12802161280216
A 九、發明說明： 【發明所屬之技術領域】 本發明係關於基板材的搬送裝置。亦即，關於用在電路 用基板的製造步驟中，用以一邊搬送基板材且一邊進行表面 處理的表面處理裝置的搬送裝置。 【先前技術】 《技術背景》 伴隨著電子機器的高性能化、高功能化、小型輕量化， 印刷配線基板等的電路用基板也進入高精度化、細巧化、極 薄化、多樣化的時代，其所形成電路的高密度化、微細化尤 爲顯著。 例如，撓性配線基板發展至薄膜狀絕緣層的層厚爲 12μιη程度，而電路部分的厚度也爲ΙΟμπι輕度的極薄型，該 撓性相當顯著。 在該種基板的製造步驟中，各步驟中分別使用有表面處 理裝置，在該種表面處理裝置中，對由搬送裝置所搬送的基 板材噴射處理液，以此對基板材進行藥液處理或洗淨處理。 例如，針對基板材順序噴射顯像液、蝕刻液、剝離液及洗淨 液等的處埋液，以此順序實施顯像、蝕刻、剝離及洗淨等的 表面處理，形成電路而製成基板。 《先前技術》 第3圖爲該種先前例的正面說明圖，其中，（1)圖顯示 其一例，（2)圖及（3)圖顯示其要部。在顯像裝置、蝕刻裝置、 剝離裝置及洗淨裝置等的表面處理裝置1中，基板材Α係由 J280216 該搬送裝置20的上下搬送輥子3所夾住而不斷被搬送，且 從霧式噴嘴4噴射處理液B，以此進行指定的藥液處理及洗 淨處理等的表面處理，形成電路而製成基板。 作爲此種表面處理裝置1的搬送裝置2的搬送輥子3, 使用滾輪或直輥，該種搬送輥子3配設於上下方向，同時在 前後搬送方向C上配設有多個，以此夾住基板材A且接觸轉 動而進行搬送。又，霧式噴嘴4係處於與搬送來的基板材A 的上下對面的位置，用以噴射處理液B。A. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a substrate transfer apparatus. In other words, a transfer apparatus for a surface treatment apparatus for performing surface treatment while transferring a base material in a manufacturing step of a circuit board. [Prior Art] "Technical Background" In the era of high-precision, compact, extremely thin, and diversified circuit boards such as printed wiring boards, the high-performance, high-performance, and small-sized and light-weight electronic devices are also available. The density and miniaturization of the circuit formed therein are particularly remarkable. For example, the flexible wiring substrate has been developed to a thickness of the film-like insulating layer of about 12 μm, and the thickness of the circuit portion is also extremely thin, which is 轻μπι, which is quite remarkable. In the manufacturing step of the substrate, a surface treatment apparatus is used in each step, and in the surface treatment apparatus, the processing liquid is sprayed on the base material conveyed by the conveying apparatus to chemically treat the base material or Washed. For example, a buried liquid such as a developing solution, an etching solution, a peeling liquid, and a cleaning liquid is sequentially sprayed on a base material, and surface treatment such as development, etching, peeling, and washing is performed in this order to form a circuit to form a substrate. . "Prior Art" Fig. 3 is a front explanatory view of the prior art, in which (1) shows an example thereof, and (2) and (3) show the main parts. In the surface treatment apparatus 1 such as a developing device, an etching device, a peeling device, and a cleaning device, the substrate sheet is continuously sandwiched by the upper and lower transfer rollers 3 of the transfer device 20, and the mist nozzle is continuously conveyed. 4 The processing liquid B is sprayed to perform surface treatment such as a predetermined chemical liquid treatment and a cleaning treatment, and a circuit is formed to form a substrate. As the conveyance roller 3 of the conveyance device 2 of the surface treatment apparatus 1, a roller or a straight roller is used, and the conveyance roller 3 is disposed in the vertical direction, and a plurality of the conveyance rollers 3 are disposed in the front-rear conveyance direction C. The base material A is conveyed by contact rotation. Further, the mist nozzle 4 is placed at a position opposite to the upper and lower sides of the conveyed base material A to spray the processing liquid B.
《先前技術文獻資訊》 作爲此種先前例的基板材A的表面處理裝置1、及其搬 送裝置2，例如可舉出在如下的專利文獻1及專利文獻2所 示者。 [專利文獻1]日本專利第3479636號公報 [專利文獻2]日本特開20〇2-00942〇號公報 【發明內容】 (發明所欲解決之課題） 但是，針對該種先前例的表面處理裝置1的搬送裝置 Λ 2，如下的問題遭到指摘。 《有關第1問題點》 第1: a·該種電路用基板材A，如前述，其極薄化、撓 性化顯著，且腰部變得柔軟。而且，b·該種基板材A，在乾 燥狀態下容易帶靜電’又’當噴射處理液B時被沾濕而帶有 附著性·黏著性。更且，c·該種基板材A，容易受到處理液 B的噴射壓及重量的影響。 -6- 1280216 i 在此，此等a.b.c.成爲如下問題的原因，即（，當在邊 通過搬送裝置2的搬送輥子3搬送此種基板材A邊從霧式噴 嘴4噴射處理液B時，產生各種搬送故障D，因而成爲一種 問題。 亦即，基板材A經常發生附著、捲附、捲入、吸附、滑 移、掀開、皺紋、彎曲、折曲、摺痕、腰斷、絆住、落下、 擦傷、損傷等的搬送故障D(參照第3圖的各圖）。在先前例 中，如此般使得穩定搬送變得困難，因此迫切需要實現順暢 的搬送。 # 《有關第2問題點》 第2:在該種搬送裝置2中，使用樹脂製搬送輥子3， ^ 但其容易產生精度誤差，從該方面考慮，將在基板材A之順 - 暢搬送上產生問題。 亦即，金屬製的輥子從腐蝕性的面考慮，無法應用於由 酸或鹼處理液B進行藥液處理的表面處理裝置1，又，精加 工爲可使用的金屬製輥子非常高價，因此從成本面考慮較難 採用，更且，因爲基於金屬製輥子的重量的加壓，而有容易 _丨 損傷基板材A之虞。 在此，在該種表面處理裝置1的搬送裝置2中，從耐腐 蝕性、成本面及重量面等方面考慮，以往雖使用樹脂製搬送 輥子3,但其容易產生精度誤差。亦即，樹脂製搬送輥子3 因爲處理液B的溫度等的原因而容易伸縮變化’在使用過程 中將產生誤差，進而產生彎曲、直徑不勻、旋轉不勻等’由 此，使得所搬送來的基板材A容易產生絆住、蛇行、鈹紋及 ,1280216 其他的搬送故障D。 從此等方面考慮，基板材A將經常發生搬送故障D ’而 有穩定搬送變得困難的問題的指摘。 《有關第3問題點》 第3:基板材A係夾於表面處理裝置1的搬送裝置2的 上下搬送輥子3間而被接觸搬送，但其接觸壓力不夠充分’ 因此從該方面考慮，將產生順暢搬送的問題。 亦即，搬送輥子3如上述般爲由樹脂所構成’但上側的 搬送輥子3的重量不足，而造成加壓不足，因此經常發生無 法使極薄化、撓性化明顯的基板材A毫無遺漏地充分接觸於 下側的搬送輥子3的事態。 例如，當具有在上下搬送輥子3間產生有數微米單位的 間隙的情況時，搬送來的基板材A容易產生滑移、蛇行及其 他的搬送故障D，從此方面考慮，而有基板材A的穩定搬送 變得困難的問題的指摘（尤其是參照第3圖的（1)圖、（2)圖）。 又，當作爲對策而設定爲使搬送輥子3間緊密接觸時， 則容易產生折曲等的搬送故障D(尤其是參照第3圖的（3) 圖）。 《有關本發明》 本發明之基板材的搬送裝置，係鑒於上述實際狀況，爲 解決上述先前例的課題，經發明者的刻意硏究努力的結果所 完成者。 針對由表面處理裝置的搬送裝置的上下等形成對的搬 送輥子，以埋入不同磁極的磁性體爲其特徵。又，以與此組 1280216 i i 合，將一搬送輥子設爲自由輥子，或與一般的搬送輥子混合 配置，全周或部分埋入磁性體爲其特徵。 藉此，本發明之目的在於提供一種基板材的搬送裝置， 第1、實現極薄化、撓性化明顯的基板材之順暢的穩定搬送； 第2、可對應樹脂製搬送輥子的精度誤差，依此亦能達成穩 定搬送；第3、能充分確保搬送輥子間的接觸壓力，依此亦 能達成穩定搬送。 (解決問題之手段） 《有關各申請專利範圍》 爲解決此等課題的本發明的技術手段如下。首先，申請 專利範圍第1項如下。 ~ 申請專利範圍第1項之基板材的搬送裝置，係關於用在 · 電路用基板的製造步驟中，用以一邊搬送基板材且一邊進行 表面處理的表面處理裝置的搬送裝置，其特徵爲：具有成對 使用且夾住基板材而藉由接觸轉動進行搬送，同時在成對之 相互間磁化爲不同磁極的搬送輥子。 申請專利範圍第2項如下。申請專利範圍第2項之基板 _ 材的搬送裝置，係於申請專利範圍第1項中，其特徵爲：搬 送輥子係由樹脂所構成，在樹脂內部埋入使成對之相互間.磁 化爲不同磁極的磁性體。 申請專利範圍第3項如下。申請專利範圍第3項之基板 材的搬送裝置，係於申請專利範圍第2項中，其特徵爲：由 上下等構成一對的一搬送輥子，係由可轉動地安裝於該軸的 自由輥子所構成，構成一對的另一搬送輥子，係由固定安裝 -9- .1280216 於該軸且被驅動的固定輥子所構成。 申請專利範圍第4項如下。申請專利範圍第4項之基板 材的搬送裝置，係於申請專利範圍第2項中，其特徵爲··該 搬送輥子，係由以上下等方式所構成一對的雙方同時固定安 裝於該軸的固定輥子所構成。 申請專利範圍第5項如下。申請專利範圍第5項之基板 材的搬送裝置，係於申請專利範圍第3或4項中，其特徵爲： 有規則性混合配置如此般埋入該磁性體而被磁化的成對的 搬送輥子、及未埋入該磁性體亦未被磁化的成對的搬送輥 子。 申請專利範圍第6項如下。申請專利範圍第6項之基板 材的搬送裝置，係於申請專利範圍第3或4項中，其特徵爲： 該搬送輥子係繞其圓周而於全周連續埋入該磁性體。 申請專利範圍第7項如下。申請專利範圍第7項之基板 材的搬送裝置，係於申請專利範圍第3或4項中，其特徵爲： 該搬送輥子係繞其圓周而取間隔以部分地埋入該磁性體。 申請專利範圍第8項如下。申請專利範圍第8項之基板 材的搬送裝置，係於申請專利範圍第3或4項中，其特徵爲： 該表面處理裝置係對由該搬送輥子搬送來的極薄且撓性基 板材，從霧式噴嘴4噴射顯像液、蝕刻液、剝離液或洗淨液 等的處理液，進行表面處理。 申請專利範圍第9項如下。申請專利範圍第9項之基板 材的搬送裝置，係於申請專利範圍第3或4項中，其特徵爲： 該表面處理裝置係對由該搬送輥子搬送來的極薄且撓性的 -10- 1280216 基板材，從氣體嘴噴吹出氣體進行乾燥處理。 申請專利範圍第1 〇項如下。申請專利範圍第1 〇項之基 板材的搬送裝置，係於申請專利範圍第3或4項中，其特徵 爲：該表面處理裝置係將該搬送輥子配設於浸漬槽的處理液 中，由處理液浸漬處理搬送來的極薄且撓性的基板材。 (發明效果） 《本發明的特徵》 本發明之基板材的搬送裝置，如上述說明，針對由表面 處理裝置的搬送裝置的上下等形成對的搬送輥子，以埋入不 同磁極的磁性體爲其特徵。 又，以與此組合，將一搬送輥子設爲自由輥子，或與一 般的搬送輥子混合配置，全周或部分埋入磁性體爲其特徵。 在此，本發明之基板材的搬送裝置，發揮如下的效果。 《第1效果》 第1、在表面處理裝置中解消搬送故障，實現極薄化、 撓性化明顯的基板材之順暢的穩定搬送。 亦即，在本發明之基板材的搬送裝置中，藉由埋入的不 同磁極的磁性體，在上下等形成對的搬送輥子間作用吸引 力，藉此毫無遺漏地夾入基板材進行接觸轉動，從而實現基 板材的穩定搬送。亦即，基板材雖有a.極薄化、撓性化明顯； b ·帶有附著性·黏著性；及c ·還容易受到處理液的影響的情 況，但仍可無故障地搬送。 可確實解消上述先前例中所指摘的基板材的附著、捲 附、捲入、吸附、滑移、掀開、皺紋、彎曲、折曲、摺痕、 -11- 1280216 腰斷、絆住、落下、擦傷、損傷等的搬送故障。 《第2效果》 第2、可對應樹脂製搬送輥子的精度誤差，依此亦能達 成穩定搬送。 亦即，在本發明之基板材的搬送裝置中，藉由埋入的不 同磁極的磁性體，在上下等形成對的搬送輥子間作用吸引 力，即使在樹脂製搬送輥子產生彎曲、直徑不勻、旋轉不勻 等，仍可由吸引力來吸收。 在此，在表面處理裝置中，針對極薄化、撓性化明顯的 基板材，可確實防止上述先前例中所指摘的起因於樹脂製搬 送輥子的精度誤差的絆住、蛇行、皺紋及其他的故障產生， 依此亦能達成穩定搬送。 《第3效果》 第3、能充分確保搬送輥子間的接觸壓力，依此亦能達 成穩定搬送。 亦即，在本發明之基板材的搬送裝置中，藉由埋入的不 同磁極的磁性體，在上下等形成對的搬送輥子間作用吸引 力，因此搬送輥子可邊充分確保需要的接觸壓力，邊夾住基 板材進行接觸轉動。藉此可毫無遺漏地夾入基板材進行搬 在此，在表面處理裝置中，針對極薄化、撓性化明顯的 基板材，可確實防止上述先前例中所指摘的起因於接觸壓力 不足的滑移、蛇行及其他的故障產生，依此亦能達成穩定搬 送。 -12- 1280216 如此般，可完全解決此種先前例所存在的課題等，本發 明所發揮的效果相當顯著。 【實施方式】 《有關圖式》 以下，基於實施圖示發明甩的較佳形態，詳細說明本發 明之基板材的搬送裝置。 第1圖顯示實施例之搬送輥子的磁性體的埋入形態。其 中，（1)圖爲第1例的正剖面說明圖，（2)圖爲第2例的正剖 面說明圖，（3)圖爲第3例的正剖面說明圖，（4)圖爲第4例 的正剖面說明圖，（5)圖爲第5例的正剖面說明圖，（6)圖爲 第6例的側剖面說明圖。 第2圖爲針對實施例之搬送輥子，顯示其配設形態的平 剖面說明圖。其中，（1)圖顯示第1例，（2)圖顯示第2例， (3)圖顯示第3例。 第4圖、第5圖、第6圖及第7圖顯示表面處理裝置的 各例。其中，第4圖顯示由滾輪組成搬送輥子的例子，爲要 部的正面說明圖。第5圖、第6圖顯示由直輥組成搬送輥子 的例子，第5圖爲整體的正面說明圖，第6圖爲整體的側面 說明圖。第7圖之（1)圖顯示由浸漬型組成的同時還由直輥 組成搬送輥子的例子，爲整體的正面說明圖。第7圖之（2) 圖顯示由乾燥型組成的同時還由滾輪組成搬送輥子的例 子，爲整體的正面說明圖。第8圖爲基板（基板材）的模式化 的平面說明圖。 《有關基板E》 1280216 該基板材A的表面處理裝置5的搬送裝置6,使用在電 路F用的基板E的製造步驟。在此，首先，參照第8圖說明 基板E的大致構成。 電路F用的基板E係在AV機器、電腦、行動電話、數 位相機及其他的各種電子機器中，用於電性連接用，在絕緣 層的外表面及內部形成連接零件間用的電路F圖案。 此種電路F用的基板E，具有單面基板、雙面基板、多 層基板（最近的沉積法所成者）等的各種基板，可分爲硬材質 的堅硬系及薄膜狀的撓性系者。 作爲此種基板E的一環，還出現了將1C、LSI元件、被 動零件、驅動零件、電容器等的半導體零件與電路F —體組 入的模組基板（半導體一體型封裝基板），及在玻璃基材將電 路F與半導體零件一起埋入的玻璃基板，亦即，電漿顯示器 PDP用的玻璃基板、液晶LCD用的玻璃基板、CSP、PBGA 等。當然，本說明書中的基板E，係指除以往的印刷配線基 板外還廣泛包含上述類型的基板。 此種電路F用的基板E，伴隨著電子機器的高性能化、 高功能化、小型輕量化，也進入了高精度化、細巧化、極薄 化、撓性化、多層化、多樣化等，而形成於外表面（上面· 表面及下面·背面的一方及雙方）的電路F、更且形成於內部 的電路F的高密度化、微細化尤爲顯著。 基板E、如印刷配線基板，其製造時的一片的縱橫的切 割尺寸，如係由5 0 0 m m X 5 0 0 m η所組成。厚度爲其絕緣層（芯 材）部分爲以往的從1.6mm至1.0 mm〜60μιη程度、乃至迄 -14- 1280216 1 今的50μπι〜ΙΟμιη前後爲止的極薄化。 電路F部分（銅箔部分）的厚度也爲從75μπι〜35μπι程 度、乃至迄今的16μιη〜ΙΟμιη前後爲止的極薄化。多層基板 的情況中，其整體厚度爲1.0 mm〜0.4mm程度的被不斷極薄 化者。電路F寬度及電路F間空間也從30μιη〜15μπι程度乃 至迄今的ΙΟμιη前後爲止，具有微細化的傾向。 基板Ε大致上形成如此。 《有關基板Ε的製造方法的例子》 其次，參照第8圖說明該基板材Α的表面處理裝置5 及使用搬送裝置6的基板E的製造方法。首先，針對第1例 的製造方法進行說明。該第1例的製造方法中，基板E、如 印刷配線基板係依下述步驟製造。 最初，準備在玻璃纖材製、陶瓷製或聚醯亞胺等的薄膜 狀樹脂製絕緣層（芯材）的外表面藉由熱壓合等貼合銅箔而 形成爲附貼合銅層疊板的基板材A。 然後，針對此種準備的基板材A，對貼合的銅箔表面進 行粗化的表面粗化處理（軟性鈾刻）後，切斷爲短尺寸的工件 尺寸的各片。表面粗化處理係由機械硏磨來進行，但最近較 多藉由噴射處理液B來進行。 在大多數的情況，通孔用的孔加工係使用雷射等來實 施。通孔係由基板材A(基板E)的兩外表面間的微細貫穿孔 所形成，一片上形成有數百個以上的極小徑的孔，其孔徑大 多爲0.5mm〜0.2mm程度以下。通孔係使用於兩外表面的電 路F(銅箔）間、多層基板的電路F(銅箔）間的層間導通連接用 -15- .1280216 及安裝於電路F的半導體零件的安裝用。 又，最近還開發出取代需要進行孔加工的通孔，形成小 突起狀·略圓錐台狀的構成接點的凸塊，以此針對多層基板 等，可通過該凸塊實現與通孔相同功能的技術。又，凸塊係 根據電路F，經顯像步驟、蝕刻步驟及剝離步驟所製造。 然後，在基板材A的銅箔外表面（上面·表面及下面· 背面的一方及雙方），呈膜狀塗敷或貼合感光性光阻。然後， 藉由對電路F的負型薄膜、即預設電路F的電路F照片進行 曝光，其外表面的光阻被曝光而留下硬化後的電路F形成 部，其他的不要部分則通過噴射屬處理液B的顯像液予以溶 解去除。 然後，此種基板材A的銅箔，留下光阻硬化後所覆被的 電路F形成部分，通過顯像溶解去除光阻而曝露的不要部 分，則通過噴射屬處理液B的蝕刻液（氯化二銅、氯化二鐵 及其他的腐蝕液）予以溶解、蝕刻去除。然後，通過噴射屬 處理液B的剝離液剝離去除殘留的電路F形成部分的光阻， 而殘留的電路F形成部分的銅箔則在基板材A的外表面形成 指定導體圖案的電路F，藉以製成基板 又，在上述顯像步驟、蝕刻步驟及剝離步驟，附設用於 各自的後處理或集中於剝離步驟後的後處理的洗淨步驟，該 洗淨步驟係噴射作爲處理液B的水洗液、中和劑液及其他的 洗淨液。藉此，在該洗淨步驟中，洗淨除去附著於基板材A 的外表面（包含通孔內等）的顯像液、蝕刻液 '剝離 '液等的處 理液B。 -16- .1230216 更且，在此種洗淨步驟後，附設有乾燥步驟。亦即，因 爲在由洗淨步驟所洗淨的基板材A的外表面（包含通孔內 等）附著有屬處理液B的水洗液、其他的洗淨液及此等的水 分，因此爲了防止氧化等而應將此等除去，而於其後立即在 乾燥步驟中進行乾燥處理。又，如此之乾燥步驟被分爲除去 附著吸引與溫風乾燥的2階段實施的情況也很多。 第1例之製造方法，係由此種濕式處理法所構成。第1 例之製造方法係如上述般構成。 其次，說明第2例之製造方法。基板E、如印刷配線基 板的製造方法，雖然上述第1例之濕式處理法爲其代表性方 法，但也常使用第2例之半添加法。 在該半添加法中，首先，在預先形成通孔的基板材A的 外表面，電鍍無電解銅。—然後，在無電解銅電鍍上呈膜狀 塗敷或貼合感光性光阻後，—對屬電路F薄膜的電路F照片 進行曝光。—於是光阻被曝光而留下硬化後的部分，其他的 部分、亦即電路F形成部分則通過噴射屬處理液B的顯像液 予以溶解去除。 然後，對電路F形成部分、即通過顯像溶解除去光阻的 電鍍圖案部分、即無電解銅電鍍曝露的部分施以電解銅電 鍍，—形成電路F。—又，殘留的硬化後的電路F形成部分 以外的光阻，則通過噴射屬處理液B的剝離液被剝離去除， —曝露的無電解銅電鍍，則通過噴射屬處理液B的蝕刻液被 快速蝕刻而融解去除。—又，依據前述內容，附設將洗淨液 作爲處理液B的洗淨步驟及乾燥步驟用作爲各步驟的後處 -17- 1280216 理。 在第2例之半添加法中，如上述，利用電解銅電鍍形成 電路F，藉以製造基板E。第2例之製造方法係如上述般構 成。 但是，印刷配線基板及其他的電路F用基板E的製造方 法，最近越來越多樣化，除上述第1例及第2例之外，還開 發、使用有各種的方法。本發明當然可應用於此等各種基板 E的製造方法。 基板E的製造方法係如上述般構成。 《有關表面處理裝置5》 首先，參照第4圖、第5圖、第6圖及第7圖說明使用 有本發明之基板材A的搬送裝置6的表面處理裝置5。該表 面處理裝置5係在基板E的製造步驟中使用，以一邊搬送基 板材A且一邊進行表面處理。 首先，第4圖、第5圖及第6圖所示表面處理裝置5, 係在基板E的製造步驟的如顯像步驟、蝕刻步驟、剝離步驟 或洗淨步驟等中，作爲顯像裝置、蝕刻裝置、剝離裝置及洗 淨裝置等使用。藉此，對搬送來的基板材A，分別噴射顯像 液、蝕刻液、剝離液或洗淨液等的處理液B，對基板材A進 行藥液處理、洗淨處理等的表面處理。 然後，該第4圖、第5圖及第6圖的表面處理裝置5， 在屬處理室的室7內具有搬送基板材A的屬傳輸帶的搬送裝 置6及噴射處理液B於搬送來的基板材A的霧式噴嘴4。 霧式噴嘴4係處於與搬送來的基板材A對面的位置，用以噴 -18- 1280216 射顯像液、餓刻液、剝離液或洗淨液等的處理液B。圖示例 之霧式噴嘴4係上下隔以間隔而配設在由搬送裝置6的搬送 輥子8以水平姿勢搬送的基板材A的正上及正下方，且配設 爲面向搬送輥子8間形成的間隔空間。 圖示例之霧式噴嘴4係沿前後的搬送方向C與左右的寬 度方向G，隔開指定間距的間隔，上下隔著基板材A排列多 個。在此，處理液B從液槽9介由泵10及配管11，壓送至 各霧式噴嘴4，噴射於基板材A。然後，在朝寬度方向G的 左方向或右方向流動於基板材A的外表面進行表面處理 後，從基板材A的左右兩側流下，再度回收至液槽9，其後 被循環使用。 其次，第7圖之（1)圖所示表面處理裝置5,係將搬送裝 置6的搬送輥子8配設於浸漬槽12的處理液B中，由處理 液B浸漬處理搬送來的基板材A。 亦即，該第7圖之（1)圖的表面處理裝置5，例如，係用 作爲洗淨步驟的洗淨裝置，在室7內上部設有浸漬槽1 2，浸 漬槽12內滿載屬處理液B的洗淨液，在該處理液B中配設 有搬送裝置6的搬送輥子8。 藉此，基板材A係藉由沿搬送方向C、圖示例中被水平 搬送至浸漬槽12內，其外表面（包含通孔內等）係由屬處理 液B的洗淨液進行浸漬處理、洗淨處理、表面處理。又，屬 處理液B的洗淨液，介由配管1 1及泵10而於室7內上部的 浸漬槽1 2與下部的液槽9間循環使用。圖中元件符號1 3爲 洗淨用刷子。 -19- 1280216 又，第7圖之（2)圖所示表面處理裝置5，係從氣體噴嘴 14對由搬送裝置6的搬送輥子8搬送來的基板材A吹出氣 體Η，進行乾燥處理。 亦即，該第7圖之（2)圖的表面處理裝置5，係用作爲乾 燥步驟的乾燥裝置，在室7內上部設有乾燥室1 5，且在乾燥 室15內配設有搬送裝置6的搬送輥子8。 與此同時，在乾燥室1 5內，在圖示例中水平搬送的基 板材Α的正上及正下方，邊上下隔開間隔邊面向搬送輥子8 間形成的間隔空間配設有氣體噴嘴1 4。於是，乾燥氣體、溫 風氣體等的氣體Η，在圖示例中介由溫風產生器16,從配設 於室7內下部的鼓風機1 7供給氣體噴嘴1 4。圖中元件符號 1 8爲鼓風機1 7的馬達。 藉此，基板材Α係藉由沿搬送方向C、圖示例中被水平 搬送至乾燥室15內，附著於其外表面（包含通孔內等）的處 理液B，如水洗液等的洗淨液，經由從氣體噴嘴14吹出的 氣體Η，進行除去處理、乾燥處理、表面處理。 表面處理裝置5係如上述般構成。 《有關搬送裝置6》 其次，參照第4圖、第5圖、第6圖及第7圖等說明此 種表面處理裝置5的搬送裝置6。 首先，該基板材Α的搬送裝置6係在電路用基板Ε的製 造步驟中，在基板材A的表面處理裝置5的室7內使用，具 備多數搬送輥子8。 該搬送輥子8係由上下等成對使用，相互間進行接觸轉 -20- 1280216 動的同時，夾住基板材A而由接觸轉動進行搬送。 作爲基板材A的搬送形態，如各圖示例，雖以水平搬送 者爲代表，但從防止處理液B的液蓄積等的觀點，還可考慮 傾斜搬送及縱向搬送。 亦即，在圖示例中，表面處理裝置5的搬送裝置6的搬 送輥子8，係讓其軸J朝向左右寬度方向G而水平配設，但 也可考慮傾斜搬送及縱向搬送，藉此，基板材A除水平姿勢 的水平搬送外，還有從水平傾斜的姿勢的傾斜搬送或縱向姿 勢的縱向搬送的情況。 當然，在該傾斜搬送及縱向搬送的情況，上述霧式噴嘴 4及氣體噴嘴14也相對基板材A而從上下對面的姿勢配設 爲傾斜的姿勢或左右方向。 圖示例的搬送輥子8係讓其軸J朝向左右寬度方向G， 同時，多數配設於前後的搬送方向，搬送裝置6具備水平的 上側搬送輥子8群及水平的下側搬送輥子8群。 分別壓接於搬送對象的基板材A、圖示例中爲下側的搬 送輥子8，介由驅動齒輪1 9連接於馬達等的驅動機構進行旋 轉驅動，藉此，基板材A在室7內沿搬送方向C而從上游側 水平搬送至下游側。 又，此種搬送輥子8係使用滾輪或直輥。亦即，在第4 圖、第7圖之（2)圖所示表面處理裝置5的搬送裝置6中， 搬送輥子8係使用滾輪（參照第2圖之（1)圖及（2)圖），相對 軸J形成爲短柱狀、車輪狀的滾輪隔開指定間距的間隔安裝 有複數個。 -2 1- .1280216 相對於此，在第5圖、第6圖、第7圖之（1)圖所示表 面處理裝置5的搬送裝置6中’搬送輥子8係使用直輥（參 照第2圖之（3 )圖），安裝有相對一根軸：Γ形成爲長圓柱狀的 一根直輥。 搬送裝置6係如上述般構成。 《有關搬送輥子8的磁化》 接著，參照第1圖、第2圖等詳細說明此種搬送裝置6 的搬送輥子8的磁化。 搬送裝置6的上下等成對的搬送輥子8，係在成對的相 互間磁化爲不同磁極。該搬送輥子8係由樹脂K製所構成， 同時，在樹脂K內部埋入在上下等成對的相互間磁化爲不同 磁極的磁性體L。 以下進一步詳述有關此種搬送輥子8的磁化。亦即，搬 送輥子8係藉由磁性體L的埋入而預設爲永久磁石化，上下 等成對的一方被磁化爲N極，而另一方被磁化爲S極。 埋入的磁性體L係使用肥粒鐵、其他的鐵、鎳、鈷、其 他的金屬，且使用帶狀、線狀、小片狀、粉末狀、其他各種 的形狀。 磁性體L的埋入形態可爲各種。首先，如第1圖之（1) 圖及（5)圖、第2圖之（1)圖等所示，考慮將磁性體L沿圓周 全周一體連續埋入搬送輥子8。該情況，使用帶狀、環狀及 筒狀等的磁性體L。 其次，如第1圖之（2)圖及（3)圖等所示，考慮將磁性體 L沿圓周隔開小間隔且非連續地部分埋入搬送輥子8。作爲 -22- 1280216 其中一環，如第1圖之（6)圖所示，考慮於軸J方向隔開小間 隔埋入。在此等情況使用小片狀、粉末狀的磁性體L。 又，此等例中，磁性體L係與搬送輥子8的軸J同軸埋 入，但並不限於此，如第1圖之（4)圖所示，還可考慮沿軸J 方向呈螺旋狀、線圏狀埋入。更且，可考慮將粉末狀磁性體 L均勻地埋入搬送輥子8的樹脂K整體內。 又，可由其他各種形態埋入。 還可規則性混合配置如此般埋入磁性體L而被磁性化 的上下等成對的搬送輥子8及未埋入磁性體L而未被磁性化 的上下等成對的搬送輥子20。 亦即，如第2圖之（1)圖所示，在表面處理裝置5的搬 送裝置6中，雖還可僅使用埋入磁性體L的搬送輥子8,但 例如，如第2圖之（2)圖及（3)圖等所示，還可規則性混合配 置埋入磁性體L的成對的搬送輥子8及未埋入磁性體L的通 常的成對的搬送輥子20。 在第2圖之（2)圖中，在使用滾輪之例中，沿寬度方向G 介由2個通常的搬送輥子20配設埋入磁性體L的搬送輥子 8 °在第2圖之（3)圖中，在使用直輥之例中，沿搬送方向C 交錯配設埋入磁性體.L的搬送輥子8與通常的搬送輥子。 又，如此般被磁化的搬送輥子8，如第1圖之（5)圖所示， 可把以上下等方式構成一對之搬送輥子雙方均相對於該軸J 作固定安裝。亦即，還可將搬送輥子8均設爲固定輥子2 1， 將任一方介由驅動齒輪1 9連接於驅動機構。 相對於此，如第1圖之（1)圖、（2)圖、（3)圖、（4)圖、（6) -23- 1280216 圖等所示，針對被磁化的搬送輥子8，可使以上下等方式形 成之成對搬送輥子8之一方設爲可轉動地安裝於該軸；r的自 由輥子22,而使另一搬送輥子8設爲固定安裝於該軸J且介 由驅動齒輪19連接於驅動機構而被驅動的固定輥子21。 亦即，可將搬送輥子8之一設爲自由輥子22，而將另一 方設爲驅動用的固定輥子2 1。又，在自由輥子22中，相對 軸J的外徑，將外嵌的軸孔內徑尺寸設定爲略大一點。 在圖示例中，將上側搬送輥子8設爲自由輥子22，而將 下側搬送輥子8設爲固定輥子2 1。如後述，如此般通過將輥 子的種類設置爲不同，具有可彈性、緩衝及有效作用搬送輥 子8間的吸引力的優點。 搬送輥子8係如上述般被磁化。 《作用等》 本發明之基板材A的搬送裝置6，係如上述說明般所構 成。在此，成爲如下。 (1)該基板材A的搬送裝置6，係使用在撓性印刷配線基 板、其他的電路用基板E的製造步驟中，各種藥液處理步 驟、洗淨步驟、或乾燥步驟等的表面處理步驟中。亦即，使 用在其顯像裝置、蝕刻裝置、剝離裝置、洗淨裝置或乾燥裝 置等的表面處理步驟中（參照第4圖、第5圖、第6圖及第7 圖等）。 該基板材A的搬送裝置6，係與霧式噴嘴4、氣體噴嘴 14或浸漬槽12等一起配設於表面處理裝置5的室7內。 各霧式噴嘴4係對搬送來的基板材A，例如從上下噴射 -24- 1280216 顯像液、蝕刻液、剝離液或洗淨液等的處理液B。氣體噴嘴 1 4係對搬送來的基板材A，例如從上下吹出氣體Η。浸漬槽 1 2內滿載洗淨液等的處理液Β。 (2) 搬送裝置6具備多數的搬送輥子8、20,搬送輥子8、 20係由樹脂所構成，由上下等成對地使用，且藉由夾住基板 材Α進行接觸轉動而沿搬送方向C進行搬送。又，搬送輥子 8、20係使用滾輪（參照第2圖之（1)圖及（2)圖、第4圖及第 7圖之（2)圖等），或直輥（參照第2圖之（3)圖、第5圖、第6 圖及第7圖之（1)圖等）。 搬送輥子8係在上下等成對的相互間埋入磁化爲不同磁 極的磁性體L，其埋入形態可爲各種（參照第1圖之各圖）。 又，可僅僅單獨使用如此般被磁化的搬送輥子8(參照第2圖 之（1)圖），還可混合使用搬送輥子8與通常的搬送輥子20(參 照第2圖之（2)圖及（3)圖）。 又，在對軸；Γ的關係上，上下等成對的至少一方（多數 情況爲下側）的搬送輥子8、20，係由固定、驅動輥子構成， 而另一搬送輥子8、20，則由自由輥子22或固定輥子21構 成（參照第1圖之各圖）。 (3) 在表面處理裝置5的室7內，對由此種搬送裝置6 的搬送輥子8(或20)所搬送來的基板材A實施表面處理。 亦即，在藥液處理步驟、洗淨處理步驟的表面處理裝置 5、即顯像裝置、蝕刻裝置、剝離裝置、洗淨裝置中，從霧 式噴嘴4對基板材A噴射處理液B，以此對基板材A進行藥 液處理、洗淨處理（參照第4圖、第5圖、第6圖等）。 -25- .1280216 * ι 又，作爲洗淨步驟等的表面處理裝置5、即洗淨裝置等， 係將基板材A浸漬於浸漬槽1 2的處理液B的洗淨液中，實 施浸漬處理、洗淨處理等（參照第7圖之（1)圖）。 又，在乾燥處理的表面處理裝置5、即乾燥裝置中，從 氣體噴嘴14噴射氣體Η，用以乾燥處理基板材A(參照第7 圖之（2)圖）。 (4) 但是，a.撓性印刷配線基板材、其他的電路用基板 材A，其極薄化、撓性化的進展顯著，且極薄而使腰變得柔 軟而富有撓性。撓性印刷配線基板材的芯材的聚醯亞胺，尤 其柔軟且容易彎曲。 而且，b·該種極薄且撓性基板材A，在乾燥狀態下容 易帶靜電，同時，當噴射處理液B時被沾濕而帶有附著性· 黏著性。 更且，c·該種極薄且撓性基板材A，容易受到處理液B的 噴射壓及從上側噴射的處理液B的重量等的影響，而容易 因壓力或重量而彎曲。 (5) 在此，在該表面處理裝置5的搬送裝置6中，鑒於 此等a.b.c·，如下述般將搬送輥子8磁化。 亦即，針對搬送裝置6的上下等成對的搬送輥子8，以 相互間成爲不同磁極的方式埋入磁性體L。即、一方被磁化 爲N極，而另一方被磁化爲S極。在此，在如此般被磁化的 上下等成對的搬送輥子8間，基於磁性力而變得作用有吸引 力，於是樹脂製搬送輥子8藉由埋入內部的磁性體L，相互 吸引。 -26- .1280216 又，該磁性力、吸引力的強度，係鑒於夾住基板材A進 行接觸轉動的情況，而設定爲相應於此的力。 例如，藉由供給磁性體L的磁性量的設定，磁性體L的 埋入形態的選擇（例如，整體或局部），磁性體L的徑向埋入 位置的選擇（例如，何種程度接近搬送輥子8的外表面進行 埋入），組合自由輥子22與固定輥子2 1 (使得吸引力彈性、 緩衝及有效地作用於基板材A)，或固定輥子2彼此的組合 (吸引力直接且單方面作用於基板材A)等的選擇設定，以決 定磁性力、吸引力的強度。 % (6)本發明之搬送裝置6中，因爲如此般在搬送輥子8 間作用有磁性力及吸引力，因此搬送輥子8毫無遺漏地夾入 ’ 基板材A進行接觸轉動，而不受限於前述的a、b、c的條件， . 基板材可如期待要求進行穩定搬送。尤其是，當一侧採用自 由輥子22時，可進一步順暢地實現毫無遺漏地夾入而進行 穩定搬送。In the prior art, the surface treatment device 1 of the base material A and the transfer device 2 thereof are shown in Patent Document 1 and Patent Document 2 below. [Patent Document 1] Japanese Patent Publication No. 3479636 (Patent Document 2) Japanese Laid-Open Patent Publication No. H20-00942 No. The transfer device 1 2 of 1 is as follows. <<First question point>> The first base plate A of the circuit is extremely thin and flexible, and the waist portion is soft as described above. Further, b. The base material A of this kind is easily electrostatically charged in a dry state, and is wetted when the treatment liquid B is sprayed to have adhesion and adhesion. Further, c. The base material A of this kind is easily affected by the injection pressure and weight of the treatment liquid B. -6- 1280216 i Here, this a. b. c. There is a problem in that when the processing liquid B is ejected from the mist nozzle 4 while the substrate sheet A is conveyed by the conveying roller 3 of the conveying device 2, various conveying failures D occur, which is a problem. That is, the base sheet A often has a transport failure D (attachment, attachment, entrapment, adsorption, slippage, splitting, wrinkles, bending, bending, creases, waist breaks, snagging, falling, scratches, damage, etc.) Referring to each of the drawings in Fig. 3, in the prior art, it is difficult to achieve stable transportation in such a manner. Therefore, it is urgent to realize smooth transportation. # "Second problem" 2: In the transport device 2, The resin transfer roller 3 is used, but it is easy to cause a precision error. From this point of view, there is a problem in the smooth conveyance of the base material A. That is, the metal roller cannot be applied from the corrosive surface. The surface treatment apparatus 1 which performs the chemical treatment by the acid or alkali treatment liquid B, and the metal roll which can be used for finishing is very expensive, and therefore it is difficult to adopt from the viewpoint of cost, and more, because it is based on a metal roller. In the case of the transfer device 2 of the surface treatment apparatus 1, the corrosion resistance, the cost surface, the weight surface, and the like are used in the past. In the resin transfer roller 3, it is easy to produce a precision error. That is, the resin transfer roller 3 is easily stretched and changed due to the temperature of the processing liquid B, etc., and an error occurs during use, resulting in bending and uneven diameter. Therefore, the unevenness of the rotation, etc., causes the substrate A to be conveyed to easily cause snagging, meandering, crepe, and other transport failures of 1280216. From this point of view, the base material A will often have a transport failure D'. In addition, there is a problem that the problem of the stable transportation becomes difficult. "The third problem" The third base material A is sandwiched between the upper and lower conveying rollers 3 of the conveying device 2 of the surface treatment apparatus 1 and is contacted and conveyed, but the contact is carried out. In view of this, the problem of smooth conveyance is caused. In other words, the conveyance roller 3 is made of resin as described above, but the weight of the upper conveyance roller 3 is insufficient. In the case where the pressurization is insufficient, the base material sheet A which is extremely thin and has a large degree of flexibility is often in contact with the lower conveyance roller 3 in a sufficient manner. For example, when there is a number between the upper and lower conveyance rollers 3 In the case of a gap of a micron unit, the substrate A that is transported is likely to cause slippage, meandering, and other transport failures D. In view of this, there is a problem that the stable transportation of the base material A becomes difficult (especially for reference). (1) and (2) of Fig. 3) When the transport rollers 3 are brought into close contact with each other as a countermeasure, it is easy to cause a transport failure D such as bending (see, in particular, Fig. 3). (3) The present invention is based on the above-described actual situation, and is completed by the inventors' intentional efforts in order to solve the above-described problems of the prior art. The transfer roller which is formed by the upper and lower sides of the transfer device of the surface treatment apparatus is characterized by a magnetic body in which different magnetic poles are buried. Further, in combination with this group 1280216, a transfer roller is provided as a free roller, or is mixed with a general transfer roller, and is characterized in that a magnetic body is buried all around or partially. Accordingly, an object of the present invention is to provide a base material conveying apparatus, which is capable of smooth and stable conveyance of a base material which is extremely thin and flexible, and which is capable of coping with a precision error of a resin conveying roller. According to this, stable transfer can be achieved. Thirdly, the contact pressure between the transfer rollers can be sufficiently ensured, and stable transfer can be achieved accordingly. (Means for Solving the Problems) "Scope of Patent Application" The technical means of the present invention for solving such problems are as follows. First, the first item of the patent application scope is as follows. The transfer device for a substrate according to the first aspect of the invention is a transfer device for a surface treatment apparatus for performing surface treatment while transferring a substrate in a manufacturing step of a circuit board, and is characterized in that: A transfer roller that is used in pairs and that sandwiches a base material and is transported by contact rotation while magnetizing the pair into different magnetic poles. The second item of the patent application scope is as follows. The substrate _ material conveying device of the second aspect of the patent application is in the first item of the patent application, characterized in that the conveying roller is made of a resin and is embedded in the resin so as to be paired with each other. Magnetic bodies that are magnetized to different magnetic poles. The third item of the patent application scope is as follows. The transfer device for a base material according to the third aspect of the patent application is the second item of the patent application, characterized in that a pair of transfer rollers, which are formed by a pair of upper and lower portions, are free rollers that are rotatably attached to the shaft. The other conveying roller that constitutes a pair is fixedly mounted -9-. 1280216 is composed of a fixed roller that is driven by the shaft. The fourth item of the patent application scope is as follows. The transfer device for the base material of the fourth aspect of the patent application is the second item of the patent application, characterized in that the transfer roller is fixedly attached to the shaft by a pair of the above-mentioned lower modes. The fixed roller is composed of. The fifth item of the patent application scope is as follows. The conveying device for the base material of the fifth aspect of the patent application is in the third or fourth aspect of the patent application, characterized in that: a pair of conveying rollers which are magnetized in a regular mixed configuration so as to be embedded in the magnetic body And a pair of transport rollers that are not embedded in the magnetic body and are not magnetized. The sixth item of the patent application scope is as follows. The transfer device of the substrate material of claim 6 is in the third or fourth aspect of the patent application, characterized in that the transfer roller continuously embeds the magnetic body around the circumference thereof around the circumference. Article 7 of the scope of patent application is as follows. The transfer device of the substrate of claim 7 is in the third or fourth aspect of the patent application, characterized in that the transfer roller is spaced around its circumference to partially embed the magnetic body. Article 8 of the scope of application for patents is as follows. The substrate transfer device according to claim 8 is the third or fourth aspect of the patent application, characterized in that: the surface treatment device is a thin and flexible substrate plate conveyed by the transfer roller. A treatment liquid such as a developing solution, an etching solution, a peeling liquid, or a cleaning liquid is sprayed from the mist nozzle 4 to perform surface treatment. Article 9 of the scope of patent application is as follows. The transfer device for the base material of claim 9 is in the third or fourth aspect of the patent application, characterized in that: the surface treatment device is extremely thin and flexible - 10 carried by the transfer roller - 1280216 Base plate, which is blown out of the gas nozzle for drying. The scope of the patent application is as follows. The transfer device for a base material according to the first aspect of the invention is the third or fourth aspect of the patent application, wherein the surface treatment device is configured to dispose the transfer roller in the treatment liquid of the immersion tank, The extremely thin and flexible base material conveyed by the treatment liquid immersion treatment. (Features of the Invention) The present invention relates to a transfer device for a base material according to the present invention, wherein the transfer roller that is formed by the upper and lower sides of the transfer device of the surface treatment device is a magnetic body in which different magnetic poles are embedded. feature. Further, in combination with this, a conveyance roller is provided as a free roller, or is disposed in a mixed manner with a general conveyance roller, and is characterized in that a magnetic body is buried all around or partially. Here, the substrate transfer device of the present invention exerts the following effects. "First effect" First, the conveyance failure is canceled in the surface treatment apparatus, and smooth and stable conveyance of the base material which is extremely thin and flexible is realized. In other words, in the substrate transfer apparatus of the present invention, the magnetic body of the different magnetic poles embedded therein exerts an attractive force between the transport rollers which form the pair of the upper and lower sides, thereby engaging the base plate without any omission. Rotate to achieve stable transfer of the base material. That is, although the base plate has a. It is extremely thin and flexible; b · With adhesion and adhesion; and c · It is also susceptible to the influence of the treatment liquid, but it can be transported without any trouble. It can surely eliminate the adhesion, entrainment, entrapment, adsorption, slippage, splitting, wrinkles, bending, bending, creases, -11-1280216 waist break, squatting, falling of the base material referred to in the above previous examples. Transportation failure such as scratches, damages, etc. "Second effect" Second, the accuracy error of the resin transfer roller can be matched, and stable transfer can be achieved. In the transfer apparatus of the base material of the present invention, the magnetic force of the different magnetic poles embedded therein exerts an attractive force between the transport rollers that form the right and the right, and the resin conveyance rollers are bent and uneven in diameter. , uneven rotation, etc., can still be absorbed by attraction. Here, in the surface treatment apparatus, it is possible to reliably prevent the squeaking, meandering, wrinkles, and the like caused by the precision error of the resin conveying roller as referred to in the above-described prior art for the base material sheet which is extremely thin and flexible. The failure occurred, and a stable transfer can be achieved accordingly. "Third effect" Third, the contact pressure between the transfer rollers can be sufficiently ensured, and stable transfer can be achieved. In other words, in the substrate transfer apparatus of the present invention, since the magnetic bodies of the different magnetic poles embedded therein exert an attractive force between the pair of transport rollers, the transport rollers can sufficiently ensure the required contact pressure. The base plate is clamped for contact rotation. In this way, in the surface treatment apparatus, the base material sheet which is extremely thin and flexible can be surely prevented from being insufficiently caused by the contact pressure in the above-mentioned prior examples. The slippage, snakes and other faults are generated, and a stable transfer can be achieved. -12- 1280216 As described above, the problems existing in the prior art can be completely solved, and the effects exerted by the present invention are remarkable. [Embodiment] [Related from the drawings] Hereinafter, a substrate transfer device of the present invention will be described in detail based on a preferred embodiment of the invention. Fig. 1 shows a form of embedding of a magnetic body of a conveying roller of the embodiment. (1) is a front cross-sectional explanatory view of the first example, (2) is a front cross-sectional explanatory view of the second example, (3) is a front cross-sectional explanatory view of the third example, and (4) is a 4 is a cross-sectional explanatory view, (5) is a cross-sectional explanatory view of a fifth example, and (6) is a side cross-sectional explanatory view of a sixth example. Fig. 2 is a cross-sectional explanatory view showing the arrangement of the conveying rollers of the embodiment. Among them, (1) shows the first example, (2) shows the second example, and (3) shows the third example. Fig. 4, Fig. 5, Fig. 6, and Fig. 7 show examples of the surface treatment apparatus. Here, Fig. 4 shows an example in which the transfer roller is composed of a roller, and is a front explanatory view of the main part. Fig. 5 and Fig. 6 show an example in which a conveying roller is composed of a straight roller, Fig. 5 is an overall front explanatory view, and Fig. 6 is an overall side explanatory view. Fig. 7 (1) shows an example in which the conveying roller is composed of a dipping type and a straight roller, and is an overall front explanatory view. Fig. 7 (2) shows an example in which the conveying roller is composed of a dry type and a roller is composed of a roller, and is an overall front explanatory view. Fig. 8 is a schematic plan view showing the substrate (base plate). <<Related Substrate E>> 1280216 The transport apparatus 6 of the surface treatment apparatus 5 of the base material A is used in the manufacturing process of the substrate E for the circuit F. Here, first, the general configuration of the substrate E will be described with reference to Fig. 8. The substrate E for the circuit F is used for electrical connection in AV equipment, computers, mobile phones, digital cameras, and other electronic devices, and forms a circuit F pattern for connecting components on the outer surface and inside of the insulating layer. . The substrate E for such a circuit F has various substrates such as a single-sided substrate, a double-sided substrate, and a multilayer substrate (manufactured by the recent deposition method), and can be classified into a hard material and a film-like flexible system. . As a part of such a substrate E, a module substrate (semiconductor-integrated package substrate) in which a semiconductor component such as a 1C, an LSI device, a passive component, a driving component, and a capacitor is incorporated into a circuit F, and a glass are also present. A glass substrate in which a substrate F is embedded with a semiconductor component, that is, a glass substrate for a plasma display PDP, a glass substrate for a liquid crystal LCD, a CSP, a PBGA, or the like. Of course, the substrate E in the present specification means that a substrate of the above type is widely included in addition to the conventional printed wiring board. The substrate E for the circuit F is highly accurate, compact, and lightweight, and is also highly accurate, compact, extremely thin, flexible, multi-layered, and diverse. In addition, the circuit F formed on the outer surface (the upper surface, the lower surface, the back surface, and the back surface) and the circuit F formed on the inner surface are more particularly denser and finer. The substrate E, such as a printed wiring board, has a vertical and horizontal cutting size of one sheet at the time of manufacture, and is composed of 50,000 m X 5 0 0 m η. The thickness of the insulating layer (core material) is the same as that of the previous one. 6mm to 1. 0 mm to 60 μm, or even -14- 1280216 1 The current 50μπι~ΙΟμιη is extremely thin. The thickness of the portion F (copper foil portion) of the circuit is also extremely thinned from 75 μm to 35 μm, and even before and after 16 μm to ΙΟμηη. In the case of a multilayer substrate, the overall thickness is 1. 0 mm~0. The 4mm level is constantly being thinned. The width of the circuit F and the space between the circuits F tend to be finer from 30 μm to 15 μm to the ΙΟμηη. The substrate Ε is formed substantially as such. <<Example of Manufacturing Method of Substrate Tanning>> Next, a surface treatment apparatus 5 for the base sheet and a method of manufacturing the substrate E using the conveying apparatus 6 will be described with reference to FIG. First, the manufacturing method of the first example will be described. In the manufacturing method of the first example, the substrate E and the printed wiring board are produced in the following steps. First, a copper clad laminate is formed by laminating a copper foil on the outer surface of a film-like resin insulating layer (core material) made of a glass fiber material, a ceramic or a polyimide, or the like by thermocompression bonding or the like. Base plate A. Then, the surface of the prepared base material A is subjected to roughening surface roughening treatment (soft uranium engraving), and then cut into pieces of a workpiece size having a short size. The surface roughening treatment is carried out by mechanical honing, but more recently it has been carried out by spraying the treatment liquid B. In most cases, the hole processing for the through hole is performed using a laser or the like. The through hole is formed by a fine through hole between the outer surfaces of the base plate A (substrate E), and a plurality of holes having a very small diameter are formed on one piece, and the hole diameter thereof is mostly 0. 5mm~0. Less than 2mm. The through hole is used for the interlayer conduction connection between the circuits F (copper foil) on the two outer surfaces and the circuit F (copper foil) on the multilayer substrate. 1280216 and installation of semiconductor components mounted on circuit F. In addition, recently, a through hole which is required to perform hole processing has been developed, and a bump having a small protrusion shape and a substantially truncated cone shape is formed, and the same function as the through hole can be realized by the bump for the multilayer substrate or the like. Technology. Further, the bumps are produced by the developing step, the etching step, and the stripping step in accordance with the circuit F. Then, on the outer surface (the upper surface, the front surface, the lower surface, and the back surface of the copper foil) of the base material A, a photosensitive photoresist is applied or bonded in a film form. Then, by exposing the negative film of the circuit F, that is, the circuit F of the preset circuit F, the photoresist of the outer surface is exposed to leave the hardened circuit F forming portion, and the other unnecessary portions are sprayed. The developing solution belonging to the treatment liquid B is dissolved and removed. Then, the copper foil of the base material A is left with the portion of the circuit F covered by the photoresist hardening, and the unnecessary portion exposed by the photo-dissolution and removal of the photoresist is sprayed by the etching liquid belonging to the treatment liquid B ( The copper dichloride, the iron dichloride and other corrosive liquids are dissolved and etched away. Then, the photoresist of the portion of the remaining circuit F is removed by the stripping liquid of the processing liquid B, and the copper foil of the remaining portion of the circuit F forms a circuit F for designating a conductor pattern on the outer surface of the substrate A. Further, in the above-described developing step, etching step, and peeling step, a cleaning step for each post-treatment or post-treatment after the stripping step is attached, which is sprayed as a washing liquid for the treatment liquid B. Liquid, neutralizer solution and other cleaning solutions. In this cleaning step, the treatment liquid B adhering to the outer surface of the base material A (including the inside of the through hole, etc.), the etching liquid 'peeling' liquid, or the like is washed and removed. -16- . 1230216 Moreover, after such a washing step, a drying step is attached. In other words, since the water washing liquid belonging to the treatment liquid B, the other washing liquid, and the like are adhered to the outer surface (including the inside of the through hole or the like) of the base material A washed by the washing step, in order to prevent This should be removed by oxidation or the like, and dried immediately after the drying step. Further, such a drying step is divided into two stages of removal of adhesion suction and warm air drying. The manufacturing method of the first example is constituted by such a wet processing method. The manufacturing method of the first example is as described above. Next, the manufacturing method of the second example will be described. In the method of manufacturing the substrate E and the printed wiring board, the wet processing method of the first example described above is a representative method, but the half-adding method of the second example is often used. In the semi-additive method, first, electroless copper is plated on the outer surface of the base material A on which the through holes are formed in advance. - Then, after coating or bonding the photosensitive photoresist on the electroless copper plating, the circuit F of the film of the circuit F is exposed. Then, the photoresist is exposed to leave a hardened portion, and the other portion, that is, the portion formed by the circuit F, is dissolved and removed by spraying the developing solution of the treatment liquid B. Then, a portion F of the circuit F, i.e., a portion of the plating pattern which is removed by photodissolution removal, i.e., a portion exposed by electroless copper plating, is subjected to electrolytic copper plating to form a circuit F. - In addition, when the residual hardened circuit F forms a photoresist other than the portion, the stripping liquid which is sprayed into the processing liquid B is peeled off, and the exposed electroless copper plating is performed by spraying the etching liquid of the processing liquid B Quickly etch and melt to remove. - Further, in accordance with the above, a cleaning step and a drying step using the cleaning liquid as the treatment liquid B are used as the rear portion of each step -17-1280216. In the half-addition method of the second example, the circuit F is formed by electrolytic copper plating as described above, whereby the substrate E is produced. The manufacturing method of the second example is as described above. However, the manufacturing method of the printed wiring board and the other substrate F for the circuit F has recently become more diverse, and various methods have been developed and used in addition to the first and second examples described above. The present invention is of course applicable to the manufacturing methods of these various substrates E. The method of manufacturing the substrate E is as described above. <<Surface Treatment Apparatus 5>> First, the surface treatment apparatus 5 using the transfer apparatus 6 of the base material A of the present invention will be described with reference to Figs. 4, 5, 6, and 7. This surface treatment device 5 is used in the manufacturing process of the substrate E, and performs surface treatment while conveying the substrate A. First, the surface treatment apparatus 5 shown in FIG. 4, FIG. 5, and FIG. 6 is used as a developing device in a developing step, an etching step, a peeling step, a washing step, and the like of the manufacturing process of the substrate E. An etching device, a peeling device, a cleaning device, and the like are used. In this manner, the substrate B that has been transported is sprayed with the treatment liquid B such as a developing solution, an etching solution, a peeling liquid, or a cleaning liquid, and the base material A is subjected to a surface treatment such as a chemical liquid treatment or a washing treatment. Then, the surface treatment apparatus 5 of the fourth, fifth, and sixth drawings is provided in the chamber 7 of the processing chamber, and the transport device 6 and the jet processing liquid B that transport the base material A are transported. The mist nozzle 4 of the base plate A. The mist nozzle 4 is disposed at a position opposite to the substrate 1 to be conveyed, and is used to spray -18-1280216 to process the liquid B such as a developing solution, a stagnation liquid, a peeling liquid, or a cleaning liquid. The mist nozzles 4 of the example are disposed above and below the base material A conveyed in a horizontal posture by the conveyance rollers 8 of the conveyance device 6 at intervals, and are disposed to face the conveyance rollers 8 Space between the spaces. The mist nozzles 4 of the illustrated example are arranged at intervals of a predetermined pitch in the transport direction C between the front and rear directions and the width direction G in the left and right directions, and are arranged one above the other with the base material A interposed therebetween. Here, the treatment liquid B is pumped from the liquid tank 9 to the respective mist nozzles 4 via the pump 10 and the pipe 11, and is sprayed on the base material A. Then, after flowing to the outer surface of the base material A in the left or right direction in the width direction G, the surface is treated, and then flows down from the left and right sides of the base material A, and is again recovered to the liquid tank 9, and thereafter recycled. In the surface treatment apparatus 5 shown in Fig. 7 (1), the conveying roller 8 of the conveying device 6 is disposed in the processing liquid B of the immersion tank 12, and the base material A conveyed by the treatment liquid B is immersed. . That is, the surface treatment apparatus 5 of the figure (1) of Fig. 7 is used, for example, as a cleaning device for the cleaning step, and the immersion tank 12 is provided in the upper portion of the chamber 7, and the immersion tank 12 is filled with the genus treatment. In the cleaning liquid of the liquid B, the conveying roller 8 of the conveying device 6 is disposed in the processing liquid B. Thereby, the base material sheet A is horizontally conveyed into the immersion tank 12 in the conveyance direction C and the example of the figure, and the outer surface (including the inside of a through-hole, etc.) is immersed by the washing liquid of the process liquid B. , washing treatment, surface treatment. Further, the cleaning liquid belonging to the treatment liquid B is circulated between the immersion tank 12 in the upper portion of the chamber 7 and the liquid tank 9 in the lower portion via the pipe 1 1 and the pump 10. In the figure, the component symbol 13 is a cleaning brush. In the surface treatment apparatus 5 shown in Fig. 7 (2), the gas enthalpy is blown from the base material A conveyed by the conveying roller 8 of the conveying device 6 from the gas nozzle 14, and is dried. That is, the surface treatment apparatus 5 of the Fig. 7 (2) is a drying apparatus as a drying step, and a drying chamber 15 is provided in the upper portion of the chamber 7, and a conveying device is disposed in the drying chamber 15. 6 conveying roller 8. At the same time, in the drying chamber 15, in the upper and lower sides of the substrate sheet which is horizontally conveyed in the example of the drawing, the gas nozzle 1 is disposed in the space formed between the transport rollers 8 with the partition therebetween. 4. Then, a gas enthalpy such as a dry gas or a warm air gas is supplied to the gas nozzle 14 from the air blower 17 disposed in the lower portion of the chamber 7 by the warm air generator 16 in the illustrated example. The component symbol 18 in the figure is the motor of the blower 17. Thereby, the base sheet is conveyed to the drying chamber 15 in the conveyance direction C and horizontally, and is attached to the treatment liquid B of the outer surface (including the through hole or the like), such as a washing liquid or the like. The cleaning liquid is subjected to a removal treatment, a drying treatment, and a surface treatment via a gas crucible blown from the gas nozzle 14. The surface treatment apparatus 5 is configured as described above. <<Transporting Device 6>> Next, the conveying device 6 of the surface treatment device 5 will be described with reference to Figs. 4, 5, 6, and 7. First, the transfer device 6 for the substrate sheet is used in the chamber 7 of the surface treatment device 5 of the base material A in the manufacturing step of the substrate substrate, and a plurality of transfer rollers 8 are provided. The conveying rollers 8 are used in pairs, such as up and down, and are moved in contact with each other -20-1280216, and are sandwiched by the base material A and conveyed by contact rotation. In the case of the transporting of the base material A, the horizontal transporter is represented by the horizontal transporter. However, from the viewpoint of preventing the liquid accumulation of the treatment liquid B, etc., it is also possible to consider the oblique transport and the longitudinal transport. In other words, in the example of the drawing, the conveying roller 8 of the conveying device 6 of the surface treatment device 5 has the axis J disposed horizontally in the left-right width direction G. However, oblique conveyance and vertical conveyance may be considered. In addition to the horizontal conveyance of the horizontal posture, the base sheet A has a case of oblique conveyance from a horizontally inclined posture or vertical conveyance in a vertical posture. Of course, in the case of the oblique conveyance and the longitudinal conveyance, the mist nozzle 4 and the gas nozzle 14 are also disposed in an inclined posture or a left-right direction from the upper and lower faces with respect to the base sheet A. In the conveyance roller 8 of the example, the axis J is oriented in the left-right width direction G, and most of the conveyance rollers 8 are disposed in the front and rear conveyance directions, and the conveyance device 6 includes a group of eight upper conveyance rollers 8 and a horizontal lower conveyance roller. The base sheet A that is pressed against the transfer target, and the lower transfer roller 8 in the illustrated example are rotationally driven by a drive mechanism that is connected to a motor or the like via a drive gear 19, whereby the base material A is in the chamber 7. It is conveyed horizontally from the upstream side to the downstream side along the conveyance direction C. Moreover, such a conveyance roller 8 uses a roller or a straight roller. In other words, in the conveying device 6 of the surface treatment apparatus 5 shown in Fig. 4 and Fig. 7 (2), the conveying roller 8 is a roller (see Fig. 2 (1) and (2)). The opposite axis J is formed in a short column shape, and a plurality of wheel-shaped rollers are mounted at intervals of a predetermined pitch. -twenty one- . 1280216 In contrast, in the conveying device 6 of the surface treatment apparatus 5 shown in Fig. 5, Fig. 6, and Fig. 7 (1), the conveying roller 8 is a straight roller (refer to Fig. 2 (3). Figure), mounted with a pair of shafts: a straight roller that is formed into a long cylindrical shape. The conveying device 6 is configured as described above. <<Magnetization of the conveying roller 8>> Next, the magnetization of the conveying roller 8 of the conveying device 6 will be described in detail with reference to Fig. 1 and Fig. 2 and the like. The pair of transport rollers 8 such as the upper and lower sides of the transport device 6 are magnetized to different magnetic poles in pairs. The transfer roller 8 is made of a resin K, and a magnetic body L magnetized to a different magnetic pole between the upper and lower sides is embedded in the resin K. The magnetization of such a transfer roller 8 will be described in further detail below. That is, the transport roller 8 is preliminarily magnetized by the embedding of the magnetic body L, and one of the upper and lower pairs is magnetized to the N pole and the other is magnetized to the S pole. The embedded magnetic body L is made of ferrite iron, other iron, nickel, cobalt, or other metals, and is used in a strip shape, a wire shape, a small piece shape, a powder form, or the like. The embedded form of the magnetic body L can be various. First, as shown in Fig. 1 (1), (5), Fig. 2 (1), etc., it is considered that the magnetic body L is continuously buried in the transport roller 8 along the circumference of the entire circumference. In this case, a magnetic body L such as a belt shape, a ring shape, or a cylindrical shape is used. Next, as shown in Fig. 1 (2) and (3), etc., it is considered that the magnetic body L is partially buried in the transfer roller 8 at a small interval and discontinuously. As one of the loops of -22-1280216, as shown in Fig. 1 (6), it is considered that the small space is buried in the direction of the axis J. In these cases, a small-sized, powdery magnetic body L is used. Further, in these examples, the magnetic material L is embedded coaxially with the axis J of the transport roller 8, but the present invention is not limited thereto, and as shown in Fig. 1 (4), it may be considered to be spiral in the direction of the axis J. The line is buried in a shape. Further, it is conceivable that the powdery magnetic body L is uniformly embedded in the entire resin K of the conveying roller 8. Moreover, it can be buried in various other forms. In the same manner, the pair of transport rollers 8 that are magnetized in the upper and lower layers, and the pair of transport rollers 20 that are not embedded in the magnetic body L and are not magnetized, may be arranged in a regular manner. In other words, as shown in Fig. 2 (1), in the conveying device 6 of the surface treatment apparatus 5, only the conveying roller 8 in which the magnetic body L is embedded may be used, but for example, as shown in Fig. 2 ( 2) As shown in the figure and (3), the pair of conveying rollers 8 in which the magnetic body L is embedded and the normal pair of conveying rollers 20 in which the magnetic body L is not embedded may be arranged in a regular manner. In the example of Fig. 2 (2), in the example in which the roller is used, the transfer roller 8 in which the magnetic body L is embedded is disposed in the width direction G via the two normal transfer rollers 20 in Fig. 2 (3) In the figure, in the case of using a straight roller, the buried magnetic body is staggered along the transport direction C. The conveying roller 8 of L and the normal conveying roller. Further, as shown in Fig. 1(5), the transport roller 8 thus magnetized can be fixedly attached to the shaft J with respect to the pair of transport rollers. That is, the transfer rollers 8 may be all set as the fixed rollers 2 1, and either one of them may be connected to the drive mechanism via the drive gears 19. On the other hand, as shown in FIG. 1 (1), (2), (3), (4), (6) -23 - 1280216, etc., the magnetized transport roller 8 can be used. One of the pair of conveying rollers 8 formed in the above-described lower mode is rotatably attached to the shaft; r of the free roller 22, and the other conveying roller 8 is fixedly mounted to the shaft J and is driven by the driving gear 19 is a fixed roller 21 that is driven by a drive mechanism. That is, one of the transport rollers 8 can be set as the free roller 22, and the other can be used as the fixed roller 21 for driving. Further, in the free roller 22, the inner diameter of the outer shaft hole is set to be slightly larger than the outer diameter of the shaft J. In the illustrated example, the upper conveying roller 8 is the free roller 22, and the lower conveying roller 8 is the fixed roller 21. As will be described later, by setting the types of the rollers to be different, there is an advantage that the attraction force between the rollers 8 can be elasticized, cushioned, and effectively acted upon. The conveying roller 8 is magnetized as described above. <<Operation and the like>> The conveying device 6 of the base material A of the present invention is constructed as described above. Here, it becomes as follows. (1) The substrate 6 of the substrate A is used in the steps of manufacturing the flexible printed wiring board and the other circuit board E, and various surface treatment steps such as a chemical processing step, a washing step, or a drying step are used. in. That is, it is used in a surface treatment step such as a developing device, an etching device, a peeling device, a cleaning device, or a drying device (see Figs. 4, 5, 6, and 7, etc.). The transfer device 6 of the base material sheet A is disposed in the chamber 7 of the surface treatment apparatus 5 together with the mist nozzle 4, the gas nozzle 14, or the dipping tank 12. Each of the mist nozzles 4 is a processing liquid B such as a developing liquid, an etching liquid, a peeling liquid, or a cleaning liquid which is ejected from the upper and lower sides of the base material A to be transported, for example, from above to below. The gas nozzles 14 are for example, for the base material A to be conveyed, for example, gas enthalpy is blown from above and below. The immersion tank 1 2 is filled with a treatment liquid such as a cleaning liquid. (2) The conveying device 6 includes a plurality of conveying rollers 8 and 20, and the conveying rollers 8 and 20 are made of resin, and are used in pairs up and down, and are moved in the conveying direction C by sandwiching the substrate sheet. Carry out the transfer. Moreover, the conveyance rollers 8 and 20 use a roller (refer to FIG. 2 (1), (2), FIG. 4, and FIG. 7 (2), or a straight roller (refer to FIG. 2). (3) Figure, Figure 5, Figure 6 and Figure 7 (1), etc.). The transport roller 8 is formed by embedding magnetic bodies L magnetized into different magnetic poles in pairs between the upper and lower sides, and the embedding form can be various (see the respective drawings in Fig. 1). Further, the transfer roller 8 thus magnetized can be used alone (see Fig. 2 (1)), and the transfer roller 8 and the normal transfer roller 20 can be used in combination (see Fig. 2 (2) and (3) Figure). Further, in the relationship between the shaft and the cymbal, at least one of the upper and lower pairs (the lower side) of the transport rollers 8 and 20 is fixed and driven by the roller, and the other transport rollers 8 and 20 are It consists of the free roller 22 or the fixed roller 21 (refer to each figure of FIG. 1). (3) The base material A conveyed by the conveying roller 8 (or 20) of the conveying apparatus 6 is subjected to surface treatment in the chamber 7 of the surface treatment apparatus 5. In other words, in the surface treatment apparatus 5 of the chemical processing step and the cleaning processing step, that is, the developing device, the etching device, the peeling device, and the cleaning device, the processing liquid B is sprayed from the mist nozzle 4 to the base material A to This base material A is subjected to a chemical liquid treatment and a washing treatment (see Fig. 4, Fig. 5, Fig. 6, etc.). -25- . 1280216 * ι, the surface treatment device 5, that is, the cleaning device, etc., is immersed in the cleaning liquid of the treatment liquid B in the immersion tank 12, and is subjected to immersion treatment and washing treatment. Etc. (Refer to Figure (1) of Figure 7). Further, in the surface treatment apparatus 5 for drying, that is, the drying apparatus, a gas crucible is ejected from the gas nozzle 14 to dry the processing substrate A (see Fig. 7 (2)). (4) However, a. The flexible printed wiring board and other circuit board materials A are extremely thin and flexible, and are extremely thin, and the waist is soft and flexible. The polyimide of the core material of the flexible printed wiring base sheet is particularly soft and easily bent. Further, b. This extremely thin and flexible base material A is easily electrostatically charged in a dry state, and is wetted with the adhesion and adhesion when the treatment liquid B is sprayed. Further, c. The extremely thin and flexible base material A is easily affected by the pressure of the injection pressure of the treatment liquid B and the weight of the treatment liquid B sprayed from the upper side, and is easily bent by pressure or weight. (5) Here, in the conveying device 6 of the surface treatment apparatus 5, in view of this a. b. c. The transfer roller 8 is magnetized as follows. In other words, the transport rollers 8 that are paired with the upper and lower sides of the transport device 6 are embedded with the magnetic body L so as to have different magnetic poles. That is, one of the magnets is magnetized to the N pole and the other is magnetized to the S pole. Here, the attraction force is applied between the pair of transport rollers 8 which are magnetized in the upper and lower directions, and the resin transfer roller 8 is attracted to each other by the magnetic body L embedded therein. -26- . 1280216 Further, the strength of the magnetic force and the attraction force is set to a force corresponding thereto in view of the contact rotation of the base material A. For example, by setting the amount of magnetic material supplied to the magnetic material L, the selection of the embedding form of the magnetic material L (for example, overall or partial), the selection of the radial embedding position of the magnetic body L (for example, how close is the transport) The outer surface of the roller 8 is embedded), combining the free roller 22 with the fixed roller 2 1 (so that the attraction is elastic, cushioning and effectively acting on the base plate A), or the combination of the fixed rollers 2 (attractively direct and unilateral Acting on the selection of the base material A) or the like to determine the strength of the magnetic force and the attractive force. (6) In the conveying device 6 of the present invention, since the magnetic force and the suction force act between the conveying rollers 8, the conveying roller 8 is inadvertently sandwiched by the 'base material A for contact rotation, and is not limited. In the aforementioned conditions of a, b, c, The base plate can be stably transported as expected. In particular, when the free roller 22 is used on one side, it is possible to smoothly carry out the stable transfer without any omission.
亦即，雖爲極薄、富有撓性且帶有附著性·黏著性的基 板材A，但不會受到處理液B的噴射壓力、重量及加壓力 的作用，藉此，無完全貼合附著於或捲附於搬送輥子8的情 況，而無從搬送輥子8間落下的情況，可穩定搬送。 根據採用該搬送裝置6的表面處理裝置5,基板材A(還 包含外表面的電路形成用銅箔及光阻）可在附著、捲附、捲 入、吸附、滑移、掀開、皺紋、彎曲、折曲、摺痕、腰斷、 絆住、落下、擦傷、損傷等的各種搬送故障D(參照第3圖） 即將發生前予以阻止而防患於未然，進行穩定的搬送。 -27- .1280216 (7) 又，該搬送裝置6的搬送輥子8係由樹脂構成’其 因爲起因於高溫處理液B的溫度等而易伸縮變化等、而容易 因使用產生精度誤差，但藉由作用在搬送輥子8間的磁性 力、吸引力，精度誤差將被吸收。於是，起因於精度誤差的 彎曲、直徑不勻、旋轉不勻等，可由吸引力來吸收。尤其是 若在一方側採用自由輥子22，則可進一步順暢地吸收。In other words, the base material sheet A which is extremely thin and flexible and has adhesiveness and adhesion is not affected by the injection pressure, weight, and pressure of the treatment liquid B, and thus, there is no complete adhesion. When it is attached to the conveyance roller 8, and it does not fall from the conveyance roller 8, it can carry out stably. According to the surface treatment apparatus 5 using the conveyance device 6, the base material sheet A (including the copper foil for circuit formation and the photoresist on the outer surface) can be attached, wound, entangled, adsorbed, slipped, split, wrinkled, Various transport failures D (see Fig. 3), such as bending, bending, creases, snagging, snagging, snagging, smashing, smashing, smashing, smashing, smashing, damage, etc. -27-.1280216 (7) In addition, the conveyance roller 8 of the conveyance device 6 is made of a resin, and it is easy to expand and contract due to the temperature of the high-temperature treatment liquid B or the like, and it is easy to cause an accuracy error due to use. The magnetic force and the suction force acting between the conveying rollers 8 are absorbed, and the accuracy error is absorbed. Therefore, the bending due to the precision error, the unevenness of the diameter, the unevenness of the rotation, and the like can be absorbed by the attraction force. In particular, if the free roller 22 is used on one side, it can be absorbed more smoothly.
藉此，根據採用該搬送裝置6的表面處理裝置5 ’雖爲 極薄化、撓性化明顯的基板材A，但仍可防止起因於精度誤 差的絆住、蛇行、皺紋及其他的故障產生，從此方面看，基 板材A能達成穩定搬送。According to this, the surface treatment apparatus 5' using the conveying apparatus 6 is extremely thin and flexible, and the base material A which is extremely thin and flexible is prevented, but it is possible to prevent the occurrence of snagging, meandering, wrinkles, and other malfunctions due to the accuracy error. From this point of view, the base sheet A can achieve stable transfer.
(8) 更且，藉由作用於搬送輥子8間的磁性力、吸引力， 上下等形成對的搬送輥子8，可邊充分確保需要的接觸壓 力，邊夾住基板材A進行接觸轉動。即，即使爲使用重量輕 的樹脂製搬送輥子8，且一方側由自由輥子22所構成的情 況，更且、所夾入且搬送的基板材雖爲極薄化、撓性化明顯 的基板材，但仍可提高搬送輥子8間的接觸度。搬送輥子8 間不會產生如數微米單位的間隙，可藉由磁性力、吸引力經 常確實進行接觸。 藉此，根據採用該搬送裝置6的表面處理裝置5，.搬送 對象雖爲極薄化、撓性化明顯的基板材A，但仍可防止起因 於接觸度不足的滑移、蛇行、皺紋及其他的故障產生，從此 方面看，基板材A能達成穩定搬送。 【圖式簡單說明】 第1圖爲針對本發明之基板材的搬送裝置，用以說明發 -28- .1280216 明之較佳實施形態，顯示實施例之搬送輥子的磁性體的埋入 形態。其中，（1)圖爲第1例的正剖面說明圖，（2)圖爲第2 例的正剖面說明圖，（3)圖爲第3例的正剖面說明圖，（4)圖 爲第4例的正剖面說明圖，（5)圖爲第5例的正剖面說明圖， (6)圖爲第6例的側剖面說明圖。 第2圖爲用以說明同發明之較佳實施形態，針對實施例 之搬送輥子，顯示其配設形態的平剖面說明圖。其中，（1) 圖顯示第1例，（2)圖顯示第2例，（3)圖顯示第3例。 第3圖爲供該種先前例說明用的正面說明圖，其中，（1) 圖顯示其一例，（2)圖及（3)圖顯示其要部。 第4圖顯示表面處理裝置的例子，爲由滾輪組成搬送輥 子的例子的要部的正面說明圖。 第5圖顯示表面處理裝置的例子，爲由直輥組成搬送輥 子的例子的整體的正面說明圖。 第6圖顯示表面處理裝置的例子，爲由直輥組成搬送輥 子的例子的整體的側面說明圖。 第7圖顯示表面處理裝置的例子，其中，（1)圖顯示由 浸漬型組成的同時、還由直輥組成搬送輥子的例子的整體的 正面說明圖，（2)圖顯示由乾燥型組成的同時、還由滾輪組 成搬送輥子的例子的整體的正面說明圖。 第8圖爲基板（基板材）的模式化的平面說明圖。 【元件符號說明】 1 表面處理裝置（先前例） 2 搬送裝置（先前例） -29- .1280216 3 搬送輥子（先前例） 4 霧式噴嘴 5 表面處理裝置（本發 6 搬送裝置（本發明） 7 室 8 搬送輥子（本發明） 9 液槽 10 泵 11 配管 12 浸漬槽 13 刷子 14 氣體噴嘴 15 乾燥室 16 溫風產生器 17 鼓風機 18 馬達 19 驅動齒輪 20 搬送輥子 21 固定輥子 22 自由輥子 A 基板材 B 處理液 C 搬送方向 D 搬送故障 -30- 1280216 E 基板 F 電路 G 寬度方向 H 氣體 J 軸 K 樹脂 L 磁性體 -3 1(8) Further, by forming the pair of transport rollers 8 by the magnetic force and the suction force acting between the transport rollers 8, the contact pressure can be sufficiently ensured, and the base material A can be sandwiched and rotated. In other words, even if the transfer roller 8 made of a light weight resin is used, and one side is composed of the free roller 22, the base material plate that is sandwiched and conveyed is extremely thin and flexible. However, the contact between the transfer rollers 8 can still be improved. A gap of several micrometers is not generated between the transfer rollers 8, and the contact can be surely made by magnetic force and attractive force. Therefore, according to the surface treatment apparatus 5 using the conveyance device 6, the base material A which is extremely thin and flexible is conveyed, but slippage, meandering, wrinkles, and wrinkles due to insufficient contact can be prevented. Other failures occur, and from this point of view, the base sheet A can achieve stable transportation. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a state in which a magnetic material of a transfer roller of the embodiment is embedded in a preferred embodiment of the present invention. (1) is a front cross-sectional explanatory view of the first example, (2) is a front cross-sectional explanatory view of the second example, (3) is a front cross-sectional explanatory view of the third example, and (4) is a 4 is a cross-sectional explanatory view, (5) is a cross-sectional explanatory view of a fifth example, and (6) is a side cross-sectional explanatory view of a sixth example. Fig. 2 is a plan sectional view showing the arrangement of the conveying roller of the embodiment for explaining the preferred embodiment of the invention. Among them, (1) shows the first example, (2) shows the second example, and (3) shows the third example. Fig. 3 is a front explanatory view for explaining the previous example, wherein (1) shows an example thereof, and (2) and (3) show the main parts. Fig. 4 is a front elevational view showing an example of a surface treatment apparatus, which is an essential part of an example in which a roller is composed of a roller. Fig. 5 is a front elevational view showing an example of a surface treatment apparatus which is an example of a conveyance roller composed of straight rollers. Fig. 6 is a side elevational view showing an example of a surface treatment apparatus which is an example of a conveyance roller composed of straight rollers. Fig. 7 is a view showing an example of a surface treatment apparatus in which (1) shows an overall front view of an example of a transfer roll composed of a dipping type and a straight roll, and (2) shows a dry type. At the same time, an overall front view of an example in which a roller is composed of a roller is also described. Fig. 8 is a schematic plan view showing the substrate (base plate). [Explanation of the component symbols] 1 Surface treatment device (previous example) 2 Transfer device (previous example) -29-.1280216 3 Transfer roller (previous example) 4 Mist nozzle 5 Surface treatment device (this invention 6 transfer device (invention) 7 chamber 8 conveying roller (invention) 9 tank 10 pump 11 piping 12 dipping tank 13 brush 14 gas nozzle 15 drying chamber 16 warm air generator 17 blower 18 motor 19 drive gear 20 conveying roller 21 fixed roller 22 free roller A base Sheet B Treatment liquid C Transportation direction D Transportation failure -30- 1280216 E Substrate F Circuit G Width direction H Gas J axis K Resin L Magnetic body - 3 1