TW595285B - The substrate treating device - Google Patents

Abstract

To propose a substrate treating device, which firstly, prevents turbulent flow and standing liquid from occurrence, thereby enabling the treatments to be executed uniformly and enhancing the accuracy of the printed wiring substrate; secondly, prevents the circuits from being damaged, thereby reducing the defects of the printed wiring substrate, and enhancing the yield rate. The substrate treating device 5 is used in the printed wiring substrate manufacturing process. The printed wiring substrate materials pare carried by the conveyors 2 without having the circuit forming surfaces R on the outer surface and inner surface contacted with the conveyors 2, the treating liquid S sprays from the spray nozzles 4 on the printed wiring substrate materials being moved by the conveyors 2, and at the same time, the air E blows against the printed wiring substrate materials from the air blowing sections 6 located at upstream and downstream of the spray nozzles 4. By means of this, the air zones are formed in the left-right width direction W on the circuit forming surfaces R, the treating liquid S is sandwiched and constrained by those air zones, thereby forming the flow passes in the left-right width direction W, and flowing while executing the predetermined treatments, finally dropping from both left and right sides.

Description

595285 V. Description of the invention (1) (Technical field to which the invention belongs) The present invention relates to a substrate processing device, that is, a substrate processing device used for manufacturing printed wiring substrates and processing printed substrates during transportation. . (Technical background) As electronic devices have become more high-performance, more functional, smaller and lighter, printed wiring boards have also become more precise, finer, and extremely thinner, and circuits have been formed on the surface and inside. It is also significantly higher in density and finer. In the manufacturing operations of the printed wiring board, the processing liquid is sprayed on the circuit forming surface of the printed wiring board material to be transported in various operations to perform various processes. For example, a developing solution, an etching solution, and a stripping solution are sequentially ejected, thereby sequentially performing processes such as development, etching, and peeling to form a circuit. As another example, immersion in an electroless copper plating solution, a spray developing solution, immersion in an electrolytic copper plating solution, and a spray stripping solution are sequentially performed, thereby sequentially performing chemical copper plating, development, electrical copper plating, peeling film, and the like to form a circuit. Furthermore, the pre- and post-processing of the aforementioned various operations is performed by spraying water washing liquid or the like to perform the washing processing. (Conventional technology) In this kind of manufacturing work for printed wiring boards, the wiring base sheet is supplied to each substrate processing apparatus for various operations, and is subjected to various processes while being conveyed in a horizontal posture by a conveyor belt.

Install the 2-plates at 5 places. The side of the base diagram is based on the main species. _ I Mingtu 3 says -1 VIII, 5 ί first, Figure} 2 Use 5- 板 和 基- 1 side 5-double number C 5. Description of the invention (2) The figure is a sectional view along the KK line arrow in FIG. 5-1. Figs. 6-1, 6-2, and 6-3 are diagrams for explaining such a conventional substrate processing apparatus (for a single-sided substrate), and Fig. 6-1 is a side view of a main part of the example. Figure 2 is a plan view (bottom view) of the main part of the circuit formation surface, and Figure 6-3 is a side view of the main part of another example. As shown in these drawings, each of the aforementioned development operations, etching operations, peeling operations, cleaning operations, and the like is carried out on each substrate processing apparatus 1 by the rollers of the conveyor belt 2 (r0lle03 and A wheel 13 is used to transport the printed wiring board P in a horizontal posture to form a surface R on the circuit between the surface Q and the back F, and spray the processing liquid S from the nozzle 4 to perform a predetermined process. As shown in Figs. 5-1 and 5-2, a substrate processing apparatus 1 for a printed wiring base sheet P having a circuit forming surface R on the surface Q. and the back F, in other words, a substrate processing apparatus for a double-sided substrate, The printed wiring board P is placed on the wheel 1 of the conveyor belt 2 and the nozzles 4 arranged on the upper and lower sides of the printed wiring board P are sprayed with the treatment liquid S on the circuit formation surface R of the surface Q and the inside F during the transportation, thereby forming the processing circuit. Surface R. In addition, as shown in FIGS. 6-1 and 6-3, only the substrate processing apparatus 1 for the printed wiring base sheet P having the circuit formation surface R on the surface Q, that is, for the single-sided substrate The substrate processing apparatus 1 transports the printed wiring board P by the rollers 3 of the conveyor belt 2 Since the nozzle 4 disposed on the upper side sprays the processing liquid S on the circuit forming surface R of the surface Q, thereby processing the circuit forming surface R. (Problems to be solved by the invention) 5. Description of the invention (3) (First problem point) But The above-mentioned conventional substrate processing apparatus 1 is accused of the following problems. First, the substrate processing apparatus 1 (for double-sided substrates) of FIGS. 5-1 and 5-2 and the substrate of FIG. 6-1 The processing device 1 (for a single-sided substrate) is accused of having a problem that turbulent flow T and effusion U are easily generated on the circuit formation surface R of the surface Q and the back surface F of the printed wiring board P. That is, it is sprayed onto the circuit formation The treatment liquid S on the surface R, in other words, the treatment liquid S sprayed onto the surface Q and the inside F in the example of Figs. 5-1 and 5-2, and the injection of the treatment liquid S in the example of Fig. 6-1. The treatment liquid S on the surface Q flows in the left-right width direction W at right angles to the front-back transportation direction V, and flows down from the left and right sides after the circuit formation surface R is processed. However, all the treatment liquid S is not as As expected, it flows in the width direction W. In other words, as shown in FIG. 6-2 and the like, the treatment liquid S Unnecessarily, if it is in the example of Fig. 5-1, 5-2, it is on the circuit forming surface R of the surface Q and the inner F, and if it is in Fig. 6-1, it is on the circuit forming surface R of the surface Q Scattering becomes a turbulent flow T flowing in the forward and backward conveying direction V, and it is easy to stagnate in the center to form a stagnant liquid U. This is caused by spraying the processing liquid S in the printed wiring board P. In this way, once the turbulence occurs After the flow T and the effusion U, the update of the treatment liquid S will be hindered, and the situation of slowness and excessive or insufficient treatment will occur, which will prevent the uniformity of the treatment, the unevenness of the treatment will be significant, and it will eventually become a uniform circuit. Obstacles of this kind. This situation has produced a seal towards the high-density and miniaturization of circuits. V. INTRODUCTION TO THE INVENTION (4) Brush wiring boards can cause defects in accuracy. (Second problem point) Second, it is accused, if it is the substrate processing device 1 (for double-sided base) shown in Figures 5-1 and 5-2, it is formed by the circuit inside F of the printed wiring substrate P. On the surface R, if the substrate processing apparatus 1 (for a single-sided substrate) shown in FIG. 6-3 is used, problems such as damage often occur on the circuit formation surface R of the surface Q of the printed wiring board P. First, the substrate processing apparatus 1 (for a double-sided substrate) shown in FIG. 5 is to place a printed wiring-based sheet material P having a circuit forming surface R on the back surface F and contact the wheel 1 3 of the conveyor belt 2 on the lower side. Be shipped. In addition, the conveyor 2 for carrying the substrate processing apparatus 1 (for a single-sided substrate) having the printed wiring base plate P provided with the circuit formation surface R on the surface Q is also used to transport the rollers 3 as shown in Fig. 6-3. The printed wiring board material 3 is pressed and conveyed in contact with the upper and lower sides. In addition, the transportation method is the same as the example in FIG. 6-1 described above, and the printed wiring board material P is placed on the roller 3 of the lower conveyor belt 2, but it is also used to prevent the turbulent flow T and The liquid accumulation U also uses a substrate processing apparatus 1 (for a single-sided substrate) provided with a limiting roller 3 'on the upper side as shown in Fig. 6-3. That is, there are also rollers 3 ′ which are provided to press the circuit forming surface R of the printed wiring base sheet material P on the upper side, so that the sprayed treatment liquid S does not flow forward and backward, but as expected in the left and right width direction W. On the flow. However, these substrate processing apparatuses 1 are pressed against the printed wiring board 595285 due to the contact with the upper roller 3, the limiting roller 3 'and the lower wheel 1 3. 5. Description of the invention (5) The circuit forming surface of the material p R is prone to contact injuries and abrasions. The photoresist (resist) on the surface Q and the circuit inside F. Copper foil, electroplating, and circuits are prone to chipping, dents, deformation, etc. 0 The damage such as damage to the circuit is high. The density and miniaturization of printed wiring boards is the biggest cause of defects, and it is a problem to reduce the yield. In particular, in the case of 5 module substrates, semiconductor parts must be integrated in advance on micro circuits. The production of such defects is a major problem, and increasing the yield to nearly 100% has become a major issue. (Introduction to 1 of the present invention) Based on this fact, the inventor's substrate processing device was created by the inventor in order to understand the results of the diligent efforts of the lessons from the previous examples. The printed wiring board manufacturing operation is characterized in that the surface of the printed wiring board and the circuit formation surface inside are conveyed in a non-contact state, and the processing liquid is sprayed from the nozzle, and the air is strongly blown out from the front and rear air blowing parts. The flow path of the processing liquid flowing in the left-right width direction. Therefore, the object of the present invention is to propose a substrate processing apparatus, the first of which can prevent turbulence and accumulation of liquid to improve the accuracy of the printed wiring board. The second is to prevent damage.丨 And; greatly reduce the defects of printed wiring boards 0 (methods to solve the problem) (the scope of patent applications) 7-

595285 V. Explanation of the invention (6) The technical method of the invention to solve this problem of Putian m is as follows. First, the first three items of the patent scope are as follows: 0, which is the first item of the patent scope. The substrate processing device is used for manufacturing printed wiring substrates. It is characterized by having a conveyor belt that conveys printed wiring-based sheet material without contact with the circuit-forming surface, and sprays the processing liquid onto the printed wiring-based sheet material. And the air blowing part of the printed wiring base board is strongly blown. The relevant item 2 of the string of three main m patents is as follows: that is, the substrate processing device of the second item of the patent range (double-sided substrate land). It is the first item in the scope of patent application. The conveyor belt holds the printed circuit board with the circuit forming surface on the inside and the inside. The base plate is transported in a horizontal posture on both sides of the circuit forming surface inside the wiring base plate. It is characterized in that the nozzles are disposed on the printed wiring base plate to be transported on the upper and lower sides of the printed circuit board. Liquid 〇The air blowing part is provided above and below the printed wiring board material being conveyed> It is also arranged above the nozzle, and the air is strongly blown to the circuit forming surface after 5 seconds. Related strings The third item of the patent scope is as follows: The substrate processing device (for double-sided substrates) of the third item of the patent scope is the second item of the patent scope. The conveyor belt is the printed wiring board and the frame. Transported together 0 It is characterized in that the frame is such that the circuit forming surface of the printed wiring base plate is exposed at the central opening, and at the same time it is carried and fixed. Holding the edges of the wiring in the substrate sheet of the surface printing (edg e s), -8- on both sides at the input side is provided with

595285 V. Description of the invention (7) Roller for feeding belt. The fourth item of patent application scope is as follows. That is, the substrate processing device (for single-sided fascia) of the scope of patent application No. 4 is the scope of patent application scope No. 1. The conveyor belt carries the printed wiring-based board material having the circuit forming surface only on the surface. The base plate is held in contact with the inside of the base plate and transported in a horizontal posture. It is characterized in that the nozzle is provided above the printed wiring board material being conveyed, and sprays the processing liquid on the circuit forming surface. The air blowing portion is provided on the printed wiring board base material being transported, and is also provided in front of and behind the nozzle to blow air strongly toward the circuit forming surface. The fifth item of patent application scope is as follows. That is, the substrate processing device of the patent application scope item 5 is the patent application scope item 2 or item 4, which is characterized in that the nozzle is arranged on the sprinkler pipe, and the sprinkler pipe is arranged on the left and right widths. The direction 俾 covers the entire width of the printed wiring board. The air blowing part is arranged on the air pipe, and the air pipe is arranged in the width direction, and is also parallel to the sprinkler pipe, and is arranged in pairs before and after the conveying direction, so as to cover all the printed wiring board material. width. The sixth item concerning the scope of patent application is as follows. That is, the substrate processing device of the patent application scope item No. 6 is the patent application scope item No. 5, which is characterized in that the air is strongly blown out by the air blowing part. The circuit forming surface of the printed wiring board is formed with a turbulent flow toward the front and rear conveyance direction, or a function of accumulating liquid. The seventh item concerning the scope of patent application is as follows. That is, the substrate processing device of the patent application scope item 7 is the patent application scope item 6, i. The invention description (8) is characterized in that the air blown out strongly from the air blowing part is the printed wiring board material An air zone along the left and right width direction is formed on the circuit formation surface, and the treatment liquid emitted from the nozzle is restrained and restricted by the air zone in front and back, thereby forming a width direction along the circuit formation surface. The road. The eighth item regarding the scope of patent application is as follows. That is, the substrate processing device of the eighth patent application scope is the seventh of the patent application scope, which is characterized in that it is used for the development, etching, or peeling operation of the printed wiring board material. A chemical solution such as a developing solution, a leaching solution, or a stripping solution is sprayed as the processing solution. The 9th item concerning the scope of patent application is as follows. The substrate processing device in the scope of the patent application No. 9 is the scope of the patent application in the seventh scope, which is characterized in that it is used for the cleaning operation of the printed wiring board material. The liquid is sprayed as the treatment liquid, and the item No. 10 of the patent application scope is as follows. That is, the substrate processing device of the scope of patent application No. 10 is the scope of patent application scope No. 7, which is characterized in that the air blowing part is formed as a slit-shaped blowing outlet that is linear in the left and right width direction, and the air is curtained. Like a strong blow out. The 11th item of patent application scope is as follows. That is, the substrate processing device of the 11th patent application scope is the 7th patent application scope, which is characterized in that the air blowing part is formed by an assembly of a plurality of blowing holes arranged in the left-right width direction. This air was blown out strongly in a continuous curtain as a whole. -10- V. Description of Invention (9) Item 12 of the scope of patent application is as follows. That is, the substrate processing device of the patent application scope item 12 is the patent application scope item 7, which is characterized in that it is used in the manufacturing operation of the modular substrate, and the printed wiring base sheet forms a fine circuit on the circuit formation surface. At the same time, the semiconductor parts are also assembled in one piece, and then laminated. (Effective aspects) Since the present invention is made as described above, it is as follows. ① This substrate processing apparatus is suitable for various operations on manufacturing operations of printed wiring substrates such as modular substrates. For example, it is used in developing operations, etching operations, peeling operations, and cleaning operations. ② The printed wiring board is provided with a circuit forming surface on the front and back, and is carried by a conveyor belt in a horizontal posture. In the case of a printed wiring base material for a double-sided substrate, it is placed on a frame, and both outer sides of the circuit formation surface inside are held by a conveyor belt. In the case of a printed wiring base material for a single-sided substrate, the inside is held by a conveyor belt. ③ In this way, the circuit formation surface of the printed wiring board is transported by the conveyor belt without contact, so there is no risk of damage to the circuit formation surface. ④ On the circuit-forming surface of the printed wiring board material thus transported, a processing liquid including a cleaning solution including a developing solution, an etching solution, a stripping solution, and a washing solution is sprayed from the nozzle. The nozzle is arranged on the sprinkler pipe in the width direction. ⑤ At the same time, the air blowing section from the front and back of the nozzle strongly blows air toward the circuit formation surface. The air blowing part is arranged in parallel with the sprinkler pipe at -11-595285. V. Description of the invention (1) The air duct is made as a straight slit-shaped blowout port and a set of blowout holes. The air blew out into a curtain. ⑥ The air blown strongly on the printed wiring board forms an air area in the width direction of the circuit formation surface. Therefore, the processing liquid is restricted by the air areas in front and back, and a flow path is formed in the width direction. ⑦ In this way, the processing liquid, as expected, is processed on the circuit forming surface while flowing across the width of the circuit forming surface, and then flows out and flows down from the left and right sides without turbulence and effusion. ⑧ Therefore, with this substrate processing device, the circuit formation surface of the printed wiring board can promote the updating of the processing liquid, prevent the processing from being fast or slow, excessive or insufficient, and thereby achieve uniform processing without unevenness. (Embodiments of the invention) (Drawings) The present invention will be described in detail based on the embodiments of the invention shown in the drawings. Figures 1-1 to 4-3 are diagrams for explaining an embodiment of a substrate processing apparatus according to the present invention. Figures 1-1, 1-2, and 1-3 are used to explain an example (for a double-sided substrate). Figures 1-1 are side views of the main part, and Figures 2 and 2 are along the 1- The cross-sectional view of the arrow of the line in Figure 1 is the plan view (bottom view) of the main parts of the printed wiring board and the frame. Figures 2-1, 2-2, and 2-3 are used to illustrate another example (for single-sided substrates). Figure 2-1 is a side view of the main part, and Figure 2-2 is along the second The cross-sectional view of the arrow on line AA in Fig. 1 and Fig. 2-3 are the cross-sectional views of the arrow along line BB in Fig. 2-1. Figure 3 is a sectional view of the main part.

-12- V. Description of the Invention (11) Figure 4-1 is a plan view (bottom view) of the main part of the circuit forming surface of the printed wiring board material, and Figure 4-2 is a bottom view (plan view) of an example of the air blowing part ), Figure 4-3 is a bottom view (plan view) of another example of the air blowing part. In addition, FIG. 7 is a plan (bottom surface) explanatory drawing of a printed wiring board (material). (Printed wiring board C) This substrate processing apparatus S is used for manufacturing a printed wiring board C. Therefore, first, the printed wiring board C will be briefly explained with reference to FIG. 7. The printed wiring board C is widely used in various electronic devices, and has a single-sided substrate, a double-sided substrate, and a multilayer substrate (including a recent build up). ) Method producer) and other substrates. In addition, such a printed wiring substrate C may include a modular substrate (semiconductor package (semiconductor package (semiconductor package)) integrated with semiconductor components such as 1C, LSI elements, passive parts, active parts, capacitors, and the like. package), and also includes plasma display (PDP), liquid crystal LCD and CSP, PBGA, etc. Of course, in this specification, the printed wiring board C also includes these parts and devices. The printed wiring board C has been developed toward higher precision, miniaturization, ultra-thinning, and multi-layering along with the higher performance, higher functionality, and smaller size of electronic equipment. It is formed on the outer surface, that is, surface Q and inner F The density and miniaturization of the circuit D on one or both sides is remarkable. Printed wiring board C, horizontal and vertical, for example, about 500mmx500mm, thickness direction insulation layer part is about 1.00 // m ~ 6 0 // m, electrical -13-595285 V. Description of the invention (12) Road D The part is about 75 / zm ~ 35 / zm, which has recently been extremely thinned to about 25 / im ~ 1 0 // m. Even in the case of a multilayer substrate, the thickness of the entire substrate is still being reduced to a thickness of 1.0 mm to 0.4 m. The width of the circuit D and the interval between the circuits D are also refined toward 3 5 // m to 2 5 // m. The outline of the printed wiring board C is as described above. (Manufacturing method of printed wiring board C)

A method of manufacturing the printed wiring board C used in this substrate processing apparatus 5 will be described below. First, a manufacturing method of the first example will be described. In the manufacturing method of the first example, the printed wiring board C is manufactured by the following steps. First, a copper foil is laminated on the outer surface of a resin, glass cloth, or ceramic insulating layer (core material) by hot pressing to make a printed wiring base sheet P of a copper laminate. . Next, a hole process is performed using a laser or the like to form a through hole.

Through-holes are through-holes that pass through the two outer surfaces (surface Q and back F) of the printed wiring substrate P (printed wiring substrate C). Hundreds or more of extremely small diameter holes are provided on one substrate. This aperture is usually below about 0.5 mm to 0.2 mm. These through-holes are used for the connection between the two outer surfaces or the multilayer substrate circuit D, and the mounting of the components constructed on the circuit D. Furthermore, recently, a bump of a small bump-shaped contact has been used instead of a through-hole. Therefore, a technology that realizes the same function as a through-hole by bumping without developing an opening has been developed, that is, NMBI method. Then, a photosensitive light is applied or pasted onto the outer surface of copper (printed wiring substrate sheet P) (surface q -14- 5., description of invention (13), one or both sides of back F) in a film form. Anti-uranium agent. Next, it is placed on a photograph of a circuit that is a negative film of circuit D. By exposing the photosensitive photoresist film on the outer surface, the portion of circuit D that is hardened by exposure is retained. Other unnecessary parts Parts are dissolved and removed by spraying the developer. Then, on the copper foil of the printed wiring substrate sheet P, the formed portion of the circuit D covered by the cured photosensitive photoresist film remains, and the photosensitive photoresist film is removed by development and dissolution to expose the unnecessary Some of them are dissolved by spraying leaching solution (copper chlovide, ferrous choWide, and other corrosive solutions) to remove the leaching solution. Next, the stripping solution is sprayed to remove the photosensitive photoresist film formed on the remaining portion of the circuit D, so that the copper foil on the remaining portion of the circuit D is formed on the outer surface of the printed wiring board P (surface Q). (One or both sides of the inner F) to form a predetermined circuit D, thereby forming a printed wiring board C. In addition, the above-mentioned developing operation, etching operation, and peeling operation respectively include a rear-end processing operation of a cleaning operation in which a water-washing liquid, a neutralizer liquid, and other cleaning liquids are cleaned, thereby cleaning and removing the adhesion to the printing. The developer, immersion liquid, peeling liquid, etc. on the outer surface of the wiring base sheet P. The manufacturing method of the first example is as described above. Next, the manufacturing method of the second example will be described. Regarding the manufacturing method of the printed wiring board C, although the first example described above is representative, the semi-active method of the second example is also gradually being widely used. This semi-active method firstly applies electroless copper electroplating to the printed wiring base plate with through-holes formed in advance -15- 595285 V. Description of the invention (14) The outer surface of P (any one or both sides of surface Q, inside F) . Next, a photosensitive photoresist film is coated or pasted on this electroless copper electrolytic plating, and then it is pasted on a circuit photograph of a negative film of circuit D and exposed. Thereby, the photosensitive photoresist retains the part that has been hardened by exposure, and the other parts, that is, the circuit D forming part, are sprayed with a developing solution to be dissolved and removed. Then, the circuit D is formed by applying electrolytic copper plating to a portion of the circuit D, that is, a portion of the electroplating pattern of the photosensitive photoresist by development and dissolution, that is, an exposed portion of the electroless copper plating. In addition, the photoresist on the hardened portion of the circuit D other than the formed portion is removed by the sprayed stripping solution, and the exposed electroless copper plating is removed by the sprayed etching solution. Quickly etch, dissolve and remove. The cleaning operation is also included as the rear processing of each operation. The semi-active method of the second example is as described above, and the printed circuit board C is manufactured by forming the circuit D by electrolytic copper plating. The manufacturing method of the second example is as described above. However, the manufacturing method of the printed wiring board C has recently been diversified. In addition to the first and second examples described above, various methods have been developed and used. The present invention is naturally applicable to a method for manufacturing such various printed wiring boards c. The manufacturing method of the printed wiring board C is as described above. (Summary of the substrate processing apparatus 5) Next, reference will be made to Figs. 1-1, 1-2, 1-3, Figs. 2-1, 2-2, 2-3, and Figs. 4-1, 4-2, Figure 4-3 illustrates the substrate processing apparatus of the present invention in detail

-16- 595285

V. Description of the Invention (15) 5 〇 This substrate processing device 5 is suitable for the manufacturing operation of printed wiring substrate C. Each operation uses the substrate processing device 5 for each operation. These substrate processing devices 5 are used for transportation and printing. The wiring base sheet P is processed. In other words, this substrate processing apparatus 5 is used for each operation on the manufacturing method of the printed wiring substrate C described above, that is, a development operation, an etching operation, a peeling operation, a cleaning operation, and the like. Each substrate processing apparatus 5 is similarly provided with a conveyor belt 2, a nozzle 4, a blow-out section 6, and the like. In other words, it is provided with a conveyor belt 2 that does not form a surface R with a circuit on the surface Q, a nozzle 4 that sprays the processing liquid S on the printed wiring substrate sheet P, and an air blowing section that strongly blows air E to the printed wiring substrate sheet p. 6. (Conveyor 2) First, the conveyor 2 will be described. As shown in Figures 1-1, 1-2, and 1-3, the conveyor belt 2 of the substrate processing apparatus 5 for double-sided substrates is the two sides of the circuit formation surface R that holds the inner F will be on the surface Q and the inner F The printed wiring base sheet P provided with the circuit formation surface R on both the front and back surfaces is carried in a horizontal posture. As shown in the figure, the printed wiring board P is placed on the frame 14 and is transported by the conveyor belt 2 together with the frame 14. The frame 14 is formed by a large opening 15 formed in the center portion. The frame board (franie board) is formed. The circuit formation surface R of the surface Q and the back surface F of the printed wiring substrate sheet P is exposed on the upper and lower sides by using this opening portion 15 and is placed on the frame 14 to form the circuit formation surface R of the back surface F

-17- 595285 V. Description of the invention (16) The peripheral edge Y (refer to Fig. 7) is placed on the frame 14 and is held and transported by, for example, the formed section and the intervening belt. Rollers 16 for driving the conveyor belt 2 are arranged on the lower sides of the frame base 14 below, that is, slightly rectangular frames, and are in contact with the frame base 14. The thickness of this roller 16 is thin and slightly round, and does not contact the exposed circuit forming surface R of the inner F of the printed wiring substrate sheet P, and the left and right outer sides of the circuit forming surface R are held by the frame 14 and given. transport. Next, as shown in Figs. 2-1, 2-2, and 2-3, the conveyor belt 2 of the substrate processing apparatus 5 for single-sided substrates carries the printed wiring substrate sheet P, and is brought into contact with the inside F and held by it. In the state, the base plate P is transported in a horizontal posture. That is, in the processing chamber of the substrate processing apparatus 5, the rollers 3 or the wheels of the rotary drive conveyor belt 2 are arranged in a row toward the conveying direction V. On the surface Q of the printed wiring base plate P, there is a circuit formation surface, and there is no surface on the back surface F, so that the circuit formation surface is transported without contacting the conveyor belt. The conveyor belt 2 is as described above. (Nozzle 4) The nozzle 4 will be described below. The nozzle 4 of this substrate processing apparatus 5 is opposite to the upper side and the lower side of the printed wiring substrate sheet P that is transported as the substrate processing apparatus 5 for the double-sided substrate shown in Figs. 1-1, 1-2. If the substrate processing device 5 for a single-sided substrate shown in FIG. 2 is provided, it is arranged opposite to the upper side, the surface R is formed on the circuit of the surface Q and the inside F, and the processing liquid S is sprayed obliquely as shown in the figure.

-18- 595285 V. Description of the invention (17) The nozzle 4 shown in the figure is inclined to the left or right in addition to the transport direction v toward the left and right width direction W (left or right). Angle setting. That is, the nozzle 4 is fixed at a spray angle inclined toward the left and right width direction W, and the sprayed treatment liquid S is sprayed obliquely to the printed wiring substrate P by being tilted leftward or rightward. Furthermore, 'the processing liquid S sprayed when this nozzle 4 is used in a developing operation is a developing liquid, and the processing liquid S sprayed when used in an etching operation is an etching liquid' is the processing liquid S sprayed in a peeling operation. It is a peeling liquid, and the processing liquid S sprayed during the cleaning operation is a water washing liquid, a neutralizer liquid, and other cleaning liquids. This nozzle 4 will be described in more detail below. As shown in FIGS. 1 to 1 to 3, the sprinkler pipe 7 is disposed in the processing chamber of the substrate processing apparatus 5 at a predetermined interval from the printed wiring board P. The examples in the figure are set on the upper and lower sides, such as in the examples in Figures 2-1, 2-2, and 2-3. In addition, the sprinkler pipe 7 is arranged on the upper and lower sides along the left and right width directions W to cover the full width of the printed wiring substrate sheet P. Furthermore, a plurality of sprinkler pipes are also provided on multiple sections of the forward and backward intervals in the conveying direction V. . In this way, the spraying pipe 7 is provided with a nozzle 4 on the surface (bottom and upper) opposite to the printed wiring board P. For the example shown in the figure, each spraying liquid is arranged in multiple stages in the conveying direction V. Nozzles inclined in the left direction and inclined in the right direction are sequentially and alternately arranged on the tube 7. For example, 'the nozzle pipe 7 of the first article uses a nozzle 4 inclined to the left, and the second article of the

-19- 595285 V. Description of the invention (18) The sprinkler pipe 7 uses the nozzle 4 inclined to the right, and the third sprinkler pipe 7 uses the nozzle 4 inclined to the left. The alternating sequence is repeated below. In addition, as the nozzle 4, as shown in Fig. 3, a combination of a plurality of blowout holes arranged in the width direction W and a slot-shaped blowout type made straight in the width direction w can be used. The processing liquid S is conveyed from the inclined nozzle 4 of each liquid pipe 7 toward the horizontal position after the liquid pipe 8 is pressed to each liquid pipe 7 as shown in Figs. 1-1 to 3, etc. The printed wiring board P is sprayed. Therefore, as shown in FIG. 4-1, the processing liquid S flows through the width W of the circuit formation surface R of the wiring substrate sheet P and the inner surface F toward the right or left direction, flows out from the left and right sides, and falls into the lower part. The liquid tank is recovered. The processing liquid S recovered to the liquid tank is then sent to the processing liquid piping 8 by a pump and circulated. In addition, a certain amount of the processing liquid S of the circuit forming surface R of the inner F is sprayed downward due to gravity, but most of them flow through the circuit forming surface R and flow in the width direction W by the spray pressure as expected. When it reaches both sides, it flows down due to the gravity being greater than the injection pressure. The nozzle 4 is as described above. (Air blowing section) The air blowing section 6 will be described below. The air blowing section 6 of this substrate processing apparatus 5 is the base board for the printed wiring substrate sheet P being conveyed in the case of the substrate processing apparatus 5 for the double-sided substrate shown in Figs. 1-1, 1-2. The upper side and the lower side are arranged in pairs. If it is shown in Figures 2-1 and 2-2

-20- 595285 V. Description of the invention (19) When the substrate processing device 5 for single-sided substrates is arranged on the upper side in pairs. Furthermore, the air blowing section 6 is arranged on the upper side and the lower side, and is disposed before and after the aforementioned nozzles 4, and in addition, it strongly blows air E on the surface Q and the circuit formation surface R of the printed wiring base sheet p. . The strongly blown air E forms the air region G along the width direction W of the circuit formation surface R of the printed wiring board P as shown in Fig. 4-1. Therefore, 'the processing liquid S sprayed from the nozzle 4 is held by this front-rear air region G' to form a flow path Η along the width direction W on the circuit formation surface R. This is to prevent the treatment liquid S from generating a turbulent flow T and a liquid accumulation U in the conveying direction V on the circuit formation surface R of the printed wiring board P (see Fig. 5-1, 6-1, 6-2). Figure). The air blowing section 6 will be described in more detail below. As shown in Figures 1-1 to 3, inside the processing chamber of the substrate processing device 5, the air duct 9 is spaced at a predetermined height from the printed wiring substrate P (closer to the printing than the aforementioned sprinkler pipe 7). The height level of the wiring base sheet P side), if it is the example in Figures 1-1, 1-2, and 1-3, it is located on the upper and lower sides, and if it is in Figures 2-1, 2-2, and 2_3 For example, it is located on the upper side. In addition, the 'air duct 9' is arranged on the upper side and the lower side in order to cover the entire width of the printed wiring substrate sheet P in addition to the width direction W, and is also arranged in parallel with the sprinkler pipe 7 before and after the conveyance direction V. In other words, the air ducts 9 are arranged in groups of two, and are arranged in parallel before and after the sprinkler ducts 7. Each of the air ducts 9 is provided with an air blow-out portion 6 on a surface (a lower surface and an upper surface) facing the printed wiring board P. The air blowing section 6 has a slit shape that is linear along the width direction W as shown in Figs. 3 and 4-2.

-21-595285 V. Description of the invention (20) The blow-out port 1 0 blows the air E into a curtain-like force, and blows out in a straight line along the width direction W as shown in Figure 4-3. The assembly of the holes 11 blows the air E in a continuous curtain-like manner as a whole. The air E is sent from the air source such as a blower, an air compressor, an air pump, a fan, and the like to the air pipes 9 through the air pipes 12. Then, the air E is strongly blown from the air blowing portion 6 of each of the air ducts 9 toward the printed wiring board material P. Air E is a film-like printed wiring substrate sheet P, and if it is the figure 1-1, 1-2, 1-3, it is blown strongly to the circuit formation surface R on the surface Q and the back F, if it is the second The examples in Figures 1-2, 2-3, and 2-3 are strongly blown to the circuit formation surface R on the inside F. That is, the upper and lower spaces of the printed wiring board material P are formed before and after the treatment liquid S sprayed from the nozzle 4, and the film of the air E blown from the two air blowing portions 6 is formed. The air E blown onto the circuit formation surface R of the printed wiring substrate P is shown in Fig. 4-1. If it is the example of Figs. 1-1, 1-2, and 1-3, it is the circuit formation surface on the surface Q Above R and directly below the circuit forming surface R of the inner F. If it is the example of Figs. 2-1, 2-2, and 2-3, the widths above the circuit forming surface R of the surface Q are respectively along the left and right widths. The direction W forms an air region G having a certain front-back width. That is, two sprayed air regions G are formed before and after the processing liquid S of one sprayed region is held in the middle. Therefore, the treatment liquid S of the spray area is formed on the surface Q and the circuit formation surface R of the printed circuit board substrate P to form a width along the left and right sides.

-22- 595285 V. Description of the invention (21) The flow path Η in the direction W, the width of the flow path of the processing liquid S is limited to a certain direction and flows to the left or right and left and right sides. In addition, if the air E is hot air having a temperature of about 40 ° C to 50 ° C, it is approximately the same as the temperature of the etching solution, for example. The air blowing section 6 is as described above. (Functions, etc.) The substrate processing apparatus 5 of this invention is comprised as mentioned above. Its function is as follows. This substrate processing apparatus 5 is used for manufacturing a printed wiring board C, and processes the printed wiring board P at the same time. For example, it is used in the manufacture of modular substrates, and microcircuits and semiconductor components are assembled on the circuit formation surface R, so that a printed wiring board C for multi-stage and multilayer buildup can be manufactured later. ① First, this substrate processing apparatus 5 is used for each operation of the manufacturing operation of the printed wiring board C, for example, a development operation, an etching operation, a peeling operation, and a cleaning operation. ② The printed wiring board P, which is fed into the substrate processing apparatus 5, contains double-sided substrates and single-sided substrates, and these are placed on a conveyor belt in a horizontal posture and transported. In other words, the substrate processing apparatus 5 for a double-sided substrate shown in FIGS. 1-1, 1-2, and 1-3 is provided with a printed wiring base plate material P on a surface Q (upper surface) and a back surface F (lower surface). The system is placed on the frame 14 and the outer sides of the circuit formation surface R on the inside F (lower side) are held by the rollers 16 of the conveyor belt 2. In addition, for single-sided substrates in Figures 2-1, 2-2, and 2-3-23- 595285 V. Description of the invention (22) The substrate processing device 5 includes a circuit forming surface R on a surface Q (upper surface). The printed wiring board P is placed on the roller 3 of the conveyor belt 2, and the inner surface F (lower side) thereof is held in contact with the roller 3. That is, these conveyor belts 2 do not use the wheels 13 (see Figs. 5-1, 5-2) that are contact-extruded on the surface Q of the printed wiring board P and the circuit-forming surface R on the back F, and pressing The roller 3 is used, and the roller 3 'is used to restrict the flow of the processing liquid S (refer to FIG. 6-3). ③ In this way, in the substrate processing apparatus 5, the surface Q of the printed wiring board P and the circuit formation surface R on the back F are transported without contacting the conveyor belt 2. Therefore, the circuit formation surface may cause problems such as contact damage to the transmission belt, abrasion and the like. Therefore, the photoresist of the circuit formation surface R, copper foil, electroplating, circuit D, etc. do not collapse, dent, deform, or the like. ④ This substrate processing apparatus 5 sprays the processing liquid S from the nozzle 4 on the wiring-based plate material P thus transported. The nozzles 4 are arranged on the upper and lower sides of the printed wiring substrate sheet P, and spray the processing liquid S on the circuit formation surface R. For example, a chemical solution such as a developing solution, an etching solution, a peeling solution, and a treatment solution S such as a water washing solution and other washing solutions are sprayed. As for the nozzle 4, the sprinkler pipe 7 is arranged on the left and right width direction of the printed wiring board P, and the sprinkler pipe 7 with the nozzle 4 is arranged in the forward and backward conveying direction V. Multi-stage interval setting. ⑤ In addition, this substrate processing apparatus 5 uses strong blowing of air E

-24- 595285 V. Description of the invention (23) To the air blowing part 6 of the printed wiring board P. The air blowing section 6 is provided on the upper and lower sides of the printed wiring board material P to be transported, and is also provided before and after the nozzle 4, and blows air E strongly to the circuit formation surface R of the printed wiring board material P. The air blowing section 6 is provided on the air pipe 9, which is provided in the width direction of the printed wiring base plate P, and is parallel to the sprinkle pipe 7, and is arranged in pairs before and after the sprinkle pipe 7. The air ducts 9 provided with such an air blowing section 6 are arranged in groups of two, and are arranged at intervals in the conveying direction V. In addition, the air blowing section 6 may have a slit-shaped blowing outlet type (refer to FIGS. 3 and 4-2) and an assembly type of the blowing hole 11 (refer to FIG. 4-3), and blow the air E strongly in a curtain shape. . ⑥ In this substrate processing apparatus 5, the blown-out air E is on the circuit formation surface R of the printed wiring substrate P, and an air region G is formed along the width direction W (see FIG. 4-1). That is, if the substrate processing apparatus 5 for a double-sided substrate is used (refer to FIGS. 1-1, 1-2, and 1-3), the circuit formation surface R on the surface Q of the printed wiring base sheet P and the back surface F Directly below the circuit forming surface R, air regions G are formed. In the case of the substrate processing apparatus 5 for a single-sided substrate (refer to FIGS. 2-1, 2-2, and 2-3), an air region G is formed above the circuit formation surface R on the surface Q. Therefore, the treatment liquid S of the sprayed spray area is held by the front and rear air areas G, thereby restricting the flow on the circuit formation surface R on the surface Q and the inside F, and the width before and after the formation is limited to be constant, along the width The flow path flowing in the direction W. Thereby, the prevention of turbulent flow T and effusion u is restricted (-25-595285 V. Description of the invention (24) Refer to Fig. 6-2, etc.). When the substrate processing device 5 for the double-sided substrate shown in FIG. 1 is used, the spaced printed wiring base sheet P in the upper and lower air blowing portions 6 faces up and down, and the pressure is equalized by the up and down force. The pressure of the blown air allows the printed wiring board material P in transit to be accurately positioned and held. Therefore, preventing sagging, bending, meandering, jumping, falling off, etc. 'has the advantage of ensuring smooth and stable transportation. In the case of the substrate processing apparatus 5 for a single-sided substrate shown in FIG. 2, the printed wiring substrate sheet P being transported is pressed toward the lower conveyor belt 2 by the blowing pressure of the air E. Thereby, it can prevent sagging, bending, meandering, jumping, falling off, etc., and has the advantage of ensuring smooth and stable transportation. In this way, on this substrate processing apparatus 5, the processing liquid S of the spraying area is forcibly and surely restricted to flow in the width direction W and processed on the circuit formation surface R of the printed wiring base plate P as expected. It flows out from the left and right sides of the printed wiring base sheet P, drops, and is collected (see Figure 4-1). If the processing liquid S is the example in Figures 1-1, 1-2, and 1-3, the nozzle 4 corresponding to the slope flows through the circuit forming surface R above the surface Q and directly below the circuit forming surface R of the inner F toward the left. After flowing in the right or right direction, it flows down from both sides. In the case of the figures 2-1, 2-2, and 2-3, the nozzle 4 corresponding to the slope flows through the circuit forming surface R on the surface Q and flows to the right or left, and then flows down from both sides. Therefore, the processing liquid S is reliably prevented from being scattered on the circuit formation surface R,

-26- 595285 V. Description of the invention (25) A turbulent flow T is formed in the conveying direction V, or a stagnant fluid U is left in the center of the circuit formation surface R (refer to Fig. 5-1, Figs. 6-1, 6- 2 pictures, etc.). ⑧ Thus, the update of the processing liquid S on the surface Q of the printed wiring substrate P and the circuit formation surface R of the inner F is promoted, thereby preventing the processing from being slow or fast, excessive, or insufficient. For example, it is assumed that after the turbulent flow T and the effusion U are generated, the chemical processing speed will be different when chemical treatment is performed with the chemical solution, and the chemical processing will be slowly and inadequately and the chemical processing will be too fast and excessive. Excessive, insufficient, error, useless, etc. occur in the width of the formed circuit D. In addition, when the cleaning treatment is performed with a cleaning solution, the cleaning operation cannot be performed smoothly. However, the present invention can avoid such a situation. In this way, with the substrate processing apparatus 5, the circuit formation surface R of the printed wiring base plate material P can be uniformly processed, thereby achieving overall uniform processing.印刷 A printed wiring board C manufactured using such a substrate processing apparatus 5 has a double-sided substrate having a circuit D formed on the surface Q and the back surface F, and a single-sided substrate having a circuit D formed on the surface Q. In this way, the printed wiring board C is also used as it is, and it is also used in combination with a double-sided substrate manufactured separately and laminated with a single-sided substrate into a plurality of stages and layers, such as a modular substrate. (Effects of the invention) (Features of the present invention) The features of the substrate processing apparatus according to the present invention are as described above.

-27- 595285 V. Description of the Invention (26) The manufacturing process of the printed wiring board is to transport the printed wiring board without contacting the surface of the printed wiring board and the circuit forming surface inside. The front and rear air blowing portions forcefully blow out air to form a flow path of the processing liquid in the left-right width direction. Therefore, the present invention exhibits the following effects. (First effect) First, prevent turbulence and fluid accumulation, and improve the accuracy of printed wiring boards. That is, in this substrate processing apparatus, an air region is formed on the surface of the printed wiring board material and the circuit formation surface on the inside thereof, whereby the processing liquid flows toward the left and right width direction flow paths. It can prevent the turbulent flow and fluid accumulation like the aforementioned conventional example, thereby promoting the renewal of the processing fluid, preventing the processing from being too slow or too fast, excessive, or insufficient, eliminating the unevenness of the processing, and achieving uniform overall processing. Therefore, greatly improving accuracy is extremely significant for printed wiring boards that are moving toward higher density and miniaturization of circuits. (Second effect) Second, prevent problems such as damage and greatly reduce defective products. In other words, this substrate processing device realizes the above-mentioned first point by the strong blowing of air. Unlike the previous conventional examples, the substrate and the circuit are pressed and contacted by rollers, limiting rollers, wheels, etc., and the circuit on the surface and inside is realized. The forming surface is transported without contact. Therefore, there is no damage to the circuit formation surface and the circuit, and to the printed wiring board which is progressing toward higher density and miniaturization of the circuit, the production rate of defective products is greatly reduced 'and the yield is significantly improved. Especially modular

-28- 595285 V. Description of the Invention (27) The situation of the substrate is of great significance for the assembly of semiconductor parts into circuits. In this way, the problems existing in the conventional examples are completely solved, and the effect exerted by the present invention is both significant and large. (Brief description of the drawings) Figures 1 to 1 are used to explain an example of the embodiment of the substrate processing apparatus related to the present invention (for a double-sided substrate), and the side portions of the main parts. The sectional view along the line arrow in Figure 1-2, Figure 1-3 is the plan view (bottom view) of the main part. Fig. 2-1 is a diagram for explaining another example of the embodiment of the present invention (for a single-sided substrate). The main part is a side part. Fig. 2-2 is a section along the arrow AA of Fig. 2-1. Figure 2-3 is a sectional view of the arrow along line BB of Figure 2-1. Fig. 3 is a sectional view for explaining an embodiment of the present invention, and is a main part. Fig. 4-1 is a plan view (bottom view) for explaining the main part of the circuit forming surface of the printed wiring board material according to the embodiment of the present invention, and Fig. 4-2 is a bottom view of an example of the air blowing part ( (Plan view), Figure 4-3 is a bottom view (plan view) of another example of the air blowing part. Figure 5-1 is a side view of the main part of the conventional substrate processing apparatus (for a double-sided substrate), and Figure 5-2 is an arrow along the KK line of Figure 5-1. Sectional view. Figure 6-1 is a side view of a substrate processing device (for single-sided substrates) used in this type of conventional example. The side view of the main part of one example. Figure 6-2 is a circuit-29-595285. (28) The plan view (bottom view) of the main part that forms the surface. Figure 6-3 is a side view of the main part of other examples. Fig. 7 is a plan view (bottom surface) of a printed wiring board (material). (Description of symbols) 1 ... substrate processing device (conventional example of this type) 2 ... conveyor belt 3 ... roller 3 '... limiting roller 4 ... nozzle 5 ... substrate processing device (invention) 6 ... air blowing section 7 ... sprinkle Liquid pipe 8 ... Process liquid pipe 9 ... Air pipe 10 ... Slot-shaped blower outlet 11 ... Blowout hole 12 ... Air line 1 3 ... Wheel 1 4 ... Frame 15 ... Opening 16 ... Roller 17 ... Frame C ... Printing wiring Substrate D ... Circuit -30- 595285 V. Description of the invention (29) E ... Air F ... Inside G ... Air zone Η ... Flow path P ... Printed wiring board Q ... Surface R ... Circuit formation surface S ... Treatment liquid T ... Messy Flow U ... Hydrogen V ... Transportation direction (front-back direction) w ... Width direction (left-right direction) Υ ... Edge -31-

Claims (1)

595285 VI. Application for Patent Scope 1. A substrate processing device used for the production of printed wiring substrates, which is characterized by having a conveyor belt for conveying printed wiring-based boards without contacting the circuit formation surface. The nozzle for spraying the processing liquid on the base plate, and the air blowing part which strongly blows air to the printed wiring base plate. 2. If the substrate processing device of the first patent application scope, wherein the conveyor belt transports the printed wiring board material having the circuit forming surface on the front and back sides to keep the two outer sides of the circuit forming surface inside in a horizontal posture, and transports it, The nozzles are arranged on the upper and lower sides of the printed wiring board material being conveyed, and the processing liquid is sprayed on the circuit forming surface, and the air blowing portions are provided on the upper and lower sides of the printed wiring board material being conveyed, and Also provided before and after the nozzle, the air is strongly blown out of the circuit forming surface. 3. For the substrate processing device of the second patent application range, wherein the conveyor belt transports the printed wiring board material together with the frame, and the frame machine exposes the circuit formation surface of the printed wiring base material at the central opening. At the same time, the inner edge of the printed wiring board is received and fixed, and the rollers of the conveyor belt are arranged under the sides of the frame. 4. For the substrate processing device of the scope of application for patent No. 1 wherein the conveyor belt carries the printed wiring base plate provided with the circuit forming surface only on the surface, and transports the base plate in a horizontal posture in a state of being held in contact with the inside. The nozzle is provided on the upper side of the printed wiring board material being transported, and -32-595285 6. Scope of patent application The circuit forming surface sprays the treatment liquid, and the air blowing portion is provided on the printed wiring board material being transported, and is also provided in front of the nozzle, etc. The formation surface blows out air forcefully. 5. If the substrate processing device of the second or fourth item of the scope of patent application, the nozzle and the like are arranged on the sprinkler pipe, and the sprinkler pipe is arranged in the left and right width direction, covering the printed wiring board material. For the entire width, the air blowing part is provided on the air duct, and the air duct is provided in the width direction, covering the full width of the printed wiring board, and in parallel with the sprinkler pipe. . 6 · The substrate processing device according to item 5 of the patent application, wherein the function of the air that is strongly blown from the air blowing section is used to limit and prevent the processing liquid ejected from the nozzle or the like from being printed on the printed wiring board. The circuit forming surface of the plate becomes a turbulent flow and stagnant fluid in the forward and backward transportation direction. 7. The substrate processing apparatus according to item 6 of the patent application scope, wherein the air blown out from the air blowing section is formed on the circuit formation surface of the printed wiring base plate along the left and right width air regions. The processing liquid sprayed from the nozzle is restricted by the air area before and after the air flow, and a flow path along the width direction is formed on the circuit formation surface. 8. The substrate processing device according to item 7 of the patent application scope, wherein the substrate processing device is used for the developing operation, etching operation, or peeling operation of the printed wiring board material, and the nozzle is used to spray the developing solution, etching solution, or peeling operation. Treatment liquid of liquid medicine. -33-595285 6. Scope of patent application 9. The substrate processing device according to item 7 of the patent application scope, wherein the substrate processing device is used for the cleaning operation of the printed wiring board, and the nozzle is sprayed with water washing liquid for other cleaning液 的 此 处理 液。 Liquid of the treatment ... 10. The substrate processing apparatus according to item 7 of the scope of patent application, wherein the air blowing section is formed with a slit-shaped blowing outlet that is linear in the left and right width direction, and blows out the air with a curtain-like force. 1 1 · If the substrate processing device according to item 7 of the scope of patent application, the air blowing section is an assembly of a large number of blowing holes arranged in the left and right width direction, and the air is strongly and integrally formed as a continuous curtain. Blow out 〇2. The substrate processing device according to item 7 of the scope of the patent application, wherein the substrate processing device is used in the manufacture of a modular substrate, and a fine circuit is formed on the circuit formation surface of the printed wiring substrate, and at the same time Integrated semiconductor components are integrated for later use. -34 >