US20120103521A1 - Etching apparatus with suction mechanism - Google Patents
Etching apparatus with suction mechanism Download PDFInfo
- Publication number
- US20120103521A1 US20120103521A1 US13/280,361 US201113280361A US2012103521A1 US 20120103521 A1 US20120103521 A1 US 20120103521A1 US 201113280361 A US201113280361 A US 201113280361A US 2012103521 A1 US2012103521 A1 US 2012103521A1
- Authority
- US
- United States
- Prior art keywords
- vacuum pump
- submersible pump
- suction
- substrate
- rollers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005530 etching Methods 0.000 title claims abstract description 29
- 230000007246 mechanism Effects 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000005507 spraying Methods 0.000 claims abstract description 53
- 239000007787 solid Substances 0.000 claims description 2
- 239000007921 spray Substances 0.000 abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Definitions
- the present disclosure generally relates to the technology of manufacturing printed circuit boards (PCBs), and particularly, to an etching apparatus with suction mechanism.
- PCBs printed circuit boards
- PCB substrates may be fed through a series of processing machines via a conveyor system.
- the process includes resist stripping, pre-cleaning, etching, neutralizing, water rinsing, and drying.
- the pre-cleaning, etching, neutralizing, and water rinsing, are known as wet processing steps.
- a spray system comprising at least one set of spray nozzles is arranged to face the conveyor system to spray wet processing liquid on the PCB substrates on the conveyor system.
- the spray system can spray etchant on the PCB substrate to remove portions of a copper foil from the substrate, and then traces will be formed by the remaining portions of the copper foil.
- FIG. 1 is a front view of an etching apparatus in accordance with an exemplary embodiment.
- FIG. 2 is a top view of the area II of FIG. 1 .
- FIG. 3 is similar to FIG. 1 , but shows a PCB substrate being processed in the etching apparatus.
- the apparatus 10 includes a tank 100 , a conveyor 12 , a spraying mechanism 14 , a suction mechanism 16 , and a controller 18 .
- the tank 100 supplies the spraying mechanism 14 , and is configured for receiving/collecting an etchant therein.
- the conveyor 12 includes a number of upper conveying rollers 123 , a number of lower conveying rollers 125 , a number of upper supporting rollers 127 , and a number of lower supporting rollers 129 .
- the conveying rollers 123 and 125 are configured for conveying a PCB substrate positioned therebetween, the supporting rollers 127 and 129 are configured for supporting the substrate in between the rollers 123 and 125 .
- the upper rollers 123 and 127 are positioned above the substrate and are in contact with the top surface of the substrate, and the lower rollers 125 and 129 are below and in contact with the bottom surface of the substrate.
- the rollers 123 , 125 , 127 , and 129 are parallel with each other, and each is perpendicular to the direction of movement of the substrate.
- the upper conveying rollers 123 constitute an upper conveying roller group 122 , which includes a number of subgroups. Each of these subgroups is constituted by two adjacent juxtaposed upper conveying rollers 123 , equidistantly arranged.
- the lower conveying rollers 125 constitute a lower conveying roller group 124 , which is opposite to the upper conveying roller group 122 .
- the lower conveying roller group 124 includes a number of subgroups equidistantly arranged. Each of these subgroups includes two adjacent juxtaposed lower conveying rollers 125 .
- the upper supporting rollers 127 constitute an upper supporting roller group 126
- the lower supporting rollers 129 constitute a lower supporting roller group 128 opposite to the upper supporting roller group 126 .
- the supporting rollers 127 and 129 are equally spaced. In the illustrated embodiment as shown in FIG. 1 , two upper supporting rollers 127 are positioned between two adjacent subgroups of upper conveying rollers 123 , and two lower supporting rollers 129 are positioned between two adjacent subgroups of lower conveying rollers 125 .
- Each upper conveying roller 123 includes an upper rotating shaft 1230 and a number of rotating wheels 1231 which are all mounted on the upper rotating shaft 1230 in line with each other along a lengthwise direction thereof.
- the central axis of the upper rotating shaft 1230 is coaxial with the central axes of the upper rotating wheels 1231 .
- Each lower conveying roller 125 includes a lower rotating shaft 1250 and a number of lower rotating wheels 1251 which are all mounted on the lower rotating shaft 1250 in line with each other along a lengthwise direction thereof.
- the diameter of the upper rotating wheels 1231 is equal to that of the lower rotating wheels 1251 , this distance may be, for example, about 30 millimeters.
- the supporting rollers 127 and 129 are solid cylindrical rollers with a diameter smaller than that of the rotating wheels 1231 and 1251 .
- the rollers 123 , 125 , 127 , and 129 can be driven by one or more motors.
- the direction of rotation of the upper rotating shaft 1230 is the reverse to that of the lower rotating shaft 1250 , and the linear velocity of the upper wheels 1231 is equal to that of the lower wheels 1251 .
- the substrate positioned between the upper and lower wheels 1231 and 1251 can be moved along by the rotation of the wheels 1231 and 1251 at a predefined speed, at 3 meters per minute, for example.
- the direction of rotation of the upper supporting rollers 127 is the reverse to that of the lower supporting rollers 129 .
- the conveyor 12 may function by means of other suitable mechanisms, for example, a motor driven belt or other mechanically driven bulk material handling device.
- the spraying mechanism 14 includes an upper spraying system 140 and a lower spraying system 145 .
- the upper spraying system 140 includes a first submersible pump 141 , a first supplying pipe 142 , a number of upper distributing pipes 143 , and a number of upper spraying nozzles 144 .
- the first submersible pump 141 is disposed in the tank 100 , and is immersed in the etchant received in the tank 100 .
- the first supplying pipe 142 includes a first channel 1421 and a second channel 1422 which is perpendicular to the first channel 1421 .
- the first channel 1421 interconnects the first submersible pump 141 and the second channel 1422 .
- the second channel 1422 communicates with each of the upper distributing pipes 143 .
- the upper distributing pipes 143 are parallel with each other and are equidistantly arranged above the upper conveying roller group 122 .
- the distance between any two adjacent upper distributing pipes 143 is about 200 millimeters.
- the upper distributing pipes 143 are horizontally perpendicular to the second channel 1422 , and are parallel to the rollers 123 , 125 , 127 , and 129 .
- Each of the upper distributing pipes 143 has a number of upper spraying nozzles 144 equidistantly mounted along the length of the upper distributing pipe 143 . There may be around six to ten upper spraying nozzles 144 mounted on each of the upper distributing pipes 143 .
- the upper spraying nozzles 144 are opposite to the lower conveying roller group 124 and look down on the top surface of the substrate.
- the distance between the upper spraying nozzles 144 and the lower conveying rollers 125 is larger than the diameter of the upper conveying roller 123 , for example, at about 180 millimeters.
- the first submersible pump 141 may be selected to operate in an activated state where the first submersible pump 141 supplies etchant to the first supplying pipe 142 thereby enabling the upper spraying nozzles 144 to spray etchant onto the top surface of the substrate, or in an unactivated state where the first submersible pump 141 stops supplying etchant to the first supplying pipe 142 and the upper spraying nozzles 144 .
- the lower spraying system 145 includes a second submersible pump 146 , a second supplying pipe 147 , a number of lower distributing pipes 148 , and a number of lower spraying nozzles 149 .
- the second submersible pump 145 is disposed in the tank 100 , and is immersed in the etchant received in the tank 100 .
- the second supplying pipe 147 includes a third channel 1471 and a fourth channel 1472 perpendicular to the third channel 1471 .
- the third channel 1471 interconnects the second submersible pump 146 and the fourth channel 1472 .
- the fourth channel 1472 communicates with each of the lower distributing pipes 148 .
- the lower distributing pipes 148 are parallel with each other and are equidistantly arranged below the lower conveying roller group 124 .
- the distance between any two adjacent lower distributing pipes 148 is about 200 millimeters.
- the lower distributing pipes 148 are parallel with the upper distributing pipes 143 , and are horizontally perpendicular to the fourth channel 1472 .
- each lower distributing pipe 148 is positioned between two adjacent upper distributing pipes 143 .
- Each lower distributing pipe 148 has around six to ten lower spraying nozzles 149 equidistantly mounted along the length of the lower distributing pipe 148 .
- the lower spraying nozzles 149 are opposite to the upper conveying roller group 122 and look up at the bottom surface of the substrate.
- the distance between the lower spraying nozzles 149 and the upper conveying rollers 123 is larger than the diameter of the lower conveying rollers 125 .
- the distance between the upper spraying nozzles 144 and the lower spraying nozzles 149 is about 360 millimeters.
- the second submersible pump 146 may be selected to operate in an activated state where the second submersible pump 146 supplies etchant to the second supplying pipe 147 thereby enabling the lower spraying nozzles 149 to spray the etchant onto the bottom surface of the substrate, or in an unactivated state where the second submersible pump 146 stops supplying etchant to the second supplying pipe 147 and the lower spraying nozzles 149 .
- the structure of the spraying mechanism 14 is not limited to that of this embodiment.
- the function of the spraying mechanism 14 may be carried out by other suitable mechanisms capable of spraying etchant onto the substrate.
- the suction mechanism 16 includes an upper suction system 160 and a lower suction system 165 .
- the upper suction system 160 includes a first vacuum pump 161 , a first connecting pipe 162 , and a number of upper suction intakes 163 .
- the first vacuum pump 161 is mounted on the first connecting pipe 162 , which is positioned below the upper distributing pipes 143 and above the lower conveying roller group 124 .
- the first connecting pipe 162 is parallel with the second channel 1422 , and is horizontally perpendicular to the upper distributing pipes 143 and to the rollers 123 , 125 , 127 , and 129 .
- the first connecting pipe 162 communicates with each of the upper suction intakes 163 .
- the upper suction intakes 163 each have an elongated tubular structure, and are parallel to, and substantially co-extensive with, the upper distributing pipes 143 . That is, the upper suction intakes 163 are substantially parallel with the rollers 123 , 125 , 127 , and 129 . The central portion of each of the upper suction intakes 163 connects with the first connecting pipe 162 .
- the upper suction intakes 163 are positioned above the lower conveying roller group 124 , and are almost in contact with the top surface of the substrate. In the illustrated embodiment, there are two adjacent upper suction intakes 163 positioned between two adjacent upper supporting rollers 127 , and between two adjacent subgroups of the upper conveying roller group 122 .
- Each upper suction intake 163 defines an elongated cavity and an elongated opening 1631 therein.
- the cavity communicates with the first connecting pipe 162 .
- the opening 1631 communicates with the cavity and is exposed at the bottom of the upper suction intake 163 . That is, the opening 1631 is closely adjacent to the top surface of the substrate.
- the first vacuum pump 161 may be selected to operate in an activated state or an unactivated state.
- the first vacuum pump 161 evacuates the air, so the air pressure of the opening 1631 is reduced and the upper suction intakes 163 are capable of sucking up any etchant on the top surface of the substrate.
- the first vacuum pump 161 stops evacuating the air from the upper suction intakes 163 , and then the upper suction intakes 163 cease suction.
- the lower suction system 165 includes a second vacuum pump 166 , a second connecting pipe 167 , and a number of lower suction intakes 168 .
- the second vacuum pump 166 is mounted on the second connecting pipe 167 , which is positioned above the lower distributing pipes 148 and below the upper conveying roller group 122 .
- the second connecting pipe 167 is parallel with the first connecting pipe.
- the second connecting pipe 167 communicates with each of the lower suction intakes 168 .
- the structure of the lower suction intake 168 is similar to that of the upper suction intake 163 .
- the lower suction intakes 168 are positioned below the upper conveying roller group 122 , and are almost in contact with the bottom surface of the substrate.
- the second vacuum pump 165 may be selected to operate in an activated state where the second vacuum pump 165 reduces the air pressure in the lower suction intakes 168 to suction up any etchant on the bottom surface of the substrate, or in an unactivated state where the second vacuum pump 165 stops evacuating air out and then the lower suction intakes 168 stop functioning.
- the geometry between the upper suction system 160 and the lower suction system 165 is such that the suction force applied to the top surface of the substrate by the upper suction system 160 balances the suction force applied to the bottom surface by the lower suction system 165 . As such, the substrate is not deformed in any way.
- the structure of the suction mechanism 16 is not limited.
- the function of the suction mechanism 16 may be carried out by other suitable mechanisms capable of simply sucking etchant from the substrate.
- the controller 18 can be central processing unit.
- the controller 18 connects and communicates with the pumps 141 , 146 , 161 , and 166 , and is configured for controlling the state of the pumps 141 , 146 , 161 , and 166 .
- Each of the pumps 141 , 146 , 161 , and 166 are alternately operated in the activated state and the unactivated state.
- the controller 18 activates the submersible pumps 141 and 146 when the vacuum pumps 161 and 166 are unactivated, and switches off the submersible pumps 141 and 146 when the vacuum pumps 161 and 166 are activated.
- the duty cycle of the submersible pumps 141 and 146 is equal to the duty cycle of the vacuum pumps 161 and 166 .
- the controller 18 activates the submersible pumps 141 and 146 for a predetermined period of time (and leaving the vacuum pumps 161 and 166 unactivated for the same length of time), and then reverses the functions, to activate the vacuum pumps 161 and 166 for the same predetermined period of time while switching off and leaving the submersible pumps 141 and 146 unactivated for that period of time.
- the predetermined period of time can be one to three seconds. It is noted that the state of the submersible pumps 141 and 146 are the same at any time, and the vacuum pumps 161 and 166 also have the same state at any time.
- a substrate 200 is provided and positioned between the upper and lower roller groups 122 and 124 .
- the substrate 200 has a top surface 201 and an opposite bottom surface 202 , wherein the top surface 201 is in contact with the upper conveying roller group 122 and the upper supporting roller group 126 , and the bottom surface 202 is in contact with the lower conveying roller group 124 and the lower supporting roller group 128 .
- the substrate 200 can be a single-sided copper clad laminate (CCL), a double-sided CCL, or a multilayer substrate having inner circuits defined therein.
- the substrate 200 is a double-sided CCL, having a coating of copper foil on the top and bottom surfaces 201 and 202 .
- the substrate 200 is moved along by the rotation of the conveying rollers 123 and 125 .
- the controller 18 controls the submersible pumps 141 and 146 .
- the upper spraying nozzles 144 spray the etchant onto the top surface 201 to etch the copper foil on the top side
- the lower spraying nozzles 149 spray the etchant onto the bottom surface 202 to etch the copper foil on the bottom side.
- the controller 18 deactivates the submersible pumps 141 and 146 , and simultaneously activates the vacuum pumps 161 and 166 . Then the upper suction intakes 163 suck any etchant from the top surface 201 , and the lower suction intakes 168 suck any etchant from the bottom surface 202 .
- the submersible pumps 141 and 146 are again activated as the vacuum pumps 161 and 166 are simultaneously deactivatated.
- the copper foils of the substrate can be efficiently and reliably etched to form electrical traces.
- any post-reaction etchant remaining on the top and bottom surfaces 201 and 202 is removed by the suction mechanism 16 , and any new etchant can be sprayed onto and react properly with the copper foil on the top and bottom sides of the substrate 200 . Then the copper foil can be etched quickly and precisely. That means the configuration of the traces is precise, and the electrical properties of the manufactured PCBs are reliable.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
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Abstract
An etching apparatus includes a conveyor, a spraying mechanism, a suction mechanism, and a controller. The conveyor is configured for conveying a substrate. The spraying mechanism includes a submersible pump and a number of spraying nozzles. The submersible pump selectively operates at an activated state where the spraying nozzles can spray etchant onto the substrate, or an unactivated state where the spraying nozzles cannot spray etchant. The suction mechanism includes a vacuum pump and a number of suction intakes. The vacuum pump selectively operates at an activated state where the suction intakes can suck up the etchant on the substrate, or an unactivated state where the suction intakes cannot suck up the etchant. The controller controls the pumps to operate alternately, so the vacuum pump is unactivated when the submersible pump is activated and vice versa.
Description
- The present disclosure generally relates to the technology of manufacturing printed circuit boards (PCBs), and particularly, to an etching apparatus with suction mechanism.
- In the manufacture of PCBs, PCB substrates may be fed through a series of processing machines via a conveyor system. The process includes resist stripping, pre-cleaning, etching, neutralizing, water rinsing, and drying. The pre-cleaning, etching, neutralizing, and water rinsing, are known as wet processing steps. In these wet processing steps, a spray system comprising at least one set of spray nozzles is arranged to face the conveyor system to spray wet processing liquid on the PCB substrates on the conveyor system. For example, the spray system can spray etchant on the PCB substrate to remove portions of a copper foil from the substrate, and then traces will be formed by the remaining portions of the copper foil.
- During the etching process, portions of the copper foil react with etchant sprayed thereon to form small and shallow depressions. Etchant inevitably collects in the depressions and begins to react with the copper foil in the depressions. However, even after the reaction, such reacted etchant remains pooled in the depressions and prevents new or different etchant reacting with the copper foil in the depressions. If the copper foil in the depressions can be made immune to the etching procedure in this way, the configuration of the copper traces and the electrical properties of the manufactured PCBs are adversely affected.
- What is needed, therefore, is an etching apparatus that overcomes the limitations described.
- Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is a front view of an etching apparatus in accordance with an exemplary embodiment. -
FIG. 2 is a top view of the area II ofFIG. 1 . -
FIG. 3 is similar toFIG. 1 , but shows a PCB substrate being processed in the etching apparatus. - Embodiments will now be described in detail with reference to the drawings.
- Referring to
FIGS. 1 and 2 , anetching apparatus 10 for etching a PCB substrate to form electrical traces thereon with an etchant is shown. Theapparatus 10 includes atank 100, aconveyor 12, aspraying mechanism 14, asuction mechanism 16, and acontroller 18. Thetank 100 supplies thespraying mechanism 14, and is configured for receiving/collecting an etchant therein. - The
conveyor 12 includes a number ofupper conveying rollers 123, a number oflower conveying rollers 125, a number of upper supportingrollers 127, and a number of lower supportingrollers 129. Theconveying rollers rollers rollers upper rollers lower rollers rollers - The
upper conveying rollers 123 constitute an upperconveying roller group 122, which includes a number of subgroups. Each of these subgroups is constituted by two adjacent juxtaposedupper conveying rollers 123, equidistantly arranged. Thelower conveying rollers 125 constitute a lowerconveying roller group 124, which is opposite to the upperconveying roller group 122. The lowerconveying roller group 124 includes a number of subgroups equidistantly arranged. Each of these subgroups includes two adjacent juxtaposedlower conveying rollers 125. The upper supportingrollers 127 constitute an upper supportingroller group 126, and the lower supportingrollers 129 constitute a lower supportingroller group 128 opposite to the upper supportingroller group 126. The supportingrollers FIG. 1 , two upper supportingrollers 127 are positioned between two adjacent subgroups ofupper conveying rollers 123, and two lower supportingrollers 129 are positioned between two adjacent subgroups oflower conveying rollers 125. - Each
upper conveying roller 123 includes an upper rotatingshaft 1230 and a number of rotatingwheels 1231 which are all mounted on the upper rotatingshaft 1230 in line with each other along a lengthwise direction thereof. The central axis of the upper rotatingshaft 1230 is coaxial with the central axes of the upper rotatingwheels 1231. Eachlower conveying roller 125 includes a lower rotatingshaft 1250 and a number of lower rotatingwheels 1251 which are all mounted on the lower rotatingshaft 1250 in line with each other along a lengthwise direction thereof. The diameter of the upper rotatingwheels 1231 is equal to that of the lower rotatingwheels 1251, this distance may be, for example, about 30 millimeters. The supportingrollers wheels - The
rollers shaft 1230 is the reverse to that of the lower rotatingshaft 1250, and the linear velocity of theupper wheels 1231 is equal to that of thelower wheels 1251. The substrate positioned between the upper andlower wheels wheels rollers 127 is the reverse to that of the lower supportingrollers 129. - The
conveyor 12 may function by means of other suitable mechanisms, for example, a motor driven belt or other mechanically driven bulk material handling device. - The
spraying mechanism 14 includes anupper spraying system 140 and alower spraying system 145. Theupper spraying system 140 includes a firstsubmersible pump 141, a first supplyingpipe 142, a number of upper distributingpipes 143, and a number ofupper spraying nozzles 144. The firstsubmersible pump 141 is disposed in thetank 100, and is immersed in the etchant received in thetank 100. The first supplyingpipe 142 includes afirst channel 1421 and asecond channel 1422 which is perpendicular to thefirst channel 1421. Thefirst channel 1421 interconnects the firstsubmersible pump 141 and thesecond channel 1422. Thesecond channel 1422 communicates with each of the upper distributingpipes 143. The upper distributingpipes 143 are parallel with each other and are equidistantly arranged above the upperconveying roller group 122. The distance between any two adjacent upper distributingpipes 143 is about 200 millimeters. The upper distributingpipes 143 are horizontally perpendicular to thesecond channel 1422, and are parallel to therollers pipes 143 has a number of upper sprayingnozzles 144 equidistantly mounted along the length of the upper distributingpipe 143. There may be around six to ten upper sprayingnozzles 144 mounted on each of the upper distributingpipes 143. Theupper spraying nozzles 144 are opposite to the lowerconveying roller group 124 and look down on the top surface of the substrate. The distance between theupper spraying nozzles 144 and thelower conveying rollers 125 is larger than the diameter of theupper conveying roller 123, for example, at about 180 millimeters. - The first
submersible pump 141 may be selected to operate in an activated state where the firstsubmersible pump 141 supplies etchant to the first supplyingpipe 142 thereby enabling theupper spraying nozzles 144 to spray etchant onto the top surface of the substrate, or in an unactivated state where the firstsubmersible pump 141 stops supplying etchant to the first supplyingpipe 142 and theupper spraying nozzles 144. - The
lower spraying system 145 includes a secondsubmersible pump 146, a second supplyingpipe 147, a number of lower distributingpipes 148, and a number oflower spraying nozzles 149. The secondsubmersible pump 145 is disposed in thetank 100, and is immersed in the etchant received in thetank 100. The second supplyingpipe 147 includes athird channel 1471 and afourth channel 1472 perpendicular to thethird channel 1471. Thethird channel 1471 interconnects the secondsubmersible pump 146 and thefourth channel 1472. Thefourth channel 1472 communicates with each of the lower distributingpipes 148. The lower distributingpipes 148 are parallel with each other and are equidistantly arranged below the lower conveyingroller group 124. The distance between any two adjacent lower distributingpipes 148 is about 200 millimeters. The lower distributingpipes 148 are parallel with the upper distributingpipes 143, and are horizontally perpendicular to thefourth channel 1472. In the illustrated embodiment, from a vertical perspective, each lower distributingpipe 148 is positioned between two adjacent upper distributingpipes 143. Each lower distributingpipe 148 has around six to tenlower spraying nozzles 149 equidistantly mounted along the length of the lower distributingpipe 148. Thelower spraying nozzles 149 are opposite to the upper conveyingroller group 122 and look up at the bottom surface of the substrate. The distance between thelower spraying nozzles 149 and the upper conveyingrollers 123 is larger than the diameter of the lower conveyingrollers 125. In the illustrated embodiment, the distance between theupper spraying nozzles 144 and thelower spraying nozzles 149 is about 360 millimeters. - The second
submersible pump 146 may be selected to operate in an activated state where the secondsubmersible pump 146 supplies etchant to the second supplyingpipe 147 thereby enabling thelower spraying nozzles 149 to spray the etchant onto the bottom surface of the substrate, or in an unactivated state where the secondsubmersible pump 146 stops supplying etchant to the second supplyingpipe 147 and thelower spraying nozzles 149. - The structure of the
spraying mechanism 14 is not limited to that of this embodiment. The function of thespraying mechanism 14 may be carried out by other suitable mechanisms capable of spraying etchant onto the substrate. - The
suction mechanism 16 includes anupper suction system 160 and alower suction system 165. Theupper suction system 160 includes afirst vacuum pump 161, a first connectingpipe 162, and a number ofupper suction intakes 163. Thefirst vacuum pump 161 is mounted on the first connectingpipe 162, which is positioned below the upper distributingpipes 143 and above the lower conveyingroller group 124. The first connectingpipe 162 is parallel with thesecond channel 1422, and is horizontally perpendicular to the upper distributingpipes 143 and to therollers pipe 162 communicates with each of theupper suction intakes 163. Theupper suction intakes 163 each have an elongated tubular structure, and are parallel to, and substantially co-extensive with, the upper distributingpipes 143. That is, theupper suction intakes 163 are substantially parallel with therollers pipe 162. Theupper suction intakes 163 are positioned above the lower conveyingroller group 124, and are almost in contact with the top surface of the substrate. In the illustrated embodiment, there are two adjacentupper suction intakes 163 positioned between two adjacentupper supporting rollers 127, and between two adjacent subgroups of the upper conveyingroller group 122. Eachupper suction intake 163 defines an elongated cavity and anelongated opening 1631 therein. The cavity communicates with the first connectingpipe 162. Theopening 1631 communicates with the cavity and is exposed at the bottom of theupper suction intake 163. That is, theopening 1631 is closely adjacent to the top surface of the substrate. - The
first vacuum pump 161 may be selected to operate in an activated state or an unactivated state. In the activated state, thefirst vacuum pump 161 evacuates the air, so the air pressure of theopening 1631 is reduced and theupper suction intakes 163 are capable of sucking up any etchant on the top surface of the substrate. In the unactivated state, thefirst vacuum pump 161 stops evacuating the air from theupper suction intakes 163, and then theupper suction intakes 163 cease suction. - The
lower suction system 165 includes asecond vacuum pump 166, a second connectingpipe 167, and a number oflower suction intakes 168. Thesecond vacuum pump 166 is mounted on the second connectingpipe 167, which is positioned above the lower distributingpipes 148 and below the upper conveyingroller group 122. The second connectingpipe 167 is parallel with the first connecting pipe. The second connectingpipe 167 communicates with each of thelower suction intakes 168. The structure of thelower suction intake 168 is similar to that of theupper suction intake 163. Thelower suction intakes 168 are positioned below the upper conveyingroller group 122, and are almost in contact with the bottom surface of the substrate. - The
second vacuum pump 165 may be selected to operate in an activated state where thesecond vacuum pump 165 reduces the air pressure in thelower suction intakes 168 to suction up any etchant on the bottom surface of the substrate, or in an unactivated state where thesecond vacuum pump 165 stops evacuating air out and then thelower suction intakes 168 stop functioning. - The geometry between the
upper suction system 160 and thelower suction system 165 is such that the suction force applied to the top surface of the substrate by theupper suction system 160 balances the suction force applied to the bottom surface by thelower suction system 165. As such, the substrate is not deformed in any way. - The structure of the
suction mechanism 16 is not limited. The function of thesuction mechanism 16 may be carried out by other suitable mechanisms capable of simply sucking etchant from the substrate. - The
controller 18 can be central processing unit. Thecontroller 18 connects and communicates with thepumps pumps pumps controller 18 activates the submersible pumps 141 and 146 when thevacuum pumps vacuum pumps vacuum pumps controller 18 activates the submersible pumps 141 and 146 for a predetermined period of time (and leaving thevacuum pumps vacuum pumps vacuum pumps - Referring to
FIGS. 1 to 3 , a method for processing a PCB substrate using theetching apparatus 10, is described in detail as follows. - Firstly, a
substrate 200 is provided and positioned between the upper andlower roller groups substrate 200 has atop surface 201 and an oppositebottom surface 202, wherein thetop surface 201 is in contact with the upper conveyingroller group 122 and the upper supportingroller group 126, and thebottom surface 202 is in contact with the lower conveyingroller group 124 and the lower supportingroller group 128. Thesubstrate 200 can be a single-sided copper clad laminate (CCL), a double-sided CCL, or a multilayer substrate having inner circuits defined therein. In the illustrated embodiment, thesubstrate 200 is a double-sided CCL, having a coating of copper foil on the top andbottom surfaces - Then, the
substrate 200 is moved along by the rotation of the conveyingrollers - During the conveyance of the
substrate 200, thecontroller 18 controls the submersible pumps 141 and 146. Thus, theupper spraying nozzles 144 spray the etchant onto thetop surface 201 to etch the copper foil on the top side, and thelower spraying nozzles 149 spray the etchant onto thebottom surface 202 to etch the copper foil on the bottom side. After a predetermined period of time, thecontroller 18 deactivates the submersible pumps 141 and 146, and simultaneously activates thevacuum pumps upper suction intakes 163 suck any etchant from thetop surface 201, and thelower suction intakes 168 suck any etchant from thebottom surface 202. After the lapse of the same predetermined period of time, the submersible pumps 141 and 146 are again activated as thevacuum pumps substrate 200, the copper foils of the substrate can be efficiently and reliably etched to form electrical traces. - Any post-reaction etchant remaining on the top and
bottom surfaces suction mechanism 16, and any new etchant can be sprayed onto and react properly with the copper foil on the top and bottom sides of thesubstrate 200. Then the copper foil can be etched quickly and precisely. That means the configuration of the traces is precise, and the electrical properties of the manufactured PCBs are reliable. - It should be emphasized that the described embodiments of the present disclosure are merely possible examples of implementations, set forth for a clear understanding of the principles of the disclosure. Many variations and modifications may be made to the above-described embodiment(s) of the disclosure without departing substantially from the spirit and principles of the disclosure. All such modifications and variations are intended to be included herein within the scope of this disclosure and the present disclosure is protected by the following claims.
Claims (16)
1. An etching apparatus comprising:
a conveyor comprising an upper conveying roller group and a lower conveying roller group, the conveyor configured for conveying a substrate between the upper and lower conveying roller groups;
a spraying mechanism comprising a first submersible pump and a plurality of upper spraying nozzles communicating with the first submersible pump, the upper spraying nozzles being above the lower conveying roller group and configured for spraying etchant to a top surface of the substrate, the first submersible pump selectively operable in an activated state where the first submersible pump supplies etchant to the upper spraying nozzles, and an unactivated state where the first submersible pump stops supplying etchant to the upper spraying nozzles;
a suction mechanism comprising a first vacuum pump and a plurality of upper suction intakes communicating with the first vacuum pump, the upper suction intakes being opposite to the lower conveying roller group and adjacent to the top surface of the substrate, the first vacuum pump selectively operable in an activated state where the first vacuum pump enables the upper suction intakes to suck up the etchant sprayed on the top surface of the substrate, and an unactivated state where the upper suction intakes cease suction; and
a controller connected with the first submersible pump and the first vacuum pump, the controller configured for controlling the first submersible and vacuum pumps in such a manner that the first submersible pump is alternately operated in the activated state and the unactivated state, when the first submersible pump is operated in the unactivated state, the first vacuum pump is operated in the unactivated state, and when the first submersible pump is operated in the unactivated state, the first vacuum pump is operated in the unactivated state.
2. The etching apparatus of claim 1 , wherein the spraying mechanism further comprises a first supplying pipe and a plurality of upper distributing pipes parallel with each other; the first supplying pipe connects the first submersible pump to each of the upper distributing pipes, each of the upper distributing pipes has a number of upper spraying nozzles mounted thereon along a length of the upper distributing pipe; each of the upper suction intakes has an elongated structure, each of the upper suction intakes is positioned between two adjacent upper distributing pipes.
3. The etching apparatus of claim 2 , wherein the upper conveying roller group includes a plurality of upper conveying rollers parallel with each other, the lower conveying roller group includes a plurality of lower conveying rollers parallel with each other, and the upper conveying rollers, the lower conveying rollers, and the upper distributing pipes are parallel with each other.
4. The etching apparatus of claim 3 , wherein the first supplying pipe includes a first channel and a second channel perpendicular to the first channel, the first channel interconnects the first submersible pump and the second channel, the second channel communicates with each of the upper distributing pipes, and each of the upper distributing pipes substantially perpendicular to the first and second channels.
5. The etching apparatus of claim 3 , wherein the suction mechanism further comprises a first connecting pipe, on which the first vacuum pump is mounted, and a lengthwise direction of the first connecting pipe is substantially perpendicular to that of the upper suction intake.
6. The etching apparatus of claim 3 , wherein the conveyor further comprises a plurality of upper supporting rollers and a number of lower supporting rollers, the conveying rollers and the supporting rollers are parallel with each other, and the upper conveying rollers and the upper supporting rollers are located above and in contact with the top surface of the substrate, the lower conveying rollers and the lower supporting rollers are located below and in contact with the bottom surface of the substrate.
7. The etching apparatus of claim 6 , wherein the conveying rollers each include a rotating shaft and a number of rotating wheels equidistantly mounted on the rotating shaft along a length thereof, the supporting rollers each are solid cylindrical rollers with a diameter smaller than that of the rotating wheels.
8. The etching apparatus of claim 3 , wherein a distance between the upper spraying nozzles and the lower conveying rollers is larger than a diameter of the upper conveying roller, and a distance between the lower spraying nozzles and the upper conveying rollers is larger than a diameter of the lower conveying roller.
9. The etching apparatus of claim 2 , wherein the upper suction intakes each have an elongated opening communicating with the first vacuum pump and adjacent to the top surface of the substrate.
10. The etching apparatus of claim 1 , wherein the spraying mechanism further comprises a second submersible pump and a plurality of lower spraying nozzles communicating with the second submersible pump, the lower spraying nozzles are located below the conveying lower roller group and configured for spraying etchant to a bottom surface of the substrate, the second submersible pump selectively operable in an activated state where the second submersible pump supplies etchant to the lower spraying nozzles, and an unactivated state where the second submersible pump stops supplying etchant to the lower spraying nozzles; wherein the suction mechanism further comprises a second vacuum pump and a plurality of lower suction intakes communicating with the second vacuum pump, the lower suction intakes being opposite to the upper conveying roller group and adjacent to the bottom surface of the substrate, the second vacuum pump selectively operable in an activated state where the second vacuum pump enables the lower suction intakes to suck up the etchant sprayed onto the bottom surface of the substrate, and an unactivated state where the lower suction intakes cease suction; wherein the controller is connected with the second submersible pump and the second vacuum pump, the controller configured to control the second submersible pump and the second vacuum pump in such a manner that the second submersible pump is alternately operated in the activated state and the unactivated state, when the second submersible pump is operated in the unactivated state, the second vacuum pump is operated in the unactivated state, and when the second submersible pump is operated in the unactivated state, the second vacuum pump is operated in the unactivated state.
11. The etching apparatus of claim 10 , wherein the spraying mechanism further comprises a first supplying pipe, a second supplying pipe, a plurality of upper distributing pipes parallel with each other, and a plurality of lower distributing pipes parallel with each other; the first supplying pipe connects the first submersible pump to each of the upper distributing pipes, each of the upper distributing pipes has a number of upper spraying nozzles mounted thereon along a length of the upper distributing pipe; the second supplying pipe connects the second submersible pump to each of the lower distributing pipes, the lower distributing pipes are substantially parallel with the upper distributing pipes, each of the lower distributing pipes has a number of lower spraying nozzles mounted thereon along a length of the lower distributing pipe; each of the upper and lower suction intakes has an elongated structure, each of the upper suction intakes is positioned between two adjacent upper distributing pipes, each of the lower suction intakes is positioned between two adjacent lower distributing pipes.
12. The etching apparatus of claim 11 , wherein the upper conveying roller group includes a plurality of upper conveying rollers parallel with each other, the lower conveying roller group includes a plurality of lower conveying rollers parallel with each other, and the upper conveying rollers, the lower conveying rollers, and the upper distributing pipes are parallel with each other.
13. The etching apparatus of claim 12 , wherein the suction mechanism further comprises a first connecting pipe and a second connecting pipe parallel with the first connecting pipe, the first vacuum pump is mounted on the first connecting pipe, the second vacuum pump is mounted on the second connecting pipe, and a lengthwise direction of the first connecting pipe is substantially perpendicular to that of the upper suction intake.
14. The etching apparatus of claim 12 , wherein the conveyor further comprises a plurality of upper supporting rollers and a number of lower supporting rollers, the conveying rollers and the supporting rollers are parallel with each other, and the upper conveying rollers and the upper supporting rollers are located above and in contact with the top surface of the substrate, the lower conveying rollers and the lower supporting rollers are located below and in contact with the bottom surface of the substrate.
15. The etching apparatus of claim 12 , wherein a distance between the upper spraying nozzles and the lower conveying rollers is larger than a diameter of the upper conveying roller, and a distance between the lower spraying nozzles and the upper conveying rollers is larger than a diameter of the lower conveying roller.
16. The etching apparatus of claim 12 , wherein the upper suction intakes each have an elongated opening communicating with the first vacuum pump and adjacent to the top surface of the substrate, and the lower suction intakes each have an elongated opening communicating with the second vacuum pump and adjacent to the bottom surface of the substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201010517860.4 | 2010-10-27 | ||
CN201010517860.4A CN102453915B (en) | 2010-10-27 | 2010-10-27 | Etching apparatus and method of applying same in etching substrate |
Publications (1)
Publication Number | Publication Date |
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US20120103521A1 true US20120103521A1 (en) | 2012-05-03 |
Family
ID=45995343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/280,361 Abandoned US20120103521A1 (en) | 2010-10-27 | 2011-10-25 | Etching apparatus with suction mechanism |
Country Status (2)
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US (1) | US20120103521A1 (en) |
CN (1) | CN102453915B (en) |
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TWI567810B (en) * | 2013-05-15 | 2017-01-21 | Canon Kk | The method of making the inner wall surface of the micro chamber and the manufacturing method of the component |
WO2017076640A1 (en) * | 2015-11-04 | 2017-05-11 | Gebr. Schmid Gmbh | Treatment fluid extracting device and etching device comprising the latter |
US10020222B2 (en) | 2013-05-15 | 2018-07-10 | Canon, Inc. | Method for processing an inner wall surface of a micro vacancy |
CN109001223A (en) * | 2018-09-06 | 2018-12-14 | 赵玮 | The detection device of electrolytic copper foil break and pin hole |
CN109142384A (en) * | 2018-09-06 | 2019-01-04 | 郑芸芸 | A kind of electrolytic copper foil break and Pinhole atomization system and its application |
US11020596B2 (en) | 2012-12-19 | 2021-06-01 | Viscardia, Inc. | Hemodynamic performance enhancement through asymptomatic diaphragm stimulation |
US11147968B2 (en) | 2012-12-19 | 2021-10-19 | Viscardia, Inc. | Systems, devices, and methods for improving hemodynamic performance through asymptomatic diaphragm stimulation |
US20210335620A1 (en) * | 2020-04-28 | 2021-10-28 | Disco Corporation | Wet etching method and wet etching system |
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KR101663081B1 (en) * | 2015-04-20 | 2016-10-07 | 박종모 | Etching apparatus |
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US11020596B2 (en) | 2012-12-19 | 2021-06-01 | Viscardia, Inc. | Hemodynamic performance enhancement through asymptomatic diaphragm stimulation |
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TWI567810B (en) * | 2013-05-15 | 2017-01-21 | Canon Kk | The method of making the inner wall surface of the micro chamber and the manufacturing method of the component |
KR20180079397A (en) * | 2015-11-04 | 2018-07-10 | 게부르. 쉬미트 게엠베하 | Process fluid extracting apparatus and etching apparatus including the same |
TWI730996B (en) * | 2015-11-04 | 2021-06-21 | 德商吉伯史密德公司 | Suction-extraction apparatus for treatment fluid and etching apparatus containing the same |
US20180324954A1 (en) * | 2015-11-04 | 2018-11-08 | Gebr. Schmid Gmbh | Treatment fluid extracting device and etching device comprising the latter |
KR102545295B1 (en) | 2015-11-04 | 2023-06-19 | 게부르. 쉬미트 게엠베하 | Treatment fluid extraction device and etching device including the same |
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CN109142384A (en) * | 2018-09-06 | 2019-01-04 | 郑芸芸 | A kind of electrolytic copper foil break and Pinhole atomization system and its application |
CN109001223A (en) * | 2018-09-06 | 2018-12-14 | 赵玮 | The detection device of electrolytic copper foil break and pin hole |
US20210335620A1 (en) * | 2020-04-28 | 2021-10-28 | Disco Corporation | Wet etching method and wet etching system |
Also Published As
Publication number | Publication date |
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CN102453915B (en) | 2014-03-12 |
CN102453915A (en) | 2012-05-16 |
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