉由來自上下呈均等壓力所噴出的 限制液Ε之噴出壓力而形成可使搬送中之印刷線路基板材 料Ρ可藉由正確的水平姿勢而維持、定位。藉此防止其撓 曲、彎曲、蛇行、彈跳、脫落等,而具有可確保順暢、穩 疋之搬送的優點。 此外,在第2圖之單面基板用之基板處理裝置5的情況 下,藉由限制液Ε之噴出壓力而將搬送中之印刷線路基板 材料Ρ朝向下側之輸送裝置2按壓。藉此防止其撓曲、彎 曲、蛇行、彈跳、脫落等,而具有可確保順暢、穩定之搬 送的優點。在此,於此種基板處理裝置5中,如前述之此 種習知例之單面基板用之基板處理裝置1(參照第6圖之(1) 圖)所示,係未採用上側之輥輪3,而印刷線路基板材料Ρ 係形成爲表面Q(上面)之電路形成面R爲對於輸送裝置2 以無接觸之狀態下來進行搬送。 ⑦如此,在此種基板處理裝置5中,噴射區域之處理液 S係爲,將印刷線路基板材料Ρ之電路形成面R強制性、 且確實地以所期望之規則性而朝向寬度方向W流動、處理 後,由印刷線路基板材料Ρ之左右兩側流出、流下、回收(參 照第4圖之(1 )圖)。 -33- 556459 在第1圖之例中’處理液S係爲,對應於已將表面Q之 電路形成面R上與裏面F之電路形成面r之正下方傾斜的 噴射噴嘴部4,在朝右方向或左方向流動後便由兩側流下。 在第2圖之例中,對應於已傾斜表面Q之電路形成面R上 的噴射噴嘴部4,而在朝右方向或左方向流動後便由兩側 流下。 藉此’處理液S係於電路形成面R上散亂,而確實防止 在朝向搬送方向V上形成亂流T、或是在電路形成面R之 中央部上形成儲液U造成滞留(參照第5圖之(1)圖、第6 圖之(1)圖、(2)圖等)。 ⑧ 藉此,針對印刷線路基板材料P之表面Q或裏面F之 電路形成面R,爲促進處理液S之更新,而阻止處理之速 度延遲、過或不足之處的產生。 例如,若發生有亂流T或儲液U時,以藥液來進行化學 處理的情況下,在處理速度上將產生差値,且產生化學處 理延遲、不足處、以及產生化學處理有形成超過、過度之 處,而在所形成之電路D寬度上係產生過或不足、誤差、 不均等。此外,在以洗淨液洗淨的情況下,洗淨本體將無 法順暢地實施。不過,在本發明中,係可迴避該等事態的 產生。 如此,實現可進行無處理不均、且整體呈均勻化的處理。 ⑨ 不過,使用此種基板處理裝置5所製造之印刷線路基 板C,係由在表面Q與裏面F上形成有電路D之雙面基板、 或是在表面Q上形成有電路D之單面基板所形成。 -34- 556459 t 而此種印刷線路基板c係可沿襲如上的來使用,不過亦 可將另行所製造之雙面基板或單面基板同時以多段、多層 來積層,爲作爲例如模組化基板來使用。 〔發明之效果〕 《本發明之特徵》 有關本發明之基板處理裝置係如上述說明所述,在印刷 線路基板之製造程序中,其特徵在於,將印刷線路基板材 料之表面或裏面之電路形成面以無接觸狀態下進行搬送的 同時,將處理液由噴射噴嘴部進行噴射,同時,將限制液 由前後之限制液吹出部噴出,以形成朝向左右寬度方向之 處理液的流路。 在此,本發明係發揮下列之效果。 《第1效果》 第1,防止亂流或儲液,提昇印刷線路基板之精度。亦 即’在此種基板處理裝置中’爲使限制液區域形成在印刷 線路基板材料之表面或裏面之電路形成面上,藉此,處理 液爲形成朝向左右之寬度方向而流動。 防止如前述之該種習知例所示之亂流或儲液的產生,進 而促進處理液之更新,而防止處理之速度延遲、過或不足 之處的產生,因此,爲使處理整體性的均勻化而迴避處理 之不均。在此,對於在精度上飛躍性的提昇、且朝電路之 高密度化、細微化前進之印刷線路基板而言,其意義將形 成爲極大。 《第2效果》 -35- 556459 第2,防止傷害等麻煩,而大幅減少不良情況。亦即, 在此種基板處理裝置中,藉由限制液之噴出以實現上述之 第1點,而不致產生如前述之該種習知例所示之輥輪、限 制輥輪、輪等之壓接、接觸,表面或裏面之電路形成面係 以無接觸狀態下所搬送。 在此,於電路形成面或電路上係不會產生傷害等,針對 於朝電路之高密度化、細微化前進之印刷線路基板而言, 將大幅降低不良發生率,形成爲顯著性的提昇成品率。特 別是在模組化基板的情況下,有鑑於使半導體構件組裝至 電路上,故而此種作用效果之意義爲相當大。 如此,完全解決存在於該種習知例中之問題等,本發明 發揮之效果係顯著的增大。 【圖式簡單說明】 第1圖所示係針對於有關本發明之基板處理裝置,而用 以提供作爲發明實施例之1例(雙面基板用)之說明,(1)圖 係爲局部側面圖,(2)圖係爲沿著(1)圖之J-J線剖面而由箭 頭所視之斷面圖,(3)圖係爲局部平面圖(底面圖)。 第2圖所示用以提供作爲本發明實施例之其他例(單面 基板用)之說明,(1)圖係爲局部側面圖,(2)圖係爲沿著(1) 圖之A-A線剖面而由箭頭所視之斷面圖,(3)圖係爲沿著(1) 圖之B-B線剖面而由箭頭所視之斷面圖。 第3圖所示用以提供作爲本發明實施例之說明的局部平 面斷面圖。 第4圖所示用以提供作爲本發明實施例之說明’(1 )圖係 -36- 556459 爲印刷線路基板材料之電路形成面之局部平面圖(底面 圖),(2)圖係爲限制液吹出部之1例的底面圖(平面圖),(3) 圖係爲限制液吹出部之其他例的底面圖(平面圖)。 第5圖所不係用以提供爲此種習知例的基板處理裝置(雙 面基板用)之說明,(1 )圖係爲局部側面圖,(2)圖所示係沿 著(1)圖之K- K線剖面而由箭頭所視之斷面圖。 第6圖所不係用以提供爲此種習知例的基板處理裝置(單 面基板用)之說明,(1)圖係爲其1例之局部側面圖,(2)圖 所示係爲電路形成面之局部平面圖(底面圖),(3)圖所示係 其他例之局部側面圖。 第7圖所示係爲印刷線路基板(材料)之平面(底面)說明 圖。 【主要部分之代表符號說明】 1 :基板處理裝置(此種爲習知例之物) 2 :輸送裝置 3 :輥輪 3 ’ :限制輥輪 4 :噴射噴嘴部 5 :基板處理裝置(本發明之物) 6 :限制液吹出部 7 :噴管 8 :處理液配管 9 :限制液管 -37- 556459 η :吹 12 :限 13 :輪 1 4 :框 15 :開 16 :輥 1 7 :框 C :印j D :電丨 E :限ί F :裏Ϊ G限制 Η :流丨 Ρ :印J Q :表 R :電丨 S :處3 Τ ··亂: U :儲 V ··搬 W :寬 Υ :邊 出孔 制液配管 座 輪 架 31J線路基板Here, the treatment liquid S in the ejected area is to restrict the flow in the circuit formation surface R -32- 556459 * 1 on the surface Q or the inside F by clamping the restriction liquid area G before and after, Furthermore, the front-back width limit is constant, and a flow path 形成 is formed along the width direction W to flow. This is to prevent and limit the occurrence of turbulent flow T or storage fluid (see (2) in Figure 6). In addition, in the case of the substrate processing apparatus 5 for the double-sided substrate shown in FIG. 1 ′, after the upper and lower restriction liquid blowing portions 6 are placed opposite to each other through the printed circuit board material ρ, the pressure is uniformly applied from above and below. The formation of the ejection pressure of the ejection restricting liquid E enables the printed circuit board material P being transported to be maintained and positioned by a correct horizontal posture. This prevents it from flexing, bending, meandering, bouncing, falling off, etc., and has the advantage of ensuring smooth and stable transportation. In the case of the substrate processing apparatus 5 for a single-sided substrate shown in FIG. 2, the printed circuit board material P being transported is pressed toward the conveying apparatus 2 on the lower side by limiting the discharge pressure of the liquid E. This prevents it from flexing, bending, meandering, bouncing, falling off, etc., and has the advantage of ensuring smooth and stable transportation. Here, in such a substrate processing apparatus 5, as shown in the substrate processing apparatus 1 (refer to FIG. 6 (1)) for a single-sided substrate of the above-mentioned conventional example, the upper roller is not used. Wheel 3, and the printed circuit board material P is formed on the circuit formation surface R of the surface Q (upper surface) to carry the conveyance device 2 in a non-contact state. In other words, in such a substrate processing apparatus 5, the processing liquid S in the ejection region is such that the circuit formation surface R of the printed wiring substrate material P is forced and flows toward the width direction W with a desired regularity. 2. After processing, it flows out from the left and right sides of the printed circuit board material P, flows down, and is recovered (refer to (1) of FIG. 4). -33- 556459 In the example in FIG. 1, the 'treatment liquid S is the spray nozzle portion 4 corresponding to the circuit formation surface R on the surface Q and directly below the circuit formation surface r on the inside F, and is directed toward After flowing in the right or left direction, it flows down from both sides. In the example of Fig. 2, the injection nozzle portion 4 on the circuit formation surface R corresponding to the inclined surface Q flows down from both sides after flowing in the right or left direction. In this way, the processing liquid S is scattered on the circuit formation surface R, and it is possible to prevent the turbulent flow T in the transport direction V or the storage solution U from being formed on the central portion of the circuit formation surface R to prevent the retention (see Figure 5 (1), Figure 6 (1), (2), etc.).借此 In this way, the circuit formation surface R of the surface Q or the inner surface F of the printed circuit board material P is to promote the renewal of the processing liquid S and prevent the processing speed from being delayed, excessive or insufficient. For example, if a turbulent flow T or a storage solution U occurs, chemical treatment with a chemical solution will result in a difference in processing speed, and delays, shortcomings, and formation of chemical treatments that exceed , The excessive part, and the width or width of the formed circuit D has been generated or insufficient, errors, and unevenness. In addition, in the case of washing with a washing liquid, the washing of the body cannot be performed smoothly. However, in the present invention, such situations can be avoided. In this way, it is possible to perform processing without unevenness and uniformity of the entirety. ⑨ However, the printed circuit board C manufactured using such a substrate processing apparatus 5 is a double-sided substrate with a circuit D formed on the surface Q and the back F, or a single-sided substrate with a circuit D formed on the surface Q. Formed. -34- 556459 t This type of printed circuit board c can be used as above, but the double-sided substrate or single-sided substrate manufactured separately can also be laminated in multiple stages and multiple layers at the same time, for example, as a modular substrate To use. [Effects of the Invention] "Features of the Invention" As described above, the substrate processing apparatus of the present invention is characterized in that in the manufacturing process of the printed wiring board, a circuit on the surface or inside of the printed wiring board material is formed. While the surface is being conveyed in a non-contact state, the processing liquid is sprayed from the spray nozzle portion, and at the same time, the limiting liquid is sprayed from the front and rear limiting liquid blowing portions to form a processing liquid flow path facing the left and right width directions. Here, the present invention exerts the following effects. "First effect" First, prevent turbulence or liquid storage, and improve the accuracy of printed circuit boards. That is, "in such a substrate processing apparatus", the restricted liquid region is formed on the surface of the printed circuit board material or the circuit formation surface on the inside thereof, whereby the treated liquid flows in a direction of width direction. Prevent the occurrence of turbulent flow or storage liquid as shown in the aforementioned conventional examples, and then promote the renewal of the processing liquid, and prevent the delay, excess or deficiency of the processing speed. Therefore, in order to make the processing as a whole Uniformize and avoid uneven processing. Here, the significance of printed circuit boards that have improved dramatically in accuracy and that have been moving toward higher density and miniaturization of circuits is of great significance. "Second Effect" -35- 556459 Second, it prevents troubles such as injury, and greatly reduces bad situations. That is, in this type of substrate processing apparatus, the above-mentioned first point is achieved by the ejection of the restricting liquid without causing the pressure of the rollers, restricting rollers, wheels, etc. as shown in the aforementioned conventional examples. The contact, contact, surface or inner circuit forming surface is carried in a non-contact state. Here, no damage will occur on the circuit formation surface or on the circuit. For printed circuit boards that are moving toward higher density and miniaturization of circuits, the incidence of defects will be greatly reduced, and the finished products will be significantly improved. rate. In particular, in the case of a modular substrate, in view of assembling a semiconductor component to a circuit, such an effect is significant. In this way, the problems existing in such conventional examples are completely solved, and the effect exerted by the present invention is significantly increased. [Brief description of the drawings] The first figure is directed to the substrate processing apparatus related to the present invention, and is used to provide an example of an embodiment of the invention (for a double-sided substrate). (1) The figure is a partial side view. Figure, (2) is a cross-sectional view viewed from the arrow along the JJ line section of (1), and (3) is a partial plan view (bottom view). Figure 2 is used to provide an explanation of other examples (for single-sided substrates) as an embodiment of the present invention. (1) the figure is a partial side view, and (2) the figure is along the line AA of (1) The section is a cross-sectional view seen by the arrow. (3) is a cross-sectional view taken along the line BB of (1) and viewed by the arrow. Fig. 3 is a partial plan sectional view for explaining the embodiment of the present invention. Figure 4 is used to provide an explanation of the embodiment of the present invention. (1) Figures -36- 556459 are partial plan views (bottom views) of the circuit forming surface of the printed circuit board material, and (2) is a limiting liquid. A bottom view (plan view) of one example of the blow-out portion, and (3) is a bottom view (plan view) of another example of the restriction liquid blow-out portion. Figure 5 is not intended to provide a description of such a conventional substrate processing apparatus (for double-sided substrates). (1) The figure is a partial side view, and (2) The figure is along (1) Figure K-K is a cross-sectional view taken from the arrow. Figure 6 is not intended to provide a description of such a conventional substrate processing apparatus (for single-sided substrates). (1) The figure is a partial side view of one example, and (2) The figure is A partial plan view (bottom view) of the circuit formation surface, and (3) is a partial side view of another example. Fig. 7 is a plan view (bottom surface) of a printed circuit board (material). [Description of Representative Symbols of Main Parts] 1: Substrate processing device (this is a conventional example) 2: Conveying device 3: Roller 3 ': Limiting roller 4: Jet nozzle unit 5: Substrate processing device (the present invention 6): Restriction liquid blowing section 7: Nozzle 8: Treatment liquid piping 9: Restriction liquid pipe-37- 556459 η: Blow 12: Limit 13: Wheel 1 4: Frame 15: On 16: Roller 1 7: Frame C: India j D: Electricity 丨 E: Limit F: Lane Ϊ G Limitation 丨: Stream 丨 P: Printing JQ: Table R: Electricity 丨 S: Office 3 Τ ·· Chaos: U: Storage V ·· W: Wide Υ: Side-outlet liquid pipe pedestal wheel stand 31J circuit board
液 液區域 洛 5!1線路基板材料 形成面 液Liquid liquid area 5: 1 circuit board material forming surface liquid
送方向(前後方向) 度方向(左右方向) 緣 -38-Feeding direction (front-back direction) Degree direction (left-right direction) Edge -38-
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US8137417B2 (en) | 2006-09-29 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
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JP2011023378A (en) * | 2009-07-13 | 2011-02-03 | Tokyo Kakoki Kk | Surface treatment device of substrate material |
CN101871121B (en) * | 2010-06-29 | 2012-07-04 | 常州市正成标牌设备有限公司 | Metal sheet electrolytic etching method and etching machine |
JP6189279B2 (en) * | 2014-11-14 | 2017-08-30 | 新光電気工業株式会社 | Etching equipment |
TWI575641B (en) * | 2016-06-02 | 2017-03-21 | 盟立自動化股份有限公司 | Wet chemistry process apparatus |
KR102505266B1 (en) * | 2016-12-30 | 2023-02-28 | 어플라이드 머티어리얼스, 인코포레이티드 | Spray bar design for uniform liquid flow distribution on the substrate |
JP7007060B2 (en) | 2018-05-21 | 2022-01-24 | 東京化工機株式会社 | Substrate etching equipment |
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