TW556459B - Substrate processing equipment - Google Patents

Abstract

A substrate processing equipment is provided, in which (1) the random flow or storage liquid can be prevented, the processing can be performed evenly and be homogenized, and (2) the trouble occurrence of the circuit damage can be prevented, the badness of the printed circuit substrate is decreased and the product/material ratio is increased. Such a substrate processing equipment 5 is used in the production process of the printed circuit substrate. The printed circuit substrate material P is conveyed by a conveyor 2 in a state which is not in contact in the circuit-forming face R of the surface Q or the inner face F, a processing liquid S is sprayed from the spray-nozzle 4 and at the same time the limiting liquid E is blown from the blowing-section 6 of front/rear limiting liquid. Thus for the circuit-forming face R the limiting liquid zone is formed along the left/right width direction W. The processing liquid E is clamped and limited by the limiting liquid zone and flows to form a flow-path along the left/right width direction W, and, after the given processing is carried out, flows downwards from both left and right sides.

Description

556459, 发明. Description of the invention (The description of the invention should state: the technical field, prior art, contents, embodiments, and drawings of the invention are briefly described. [Technical field to which the invention belongs] The present invention relates to a substrate processing apparatus. That is, it relates to a substrate processing apparatus that uses a manufacturing process for a printed wiring board and performs processing while conveying printed wiring board materials. [Previous technology] "Technical background" With the increase in performance, functionality, and weight of electronic equipment, printed circuit boards are also becoming more precise, thinner, thinner, and formed on the surface or inside. The progress of higher density and miniaturization of the circuit is also remarkable. In each of the procedures of the manufacturing process of such a printed wiring board, various processes described below are performed with respect to the printed wiring board material to be conveyed. For example, the developing liquid-etching liquid-stripping liquid is sequentially sprayed, and the circuit is formed by sequentially performing processing such as developing etching-stripping. For another example, the spraying of the electrolytic copper plating solution ^ development solution is immersed in sequence. The electrolytic copper plating solution-the spraying of the stripping solution is immersed in sequence. Therefore, the chemical copper plating treatment is performed in sequence-development ^ electric copper plating- &gt; Peeling, etc. to form a circuit. Furthermore, as a pre- and post-treatment of each of these processes, a washing process such as spraying with a washing liquid is performed. << Knowledge Technology >> Next, in each of the procedures of the manufacturing process of such a printed circuit board, the printed circuit board materials are separately supplied to a substrate processing apparatus, and various kinds of conveyance are carried out in a horizontal posture by a conveying apparatus 556459. deal with. Fig. 5 is used to provide a description of such a conventional substrate processing apparatus (for a double-sided substrate), (1) is a partial side view, and (2) is shown along (1) A cross-sectional view taken along the line KK and viewed by an arrow. Fig. 6 is a description of a conventional substrate processing apparatus (for a single-sided substrate). (1) is a partial side view of one example, and (2) is a circuit formation. Partial plan view of the surface (bottom view), (3) is a partial side view of other examples. As shown in these drawings, in the aforementioned development processing, etching procedure, peeling procedure, cleaning procedure and the like, in each substrate processing apparatus 1, in order to carry out,-the printed wiring substrate material P is passed through a conveying device The rollers 3 or 2 of 2 are conveyed in a horizontal posture—for the circuit formation surface R of the surface Q or the inner surface F, the processing liquid S is sprayed from the spray nozzle portion 4—and then the predetermined processing is performed. That is, as shown in FIG. 5, for example, a substrate processing device i for a printed circuit substrate material P that has a circuit formation surface R on the surface Q or the back surface F, that is, a substrate processing for a double-sided substrate. In the device 1, in order to carry out '-the printed circuit board material P is placed on the wheel i 3 of the conveying device 2-at the same time, the surface R and the circuit F on the surface Q are formed on the surface R, and are arranged on the upper and lower sides The spray nozzle portion 4 sprays the processing liquid S, and further processes the circuit formation surface R. In addition, as shown in (1) or (3) of FIG. 6, for example, a substrate processing apparatus 1 for a printed circuit board material P provided with a circuit formation surface R only on the surface Q is In the substrate processing apparatus 1 for a surface substrate, the printed circuit board material P is conveyed by the wheel 1 3 556459 of the conveying device 2 '&gt; The processing liquid S is sprayed from the upper spray nozzle 4 to process the circuit formation surface R. [Problems to be Solved by the Invention] "About the first problem point" However, the substrate processing apparatus 1 of this conventional example is accused of the following problem points. First, the substrate processing apparatus 1 (for a double-sided substrate) shown in FIG. 5 or the substrate processing apparatus 1 (for a single-sided substrate) shown in (1) of FIG. 6 is provided on the surface of the printed wiring substrate material P The circuit formation surface R of Q or inner F is prone to the problem of turbulent flow T or liquid storage U. That is, the processing liquid S sprayed onto the circuit formation surface R (that is, the processing liquid S sprayed onto the surface Q and the back surface F in the example of FIG. 5, and the example of FIG. 6 (1) The processing liquid S) sprayed onto the surface Q is formed so that the circuit forming surface R flows into the width direction W orthogonal to the front-to-rear conveyance direction V for processing, and then flows down from the left and right sides. However, the entire treatment liquid S cannot flow in the width direction W as expected. That is, as shown in (2) in FIG. 6 and the like, the processing liquid S is secondary on the circuit forming surface R of the surface Q or the inner surface F in the example of FIG. 5, and 1) In the example shown in the figure, the circuit formation surface R on the surface Q is formed with a turbulent flow T that is scattered and conveyed in the forward-backward direction V, or a storage liquid U is formed in the central portion, which is likely to cause stagnation. This is because the printed circuit board material P is conveyed while the processing liquid S is ejected.

When such turbulent flow T or storage liquid U is generated, it will hinder the update of the processing liquid S 556459, and the processing speed will be delayed, over, or insufficient, which will hinder the uniformity of the processing and cause significant processing unevenness. Further, there is an obstacle in forming a uniform circuit. In the case of printed circuit board materials which are moving toward higher density and miniaturization of circuits, the occurrence of such a situation causes a defect in accuracy. "About the second problem" Second, in the substrate processing apparatus 1 (for a double-sided substrate) shown in Fig. 5, the circuit formation surface R on the back surface F of the printed circuit board material P is shown in Fig. 6 In the substrate processing apparatus 1 (for a single-sided substrate) shown in (3), on the circuit formation surface R of the surface Q of the printed circuit board material P, it is pointed out that there are problems such as frequent occurrence of scratches. First, the substrate processing apparatus 1 (for a double-sided substrate) shown in FIG. 5 is such that the wheels 13 of the lower conveying device 2 are mounted, contacted, and transported. A printed circuit board material P having a circuit formation surface R. In addition, as the conveying device 2 for conveying the substrate processing device 1 (for a single-sided substrate) having the printed circuit substrate material P provided with the circuit formation surface R only on the surface Q, as shown in FIG. 6 (3), The roller 3 is brought into contact with and pressed against the printed circuit board material P from above and below, and is used as an object to be held and conveyed. In addition, the conveyance is the same as the example in FIG. 6 (1), and is performed by placing the printed circuit board material p on the roller 3 of the lower conveying device 2; however, it is necessary to prevent the disorder As shown in (3) of FIG. 6, the flow T or the liquid storage U is also a substrate processing apparatus 1 (for a single-sided substrate) having a restriction roller 3 ′ provided on the upper side. That is, the sprayed treatment liquid S does not flow in the front-rear direction, but is provided with rollers 3 which are crimped to the circuit forming surface R of the printed circuit board material P before and after the upper side so as to face as desired. The right and left width direction W flows and is used. However, in these substrate processing apparatuses 1, contact and pressure contact with the upper roller 3, the restricting roller 3 ', or the lower roller 1 3 facilitates contact between the printed circuit board material P and the substrate. Contact damage, abrasion, and the like occur on the circuit formation surface R. On the surface Q or the inner surface of the circuit, the photosensitive anti-corrosion layer on the surface R, the copper foil, the plating, and the circuit are easy to cause damage such as crushing, dents, deformation, and the like. The occurrence of such damages is a major cause of failure for printed circuit boards that are moving toward higher density and finer circuits, and the problem that yields deteriorate. Especially in the case of a modular substrate, in view of the fact that semiconductor components are integrated into fine circuits in advance, the generation of defects causes great problems, and the improvement of 100% yield is the main goal. . << About the present invention >> The substrate processing apparatus of the present invention is a result of intensive research by the inventors in order to solve the problems of the conventional examples in view of the above-mentioned facts. In the manufacturing process of the printed circuit board, it is characterized in that the surface of the printed circuit board material or the circuit-forming surface inside is conveyed in a non-contact state, while the processing liquid is sprayed from the spray nozzle portion, and the front and rear restriction liquids are used. The blow-out portion sprays the restricting liquid to form a flow path of the processing liquid in the left-right width direction. Therefore, the object of the present invention is to propose a substrate processing device. The first is to prevent turbulence or liquid storage to improve the accuracy of printed circuit boards. The same as -11-556459, 2nd, to prevent troubles such as injury, To greatly reduce the defects of printed circuit boards. [Summary of the Invention] [Means for Solving the Problems] The technical means of the present invention for solving such problems in the "Scope of Patent Application for Each Application" are as described below. First of all, the first item of patent application scope is as follows. That is, the substrate processing apparatus of the scope of patent application No. 1 is used in a manufacturing process of a printed circuit board. It is characterized by having: a conveying device for conveying the printed circuit board without contacting the circuit formation surface; an injection nozzle section for ejecting a processing liquid onto the printed circuit board; a restricting liquid blowing section for The restriction liquid is ejected to the printed wiring board. The second item of patent application scope is shown below. That is, the substrate processing device (for double-sided substrates) in the second patent application scope is that in the first patent application scope, the conveying device is such that the circuit forming surface is provided on the surface or inside thereof. The printed wiring board is transported in a horizontal posture while maintaining both outer sides of the circuit formation surface on the inside. The spray nozzles are arranged on the upper and lower sides of the printed circuit board being conveyed, and spray the processing liquid on the circuit forming surface. The restricting liquid blowing section is the one that is disposed on the upper and lower sides of the printed circuit board material being conveyed, is disposed before and after the ejection nozzle section, and ejects the restricting liquid to the circuit forming surface, Is its characteristic. The third item of patent application scope is shown below. The substrate processing &amp; placement (for double-sided substrate) in the scope of patent application No. 3 is 556459. In the scope of patent application scope No. 2, the conveying device is to feed the printed circuit board material together with the frame into fj Jk to reach The private: frame is to allow the circuit forming surface of the printed circuit board material to be exposed through the central opening, and to maintain and maintain the inner edge of the printed circuit board material in a fixed manner so that it is below the sides. The rollers equipped with the conveying device are its characteristics. The fourth item of patent application scope is shown below. That is, the substrate processing device (for single-sided substrates) in the scope of the patent application No. 4 is that in the first scope of the patent application, 'the transfer device is that the circuit formation surface is provided only on the surface. This printed wiring board material is conveyed in a horizontal posture while maintaining and contacting the inside. The spray nozzle unit is disposed on the printed circuit board above the conveyed circuit board, and sprays the processing liquid on the circuit forming surface. The restriction liquid blowing section is arranged on the printed circuit board material being conveyed above the conveyed circuit board material, and is arranged before and after the spray nozzle section, and the restriction liquid is sprayed on the circuit forming surface. Its characteristics. The fifth item of patent application scope is shown below. That is, the substrate processing apparatus of the scope of application for patent No. 5 is that, in the scope of the scope of application for patents No. 2 or 4, the spray nozzle unit is arranged on the nozzle, and the nozzle should cover the printed circuit. The full width of the substrate material is arranged in the left and right width directions. The restricting liquid blowing part is arranged on the restricting liquid pipe, and the restricting liquid pipe should cover the full width of the printed circuit board material and be arranged in the width direction while being transported in parallel with the nozzle. The direction is formed as a pair, which is its characteristic. -13- 556459 The 6th scope of patent application is shown below. That is, the substrate processing apparatus of the patent application scope item 6 is that, in the patent application scope item 5, the restriction liquid ejected by the restriction liquid blowing part should have the following functions, that is, the ejection nozzle part The sprayed treatment liquid is on the circuit formation surface of the printed circuit board material to restrict and prevent the formation of turbulent flow or the formation of storage liquid in the forward and backward conveying directions, which are its characteristics. As follows. That is, the substrate processing device of the seventh patent application scope is' In the sixth patent application scope, the restriction liquid ejected by the restriction liquid blowing part is' on the circuit formation surface of the printed circuit board material ' A restriction liquid region is formed along the left and right width directions, and the treatment liquid sprayed by the spray nozzle unit clamps and restricts the restriction liquid regions before and after, thereby along the width direction on the circuit formation surface. Those who form the flow path are its characteristics. The eighth item of patent application scope is shown below. That is, the substrate processing device of the eighth scope of the patent application is, in the seventh scope of the patent scope of the application, the jet nozzle is used for the development process, etching process, or peeling process of the printed circuit board material. The part sprays a chemical liquid such as a developing liquid, an etching liquid, or a peeling liquid as the processing liquid, and the restricting liquid blowing part ejects the chemical liquid or other liquid as the restricting liquid and sprays it. feature. The 9th scope of the patent application is shown below. The substrate processing device in the scope of the patent application No. 9 is used in the scope of the patent application in the seventh scope, which is used for the cleaning process of the printed circuit board material, and the spray nozzle unit is made of water detergent, neutralizer and other cleaning agents. Detergent is sprayed as the treatment liquid, and the -14-556459 restriction liquid blowing section also sprays the cleaning liquid as the restriction liquid, which is characteristic. The 10th scope of the patent application is shown below. That is, the substrate processing apparatus of the scope of application for the patent No. 10 is that, in the scope of the scope of the patent for the seventh application, the restriction liquid blowing part is formed by a slit-shaped blowing outlet that is linear in the width direction from left to right. It is characterized by a discharge operator who blows out this restriction liquid in a curtain shape. The 11th item in the patent application scope is as follows. That is, the substrate processing apparatus of the scope of patent application No. 11 is that, in the scope of patent application No. 7, the restricting liquid blowing part is formed by an assembly of a plurality of blowing holes arranged side by side in the left and right width direction. It is also characterized by a person who ejects the restriction liquid in a continuous continuous curtain. The 12th scope of the patent application is shown below. That is, the substrate processing device in the scope of patent application No. 12 is used in the scope of patent application No. 7 in the manufacturing process of modular substrates, and the printed circuit board material is on the circuit formation surface It is characterized in that a micro-circuit is formed thereon, and a semiconductor component is integrally mounted, and the user is laminated afterwards. << About the effect >> The present invention is structured as described above, and is thus formed as follows. Φ Such a substrate processing apparatus is applicable to various processes in the manufacturing process of a printed wiring board (for example, a modular substrate). For example, it is used in a development process, an etching process, a peeling process, or a cleaning process. ② The printed circuit board material is provided with a circuit-forming surface on the surface or the inside, and is conveyed in a horizontal posture by a conveying device. In the case of a printed circuit board material of -15-556459 for a double-sided substrate, it is placed on a frame base, and both outer sides of the circuit formation surface inside are maintained by a conveying device. In the case of a printed circuit board material for a single-sided substrate, the inside is maintained by a conveying device. ③ In this printed circuit board material, the circuit formation surface is transported in a non-contact state on the transmission device, so there is no risk of causing damage to the circuit formation surface. In addition, with respect to the circuit formation surface of the printed circuit board material thus conveyed, the spray nozzle unit uses a chemical liquid such as a developing liquid, an etching liquid, a peeling liquid, or a cleaning liquid such as a water washing liquid as a processing liquid. injection. The spray nozzle unit is arranged on a nozzle in the width direction. ⑤ At the same time, the restriction liquid is ejected onto the circuit formation surface from the restriction liquid blowing portion before and after the spray nozzle portion. The restricting liquid blowing part is arranged on the restricting liquid pipe which is parallel to the nozzle and forms a pair, and is formed by a linear slit-shaped blowing outlet or an assembly of blowing holes arranged in order to restrict the restricting liquid. Blow out like a curtain. As the limiting liquid, when the chemical liquid as the processing liquid is sprayed from the spray nozzle portion, it is typical to use the same type of chemical liquid, but other liquids may be used. In addition, in the case where a water washing liquid or other washing liquid as a treatment liquid is sprayed from the spray nozzle portion, the washing liquid is typically used, but other washing liquids may be used. ⑥ The restriction liquid system ejected to the printed circuit board material is such that the restriction liquid region is formed in the width direction of the circuit formation surface. Therefore, the treatment liquid system is restricted by the restriction liquid region before and after, and a flow path is formed along the width direction. In this way, the processing liquid is flowed in a direction of 556459 degrees wide as the circuit forming surface is processed as desired, and then flows out and flows down from the left and right sides without causing turbulence or storage liquid. ⑧Here, with this substrate processing device, the circuit formation surface of the printed circuit board material promotes the updating of the processing liquid and prevents the processing speed from being delayed, over, or insufficient, and can achieve non-uniform and uniform processing. . [Embodiment] "About the Drawing" Hereinafter, the present invention will be described in detail based on the embodiment of the invention shown in the drawing. Figures 1, 2, 3, 4 and the like provide descriptions of embodiments of the substrate processing apparatus of the present invention. The first figure is to provide an example (for a double-sided substrate). (1) The figure is a partial side view. '(2) The figure is a section along line J-J of (1). The sectional view viewed from the arrow, (3) is a partial plan view (bottom view) of the printed circuit board material or frame base. Figure 2 is used to provide an explanation of this other example (for a single-sided substrate). Figure 1 (1) is a partial side view, and (2) is A-A along (1) (3) is a cross-sectional view viewed by the arrow along the BB line of (1), and FIG. 3 is a partial plan cross-sectional view. (1) of FIG. 4 is a partial plan view (bottom view) of a circuit forming surface of a printed circuit board material, and (2) is a bottom view (plan view) of an example of a restricting liquid blowing part, and (3) This is a bottom view (plan view) of another example of the restriction liquid blowing part. In addition, FIG. 7 is a plan (bottom) explanatory diagram of a printed wiring board (material). -17- 556459 "Printed wiring board c" This type of substrate processing apparatus 5 is a manufacturing process used for printed wiring board C. Here, the printed circuit board C will be briefly described with reference to FIG. 7. The printed circuit board C is widely used in various electronic devices, and includes various substrates such as a single-sided substrate, a double-sided substrate, and a multilayer substrate (including the latest lamination method). As a ring of such a printed circuit board C, there is also a modular substrate (semiconductor package substrate), or a plasma, in which semiconductor components such as 1C, LSI elements, passive components, driving components, and capacitors are integrated. The emergence of display PDP, liquid crystal LCD or CSP, PBGA and so on. Of course, in this specification, the so-called printed wiring board C also includes the above-mentioned ones. The printed circuit board C is accompanied by higher performance, higher performance, smaller size, and lighter weight of electronic equipment, and is moving toward higher precision, thinner, thinner, and multilayered, and is formed on the outer surface, that is, the surface One or both of Q or F inside, the density and miniaturization of circuit D is quite remarkable. The printed circuit board C is formed by, for example, about 500 mm × 500 mm in the vertical and horizontal directions, and the thickness of the insulation layer is 1.0 mm to 6 0 // m. The degree of the circuit D portion is 75 // m. ~ 35 / zm, recently it has been extremely thinned to about 25 μm ~ 1 0 // m. Even in the case of a multilayer substrate, the overall meat thickness is extremely thinned to about 1.0 mm to 0.4 mm. The width of the circuit D or the space (interval) between the circuits D also tends to be finer than 3 5 # m ~ 2 5 // m. The printed circuit board C is formed as described above. -18- 556459 "Manufacturing method of printed circuit board c"> Next, using this substrate processing apparatus 5, the manufacturing method of printed circuit board c will be described. First, the manufacturing method of the first example will be described. In the manufacturing method of the first example, the printed wiring board C is manufactured through the following steps. First, on the outer surface of an insulating layer (core material) made of resin, fiberglass cloth, or ceramics, a printed circuit board material p is prepared by attaching a copper foil by hot stamping or the like as a copper-clad laminated board. The perforation process for through holes is performed using a laser or the like. The through-hole is formed by a through-hole between the two outer surfaces (surface Q and inner F) of the printed circuit board material p (printed circuit board c). For one piece, there are hundreds or more of extremely small diameters. The diameter of the object is more than 0.5 mm to 0 · 2 mm. It is used for the connection between the two outer surfaces or between the circuits D of the multilayer substrate, or for the mounting of a component mounted on the circuit d. In addition, recently, a small protruding contact was used as a protruding block instead of a through hole. Therefore, by using the protruding block, a technology that has the same function as a through hole without having to be perforated has been developed. Also developed the NM BI method. After that, on the outer surface (one or both of the surface Q and the inner surface F) of the copper foil of the printed circuit board material P, a photosensitive photoresist is applied or filmed. Here, the negative film of circuit D is used as the photo of the circuit. The photosensitive photoresist on the outer surface is exposed by exposure. Only the hardened circuit D remains, and the other unnecessary parts are formed by the developer. Spray -19- 556459 and dissolve and remove. Thereafter, the copper foil of the printed circuit board material p is formed by curing the photosensitive photoresist and leaving the covered circuit D to form a portion. The photosensitive photoresist is dissolved and removed by development, and the exposed unnecessary portion is removed by Etching solution (copper chloride, ferric chloride, and other corrosive solutions) is sprayed to dissolve, remove, and perform etching. From then on, the photoresist of the remaining circuit D forming portion is peeled off by spraying of the stripping solution, and the copper foil of the remaining circuit D forming portion is removed from the surface (surface Q) of the printed circuit board material P (One or both of F inside, F), thereby forming a printed circuit board C. In addition, in the above-mentioned development process, etching process, and peeling process, spray water washing is additionally provided for post-processing. The cleaning procedure of the liquid, the neutralizer liquid, and other cleaning liquids thereby cleans and removes the developing liquid, etching liquid, peeling liquid, and the like adhered to the outer surface of the printed circuit board material P. The manufacturing method of the first example is formed by such a wet process method. The manufacturing method of the first example is formed as described above. Next, the manufacturing method of the second example will be described. As the manufacturing method of the printed circuit board C, although the wet process method of the first example described above is known as a representative method, the semi-additive method of the two cases formed by the wet process method is often used ( semi-additive process). In this semi-additive method, first, electroless copper plating is performed on the outer surface (one or both of the surface Q and the back surface F) of the printed wiring board material P in which a through-hole is formed in advance. —Later, after coating the photosensitive photoresist in a film form -20- 556459 or post it on the electroless copper circuit, it will be exposed as a circuit D film as a circuit photo. -After that, the photosensitive photoresist is exposed and the hardened part remains, and the other part, that is, the forming part of the circuit D is dissolved and removed by spraying the developing solution. After that,-for the circuit D forming part, that is, the electroplating pattern part that dissolves and removes the photosensitive photoresist by development, in other words, the electroless copper plating part has been exposed, and is used to implement the electrolytic copper circuit'— Instead, the circuit D is formed. In addition, the remaining photoresist other than the hardened circuit D forming part is removed by spraying the stripping solution. The exposed electroless copper circuit is quickly etched and dissolved by spraying the etching solution. Remove. — In addition, a washing program is attached for subsequent processing of each program. In the semi-additive method of the second example, the printed circuit board C is manufactured by forming the circuit D with an electrolytic copper circuit in this manner. The manufacturing method of the second example is formed as described above. However, the manufacturing method of the printed wiring board C has recently been gradually diversified. In addition to the above-mentioned first and second examples, various methods have been developed and used. Of course, the present invention is also used in such various methods for manufacturing a printed circuit board C. The manufacturing method of the printed wiring board c is formed as described above. "About the substrate processing apparatus 5" Hereinafter, the substrate processing apparatus 5 of the present invention will be described in detail with reference to Figs. 1 to 4 and the like. This type of substrate processing device 5 is suitable for the manufacturing process of printed circuit board C. -21-556459 Sequence 'Although it is used for the substrate processing device 5 for each process, however, these substrate processing devices 5 are all printed circuit substrates. Material p. That is, 'this type of substrate processing apparatus 5 is used in each process of the above-mentioned method of manufacturing the printed wiring board C, that is, used in its development process' an etching process, a peeling process, or a cleaning process. Wait. In addition, each substrate processing apparatus 5 includes a conveying device 2, an ejection nozzle section 4, a restriction liquid blowing section 6, and the like in common. In other words, the conveying device 2 conveys the printed circuit board material p without contacting the circuit forming surface R of the surface Q; and the ejection nozzle section 4 ejects the processing liquid S onto the printed circuit board material. p; the restricting liquid blowing part 6 is for discharging the restricting liquid e to the printed circuit board material p. "About Conveying Device 2" First, the conveying device 2 will be described. As shown in FIG. 1, the conveying device 2 of the substrate processing apparatus 5 for a double-sided substrate is to maintain the printed circuit substrate material P provided with the circuit forming surface r on both the front and back surfaces of the surface q and the back surface F. Both sides of the circuit formation surface R are conveyed in a horizontal posture.

The printed circuit board material p of the illustrated example is transported by the conveying device 2 together with the frame base 14 placed on the frame base M, and the frame base 14 is formed with a wide opening 15 in the center. It is formed by a slightly rectangular frame. The printed circuit board material P is such that the surface Q and the circuit formation surface R 'of the inner F are exposed in a positional relationship upward and downward through the opening 15 and are placed on the frame base 14 and formed. The circuit-forming surface R -22- 556459 on the inside F (see Fig. 7) is placed on the frame base 14 and, for example, is formed by using the formed stage or the intervening belt. It is fixed in advance and the rollers 16 driven by the conveying device 2 are arranged in contact with the sides of such a frame base 14, that is, the left and right sides of the frame base i 4 forming a slightly rectangular shape. Down the sides. This roller 16 is formed in a slightly round shape with a thin left and right flesh, so as not to contact the exposed circuit forming surface R of the inside F of the printed circuit board material p, and the left and right outer sides of the circuit forming surface r It is maintained and transported through the frame base 14. Next, as shown in Fig. 2, the conveying device 2 of the substrate processing device 5 for a single-sided substrate is loaded with the printed wiring substrate material p, and is conveyed in a horizontal posture while contacting and maintaining the back surface F. That is, in the processing chamber of such a substrate processing apparatus 5, the rollers 3 or wheels driven by the conveying device 2 are arranged in the forward and backward conveying direction v °, and the printed wiring substrate material P is on the surface Q. Since the circuit formation surface R 'is formed and not formed on the back surface F, the conveying device 2 is conveyed in a non-contact state. The conveying device 2 is formed as described above. << About the spray nozzle part 4 >>

Next, the injection nozzle unit 4 will be described. The ejection nozzle portion 4 of such a substrate processing apparatus 5 is such that the printed circuit board material P to be conveyed is arranged in a pair @ on the upper side of the substrate processing apparatus 5 for a double-sided substrate shown in FIG. 1 and On the lower side, the substrate processing apparatus 5 for a single-sided substrate shown in FIG. 2 is disposed on the upper side in an opposite direction, and for the circuit formation surface R of the surface Q or the inner surface F -23- 556459, the processing liquid S In the illustrated example, the injection is performed in an oblique direction. In contrast, the injection nozzle portion 4 in the figure is arranged so that the conveying direction V is a width direction W (left or right) toward the left and right, and is arranged to be inclined toward either the left or right direction. angle. That is, the spray nozzle portion 4 is fixed at a spray angle obliquely to the width direction W of the left and right, and the sprayed treatment liquid S is slanted to the left or right and is sprayed onto the printed circuit board. Material P. In addition, the spray nozzle unit 4 sprays a developing solution as the processing solution S when used in a developing program, and uses an etching solution as a processing when used in an etching program. The liquid S is sprayed. In the case of being used in a peeling process, the peeling liquid is sprayed as the treatment liquid S. In the case of being used in a washing process, a water washing liquid, a neutralizer liquid, The other cleaning liquid is sprayed as the processing liquid S. The spray nozzle portion 4 will be described in more detail. As shown in FIGS. 1 to 3, in the processing chamber of the substrate processing apparatus 5, the nozzles 7 are arranged at a predetermined height for the printed circuit substrate material P. In the example of FIG. 1, the nozzles 7 are arranged above and below. Both sides are arranged on the upper side in the example in FIG. 2. At the same time, the nozzles 7 in the upper or lower side should cover the full width of the printed circuit board material P. While being arranged along the left and right width direction W, a plurality of nozzles 7 are arranged in the forward and backward conveying direction V. There is a multi-segment arrangement with back and forth intervals. In this type of nozzle 7, the spray nozzle portion 4 is arranged to face the printing line -24- 556459 ▲ road substrate material p opposite surface (lower or upper surface). In the example of the figure, it is arranged in multiple stages. The nozzles 7 provided in the conveying direction V are all objects arranged to be alternately formed in the left direction and objects inclined in the right direction in this order. For example, the first nozzle 7 uses an injection nozzle portion 4 inclined to the left, the second nozzle 7 uses an injection nozzle portion 4 inclined to the right, and the third nozzle 7 In order to use the injection nozzle portion 4 inclined to the left, the fourth nozzle 7 is to use the injection nozzle portion 4 inclined to the right, and the following is repeated in this manner. In addition, as the injection nozzle portion 4, an assembly form of a plurality of blowout holes arranged in the width direction W as shown in FIG. 3 or an example not disclosed in the drawing is adopted, and the width direction W is adopted. It is a straight slit-shaped blowout. The processing liquid S is shown in Figs. 1 to 3, etc. When the processing liquid S is pressure-fed from the processing liquid pipe 8 to the nozzles 7, the nozzles 4 and 4 of the nozzles 7 are tilted. It sprays toward the printed wiring board material P conveyed in a horizontal attitude. Here, as shown in (1) in FIG. 4, the treatment liquid S flows the circuit formation surface R on the surface Q or the inner surface F toward the right or left width direction W, and then the left and right Side outflow and downflow,-collected towards the lower tank. —The treatment liquid S recovered in the liquid tank is as follows——Afterwards, it is pumped to the treatment liquid pipe 8 by a pump for recycling. In addition, although the processing liquid S sprayed onto the circuit formation surface R on the inside F directly flows downward by a certain amount by gravity, most of the processing liquid S is formed by spraying pressure as expected. After the surface R flows toward the left and right widths and flows toward W, it reaches both sides, and flows down by resisting gravity -25-556459 by spray pressure. The injection nozzle portion 4 is formed as described above. << About the restriction liquid blowing part 6 >> Next, the restriction liquid blowing part 6 is demonstrated. The restricting liquid blowing section 6 of the substrate processing apparatus 5 is such that the printed circuit board material P to be transported is disposed opposite to the substrate processing apparatus 5 for the double-sided substrate shown in FIG. 1 on the upper side and the lower side. On the other hand, the substrate processing apparatus 5 for a single-sided substrate shown in FIG. 2 is disposed opposite to the upper side. In addition, such a restricting liquid blowing section 6 is arranged on the upper side or the lower side, and is arranged before and after the spray nozzle section 4 to be described later, and is a circuit forming surface for the surface Q or the back F of the printed wiring board material P. R to spray the restriction liquid E. In addition, as shown in FIG. 4 (丨), the ejection of the restriction liquid e is for the circuit formation surface R of the printed circuit board material P to form a restriction liquid region G along the width direction W. Here, the processing liquid s ejected from the ejection nozzle section 4 is held and restricted by the restriction liquid region G before and after such, and a flow path η is formed along the width direction W in the circuit formation surface R. Therefore, the treatment liquid s is restricted by the circuit formation surface R of the printed circuit board material P to prevent the formation of a turbulent flow T, a storage liquid U, and the like in the conveying direction V (refer to FIG. 5 (丨), FIG. 6 (!) Diagram, (2) diagram, etc.). The restriction liquid blowing section 6 will be described in more detail. As shown in FIG. 丨 to FIG. 3, in the processing chamber of the substrate processing device 5, the restricting liquid pipe 9 is spaced at a predetermined height for the printed circuit substrate material p (and the nozzle 7 is closer to the printing by this The height level of the circuit board material ρ), 556459 is arranged on the upper and lower sides in the example in FIG. 1 and is arranged on the upper side in the example in FIG. 2. At the same time, the liquid pipe is restricted in the upper side or the lower side, and it should cover the full width of the printed circuit board material P and be arranged along the width direction W, and it is arranged to be transported in parallel with the nozzle 7 Direction V before and after. In other words, the restricting liquid pipes 9 are formed in groups of two, and are arranged in front of and behind the nozzles 7 in parallel. In each of the restricting liquid pipes 9 described above, the restricting liquid blowing portions 6 are respectively provided on the facing surfaces (upper or lower) facing the printed wiring board material P. As the restricting liquid blowing part 6, as shown in (2) of FIG. 3 or FIG. 4, the restricting liquid E is formed by a slit-shaped blowing port 10 that is linear in the width direction W. Objects that are blown out or ejected in the form of a curtain, or as shown in (3) of FIG. 4, are formed by a collection of blowout holes 11 arranged linearly in the width direction W, and will be limited. Liquid E is continuously blown out and ejected as a curtain. However, as the limiting liquid E, the following liquid is used. First, when the substrate processing apparatus 5 is used in a development program, an etching program, or a peeling program, the spray nozzle portion 4 uses a chemical solution such as a developing liquid, an etching liquid, or a peeling liquid as the liquid. The treatment liquid S is sprayed. In this case, the corresponding corresponding chemical liquid, that is, a developing liquid, an etching liquid, or a stripping liquid (that is, the same liquid as the processing liquid S) is used as the limiting liquid E. The liquid blowing portion 6 is discharged. However, instead of using this, other liquid medicines, or even other washing liquids such as water washing liquids, may be used as the restriction liquid E to perform the ejection operation. 556459, In addition, in the case of using a chemical liquid such as a developing liquid, an etching liquid, or a peeling liquid (that is, the same liquid as the processing liquid S) as the limiting liquid e, the following structure is adopted, that is, The liquid tank has a structure in which the restriction liquid pipe 12 for the restriction liquid E is diverged through the processing liquid pipe 8 connected to the pump, and is connected to the restriction liquid pipe 9 and the restriction liquid blowing section 6. In this case, the used restriction liquid E is recovered to the liquid tank in the same manner as the previously-used treatment liquid S for recycling. The restriction liquid E is not limited to the case of using other liquids, and the restriction liquid E is pressure-fed and supplied to the restriction liquid pipe 12 in order to use other means. Next, when the substrate processing apparatus 5 is used in a cleaning program, the spray nozzle portion 4 sprays a water washing liquid or other cleaning liquid as the processing liquid S. In this case, in order to use the corresponding cleaning liquid (that is, the same liquid) as the restricting liquid E, the restricting liquid blowing section 6 ejects it. However, instead of using this method, another type of cleaning liquid can be used as the restricting liquid E to perform the ejection operation. In addition, in the case where the same liquid is used or the chemical liquid of the piping structure in other cases is used as the restricting liquid E, the above contents are used as a reference, so the description is omitted. When the cleaning solution is used as the restriction solution E, the used restriction solution E or the treatment solution S is not recovered and recycled, but a majority of them are formed into a waste solution.

In addition, the restriction liquid E pressurized by a pump or the like is pressure-fed to the respective restriction liquid pipes 9 through the restriction liquid pipes 12. — Since then, the restricting liquid E is ejected from the restricting liquid blowing portion 6 of each restricting liquid pipe 9 toward the printed circuit board material P 556459. —The restriction liquid E is formed into a film shape. For the printed circuit board material P, in the example of FIG. 1, the circuit formation surface R is ejected to the surface Q and the back F, and in the example of FIG. 2, it is The circuit forming surface R ejected to the inside F. That is, in the upper space or lower space of the printed circuit board material P, the film of the restriction liquid E blown by the two restriction liquid blowing portions 6 is formed before and after the treatment liquid S sprayed by the spray nozzle. Moreover, the restricting liquid E which has reached the circuit formation surface r of the printed circuit board material P is, as shown in (1) of FIG. 4. In the example of FIG. 1, the circuit is formed on the surface Q. The circuit forming surface on the surface R and the surface F are directly below the surface R, and the restricted liquid region G is formed along the width direction W with a certain width in the front and back. In the example in FIG. 2, the circuit is formed on the surface Q. On R, a restricted liquid region G is formed along a left-right width direction W having a constant width from front to back. -&gt; That is, the treatment liquid S of one shot area that has been sprayed is sandwiched therein, and two-line restriction liquid area G is formed before and after it. Here, —on the circuit formation surface R of the printed circuit board material P on the surface Q or the inner surface F, a flow path 沿着 along the width direction W of the left and right is formed by the treatment liquid S in the spray region, and the treatment liquid In the S system, the width of the flow path 为 is restricted to be constant, and flows toward the left or right direction and the left and right sides. In addition, as the limiting liquid E, a thermal limiting liquid having a temperature of about 40 ° C to 50 ° C is used, and for example, it is preferably formed at a temperature almost equal to the temperature of the etching liquid. The restriction liquid blowing portion 6 is formed as described above. << About Actions >> The substrate processing apparatus 5 related to the present invention is configured as described above. At -29- 556459, the system is formed as follows. This type of substrate processing device 5 is used in the manufacturing process of the printed wiring board C, and the printed wiring board P is transported and processed. For example, it is used for a manufacturing process of a modular substrate, and semiconductor components are assembled in addition to fine circuits on the circuit formation surface R to provide the manufacture of a printed circuit board C used in a multi-stage, multi-layer buildup afterwards. ① First, such a substrate processing apparatus 5 is a process used in a manufacturing process of a printed circuit board C, for example, it is used in a development process, an etching process, a peeling process, and a cleaning process. ② The printed wiring board material P, which is fed into and supplied to the substrate processing apparatus 5, is formed of a double-sided substrate or a single-sided substrate, and is conveyed in a horizontal posture by a conveying device. That is, in the substrate processing apparatus 5 for a double-sided substrate shown in FIG. 1, the printed circuit substrate material P having the circuit formation surface R on the surface Q (upper surface) or the back surface F (lower surface) is placed on a frame. The seat 14 and the two outer sides of the circuit formation surface R on the inside F (lower side) are maintained by the rollers 16 of the conveying device 2. In addition, in the substrate processing apparatus 5 for a single-sided substrate shown in FIG. 2, the printed circuit board material P having the circuit formation surface R on the surface Q (_h surface) is the roller 3 placed on the conveying device 2. Up, and keep the inside F (bottom) in contact. That is, in these conveying devices 2, the circuit formation surface R is in contact with or crimped to the surface Q or the back surface F of the printed circuit board material P, and the wheels 1 3 (see FIG. 5) and pressing rollers are not used. The wheel 3, or the flow restricting roller V of the processing liquid s (refer to FIG. 6 (3)) and the like. 556459, ③ In this way, in this type of substrate processing apparatus 5, the printed circuit board material P is the circuit forming surface R on the surface Q or the back F, and is conveyed in a non-contact state with respect to the conveying device s 2. Here, the circuit formation surface R is free from any trouble &amp; The photoresist, copper foil, electroplating, and electric foot D on the circuit formation surface R will not cause damage such as crushing, dents, deformation, etc. ④ In such a substrate processing apparatus 5, the processing liquid S is ejected from the ejection nozzle section 4 with respect to the printed wiring board material P thus conveyed. The spray nozzle portion 4 is disposed on the printed circuit board material P above the lower side m, and sprays the processing liquid S on the circuit formation surface R. For example, a chemical liquid such as a developing liquid, an etching liquid, a peeling liquid, or another cleaning liquid such as a water washing liquid is sprayed as the processing liquid S. The injection nozzle portion 4 is arranged on the nozzle 7 and the nozzle 7 is arranged on the left and right width direction W of the printed circuit board material P. The nozzle 7 with the injection nozzle portion 4 is as follows: There are intervals in the forward and backward conveying direction V, and they are arranged in multiple stages. ⑤ At the same time, in this type of substrate processing apparatus 5, a restriction liquid blowing section 6 that ejects the restriction liquid E onto the printed wiring substrate material P is used. Such a restricting liquid blowing section 6 is arranged on the upper or lower side of the printed circuit board material P being conveyed, and is also arranged before and after the ejection nozzle section 4 and discharges the restricting liquid E to the printed circuit board. The circuit of material P forms a surface R. The restricting liquid blowing section 6 is arranged on the restricting liquid pipe 9. The restricting liquid pipe 9 is arranged in the width direction W of the printed circuit board material P, and -31-556459 is parallel to the nozzle 7. They are arranged in pairs before and after the nozzle 7. On the other hand, the restricting liquid pipes 9 with the restricting liquid blowing section 6 are arranged in a plurality of sections with two spaces as a group, and there are spaces in the conveying direction V. In addition, the restricting liquid blowing part 6 is formed by a slit-shaped blowing port 10 (refer to FIG. 3 and FIG. 4 (2)) or an assembly form of the blowing port Π (refer to FIG. 4 (3)). ), And the curtain-shaped discharge and discharge restriction liquid E is formed. As such a limiting liquid E, when the chemical liquid as the processing liquid S is sprayed from the spray nozzle section 4, that is, when the substrate processing apparatus 5 is used in a development program, an etching program, a peeling program, etc., it is representative. This solution is used, but other liquids can also be used. In addition, when other cleaning liquids, which are water washing liquids of the processing liquid S, are sprayed from the spray nozzle unit 4, that is, when the substrate processing apparatus 5 is used in a cleaning program, the cleaning liquid or other cleaning liquid is used. Let's use it as the limiting liquid E. ⑥ In this type of substrate processing apparatus 5, the discharged restriction liquid E is directed to the circuit formation surface R of the printed circuit board material P, and a restriction liquid region G is formed along the width direction W (refer to FIG. 4 (1) ) Figure). That is, in the case of the substrate processing apparatus 5 for a double-sided substrate (refer to FIG. 1), the restricted liquid regions G are formed on the circuit formation surface R and the back surface F of the surface Q of the printed circuit substrate material P, respectively. The circuit formation plane R is directly below. In the case of the substrate processing apparatus 5 for a single-sided substrate (see Fig. 2), the restricted liquid region G is formed on the circuit formation surface R of the surface Q.

Here, the treatment liquid S in the ejected area is to restrict the flow in the circuit formation surface R -32- 556459 * 1 on the surface Q or the inside F by clamping the restriction liquid area G before and after, Furthermore, the front-back width limit is constant, and a flow path 形成 is formed along the width direction W to flow. This is to prevent and limit the occurrence of turbulent flow T or storage fluid (see (2) in Figure 6). In addition, in the case of the substrate processing apparatus 5 for the double-sided substrate shown in FIG. 1 ′, after the upper and lower restriction liquid blowing portions 6 are placed opposite to each other through the printed circuit board material ρ, the pressure is uniformly applied from above and below. The formation of the ejection pressure of the ejection restricting liquid E enables the printed circuit board material P being transported to be maintained and positioned by a correct horizontal posture. This prevents it from flexing, bending, meandering, bouncing, falling off, etc., and has the advantage of ensuring smooth and stable transportation. In the case of the substrate processing apparatus 5 for a single-sided substrate shown in FIG. 2, the printed circuit board material P being transported is pressed toward the conveying apparatus 2 on the lower side by limiting the discharge pressure of the liquid E. This prevents it from flexing, bending, meandering, bouncing, falling off, etc., and has the advantage of ensuring smooth and stable transportation. Here, in such a substrate processing apparatus 5, as shown in the substrate processing apparatus 1 (refer to FIG. 6 (1)) for a single-sided substrate of the above-mentioned conventional example, the upper roller is not used. Wheel 3, and the printed circuit board material P is formed on the circuit formation surface R of the surface Q (upper surface) to carry the conveyance device 2 in a non-contact state. In other words, in such a substrate processing apparatus 5, the processing liquid S in the ejection region is such that the circuit formation surface R of the printed wiring substrate material P is forced and flows toward the width direction W with a desired regularity. 2. After processing, it flows out from the left and right sides of the printed circuit board material P, flows down, and is recovered (refer to (1) of FIG. 4). -33- 556459 In the example in FIG. 1, the 'treatment liquid S is the spray nozzle portion 4 corresponding to the circuit formation surface R on the surface Q and directly below the circuit formation surface r on the inside F, and is directed toward After flowing in the right or left direction, it flows down from both sides. In the example of Fig. 2, the injection nozzle portion 4 on the circuit formation surface R corresponding to the inclined surface Q flows down from both sides after flowing in the right or left direction. In this way, the processing liquid S is scattered on the circuit formation surface R, and it is possible to prevent the turbulent flow T in the transport direction V or the storage solution U from being formed on the central portion of the circuit formation surface R to prevent the retention (see Figure 5 (1), Figure 6 (1), (2), etc.).借此 In this way, the circuit formation surface R of the surface Q or the inner surface F of the printed circuit board material P is to promote the renewal of the processing liquid S and prevent the processing speed from being delayed, excessive or insufficient. For example, if a turbulent flow T or a storage solution U occurs, chemical treatment with a chemical solution will result in a difference in processing speed, and delays, shortcomings, and formation of chemical treatments that exceed , The excessive part, and the width or width of the formed circuit D has been generated or insufficient, errors, and unevenness. In addition, in the case of washing with a washing liquid, the washing of the body cannot be performed smoothly. However, in the present invention, such situations can be avoided. In this way, it is possible to perform processing without unevenness and uniformity of the entirety. ⑨ However, the printed circuit board C manufactured using such a substrate processing apparatus 5 is a double-sided substrate with a circuit D formed on the surface Q and the back F, or a single-sided substrate with a circuit D formed on the surface Q. Formed. -34- 556459 t This type of printed circuit board c can be used as above, but the double-sided substrate or single-sided substrate manufactured separately can also be laminated in multiple stages and multiple layers at the same time, for example, as a modular substrate To use. [Effects of the Invention] "Features of the Invention" As described above, the substrate processing apparatus of the present invention is characterized in that in the manufacturing process of the printed wiring board, a circuit on the surface or inside of the printed wiring board material is formed. While the surface is being conveyed in a non-contact state, the processing liquid is sprayed from the spray nozzle portion, and at the same time, the limiting liquid is sprayed from the front and rear limiting liquid blowing portions to form a processing liquid flow path facing the left and right width directions. Here, the present invention exerts the following effects. "First effect" First, prevent turbulence or liquid storage, and improve the accuracy of printed circuit boards. That is, "in such a substrate processing apparatus", the restricted liquid region is formed on the surface of the printed circuit board material or the circuit formation surface on the inside thereof, whereby the treated liquid flows in a direction of width direction. Prevent the occurrence of turbulent flow or storage liquid as shown in the aforementioned conventional examples, and then promote the renewal of the processing liquid, and prevent the delay, excess or deficiency of the processing speed. Therefore, in order to make the processing as a whole Uniformize and avoid uneven processing. Here, the significance of printed circuit boards that have improved dramatically in accuracy and that have been moving toward higher density and miniaturization of circuits is of great significance. "Second Effect" -35- 556459 Second, it prevents troubles such as injury, and greatly reduces bad situations. That is, in this type of substrate processing apparatus, the above-mentioned first point is achieved by the ejection of the restricting liquid without causing the pressure of the rollers, restricting rollers, wheels, etc. as shown in the aforementioned conventional examples. The contact, contact, surface or inner circuit forming surface is carried in a non-contact state. Here, no damage will occur on the circuit formation surface or on the circuit. For printed circuit boards that are moving toward higher density and miniaturization of circuits, the incidence of defects will be greatly reduced, and the finished products will be significantly improved. rate. In particular, in the case of a modular substrate, in view of assembling a semiconductor component to a circuit, such an effect is significant. In this way, the problems existing in such conventional examples are completely solved, and the effect exerted by the present invention is significantly increased. [Brief description of the drawings] The first figure is directed to the substrate processing apparatus related to the present invention, and is used to provide an example of an embodiment of the invention (for a double-sided substrate). (1) The figure is a partial side view. Figure, (2) is a cross-sectional view viewed from the arrow along the JJ line section of (1), and (3) is a partial plan view (bottom view). Figure 2 is used to provide an explanation of other examples (for single-sided substrates) as an embodiment of the present invention. (1) the figure is a partial side view, and (2) the figure is along the line AA of (1) The section is a cross-sectional view seen by the arrow. (3) is a cross-sectional view taken along the line BB of (1) and viewed by the arrow. Fig. 3 is a partial plan sectional view for explaining the embodiment of the present invention. Figure 4 is used to provide an explanation of the embodiment of the present invention. (1) Figures -36- 556459 are partial plan views (bottom views) of the circuit forming surface of the printed circuit board material, and (2) is a limiting liquid. A bottom view (plan view) of one example of the blow-out portion, and (3) is a bottom view (plan view) of another example of the restriction liquid blow-out portion. Figure 5 is not intended to provide a description of such a conventional substrate processing apparatus (for double-sided substrates). (1) The figure is a partial side view, and (2) The figure is along (1) Figure K-K is a cross-sectional view taken from the arrow. Figure 6 is not intended to provide a description of such a conventional substrate processing apparatus (for single-sided substrates). (1) The figure is a partial side view of one example, and (2) The figure is A partial plan view (bottom view) of the circuit formation surface, and (3) is a partial side view of another example. Fig. 7 is a plan view (bottom surface) of a printed circuit board (material). [Description of Representative Symbols of Main Parts] 1: Substrate processing device (this is a conventional example) 2: Conveying device 3: Roller 3 ': Limiting roller 4: Jet nozzle unit 5: Substrate processing device (the present invention 6): Restriction liquid blowing section 7: Nozzle 8: Treatment liquid piping 9: Restriction liquid pipe-37- 556459 η: Blow 12: Limit 13: Wheel 1 4: Frame 15: On 16: Roller 1 7: Frame C: India j D: Electricity 丨 E: Limit F: Lane Ϊ G Limitation 丨: Stream 丨 P: Printing JQ: Table R: Electricity 丨 S: Office 3 Τ ·· Chaos: U: Storage V ·· W: Wide Υ: Side-outlet liquid pipe pedestal wheel stand 31J circuit board

Liquid liquid area 5: 1 circuit board material forming surface liquid

Feeding direction (front-back direction) Degree direction (left-right direction) Edge -38-

Claims (1)

556459 Pick up and apply for the Riley range 1. A substrate processing device is used in the manufacturing process of printed circuit substrates, and is characterized by having: a conveying device for conducting the printed circuit substrates without contacting the circuit formation surface Conveying; the ejection nozzle unit is used to eject the processing liquid onto the printed circuit board; and the restriction liquid blowing unit is used to eject the restriction liquid onto the printed circuit board. 2. The substrate processing device according to item 1 of the patent application scope, wherein the conveying device is such that the printed circuit board having the circuit forming surface on the surface or the inside, and the two outsides of the circuit forming surface that is maintained inside The spraying nozzle unit is arranged on the upper and lower sides of the printed circuit board being transported, and sprays the processing liquid on the circuit forming surface; the restricting liquid blowing portion is It is disposed on the upper and lower sides of the printed circuit board material being conveyed, and is disposed in front of and behind the ejection nozzle portion, and the restriction liquid is ejected to the circuit forming surface. 3. If the substrate processing device of item 2 of the patent application scope, the conveying device is to 'convey the printed circuit board material together with the frame base; and the frame base is to make the circuit forming surface of the printed circuit board material While the central opening is exposed, the inner edge of the printed circuit board material is placed and fixed to maintain the rollers of the conveying device on the lower sides of both sides. 4 · If the substrate processing device according to item 1 of the scope of the patent application, the conveying device -39-556459 Α is set so that the printed circuit substrate material having the circuit forming surface only on the surface is placed, maintained and contacted inside The spray nozzle unit is arranged on the upper side of the printed circuit board being transported, and the processing liquid is sprayed on the circuit forming surface. The restricting liquid blowing unit is arranged. At the same time as the upper side of the printed wiring board material being conveyed, it is arranged before and after the spray nozzle portion, and the restriction liquid is sprayed on the circuit formation surface. 5. For the substrate processing device with the scope of patent application No. 2 or 4, the spray nozzle is arranged on the nozzle, and the nozzle should cover the full width of the printed circuit board material and be arranged. In the left and right width direction, the restricting liquid blowing part is arranged on the restricting liquid tube. The restricting liquid tube system should cover the full width of the printed circuit board material and be arranged in the width direction. The nozzles are formed as a pair in front and back in a parallel conveying direction. 6. For the substrate processing apparatus of the scope of application for patent, the restriction liquid ejected by the restriction liquid blowing section should have the following functions, that is, the processing liquid ejected by the ejection nozzle section is on the printed circuit. The circuit formation surface of the substrate material is used to restrict and prevent turbulence or storage fluid from forming in the forward and backward conveying directions. 7. The substrate processing apparatus according to item 6 of the scope of patent application, wherein the restriction liquid ejected from the restriction liquid blowing section is such that restrictions are formed along the left and right width directions on the circuit formation surface of the printed circuit board material. -40- 556459 The processing liquid sprayed by the spray nozzle unit clamps and restricts the restricted liquid area before and after, thereby forming a flow path along the width direction on the circuit formation surface. 8 · If the substrate processing device of the scope of patent application item 7, wherein the substrate processing device is used in the development process, etching process, or peeling process of printed circuit board material, the spray nozzle unit will develop the liquid A chemical liquid such as an etching solution, a peeling liquid, or a peeling liquid is sprayed as the processing liquid, and the limiting liquid blowing section sprays the chemical liquid or other liquid as the limiting liquid. 9 · The substrate processing apparatus according to item 7 of the patent application scope, wherein the substrate processing apparatus is used in a cleaning program of the printed circuit board material. The spray nozzle unit uses water detergent and other detergents as the processing liquid. Spraying is performed, and the cleaning solution blowing section also sprays the cleaning solution as the control solution. 1 〇. The substrate processing apparatus according to item 7 of the scope of patent application, wherein the restricting liquid blowing section is formed by a slit-shaped blowing outlet that is linear in the width direction of left and right to blow the restricting liquid in a curtain shape. Perform the ejection operation. 1 1 · The substrate processing apparatus according to item 7 of the scope of patent application, wherein the restricting liquid blowing part is formed by an assembly of a plurality of blowing holes arranged side by side in the left and right width direction, and the restricting liquid is integrally formed. The blowing operation is performed in a continuous curtain. 1 2 · The substrate processing apparatus according to item 7 of the scope of patent application, wherein the substrate processing apparatus is used in a manufacturing process of a modular substrate, and the material of the printed circuit board is a micro-circuit formed on a circuit formation surface. At the same time, the semiconductor components are integrated into one piece, and they are laminated and used afterwards. -41-