CN112492764B - Method for eliminating solder resist ink in through hole of printed circuit board - Google Patents

Method for eliminating solder resist ink in through hole of printed circuit board Download PDF

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Publication number
CN112492764B
CN112492764B CN202110106782.7A CN202110106782A CN112492764B CN 112492764 B CN112492764 B CN 112492764B CN 202110106782 A CN202110106782 A CN 202110106782A CN 112492764 B CN112492764 B CN 112492764B
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China
Prior art keywords
circuit board
ink
exposure
via hole
solder resist
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CN202110106782.7A
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CN112492764A (en
Inventor
牟玉贵
张仁军
李清华
杨海军
孙洋强
艾克华
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Sichuan Yingchuangli Electronic Technology Co Ltd
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Sichuan Yingchuangli Electronic Technology Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/06—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for producing matt surfaces, e.g. on plastic materials, on glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Abstract

A method for eliminating solder resist ink in a through hole of a printed circuit board comprises the following steps: s1, cleaning the substrate and the conductive copper layer on the surface of the substrate, roughening the surface of the conductive copper layer by using a polishing device, and cleaning the substrate and the conductive copper layer again; s2, screen printing, namely printing an ink layer with a preset color on the conductive copper layer; s3, pre-baking, namely pre-drying the silk-screen printed circuit board; s4, carrying out first exposure, carrying out contraposition exposure by using a film, carrying out photocuring on the solder resist ink, and shielding the via hole and the periphery by a light shielding part of the film; s5, developing for the first time to remove the ink at the position shielded by the light shielding part of the film; and S6, drying the circuit board. S7, carrying out second exposure, carrying out second alignment exposure by using a film, and carrying out second photocuring on the ink layer; s8, developing for the second time, and removing residual solder resist ink in the via hole; and S9, drying the circuit board. Solder resist ink in the through hole can be effectively eliminated, the integrity of the ink layer is guaranteed, and assembly welding bridge partition is prevented.

Description

Method for eliminating solder resist ink in through hole of printed circuit board
Technical Field
The invention belongs to the field of circuit board production, and particularly relates to a method for eliminating solder resist ink in a through hole of a printed circuit board.
Background
In the process of manufacturing a printed circuit board, when solder resist ink is printed, the ink can plug the via hole with a small aperture, and when a customer requires that residual ink cannot exist in the via hole, the existing mode is to arrange a baffle or a plug at a position corresponding to the via hole on a printing screen, but the manufacturing difficulty of the printing screen is high in the mode, the cost is high, the position precision of the plug behind the baffle is not easy to control, solder resist ink cannot be completely and effectively prevented from entering the via hole, and the method can only adopt single-sided printing, two sides of the double-sided circuit board are required to be printed respectively when the double-sided circuit board is manufactured, and the production efficiency is low. The other method is to perform back development on the defective products of the solder resist ink entering the via hole, and the method can cause excessive development during the second development, show the state as shown in fig. 7 to cause ink loss at the edge of the via hole, even cause the bad phenomena of solder resist bridge partition between ICs and the like, and cause rework or scrap of the circuit board.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides a method for eliminating solder resist ink in a through hole of a printed circuit board, which can effectively eliminate the solder resist ink in the through hole, ensure the integrity of an ink layer and prevent assembly welding bridge from being cut off.
In order to realize the purpose of the invention, the following scheme is adopted:
a method for eliminating solder resist ink in a through hole of a printed circuit board comprises the following steps:
s1, cleaning the substrate and the conductive copper layer on the surface of the substrate, roughening the surface of the conductive copper layer by using a polishing device, improving the associativity of solder resist ink, and cleaning the substrate and the conductive copper layer again;
s2, screen printing, namely printing an ink layer with a preset required color on the conductive copper layer, wherein the through hole is filled with solder resist ink;
s3, prebaking the printed circuit board to prevent the negative plate from being stained during exposure;
s4, carrying out first exposure, carrying out contraposition exposure by using a film, carrying out photocuring on the solder resist ink, and shielding the via hole and the periphery by a light shielding part of the film;
s5, developing for the first time to remove the ink at the position shielded by the light shielding part of the film;
s6, drying the circuit board by a drying device;
s7, carrying out second exposure, carrying out second alignment exposure by using a film, carrying out second photocuring on the ink layer, and ensuring the photocuring effect of the ink on the side wall of the ink layer at the periphery of the via hole, so that no ink loss occurs during second development;
and S8, secondary development is carried out, and residual solder resist ink inside the through hole is removed.
And S9, drying the circuit board by using a drying device.
And step S2, printing by using a 43T white net double-sided nail bed during silk printing.
And step S3, the pre-drying temperature of the pre-baking is 75 ℃, and the drying time is 40-50 min.
The drying temperature of the step S6 and the step S9 is 45 ° to 55 °, and the drying time is 20 seconds to 30 seconds.
The distance between the edge of the via hole and the edge of the film light-shielding portion in step S5 and step S7 is 6 to 8 mil.
The exposure energy of the first exposure of step S4 is 9-11 lattices, and the exposure energy of the second exposure of step S7 is 12-13 lattices.
The developing pressure of the first developing in the step S5 is 1.2kg/cm2, the developing speed is 4.5 m/min-4.8 m/min, and the developing conditions adopted in the step S7 for the first time are as follows: the developing pressure is 1.2kg/cm2, and the developing speed is 3.8 m/min-4.5 m/min).
Further, the method is suitable for the circuit board with the hole diameter of the through hole being 0.2mm to 0.5 mm.
Further, the surface of the conductive copper layer is roughened by adopting a grinding and blasting mode, a grinding mechanism and an injection mechanism are arranged on the grinding device, the grinding device adopts rollers to convey the circuit board, the rollers comprise a lower roller set and an upper roller set, the lower roller set is used for driving the circuit board to move, the upper roller set is used for compressing the circuit board, the grinding mechanism comprises grinding and brushing rollers which are arranged up and down, the grinding and brushing rollers rotate simultaneously to roughen the upper and lower surfaces of the circuit board, the injection mechanism comprises a pressure pipe which is arranged up and down, the pressure pipe is provided with a plurality of nozzles along the length direction array, the pressure pipe further roughens the upper and lower surfaces of the circuit board simultaneously, the grinding and brushing mechanism and the injection mechanism are both arranged in a first cavity of the grinding device, and the bottom of the first cavity is provided with a through hole, the recovery sand is made of stainless steel.
Furthermore, the polishing device is further provided with a blowing mechanism, the blowing mechanism is located behind the injection mechanism along the conveying direction of the circuit board, the blowing mechanism is independently arranged in a second cavity of the polishing device, the blowing mechanism comprises an air pipe which is vertically arranged, the air pipe is provided with a blowing port, the blowing port is arranged along the length direction of the air pipe, and the blowing port is inclined towards the input direction of the circuit board.
The invention has the beneficial effects that:
1. compared with the traditional mode of adopting the baffle or the plug, the method can be used for simultaneously printing two sides of the double-sided circuit board, and has high production efficiency; a baffle or a plug is not required to be arranged on the printing screen, so that the production and manufacturing difficulty of the printing screen is reduced, the manufacturing cost of the printing screen is reduced, and the alignment precision during printing is reduced; the solder resist ink in the through hole is removed more thoroughly.
2. Compared with the mode of performing back development on defective products, the method performs second alignment exposure on the solder resist ink reserved after the first development of the via hole, performs light curing on the solder resist ink at the periphery of the solder resist bridge and the development area again, ensures that the phenomena of excessive development and solder resist bridge falling cannot occur during the second development,
3. adopt dedicated grinding device to carry out the alligatoring to the surface on electrically conductive copper layer, grinding device is provided with brush mechanism and injection mechanism and carries out the alligatoring to the circuit board, makes the surface alligatoring effect on electrically conductive copper layer better, effectively improves and hinders and welds printing ink adhesive force, and brush mechanism and injection mechanism can carry out the alligatoring to the upper and lower face of circuit board simultaneously moreover, not only can be used to single-sided circuit board still can be used to two-sided circuit board.
4. Because the sand grain inevitable existence wearing and tearing in long-term use can produce some dusts, grinding device is provided with the mechanism of blowing, and the circuit board carries out preliminary cleaning through the mechanism of blowing before getting into the second time clean, prevents that the dust from adhering to the surface of circuit board, improves the clean effect to the circuit board.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
FIG. 1 shows a process flow diagram of the present application;
fig. 2 shows a cross-sectional view of the circuit board after the silk-screen printing of step S2;
fig. 3 shows a cross-sectional view of the circuit board after the first development of step S5;
fig. 4 shows a cross-sectional view of the circuit board after the second development of step S8;
FIG. 5 shows an embodiment of the positional relationship of the light shielding portion and the via hole of the film;
FIG. 6 shows another embodiment of the positional relationship of the light shielding portion and the via hole of the film;
FIG. 7 illustrates a cross-sectional view of a circuit board after ink removal by a prior art back developing method;
fig. 8 shows an internal configuration diagram of the polishing apparatus;
fig. 9 shows a partial enlarged view at a.
The labels in the figure are: 1-substrate, 2-conductive copper layer, 3-ink layer, 4-via hole, 5-shading part, 10-polishing device, 101-first chamber, 102-second chamber, 11-polishing mechanism, 111-polishing roller, 12-spraying mechanism, 121-pressure pipe, 122-nozzle, 13-lower roller group, 14-upper roller group, 15-blowing mechanism, 151-air pipe and 152-air blowing port.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed in when used, and are only for convenience of describing the present invention and simplifying the description. The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; either directly or indirectly through intervening media, or through both elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Examples
As shown in FIG. 1, the method of the present invention is suitable for circuit boards with via holes 4 having a diameter of 0.2mm to 0.5mm, such as 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.45mm, 0.5 mm.
In this embodiment, taking a double-sided circuit board as an example, the method includes the following steps:
and S1, cleaning the substrate 1 and the conductive copper layer 2 on the surface of the substrate 1, roughening the surface of the conductive copper layer 2 by using the polishing device 10 to improve the bonding property of the solder resist ink, cleaning the substrate 1 and the conductive copper layer 2 again, and removing dust and impurities on the surface of the circuit board by adopting a water washing or ultrasonic mode for two times of cleaning.
S2, printing the ink layer 3 with the predetermined color on the conductive copper layer 2 by silk screen printing, wherein the via hole 4 is filled with solder resist ink as shown in FIG. 2.
And S3, pre-baking, namely pre-drying the silk-screen printed circuit board to prevent the circuit board from being stained on a negative plate during exposure, wherein the pre-baking temperature is 75 ℃, the drying time is 40-50 min, and the drying time is set according to the thickness of the solder resist ink silk-screen, and the thicker the solder resist ink is, the longer the solder resist ink is.
S4, carrying out first exposure, carrying out contraposition exposure by using a film, carrying out photocuring on the solder resist ink, and shielding the via hole 4 and the periphery by the light shielding part 5 of the film;
s5, the first development is carried out to remove the ink at the position shielded by the light shielding part 5 of the film, including the ink in the hole of the via hole 4 and the ink shielded by the light shielding part 5 at the periphery of the via hole 4. After the first development, the circuit board is in the state shown in fig. 3, and a small amount of solder resist ink is usually remained in the via hole 4.
And S6, drying the circuit board by using a drying device to remove the developing solution and the moisture on the surface of the circuit board, wherein the drying temperature is 45-55 ℃, and the drying time is 20-30 seconds.
And S7, carrying out second exposure, carrying out second alignment exposure by using a film, carrying out second photocuring on the ink layer 3, and ensuring the photocuring effect of the ink on the side wall of the ink layer 3 around the via hole 4, so that no ink loss is ensured during second development, and the solder resist ink loss state at the position a shown in figure 7 after second development is prevented.
And S8, second developing to remove the residual solder resist ink in the via hole 4, wherein the circuit board is in the state shown in FIG. 4 after the second developing, and the solder resist ink in the via hole 4 is completely removed.
And S9, drying the circuit board by using a drying device, wherein the drying temperature is 45-55 ℃, and the drying time is 20-30 seconds. .
More specifically, in step S2, a 43T white screen double-sided bed nailing machine is used for printing.
Preferably, as shown in fig. 5 and 6, the distance between the edge of the via hole 4 and the edge of the light shielding portion 5 of the film in steps S5 and S7 is 6 to 8 mil.
More specifically, the exposure energy of the first exposure of step S4 is 9-11 lattices, and the exposure energy of the second exposure of step S7 is 12-13 lattices.
More specifically, to achieve the solder resist ink removing effect, the developing pressure of the first developing in step S5 is 1.2kg/cm, the developing speed is 4.5m/min to 4.8m/min, the developing speed can be selected from 4.5m/min, 4.6m/min, 4.7m/min and 4.8m/min, and the developing conditions adopted in step S7 for the first time are as follows: the developing pressure is 1.2kg/cm, the developing speed is 3.8 m/min-4.5 m/min, and the developing speed can be selected from 3.8m/min, 3.9m/min, 4.0m/min, 4.1m/min and 4.3 m/min.
And simultaneously roughening the upper and lower surfaces of the conductive copper layer 2 by adopting a brushing and shot blasting mode. The polishing mechanism 11 and the spraying mechanism 12 are both disposed in the polishing device 10.
The grinding device 10 adopts a roller to convey the circuit board, the roller comprises a lower roller set 13 and an upper roller set 14, the lower roller set 13 is connected to a driving motor and used for driving the circuit board to move, and the upper roller set 14 is used for compressing the circuit board to prevent the circuit board from shaking.
The brushing mechanism 11 includes brushing rollers 111 arranged up and down, the brushing rollers 111 are respectively connected with a driving motor, the brushing rollers 111 rotate simultaneously to conduct roughening treatment on the upper and lower surfaces of the circuit board, and the bristles of the brushing rollers 111 are utilized to conduct roughening treatment on the surface of the circuit board.
The injection mechanism 12 is including being the pressure pipe 121 that arranges from top to bottom, pressure pipe 121 all is equipped with a plurality of nozzles 122 along the length direction array, utilize nozzle 122 spun sand grain to carry out the alligatoring to the circuit board surface, make circuit board surface formation small pit, with the adhesive force that increases fire-retardant printing ink, pressure pipe 121 carries out the alligatoring to the upper and lower surface of circuit board simultaneously and handles, the first cavity 101 of grinding device 10 is all located with injection mechanism 12 to scrubbing mechanism 11, prevent that the sand grain from dropping out grinding device 10. The bottom of the grinding device 10 is provided with a through hole for recovering sand grains, and the sand grains are made of aluminum oxide or volcanic ash.
When the sand grains are made of alumina, the injection mechanism 12 is positioned behind the scrubbing mechanism 11 along the conveying direction of the circuit board, and the upper surface and the lower surface of the circuit board can be directly roughened. When the sand particles are made of volcanic ash, the spraying mechanism 12 is located in front of the brushing mechanism 11 along the conveying direction of the circuit board, and the surface of the circuit board is subjected to frictional roughening treatment by communicating the volcanic ash through the brushing rollers 111.
The polishing device 10 is further provided with a blowing mechanism 15, the blowing mechanism 15 is located behind the injection mechanism 12 along the conveying direction of the circuit board, the blowing mechanism 15 is independently arranged in a second chamber 102 of the polishing device 10, the second chamber 102 and the first chamber 101 are both formed by the side wall of the polishing device 10 and end plates in the front-back direction, and a gap is formed in the middle of each end plate and used for allowing the circuit board to pass through. The second chamber 102 is located above the through-hole in the bottom of the grinding device 10 through which settled dust will fall.
The blowing mechanism 15 includes air pipes 151 disposed up and down, each air pipe 151 has a blowing port 152, the blowing ports 152 are disposed along the length direction of the air pipes 151, the length of the blowing pipes 151 is greater than the width of the circuit board, and the blowing ports 152 are inclined toward the input direction of the circuit board as shown in fig. 8 and 9.
The foregoing is only a preferred embodiment of the present invention and is not intended to be exhaustive or to limit the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.

Claims (8)

1. A method for eliminating solder resist ink in a through hole of a printed circuit board is characterized by comprising the following steps:
s1, cleaning the substrate (1) and the conductive copper layer (2) on the surface of the substrate (1): roughening the surface of the conductive copper layer (2) by using a polishing device (10) for improving the bonding property of solder resist ink, and cleaning the substrate (1) and the conductive copper layer (2) again;
wherein, adopt the mode of brush polish and peening to carry out the alligatoring to conductive copper layer (2) surface, grinding device (10) have set gradually along direction of delivery brush mechanism (11), injection mechanism (12) and blowing mechanism (15), first cavity (101) of grinding device (10) are all located with injection mechanism (12) in brush polish mechanism (11), blowing mechanism (15) set up alone in second cavity (102) of grinding device (10), the alligatoring step is:
s11, the grinding device (10) conveys the circuit board by adopting a roller, the roller comprises a lower roller set (13) and an upper roller set (14), the circuit board is driven to move by the lower roller set (13), and the conveyed circuit board is pressed by the upper roller set (14);
s12, in the process of conveying, the upper surface and the lower surface of the circuit board are roughened by simultaneously rotating the grinding and brushing rollers (111) which are arranged up and down by the grinding and brushing mechanism (11);
s13, continuing conveying, and coarsening the upper and lower surfaces of the circuit board by sand grains sprayed by a plurality of nozzles (122) arranged along the length direction by pressure pipes (121) arranged up and down by the spraying mechanism (12);
s14, continuing conveying, utilizing air blowing ports (152) which are arranged on air pipes (151) which are arranged up and down by an air blowing mechanism (15) along the length direction to blow air to the upper surface and the lower surface of the circuit board, wherein the air blowing ports (152) are inclined towards the input direction of the circuit board;
s2, screen printing, namely printing an ink layer (3) with a preset required color on the conductive copper layer (2), wherein the solder resist ink is filled in the via hole (4);
s3, prebaking the printed circuit board to prevent the negative plate from being stained during exposure;
s4, carrying out first exposure, carrying out counterpoint exposure by using a film, carrying out photocuring on the solder resist ink, shielding the via hole (4) and the periphery by the light shielding part (5) of the film, wherein the distance between the edge of the via hole (4) and the edge of the light shielding part (5) of the film is 6-8 mil;
s5, first developing to remove the ink at the position shielded by the light shielding part (5) of the film;
s6, drying the circuit board by a drying device;
s7, carrying out second exposure, carrying out second alignment exposure by using a film, carrying out second photocuring on the ink layer (3), and ensuring the photocuring effect of the ink on the side wall of the ink layer (3) at the periphery of the via hole (4) so as to ensure that no ink loss occurs during second development, wherein the distance between the edge of the via hole (4) and the edge of the light shielding part (5) of the film is 6-8 mil;
s8, secondary development is carried out, and residual solder resist ink in the via hole (4) is removed;
and S9, drying the circuit board by using a drying device.
2. The method for eliminating solder mask ink in the through holes of the printed circuit board as claimed in claim 1, wherein the step S2 is performed by using a 43T white net double-sided nail bed printing.
3. The method for eliminating solder mask ink in the via hole of the printed circuit board as claimed in claim 1, wherein the pre-drying temperature of the pre-baking of step S3 is 75 ° and the drying time is 40min to 50 min.
4. The method of claim 1, wherein the drying temperature of step S6 and step S9 is 45 ° to 55 ° and the drying time is 20 seconds to 30 seconds.
5. The method of claim 1, wherein the exposure energy of the first exposure of step S4 is 9-11 grids, and the exposure energy of the second exposure of step S7 is 12-13 grids.
6. The method according to claim 1, wherein the developing pressure of the first developing in step S5 is 1.2kg/cm, the developing speed is 4.5m/min to 4.8m/min, and the first adopted developing conditions in step S7 are: the developing pressure is 1.2kg/cm, and the developing speed is 3.8 m/min-4.5 m/min.
7. The method for eliminating solder mask ink in the via hole of the printed circuit board as claimed in claim 1, wherein the hole diameter of the via hole (4) is 0.2mm to 0.5 mm.
8. The method for eliminating solder mask ink in the via hole of the printed circuit board as claimed in claim 1, wherein the bottom of the first chamber (101) and the second chamber (102) are provided with via holes for recovering sand, and the sand is made of alumina or volcanic ash.
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