JP2003124611A - Drying device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a drying device which sufficiently and securely dries a printed wiring board material firstly, sufficiently and securely dries, specially, the inner sides of a through hole and a blind via hole secondly, speedily dries them with warm air thirdly, improves operation environment, etc., forthly, evades the sticking of dust, etc., fifthly, and evades rubbing and adsorption accidents sixthly. SOLUTION: This drying device 1 is used in a process of manufacturing a printed wiring board and has a water removing chamber 2 and a warm-air drying chamber 3 in order. The water removing chamber 2 has a suction unit 5 with a slit suction hole 6 and sucks and removes water H sticking on a printed wiring board material D, and the warm-air drying chamber 3 is equipped with a blower 19 with a slit blowout hole 20 and dries the printed wiring board material D by using warm air J. The suction unit 5 is in a shape of a cylindrical pipe and a cylindrical net 13 is put rotatably around its outer circumferential surface.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a drying device. That is, the present invention relates to a drying device that is used in a manufacturing process of a printed wiring board, removes water attached to a printed wiring board material that has been washed and supplied, and dries it.

[0002]

[Technical Background] As electronic devices have become more sophisticated, more functional, smaller and lighter, printed wiring boards have also become more precise, finer, ultra-thin and flexible, and their outer surfaces Significant progress has been made in the densification and miniaturization of circuits formed on the surface. In the manufacturing process of such a printed wiring board, chemicals such as a developing solution, an etching solution, a stripping solution are sequentially sprayed onto the conveyed printed wiring board material,
Chemical treatment is performed. Then, after each chemical liquid treatment, by spraying a washing liquid onto the printed wiring board material after the fact,
The attached chemical solution is washed. A drying device is provided to remove and dry the moisture attached to the printed wiring board material during the cleaning process. That is,
In the manufacturing process of the printed wiring board, the outer surface of the printed wiring board material in the process of manufacturing, and in the through hole between the outer surfaces formed in large numbers with a very small diameter, or in the blind via hole opened only on one outer surface, Since water is attached in a liquid state, a water drop state, or a moisture state as a result of cleaning, the water is removed and dried using a drying device to prevent oxidation.

<< Regarding the Prior Art >> Now, as a drying device of this type, one in which rollers and hot air are sequentially used is
It was typically used. That is, in this type of conventional drying device, while conveying a printed wiring board material to which water has adhered, first, it is passed between sponge-like rollers having water absorption to remove water by pressure bonding, and then dried. In the furnace, hot air of about 50 ° C. to 80 ° C. was blown from a number of circular nozzle-shaped outlets using a heater or a fan to dry the hot air.

[0004]

<Regarding the First Problem> By the way, the following problems have been pointed out in the conventional drying apparatus of this kind. First, it was pointed out that the drying was insufficient and uncertain. That is, in the pressure-bonding removal method of passing between sponge-like rollers, the removal of water adhering to the printed wiring board material is insufficient and uncertain, and furthermore, the hot air is not blown evenly to the printed wiring board material. However, unevenness is likely to occur due to the occurrence of contact areas and non-contact areas, and in the end, the drying tends to be insufficient and uncertain. Since the drying device of this type of conventional example is likely to have insufficient and uncertain drying in this way, the printed wiring board material and the manufactured printed wiring board were formed due to the adhered / residual moisture. There were problems such as circuit oxidization, corrosion, and wire breakage.

<Regarding the Second Problem> Secondly, it has been pointed out that the drying in the through hole and the blind via hole becomes insufficient and uncertain in particular. That is, in the printed wiring board, as the density and the miniaturization of the formed circuit progress, the diameter of the through hole formed between the outer surfaces and the blind via hole opened only on one outer surface is significantly reduced. . The diameter of the through hole is
Many of them are about 0.5 mm to 0.2 mm or less, and many of blind via holes are about 0.1 mm or less. In addition, hundreds or thousands of such through holes and tens of thousands of blind via holes are formed per printed wiring board. Further, a water film is likely to be formed in the vicinity of the openings of the through holes and the blind via holes due to the cleaning process in the previous step.

Therefore, the water adhering to the inside of the through hole or the bracket where a large number of extremely small diameters are present and also has an impeding water film is removed from the attached water by a sponge-like roller as in the conventional drying apparatus of this kind. It is extremely difficult to remove by the crimping removal method. In addition to this, hot air does not reach the through holes and blind via holes.
It was difficult to pass, and after all, the inside of the through hole and the blind via hole were likely to be insufficient and uncertain.
Therefore, according to the above-mentioned place, there has been pointed out the problem that inner wall plating, circuit oxidation, corrosion, disconnection, etc. occur. In addition, through holes and blind via holes are also used for the base insertion / mounting of (thin type) parts, but due to oxidation and corrosion of the inner wall plating, soldering for mounting thin type parts It has been pointed out that problems such as defects and peeling occur.

<Regarding Third Problem> Thirdly, the adverse effect of hot air on the circuit has been a problem. That is, as described above, the blown hot air does not reach the through holes or the blind via holes and does not pass through it.As a countermeasure against this, in the conventional drying apparatus of this type, the hot air is taken over the printed wiring board material over time. It has been performed that the outer surface is sprayed, the entire printed wiring board material is made to absorb heat, and the residual heat is used to gradually dry the through holes and the blind via holes. However, as a result of blowing hot air of about 50 ° C. to 80 ° C. over time, the printed wiring board material thermally expands and contracts, and various adverse effects have been pointed out. For example, it is fatal for a circuit in which the dimensional accuracy of the circuit is incorrect and the position accuracy of the through hole or the blind via hole is incorrect, and the density and miniaturization of the circuit are progressing, and the precision and fineness of the printed wiring board is advancing. It was a problem. In particular, recently, as the insulating base material / insulating layer of the printed wiring board (material), the one with a glass cloth having heat-resistant expansion and contraction tends to be used less frequently. Some point out that defects are likely to occur.

<Regarding Fourth Problem> Fourthly, it has been pointed out that the work environment is deteriorated. That is, in the drying device of this type of conventional example, 50 ° C. in the drying furnace.
Since hot air of ~ 80 ° C is blown, the hot air leaks out through the entrance and exit and other gaps before and after the drying furnace,
The humidity of the outer wall of the drying furnace rises and heat is radiated to the outside. As a result, it was pointed out that the temperature outside the dryer rises and the working environment in the factory deteriorates. In addition, it was pointed out that the air conditioner in the factory is in full operation and is liable to be damaged in capacity in order to solve such a problem.

<Regarding the Fifth Problem> Fifth, it has been pointed out that the dust or the like attached to the sponge roller is reattached. In this type of conventional drying device,
Adhesion removal method is used to remove the moisture adhering to the printed wiring board material by passing it between the sponge-shaped rollers.
It was pointed out that it would reattach to the outer surface of the printed wiring board material. That is, in the manufacturing process of a printed wiring board, first, a copper-clad laminate in which a copper foil is attached to an insulating base material is cut into a work size. As a result, cutting powder, dust, and other dust around the periphery are attached to the peripheral cut surface. Then, such dust or the like is once attached from the peripheral cut surface side of the printed wiring board material to the pressure-bonded sponge-like roller side, and then is forced from the sponge-like roller side to the outer surface of the printed wiring board material, especially to the circuit side. It was pointed out that they would reattach. Adhesion of such dust and the like is caused by a circuit in which density and miniaturization progress,
Further, it has been a serious problem for printed wiring boards, which are becoming more precise and finer.

<< Regarding the Present Invention >> The drying apparatus of the present invention is
In view of such circumstances, the inventors have made earnest research efforts in order to solve the problems of the conventional example.
And, the moisture removal chamber in the previous stage equipped with a suction device with a slit-shaped suction port, and the warm air drying chamber in the subsequent stage equipped with a blower with a slit-shaped outlet were adopted in combination for the first time. Characterize. Therefore, according to the present invention, firstly, the printed wiring board material is sufficiently and reliably dried, and secondly,
In particular, the inside of the through hole and the blind via hole are sufficiently and surely dried. Thirdly, it is quickly dried with warm air to prevent adverse effects on the circuit, etc. Fourthly, the working environment is improved, 5, the adhesion of dust and the like is avoided, and sixth,
Moreover, it is an object of the present invention to propose a drying device in which rubbing and adsorption accidents can be avoided, and this aspect can also prevent adverse effects on circuits and the like.

[0011]

<< About Each Claim >> The technical means of the present invention for solving such a problem are as follows. First, claim 1 is as follows. The drying device according to the first aspect is used in the manufacturing process of the printed wiring board, and has a moisture removing chamber and a warm air drying chamber in order. Then, with respect to the printed wiring board material that is cleaned, supplied, and conveyed by the conveyor, first, the attached water is sucked and removed in the moisture removal chamber, and then hot air is used in the warm air drying chamber. And dried.
Claim 2 is as follows. According to a second aspect of the present invention, in the first aspect, the moisture removal chamber includes a plurality of suction devices. The suction device is arranged so as to cover the entire width of the conveyed printed wiring board material in the lateral direction on the left and right, and the printed wiring board is supplied from a slit-shaped suction port formed facing the printed wiring board material. It is characterized in that a suction force is applied to the substrate material to suck and remove the attached water.

Claim 3 is as follows. In the drying device according to the third aspect of the present invention, in the second aspect, the aspirator of the moisture removal chamber has a circular pipe shape, and a cylindrical net is rotatably mounted on the outer periphery, and the slit-shaped suction port is the cylindrical shape. The printed circuit board material is opposed to the printed circuit board material via a net, and the cylindrical net is in contact with and driven by the printed circuit board material. Claim 4 is as follows. In the drying device according to the fourth aspect, in the third aspect, as the conveyor of the moisture removing chamber, the upper and lower roller groups or wheel groups that feed the printed wiring board material while sandwiching the printed wiring board material are used. The suction port is arranged between the roller group and the wheel group. Claim 5 is as follows. In the drying device of the fifth aspect of the present invention, in the second aspect, as the conveyor of the moisture removing chamber, upper and lower net belts that sandwich and feed the printed wiring board material are used, and the suction device and the slit-shaped suction port are used. Is disposed so as to face the printed wiring board material via the net belt.

Claim 6 is as follows. In the drying device according to claim 6, the printed wiring board material supplied according to claim 4 or 5 has a moisture content in the outer surface on which a circuit is formed or in a through hole opened between the outer surfaces, which is caused by washing. Are attached in the form of liquid, water droplets, or moisture. Claim 7 is as follows. In the drying device according to claim 7, in claim 2, as the conveyor of the moisture removing chamber, a group of upper and lower rollers or a group of wheels that feeds the printed wiring board material is used.
The slit-shaped suction port of the suction device is arranged between the roller group and the wheel group and directly opens to the printed wiring board material. Then, the supplied printed wiring board material is such that the water accompanying the cleaning adheres to the outer surface or a blind via hole opened only on one outer surface in the form of liquid, water drops, or moisture. Characterize. Claim 8 is as follows. In the drying device of the eighth aspect, the suction device of the moisture removing chamber is connected to a blower for generating and supplying a suction force through a pipe in the sixth or seventh aspect.

Claim 9 is as follows. According to the drying device of claim 9, in any one of claims 2, 6, and 7,
The warm air drying chamber includes a plurality of blowers. The blower is provided to cover the entire width of the conveyed printed wiring board material in the lateral width direction on the left and right, and from the slit-shaped outlet formed facing the printed wiring board material, A hot air set at 50 ° C. or less, especially about 40 ° C., is blown onto the printed wiring board material. Claim 10 is as follows. In the drying device according to the tenth aspect of the present invention, in the ninth aspect, as the conveyor of the moisture removing chamber, upper and lower roller groups or wheel groups that sandwich and feed the printed wiring board material are used,
The blower is connected to a warm air generator with a blower for supplying warm air through a pipe, and the slit-shaped blowout port is arranged between the roller group and the wheel group. And

<Regarding Operation> Since the present invention is configured as described above, it is as follows. This drying device is used in the manufacturing process of the printed wiring board, the cleaned printed wiring board material is supplied, and is dried in the next step. Water adheres to the outer surface of the printed wiring board material, the through hole opened between the outer surfaces, and the blind via hole opened only on one outer surface in the form of liquid, water droplet, or moisture. Then, the printed wiring board material is first supplied to the moisture removing chamber of the drying device. A plurality of suction devices connected to the blower are arranged in the moisture removal chamber, and suction forces are applied to the conveyed printed wiring board material from the slit-shaped suction ports. With this suction removal method, a strong suction force acts, and the air passes through not only the outer surface of the printed wiring board material, but also the through holes and blind via holes that are formed with a large number of extremely small diameters, and the moisture Are suctioned off sufficiently and reliably. Since it is a suction-removal method, cutting powder, dust, etc. do not reattach to the outer surface of the printed wiring board material.

In the moisture removing chamber of the first example, a roller group and a wheel group are used as a conveyor, and the suction device has a circular pipe shape and is covered with a cylindrical net. The slit-shaped suction port has a cylindrical shape. A suction force is applied to the printed wiring board material via the net, and the cylindrical net is driven to rotate by the printed wiring board material. In the moisture removal chamber of the second example, a net belt is used as a conveyor, and the suction device and the slit-shaped suction port apply suction force to the printed wiring board material via the net belt. In the moisture removing chamber of the third example, a roller group and a wheel group are used as the conveyor, and the slit-shaped suction port of the suction device directly opens in the printed wiring board material to apply suction force. In the first and second examples, the cylindrical net and the net belt are located between the printed wiring board material and the slit-shaped suction port. Therefore, the outer surface of the printed wiring board material is prevented from being adsorbed and rubbed by the slit-shaped suction port, so that the printed wiring board material having a circuit already formed on the outer surface (often having through holes). Suitable for On the other hand, in the third example, since the outer surface of the printed wiring board material directly receives the suction force of the slit-shaped suction port, for example, a printed wiring board material not yet formed with a circuit on the outer surface after the blind via hole is formed is used. ,Are suitable.

Now, the printed wiring board material is supplied to the warm air drying chamber after the moisture removing chamber described above. A plurality of blowers are arranged in the warm air drying chamber, and the slit-shaped blowout ports are arranged between the roller group and the wheel group of the conveyor. The blower was connected to a hot air generator with a blower, and the slit-shaped blower was used to connect the printed wiring board material to the blower.
A warm air of 0 ° C or less, especially around 40 ° C is blown. The printed wiring board material is supplied to this hot air drying chamber after the water is sufficiently and surely sucked and removed in the above-mentioned moisture removing chamber, so that the hot air is not limited to its outer surface,
It passes smoothly through the through holes and blind via holes, allowing it to dry quickly and in a short time. As described above, since the hot air is used quickly instead of the hot air, the thermal expansion and contraction of the printed wiring board material is avoided, so that the circuit,
Through holes and blind via holes are prevented from adversely affecting accuracy. Further, it does not adversely affect the external work environment.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION
A detailed description will be given based on an embodiment of the invention shown in the drawings. 1, FIG. 2, FIG. 3, FIG. 4 and the like serve to explain the embodiment of the present invention. 1 is a side sectional explanatory view of the first example, FIG. 2 is a side sectional explanatory diagram of the second example, and FIG. 3 is a side sectional explanatory diagram of the third example. FIGS. 4A and 4B show an aspirator with a cylindrical net, and FIG. 4A is a side sectional view.
(2) The figure is a front view with a part cut away. FIGS. 4 (3), 4 (4), 5 (5), and 6 (6) are plan explanatory views of the suction device. FIG. 3 (3) is the first example, and FIG. 4 (2) is the second example. An example, (5) shows a third example, and (6) shows a fourth example. FIG. 5 (1) is an enlarged vertical cross-sectional view of the printed wiring board material, and is used to explain the through hole, and FIG. 5 (2) shows
It is a longitudinal cross-sectional enlarged view of the printed wiring board material, and is used for description of the through hole after plating and circuit formation, and (3) is a plan view of the printed wiring board (material). FIG. 6 is an enlarged vertical cross-sectional view of a printed wiring board material showing an example of a manufacturing process of a multilayer type printed wiring board. And
FIG. 1 shows the first step, FIG. 2 shows the second step, FIG. 3 shows the third step, FIG. 4 shows the fourth step, and FIG. 5 step, and FIG. 6 (6) shows a sixth step.

<< Regarding Printed Wiring Board >> First, the premise of the printed wiring board A will be briefly described with reference to FIG. The printed wiring board A, which is also called an electronic circuit board, is a board for a wide variety of OA equipment,
It is used as a substrate for other electronic devices, and there are various types such as single-sided substrates, double-sided substrates, and multi-layered substrates (including those of recent build-up construction method). CSP and PBGA have also appeared. The printed wiring board A has become more and more precise, finer, ultrathin, flexible, multi-layered, etc. in recent years as the performance and functionality of electronic devices have become smaller and lighter. The density and miniaturization of the circuit B formed on one or both of the front surface and the back surface are remarkable. The printed wiring board A has, for example, dimensions of about 500 mm × 500 mm in length and width to about 250 mm × 330 mm,
The thickness of the insulating base material / insulating layer C made of resin or glass cloth is about 1.0 mm to 60 μm, and the thickness of the circuit B portion (copper foil part) is 75 μm to 35 μm.
It is extremely thinned to about m, and even in the case of a multilayer substrate, the overall thickness is being extremely thinned to about 1.0 mm to 0.4 mm. The width and interval of the circuit B are also 0.1 μm or less, and are about 70 μm to 20 μm, which is a tendency toward miniaturization.

<< Regarding Manufacturing Process of Printed Wiring Board A >> The printed wiring board A is manufactured by following the following steps as is well known. First, after a copper foil is attached to the outer surface of the insulating layer C, which is an insulating base material made of resin or glass cloth, by hot pressing or the like, soft etching for roughening the copper foil surface is performed and cut into a work size. It In many cases, the printed wiring board material D, which is a copper-clad laminate, prepared in this way is subjected to a large number of holes for through-holes E, and then panel plating F is applied to the inner walls of the through-holes E to form plating F. To be done. After that, a photosensitive resist, which is a protective film, is applied or attached in a film form on the outer surface of the printed wiring board material D. In addition,
The printed wiring board material D shown in FIGS. 5 (1) and 5 (2) is composed of a double-sided board having circuits B formed on both outer surfaces (both front and back surfaces) of a double-sided copper-clad laminate. But
A single-sided board having a circuit B formed only on one outer surface and a single-sided copper-clad laminate may be used. The through hole E is also called a via hole, and one printed wiring board material D (printed wiring board A) is formed with a large number of extremely small diameters of several hundreds or thousands, and the diameter thereof is 0. Many of them are about 0.5 mm to 0.2 mm or less. The through hole E is used for connection between the circuits B on both outer surfaces and for mounting / attaching the base of a (thin type) component mounted on the circuit B.

Then, a circuit photograph, which is a negative film of the circuit B, is applied to such a printed wiring board material D,
Expose. As a result, the photosensitive resist coating the outer surface of the printed wiring board material D leaves a portion where the circuit B is exposed and cured, and the other unnecessary portion is dissolved and removed by spraying a developing solution which is a chemical solution. Thereafter, in the copper foil on the outer surface of the printed wiring board material D, the photosensitive resist is hardened to leave the circuit B formation portion covered and protected, and the photosensitive resist is dissolved and removed by the above-described unnecessary portion. However, it is dissolved and removed / etched by spraying an etching solution (corrosion solution) which is a chemical solution. Then, the remaining photosensitive resist of the cured circuit B forming portion is dissolved and removed by spraying a stripping solution which is a chemical liquid, so that the outer surface of the printed wiring board material D is formed by the remaining copper foil of the circuit B forming portion. A predetermined circuit B is formed on the printed circuit board A, and the printed wiring board A is manufactured accordingly. Incidentally, on the outer surface of the printed wiring board A manufactured by following these steps, the protective film of the formed circuit B is formed by a photosensitive resist as a post-treatment step according to the above-mentioned step. It The manufacturing process of the printed wiring board A is as described above.

<< Manufacturing Process of Multilayer Type Printed Wiring Board A >> Next, the multilayer type printed wiring board A will be described.
The manufacturing process will be described with reference to FIG. The multi-layer type printed wiring board A has a structure in which circuits B are laminated in multiple layers, and a build-up method is known as a manufacturing method thereof. In the build-up method, the insulating layer C and the circuit B are sequentially laminated one by one on the outer surface of the printed wiring board material D, and the connection between the laminated circuits B is performed by the blind via hole G in each insulating layer C. To form
It is carried out by plating F on the inner wall.

That is, the multilayer type printed wiring board A is manufactured by the build-up method, for example, following the steps below. First, the printed wiring board material D to be the core board shown in FIG. 6A is manufactured by following the steps described above.
Be prepared. Then, as shown in FIG. 6A, an insulating layer C made of resin is laminated on the outer surface of the printed wiring board material D. Thereafter, as shown in FIG. 6B, a blind via hole G is formed in the insulating layer C by using a laser or the like. Next, the inner wall of the blind via hole G is smoothed by a chemical solution (desmear). Then, the inside of the blind via hole G is washed with water and then dried. Then, as shown in FIG. 6C, formation of the circuit B and plating F in the blind via hole G are performed.
That is, the circuit B is formed on the outer surface of the insulating layer C, and the circuit B thus formed and the circuit B already formed under the insulating layer C (the circuit B of the printed wiring board material D). The gaps are electrically connected by plating F on the inner walls of the blind via holes G interposed therebetween. Then, further, the lamination of the insulating layer C shown in FIG. 6 (4), the formation of the blind via hole G shown in FIG. 6 (5), and the plating F treatment shown in FIG. 6 (6) are performed. The steps are sequentially performed according to the above-mentioned steps. Afterwards, such steps are repeated as necessary.

By following these steps, a multi-layer type printed wiring board A in which the insulating layer C and the circuit B are sequentially laminated on the printed wiring board material D which is the core substrate is manufactured by the build-up method. . In such a multilayer-type printed wiring board A, a large number of blind via holes G are formed, for example, on the order of 30,000 per board, and the diameter thereof is an extremely small diameter of about 100 μm (0.1 mm) to about 10 μm. . The blind via hole G is formed in the insulating layer C laminated in multiple layers on the printed wiring board material D, and one outer surface (front surface) is formed during the manufacturing of the multilayer type printed wiring board A.
Only the opening is open and the other outer surface (back surface) is the circuit B
It is composed of a so-called blind hole which is closed and closed by another insulating layer C. That is, as shown in each drawing of FIG. 6, in the course of manufacturing, the blind via hole G is a hole having only one surface opened (multilayer type printed wiring board A).
Upon completion of manufacturing, the both sides are usually closed and closed by the circuit B and the insulating layer C). The blind via hole G is used for connection between the circuits B on both outer surfaces (upper and lower layers) and for mounting / attaching the base of a (thin type) component mounted on the circuit B. The multilayer type printed wiring board A is manufactured in this manner.

<< Outline of Drying Device 1 >> The drying device 1 of the present invention will be described in detail below with reference to FIGS. 1, 2, 3, and 4. As described above, in the manufacturing process of the printed wiring board A and the manufacturing process of the multilayer type printed wiring board A by the build-up method which is a part of the manufacturing process, the developing solution, the etching solution (corrosive solution) is added to the printed wiring board material D. ), A stripper, and other chemicals are sprayed to perform chemical treatment. The chemical solution is printed wiring board material D
Of the outer surface of the through hole E and the blind via hole G. The printed wiring board material D treated with the chemical liquid is then subjected to a cleaning treatment of the adhered chemical liquid using a water washing device for spraying a washing liquid, and the printed wiring board material D subjected to the washing treatment is immediately oxidized after the fact. It is dried for prevention. For such a drying process, the drying device 1 is disposed after the water washing device, and removes water attached to the outer surface of the printed wiring board material D, the through hole E, the blind via hole G, and the like due to the water washing. , Remove and dry. As described above, the drying device 1 is used in the manufacturing process of the printed wiring board A and has the moisture removing chamber 2 and the warm air drying chamber 3 in this order. Then, with respect to the printed wiring board material D that has been washed and supplied and conveyed by the conveyor 4, first, the attached water H is sucked and removed in the moisture removal chamber 2, and then the warm air drying chamber 3 is heated with hot air. Dry using J. The outline of the drying device 1 is as described above.

<< Moisture Removal Chamber 2 >> First, the moisture removal chamber 2 of the drying device 1 will be described. First shown in FIG.
Through the second example shown in FIG. 2 and the third example shown in FIG.
The water removal chamber 2 includes a plurality of suction devices 5. The suction device 5 is arranged along the left and right lateral width directions L of the printed wiring board material D to be conveyed so as to cover the entire width thereof, and the slit-shaped suction port formed facing the printed wiring board material D. From 6, a suction force is applied to the printed wiring board material D to suck and remove the attached water H.

That is, the moisture removing chamber 2 is divided into upper and lower parts by the partition floor plate 7, the internal air M is kept at room temperature at room temperature, and the printed wiring board material D is in the conveying direction K in the upper part thereof. It is transported horizontally. The suction device 5 has a shape of a hollow circular pipe or a square pipe, and is made of a printed wiring board material D.
Along the left-right lateral width direction L instead of the front-back transport direction K, the upper-side moisture removal chamber 2 is provided with a length capable of covering the entire width. The suction device 5 of the illustrated example is arranged two sets above and below the printed wiring board material D to be conveyed, but it is also conceivable to arrange one set or three sets or more instead of this. Further, when the printed wiring board material D of the double-sided board is not targeted as in the illustrated example, and the printed wiring board material D of the single-sided board and the blind via hole G are present only on one side (one outer surface), the suction device 5
Are arranged only on the upper side or the lower side of the printed wiring board material D to be conveyed.

The slit-shaped suction port 6 is formed so as to be attached to such a suction device 5, and is located opposite to the conveyed printed wiring board material D in a right angle direction with a slight vertical gap. There is. The slit-shaped suction port 6 is formed along the longitudinal direction of the suction device 5 and along the lateral width direction L on the left and right sides of the printed wiring board material D, and has a size capable of covering the entire width. 4 (3) to FIG. 6 (6) show various forming modes of the slit-shaped suction port 6 on the horizontal plane while taking one suction device 5 as an example. In the example shown in FIG. 4 (3), one slit-shaped suction port 6 is formed along the lateral width direction L on the right and left, which is perpendicular to the conveyance direction K of the printed wiring board material D. In the example of FIG. 4 (4), two lines are formed. Of course, it is also possible to form three or more. Furthermore, slit-shaped suction port 6
In the example of FIG. 5 (5), two are formed with a slight inclination from the lateral width direction L toward the transport direction K. In the example shown in FIG. 5 (6), the two columns are divided and arranged so as not to overlap in the front and rear. In the slit-shaped suction port 6 of the example shown in FIGS. 5 (5) and 6 (6), the suction force with respect to the printed wiring board material D is
It is designed so that it does not act excessively at one time.

Further, each suction device 5 is connected via a suction pipe 8 to a blower 9 provided below the partition floor plate 7 of the moisture removing chamber 2. The blower 9 is for generating and supplying a suction force, and generates a suction force by driving an attached motor 10. Then, the air M in the moisture removal chamber 2 is
Through the printed wiring board material D, each slit-shaped suction port 6, the suction device 5, the suction pipe 8 and the like, the removed water H is sucked and discharged from the discharge pipe 11 to the outside. A vacuum pump or an ejector may be used instead of the blower 9 in the illustrated example. The moisture removing chamber 2 is configured in this way.

<< Regarding each example of the moisture removing chamber 2 >> Next, the first example, the second example, and the third example of the moisture removing chamber 2 will be described. First, in the moisture removal chamber 2 of the drying device 1 of the first example shown in the left part of FIG. 1, as the conveyor 4, upper and lower roller groups or wheel groups 12 that sandwich and feed the printed wiring board material D are used. The suction device 5 and the slit-shaped suction port 6 are arranged between the roller group and the wheel group 12. That is, the conveyor 4 is composed of a pair of upper and lower rollers or wheels 12, one of which is for driving and the other is for driving, and the other is for horizontally driving with the axis in the lateral width direction L and in multiple rows in the conveying direction K. It is provided in. The suction device 5 with the slit-shaped suction port 6 is interposed between the roller groups or the wheel groups 12 of the conveyor 4 described above, that is, at intervals formed in the transport direction K.

The aspirator 5 of the water removing chamber 2 of the first example has a circular pipe shape, and a mesh-shaped cylindrical net 13 is rotatably mounted on the outer peripheral surface thereof. The suction opening 5 of the suction device 5 faces the printed wiring board material D via the cylindrical net 13, and the cylindrical net 13 is brought into contact with the printed wiring board material D and driven. That is, as shown in FIGS. 4A and 4B, the suction pipe 8
The aspirator 5 connected to the has a cylindrical shape and has a horizontal width direction L.
It is disposed so as to face the printed wiring board material D through the cylindrical net 13 with its axis facing to. The cylindrical net 13 is a suction device 5
It is slidably rotatably fitted on the outer peripheral surface of the sheet, and comes into contact with the printed wiring board material D to be transported, so that it can be driven and rotated in the transport direction K while centering on the lateral width direction L. The cylindrical net 13, which is a net ring, is made of a resin having air permeability, for example, Saran net, and the slit-shaped suction port 6 is positioned to face the printed wiring board material D through the mesh space. The suction force from the slit-shaped suction port 6 acts on the printed wiring board material D via the mesh space of the cylindrical net 13.

Next, in the moisture removing chamber 2 of the drying apparatus 1 of the second example shown in the left portion of FIG. 2, as the conveyor 4, the upper and lower endless mesh-like nets which sandwich and feed the printed wiring board material D are sent. A belt 14 is used, and the suction device 5 and the slit-shaped suction port 6 are provided via the net belt 14,
The printed wiring board material D is arranged so as to face it. That is, the conveyor 4 is made of a net belt 14, and the upper and lower net belts 14 are endless, and the drive roller 15 and the driven roller 1 whose axes are oriented in the lateral width direction L.
The tension roller 6 is stretched between the guide rollers 17 with tension so that the printed wiring board material D can be sandwiched between the guide rollers 17 and can be moved in the transport direction K.
The net belt 14 is made of breathable resin,
The suction force from the slit-shaped suction port 6 acts on the printed wiring board material D via the mesh space. In the illustrated example, the aspirator 5 has a rectangular tube shape, and one surface (upper surface or lower surface) of the aspirator 5 is inserted through a net belt 14 that passes while slidingly contacting the aspirator 5.
The slit-shaped suction ports 6 are located opposite to the printed wiring board material D, and two slit-shaped suction ports 6 are formed on the one surface of the suction device 5.

Next, in the moisture removing chamber 2 of the drying device 1 of the third example shown in the left part of FIG. 3, the upper and lower roller groups or the wheel groups 12 which sandwich and feed the printed wiring board material D are used as the conveyor 4. It is used, the slit-shaped suction port 6 of the suction device 5 is arranged between the roller group and the wheel group 12,
The printed wiring board material D is directly opened with a slight vertical gap. Regarding the conveyor 4 including the roller group or the wheel group 12, the slit-shaped suction ports 6 are formed between the roller groups or the wheel groups 12 of the conveyor 4, that is, between the transporting directions K, in accordance with the above description in the first example. It is arranged at the specified intervals. In contrast,
Unlike the first example and the second example, in the suction device 5 of the third example, the slit-shaped suction port 6 directly contacts the printed wiring board material D without any intervening material such as a net. It is open. The suction device 5 in the illustrated example is arranged at a vertical interval with respect to the printed wiring board material D to be conveyed and the roller group or wheel group 12 of the conveyor 4. And, the protruding portion 18 having a vertical flat hole therein
However, it is provided so as to project in the vertical direction toward the printed wiring board material D, and the tip of the projecting portion 18 serves as the slit-shaped suction port 6. Of course, the relationship between the suction device 5 and the slit-shaped suction port 6 does not depend on such an illustrated example, and the slit-shaped suction port 6 is directly formed in the suction device 5 by notching without forming the protrusion 18. Good.

By the way, the drying device 1 and the moisture removing chamber 2 of the first and second examples shown in FIGS. 1 and 2 are provided with respect to the supplied printed wiring board material D, the outer surface on which the circuit B is formed, and the like. It is suitable when the water H accompanying the cleaning adheres in the form of liquid, water droplets, or humidity in the through hole E opened between the outer surfaces (see FIG. 5 (2)). . That is, it is suitable for the printed wiring board material D on which the circuit B is already formed on the outer surface. On the other hand, in the drying device 1 and the moisture removing chamber 2 of the third example shown in FIG. 3, with respect to the printed wiring board material D to be supplied, inside the blind via hole G opened only on the outer surface or one of the outer surfaces. In addition, it is suitable when the water H accompanying the cleaning is attached in a liquid state, a water drop state, or a moisture state (see FIGS. 6B and 6C). That is, it is suitable for the printed wiring board material D on which the circuit B is not yet formed on the outer surface. Each example of the water removal chamber 2 has such a configuration.

<< Regarding Warm Air Drying Chamber 3 >> Next, the warm air drying chamber 3 of the drying device 1 will be described with reference to the right portions of FIGS. 1, 2 and 3, respectively. First, as the conveyor 4 of the warm air drying chamber 3, upper and lower roller groups or wheel groups 12 that sandwich and feed the printed wiring board material D are used. The warm air drying chamber 3 is provided with a plurality of blowers 19, and the blowers 19 are not in the front-back conveyance direction K of the printed wiring board material D to be conveyed but along the left and right lateral width directions L, The slit-shaped outlets 20 are provided to cover the entire width and are formed to face the printed wiring board material D, and the temperature is set to 50 ° C. or less, particularly around 40 ° C., with respect to the printed wiring board material D. Blow wind J. The blower 19 is a blower for supplying warm air through a blow pipe 21.
The slit-shaped outlet 20 is connected to the hot air generator 23 with 20 and is arranged between the roller group and the wheel group 12.

The warm air drying chamber 3 will be described in more detail. The warm air drying chamber 3 is divided into upper and lower parts by a partition floor plate 24, and the printed wiring board material D is horizontally conveyed in the conveying direction K inside the upper part. The blower 19 has a hollow circular pipe shape or a rectangular pipe shape, and is arranged along the left-right lateral width direction L instead of the front-back conveyance direction K of the printed wiring board material D.
The hot air drying chamber 3 on the upper side has a length that can cover the entire width.
It is installed in. The blower 19 of the illustrated example is arranged two sets above and below the conveyed printed wiring board material D, but it is also possible to arrange one set or three sets or more irrespective of this. Furthermore, when the printed wiring board material D of the double-sided board is not targeted as in the illustrated example and the printed wiring board material D of the single-sided board and the blind via hole G are present only on one side (one outer surface), the blower 19
Are arranged only on the upper side or the lower side of the printed wiring board material D to be conveyed. In addition, the slit-shaped outlet 20 is formed in addition to the blower 19, and is positioned opposite to the printed wiring board material D to be conveyed from the right-angled direction with a slight vertical gap, It is formed along the longitudinal direction and along the lateral width direction L on the left and right of the printed wiring board material D with a size capable of covering the entire width thereof. Regarding the mode of forming the slit-shaped outlet 20, the slit-shaped suction port 6 is based on the description made with reference to FIGS. 4 (3) to 4 (6).

The blower 19 in the illustrated example is disposed at a vertical interval with respect to the printed wiring board material D to be conveyed and the roller group or wheel group 12 of the conveyor 4. And, the protruding portion 25 having a vertical flat hole inside
Are provided so as to project in the vertical direction toward the printed wiring board material D, and the tip of the projecting portion 25 serves as the slit-shaped blow-out port 20. Of course, the blower 19 and the slit-shaped outlet 20
With respect to the relationship with the above, the slit-shaped blowout port 20 may be directly formed in the blowout device 19 by notching, not via the projecting portion 25.

Each of the blowers 19 is connected to a warm air generator 23 provided below the partition floor plate 24 of the warm air drying chamber 3 via a blow pipe 21. Hot air generator 23
Is equipped with a heater, etc., from the hot air drying chamber 3 at the top,
The warm air J recovered via the recovery pipe 26 is heated. Then, the heated warm air J is supplied to each of the blowers 19, the slit-shaped blowout port 20, and the printed wiring board material D through the blowout pipe 21 by using the blower 22 driven by the motor 27. To do. The temperature of the hot air J is adjusted by the hot air generator 23 such that the temperature of the hot air J becomes 50 ° C. or less, particularly around 40 ° C. when blown out from the slit-shaped outlet 20. After being blown on the printed wiring board material D, the warm air J is supplied from the warm air drying chamber 3 at the upper part to the blower 22 again via the recovery pipe 26, and is circulated and used. The conveyor 4 including the group of rollers or the group of wheels 12 is similar to that described in the first example of the water removal chamber 2 and thus the description thereof is omitted. The slit-shaped outlets 20 of the blower 19 are arranged between the roller groups or the wheel groups 12 of the conveyor 4 described above, that is, at intervals formed in the transport direction K. The warm air drying chamber 3 has such a structure.

<< Regarding Operation and the Like >> Drying apparatus 1 of the present invention
Is configured as described above. Therefore, it becomes as follows. This drying device 1 has a printed wiring board A.
It is used in the manufacturing process (see FIG. 5C). Then, after the chemical solution is sprayed and the chemical solution is processed, the printed wiring board material D, which has been subjected to the cleaning process by spraying the rinse solution by the rinse apparatus, is supplied to the drying apparatus 1. Then, it is dried by following the next step.

Moisture H adheres to the supplied printed wiring board material D as it is washed with water. That is, on the outer surface of the printed wiring board material D (the circuit B is already formed in many cases, but the circuit B is not formed in some cases), the water H accompanying the cleaning is in the form of liquid or water droplets. It adheres in the form of water and moisture. Further, in the supplied printed wiring board material D, when a through hole E opened between both outer surfaces is formed (often formed), moisture H is also attached to the inside of this through hole E. (See (2) in Fig. 5). Further, in the supplied printed wiring board material D, when the blind via hole G opened only on one outer surface is formed, the moisture H also adheres to the inside of the blind via hole G ((in FIG. 6). 2)
(See Figure and Figure (5)).

The printed wiring board material D is as follows.
While being supplied to the moisture removing chamber 2 of the drying device 1 and being conveyed by the conveyor 4, the attached moisture H is removed by suction (see the left portions of FIGS. 1, 2 and 3). That is, the water removal chamber 2 includes a plurality of suction devices 5 and each suction device 5
Are arranged to cover the entire width of the conveyed printed wiring board material D along the left and right lateral width directions L. The suction device 5 is connected to a blower 9 for generating and supplying a suction force via a suction pipe 8 and also from a slit-shaped suction port 6 formed facing the printed wiring board material D, to the printed wiring board material D. A suction force is applied to and the attached water H is sucked and removed together with the air M in the water removal chamber 2.

In the drying device 1 and the moisture removing chamber 2 of the first example shown in FIG. 1, as the conveyor 4, the upper and lower roller groups or wheel groups 12 which sandwich and feed the printed wiring board material D are used. ing. In addition, in this first example, the suction device 5 and the slit-shaped suction port 6 are arranged between the roller group and the wheel group 12, and the suction device 5 has a circular pipe shape and the cylindrical net 13 is an exterior. Has been done. Therefore, the slit-shaped suction port 6 is formed by the cylindrical net 1
It is located opposite to the printed wiring board material D through 3,
A suction force is applied through the cylindrical net 13 so that the water H attached to the printed wiring board material D is removed by the air M.
Aspirate with. During this time, the cylindrical net 13 contacts the conveyed printed wiring board material D and is driven to rotate.

Next, the drying apparatus 1 of the second example shown in FIG.
Then, in the moisture removal chamber 2, the upper and lower net belts 14 sandwiching the printed wiring board material D and sending the same are used as the conveyor 4.
It is used. Further, in this second example, the suction device 5 and the slit-shaped suction port 6 are arranged to face the printed wiring board material D via the net belt 14 of the conveyor 4, and suction is performed via the net belt 14. A force is applied to suck and remove the water H attached to the printed wiring board material D together with the air M.

Next, the drying apparatus 1 of the third example shown in FIG.
Further, in the water removal chamber 2, the upper and lower roller groups or wheel groups 12 that sandwich and feed the printed wiring board material D are used as the conveyor 4. Then, in this third example, the slit-shaped suction port 6 of the suction device 5 is arranged between the roller group and the wheel group 12, is directly opened to the printed wiring board material D, and is opposed to it, and attracts suction force. The water H adhered to the printed wiring board material D is sucked and removed together with the air M by directly acting.

Now, the printed wiring board material D is
It is supplied to the warm air drying chamber 3 of the drying device 1 (Fig. 1, Fig. 2,
See each right part of FIG. 3). As described above, the drying device 1
The printed wiring board material D, which has been supplied to the moisture removal chamber 2 in the previous stage and from which the moisture H has been sucked and removed, is then supplied to the warm air drying chamber 3 in the subsequent stage of the drying device 1 and is conveyed by the conveyor 4. While being transported, it is dried using warm air J. That is, the warm air drying chamber 3 uses a group of upper and lower rollers or a group of wheels 12 that sandwich and feed the printed wiring board material D as the conveyor 4, and includes a plurality of blowers 19. The blower 19 is provided so as to cover the entire width of the conveyed printed wiring board material D along the left and right lateral width directions L, and the slit-shaped outlet 20 is formed so as to face the printed wiring board material D. Are arranged between the roller group and the wheel group 12. The blower 19 is connected to the warm air generator 23 with the blower 22 for supplying the warm air J through the blowout pipe 21, and the temperature from the slit-shaped blowout port 20 to the printed wiring board material D is 50 ° C. or less, in particular. 40 ° C
The warm air J set to the front and back is blown to dry the printed wiring board material D.

<< Regarding Each Operation >> Now, according to this drying apparatus 1, the following first, second, third, fourth, fifth
It becomes like the sixth. First, the printed wiring board material D is
First, the moisture H that has been supplied to the moisture removal chamber 2 of the drying device 1 and adhered is sufficiently and reliably removed by the suction removal method from the slit-shaped suction port 6 of the suction device 5. That is, by adopting the suction removal method using the slit-shaped suction port 6, the suction force acts strongly on the printed wiring board material D, and the flow of the air M in the moisture removal chamber 2 causes the printed wiring to pass through. The water H attached to the substrate material D is sucked and removed to the slit-shaped suction port 6 without remaining. In this drying device 1, the printed wiring board material D from which the moisture H has been sufficiently and surely sucked and removed in the moisture removing chamber 2 in the preceding stage is supplied to the warm air drying chamber 3 in the following stage. Therefore, the slit-shaped outlet 20 of the warm air drying chamber 3
Printed wiring board material D by the hot air J blown from the
Will be evenly and sufficiently dried.

Second, the inside of the through hole E and the inside of the blind via hole G, in particular, are sufficiently and surely dried. That is, by adopting the suction-removal method using the slit-shaped suction port 6, the suction force acts strongly on the printed wiring board material D, so that the air M in the moisture removal chamber 2 is removed from the printed wiring board material D. Not only the outer surface but also the through hole E and the blind via hole G flow and pass through, and the attached water H is sucked and removed to the slit suction port 6 without remaining. Through hole E and blind via hole G
Had a very small diameter and were formed in large numbers, and a water film also existed at the time of supply, but these obstacles were overcome and the water film was broken, and the water H was sucked and removed together with the passing air M.

In this drying device 1, the moisture H in the through hole E and the blind via hole G of the printed wiring board material D is sufficiently and surely sucked and removed in the moisture removing chamber 2 in the preceding stage. , And is supplied to the warm air drying chamber 3 in the subsequent stage. Therefore, the warm air J blown out from the slit-shaped outlet 20 of the warm air drying chamber 3 in the subsequent stage smoothly passes through the through holes E and the blind via holes G formed in large numbers with a very small diameter. That is, since the water H is completely removed and the air M is filled, the warm air J passes smoothly, and the inside of the through hole E and the blind via hole G are sufficiently and surely dried.

Thirdly, in the drying device 1, the suction / removal method is adopted in the moisture removing chamber 2 in the previous stage, so that the printed wiring board material D has moisture on the outer surface, the through holes E, and the blind via holes G. The H is sufficiently and surely removed by suction and supplied to the warm air drying chamber 3 in the subsequent stage. Therefore, the warm air J blown out from the slit-shaped outlet 20 of the warm air drying chamber 3 in the latter stage is allowed to smoothly pass through the outer surface and the through holes E and blind via holes G formed with a large number of extremely small diameters. become. In other words, the warm air J passes smoothly because the water H is completely removed, and even though the temperature is 50 ° C. or less, especially around 40 ° C., the warm air J can quickly and quickly reach the inside of the through hole E or the blind via hole G. Drying is realized. As described above, the hot air J is quickly used instead of the hot air J, so that thermal expansion and contraction of the printed wiring board material D is avoided, and thus the dimensional accuracy of the formed circuit B is deviated, and the positional accuracy of the through hole E and the blind via hole G is increased. It is possible to prevent the occurrence of adverse effects on the circuit B and the like such as deviation of the circuit.

Fourthly, the drying device 1 includes the warm air drying chamber 3
In this way, it is not hot air like this, but below 50 ° C, especially 4
Since the warm air J around 0 ° C. is used, and moreover, the warm air J is used quickly and for a short time, there is little adverse effect on the temperature. That is, it is unlikely that the temperature of the outside will rise due to the leakage or heat dissipation of the warm air J to the outside.
The external work environment is maintained well.

Fifthly, the drying device 1 has a water removing chamber 2
Since the suction removal method is adopted in the above, there is no possibility that cutting powder, dust, other dust, etc. will reattach to the outer surface of the printed wiring board material D. That is, cutting powder, dust, and other dust adhere to the peripheral cutting surface of the printed wiring board material D supplied to the drying device 1, but since it is a suction removal method, it is a pressure removal method using a roller. As described above, such dust and the like are not redeposited on the outer surface of the printed wiring board material D to which it is conveyed. Such dust and the like, together with the water H, are removed from the water removing chamber 2
Is sucked and removed to the slit-shaped suction port 6 of the suction device 5.

Sixth, in the moisture removing chamber 2 of the drying device 1 of the first example shown in FIG. 1 or the second example shown in FIG. 2, the cylindrical net contacting the printed wiring board material D is provided on the outer peripheral surface of the aspirator 5. 13 is used as an exterior or the printed wiring board material D is a net belt 14
The conveyer 4 is sandwiched between the two, and the cylindrical net 13 and the net belt 14 are always interposed between the outer surface of the printed wiring board material D and the slit-shaped suction port 6 of the suction device 5. There is. In this way, the printed wiring board material D
The outer surface of is protected by the suction force of the slit-shaped suction port 6 of the suction device 5, so that the suction-removal method is adopted, but the outer surface of the printed wiring board material D becomes the slit-shaped suction port 6. Adsorption or aspiration and rubbing is avoided. Therefore, when the moisture removal chamber 2 of the drying device 1 of the first or second example is intended for the printed wiring board material D at the stage where the circuit B is already formed on the outer surface,
It is particularly suitable and the formed circuit B is protected without being damaged by adsorption or rubbing. The printed wiring board material D on which the circuit B is formed as described above is
Through holes E are often formed.

On the other hand, in the moisture removing chamber 2 of the drying device 1 of the third example shown in FIG. 3, the slit-shaped suction port 6 of the suction device 5 is used.
Are directly opened and opposed to the outer surface of the printed wiring board material D, and the outer surface of the printed wiring board material D is
The suction force of the slit-shaped suction port 6 is directly received. Therefore, although the water removal chamber 2 of the drying apparatus 1 of the third example has a strong suction force and has an advantage of being extremely excellent in suction and removal of the water H, the circuit B is still formed on the outer surface. This is suitable for the case where the printed wiring board material D at a stage not yet processed is targeted. For example,
It is suitable for the printed wiring board material D immediately after forming the blind via hole G.

[0054]

<Characteristics of the present invention> As described above, the drying apparatus according to the present invention includes the moisture removing chamber at the previous stage provided with the suction device having the slit-shaped suction port and the slit-shaped outlet. It is characterized in that it was adopted for the first time in combination with a warm air drying chamber at a later stage equipped with a blower. Therefore, the present invention exhibits the following effects.

<< Regarding the First Effect >> First, the printed wiring board material is dried sufficiently and reliably. That is, in this drying device, first, the moisture adhering to the printed wiring board material is sufficiently and reliably removed without remaining by adopting the suction removal method by the slit-shaped suction port of the suction device of the moisture removal chamber. To be done. Compared to the above-mentioned conventional pressure-bonding removal method using a sponge roller of this kind, the water removal effect is dramatically improved. Then, the printed wiring board material from which the attached water is removed is uniformly dried by the warm air from the slit-shaped outlet of the blower of the warm air drying chamber. In this way, the drying is carried out sufficiently and reliably. Therefore, the printed wiring board material and the manufactured printed wiring board are reliably prevented from causing oxidation, corrosion, disconnection, etc. of the circuit due to the adhered and remaining moisture.

<Regarding the Second Effect> Secondly, the inside of the through hole and the blind via hole can be sufficiently and surely dried. That is, through-holes and blind via-holes formed on the printed wiring board material had an extremely small diameter and a large number of water films were formed, which was an obstacle, but first, in this drying device, they adhered to the inside. The existing water content is sufficiently and surely removed without remaining by adopting the suction removal method from the slit-shaped suction port of the suction device of the water removal chamber. The removal efficiency is dramatically improved as compared with the above-described pressure-bonding removal method using a sponge-like roller of this type. Then, in the through holes and the blind via holes from which the attached water has been removed in this way, the warm air from the slit-shaped outlet of the blower of the warm air drying chamber easily passes through the inside and passes smoothly. Therefore, it will be dried sufficiently and surely. Therefore, with respect to the printed wiring board material and the printed wiring board to be manufactured, it is possible to prevent inner wall plating of through holes and blind via holes, and oxidation, corrosion, disconnection, etc. of circuits. Further, with respect to (thin type) components inserted into the through-holes or the blind via holes, it is possible to prevent defective soldering for attachment or peeling.

<< Third Effect >> Thirdly, drying is performed quickly with warm air to prevent adverse effects on circuits and the like.
That is, in this drying device, as described above,
Moisture is sufficiently and surely removed by the previous-stage water removal chamber that adopts the suction removal method. Therefore, in the warm air drying chamber at the later stage, it is possible to adopt a warm air of 50 ° C. or less, especially around 40 ° C., and by blowing the warm air quickly and for a very short time, it goes without saying that the outer surface of the printed wiring board material is That is, the inside of the through hole and the inside of the blind via hole are sufficiently and surely dried.

As in the conventional example of this kind described above, the temperature range of 50.degree.
By using hot air of about 80 ° C and blowing it for a long time over a long period of time, the residual heat absorbed is used to cool the inside of the through-holes and blind via-holes at a lower temperature than when gradually drying. It can be dried in a short time. Therefore, thermal expansion and contraction of the printed wiring board material is avoided, and thus the dimensional accuracy of the formed circuit is incorrect, the dimensional accuracy of the circuit formed immediately after the fact is incorrect, and the positional accuracy of the through hole and blind via hole is incorrect, The occurrence of harmful effects, etc. will be prevented. These points are particularly significant for a printed wiring board in which precision and fineness are advanced, and circuit density and miniaturization are remarkable. Moreover, recently, as the insulating base material and the insulating layer, those containing glass cloth tend to be used less frequently, and thermal expansion and contraction easily occur, which is also significant from this aspect.

<< Regarding Fourth Effect >> Fourthly, the working environment and the like are improved. Since the warm air drying chamber of this drying device uses warm air of 50 ° C. or lower, especially around 40 ° C., it has less adverse effect on the temperature. That is, unlike the above-mentioned conventional example of this kind, hot air of about 50 ° C. to 80 ° C. does not leak to the outside through the entrance and other gaps and is not radiated to the outside from the outer surface of the outer wall. As a result, the rise of the external temperature is suppressed, the working environment of the factory is maintained in good condition, and the air conditioner in the factory is in full operation, so that there is no possibility of being damaged in capacity.

<Regarding the Fifth Effect> Fifth, the adhesion of dust and the like is also avoided. Since the moisture removal chamber of this dryer uses a suction removal method, when removing water, cutting powder, dust, and other dust that had adhered to the peripheral cutting surface of the printed wiring board material, etc., reattached. The situation that will happen is
Avoided. That is, in the conventional example of this kind described above, since the pressure-removing method using the sponge-like roller was adopted, after dust or the like is once attached from the peripheral cut surface side of the printed wiring board material by pressure bonding, There has been a situation in which the printed wiring board material is again attached to the outer surface of the printed wiring board material, particularly to the circuit side. However, since the suction removal method is adopted, there is no possibility of such a situation occurring. In this way, since the adhesion of dust and the like is avoided, the density of the circuit and the miniaturization of the circuit are remarkably advanced from this aspect as well, and the quality of the printed wiring board, which is highly accurate and fine, is maintained.

<Regarding the Sixth Effect> Sixthly, rubbing and adsorption accidents are avoided, and adverse effects on the circuit and the like are prevented from this aspect as well. A suction / removal method is adopted in the moisture removing chamber of the dryer, but as in claims 3, 4, 5 and 6, a cylindrical net is attached to the outer peripheral surface of the aspirator or a conveyor including a net belt. By adopting, it is possible to avoid an accident in which the printed wiring board material is sucked or sucked by the slit-shaped suction port of the suction device. That is, a cylindrical net or net belt is used to attach the outer surface of the printed wiring board material to the
Since it is guarded, it uses a suction removal method, but it prevents accidents where circuits, etc. are rubbed, adsorbed and damaged. From this aspect as well, the progress of circuit density and miniaturization is remarkable, and the quality of the printed wiring board, which is becoming more precise and finer, is maintained. Thus, the effects of the present invention, such as solving all the problems existing in this type of conventional example,
There is a remarkable and great thing.

[Brief description of drawings]

FIG. 1 is a side cross-sectional explanatory view of a first example of the drying device according to the present invention, which is used for explaining an embodiment of the present invention.

FIG. 2 is a side cross-sectional explanatory view of a second example for explaining the embodiment of the present invention.

FIG. 3 is a side cross-sectional explanatory view of a third example for explaining the embodiment of the present invention.

FIG. 4 is a view for explaining the embodiment of the present invention, FIG.
FIG. 2 (2) shows a suction device with a cylindrical net, FIG. 1 (1) is a side sectional view, and FIG. 2 (2) is a partially cutaway front view. (3), (4), (5), and (6) are plan explanatory views of the aspirator. (3) is a first example, (4) is a second example, FIG. 5 (5) shows a third example, and FIG. 6 (6) shows a fourth example.

FIG. 5 (1) is an enlarged vertical cross-sectional view of a printed wiring board material, and is used for explanation of a through hole; and FIG. 5 (2) is an enlarged vertical cross-sectional view of a printed wiring board material including plating and circuit formation. In order to explain the through hole later, (3) is a plan explanatory view of the printed wiring board (material).

FIG. 6 is a first manufacturing process of a multilayer printed wiring board.
FIG. 3 is an enlarged vertical cross-sectional view of a printed wiring board material, showing an example. Then, (1) figure shows the first step, (2)
The figure shows the second step, (3) the third step,
FIG. 4 (4) shows the fourth step, FIG. 5 (5) shows the fifth step, and FIG. 6 (6) shows the sixth step.

[Explanation of symbols]

1 dryer 2 Moisture removal room 3 warm air drying room 4 conveyor 5 aspirator 6 Slit suction port 7 partition floor boards 8 Suction piping (piping) 9 Blower 10 motors 11 Discharge pipe 12 Rollers or wheels 13 Cylindrical net 14 Net belt 15 Drive roller 16 Driven roller 17 Guide roller 18 Projection 19 blower 20 Slit shaped outlet 21 Blow-off piping (piping) 22 Blower 23 Hot air generator 24 partition floorboards 25 Projection 26 Recovery pipe 27 motor A printed wiring board B circuit C insulating layer D Printed wiring board material E through hole F plating G Blind Beer Hall H moisture M air J warm air K transport direction L width direction

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masahiro Midorikawa             4-1-1 Higashi-Komatsugawa, Edogawa-ku, Tokyo             Within Tokyo Kakoki Co., Ltd. (72) Inventor Ryoji Abe             4-1-1 Higashi-Komatsugawa, Edogawa-ku, Tokyo             Within Tokyo Kakoki Co., Ltd. F term (reference) 3L113 AA02 AA03 AB02 AC01 AC31                       AC36 AC67 AC73 BA34 DA10                       DA24                 5E343 FF23

Claims (10)

[Claims] 1. A drying device used in a process for manufacturing a printed wiring board, comprising: a moisture removing chamber and a warm air drying chamber, which are sequentially cleaned, supplied, and conveyed by a conveyor. Regarding the substrate material, first, the attached water is sucked and removed in the moisture removing chamber, and then the substrate material is dried using warm air in the warm air drying chamber. 2. The drying device according to claim 1, wherein
The moisture removing chamber is provided with a plurality of suction devices, and the suction devices are arranged to cover the entire width of the conveyed printed wiring board material along the left and right lateral width directions. A suction force is applied to the printed wiring board material from a slit-shaped suction port formed facing the plate material,
A drying device characterized in that the attached water is removed by suction. 3. The drying device according to claim 2,
The suction device of the water removal chamber has a circular pipe shape, and a cylindrical net is rotatably mounted on the outer periphery, and the slit-shaped suction port faces the printed wiring board material through the cylindrical net, The cylindrical net is driven by being in contact with the printed wiring board material. 4. The drying device according to claim 3,
As the conveyor of the moisture removing chamber, upper and lower roller groups or wheel groups that sandwich and feed the printed wiring board material are used, and the suction device and the slit-shaped suction port are provided between the roller group and the wheel group. The drying device is characterized by being arranged. 5. The drying device according to claim 2,
As the conveyor of the moisture removal chamber, upper and lower net belts that sandwich and feed the printed wiring board material are used,
The suction device and the slit-shaped suction port are arranged to face the printed wiring board material via the net belt,
A drying device characterized by. 6. The drying device according to claim 4 or 5, wherein the supplied printed wiring board material has an outer surface on which a circuit is formed or a through hole opened between the outer surfaces.
A cleaning device characterized by the fact that water is attached in the form of liquid, water droplets, or moisture during cleaning. 7. The drying device according to claim 2, wherein
As the conveyor of the moisture removing chamber, upper and lower roller groups or wheel groups that sandwich and feed the printed wiring board material are used, and the slit-shaped suction port of the suction device is provided between the roller group and the wheel group. The printed wiring board material is placed and directly opened to the printed wiring board material, and the supplied printed wiring board material has liquid on the outer surface or in a blind via hole opened only on one outer surface due to the liquid accompanying cleaning. ， Drying device characterized by being attached in the form of water droplets or moisture. 8. The drying device according to claim 6 or 7, wherein the suction device of the moisture removing chamber is connected to a blower for generating and supplying suction force through a pipe. apparatus. 9. The drying device according to claim 2, 6, or 7, wherein the warm air drying chamber includes a plurality of blowers, and the blowers are provided for the printed wiring board material to be conveyed. It is arranged so as to cover the entire width along the lateral width direction on the left and right, and is 50 ° C. or less, especially about 40 ° C., from the slit-shaped outlet formed facing the printed wiring board material to the printed wiring board material. The drying device is characterized by spraying warm air set to. 10. The dryer according to claim 9, wherein as a conveyor of the warm air drying chamber, upper and lower roller groups or wheel groups that sandwich and feed the printed wiring board material are used. Is connected to a warm air generator with a blower for supplying warm air through a pipe, and the slit-shaped outlets are arranged between the roller group and the wheel group. apparatus.