1230569 玖、發明說明： (一） [發明所屬之技術領域] 本發明係有關基板材之藥液處理裝置。亦即，有關使用 於電路用基板之製造工程，對搬送中之基板材噴射藥液以 進行藥液處理之藥液處理裝置。 (二） [先前技術] <技術背景> 隨著電子機器之高性能化、小型輕量化，該電路用之基 板也高精密度化、細微化、極薄化、多樣化等，所形成之 鲁 電路之高精密度化與細微化也顯著。而且該種基板之製造 工程中，在各工程中，對於被搬送之基板材分別噴射藥液 ，因此，對基板材進行各種藥液處理與表面處理。 例如，依次噴射顯像液—蝕刻液—剝離液等之藥液，藉 此，依次實施顯像蝕刻—剝膜等之藥液處理，表面處理 ，以形成電路。又例如，依次進行浸漬於非電解銅鍍液-顯像液之噴射電解銅鍍液中浸漬—剝膜等之藥液處理， 表面處理，而形成電路。 · 而且藉由經過進行該項藥液處理與表面處理之各工程之 製造工程，製造封裝有半導體零件之模組多層基板，以及 其他各種電路用之基板。 在此種基板之製造工程之各工程中，基板材係分別供應 到藥液處理裝置，而以輸送帶邊搬送邊噴射藥液來進行藥 液處理與表面處理。 第5(1)、（2)圖爲供說明該先前例之藥液處理裝置，其中 -6- 1230569 第5 (1 )圖係利用直輥式輸送帶之例的側面說明圖，第5 ( 2 ) 圖之車輪式輸送帶之例的側面說明圖。 如該等圖式所示，例如顯像工程、蝕刻工程、剝膜工程 等中，在各藥液處理裝置1之處理室中係以輸送帶2將基 板材A —邊以水平姿勢搬送至搬送方向B，一邊對其上面 或下面之外表面（圖示例爲上面）由配設於前後左右之多個 噴嘴3噴射藥液C。然後，進行特定之藥處理與表面處理 而形成電路並製造基板。 此外，在此種藥液處理裝置1中，輸送帶2上典型上係 使用第5(1)圖所示之直輥4與第5(2)圖所示之車輪5。 可是此種先前之藥液處理裝置1被指出有下列的問題。 (第1問題） Λ 第1，在基板材Α有發生彎曲、波狀化D、折彎、腰折 、下垂E、鈎住、捲纏、掉落、跳躍等搬送上之問題。 亦即，電路用之基板材A如上述，極薄化與柔性化很顯 著，其絕緣層部分之厚度達1.0mm至60μηι左右，最近更 出現ΙΟμηι左右者。 而且此種極薄化與柔性化進步的基板材Α在藥液處理裝 置1上，在一邊由輸送帶2所搬送，一邊由噴嘴3噴射藥 液C時，由於被噴射之藥液C之噴射壓與重量，發生各種 搬運上之問題。 例如’在直輥4間與車輪5間之前後間隔F中，a.被以 水平姿勢搬送的薄板材A有時發生如圖示之彎曲、波狀化 D、折彎、腰折等，b.有時發生基板材A之前端部或後端部 1230569 對直輥4或車輪5之下垂E。 因而常常發生c.基板材A鈎住直輥4或車輪5，捲纏吸 附而被捲入，d.基板材A由直輥4或車輪5掉落，或彈跳 等事故。 先前該種藥液處理裝置1對於基板材A常常發生該項搬 運上之問題及不良事故而成爲產量低落之問題。 (第2問題） 第2，針對基板材A有人指出由於上述以致彎曲、液狀 化D等而形成之凹陷中，所噴射之藥液C滯留成爲液窪G ® 時，或前端部或後端部如上述下垂E，以致妨礙藥液處理 ，表面處理的均勻性之問題。 亦即，電路用基材A雖然如上述高精密度化與細微化， 所形成之電路之高密度化與細微化顯著，惟如上述，若發 生積水G或下垂F時，藥液C噴射之均勻化受阻，視外 表面之位置，即發生處理之快慢、過與不足、參差，以致 損及藥液處理與表面處理之均勻性。 因此，先前的此種藥液處理裝置1中，上述之高精密度 鲁 化’細微化，高密度化之實現困難而成爲問題。 (第3問題） 第3，爲解決此種問題，在該種藥液處理裝置1中，先 前也有採用前導板進行，但是麻煩而效率差爲其缺點。 亦即’在搬送之前’分別在各基板材A以膠帶黏貼富於 剛性之硬質前導板，.藉由前導板之引導以送基板材A以防 止基板材A之彎曲、液狀化D、折彎、腰折、下垂£、鈎 -8- 1230569 住、捲纏、掉落、彈跳、液體滯留G等。 然而，粘貼此種前導板需要以手工作業對各基板材A實 施，既麻煩而效果差而爲人所垢病。 (弟4問題） 第4爲噴嘴3之配設位置有侷限於輸送帶2之直輥4或 車輪5之正上面等問題。 亦即，要對極薄化與彈性化皆進步的基板材A噴射藥液 C之噴嘴3之配設位置皆如圖所示被侷限於直輥4或車輪5 之正上面（噴射基板材A上面對）或，正下面（噴射基板材A ® 下面時）。 若在直輥4或車輪5之前後間隔F之正上面或正下面對 該處搬送中或通過中之基板材A噴射藥液C，極薄而彈性 之基板材A會由於藥液C之噴射壓或重量，100%當場折彎 ，腰折而掉落。 如上所述，先前那種藥液處理裝置1有噴嘴3之配設位 置受到限制之缺點。 (三）[發明內容] 本發明之基板材之藥液處理裝置有鑑於此種實情而爲解 決上述先前例之課題由發明者銳意硏究努力而成之結果。 而且以在距離輸送帶之輸送面上下方些許之高度位準設 置墊板爲其特徵。亦即，以將墊板在直輥與車輪間之前後 間隔配設成比該等外周頂面僅凹陷於上下些許之高度位準 爲其特徵。 因此，本發明之目的在提供一種基板材之藥液處理裝置 -9 - 1230569 ，第1，消除基板材之搬送上之問題，第2，因此，基板材 之藥液處理均勻，第3，而且該等之實現簡單容易，第4 ，可以自由設定噴嘴之配設位置。 用於解決上述課題之本發明之技術手段如下。首先，申 請專利範圍第1項之內容如下。即，該申請專利範圍第1 項之基板材之藥液處理裝置係使用於基板之製造工程，而 對基板材噴射藥液以進行藥液處理。 而且以具有用於搬送該基板材之輸送帶，用於對該基板 材噴射藥液之噴嘴，以及用於保護該基板材而配設於遠離 該輸送帶之搬送面之墊板爲其特徵。 申請專利範圍第2項如下。申請專利範圍第2項之基板 材的藥液處理裝置係在申請專利範圍第1項中，該輸送帶 以水平姿勢搬送該基板材，而該噴嘴係與被搬送之該基板 材相對向，而由上下方向噴射該藥液，且該墊板係配設於 僅離開該輸送帶之搬送面上下方稍許處爲其特徵。 申請專利範圍第3項如下。申請專利範圍第3項之基板 材的藥液處理裝置係在申請專利範圍第2項中，該輸送帶 係將軸朝向左右的寬方向並以排列於前後之搬送方向之許 多搬送用直輥或車輪所構成，該直輥或車輪係配設於該搬 送面上下方而由上下方夾持該基板材並藉由接觸旋轉來搬 达。 該墊板以配設於鄰接於該輸送帶前後之直輥間與車輪間 ’同時配設成比該直輥或車輪之外周頂面至少凹陷於該基 板材之厚度左右之上下向之高度位準爲其特徵。 1230569 申請專利範圍4項以下。申請專利範圍第4項之基板材 料的藥液處理裝置係在申請專利範圍第3項中，該噴嘴至 少配設於被搬送之基板材之上側並經由配管連接到泵或藥 液槽。 該墊板之等徵爲：配設於該輸送帶之至少下側之直輥間 或車間之前後間隔間，同時其頂面係配設於比下側之直輥 或車輪之外周頂面稍低的位置，至少由下方保持並引導該 基板材。 申請專利範圍第5項如下。申請專利範圍第5項之基板 材的藥液處理裝置係在申請專利範圍第4項中，該墊板之 特徵爲：該基板材之防止吸附用之槽或孔等之凹凸係沿著 前後之搬送方向形成許多。 申請專利範圍第6項如下。申請專利範圍第6項之基板 材的藥液處理裝置係在申請專利範圍第4項中，該墊板之 特徵爲：滑接於該輸送帶之前後之直輥或車輪，同時被定 位保持於該直輥或車輪的軸上。 申請專利範圍第7項如下。申請專利範圍第7項之基板 材的藥液處理裝置係在申請專利範圍第4項中，該墊板之 特徵爲：以多個直輥或車輪爲對象配設於該輸送帶之前後 的搬送方向，而且有多數個經由橋部在搬送方向連結成一 體。 申請專利範圍第8項如下。申請專利範圍第8項之基板 材的藥液處理裝置係在申請專利範圍第5、6或7項中’該 藥液處理裝置係使用於模組基板，玻璃基板以及其他電路 1230569 用之該基板之製造工程，尤其是該顯像工程、飩刻工程、 或剝膜工程。 而且該基板材以富於極薄與柔性，該噴嘴用於對該基板 材噴射顯像液、蝕刻液、或剝離液等之藥液爲特徵。 本發明之構造如上，其功能如下。 ① 本基板材的藥液處理裝置係使用於電路用基板之製造 工程。 ② 而且該藥液處理裝置係在例如顯像工程、蝕刻工程、 或剝膜工程中對極薄而柔軟之基板材嘴射藥液以進行藥液 # 處理。並且具備輸送帶、噴嘴、墊板等。 ③ 輸送帶係以直輥或車輪所構成，而由上下方夾持基板材 而搬送至水平方向。噴嘴至少配設於被搬送之基板材之上側 ，而對基板材噴射顯像液、蝕刻液、或剝膜液等藥液。 ④ 墊板則配設於僅離開輸送帶之搬送面之上下些許之處 。亦即，墊板係介設於直輥間或車輪間之前後間隔處，同 時配設於比直輥或車輪之外周頂面至少凹陷於基板材之厚 度之上方或下方之高度位準。例如配設於稍低之位置。 ® ⑤ 因此，基板材被介設於直輥間或車輪間之前後間隔之 墊板所保持與引導，保持水平姿勢而搬送。 ⑥ 因此，利用該藥液處理裝置，可以防止在直輥間或車 輪間之前後間隔中，因爲藥液之噴射壓或重量以致基板材 彎曲、波狀化、折彎、腰折、下垂、捲纒、被捲入、掉落 或彈跳。 另外，雖然墊板的表面只要平滑狀即可，但是如形成槽 1230569 或孔等之凹凸，則更能確實防止基板材吸附於墊板。 ⑦ 在本藥液處理裝置中，此種基板材可以防止彎曲，波 狀化等並以水平姿勢搬送，所以不致於在凹陷處或殘留藥 液，也不致於下垂。因此基板材可以整面沒有快慢，過與 不足與參差均勻地進行藥液裡。 ⑧ 而且該等優點可藉由配設墊板，而不需手工作業簡單 地達成。 而且墊板藉由滑接於直輥或車輪，同時利用該等之軸穩 定地定位保持，所以構造也簡單。另外，也可以將墊板以 鲁 多個直輥或車輪爲對象配設於搬運方向，並以橋部連結成 一體，可以簡化其構造。 ⑨ 在直輥間或車輪間之前後間隔中，墊板抗拒藥液之噴 射壓以保持，引導與支撐基板材，所以可以不考慮直輥或 車輪之關係位置自由設定噴嘴之配設位置。 (四）[實施方式] (基板Η之說明） 本藥液處理裝置6係使用於電路J所用基板Η之製造工 φ 程中。茲參照第6圖說明基板Η之槪略。 電路J所用之基板Η係廣泛使用於各種電子機器，有單 面基板、雙面基板、多層基板（含最近之積累（build-up)法） 等各種。做爲此種基板Η之一環，也出現將1C、LSI元件 、被動零件、驅動零件、電容器等之半導體零件與電路j 組裝成一體之模組基板（半導體一體型之封裝基板）或，在 玻璃地（glass bare)與電路J 一起埋入半導體零件之玻璃基 板，亦即電漿顯示器PDP用之玻璃基板，或液晶LCD用之 -13- 1230569 玻璃基板，或CSP、PBGA等。當然在本說明書中所謂的基 板Η除了先前以來之印刷電路板之外也包含此種基板。 此種電路J用之基板Η隨著電子機器之高性能化、高功 能化、在高精密度化、微細化、以及極薄化、柔軟化、甚 至多層化、多樣化等也在進步，形成於外表面，即上面、 表面或下面、裏面之一方或雙方之電路J，甚至形成於內部 之電路J之高密度化，微細化很顯著。 基板Η例如印刷電路板係縱橫由例如5 0 0 m m X 5 0 0 m m左 右所構成。厚度在絕緣層部分由先前之1 .6mm極薄化至 1.0mm左右’最近由20μιη至ΙΟμηι左右’電路J部分（銅 箱部分）爲75μιη至35μηι，最近極薄化至16μηι至ΙΟμηι左 右。多層基板之情形也是整體厚度極薄化到1 .〇mm至 0 · 4 m m左右。電路J之寬或電路J間之間隙（s p a c e)也有細 微化至35μιη至25μηι左右，最近達到ΙΟμηι左右之傾向。 基板Η之槪要如上述。 (基板Η之製造方法之例） 其次，要邊參照第1圖與第6圖說明使用本藥液處理裝 置6之基板Η之製造方法。首先說明第1例之製造方法。 第1例之製造方法中，基板Η例如印刷電路板是依循下列 步驟製造的。 首先，準備在玻璃布（glasscloth)，陶瓷，或薄膜狀樹脂 製之絕緣層（芯材）之外表面以熱壓接等粘粘銅箔之銅箔疊 層板（c 0 p p e r f 〇 i 1 1 a m i n a t e )之基板材A。然後，利用雷射等 實施通孔用之鑽孔加工。 -14- 1230569 通孔（through hole)係由基板材a(基板H)之兩外表面間 之貫穿孔所構成’在一片上形成極小徑者數百個以上，其 直徑多爲〇.5mm至〇·2 mm以下。而且通孔係使用於連接兩 外表面之電路J(銅箔）間或多層基板之電路】（銅箔）間之層 間導通’或用於安裝封裝於電路j之零件。 此外’爲替代需要鑽孔加工之通孔（thr〇ugh hole)有人更 開發了形成小凸起，略呈圓錐台狀之接點的凸起（bump)， 藉由該凸起對多層基板等實現與通孔相同功能之技術。而 且凸起係按照電路J，依循顯像工程、蝕刻工程、剝離工程 而製造。 然後’在基板材A之銅箔之外表面（上面•表面、下面· 裏面之一方或雙方）塗敷或張貼光敏性抗蝕刻成膜狀然後 ’將電路J之負底片（negative film)之電路照片放在上面曝 光’因此’外表面之光敏性抗蝕劑被曝光而留下硬化之電 路J之形成部分，其他不要部分利用藥液C之顯像液之噴 射溶解去除。 然後，此種基板材A之銅箔留下光敏性抗蝕劑硬化而被 覆蓋之電路J之形成部分，而藉由顯像而溶解去除光敏性 抗蝕劑所露出之不要部分被藥液C之蝕刻液（氯化銅、氯化 鐵、以及其他腐蝕液）之噴射而溶解去除與蝕刻。 然後，剩下的電路J之形成部分的光敏性抗蝕劑被藥液C 之剝離液之噴射而剝膜去除，而以剩下之電路J之形成部 分之銅箔在基板材A之外表面（上面•表面、下面•裏面之 一方或雙方）形成特定之電路J，藉此製造基板Η即印刷電 1230569 路板。 另外，在上述顯像工程、蝕刻工程、與剝膜工程中，爲 各工程之後處理用，或在剝膜工程之後之集中後處理用， 附設有用於噴射水洗液，中和劑液以及其他藥液C之洗淨 液之洗淨工程，藉此以淸洗與去除附著於基板材A外表面 之顯像液、蝕刻液、剝離液等藥液C。此外，有關銅箔雖 然是在張貼光敏性抗鈾劑之前進行表面粗化處理（軟蝕刻） ，惟該表面粗化處理多逐漸以噴射藥液C代替先前之機械 硏磨。 魯 第1例之製造方法是由上述濕法（wet pro cess)來進行。 第1例之製造方法是如上所述。 其次，要就第2例之製造方法加以敘述。基板Η例如印 刷電路板之製造方法雖以上述第1例之濕法爲代表，惟第 2例之半輔助法（semi-additive)也多被採用。 此種半輔助法首先在事先形成通孔之基板材A之外表面 (上面、表面、下面、裏面之一方或雙方）施予非電解銅電 鍍。然後，在該非電解銅電鍍上塗敷或張貼光敏性抗蝕劑 ® 成膜狀後，安放電路：F軟片（film)之電路照片曝光。然後， 光敏性抗蝕劑被曝光而留下硬化之部分，而其他部分即電 路J之形成部分被藥液C之顯像液之噴射溶解去除。 然後，對電路J之形成部分，即以顯像將光敏性抗蝕劑 溶解去除之電鍍圖案（pat ter η)部分，即非電解銅電鍍露出 之部分施予電解銅電銅而形成電路J。 至於殘留的硬化電路J之形成部分以外之光敏性抗蝕劑則 -16- 1230569 被藥液C之剝離液之噴射而剝膜去除’而露出之非電解銅電 鍍被藥液c之蝕刻液之噴射而快速蝕刻’並溶解法除。另外 ，依照上述附設洗淨工程做爲各工程之後處理之用。 第2例之半輔助法中，以電解銅電鍍如此形成電路：ί，藉 以製造基板Η，即印刷電路板。第2例之製造方法如上所 述。 但是，印刷電路板之製造方法與其他電路J用之基板Η 之製造方法最近漸趨多樣化，除了上述第1例、第2例之 外，己開發與使用各種方法。當然本發明也適用於該各種 # 基板Η之製造方法。 基板Η之製造方法如上所述。 (藥液處理裝置6之槪要） 以下參照第1(1)、（2)圖，第2(1)、（2)圖，第3(1)、（2) 圖，第4(1)、（2)圖等以詳細說明本發明之藥液處理裝置6。 該藥液處理裝置係使用於上述之基板Η之製造工程。並 對搬送之基板材Α噴射藥液C以藥液處理基板材Α。亦即 ，使用於基板Η之製造方法之各工程，例如顯像工程、蝕 ® 刻工程、或剝膜工程等’並對該基板材Α分別噴射顯像液 、蝕刻液、或剝離液等之藥液C以進行藥液處理與表面處 理。 而且該藥液處理裝置6皆相同地在其處理室內具有輸送 帶2、噴嘴3、以及墊板7等。 藥液處理裝置6之槪略如上所述。 (輸送帶2之內容） -17- 1230569 首先敘述藥液處理裝置6之輸送帶2。該輸送帶2係使 用軸朝向左右之寬方向K，同時在前後之搬送方向B設置 多列之搬送用直輥4或車輪5所構成，該直輥4或車輪5 係配設於搬送面Μ之上下，並由上下夾持基板材A且藉由 接觸旋轉，以水平姿勢搬送至搬送方向B。 兹對此種輸送帶2進一步說明。首先，在第1 ( 1 )、（ 2)圖 ，第2(1)、（2)圖之例中，圖示著使用直輥4之輸送帶2。 亦即，在該圖示例之輸送帶2上，上下一對相對之長圓 柱狀之直輥4將軸8平行朝向左右之寬方向K，同時，沿 ® 著搬送方向B在前後互相間保持前後間隔F，多根軸平行 排列成一列。而輸送帶2由前工程連續配設於該藥液處理 裝置6以至於後工程。 因此，輸送帶2之下側的各直輥4被旋轉驅動，並藉將 由前工程所供給之基板材A夾持於上側之被動用直輥4之 間，以水平姿勢由上游側搬送至下游側。 相對地，第3(1)、（2)圖，第4(1)、（2)圖之例圖示著使用 車輪5之輸送帶2。 ® 亦即’該圖不例之輸送帶2在左右之寬方向K的軸8分 別保持特定間距間隔設置多列之短柱狀與車輪狀之車輪5 。而且此種附有車輪5之軸8有多根在寬度方向錯開間距 ’同時各車輪5係以前後重疊若干且以稍爲互相嚙合之關 係位置，平行於寬度方向K多數配置於搬送方向。 亦即，相鄰接之各列的軸8之車輪5係設定成前後不重 疊而左右錯開，結果，前後相鄰接的車輪5成爲在其前後 1230569 間隔F之間串設著鄰接的軸8之關係。此外’對於該第3 圖，第4圖之輸送帶2 ’其他的構造是依循對第1(1)、（2) 圖，第2(1)、（2)圖之輸送帶2之說明。 輸送帶2之內容如上所述。 (噴嘴之說明） 其次，要就藥液處理裝置6之噴嘴3加以說明。如第1 (1 ) 、（2)圖所示，噴嘴3位於被搬送之基板材A之對面而由上 下方向L噴射顯像液、蝕刻液、剝離液、以及其他藥液C。 茲更詳細說明此種噴嘴3。首先，噴嘴3係使用孔狀者 ，惟也可以使用開縫狀者。 噴嘴3係對向配置於由輸送帶2以水平姿勢搬送之基板 材A之正上方或正下方，並保持若干上下間隔。在第1(1) 圖之例中係僅配設於正上方，在第1(2)圖係配設於正上方 與正下方。任何情形下，至少配設於被搬送之基板材A之 上側。 在被搬送基板材A之正上方或正下方，分別配設於前後 左右之多個噴嘴3分別透過噴液管（spray pipe)等之配管9 連接到泵或藥液槽（未圖示）。 於是藥液C由藥液槽經過泵或配管9供應，壓送至各噴 嘴3之後噴射到基板材a，事後，再被回收到藥液槽以循 環使用。 另外’此種噴嘴3與基板材A之間，即配設有噴嘴3之 區域上方或區域下方，並未介設輸送帶2之直輥4或車輪 -19- 1230569 噴嘴3之構造如上。 (墊板之說明） 其次，要針對該藥液處理裝置6之墊板7加以敘述。墊 板7係配置在前後鄰接之輸送帶2之直輥4之間或車輪5 之間成可拆卸狀態。 因爲墊板7由於上述至少在其上側配設有噴嘴3 ’因此 在輸送帶2之至少下側之直輥4之間或車輪5之間的各前 後間隔F必定有配設。亦即’位於上側噴嘴3之藥液C之 噴射區對面之下側的前後間隔F介設有墊板7。 此外，如第1 (2)圖所示，在噴嘴3設置於下側之情形下 ，在輸送帶2之上側之直輥4之間或車輪5之間之前後間 隔F，亦即位於下側之噴嘴3之藥液C之噴射區對面之上 側之前後間隔F也介設有墊板7。（在此情形下’墊板7係 位於基板材A之高位而非低位，惟在本說明書中也將其稱 爲墊板7)。 另外，如第1(1)、（2)圖，第3(1)圖，第4(1)圖等所示， 如此配設之各墊板7係沿著上下方向L由輸送帶2之搬送 面Μ上下間隔少許配設。 亦即，墊板7係配設於比直輥4或車輪5之外周頂面1 0 至少在上方或下方凹陷基板材Α之厚度部分左右之高度位 準。 例如，對於配設於基板材A之下側之墊板7來說’其頂面 配設於比同樣配設於下側之直輥4或車輪5之外周頂面1 〇( 外周上面）稍低的位置，藉此由下面保持並引導基板材A。 -20- 1230569 當然，配設於基板材A上側之墊板7之頂面配設於比同 樣配設於上側之直輥4或車輪5之外周頂面1 〇(外周下面） 稍高的位置，藉此由上面保持並引導基板材A ° 如第1(1)、（2)圖或第2(1)、（2)圖之例所示，若輸送帶2 係由直輥4構成時，墊板7則沿著左右之覓度方向K形成 長板狀。亦即墊板7應介設於（沿著左右之寬度方向K配設 之）直輥4之間所形成之前後間隔F，且由平面或底面看來 成沿著寬度方向K形成長板狀。 相對地，如第3(1)、（2)圖或第4(1)、（2)圖之例所示，若 輸送帶2係以車輪5構成時，墊板7應分別介設於散佈於 前後左右（搬送方向B或寬度方向K)之各處之車輪之間的 前後間隔F，而由平面或底面看來，略呈正方形而配設成 多個散佈之狀態。 另外，在第1(1)、（2)圖，第2(1)、（2)圖或第3(1)、（2)圖 ，第4(1)、（2)圖之例由正面或背面看來，墊板7附設與突 設有用於滑接於前後之直輥4或車輪5之滑接部1 6。 雖然墊板7接觸基板材A —側之表面爲防止吸附於基板材 A而設成平滑面，惟如進一步將用爲防止基板材A之吸附之 槽或孔等之凹凸Π沿著後之搬送方向B形成多數更好。 亦即，如第2(1)、（2)圖，第3 (2)圖，第4(1)、（2)圖等 所示，若將槽狀之痕線或上下貫穿孔狀之明孔所構成之凹 凸1 1形成於基板材A，即可比僅以平滑面之情形更確實地 防止因藥液C以致基板材A吸附於墊板7。 另外，墊板7滑接於輸送帶2之前後之直輥4或車輪5 -21- 1230569 ，同時被定位保持於直輥4與車輪5之軸8 ° 亦即，墊板7如第1(1)、（2)圖，第3(1)圖’第4(1)圖等 所示，利用其滑接部1 6接觸，滑接於形成前後間隔F之前 後之直輥4或車輪5，即介設該墊板7之前後之兩直輥4 或車輪5之彎曲面，藉以定位保持。 與此同時，墊板7如第1(1)、（2)圖，第3(1)圖’第4(1) 圖等所示，被附設之安裝部1 2夾持直輥4或車輪5之凸起 部等之軸8藉以定位保持。 此外，設置於基板材A上側之墊板7如第1 (2)圖所示’ 安裝部1 2除了夾持軸8，進一步被軸8懸吊保持。 另外，第4(1)、（2)圖所示之墊板7分別被單獨使用，惟 第1(1)、（2)圖，第2(1)、（2)圖，第3(1)、（2)圖等所示之 墊板7是連成兩連，3連多連使用。 亦即，在第 1(1)、（2)圖，第 2(1)、（2)圖，第 3(1)、（2) 圖等所示之墊板7係在輸送帶2之前後之搬送方向B以多 個直輥4或車輪5爲對象配設，多個墊板透過橋部1 3橫跨 搬送方向B連成一體。 在直輥4的情形下，如第2 (1 )圖所示，橋部1 3係沿著被 輥送之基板材A之側方形成。 藉此，形成一體之連結對象之前後墊板7與兩側之橋部 1 3所圍繞之開口部1 4 ’該開口部1 4有直輥4或車輪5之 外周頂面1 〇等之外周頂部露出。亦即，多個墊板7係以橋 部1 3連接，同時在寬度方向K形成橫長的開口部1 4爲2至3 根多個，而形成由該處使直輥4露臉之略呈桌子之形狀。 -22- 1230569 相對地，車輪5之情形是如第3(2)圖所示，墊板7分別 鄰接而散布成棋子狀，因此橋部1 3被形成爲在前後左右連 結該多個墊板7之間的零件。 因此，由各墊板7與橋部1 3所圍繞之開口部1 5形成於 各處，在該開口部1 5成爲車輪5之外周頂面1 〇等外周頂 部露出之關係位置。亦即，此時，多片的墊板7 —體集中 於橋部.1 3，許多小的開口部1 5散佈形成爲黑白相間狀， 而形成由該處使車輪分別露臉之略呈桌子之形狀。 墊板7之構造如上述。 (作用等） 本發明之構造如上述，而結果如下。 ① 本基板材A之藥液處理裝置6係使用於基板Η之製造 工程（參照第6圖）。亦即，使用於模組基板，玻璃基板， 以及其他電路J用之基板Η之製造工程。 ② 並且本藥液處理裝置6在例如此種基板Η之製造工程 之顯像工程、蝕刻工程、或剝膜工程中，對極薄且柔軟的 基板材Α噴射藥液C以進行藥液處理，爲形成電路J而進 行表面處理（參照第1 (1 )、（ 2 )圖）。 而且本藥液處理裝置6具有搬送基板材A之輸送帶2， 將藥液C噴射於基板材A之多個噴嘴3，用於保持與引導 基板材A而配設於離開輸送帶2之搬送面Μ之墊板7。 ③ 本藥液處理裝置6之輸送帶2除了將軸8朝向左右之 莧方向Κ之外，同時由設置多列於則後之搬送方向Β之搬 送用直輥4或車輪5所構成。 1230569 該直輥4或車輪5係配設於搬送面Μ之上下方，由上下 方邊夾持基板材Α邊接觸旋轉，並以水平姿勢搬送（參照第 1(1)、（2)圖）（另外在第3(1)圖，第4(1)圖中，省略上側車 輪5之圖示）。 另外，本藥液處理裝置6之噴嘴3係位於被搬送之基板 材A之對面，而由上下方向L噴嘴藥液C(參照第1(1)、（2) 圖）。 亦即，各噴嘴3係至少配設於被搬送之基板材a之上側 而透過配管9連接到泵或藥液槽，並且基板材a噴射顯像 · 液、蝕刻液、或剝離液等之藥液C。 ④ 本藥液處理裝置6之墊板7係離開輸送帶2之搬送面 Μ之上下些許之處。 亦即，墊板7係配置於在輸送帶2前後連接處之直|昆4 之間或車輪5之間的前後間隔F(參照第1(1)、（2)圖，第 2(1)圖，第3(1)、（2)圖，第4(1)圖等）。同時墊板7係以比 直輥4或車輪5之外周頂面1 0至少在上方或下方凹陷基板 材A之厚度部分左右之高度位準介設（參照第1(1)、（2)圖 ，第3(1)圖，第4(1)圖等）。 另外，因爲噴嘴3至少配設於基板材A之上側，所以墊 板7至少配設於下側之直輥4或車輪5之間的前後間隔F ，而其頂面位於該等外周頂面1 〇稍低的位置。 ⑤ 而且，在該藥液處理裝置6中基板材A係由墊板7保 持與引導，保持水平姿勢而搬送（參照第1(1)、（2)圖，第 3(1)圖，第4(1)圖等）。 -24- 1230569 亦即基板材A係用輸送帶2之直輥4或車輪5以水平姿 勢搬送。而且基板材A係以介設於直輥4之間或車輪5之 間之前後間隔F之墊板7，至少由下方保持與引導，甚至 也由上方保持與引導（參照第1(2)圖），而不受被噴射藥液C 之不良影響，繼續維持水平姿勢搬送。 ⑥ 利用本藥液處理裝置6可以防止由於噴嘴3所噴射之 藥液C之噴射壓或重量，在直輥4之間或車輪之間的前後 間隔F處’ a.基板材A彎曲、液狀化D、折彎、腰折等（參 照第5(1)、（2)圖之先前例），b·對基板材A之前端部或後端 # 部之相對應之直輥4或車輪5發生下垂，c ·基板材A捲纏 於直輥4或車輪5或吸附而捲入，以及d.基板材A由直輥 4或車輪5掉落或彈跳。 ， 另外，墊板7之表面形成平滑狀即可，但是若沿著前後 之搬送方向B形成許多凹槽或明孔等之凹凸1 1即可更確實 防止因藥液C基板材A吸附於墊板7之問題（參照第2 (1 ) 、（2)圖，第 3(2)圖，第 4(1)、（2)圖等）。 _ ⑦ 在本藥液處理裝置6中，該基板材A係以墊板7保持 與引導，所以可以保持水平姿勢順利搬送。 基板材A之彎曲，波狀化D等之發生得以防止，不致在 因彎曲，波狀化D等而形成之凹部，被噴射之藥液C殘留成 液窪（參照第5(1)、（2)圖先前例），並且可以防止基板材A 之前端部或後端部對相對應之直輥4或車輪5之下垂E。 因此’基板材A可以均勻地噴射以由噴嘴3噴射之藥液C ，整面沒有快慢、過與不足與參差，可均勻地進行藥液處 -25- 1230569 理以及表面處理以供形成電路：r之用。 例如，在蝕刻工程中，經由測試所形成之電路J之蝕刻 偏差値，得到了下列的結果。即，對於縱橫爲5 0 0mm X 5 00mm 之基板材A，全面地檢查所形成之寬度或面積爲15μΐΏ之電 路J 1 2 1點之結果，相對於本藥液處理裝置6所獲得之優點 偏差値0.9，上述第5(1)、（2)圖之藥液處理裝置1之偏差 値爲1 . 6。 ⑧ 本藥液處理裝置6由於在輸送帶2之直輥4之間或車 輪5之間配設墊板7，因此，容易實現上述各點。即不需 要任何手工作業，即可實現上述各點。 而且，墊板7利用本身的重量，以滑接部1 6滑接輸送帶 2之前後之直輥4或車輪5，同時利用直輥4或車輪5之軸 8穩定地定位與保持（參照第1(1)、（2)圖，第3(1)圖，第 4(1)圖等），因此，其構造也簡單而穩定。 也可以將墊板7以多個直輥4或車輪5爲對象配設於輸 送帶之前後之搬送方向Β，並藉由靈活運用橋部13俾將成 爲2連或3連等多數連之墊板7在搬送方向連接成一體（參 照第2(1)圖，第3(2)圖），由此可見構造上也可以簡化。 ⑨ 另外，在本藥液處理裝置6因爲在輸送帶2之直輥4 之間或車輪5之間的前後間隔F介設有墊板7，所以可以 自由設定噴嘴3之配設位置。1230569 发明 Description of the invention: (1) [Technical field to which the invention belongs] The present invention relates to a chemical liquid processing device for a base plate. That is, regarding a manufacturing process for a circuit board, a chemical liquid processing device that sprays a chemical liquid on a substrate material being transported to process the chemical liquid. (Two) [prior art] < Technical background > With the high performance, small size, and light weight of electronic equipment, the substrates for this circuit are also highly precise, miniaturized, extremely thin, and diversified. Refinement and refinement are also significant. Moreover, in this kind of substrate manufacturing process, in each process, the base material to be transported is sprayed with a chemical solution, so various chemical liquid treatments and surface treatments are performed on the base material. For example, a chemical solution such as a developing solution-etching solution-stripping solution is sequentially sprayed, and a chemical solution treatment such as developing etching-stripping film and surface treatment are sequentially performed to form a circuit. As another example, a chemical liquid treatment such as immersion in a non-electrolytic copper plating solution-developing solution, a spray electrolytic copper plating solution, and a peeling film, and a surface treatment are sequentially performed to form a circuit. · Through the manufacturing process of each process of chemical liquid treatment and surface treatment, the module multi-layer substrate with semiconductor components packaged, and other substrates for various circuits are manufactured. In each process of the manufacturing process of such a substrate, the base plate is supplied to the chemical liquid processing device, and the chemical liquid is processed and surface-treated by spraying the chemical liquid while being conveyed by a conveyor belt. Figures 5 (1) and (2) are diagrams for explaining the chemical liquid processing device of the previous example, of which -6-1230569. Figure 5 (1) is a side explanatory view of an example using a straight roller conveyor. 2) An explanatory side view of an example of a wheeled conveyor. As shown in these drawings, for example, in a development process, an etching process, a peeling process, etc., in the processing chamber of each chemical liquid processing apparatus 1, the base plate A is conveyed to the conveyance in a horizontal posture by a conveyor belt 2 In the direction B, a plurality of nozzles 3 arranged on the front, back, left, and right are sprayed with the chemical liquid C on the outer surface of the upper or lower side (the upper side in the example of the figure). Then, specific chemical treatment and surface treatment are performed to form a circuit and manufacture a substrate. Further, in this chemical liquid processing apparatus 1, the conveyor belt 2 typically uses straight rollers 4 shown in Fig. 5 (1) and wheels 5 shown in Fig. 5 (2). However, such a conventional chemical liquid processing apparatus 1 has been pointed out as follows. (First problem) Λ First, the base plate A has problems in transportation such as bending, corrugation D, bending, waist folding, sagging E, hooking, entanglement, dropping, and jumping. That is, as described above, the base plate A for the circuit is extremely thin and flexible, and the thickness of the insulating layer portion is 1. 0mm to 60μηι, and more recently, about 10μηι. In addition, when the base material A having such an extremely thinner and more flexible substrate is sprayed on the chemical liquid processing device 1 by the conveyor 3 while the chemical liquid C is sprayed from the nozzle 3, the chemical liquid C is sprayed. Pressure and weight cause various transportation problems. For example, 'in the interval F between the straight roller 4 and the wheel 5, a. The thin sheet A being transported in a horizontal posture sometimes undergoes bending, corrugation D, bending, waist folding, etc. as shown in the figure, b. In some cases, the front or rear end portion of the base plate A 1230569 sags E against the straight rollers 4 or the wheels 5. Thus often c. The base plate A is hooked on the straight roller 4 or the wheel 5 and is wound and sucked and is drawn in, d. The base plate A is dropped or bounced by the straight roller 4 or the wheel 5. In the past, this kind of chemical liquid processing device 1 often suffered from such problems in transportation and bad accidents with respect to the base plate A, and became a problem of low production. (Second question) Secondly, it was pointed out that the base material A was deflected due to the above-mentioned bending, liquefaction D, etc., when the sprayed chemical liquid C remained as a liquid depression G ®, or the front end or the rear end The part sags E as described above, which hinders the treatment of the chemical solution and the problem of the uniformity of the surface treatment. That is, although the circuit substrate A is highly precise and miniaturized as described above, the density and miniaturization of the formed circuit is remarkable. However, as described above, when the stagnant water G or sagging F occurs, the chemical liquid C is sprayed. The homogenization is hindered, depending on the position of the external surface, that is, the speed of the treatment, the excessive and insufficient, and the unevenness, so that the uniformity of the liquid treatment and the surface treatment is damaged. Therefore, in the conventional chemical liquid processing apparatus 1 described above, it is difficult to realize the above-mentioned high-precision rubbing ', and it is difficult to realize high-density. (Third problem) Third, in order to solve such a problem, in this kind of chemical liquid processing apparatus 1, a front guide plate has also been used in the past, but it is troublesome and poor in efficiency. That is, ‘Before the transportation’, the rigid front guides with high rigidity are adhered to each base plate A with tape. Guide the base plate A to feed the base plate A to prevent the base plate A from bending, liquefaction D, bending, waist folding, sagging. Hook-8-1230569 Live, coil, drop, bounce, liquid retention G, etc. However, the application of such a front guide plate needs to be performed manually on each base plate A, which is cumbersome and has a poor effect and is contaminated by people. (Problem 4) The fourth problem is that the arrangement position of the nozzle 3 is limited to the straight roller 4 of the conveyor belt 2 or directly above the wheels 5. That is, the arrangement positions of the nozzles 3 for spraying the chemical liquid C on the base plate A, which has been extremely thinned and elasticized, are all limited to the top of the straight roller 4 or the wheel 5 as shown in the figure (the base plate A is sprayed) Face up) Or, directly below (when spraying base plate A ® below). If the medicine liquid C is sprayed on the base plate A which is being transported or passed through the space F directly above or below the space F before and after the straight roller 4 or the wheel 5, the extremely thin and elastic base plate A will Jet pressure or weight, 100% bending on the spot, waist fold and fall. As described above, the conventional liquid medicine processing apparatus 1 has a disadvantage that the arrangement position of the nozzle 3 is limited. (3) [Content of the Invention] In view of such facts, the chemical liquid processing device of the base plate of the present invention is a result of the intensive efforts of the inventors to solve the problems of the foregoing examples. It is also characterized by setting the shim plate at a slight height level from the conveying surface of the conveyor belt. That is, it is characterized by arranging the backing plate between the straight rollers and the wheels at a space slightly higher than the outer peripheral top surface at a certain height level. Therefore, the object of the present invention is to provide a chemical liquid processing device for base plates-9-1230569, first, to eliminate the problem of transportation of the base plate, second, and therefore, to uniformly treat the base liquid, third, and The realization of these is simple and easy. Fourth, the arrangement position of the nozzle can be set freely. The technical means of the present invention for solving the above-mentioned problems are as follows. First, the content of the first patent application is as follows. That is, the chemical liquid processing device for the base plate in item 1 of the patent application scope is used in the manufacturing process of the substrate, and the base plate is sprayed with the chemical liquid to perform the chemical liquid treatment. Further, it is characterized by having a conveyor belt for conveying the base plate, a nozzle for spraying a chemical solution to the substrate material, and a pad plate arranged on the conveying surface away from the conveyor belt to protect the base plate. The second item of the scope of patent application is as follows. In the patent application scope item 1, the chemical liquid processing device of the base sheet is in the patent application scope item 1. The conveyor belt transports the base sheet material in a horizontal posture, and the nozzle faces the base sheet material being conveyed, and It is characterized in that the chemical liquid is sprayed from the up and down direction, and the pad is arranged only slightly above and below the conveying surface of the conveyor belt. The third item of patent application scope is as follows. In the patent application scope item 3, the chemical liquid processing device for the base plate is in the patent application scope item 2. The conveyor belt has a plurality of transporting straight rollers or a plurality of transporting rollers, which have the shafts oriented in the wide direction from left to right and aligned in the forward and backward transport directions. It is composed of wheels, and the straight roller or wheel is arranged on the conveying surface and underneath, the base plate is clamped from above and below, and is conveyed by contact rotation. The backing plate is arranged between the straight rollers adjacent to the front and back of the conveyor belt and between the wheels. At the same time, the backing plate is recessed at least higher than the thickness of the base plate from the outer peripheral top surface of the straight roller or wheel. It must be its characteristic. 1230569 The scope of patent application is less than 4 items. In the patent application scope item 4, the chemical liquid processing device of the base sheet material is in the patent application scope item 3, the nozzle is arranged at least on the upper side of the base sheet being transported and connected to a pump or a liquid tank through a pipe. The characteristics of the pad are: at least the lower rollers of the conveyor belt or the front and rear compartments of the workshop. At the same time, the top surface is arranged slightly above the outer peripheral top surface of the lower rollers or wheels. The low position holds and guides the base plate at least from below. Item 5 of the scope of patent application is as follows. The liquid medicine processing device of the base plate in the scope of the patent application No. 5 is in the scope of the patent application in the fourth scope. The pad is characterized in that the grooves or holes of the base plate prevent the unevenness along the front and back. There are many transport directions. Item 6 of the scope of patent application is as follows. The chemical liquid processing device for the base plate of the sixth scope of the patent application is in the fourth scope of the patent application. The characteristics of the pad are: straight rollers or wheels slidingly connected to the front and back of the conveyor belt, and simultaneously positioned and maintained at The straight roller or wheel on the shaft. Item 7 of the scope of patent application is as follows. The chemical liquid processing device for the base plate of the seventh scope of the patent application is in the fourth scope of the patent scope. The feature of the pad is that a plurality of straight rollers or wheels are arranged before and after the conveyor. Direction, and many of them are integrated in the conveying direction via the bridge. Item 8 of the scope of patent application is as follows. The chemical liquid processing device of the base plate for the patent application item No. 8 is in the patent application scope of the item No. 5, 6 or 7 'The chemical liquid treatment device is used for the module substrate, glass substrate and other substrates for the circuit 1230569 Manufacturing process, especially the development process, engraving process, or peeling process. The base material is extremely thin and flexible, and the nozzle is used to spray a chemical solution such as a developing solution, an etching solution, or a peeling solution on the substrate material. The structure of the present invention is as above, and its function is as follows. ① The chemical liquid processing device of the base plate is used in the manufacturing process of circuit board. ② In addition, the chemical liquid processing device sprays the chemical liquid on the extremely thin and soft base plate to perform the chemical liquid # treatment in, for example, a development process, an etching process, or a peeling process. In addition, it is equipped with a conveyor belt, a nozzle, and a pad. ③ The conveyor belt is composed of straight rollers or wheels, and the base material is clamped by the upper and lower sides to carry it horizontally. The nozzle is arranged at least on the upper side of the base plate being conveyed, and sprays a chemical liquid such as a developing liquid, an etching liquid, or a peeling liquid on the base plate. ④ The backing plate is arranged only slightly above and below the conveying surface of the conveyor belt. That is, the backing plate is arranged at the front and back space between the straight rollers or the wheels, and at the same time, it is arranged at a level higher than or below the thickness of the base plate than the outer top surface of the straight rollers or wheels. For example, it is arranged at a slightly lower position. ® ⑤ Therefore, the base material is held and guided by the shim interposed between the straight rollers or the wheels. It is transported in a horizontal position. ⑥ Therefore, by using the chemical liquid processing device, it is possible to prevent the base plate from bending, corrugating, bending, waist-folding, sagging, rolling in the back and forth space between the straight rollers or the wheels.纒, get involved, drop or bounce. In addition, although the surface of the backing plate may be smooth, it is possible to prevent the base plate from being attracted to the backing plate more reliably by forming irregularities such as grooves 1230569 or holes.此种 In this medicinal solution processing device, this kind of base plate can be prevented from bending, corrugation, etc., and can be transported in a horizontal posture, so that no medicinal solution is left in the depression or sagging. Therefore, the base plate can be uniformly processed in the liquid without the speed, over, under, and uneven. ⑧ And these advantages can be easily achieved by installing a pad without manual work. In addition, the pad is slidably connected to a straight roller or a wheel, and at the same time, the shaft is stably positioned and held, so the structure is simple. In addition, it is also possible to arrange the shim plate in the conveying direction for a plurality of straight rollers or wheels, and to integrate the bridge portion together, thereby simplifying the structure. ⑨ During the interval between the straight rollers or wheels, the backing plate resists the spray pressure of the chemical liquid to maintain, guide and support the base plate, so the position of the nozzle can be freely set regardless of the position of the straight rollers or wheels. (IV) [Embodiment] (Explanation of Substrate Η) This chemical liquid processing device 6 is used in the process of manufacturing a substrate Η used in circuit J. The strategy of the substrate will be described with reference to FIG. 6. The substrates used in Circuit J are widely used in various electronic devices, including single-sided substrates, double-sided substrates, and multilayer substrates (including the recent build-up method). As a part of such substrates, there are also module substrates (semiconductor-integrated package substrates) that integrate semiconductor components such as 1C, LSI elements, passive components, drive components, capacitors, and circuits j into one. Ground (glass bare) is embedded in the glass substrate of the semiconductor component together with the circuit J, that is, the glass substrate for the plasma display PDP, or the -13-1230569 glass substrate for the LCD, or the CSP, PBGA, etc. Of course, the so-called substrate Η in this specification includes such a substrate in addition to the printed circuit board previously used. This type of circuit board for circuit J is also progressing with the increase in the performance and functionality of electronic equipment, as well as high precision, miniaturization, ultra-thinning, softening, and even multilayering and diversification. The circuit J on the outer surface, that is, the top, the surface or the bottom, one or both of the inside, and even the circuit J formed on the inside, has a high density, and the miniaturization is remarkable. The substrate Η, such as a printed circuit board, is composed of, for example, about 500 m m × 50 m m. The thickness in the insulation layer is from the previous one. 6mm extremely thin to 1. About 0mm, the most recent part of the circuit J (copper box part) from about 20μm to 10μm is 75μm to 35μm, and recently it has been extremely thinned to about 16μm to 10μm. In the case of a multilayer substrate, the overall thickness is extremely thinned to 1. 〇mm to about 0.4 m. The width of the circuit J or the gap (s p a c e) between the circuits J also tends to be reduced to about 35 μm to 25 μm, and recently tends to reach about 10 μm. The substrate should be as described above. (Example of a method of manufacturing a substrate Η) Next, a method of manufacturing a substrate 本 using the chemical liquid processing apparatus 6 will be described with reference to Figs. 1 and 6. First, the manufacturing method of the first example will be described. In the manufacturing method of the first example, a substrate, such as a printed circuit board, is manufactured by the following steps. First, prepare a copper foil laminate (c 0 pperf 〇i 1 1) which is bonded to a copper foil by thermocompression bonding on the outer surface of a glass cloth, ceramic, or film-like resin insulation layer (core material). aminate) based sheet A. Then, a laser or the like is used for drilling of the through hole. -14- 1230569 Through-holes (through-holes) are made up of through-holes between the two outer surfaces of the base plate a (substrate H), and there are hundreds or more of extremely small diameters on one sheet, and the diameter is mostly 0. 5mm to 0.2 mm or less. Furthermore, the through-hole is used for interlayer conduction 'between the circuit J (copper foil) or the circuit of the multi-layer substrate] (copper foil) connecting the two outer surfaces, or for mounting and encapsulating the component in the circuit j. In addition, in place of thrugh holes that require drilling, some people have developed bumps that form small bumps, slightly conical frustum-shaped contacts, and use the bumps to multilayer substrates, etc. Technology that achieves the same functions as through holes. Further, the protrusions are manufactured in accordance with the circuit J, in accordance with the imaging process, the etching process, and the peeling process. Then 'coat or post a photosensitive anti-etching film on the outer surface (one or both of the upper surface, the lower surface, or the lower surface) of the copper foil of the base plate A, and then the circuit of the negative film of the circuit J The photo was placed on top of it and exposed, so the photoresist on the outer surface was exposed, leaving the formation of the hardened circuit J, and the other unnecessary parts were removed by spraying and dissolving with the developing solution of chemical solution C. Then, the copper foil of such a base plate A leaves the photoresist hardened and covered with the formation portion of the circuit J, and the unnecessary portion exposed by the photoresist is dissolved and removed by the development solution C. The etching solution (copper chloride, ferric chloride, and other etching solutions) is sprayed to dissolve, remove and etch. Then, the remaining photoresist of the forming portion of the circuit J is peeled off by spraying the peeling liquid of the chemical solution C, and the copper foil with the remaining forming portion of the circuit J is on the outer surface of the base plate A (One or both of the upper surface, the lower surface, and the lower surface) to form a specific circuit J, thereby manufacturing a substrate, that is, a printed circuit board 1230569. In addition, in the above-mentioned development process, etching process, and peeling process, it is used for post-processing of each process, or concentrated post-processing after peeling process. It is also provided with a spraying water washing solution, a neutralizer solution and other drugs The cleaning process of the cleaning solution of the liquid C is to wash and remove the chemical liquid C such as the developing liquid, the etching liquid and the peeling liquid attached to the outer surface of the base plate A. In addition, although the copper foil is subjected to a surface roughening treatment (soft etching) before the photosensitive anti-uranium agent is posted, the surface roughening treatment is gradually replaced by the spraying of the liquid chemical C in the previous mechanical honing. The manufacturing method of the first example is performed by the above wet method. The manufacturing method of the first example is as described above. Next, the manufacturing method of the second example will be described. Although the method of manufacturing a substrate such as a printed circuit board is typified by the wet method of the first example described above, the semi-additive method of the second example is also often used. In this semi-assisted method, non-electrolytic copper plating is first applied to the outer surface (one or both of the upper surface, the upper surface, the lower surface, and the inner surface) of the base plate A in which a through hole is formed in advance. Then, a photoresist ® is applied or pasted on the electroless copper plating to form a film, and then a circuit: a photograph of a circuit of an F film is placed and exposed. Then, the photosensitive resist is exposed to leave a hardened portion, and the other portion, i.e., the formation portion of the circuit J, is sprayed, dissolved and removed by the developing solution of the chemical solution C. Then, the formation part of the circuit J, that is, the electroplating pattern (patter n) where the photosensitive resist is dissolved and removed by development, that is, the exposed part of the electroless copper plating is applied with electrolytic copper electric copper to form the circuit J. As for the remaining photoresist other than the formation part of the hardened circuit J, -16-1230569 is peeled off by the spray of the stripping solution of the chemical solution C, and the non-electrolytic copper plating is exposed by the etching solution of the chemical solution c. Spray and quickly etch 'and dissolve. In addition, according to the above-mentioned attached cleaning project for the subsequent processing of each project. In the semi-assisted method of the second example, a circuit is formed by electrolytic copper plating: ί, to manufacture a substrate Η, that is, a printed circuit board. The manufacturing method of the second example is as described above. However, the manufacturing method of the printed circuit board and the manufacturing method of the substrate Η for other circuits J have recently been diversified. In addition to the above-mentioned first and second examples, various methods have been developed and used. Of course, the present invention is also applicable to the manufacturing methods of the various substrates. The method of manufacturing the substrate Η is as described above. (Summary of Chemical Liquid Processing Device 6) Refer to Figures 1 (1) and (2), Figures 2 (1) and (2), Figures 3 (1) and (2), and Figure 4 (1) (2) and the like to explain the medicinal solution processing apparatus 6 of the present invention in detail. This chemical liquid processing device is used in the above-mentioned manufacturing process of the substrate. The base material A is sprayed with the chemical solution C to treat the base material A with the chemical solution. That is, each process used in the manufacturing method of the substrate Η, such as a development process, an etching process, or a peeling process, etc., and the substrate A is sprayed with a developing solution, an etching solution, or a peeling solution. Chemical solution C is used for chemical solution treatment and surface treatment. The chemical liquid processing apparatus 6 also has a conveyor belt 2, a nozzle 3, a pad 7 and the like in the processing chamber. The outline of the chemical liquid processing device 6 is as described above. (Contents of Conveyor Belt 2) -17- 1230569 First, the conveyor belt 2 of the chemical liquid processing apparatus 6 will be described. This conveyor belt 2 is constituted by using a shaft facing the left-right width direction K, and at the same time, a plurality of rows of conveying straight rollers 4 or wheels 5 are provided in the forward and backward conveying directions B. The straight rollers 4 or wheels 5 are arranged on the conveying surface M The base plate A is clamped up and down, and is rotated in contact with the base plate A, and is transported to the transport direction B in a horizontal posture. This kind of conveyor belt 2 is explained further below. First, in the examples of FIGS. 1 (1) and (2) and FIGS. 2 (1) and (2), a conveyor belt 2 using a straight roller 4 is illustrated. That is, on the conveyor belt 2 illustrated in the figure, an upper and lower pair of opposite long cylindrical straight rollers 4 are parallel to the shaft 8 toward the left and right width direction K, and at the same time, they are held forward and backward along the conveying direction B. Back and forth space F, multiple axes are arranged in parallel in a row. And the conveyor belt 2 is continuously arranged in the chemical liquid processing device 6 from the front process to the rear process. Therefore, each of the straight rollers 4 on the lower side of the conveyor belt 2 is driven to rotate, and the base plate A supplied by the previous process is held between the passive straight rollers 4 on the upper side, and is conveyed from the upstream side to the downstream in a horizontal posture side. In contrast, the examples in Figs. 3 (1) and (2) and Figs. 4 (1) and (2) illustrate the conveyor belt 2 using wheels 5. As shown in Figs. ® In other words, the axis 8 of the conveyor belt 2 shown in the example in the left and right width direction K is provided with a plurality of rows of short column-shaped and wheel-shaped wheels 5 at specific intervals. In addition, there are a plurality of such shafts 8 with wheels 5 staggered in the width direction. At the same time, the wheels 5 are superimposed on each other and are slightly intermeshing with each other. They are arranged parallel to the width direction K in the transport direction. That is, the wheels 5 of the shafts 8 of the adjacent rows are set so that they do not overlap front and back and are shifted from side to side. As a result, the wheels 5 adjacent to the front and back are arranged in series with adjacent shafts 8 between the front and rear 1230569 intervals F Relationship. In addition, with regard to the third and fourth conveyor belts 2 ', the other structures follow the description of the first and second conveyor belts 2 (1), (2), and (2). The content of the conveyor belt 2 is as described above. (Description of Nozzle) Next, the nozzle 3 of the chemical liquid processing apparatus 6 will be described. As shown in Figs. 1 (1) and (2), the nozzle 3 is located on the opposite side of the base plate A being conveyed, and ejects a developing liquid, an etching liquid, a peeling liquid, and other chemical liquid C from the upper and lower directions L. Such a nozzle 3 is described in more detail. First, the nozzle 3 is a hole-shaped one, but a slit-shaped one can also be used. The nozzles 3 are arranged opposite to each other directly above or directly below the substrate material A conveyed by the conveyor belt 2 in a horizontal posture, and maintain a number of vertical intervals. In the example of Fig. 1 (1), it is arranged only directly above, and in the example of Fig. 1 (2), it is arranged directly above and directly below. In any case, it should be placed at least on the base plate A being transported. A plurality of nozzles 3 arranged on the front, bottom, and right sides of the base material A to be conveyed are respectively connected to a pump or a chemical tank (not shown) through a pipe 9 such as a spray pipe. Then, the chemical liquid C is supplied from the chemical liquid tank through the pump or piping 9, and is pressure-fed to the nozzles 3 and sprayed to the base plate a. After that, it is recovered to the chemical liquid tank for recycling. In addition, between the nozzle 3 and the base plate A, that is, above or below the area where the nozzle 3 is arranged, there is no straight roller 4 or wheel -19-1230569 of the conveyor belt 2 interposed. The structure of the nozzle 3 is as above. (Description of Pad Plate) Next, the pad plate 7 of the chemical liquid processing apparatus 6 will be described. The backing plate 7 is arranged in a detachable state between the straight rollers 4 or the wheels 5 of the conveyor belt 2 adjacent to each other. Since the shim plate 7 is provided with the nozzles 3 'at least on the upper side thereof, the front and rear intervals F between the straight rollers 4 or the wheels 5 of at least the lower side of the conveyor belt 2 must be provided. In other words, a backing plate 7 is interposed between the front and rear intervals F below the spraying area of the chemical liquid C located on the upper nozzle 3. In addition, as shown in FIG. 1 (2), when the nozzle 3 is disposed on the lower side, the front and back space F between the straight rollers 4 on the upper side of the conveyor belt 2 or between the wheels 5 is on the lower side. A backing plate 7 is also interposed between the front and back space F on the upper side opposite to the spray area of the chemical liquid C of the nozzle 3. (In this case, the 'plate 7 is located at the high position of the base plate A, not the low position, but it is also referred to as a plate 7 in this specification). In addition, as shown in FIGS. 1 (1), (2), 3 (1), 4 (1), etc., each of the pads 7 thus arranged is arranged along the vertical direction L by the conveyor belt 2 The conveyance surface M is arranged at a slight interval from top to bottom. That is, the shim plate 7 is disposed at a height level that is at least about the thickness of the base plate A recessed above or below the top surface 1 0 of the outer periphery of the straight roller 4 or the wheel 5. For example, for the shim plate 7 disposed on the lower side of the base plate A, its top surface is disposed slightly lower than the outer peripheral top surface 1 (upper peripheral surface) of the straight roller 4 or the wheel 5 also disposed on the lower side. The low position, whereby the base plate A is held and guided from below. -20- 1230569 Of course, the top surface of the backing plate 7 disposed on the upper side of the base plate A is disposed at a position slightly higher than the outer peripheral top surface 1 (lower outer periphery) of the straight roller 4 or the wheel 5 also disposed on the upper side. In this way, the base plate A is held and guided from above. As shown in the examples in Figures 1 (1), (2) or 2 (1), (2), if the conveyor belt 2 is composed of straight rollers 4 The shim plate 7 is formed in a long plate shape along the left-right direction of the direction K. That is, the backing plate 7 should be interposed between (arranged along the left and right width direction K) the front and back space F formed between the straight rollers 4, and viewed from the plane or bottom surface to form a long plate shape along the width direction K . In contrast, as shown in the examples in Figures 3 (1) and (2) or Figures 4 (1) and (2), if the conveyor belt 2 is composed of wheels 5, the pads 7 should be interspersed in the distribution. The front-to-back spacing F between the wheels at the front, rear, left, and right (conveying direction B or width direction K) is slightly square when viewed from the plane or bottom surface, and is arranged in a plurality of scattered states. In addition, in the figures 1 (1), (2), 2 (1), (2) or 3 (1), (2), and the examples of 4 (1), (2) are shown from the front Or viewed from the back, the pad 7 is attached with and protruded with a sliding contact portion 16 for slidingly contacting the front and rear straight rollers 4 or wheels 5. Although the backing plate 7 contacts the base plate A, the surface on the side is provided as a smooth surface in order to prevent the base plate A from being adsorbed. However, the unevenness of the grooves or holes used to prevent the base plate A from being further conveyed along the back Direction B forms a better majority. That is, as shown in Figs. 2 (1), (2), 3 (2), 4 (1), (2), etc., if the groove-like marks or the penetrating holes are made up and down The irregularities 11 formed by the holes are formed on the base plate A, so that the base plate A can be prevented from being adsorbed on the backing plate 7 due to the chemical solution C more than when only the smooth surface is formed. In addition, the backing plate 7 is slidably connected to the straight rollers 4 or wheels 5 -21-1230569 before and after the conveyor belt 2 and is positioned and held on the axis of the straight rollers 4 and the wheels 8 8 °. That is, the backing plate 7 is as the first ( 1), (2), 3 (1), 4 (1), etc., using its sliding contact portion 16 to make sliding contact with the straight roller 4 or wheel 5 before and after the front-to-back gap F is formed. That is, the curved surfaces of the two straight rollers 4 or the wheels 5 of the backing plate 7 are positioned to maintain the positioning. At the same time, as shown in Figs. 1 (1) and (2), Fig. 3 (1) and Fig. 4 (1), etc., the attached mounting portion 12 holds the straight roller 4 or the wheel The shaft 8 of the raised portion 5 is positioned and held. Further, as shown in FIG. 1 (2), the shim plate 7 provided on the upper side of the base plate A is attached to the shaft 8 and held by the shaft 8 in addition to the shaft 8. In addition, the pads 7 shown in Figs. 4 (1) and (2) are used separately, but Figs. 1 (1) and (2), Figs. 2 (1) and (2), and 3 (1) ), (2) The pads 7 shown in the figure are connected in two, and three are used in multiples. That is, the pads 7 shown in Figs. 1 (1), (2), 2 (1), (2), 3 (1), (2), etc. are before and after the conveyor belt 2. The conveying direction B is arranged for a plurality of straight rollers 4 or wheels 5, and a plurality of pads are integrated across the conveying direction B through the bridge portion 13. In the case of the straight roller 4, as shown in Fig. 2 (1), the bridge portion 13 is formed along the side of the base plate A being fed by the roller. Thereby, the opening portion 14 surrounded by the front and rear backing plates 7 and the bridge portions 13 on both sides is formed as an integrated connection object. The opening portion 14 has a straight roller 4 or an outer peripheral top surface 10 of the wheel 5 and other outer periphery. The top is exposed. That is, a plurality of backing plates 7 are connected by a bridge portion 13, and at the same time, there are two or three openings 14 formed in the width direction K, so that the straight roller 4 is slightly exposed from this place. The shape of the table. -22- 1230569 In contrast, in the case of wheel 5, as shown in Fig. 3 (2), the pads 7 are adjacent to each other and scattered in the shape of chess pieces. Therefore, the bridge portion 13 is formed to connect the multiple pads in front, back, left, and right. Between 7 parts. Therefore, the openings 15 surrounded by each of the shim plates 7 and the bridges 13 are formed at various places, and the openings 15 become positions where the outer peripheral tops such as the outer peripheral top surface 10 of the wheel 5 are exposed. That is, at this time, a plurality of pads 7-body concentrated on the bridge. 13. Many small openings 15 are scattered in black and white, forming a shape of a table from which the wheels are exposed. The structure of the backing plate 7 is as described above. (Effects, etc.) The structure of the present invention is as described above, and the results are as follows. ① The chemical liquid processing device 6 of the base plate A is used in the manufacturing process of the substrate Η (see Fig. 6). That is, it is used in the manufacturing process of module substrates, glass substrates, and other substrates for circuit J. ② In addition, in the development process, etching process, or peeling process of such a substrate Η manufacturing process, the chemical liquid processing apparatus 6 sprays the chemical liquid C on the extremely thin and soft base plate A to perform the chemical liquid treatment. Surface treatment is performed to form the circuit J (see Figs. 1 (1) and (2)). In addition, the chemical liquid processing device 6 has a conveyor belt 2 for conveying the base plate A, and sprays the chemical liquid C on the plurality of nozzles 3 of the base plate A. The liquid liquid processing device 6 is configured to hold and guide the base plate A and is arranged to be conveyed away from the conveyor 2面 Ｍ 的 垫板 7。 Surface M of the pad plate 7. ③ The conveyor belt 2 of the chemical liquid processing device 6 is constituted by a plurality of straight rollers 4 or wheels 5 for transport, which are arranged in the subsequent transport direction B in addition to the shaft 8 in the left-right 苋 direction K. 1230569 The straight roller 4 or the wheel 5 is arranged above and below the conveying surface M, and the base plate A is rotated while being contacted by the upper and lower sides, and is conveyed in a horizontal posture (refer to Figures 1 (1) and (2)). (In addition, in FIGS. 3 (1) and 4 (1), the illustration of the upper wheel 5 is omitted). In addition, the nozzle 3 of the chemical liquid processing apparatus 6 is located on the opposite side of the substrate material A being conveyed, and the chemical liquid C is nozzle L from the vertical direction L (see Figs. 1 (1) and (2)). That is, each of the nozzles 3 is disposed at least on the upper side of the base plate a being conveyed, and is connected to a pump or a chemical liquid tank through a pipe 9, and the base plate a sprays a developing liquid, an etching liquid, or a peeling liquid.液 C。 Liquid C. ④ The backing plate 7 of this chemical liquid processing device 6 is slightly above and below the conveying surface Μ of the conveyor belt 2. In other words, the backing plate 7 is arranged at the front-to-rear space F between the front and rear joints of the conveyor belt 2 or between the wheels 4 or 5 (refer to Figures 1 (1), (2), and 2 (1) (Figures 3 (1), (2), 4 (1), etc.). At the same time, the backing plate 7 is positioned at a height level at least about the thickness of the base plate A at the top or bottom of the outer peripheral top surface 10 of the straight roller 4 or the wheel 5 (refer to Figures 1 (1) and (2)). , Figure 3 (1), Figure 4 (1), etc.). In addition, because the nozzle 3 is arranged at least on the upper side of the base plate A, the pad 7 is arranged at least at the front-rear interval F between the straight rollers 4 or wheels 5 on the lower side, and its top surface is located at the outer peripheral top surfaces 1 〇Slightly lower position. ⑤ In this chemical liquid processing device 6, the base plate A is held and guided by the shim plate 7, and is transported in a horizontal posture (refer to FIGS. 1 (1), (2), 3 (1), and 4 (1) Figures, etc.). -24- 1230569 That is, the base plate A is conveyed by the straight rollers 4 or wheels 5 of the conveyor belt 2 in a horizontal posture. Moreover, the base plate A is supported and guided at least by the bottom plate 7 interposed between the straight rollers 4 or the front and back intervals F between the wheels 5 (see also Fig. 1 (2)). ), Without being adversely affected by the sprayed liquid C, continue to carry in a horizontal posture. ⑥ The use of the chemical liquid processing device 6 can prevent the pressure or weight of the chemical liquid C sprayed from the nozzle 3 at the front-to-back space F between the straight rollers 4 or between the wheels 'a'. Base plate A is bent, liquefied D, bent, waist folded, etc. (refer to the previous examples in Figures 5 (1) and (2)), b. Corresponds to the front or rear end # of base plate A The straight roller 4 or the wheel 5 sags, c · the base plate A is wound around the straight roller 4 or the wheel 5 or is sucked and drawn in, and d. The base plate A is dropped or bounced by the straight rollers 4 or the wheels 5. In addition, the surface of the shim plate 7 may be smooth, but if a large number of grooves or open holes 11 are formed along the forward and backward conveying direction B, it is possible to more reliably prevent the chemical liquid C-based plate A from being adsorbed on the shim Problems with plate 7 (refer to Figure 2 (1), (2), Figure 3 (2), Figure 4 (1), (2), etc.). _ ⑦ In this chemical liquid processing device 6, the base plate A is held and guided by the backing plate 7, so that it can be smoothly transported while maintaining a horizontal posture. The bending of the base plate A and the occurrence of corrugation D and the like are prevented, so that the sprayed chemical liquid C remains as a liquid depression in the recess formed by the bending and corrugation D and the like (refer to Section 5 (1), 2) The previous example in the figure), and it is possible to prevent the front end or the rear end of the base plate A from sagging E against the corresponding straight roller 4 or wheel 5. Therefore, 'base plate A can be uniformly sprayed with the chemical liquid C sprayed from the nozzle 3, and there is no speed, overshooting, inadequacy, or unevenness on the entire surface, and the chemical liquid processing can be performed uniformly -25-1230569 and surface treatment for circuit formation: Use of r. For example, in the etching process, the following results were obtained by testing the etching deviation 値 of the circuit J formed. That is, for the base plate A having a vertical and horizontal width of 500 mm x 500 mm, the results of a comprehensive inspection of the formed circuit J 1 2 1 with a width or an area of 15 μΐΏ are deviated from the advantages obtained by the chemical liquid processing device 6値 0. 9. The deviation 値 of the chemical liquid processing device 1 of the above 5 (1) and (2) is 1. 6. ⑧ Since the chemical liquid processing device 6 is provided with a pad 7 between the straight rollers 4 of the conveyor belt 2 or between the wheels 5, the above-mentioned points are easily realized. That is, the above points can be achieved without any manual work. Furthermore, the backing plate 7 uses its own weight to slide the straight rollers 4 or wheels 5 of the conveyor belt 2 in the sliding contact portion 16 while stably positioning and holding the straight rollers 4 or the shafts 8 of the wheels 5 (refer to 1 (1), (2), 3 (1), 4 (1), etc.), so its structure is also simple and stable. It is also possible to arrange the pad 7 with a plurality of straight rollers 4 or wheels 5 in the conveying direction B before and after the conveyor belt, and by flexibly using the bridge portion 13 俾, it will become a pad with two or three rows, etc. The plates 7 are integrally connected in the conveying direction (refer to FIGS. 2 (1) and 3 (2)), so that the structure can be simplified. ⑨ In addition, since the chemical liquid processing device 6 is provided with a backing plate 7 between the straight rollers 4 of the conveyor belt 2 or the front-to-back space F between the wheels 5, the arrangement position of the nozzles 3 can be freely set.
亦即，噴嘴3之配設位置不必侷限於直輥4或車輪5的 正上面（由上側之噴嘴3朝基板材Α之上面噴射藥液時）（參 照第1(1)、（2)圖），或正下面（由下側之噴嘴3向基板材A -26- 1230569 下面噴射藥液C時）（參照第1(2)圖）’也可以將噴嘴3配設 於直輥4之間或車輪5之間的前後間隔F之上方或下方 (未圖示）。 換言之，在直輥4之間與車輪5之間的前後間隔F，墊 板7是抗拒著由噴嘴3噴射之藥液C之噴射壓而保持，引 導與支撐基板材A，所以不必考慮噴射壓之不良影響，即 不必考慮與直輥4或車輪5之關係位置，即可自由設定噴 嘴3之配設位置。 [發明之效果] 本發明之基板材的藥液處理裝置，如上所述’是以將墊 板配設於僅距離輸送帶之搬送面些許之局度位準爲其特徵 。亦即，以將墊板在搬送用之直輥或車輪間之前後間隔中 ，配設於比該等之外周頂面僅凹陷於上下方些許的高度位 準爲其特徵。 因此，本發明之基板材的藥液處理裝置可發揮下列的效 果。 (第1效果） 第1，基板材之搬送上之問題被消除。換言之，因爲本 發明之藥液處理裝置係在輸送帶之直輥或車輪間的前後間 隔距離搬送面上下方些許處配設墊板，所以基板材可以保 持水平姿勢搬送。 因此，可以確實防止如上所述之先前例之藥液處理裝置 ，被搬送之基板材在途中所發生之彎曲、波狀化、折彎、 腰折、下垂、鈎住、捲纏、掉落、彈跳等問題。因此，基 -27- 1230569 板材之惡化事故激減，產量大幅增加。另外，若在墊板上 形成條紋或明孔等凹凸時，可以更確實防止基板材吸附於 墊板。 而且，此種搬送上之問題的防止，對於極薄化與柔軟化 之進展顯著之電路用基板，其意義尤其重大。 (第2效果） 第2，藉此可以實現基板材之藥液處理之均勻化。亦即， 如上所述，本發明之藥液處理裝置上，基板材是保持水平 姿勢順利搬送。因此，不致如上述之先前例之藥液處理裝 着 置’所搬送之基板材成爲彎曲或波狀化，也不會在凹部成 爲藥液之液窪而滯留，以致前端部或後端部下垂的問題。 因此，基板材整面可以處理得毫無快慢，過與不足或參 差，藥液處理與表面處理均等實施。 此點對於高精密度，細微化進步而電路之高密度化，細 微化顯著的電路用基板意義尤其重大，可說開啓了該等的 實現，即量產體質的實現之路。 (第3效果） 鲁 第3，而且此事容易實現。亦即，本發明之藥液處理裝 置藉由在輸送帶之直輥或車輪間配設墊板，所以容易實現 上述之第1點與第2點。 而且墊板係滑接於直輥或車輪，同時利用軸穩定地定位 與保持，並且也可以藉由橋部連接2連、3連等，構造簡 單而穩定。 因爲不必如上述之先前例之藥液處理裝置，將前導板粘 -28- 1230569 貼於各基板材的麻煩手工作業，省卻麻煩而有效率。 (第4效果） 第4，噴嘴之配設位置可以自由設定。即，在本發明之 藥液處理裝置之輸送帶之直輥或車輪之間配設有墊板。 因此，不必如上述之此種先前例之藥液處理裝置限制將 噴嘴配設於直輥或車輪之正上方或正下方。因爲正上方與 正下方以外之前後間隔，墊板抗拒著藥液之噴射壓以保持 與支撐基板材，因此，可以自由設定噴嘴之配設位置。 此點對於極薄化與柔軟化之進步顯著之電路用基板，意 ϋ 義尤其重大。 如上所述，解決了先前例存在之所有課題之本發明所發 揮之效果顯著而重大。 (五）[圖式簡單說明] 第1(1)、（2)圖爲針對本發明之基板材之藥液處理裝置， 供說明發明之實施形態並表示適用於直輥式之輸送帶之例 其中第1(1)圖爲其一例之側面說明圖，第1(2)圖爲另一例 之側面說明圖。 ® 第2(1)、（2)圖爲供說明本發明之實施形態，表示適用於 直輥式之輸送帶之例，其中第2( 1 )圖爲重要部分之平面說 明圖，第2(2)圖爲第2(1)圖之部分擴大圖。 第3(1)、（2)圖爲供說明本發明之實施形態，表示適用於 車輪式輸送帶之例’其中第3 (1 )圖爲其一例之側面說明圖 ，第3(2)圖爲同例之平面說明圖。 第4(1)、（2)圖爲供說明本發明之實施形態，表示適用於 -29 - 1230569 車輪式輸送帶之例，其中第4 ( 1 )圖爲其他例之重要部分之 側面說明圖，第4(2)圖爲同例之重要部份之平面說明圖。 第5(1)、（2)圖爲供說明此種先前例之基板材之藥液處理 裝置，其中第5 ( 1 )圖爲使用直輥式輸送帶之例的側面說明 圖，第5 (2)圖爲使用車輪式輸送帶之例的側面說明圖。 第6圖爲將基板基板材模式化之平面說明圖。 [主要部分之代表符號說明] 1 藥液處理裝置（先前例） 2 輸送帶 3 噴嘴 4 直輥 5 早卑W 6 藥液處理裝置（本發明） 7 墊板 8 軸 9 配管 10 外周頂面 11 凹凸 12 安裝部 13 橋部 14 開口部 15 開口部 16 滑接部 A 基板材 -30- 1230569That is, the arrangement position of the nozzle 3 does not need to be limited to the top surface of the straight roller 4 or the wheel 5 (when the chemical solution is sprayed from the upper nozzle 3 to the upper surface of the base plate A) (refer to Figs. 1 (1) and (2)) Or directly below (when spraying the chemical liquid C from the nozzle 3 on the lower side to the base plate A -26-1230569) (refer to Figure 1 (2)) 'The nozzle 3 can also be arranged between the straight rollers 4 or Above or below the space F between the wheels 5 (not shown). In other words, at the front-to-back distance F between the straight rollers 4 and the wheels 5, the shim plate 7 is held against the spray pressure of the chemical liquid C sprayed by the nozzle 3, and guides and supports the base plate A, so there is no need to consider the spray pressure. The adverse effect is that the position of the nozzle 3 can be set freely without considering the position with respect to the straight roller 4 or the wheel 5. [Effects of the Invention] As described above, the medicinal solution processing device for the base material of the present invention is characterized by arranging the base plate at a certain level only from the conveying surface of the conveyor belt. That is, it is characterized by arranging the shim plate at a height level slightly lower than the outer peripheral top surface in the space between the front and back of the straight rollers or wheels for transportation. Therefore, the medicinal solution processing apparatus for the base material of the present invention can exhibit the following effects. (First effect) First, the problem of conveying the base material is eliminated. In other words, since the chemical liquid processing device of the present invention is provided with pads on the conveying surface at a distance from the front and back of the straight rollers or wheels of the conveyor, the base plate can be transported in a horizontal posture. Therefore, it is possible to surely prevent the base material sheet being transported from being bent, corrugated, bent, waist folded, sagging, hooked, entangled, dropped, etc. Bounce and other issues. As a result, the deterioration of base -27-1230569 plates has sharply reduced, and output has increased significantly. In addition, when irregularities such as stripes or open holes are formed on the backing plate, it is possible to more reliably prevent the base material from being adsorbed on the backing plate. In addition, the prevention of such transportation problems is particularly significant for circuit boards that have made significant progress in extremely thinning and softening. (Second effect) Second, it is possible to achieve uniform treatment of the chemical solution of the base plate. That is, as described above, in the medicinal solution processing apparatus of the present invention, the base material is smoothly conveyed while maintaining a horizontal posture. Therefore, the base material conveyed by the chemical liquid treatment device 'as described in the previous example will not be bent or corrugated, and it will not stay in the concave portion as a liquid depression of the chemical liquid, causing the front end or the rear end to sag. The problem. Therefore, the entire surface of the base plate can be processed without any speed, overshoot, undershoot, or unevenness, and the chemical liquid treatment and surface treatment can be performed equally. This point is particularly important for high precision, finer progress and higher density of circuits, and significant miniaturization of circuit substrates. It can be said that such realization, that is, the road to mass production physique. (3rd effect) Lu 3rd, and this is easy to achieve. That is, since the chemical liquid processing apparatus of the present invention is provided with a pad between the straight rollers or wheels of the conveyor belt, it is easy to realize the above-mentioned first and second points. In addition, the pad is slidingly connected to a straight roller or a wheel, and the shaft is stably positioned and held at the same time. The bridge can also be connected to two or three bridges with a simple and stable structure. Because there is no need for the chemical liquid processing device of the previous example described above, the troublesome manual operation of sticking the front guide plate -28-1230569 to each base plate saves trouble and is efficient. (Fourth effect) Fourth, the arrangement position of the nozzle can be set freely. That is, a pad is arranged between the straight rollers or wheels of the conveyor belt of the chemical liquid processing apparatus of the present invention. Therefore, it is not necessary to restrict the nozzles to be disposed directly above or directly below the straight rollers or wheels as in the chemical liquid processing apparatus of the previous example. Because the front and back are spaced apart from the front and back, the pad resists the spray pressure of the liquid medicine to maintain and support the base plate, so the position of the nozzle can be set freely. This point is particularly significant for circuit substrates that have made significant progress in thinning and softening. As described above, the effect of the present invention that solves all the problems existing in the previous examples is significant and significant. (V) [Schematic description] Figures 1 (1) and (2) are for the liquid medicine processing device of the base plate of the present invention, for explaining the embodiment of the invention, and showing an example of a straight roller type conveyor belt FIG. 1 (1) is a side explanatory diagram of one example, and FIG. 1 (2) is a side explanatory diagram of another example. ® Figures 2 (1) and (2) are diagrams for explaining the embodiment of the present invention, and show an example of a straight roller type conveyor belt. Among them, Figure 2 (1) is a plan explanatory diagram of important parts, and Figure 2 (1) 2) The figure is an enlarged view of part 2 (1). Figures 3 (1) and (2) are diagrams for explaining the embodiment of the present invention, and show an example applicable to a wheeled belt. Among them, Figure 3 (1) is a side explanatory view of an example, and Figure 3 (2) It is a plan explanatory diagram of the same example. Figures 4 (1) and (2) are diagrams for explaining the embodiment of the present invention, and show examples of -29-1230569 wheeled belts. Among them, Figure 4 (1) is a side explanatory diagram of important parts of other examples. Figure 4 (2) is a plan explanatory diagram of the important part of the same example. Figures 5 (1) and (2) are illustrations of the chemical liquid processing device for the base plate of this previous example, and Figure 5 (1) is a side explanatory view of an example using a straight roller conveyor. 2) The figure is a side explanatory view of an example using a wheeled belt. Fig. 6 is a plan explanatory view of a substrate-based plate material. [Description of Representative Symbols of Main Parts] 1 Chemical liquid processing device (previous example) 2 Conveyor belt 3 Nozzle 4 Straight roller 5 Goodbye W 6 Chemical liquid processing device (Invention) 7 Backing plate 8 Shaft 9 Piping 10 Outer peripheral top surface 11 Concave and convex 12 Mounting part 13 Bridge part 14 Opening part 15 Opening part 16 Sliding part A Base plate -30-1230569
B 搬送方向 C 藥液 D 波狀化 E 下垂 F 前後間隔 G 液窪 H 基板 J 電路 K 寬度方向 L 上下方向 M 搬送面B Transfer direction C Chemical solution D Corrugation E Sagging F Back-and-forth interval G Liquid sink H Substrate J Circuit K Width direction L Up and down direction M Transfer surface
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