,1301820 九、發明說明： 【發明所屬技術領域】 本發明係有關薄物基板材的搬送裝置。即，有關表面處 理裝置的搬送裝置，在薄物電路基板之製造製程所使用，搬 送其基板材並進行表面處理。 【先前技術】 《技術的背景》 隨著電子機器之高性能化、高功能化、小型輕量化，亦 φ促進印刷配線基板等電路基板的高精密度化、精巧化、極薄 化、多樣化、所形成之電路顯著地高密度化、微細化。譬如， 亦出現絕緣層的厚度爲ΙΟμπι程度而電路之厚度亦爲ΙΟμπι 程度的印刷配線基板等，展現極薄化、薄物化，腰部顯著地 薄弱柔軟的撓性化。 而且，這種電路基板之製造製程，在各製程中，各自使 用表面處理裝置，表面處理裝置係以其搬送裝置對於要搬送 的基板材，各自噴射處理液，因此，進行基板材之藥液處理 善或洗淨處理。譬如對於基板材，依順序噴射顯像液、蝕刻液、 剝離液、洗淨液等之處理液，因此依順序來實施顯像、蝕刻、 剝離、洗淨等的表面處理，形成電路，並製造電路基板。 《先前技術》 第5圖、第6圖係提供這種先前例之說明，第5圖係表 面處理裝置全體的正剖面說明圖，第6圖係其搬送裝置等之 側面槪略圖，第6圖之（1 )圖係顯示全體，（2 )圖係顯示 其一例的重要部分，（3 )圖係顯示另一例之重要部分。 1301820 亦如上述圖所示，顯像裝置、蝕刻裝置、剝離裝置、洗 淨裝置等，這種表面處理裝置1，係使基板材A被夾持在搬 送裝置2之上下的搬送滾筒3，來水平搬送且從噴射噴嘴4 來噴射處理液B，因此，來進行預定之藥液處理或洗淨處理 等的表面處理，來形成電路，並來製造電路基板。 而且，這種作爲表面處理裝置1之搬送裝置2的搬送滾 筒3，先前一向使用直形滾筒，這種搬送滾筒3在上下方向 C上下成對，並在前後之搬送方向D列設多數，將基板材A φ 從上下夾持來進行接觸旋轉，因此水平搬送基板材A。又， 噴射噴嘴4係在噴射區域E中，在要搬送的基板材A之上下 對向位置，並來噴射處理液B。 還有第5圖中，F係顯示與搬送方向D垂直之寬度方 向，5係表面處理裝置1的室，6係處理液B之液槽，7係 配管，8係泵。 《先前技術文獻資訊》 這種先前例，譬如可例舉以下專利文獻1中所示者。 φ 〔專利文獻1〕日本專利特開2002-009420號公報 【發明內容】 〔發明揭示〕 〔發明所欲解決之問題〕 《關於問題點》 但是，對於這種先前例之表面處理裝置1的搬送裝置 2，被指摘有以下之問題。 即，這種基板材A，如前述顯著地極薄化，腰部薄弱柔 1301820 軟。而且，對於這種基板材A，使處理液B隨著噴射壓或重 量噴射。因此，將基板材A以搬送裝置2之搬送滾筒3來水 平搬送，且從噴射噴嘴4來噴射處理液B時，則基板材A 不能以搬送滾筒3穩定保持，產生許多各種之搬送事故，形 成問題。 即，關於基板材A，對搬送滾筒3產生許多附著、捲纏、 卷入、吸著、或彎曲、捲折、鈹紋、彎曲、折曲、折痕、腰 折、或滑動、鉤住、下垂、掉落、擦傷、損傷等之搬送事故 φ G。這樣，先前例的這種搬送裝置2在穩定搬送產生許多困 難，在要求高精密度之基板材A的表面處理亦產生障礙之事 態等，使基板材A之穩定保持、穩定搬送成爲殷切的期待。 特別，對於顯著極薄化之基板材A，穩定保持、穩定搬 送幾乎被視爲困難的狀況下，另外，極薄化之需求最近愈來 愈高漲。 《關於本發明》 有關本發明之薄物基板材的搬送裝置，係鑑於這樣之實 #情爲了要解決上述先前例的問題，發明人經銳意硏究努力之 結果所發明。 而且，本發明係提供一種薄物基板材的搬送裝置，其目 的爲：第1、在基板材產生腰部來賦予強度，因此來實現穩 定保持、穩定搬送，第2、使基板材在前後之搬送滾筒間順 暢地移動下去，從這個層面亦可實現穩定保持、穩定搬送。 〔解決問題之手段〕 《關於申請專利範圍》 1301820 解決這種問題之本發明的技術手段係如下所述。首先對 於申請專利範圍第1項所記載之發明，係如下所述。 申請專利範圍第1項所記載之薄物基板材的搬送裝置， 係在薄物電路基板之製造製程中，搬送基板材並進行表面處 理的表面處理裝置中所使用。 而且，其特徵爲：採用大徑部及小徑部慢慢地重複而形 成的波浪狀的搬送滾筒。 申請專利範圍第2項係如下所述。申請專利範圍第2項 φ 所記載之薄物基板材的搬送裝置，係如申請專利範圍第1 項，其特徵爲：該搬送滾筒係直徑在軸方向，由大朝小而且 由小朝大重複進行，且慢慢地來變化成平穩的錐形，並使該 大徑部及小徑部，以預定之間距及高度連續地形成的多數。 申請專利範圍第3項係如下所述。申請專利範圍第3項 所記載之薄物基板材的搬送裝置，係如申請專利範圍第2 項，其特徵爲：該基板材係厚度極薄又柔軟，並以該搬送滾 筒水平搬送。而且該表面處理係從各噴射噴嘴，將由藥液或 φ洗淨液構成的處理液，藉由對該基板材噴射所進行。 對於申請專利範圍第4項係如下所述。申請專利範圍第 4項所記載之薄物基板材的搬送裝置，係如申請專利範圍第 3項，其特徵爲：該搬送滾筒係上下成對來進行接觸旋轉， 並在前後之搬送方向保存稍微的相互間隙並列設多數。而 且，在上下之該搬送滾筒間，該大徑部及小徑部係對應位 置，而在前後之該搬送滾筒間，該大徑部及小徑部亦依順對 應位置。 1301820 申請專利範圍第5項係如下所述。申請專利範圍第5項 所記載之薄物基板材的搬送裝置，係如申請專利範圍第4 項，其特徵爲：上下之該搬送滾筒係在該大徑部及小徑部間 夾入該基板材並搬送，且前後之該搬送滾筒係在該大徑部及 小徑部間交接該基板材並搬送。 而且，該基板材係藉由此等使凹凸形成爲彎曲狀，藉此 產生腰部以賦予強度且被搬送。 申請專利範圍第6項係如下所述。申請專利範圍第6項 φ 所記載之薄物基板材的搬送裝置，係如申請專利範圍第4 項，其特徵爲：前後之該搬送滾筒係在該大徑部及小徑部間 交接該基板材並搬送。而且該基板材係利用前後之該大徑部 及小徑部的外周旋轉速度之差，及形狀上相互咬入，而在前 後之搬送滾筒間順暢地交接移載而被搬送。 《作用等》 本發明之薄物基板材的搬送裝置，係由這樣之手段所構 成，所以形成如下。 φ (1) 該搬送裝置係在薄物電路基板之製造製程中， 使用在藥液處理製程或洗淨製程的表面處理裝置。 (2) 而且，基板材係以搬送裝置之搬送滾筒搬送， 且從噴射噴嘴噴射由藥液或洗淨液而成的處理液，而被表面 處理。 (3) 搬送裝置之搬送滾筒係上下成對來進行接觸旋 轉，並在前後之搬送方向保存稍微的相互間隙，並列設多數。 (4) 而且，該搬送裝置係採用波浪狀之搬送滾筒。 -10- J3Q1820 即，該搬送滾筒係直徑在軸方向由大朝小而且由小朝大重複 進行，且慢慢地變化成平穩的錐形，因此使大徑部及小徑部 以預定之間距及高度連續地形成多數。 (5 ) 而且，在上下之搬送滾筒間，該大徑部及小徑 部係對應位置，而在前後之搬送滾筒間，大徑部及小徑部亦 依順對應位置，而上下之搬送滾筒係在大徑部及小徑部間夾 入基板材並搬送，而前後之搬送滾筒係在大徑部及小徑部間 交接基板材並搬送。 φ ( 6) 且因此，以該搬送裝置所搬送之基板材，係藉 由在上下的搬送滾筒之大徑部及小徑部間夾入，而在左右的 寬度方向賦予固定周期的平穩之彎曲凹凸形狀，因此產生腰 部以提高強度。進而，彎曲形狀係藉由前後之搬送滾筒的大 徑部及小徑部，亦追加地形成在前後之搬送方向，從這層面 亦可提高基板材的強度。 基板材係顯著極薄化且柔軟，且處理液隨著噴射壓或重 量噴射，但這是足以承受，而穩定保持、穩定搬送。 Φ ( 7) 進而，該搬送裝置係使搬送滾筒之大徑部的外 周圍旋轉速度比小徑部更快，所以在前後之搬送滾筒間，將 基板材形成從小徑部朝向大徑部拉入。進而，前後之搬送滾 筒間，係使大徑部及小徑部相互地咬入。藉此，在前後之搬 送滾筒間，基板材確實且容易地移載，形成順暢地搬送。 (8 ) 且因此，本發明之薄物基板材的搬送裝置係發 揮以下第1、第2效果。 〔發明效果〕 -11- •1301820 《第1效果》 第1、在基板材產生腰部以賦予強度，因此消除搬送事 故，而實現穩定保持、穩定搬送。 即，本發明之薄物基板材的搬送裝置，係藉由採用波浪 狀之搬送滾筒，在基板材賦予彎曲凹凸形狀，因此可在被搬 送的基板材產生腰部以提高強度，使耐負荷性增強。 基板材係顯著極薄化且柔軟撓性，且處理液隨著噴射壓 或重量噴射，但其足以承受，而穩定保持，穩定搬送。 _ 因此，前述這種先前例中被指摘的，對搬送中之基板材 的搬送滾筒產生的附著、卷纒、卷入、吸著、或彎曲、捲折、 皺紋、彎曲、折曲、折痕、腰折、或滑動、鉤住、下垂、掉 落、擦傷、損傷等，確實被防止。使基板材無搬送事故地被 搬送，實現精密度高的表面處理。 《第2效果》 第2、使基板材在前後之搬送滾筒間，順暢地移動下去， 從這個層面，亦可實現穩定保持、穩定搬送。 即，本發明之薄物基板材的搬送裝置，係藉由採用波浪 胃狀之搬送滾筒，在前後之搬送滾筒間，從其小徑部朝大徑 部，將基板材順暢地交接移載下去。 因此’從這個層面亦確實地防止前述這種先前例中被指 摘之基板材搬送事故之產生，而實現高精密度之表面處理。 這樣’對解決存在這種先前例之全部問題等，本發明發 揮的效果有顯著又重大者。 【實施方式】 〔實施發明之最佳形態〕 -12- 观 1820 《關於圖式》 以下，將有關本發明之薄物基板材的搬送裝置，根據圖 式所示實施發明之最佳形態，來詳細加以說明。第1圖、第 2圖、第3圖、第4圖，係提供實施本發明之最佳形態的說 明。 而且，第1圖之（1)圖係搬送裝置的搬送滾筒之正面 圖（平面圖），（2 )圖係搬送裝置的正面圖，第2圖係搬 送裝置之重要部分的平面圖。第3圖係表面處理裝置全體之 φ 正剖面說明圖，第4圖係側剖面說明圖。 還有第7圖係電路基板（基板材）的模式化之平面說明 圖。 《關於電路基板Η》 該基板材Α之表面處理裝置9的搬送裝置10,係使用 在電路基板Η之製造製程。因此首先參考第7圖，對於電路 基板Η之槪略情況加以說明。 電路基板Η係AV機器、個人電腦、行動電話、數位相 φ機、其他各種電子機器中，使用在電連接用，爲了來連接零 件間之電路J圖案，形成於絕緣層的外表面或內部而構成。 而且電路基板Η係分成單面基板及兩面基板之外，亦有 多層基板（含最近之增層法的基板），其他各種基板，又， 亦可分成，硬質的剛性系基板及薄膜狀之撓性系基板。撓性 系基板的絕緣層係由聚醯亞胺製薄膜、其他之樹脂製薄膜所 構成。 又，作爲這種電路基板Η之一環，係1C、LSI元件、從 -13· 1301820 動零件、驅動零件、電容器等等的半導體零件，與電路j以 一體所組裝之模組基板（半導體一體型的封裝基板），或在 玻璃基材一起埋入有電路j和半導體零件之玻璃基板’即電 漿顯示板PDP用的玻璃基板或液晶LCD用玻璃基板，進而 CSP、PBGA等亦出現。當然，本說明書中所謂電路基板Η， 除了先前技術的印刷配線基板之外，亦包含這些廣泛的基 板。 而且電路基板Η係隨著電子機器之高性能化、高功能 0 化、小型輕量化，亦促進高精密度化、精巧化、而且薄物化、 極薄化、柔軟化、撓性化、進而多層化、多樣化等，在外表 面（表面或背面）所形成的電路J，進而在內部所形成之電 路J顯著地高密度化、微細化。 電路基板Η譬如印刷配線基板，當製造時使1片之縱橫 的切割尺寸，譬如由5 0 0 m m X 5 0 0 m m程度所構成。厚度係使 絕緣層（心材）部分，先前技術從1.6mm到1 .Omm〜60μπι 程度，現在則從50μιη到ΙΟμπι左右，被極薄化。電路J部 0分（銅箔部分）的厚度，亦先前技術爲75μιη〜35μίη，而現 在係16μπι〜ΙΟμπι左右，被極薄化。 多層基板之情況，亦持續被極薄化至全體的厚度爲 1.0mm〜0.4mm程度。電路J寬度或電路J間空間，亦先前 從3 0 μ m〜1 5 μ m程度，而現在係1 0 μ m左右而有微細化傾向。 電路基板Η係形成這樣槪略的構成。 《關於電路基板Η之製造方法的1例》 其次，關於使用該基板材Α之表面處理裝置9及搬送裝 -14- • 1301820 置10的電路基板Η之製造方法，參考第7圖等加以說明。 首先，對於第1例的製造方法加以陳述。該製造方法中，電 路基板Η譬如印刷配線基板，係根據以下之步驟所製造。 最先，在玻璃布製、陶瓷製、或聚醯亞胺製、其他薄膜 狀樹脂製之絕緣層（心材）的外表面，使銅箔藉由熱加壓等 而貼著，以準備貼銅積層板也就是基板材Α。 而且，對於這樣所準備之基板材A，粗化所貼著的銅箔 表面來進行表面粗化處理（軟蝕刻）之後，切斷成短形的加 φ 工件尺寸之各片。表面粗化處理於先前技術係藉由機械硏磨 進行，但最近係利用噴射由表面粗化液而成的處理液B所進 行爲多。 而且多數之情況下，通孔用之穿孔加工係使用雷射等而 實施。通孔係由基板材A (電路基板Η)的兩外表面間之微 細的貫通孔所構成，一片形成數百個以上極小直徑之通孔， 而其直徑係〇.5mm〜0.2mm程度以下的直徑爲多。而且，通 孔係用於作爲兩外表面之電路J (銅箔）間或多層基板的電 •路J (銅箔）間之導通連接用，或安裝於電路J的半導體零 件之安裝用。 還有最近，取代需要穿孔加工之通孔，形成小突起狀、 略圓錐梯形的接點也就是凸出，因此對於多層基板等，亦開 發有藉由該凸出，來實現與通孔同樣之功能的技術。凸出係 以電路〗爲準，根據顯像製程、蝕刻製程、剝膜製程等之表 面處理製程而製造。 且然後’在基板材A之銅箔的外表面，將感光性之抗蝕 .1301820 劑塗布或貼著成膜狀。之後，藉由對電路j的負片也就是預 先設計有電路j之電路j照片進行曝光，使外表面的抗蝕劑 被曝光而留下硬化後的電路j形成部分，而其他不要部分， 係藉由噴射處理液B也就是鹼性之顯像液，來溶解除去。 然後，這種基板材A之銅箔係藉由噴射處理液B也就是 蝕刻液（氯化第二銅、氯化第二鐵、其他腐蝕液），來溶解 除去、蝕刻不要的部分，該不要的部分係抗蝕劑硬化，留下 被披覆的電路J形成部分（保護膜部分），並藉由顯像來溶 φ 解除去抗蝕劑而露出。然後，使留下之電路J形成部分的抗 蝕劑，藉由處理液B也就是鹼性之剝離液的噴射而剝離除 去，因此，以留下之電路J形成部分的銅箔，在基板材A之 外表面，來形成預定導體圖案的電路J，並來製造電路基板 Η 〇 又，上述之顯像製程、蝕刻製程、剝膜製程，爲了後處 理用，或剝膜製程之後集中後處理用，而附設有洗淨製程， 係噴射水洗液、中和劑液、其他洗淨液作爲處理液Β，所附 φ設的洗淨製程。該洗淨製程係使附著於基板材Α之外表面 (含通孔內等）的顯像液、蝕刻液、剝離液等之處理液B被 洗淨、除去。 進而，在洗淨製程之後，附設有乾燥製程。即，在洗淨 製程所洗淨的基板材A之外表面（含通孔內等），附著有處 理液B也就是水洗液及其他洗淨液，或此等的水分，所以爲 了防止氧化等而必須除去此等，事後立刻在乾燥製程進行乾 燥處理。 -16- •1301820 第1例之製造方法是由這種濕式處理法所構成。第1例 的製造方法係形成如此。 《關於電路基板Η之製造方法的另外例》 其次，對於第2例之製造方法來加以陳述。作爲電路基 板Η譬如印刷配線基板的製造方法，上述之第1例的濕式處 理法係代表性之例，但第2例之半加成（semiadditive)法亦常 被使用。 半加成法中，首先在預先形成有通孔的基板材A之外表 φ 面，來施予無電鍍銅。然後，在該無電鍍銅，將感光性抗蝕 劑塗布或貼著成膜狀之後，對電路：Γ底片也就是電路：T照片 進行曝光。而且，抗蝕劑係被曝光，留下硬化後的部分，並 使另外部分也就是電路J形成部分，藉由噴射處理液B也就 是顯像液而溶解除去。 然後，對電路J形成部分，即藉由顯像使抗蝕劑被溶解 除去後的鍍圖案部分，也就是無電鍍銅露出之部分，施予電 鍍銅，而形成電路I。還有，留下的硬化後之電路J形成部 0分以外的抗蝕劑，係藉由噴射處理液B也就是剝離液來剝離 除去，使露出之無電鍍銅，藉由噴射處理液B也就是蝕刻液 來快速蝕刻，而溶解除去。還有，作爲各製程之後處理用， 而以前述所述爲準’附設將洗淨液作爲處理液B的洗淨製程 或乾燥製程。 第2例之半加成法中，這樣一來，即以電鍍銅來形成電 路J，因此製造電路基板Η。第2例之製造方法係形成這種 構成。 •130.1820 但是’印刷配線基板及其他電路基板Η之製造方法，最 近愈來愈多樣化，除了上述之第i例、第2例以外，各種方 法亦被開發、使用。本發明當然亦適用於這些各種的電路基 板Η之製造方法。 電路基板Η之製造方法係形成這樣構成。 《關於表面處理裝置9》 首先’對於使用本發明之基板材Α的搬送裝置10之表 面處理裝置9，參考第3圖、第4圖等加以說明。該表面處 φ理裝置9係電路基板Η之製造製程所使用，用於搬送基板材 Α並進行表面處理。 即表面處理裝置9係在電路基板Η之製造製程，譬如表 面粗化製程、其他前處理製程、顯像製程、飩刻製程、剝膜 製程、洗淨製程、其他後處理製程等中，譬如，作爲表面粗 化裝置、顯像裝置、蝕刻裝置、剝離裝置、或洗淨裝置所使 用。而且，對於要以搬送裝置10搬送之基板材A，各自噴 射例如表面粗化液、顯像液、蝕刻液、剝離液、或洗淨液等 φ的處理液B，將基板材A進行藥液處理、洗淨處理等表面處 理。 而且，表面處理裝置9係在處理室也就是室5內，具有： 將基板材A在搬送方向D搬送之輸送帶，也就是搬送裝置 1 〇 ;及在要搬送的基板材A噴射處理液B的噴射噴嘴4。 噴射噴嘴4係在噴射區域E中，與要搬送的基板材A 對置配設，譬如噴射表面粗化液、顯像液、蝕刻液、剝離液、 或洗淨液等處理液B。 -18- •1301820 即噴射噴嘴4係以搬送裝置10之搬送滾筒11在要水平 搬送基板材A的正上方或正下方，各自保存上一F間隔，並通 過前後之搬送方向D及左右的寬度方向F，隔著預定間距間 隔配列多數。還有，在配設有噴射噴嘴4之噴射區域E中， 僅該處欠缺搬送滾筒1 1的配設。 處理液B係從液槽6通過泵8或配管7，被壓送到各噴 射噴嘴4，並噴射在基板材A。而且將基板材A之外表面， 朝向寬度方向F的左方向或右方向流動並進行表面處理之 φ後，從基板材A的左右兩側來往下流，在液槽6被回收，事 後亦被循環所使用。 表面處理裝置9係形成這樣構成。 《關於搬送裝置1 0》 以下，對於這種表面處理裝置9所使用的搬送裝置10, 參考第1圖、第2圖、第3圖、第4圖等，來加以說明。 首先，該基板材A之搬送裝置10,係配設在基板材A 的表面處理裝置9之室5內，具備多數之搬送滾筒11。而且， 修搬送滾筒1 1，係在上下方向C上下成對，組合成須接觸旋 轉而配設，且在前後之搬送方向D保存稍微的相互前後間 隙，並組合多數而列設。 即，搬送滾筒1 1係在進行接觸旋轉之上下相互間夾持 基板材A來壓接保持（噴射區域E除外），將基板材A在 搬送方向D搬送，並上下一起在前後之搬送方向D列設多 數（噴射區域E除外）。 而且，該搬送裝置10中，上位之搬送滾筒11及下位的 -19- 1301820 搬送滾筒1 1，係由對其軸1 2安裝固定之驅動滾筒所構成。 即，搬送滾筒1 1係經由被安裝固定之軸1 2、及驅動齒 輪等，連接在馬達等驅動機構，而旋轉驅動。第1圖、第2 圖中之1 3係輸送帶框架，將搬送滾筒1 1的軸1 2在左右來 保持成轉動自如。 還有，作爲基板材A之搬送形態，圖示的水平搬送係代 表性的形態，但亦可考慮傾斜搬送或縱向搬送。即圖示例， 搬送裝置10之搬送滾筒11，係將其軸12朝向左右的寬度方 φ 向F水平配設，但亦可傾斜配設或縱向配設，因此基板材a 係在水平姿勢之水平搬送以外，亦有從水平以傾斜的姿勢來 傾斜搬送，或以縱向姿勢來縱向搬送的情況。 當然，該傾斜搬送或縱向搬送之情況下，噴射噴嘴4亦 對於基板材A，從上下對置姿勢來配設成傾斜的姿勢或在左 右。 搬送裝置1 〇係形成這樣的槪略構成。 《關於波浪狀之搬送滾筒11》 # 而且，該搬送裝置10係採用波浪狀之搬送滾筒11。對 於該搬送滾筒11，特別參考第1圖、第2圖、進而第3圖、 第4圖來加以說明。 波浪狀之搬送滾筒1 1，係大徑部14及小徑部1 5慢慢重 複形成而構成。即搬送滾筒1 1係直徑從大朝小而且從小朝 大，一面重複一面慢慢變化成平穩之錐形狀，該直徑係沿著 左右的寬度方向F也就是軸12方向，且與軸方向12垂直方 向（前後之搬送方向D )，因此大徑部14及小徑部15，以 -20- •1301820 預定的間距及高度連續地形成多數。 而且如圖示，在上下之搬送滾筒1 1間，大徑部i 4及小 徑部1 5係對應位置，在前後的搬送滾筒i 1間，大徑部14 及小徑部1 5亦依順序對應位置。 對於這種搬送滾筒1 1，來更詳細加以說明。搬送滾筒 1 1係譬如，亦表現成由將軸1 2置於左右之譬如圓錐台之反 轉重複形狀所構成，且著眼於其外表面時，亦表現成以固定 周期高低反複著凹凸。而且，其傾斜係平穩地慢慢形成，譬 φ 如對於水平從1、2度程度之傾斜角，形成到14、1 5度程度 之間的傾斜角。代表性係3、4度程度之傾斜角。 因此，該搬送滾筒1 1係大徑部1 4及小徑部1 5在軸1 2 方向順序重複，以預定間距及高度所形成。 而且，在上下方向C之上位的搬送滾筒11及下位之搬 送滾筒1 1間，上位的大徑部1 4及下位之小徑部1 5須配設 成對應位置，且使上位的小徑部15及下位之大徑部14須配 設成對應位置（噴射區域E除外）。 φ 又，沿著前後之搬送方向D的前側（上游側）之搬送滾 筒1 1，及後側（下游側）之搬送滾筒1 1間，前側的大徑部 14及後側之小徑部15須配設成對應位置，且前側的小徑部 15及後側之大徑部14須配設成對應位置。 且因此，該搬送裝置10中，上下之搬送滾筒11係在大 徑部1 4及小徑部1 5間夾持基板材A並搬送，而前後之搬送 滾筒1 1係在大徑部1 4及小徑部1 5間交接基板材A且搬送。 因此基板材A藉由此等，首先，使稍微之凹凸來形成爲 -21 - .1301820 彎曲狀，藉此產生腰部以賦予強度且被搬送。即基板材A係 於針對上下方向C觀察時，藉由夾入在上下的搬送滾筒n 間，而朝向左右的寬度方向F，依順序以預定之間距及稍微 的高低來形成凹凸。進而，這種上下之搬送滾筒11，藉由在 前後之搬送方向D交接，即使朝向前後之搬送方向D，亦依 順序以預定間距及高度來形成凹凸。 又，在前後之搬送滚筒1 1間，基板材A係利用前後的 大徑部1 4及小徑部1 5間之外周圍旋轉速度的差，及形狀上 φ 相互咬入，順暢地交接移載而被搬送。 即基板材A係於針對前後之搬送方向D觀察時，在從 搬送滾筒1 1的外周旋轉速度從更慢之小徑部1 5，朝向更快 的大徑部1 4交接的部位中，從前者朝向後者被積極的拉入。 又，搬送滾筒1 1係大徑部1 4咬入在對方之小徑部1 5，而小 徑部1 5咬入於對方的大徑部1 4。藉由此等，使基板材A順 暢地在前後之搬送滾筒1 1間交接、移載。 波浪狀之搬送滾筒1 1係形成這樣構成。 φ《關於作用等》 有關本發明之薄物基板材A的搬送裝置1 0，係如以上 說明所構成。因此，形成如下。 (1 ) 該搬送裝置1 〇，係印刷配線基板及其他薄物之 電路基板Η之製造製程中，在各種的藥液處理製程或洗淨製 程等之表面處理製程所使用。譬如，在其表面粗化裝置、顯 像裝置、蝕刻裝置、剝離裝置、洗淨裝置等的表面處理裝置 9所使用（參考第7圖、第3圖、第4圖等）。 -22 - 1301820 (2) 而且基板材A係於表面處理裝置9之室5內， 以搬送裝置10的搬送滾筒11水平搬送，且從各噴射噴嘴4, 來噴射由藥液或洗淨液而成的處理液B，以表面處理。 即，使厚度極薄且柔軟的撓性之基板材A，在表面粗化 裝置、顯像裝置、蝕刻裝置、剝離裝置、洗淨裝置等的表面 處理裝置9，來水平搬送，且使表面粗化液、顯像液、蝕刻 液、剝離液、洗淨液等的處理液B，分別被噴射，因此來進 行藥液處理或洗淨處理（參考第3圖、第4圖）。 |(3) 該表面處理裝置9之搬送裝置10的搬送滾筒 11，係在上下方向C，上下成對來進行接觸旋轉，並在前後 之搬送方向D，保存稍微的相互間隙且列設多數（參考第3 圖、第4圖）。 (4) 而且，該搬送裝置10係採用大徑部14及小徑 部1 5慢慢地重複所形成的波浪狀之搬送滾筒1 1。 即，該搬送滾筒1 1係使沿著軸1 2方向之直徑，從大朝 小而且從小朝大重複，慢慢來變化成平穩之錐形狀，使大徑 II部14及小徑部1 5也就是平穩的凹凸，以預定的間距及高度 來連續地形成多數（參考第1圖、第2圖）。 (5) 而且，該搬送裝置10中，在上下方向C之搬送 滾筒1 1間，大徑部14及小徑部1 5係對應位置（參考第丄 圖之（2)圖），又，在前後之搬送方向D的搬送滾筒11 間，大徑部1 4及小徑部1 5亦依順序對應位置（參考第2圖）。 因此，上下之搬送滾筒1 1係在對應位置的大徑部1 4及 小徑部1 5間，夾持基板材A且搬送，而前後之搬送滾筒i i， -23- • 1301820 係在對應位—置的大徑部1 4及小徑部1 5間’交接基板材A且 搬送。 (6) 藉由此等，要以該搬送裝置1 〇搬送的基板材 A，係使稍微之凹凸在左右形成爲彎曲狀，藉此來產生腰部 賦予強度且被搬送。 即，基板材A係在搬送裝置1 0之上下對應位置的搬送 滾筒1 1之各大徑部1 4及小徑部1 5間，也就是在已形成的 平穩之各凹凸面間，藉由夾入’而在左右的寬度方向F賦予 φ 固定周期的略波浪狀之平穩的彎曲凹凸形狀（參考第1圖之 (2)圖、第3圖）。而且，基板材A係藉由賦予該彎曲凹 凸形狀，比起在平的平面形狀之下搬送的情況（參考第5 圖），會產生腰部來提高強度，使耐負荷性更大而增強。 基板材A係有顯著極薄化傾向既柔軟且撓性，且處理液 B隨著噴射壓或重量噴射（譬如噴射壓31kg)，但其形成具 備充分承受的強度。因此，基板材A係穩定地保持，且無搬 送事故G(參考第6圖）而穩定地搬送。 φ 還有，這種彎曲凹凸形狀，進而藉由在前後對應位置之 搬送滾筒1 1的各大徑部1 4及小徑部1 5之組合，在上述之 左右的寬度方向F之外，在前後之搬送方向D亦追加形成， 從這個層面，亦更進一步促進上述的基板材A之強度提高。 (7) 進而，以該搬送裝置10搬送的基板材A，係在前 後之搬送滾筒1 1間，利用對應位置的各大徑部1 4及小徑部 1 5間之外周旋轉速度的差，及形狀上相互咬入，順暢地交接 並移載、被搬送（參考第2圖、第4圖）。 -24- 1301820 即，該搬送裝置1 0中，搬送滾筒1 1係大徑部1 4比小 徑部1 5的外周圍旋轉速度更快，所以在將要搬送的基板材 A ’從前方之搬送滾筒丨i的小徑部丨5，朝向後方之搬送滾 筒的大徑部1 4交接之各部位中，將基板材A從外周圍旋轉 速度慢的小徑部1 5 (前方），朝向外周旋轉速度快的大徑部 14(後方）拉入。 因此，要搬送的基板材A是在這種各部位中，從通過的 小徑部1 5 (前方）之搬送滾筒1 1，朝向抓住的大徑部1 4 (後 p 方）之搬送滾筒11，被促進移載。因此基板材A在前後之 搬送滾筒1 1間，確實且容易地移載，形成順暢地搬送，從 這個層面，亦可消除搬送事故G(參考第6圖）。 進而，在前後之搬送滾筒1 1間，藉由對應位置的各大 徑部1 4及小徑部1 5間之形狀上相互咬入，亦使基板材A的 移載確實化、容易化、被促進。 【圖式簡單說明】 第1圖係對於有關本發明之薄物基板材的搬送裝置，提 φ供爲了實施發明的最佳形態之說明，（1 )圖係搬送裝置的 搬送滾筒之正面圖（平面圖），（2)圖係搬送裝置的正面 圖。 第2圖係提供爲了實施上述發明的最佳形態之說明’搬 送裝置的重要部分之平面圖。 第3圖係提供爲了實施上述發明的最佳形態之說明’表 面處理裝置全體的正剖面說明圖。 第4圖係提供爲了實施上述發明的最佳形態之說明’表 -25 - 1301820 面處理裝置全體的側剖面說明圖。 第5圖係提供這種先前例之說明，表面處理裝置全體的 正剖面說明圖。 第6圖係提供這種先前例之說明，搬送裝置等的側面槪 略圖，（1)圖係顯示全體，（2)圖係顯示其1例之重要部 分’（3 )圖係顯示另外例的重要部分。 第7圖係電路基板（基板材）之模式化的平面說明圖。 【元件符號說明】 φ 1…表面處理裝置（先前例） 2…搬送裝置（先前例） 3…搬送滾筒（先前例） 4…噴射噴嘴 5···室 6···液槽 7···配管 8···泵 φ 9…表面處理裝置（本發明） 10…搬送裝置（本發明） 11 ·.·搬送滾筒 12···軸 1 3 ·.·輸送帶框架 14…大徑部 15…小徑部 A · · ·基板材 -26- •1301820 B…處理液 C. ..上下方向 D. ..搬送方向 E…噴射區域 F. ..寬度方向 G. ..搬送事故 H. ..電路基板 J ...電路1,1301820 IX. Description of the Invention: [Technical Field] The present invention relates to a conveying device for a thin material-based sheet material. That is, the transfer device for the surface treatment device is used in the manufacturing process of the thin circuit board, and the base material is transferred and subjected to surface treatment. [Prior Art] "Technical Background" With the high performance, high functionality, small size and light weight of electronic devices, φ promotes high precision, compactness, thinning, and diversification of circuit boards such as printed wiring boards. The circuit formed is significantly higher in density and finer. For example, a printed wiring board in which the thickness of the insulating layer is about ΙΟμπι and the thickness of the circuit is also ΙΟμπι is exhibited, and the thickness of the insulating layer is extremely thin and thin, and the waist portion is remarkably soft and flexible. Further, in the manufacturing process of the circuit board, in each of the processes, a surface treatment apparatus is used, and the surface treatment apparatus sprays the treatment liquid on the substrate to be conveyed by the conveyance apparatus, thereby performing the chemical treatment of the base material. Good or clean. For example, in the case of the base material, the treatment liquid such as the development liquid, the etching liquid, the stripping liquid, and the cleaning liquid is sequentially sprayed, and thus surface treatment such as development, etching, peeling, and washing is performed in order, and a circuit is formed and manufactured. Circuit board. [Prior Art] Figs. 5 and 6 provide a description of such a prior art, and Fig. 5 is a front cross-sectional explanatory view of the entire surface treatment apparatus, and Fig. 6 is a side elevational view of the conveying apparatus and the like, Fig. 6 (1) the figure shows the whole, (2) the figure shows an important part of an example, and (3) the figure shows the important part of another example. 1301820 is also a developing device, an etching device, a peeling device, a cleaning device, and the like as shown in the above figure. The surface treatment device 1 is such that the substrate sheet A is held by the transport roller 3 above and below the transport device 2. Since the processing liquid B is ejected from the ejection nozzle 4 while being horizontally conveyed, a surface treatment such as a predetermined chemical liquid treatment or a cleaning treatment is performed to form a circuit, and a circuit board is manufactured. Further, in the transfer drum 3 as the conveying device 2 of the surface treatment apparatus 1, a straight roller is used in the vertical direction, and the transfer drum 3 is vertically paired in the vertical direction C, and a plurality of the transport rollers D are arranged in the front and rear directions. The base material A φ is held by contact between the upper and lower sides, so that the base material A is conveyed horizontally. Further, the injection nozzle 4 is placed in the ejection region E, and the processing liquid B is ejected at a position opposite to the substrate A to be conveyed. Further, in Fig. 5, F shows the width direction perpendicular to the conveyance direction D, the chamber of the 5-series surface treatment apparatus 1, the liquid tank of the 6-series treatment liquid B, the 7-series piping, and the 8-series pump. "Previous Technical Literature Information" This prior example can be exemplified by the following Patent Document 1. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2002-009420 [Draft of the Invention] [Disclosure of the Invention] [Problem to be Solved by the Invention] However, the conveyance of the surface treatment apparatus 1 of the prior art example Device 2 is referred to the following problem. Namely, such a base sheet A is remarkably extremely thin as described above, and the waist portion is weak and soft 1301820 soft. Further, with this base material A, the treatment liquid B is sprayed with the injection pressure or the weight. Therefore, when the base material A is conveyed horizontally by the conveyance drum 3 of the conveyance apparatus 2, and the processing liquid B is sprayed from the injection nozzle 4, the base material A cannot be stably held by the conveyance drum 3, and many types of conveyance accidents are generated and formed. problem. That is, with respect to the base sheet A, a lot of adhesion, winding, entrapment, suction, or bending, curling, crease, bending, bending, crease, waist folding, or sliding, hooking, and the like are caused to the conveying roller 3. Transport accidents such as drooping, falling, scratching, damage, etc. φ G. In this way, the transfer apparatus 2 of the prior art has many difficulties in stable conveyance, and the surface treatment of the base material A requiring high precision is also hindered, and the stable and stable transfer of the base material A becomes an earnest expectation. . In particular, in the case of the substrate sheet A which is remarkably extremely thinned, stable holding and stable transportation are almost regarded as difficult, and the demand for extremely thinning has recently increased. <<About the Invention>> The present invention has been invented by the inventors of the present invention in order to solve the above problems of the prior art in view of such a situation. Further, the present invention provides a conveying apparatus for a thin material-based sheet material, which is characterized in that: first, a waist portion is formed on a base sheet to impart strength, so that stable holding and stable conveyance are realized, and second, the base sheet is conveyed to the front and rear rollers. Smoothly moving between them, from this level can also achieve stable maintenance, stable transfer. [Means for Solving the Problem] "Regarding the Patent Application Range" 1301820 The technical means of the present invention for solving such a problem is as follows. First, the invention described in the first item of the patent application scope is as follows. The transfer apparatus for a thin-material base sheet according to the first aspect of the invention is used in a surface treatment apparatus for transporting a base material and performing surface treatment in a manufacturing process of a thin-film circuit board. Further, it is characterized in that it is a wave-shaped conveying roller which is formed by gradually repeating the large diameter portion and the small diameter portion. The second item of the patent application scope is as follows. The transfer apparatus for the thin-material base sheet according to the second item of the second aspect of the patent application is the first item of the patent application scope, characterized in that the transport drum has a diameter in the axial direction, which is repeated from large to small and from small to large. And slowly changing into a smooth taper, and the large diameter portion and the small diameter portion are continuously formed in a predetermined interval and height. The third item of the patent application scope is as follows. The transfer apparatus for the thin-material base sheet according to the third aspect of the patent application is the second item of the patent application, characterized in that the base sheet is extremely thin and soft, and is conveyed horizontally by the transfer drum. Further, in the surface treatment, the treatment liquid composed of the chemical liquid or the φ cleaning liquid is sprayed from the respective injection nozzles by spraying the base material. The fourth item of the scope of patent application is as follows. The conveying apparatus of the thin-material base sheet according to the fourth aspect of the invention is the third aspect of the patent application, characterized in that the conveying drum is vertically rotated in pairs to perform contact rotation, and is stored slightly in the conveying direction of the front and rear. A majority is placed in parallel with each other. Further, between the upper and lower transfer drums, the large-diameter portion and the small-diameter portion correspond to each other, and the large-diameter portion and the small-diameter portion also follow the corresponding position between the transfer rollers. 1301820 The fifth item of patent application scope is as follows. The conveying apparatus of the thin-material base sheet according to the fifth aspect of the invention is the fourth aspect of the patent application, characterized in that the upper and lower conveying rollers are sandwiched between the large-diameter portion and the small-diameter portion. And conveyed, and the conveyance roller is conveyed by the conveyance roller between the large diameter part and the small diameter part, and is conveyed. Further, the base sheet is formed into a curved shape by the like, whereby the waist portion is formed to impart strength and is conveyed. The sixth item of the patent application scope is as follows. The conveying device of the thin-material base sheet according to the sixth item of the ninth application of the patent application is the fourth item of the patent application, characterized in that the front and rear transfer rollers are connected to the base plate between the large diameter portion and the small diameter portion. And transport. Further, the base sheet is fed by the difference between the outer peripheral rotation speeds of the large-diameter portion and the small-diameter portion before and after the front and rear sides, and is smoothly transferred between the front and rear conveyance rollers. <<Operation and the like>> The apparatus for conveying a thin-material base material of the present invention is constituted by such a means, and is thus formed as follows. φ (1) This conveying device is used in a manufacturing process of a thin circuit board, and is used as a surface treatment apparatus in a chemical processing process or a cleaning process. (2) Further, the base material is conveyed by the conveyance drum of the conveyance device, and the treatment liquid obtained by spraying the chemical liquid or the cleaning liquid from the injection nozzle is surface-treated. (3) The transport rollers of the transport unit are rotated in contact with each other in pairs, and a slight gap is stored in the transport direction in the front and rear directions. (4) Further, the conveying device uses a wavy conveying drum. -10- J3Q1820 That is, the diameter of the transport roller is repeated from the large to the small in the axial direction and is gradually changed from small to large, and gradually changes to a smooth taper, so that the large diameter portion and the small diameter portion are spaced apart by a predetermined distance. And the majority is formed continuously in a high degree. (5) Further, between the upper and lower transfer rollers, the large-diameter portion and the small-diameter portion correspond to each other, and between the front and rear transfer rollers, the large-diameter portion and the small-diameter portion also follow the corresponding positions, and the upper and lower transfer rollers The base plate is sandwiched between the large-diameter portion and the small-diameter portion and transported, and the front and rear transfer rollers are transferred between the large-diameter portion and the small-diameter portion and transferred. φ (6) Therefore, the base material conveyed by the conveyance device is sandwiched between the large-diameter portion and the small-diameter portion of the upper and lower conveyance rollers, thereby providing a smooth bending in a fixed cycle in the left-right width direction. Concave-convex shape, thus creating a waist to increase strength. Further, the curved shape is additionally formed in the front and rear conveying directions by the large-diameter portion and the small-diameter portion of the front and rear conveying rollers, and the strength of the base material can be improved from this level. The base sheet is remarkably extremely thin and soft, and the treatment liquid is sprayed with the spray pressure or the weight, but this is sufficient to withstand, and is stably maintained and stably conveyed. Φ (7) Further, in the conveying apparatus, the outer peripheral rotation speed of the large diameter portion of the conveying drum is made faster than the small diameter portion, so that the base material sheet is drawn from the small diameter portion toward the large diameter portion between the front and rear conveying rollers. . Further, between the front and rear transfer rollers, the large diameter portion and the small diameter portion are bitten into each other. Thereby, the base material is reliably and easily transferred between the front and rear transfer drums, and the conveyance is smoothly performed. (8) Therefore, the conveying apparatus of the thin-material base sheet of the present invention exerts the following first and second effects. [Effect of the Invention] -11- • 1301820 "First effect" First, the waist portion is formed on the base material to impart strength. Therefore, the conveyance is eliminated, and stable holding and stable conveyance are realized. In other words, in the conveying apparatus of the thin-material base material of the present invention, since the corrugated conveying roller is used to impart a curved uneven shape to the base material, the waist portion can be formed on the base material to be conveyed to increase the strength and the load resistance can be enhanced. The base sheet is remarkably extremely thin and flexible, and the treatment liquid is sprayed with the spray pressure or weight, but it is sufficiently durable to be stably held and stably conveyed. _ Therefore, in the foregoing prior examples, the adhesion, curling, entanglement, squeezing, or bending, curling, wrinkling, bending, bending, creaseing of the conveying roller of the base material being conveyed is referred to. Waist, waist, or sliding, hooking, sagging, falling, scratching, damage, etc., are indeed prevented. The base material is conveyed without a conveyance accident, and a highly precise surface treatment is realized. "Second effect" Second, the base plate is smoothly moved between the front and rear transfer rolls, and stable and stable conveyance can be achieved from this level. In other words, in the conveying apparatus of the thin-material base sheet of the present invention, the base sheet is smoothly transferred and transferred from the small-diameter portion to the large-diameter portion by the transfer drum of the wavy stomach. Therefore, from this level, the occurrence of the substrate transfer accident in the above-mentioned prior example is surely prevented, and high-precision surface treatment is realized. Thus, the effects of the present invention are significant and significant for solving all the problems of the prior art. [Embodiment] [Best Mode for Carrying Out the Invention] -12-View 1820 "About the Drawings" Hereinafter, the conveying apparatus for the thin-material base sheet according to the present invention will be described in detail based on the best mode of the invention as shown in the drawings. Explain. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1, Fig. 2, Fig. 3, and Fig. 4 are views showing the best mode for carrying out the invention. Further, Fig. 1(1) is a front view (plan view) of the transport drum of the transport apparatus, (2) a front view of the transport apparatus, and Fig. 2 is a plan view showing an important part of the transport apparatus. Fig. 3 is a φ cross-sectional explanatory view of the entire surface treatment apparatus, and Fig. 4 is a side cross-sectional explanatory view. Further, Fig. 7 is a plan view showing the pattern of the circuit board (base board). <<Circuit Substrate Η>> The transport apparatus 10 of the surface treatment apparatus 9 of the base sheet is used in the manufacturing process of the circuit board. Therefore, first, referring to Fig. 7, a description will be given of the outline of the circuit board. The circuit board is used in an AV device, a personal computer, a mobile phone, a digital phase φ machine, and various other electronic devices. It is used for electrical connection, and is formed on the outer surface or inside of the insulating layer in order to connect the circuit J pattern between the components. Composition. Moreover, the circuit board is divided into a single-sided substrate and a double-sided substrate, and also has a multi-layer substrate (including the substrate of the most recent build-up method), and various other substrates can be further divided into a rigid rigid substrate and a film-like scratch. Sexual substrate. The insulating layer of the flexible substrate is composed of a film made of polyimide and a film made of another resin. In addition, as one of the circuit boards, a semiconductor module including a 1C, an LSI element, a semiconductor component such as a 13·1301820 moving component, a driving component, and a capacitor, and a module substrate integrally assembled with the circuit j (semiconductor integrated type) A package substrate) or a glass substrate in which a circuit j and a semiconductor component are embedded in a glass substrate, that is, a glass substrate for a plasma display panel PDP or a glass substrate for a liquid crystal LCD, and CSP, PBGA, and the like are also present. Of course, the circuit board 本 in the present specification includes these wide-area substrates in addition to the printed wiring board of the prior art. In addition, the circuit board is improved in high performance, high in function, small in size and light weight, and also promotes high precision and compactness, and is thinner and thinner, extremely thinner, softer, and more flexible. In addition, the circuit J formed on the outer surface (surface or back surface) and the circuit J formed inside are remarkably high-density and fine. The circuit board, for example, a printed wiring board, is manufactured such that the longitudinal and lateral cutting dimensions of one sheet are, for example, about 500 m 2 X 5 0 m m. The thickness is the portion of the insulating layer (heart material), prior art from 1. 6mm to 1 . Omm~60μπι degree, now from 50μιη to ΙΟμπι, is extremely thin. The thickness of the circuit J portion 0 (copper foil portion) is also 75 μm to 35 μίη in the prior art, and is now extremely thinned by about 16 μm to ΙΟμπι. In the case of a multi-layer substrate, it is also continuously thinned to the thickness of the whole body. 0mm~0. 4mm level. The width of the circuit J or the space between the circuits J is also from about 30 μm to about 15 μm, but now it is about 10 μm and there is a tendency to be fine. The circuit board is formed in such a schematic configuration. "One example of the method of manufacturing the circuit board" Next, the method of manufacturing the circuit board 使用 using the substrate processing apparatus 9 and the transfer apparatus 14-1301820 is described with reference to Fig. 7 and the like. . First, the manufacturing method of the first example will be described. In this manufacturing method, a circuit board such as a printed wiring board is manufactured according to the following procedure. First, the copper foil is adhered to the outer surface of an insulating layer (heart material) made of glass cloth, ceramic, or polyimide or other film-like resin by thermal pressing or the like to prepare a copper layer. The board is also the base sheet. Then, the surface of the copper foil to be adhered is roughened by the surface roughening treatment (soft etching), and then cut into short pieces of the workpiece size of φ. The surface roughening treatment was carried out by mechanical honing in the prior art, but recently, the treatment liquid B which is formed by the surface roughening liquid is subjected to a large amount of action. Further, in many cases, the perforation processing for the through holes is carried out using a laser or the like. The through hole is formed by a fine through hole between the outer surfaces of the base plate A (circuit substrate Η), and one piece forms a through hole of several hundred or more extremely small diameters, and the diameter thereof is 〇. 5mm~0. The diameter below 2 mm is large. Further, the through hole is used for the conduction connection between the circuit J (copper foil) between the two outer surfaces or the electric circuit J (copper foil) of the multilayer substrate, or the mounting of the semiconductor component mounted on the circuit J. Further, recently, in place of a through hole which requires perforation processing, a contact having a small protrusion shape and a substantially conical trapezoidal shape is formed, and thus a multilayer substrate or the like is developed, and the same as that of the through hole is developed by the protrusion. Functional technology. The bulging system is manufactured according to the surface treatment process such as the developing process, the etching process, and the stripping process. And then 'on the outer surface of the copper foil of the base sheet A, the photosensitive resist will be used. The 1301820 agent is coated or adhered to form a film. Thereafter, by exposing the negative film of the circuit j, that is, the photo of the circuit j pre-designed with the circuit j, the resist of the outer surface is exposed to leave a portion of the hardened circuit j, and other unnecessary portions are used. It is dissolved and removed by the blasting treatment liquid B, that is, an alkaline developing solution. Then, the copper foil of the base material A is dissolved and removed, and the unnecessary portion is removed by spraying the treatment liquid B, that is, the etching liquid (the second copper chloride, the second iron chloride, and the other etching liquid). The portion is hardened by the resist, leaving a portion (protective film portion) of the circuit J to be coated, and exposed by lithography to remove the resist. Then, the resist which forms part of the remaining circuit J is peeled off by the ejection of the treatment liquid B, that is, the alkaline stripping liquid, and therefore, a part of the copper foil is formed by leaving the circuit J on the base sheet. The outer surface of A is used to form a circuit J of a predetermined conductor pattern, and the circuit board is manufactured, and the above-mentioned developing process, etching process, stripping process, for post-processing, or post-processing after stripping process The washing process is attached, and the washing liquid, the neutralizing agent liquid, and the other washing liquid are used as the processing liquid, and the washing process of the attached φ is attached. In the cleaning process, the treatment liquid B such as a developing liquid, an etching liquid, or a peeling liquid adhering to the outer surface of the substrate (including the inside of the through hole) is washed and removed. Further, after the cleaning process, a drying process is attached. In other words, in the outer surface (including the through hole or the like) of the base material A washed by the cleaning process, the treatment liquid B, that is, the water washing liquid and other washing liquid, or the like, is adhered thereto, so that oxidation is prevented. It is necessary to remove this and immediately dry it in a drying process afterwards. -16- • 1301820 The manufacturing method of the first example is constituted by this wet processing method. The manufacturing method of the first example is formed as such. <<Another Example of Manufacturing Method of Circuit Board Η>> Next, the manufacturing method of the second example will be described. As a method of manufacturing a circuit board such as a printed wiring board, the wet processing method of the first example described above is a typical example, but the semi-additive method of the second example is also often used. In the semi-additive method, first, the electroless copper is applied to the surface of the base material A in which the through holes are formed in advance. Then, after the photosensitive resist is applied or pasted into a film shape on the electroless copper plating, the circuit: a negative film, that is, a circuit: T photo, is exposed. Further, the resist is exposed to leave a hardened portion, and another portion, that is, a portion formed by the circuit J, is dissolved and removed by spraying the treatment liquid B as a developing liquid. Then, a part of the circuit J is formed, that is, a portion of the plating pattern after the resist is dissolved and removed, that is, a portion where the electroless copper is exposed, and copper plating is applied to form the circuit 1. In addition, the remaining resist other than the 0 part of the circuit J after the curing is peeled off by the blasting treatment liquid B, that is, the stripping liquid, so that the exposed electroless copper is formed, and the processing liquid B is also sprayed. It is the etching solution to quickly etch and dissolve and remove. Further, as a post-processing for each process, the cleaning process or the drying process in which the cleaning liquid is used as the processing liquid B is attached as a matter of the above. In the semi-additive method of the second example, the circuit J is formed by electroplating copper, and thus the circuit board 制造 is manufactured. The manufacturing method of the second example forms such a configuration. • 130. 1820 However, the manufacturing methods of the printed wiring board and other circuit boards have become more and more diverse, and various methods have been developed and used in addition to the above-described i-th and second examples. The invention is of course also applicable to the manufacture of these various circuit boards. The manufacturing method of the circuit board 形成 is formed in this way. <<Surface treatment device 9>> First, the surface treatment device 9 of the transfer device 10 using the substrate sheet of the present invention will be described with reference to Figs. 3 and 4 and the like. This surface is used in the manufacturing process of the circuit board 9 for transporting the substrate and performing surface treatment. That is, the surface treatment device 9 is in the manufacturing process of the circuit substrate, such as a surface roughening process, other pre-processing processes, a developing process, an engraving process, a stripping process, a cleaning process, and other post-processing processes, for example, It is used as a surface roughening device, a developing device, an etching device, a peeling device, or a cleaning device. Further, the base material A to be conveyed by the conveying device 10 is sprayed with a treatment liquid B such as a surface roughening liquid, a developing liquid, an etching liquid, a peeling liquid, or a cleaning liquid, and the base material A is subjected to a chemical liquid. Surface treatment such as treatment, washing treatment, etc. Further, the surface treatment apparatus 9 is provided in the processing chamber, that is, in the chamber 5, and has a conveyor belt that conveys the base material A in the conveyance direction D, that is, the conveyance device 1; and a spray treatment liquid B on the base material A to be conveyed. Spray nozzle 4. The injection nozzle 4 is disposed in the ejection region E so as to face the substrate A to be conveyed, such as the treatment liquid B such as the spray surface roughening liquid, the developing liquid, the etching liquid, the peeling liquid, or the cleaning liquid. -18- • 1301820 That is, the spray nozzle 4 is such that the transfer drum 11 of the transport device 10 stores the upper F interval directly above or below the horizontal transfer substrate A, and passes the front and rear transport directions D and the left and right widths. In the direction F, a majority is arranged at intervals of a predetermined interval. Further, in the injection area E in which the injection nozzles 4 are disposed, only the arrangement of the conveyance rollers 1 1 is lacking. The treatment liquid B is sent from the liquid tank 6 to the respective injection nozzles 4 through the pump 8 or the piping 7, and is sprayed on the base material A. Further, the outer surface of the base material A flows in the left or right direction in the width direction F and is subjected to surface treatment of φ, and then flows downward from the left and right sides of the base material A, is recovered in the liquid tank 6, and is circulated afterwards. Used. The surface treatment device 9 is configured as described above. <<Transporting Device 10>> Hereinafter, the conveying device 10 used in the surface treating device 9 will be described with reference to Figs. 1, 2, 3, 4, and the like. First, the transfer device 10 of the base material sheet A is disposed in the chamber 5 of the surface treatment apparatus 9 of the base material sheet A, and includes a plurality of transfer drums 11. Further, the transporting and transporting rollers 1 1 are vertically aligned in the vertical direction C, and are arranged so as to be in contact with each other, and are arranged in the transport direction D in the front and rear directions, and are arranged in a plurality of combinations. In other words, the transport roller 1 1 is held between the base material A and the pressure contact between the transfer rollers 1 (except for the ejection region E), and the base material A is transported in the transport direction D, and is transported up and down in the transport direction D. The majority is listed (except for the injection area E). Further, in the transfer device 10, the upper transfer drum 11 and the lower -19-1301820 transfer drum 1 1 are constituted by a drive roller to which the shaft 12 is attached and fixed. In other words, the transport roller 11 is rotationally driven by being connected to a drive mechanism such as a motor via a shaft 1 2 that is attached and fixed, a drive gear, or the like. In the first and second drawings, the conveyor belt frame 1 is configured such that the shaft 1 2 of the transport drum 1 1 is rotatably held to the left and right. Further, as the transport form of the base material sheet A, the horizontal transport shown in the drawings is a representative one, but oblique transport or vertical transport may be considered. In other words, the transport roller 11 of the transport device 10 is disposed horizontally with respect to the width φ of the left and right sides of the transporting device 10, but may be disposed obliquely or vertically. Therefore, the base plate a is in a horizontal posture. In addition to the horizontal conveyance, there is a case where the vehicle is tilted from the horizontal posture in an inclined posture or vertically in the vertical posture. Of course, in the case of the oblique conveyance or the longitudinal conveyance, the injection nozzle 4 is also disposed in an inclined posture or left and right from the upper and lower opposing postures with respect to the base material A. The transport device 1 has such a schematic structure. <<Regarding the undulating conveyance roller 11>> # Furthermore, this conveyance device 10 employs the wave-shaped conveyance roller 11. The transfer drum 11 will be described with particular reference to Figs. 1, 2, 3, and 4. The undulating conveying roller 1 1 is configured by gradually forming a large diameter portion 14 and a small diameter portion 15 . That is, the transport roller 1 1 has a diameter which gradually changes from a large size to a small size and gradually changes to a smooth tapered shape which is along the left and right width directions F, that is, the direction of the shaft 12, and is perpendicular to the axial direction 12 Since the direction (the front and rear conveyance directions D) is large, the large diameter portion 14 and the small diameter portion 15 are continuously formed at a predetermined pitch and height of -20 - 13001820. Further, as shown in the figure, between the upper and lower transfer rollers 1 1 , the large diameter portion i 4 and the small diameter portion 15 are corresponding positions, and between the front and rear transfer rollers i 1 , the large diameter portion 14 and the small diameter portion 15 are also The order corresponds to the location. This transfer drum 1 1 will be described in more detail. The transport roller 1 1 is also composed of, for example, a repetitive shape in which the shaft 12 is placed on the left and right sides, such as a truncated cone, and when the outer surface is focused on it, the unevenness is repeated at a fixed cycle height. Further, the inclination system is formed slowly and smoothly, and 譬 φ is formed to an inclination angle of about 14 to 15 degrees as for the inclination angle of the level from 1, 2 degrees. The representative is a tilt angle of 3 or 4 degrees. Therefore, the transport roller 11 is formed by repeating the large-diameter portion 14 and the small-diameter portion 15 in the direction of the axis 1 2 at a predetermined pitch and height. Further, between the transport roller 11 above the upper and lower direction C and the transport roller 11 of the lower position, the upper large diameter portion 14 and the lower small diameter portion 15 are disposed so as to correspond to each other, and the upper small diameter portion is provided. The 15 and the lower large diameter portion 14 must be arranged to correspond to the position (except for the injection region E). φ Further, between the transport roller 1 1 on the front side (upstream side) of the front and rear transport directions D and the transport roller 1 1 on the rear side (downstream side), the large-diameter portion 14 on the front side and the small-diameter portion 15 on the rear side It must be arranged in a corresponding position, and the small diameter portion 15 on the front side and the large diameter portion 14 on the rear side must be disposed at corresponding positions. Therefore, in the conveying device 10, the upper and lower transfer drums 11 are held between the large-diameter portion 14 and the small-diameter portion 15 and are conveyed, and the front and rear transfer rollers 11 are attached to the large-diameter portion 14 And the small-diameter part 15 is transferred to the base material A and conveyed. Therefore, the base material A is formed by this, and first, a slight unevenness is formed as -21 - . 1301820 is curved, thereby creating a waist to impart strength and being transported. In other words, when the base material sheet A is viewed in the vertical direction C, the unevenness is formed in a predetermined distance and a slight height in the width direction F of the left and right by being sandwiched between the upper and lower transport rollers n. Further, the upper and lower transfer drums 11 are conveyed in the transport direction D in the front and rear directions, and the irregularities are formed at predetermined pitches and heights in order in the transport direction D in the front and rear directions. Further, between the front and rear transfer rollers 1 1 , the base material sheet A uses the difference in the rotational speeds between the large-diameter portion 14 and the small-diameter portion 15 in the front and rear, and the shape φ bites into each other to smoothly transfer. It was carried and carried. In other words, when the base sheet A is viewed in the transport direction D before and after, the outer peripheral rotation speed from the transport drum 1 1 is transferred from the slower small diameter portion 15 toward the faster large diameter portion 14 The latter is actively pulled in towards the latter. Further, the transport roller 1 1 is such that the large-diameter portion 14 bites into the small-diameter portion 15 of the other side, and the small-diameter portion 15 bites into the large-diameter portion 14 of the other side. By this, the base material A is smoothly transferred and transferred between the front and rear transfer drums 1 1 . The undulating conveyance roller 11 is configured as described above. φ "About action" and the like The transfer device 10 of the thin-material base sheet A of the present invention is constructed as described above. Therefore, it is formed as follows. (1) The transfer device 1 is used in a surface treatment process such as various chemical processing processes or cleaning processes in a manufacturing process of a printed circuit board and other thin circuit substrates. For example, it is used in the surface treatment device 9 such as a surface roughening device, a developing device, an etching device, a peeling device, and a cleaning device (refer to Fig. 7, Fig. 3, Fig. 4, etc.). -22 - 1301820 (2) Further, the base material A is placed in the chamber 5 of the surface treatment apparatus 9, and is conveyed horizontally by the transfer drum 11 of the transport apparatus 10, and the chemical liquid or the cleaning liquid is sprayed from each of the spray nozzles 4. The treated liquid B is treated with a surface. In other words, the flexible base material A having a very thin thickness and a soft surface is horizontally conveyed by a surface treatment device 9 such as a surface roughening device, a developing device, an etching device, a peeling device, and a cleaning device, and the surface is made thick. The treatment liquid B such as the chemical liquid, the developing liquid, the etching liquid, the peeling liquid, and the cleaning liquid is sprayed, and thus the chemical liquid treatment or the washing treatment is performed (refer to Figs. 3 and 4). (3) The conveyance roller 11 of the conveyance device 10 of the surface treatment apparatus 9 is in the vertical direction C, and is rotated in pairs in the vertical direction, and a small gap is stored in the conveyance direction D in the front and rear directions. Refer to Figure 3 and Figure 4). (4) Further, in the conveying device 10, the wavy conveying drum 1 1 formed by the large diameter portion 14 and the small diameter portion 15 is gradually repeated. In other words, the transport roller 1 1 is formed such that the diameter along the direction of the axis 12 is repeated from large to small and from small to large, and gradually changes to a smooth tapered shape, so that the large diameter II portion 14 and the small diameter portion 15 That is, a smooth unevenness is formed continuously at a predetermined pitch and height (refer to Figs. 1 and 2). (5) In the transfer device 10, the large-diameter portion 14 and the small-diameter portion 15 are corresponding positions between the transport rollers 1 in the vertical direction C (refer to the figure (2) in the second figure), and Between the transport rollers 11 in the transport direction D before and after, the large-diameter portion 14 and the small-diameter portion 15 also correspond to the positions in order (see Fig. 2). Therefore, the upper and lower transfer rollers 1 1 are interposed between the large-diameter portion 14 and the small-diameter portion 15 at the corresponding positions, and the base material A is sandwiched and conveyed, and the front and rear transfer rollers ii, -23- • 1301820 are in the corresponding positions. - The large-diameter portion 14 and the small-diameter portion 15 are placed and transferred to the base material A. (6) In this case, the base material A conveyed by the transporting device 1 is formed such that a slight unevenness is formed in a curved shape on the right and left sides, whereby the waist portion is given strength and conveyed. In other words, the base sheet A is between the large-diameter portion 14 and the small-diameter portion 15 of the transfer drum 1 1 at the corresponding position above and below the conveying device 10, that is, between the smooth surfaces of the formed smooth surface. In the left-right width direction F, a slightly wavy smooth curved concave-convex shape with a fixed period of φ is applied (refer to Fig. 1 (2) and Fig. 3). Further, the base sheet A is provided with a curved concave-convex shape, and is conveyed under a flat planar shape (refer to Fig. 5), a waist portion is formed to increase the strength, and load resistance is enhanced and enhanced. The base sheet A has a tendency to be extremely thin and flexible, and the treatment liquid B is sprayed with a spray pressure or a weight (e.g., a spray pressure of 31 kg), but it is formed to have sufficient strength. Therefore, the base material sheet A is stably held, and is conveyed stably without the conveyance accident G (refer to Fig. 6). Further, the curved uneven shape is further combined with the large-diameter portion 14 and the small-diameter portion 15 of the transport roller 1 1 at the front and rear corresponding positions in the width direction F of the left and right sides. The front and rear transport directions D are also additionally formed, and from this aspect, the strength of the above-mentioned base material A is further improved. (7) Further, the base material sheet A conveyed by the conveyance device 10 is between the front and rear conveyance rollers 1 1 and the difference in rotation speed between the outer diameter portions 14 and the small diameter portions 15 at the corresponding positions is used. And bite into each other in shape, and smoothly transfer, transfer, and transport (refer to Fig. 2 and Fig. 4). In the conveyance device 10, the conveyance roller 1 1 has a larger diameter portion 14 than the outer diameter of the small diameter portion 1 5, so that the base material A 'to be conveyed is transported from the front. In the small-diameter portion 丨5 of the drum 丨i, the base plate A is rotated toward the outer circumference from the small-diameter portion 15 (front) having a slow rotation speed from the outer periphery in each of the portions where the large-diameter portion 14 of the transfer drum is conveyed rearward. The large diameter portion 14 (rear) is pulled in. Therefore, the base material A to be conveyed is a conveyance roller that faces the conveyance roller 1 1 of the small-diameter portion 15 (front) that passes through the respective large-diameter portions 1 4 (the rear p-side) in the respective portions. 11, was promoted to transfer. Therefore, the base material sheet A is reliably and easily transferred between the front and rear conveyance rollers 1 to form a smooth conveyance, and from this aspect, the conveyance accident G can be eliminated (refer to Fig. 6). Further, between the front and rear transfer rollers 1 1 , the shape of each of the large diameter portions 14 and the small diameter portions 15 at the corresponding positions is bitten into each other, and the transfer of the base material A is also facilitated and facilitated. Was promoted. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the best mode for carrying out the invention for the conveying device of the thin-material base sheet according to the present invention, and (1) the front view of the conveying roller of the drawing conveying device (plan view) ), (2) Front view of the image transfer device. Fig. 2 is a plan view showing an important part of the conveying apparatus for explaining the best mode of the above invention. Fig. 3 is a front cross-sectional explanatory view showing the entire surface treatment apparatus for explaining the best mode of the invention. Fig. 4 is a side cross-sectional explanatory view showing the entire surface treatment apparatus of the table - 25 - 1301820 in order to carry out the best mode for carrying out the above invention. Fig. 5 is a front cross-sectional explanatory view showing the entire surface treatment apparatus for explaining the previous example. Fig. 6 is a side elevational view showing the description of the prior art, a side view of the transport apparatus, etc., (1) the figure shows the whole, and (2) the figure shows the important part of one example. (3) The figure shows another example. important part. Fig. 7 is a schematic plan view showing a circuit board (base board). [Description of component symbols] φ 1...surface treatment device (previous example) 2...transport device (previous example) 3...transport roller (previous example) 4...jet nozzle 5···chamber 6···liquid tank 7··· Piping 8···Pump φ 9...surface treatment device (invention) 10...transport device (invention) 11 ·. ·Transport roller 12···Axis 1 3 ·. · Conveyor belt frame 14... Large diameter section 15... Small diameter section A · · · Base plate -26- • 1301820 B... Treatment liquid C. . . Up and down direction D. . . Transport direction E...spray area F. . . Width direction G. . . Transport accident H. . . Circuit board J . . . Circuit
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