1323187 九、發明說明： 【發明所屬之技術領域】 本發明關於一種藥液處理裝置。亦即，關於一種藥液 處理裝置，其在基板的製造步驟中被採用，並藉由藥液來 對基板材進行表面處理。 【先前技術】 <<技術背景>> 用於電子機器的電路基板係小型輕量化、極薄化、撓 性化的進展很顯著，形成的電路的微細化' 高密度化也很 顯著。 然後，在這種基板的製造步驟中，使用藥液處理裝置， 基板材係藉由所噴射的藥液而被進行處理表面。噴射例 如，顯影液、蝕刻液、剝離液等等的藥液，因而進行顯影、 蝕刻、剝離等等的表面處理。 <<習知技術>> 在這種習知例的藥液處理裝置中，基板材係被輸送裝 置的搬送滾筒所搬送，從噴嘴噴射藥液，因而依序執行顯 影、蝕刻、剝離等等的表面處理，並製造形成有電路的基 板。然後，輸送裝置或噴嘴係一般被配設在大氣中•空氣 中，基板材係藉由在大氣中·空氣中被噴射的藥液而被進 行處理表面。 相對於此，也正在開發將輸送裝置或噴嘴.配設在藥液 裡而進行表面處理的藥液處理裝置。亦即，將輸送裝置或 噴嘴配設在充滿藥液的液槽中，因而也出現了藉由液中噴 1323187 射的藥液來對基板材進行表面處理的藥液處理裝置。 <<先前技術文獻資訊〉〉 作爲這種藥液處理裝置，例如，能舉出被以下專利文 獻1、2中所示者。專利文獻1係關於空中噴射處理方式者’ 專利文獻2係關於液中噴射處理方式者。 [專利文獻1]特開2002-68435號公報 [專利文獻2]特開平10-079565號公報 【發明內容】 [發明欲解決的問題] 不過，關於這種習知範例，則被指出了以下問題。 <<第1問題點>> 第1，關於空中噴射'處理方式的藥液處理裝置，則被 指出了以下的問題。亦即，被噴射的藥液係在與前後搬送 方向正交的左右寬度方向上流動’並將基板材表面進行表 面處理之後’從左右兩側邊流下。不過，並不是所有藥液 都如預期般地在左右的寬度方向上流動，次要地，反而容 易在前後搬送方向上成爲亂流，在中央部成爲儲液而滯留。 然後，如果發生這種亂流和儲液，會妨礙藥液的更新， 並產生表面處理的遲速、過與不及、不均勻，對形成均句 的電路而言則產生障礙，對電路的微細化、高密度化在進 展的基板而言，成爲很大的問題。 另外，這種基板材係因極薄化而虛弱柔軟，但是對這 種基板材，隨著噴射壓或重量而噴射藥液。因而，被指出 了基板材大多無法被輸送裝置所穩定搬送的問題。肇因於 1323187 被噴射之藥液的壓力或重量，被搬送的基板材係常發生變 形、彎曲、折斷、皺折、捲縮、落下等等的事故。 <<第2問題點>> 第2 ’關於液中噴射處理方式的藥液處理裝置，則被 指出了以下的問題。此藥液處理裝置係被開發來解決上述 第1問題點，亦即空中噴射處理方式的藥液處理裝置之問 題點’但是關於被輸送裝置上下的連續滾筒群和滾輪群所 夾持且在液中被搬送的基板材，則被指出了其電路形成面 接觸至連續滾筒和滾輪而損傷的問題。 <<關於本發明>> 本發明的藥液處理裝置係有鑑於這種情況，爲解決上 述習知例的課題而成者。然後，本發明之目的在於提供一 種藥液處理裝置，第1，解決被噴射之藥液所造成的亂流、 儲液、變形事故的同時，第2，也不會有在搬送中對電路 形成面造成損傷的疑慮。 [解決問題的方法] <<關於申請專利範圍>> 解決這種問題的本發明之技術手段係如同以下。首 先，關於申請專利範圍第1項，如下所述。 申請專利範圍第1項的藥液處理裝置，其被用於基板 之製造步驟中，藉由藥液來對基板材進行表面處理，其特 徵爲具有：液槽，被該藥液所塡滿；輸送裝置，被配設在 該液槽內並搬送該基板材；以及噴嘴，被配設在該液槽內 並對該基板材噴射該藥液；其中該輸送裝置係具備以不接 1323187 觸電路形成面之方式來運送該基板材的夾持滾筒群，該夾 持滚筒係由夾持該基板材之兩側端面並運送之的驅動滚筒 所構成。 關於申請專利範圍第2項，如下所述。申請專利範圍 第2項的藥液處理裝置，在申請專利範圍第1項中，夾持 並運送該基板材且成對的其中一邊之滾筒，係由軟質材料 所構成；另一邊的滾筒係由硬質材料所構成，並在外周面 形成溝槽，在兩個這種該夾持滾筒之間，壓接、挾持該基 板材，並且不會有滑動、蛇行地運送該基板材。 關於申請專利範圍第3項，如下所述。申請專利範圍 第3項的藥液處理裝置，在申請專利範圍第1項中，該藥 液處理裝置係在基板製造步驟之顯影步驟、蝕刻步驟 '或 者剝離步驟中被使用，該藥液係由顯影液、蝕刻液、或者 剝離液所組成’該基板材係由撓性基板材、其他的極薄材 料所構成。 關於申請專利範圍第4項，如下所述。申請專利範圍 第4項的藥液處理裝置，在申請專利範圍第1項中，該輸 送裝置係水平搬送該基板材，該夾持滾筒係在上下成對的 同時被配置在左右’分別從上下夾持該基板材之左右兩側 端面並運送之。 <<關於作用等等>> 本發明係因爲由這些手段所構成，所以如下所述。 (1)此藥液處理裝置係在基板製造步驟中被使用，對 基板材進行藥液處理。 -10- 1323187 (2) 例如，在顯影步驟、蝕刻步驟、或者剝離步驟中， 用輸送裝置來搬送基板材’並且從噴嘴噴射藥液來進行表 面處理。 (3) 然後，在塡滿與被噴射之藥液相同的藥液的液槽 中，配設輸送裝置和噴嘴。 (4) 因此，被噴射的藥液係在液中立即前進，對基板 材之電路形成面進行表面處理之後，不流過基板材表面而 被反射，且被吸收於液槽的藥液中。 (5) 在此藥液處理裝置中，藥液不會在基板材表面流 動，不會發生藥液的亂流、儲液、滯留等等。另外，肇因 於被噴射之藥液的壓力或重量的基板材之變形、彎曲、折 斷、皺折、捲縮、落下等等也不會發生》 (6) 那麼，在此藥液處理裝置中，輸送裝置之夾持滾 筒係夾持基板材兩側端面並運送之。 (7) 因此’不會有被液中搬送之基板材電路形成面造 成損傷的疑慮。亦即，夾持滾筒係夾持基板材的兩側端面 並運送之’且不接觸基板材的電路形成面。 (8) 此外’夾持滾筒和基板材的兩側端面係由於有藥 液介入而滑動且易滑，基板材也會有蛇行的疑慮β作爲夾 持滾筒’如果組合硬質橡膠滾筒和附有溝槽的金屬滾筒並 採用之’就能以強摩擦力和止動力，來確實防止這些問題。 (9) 那麼’因此該藥液處理裝置係發揮以下的效果。 [發明效果] <<第1效果>> -11- 1323187 第1，本發明的藥液處理裝置係因爲以液中噴射處理 方式所形成，所以解決被噴射之藥液引起的亂流、儲液、 變形等等的事故。 亦即，此藥液處理裝置係因爲以液中噴射的藥液來對 基板材進行表面處理，所以與如同空中噴射處理方式之前 述的這種習知範例，換言之，如同這種習知範例的夾持滾 筒之接觸搬送有所不同，不會有電路損傷，再者，被噴射 之藥液的亂流、儲液、滞留等等也不會發生。從而，亦消 除表面處理的遲速、過與不及、不均勻，並實現形成均勻 的電路。另外，也能迴避肇因於被空中噴射之藥液的壓力 或重量的基板材之變形、彎曲、折斷、皺折、捲縮、落下 等等事故。 <<第2效果>> 第2，此藥液處理裝置係以液中噴射處理方式所形成， 但是不會有對被液中搬送之基板材電路形成面造成損傷的 疑慮。 亦即，此藥液處理裝置的輸送裝置中，夾持滾筒係因 爲夾持基板材的兩側端面並運送之，所以與如同前述液中 噴射處理方式之這種習知範例，換言之，與類似這種習知 範例的夾持滾筒之接觸搬送不同，不會對基板材之電路形 成面造成損傷。另外，關於夾持滾筒，在成對的其中一邊 爲硬質橡膠製、另一邊爲附帶溝槽的金屬製的情況下，也 能確實防止基板材的滑動和蛇行等等，進而防止搬運的麻 煩。 叫 3187 如這般，這種習知範例中存在的問題係全部被解決等 等，本發明的發揮效果係顯著且龐大。 【實施方式】 <<關於圖面>> 以下，根據用於實施圖面所示之發明的最佳形態，來 詳細說明本發明的藥液處理裝置。 第1圖、第2圖係提供實施本發明之最佳形態的說。 然後，第1圖係全體的側截面說明圖，第2圖係主要部分 的正截面說明圖。 <<關於基板〉〉 本發明的藥液處理裝置1係在基板的製造步驟中被使 用。因而，首先就基板進行說明。 被用於電子機器的印刷接線基板等等的電路基板係小 型輕量化、極薄化、微細電路化、高密度電路化、多層化 等等的進展顯著。關於電路基板的軟硬，和一直以來的硬 固基板之硬性基板相比，撓性基板之其他極薄且柔軟之軟 性基板的進展、增加很顯著，半導體零件與電路被組合成 一體的半導體封裝基板的普及化也急速進行。 因此，作爲最近的基板要求度，係被極薄化、微細化 至板厚爲50/zm〜25/zm左右，電路寬度L和電路之間的 空間S爲2〇em〜30；am左右。 然後，這種基板係藉由例如跟隨以下的製造步驟而被 製造。亦即，在由銅張力積層板所形成的基板材A的外表 面上，y塗佈或者貼上光敏阻餓劑之後，—安排電路的負 1323187 - 片並將之曝光後’—藉由顯影來溶解除去電路形成部分之 外的光阻’->藉由蝕刻來溶解除去電路形成部分之外的銅 箔以後’—藉由剝膜除去電路形成部分的光阻，—藉由銅 箔，在基板材A的外表面上形成電路，—因此，製造出基 板。 基板就成爲這種型態。 <<關於藥液處理裝置1>> 然後’藥液處理裝置1係被用於這種基板的製造步 • 驟’且藉由藥液B來對基板材A進行表面處理。關於這種 藥液處理裝置，將進一步詳述。 此藥液處理裝置1係在基板的製造步驟中（例如顯影步 驟、蝕刻步驟、或者剝離步驟），被用作爲顯影裝置、蝕刻 裝置或者剝離裝置。然後，在此處理室2內，噴嘴4對輸 送裝置3所搬送的基板材A，噴射例如顯影液、蝕刻液、 剝離液等等的藥液B，因而，基板材A被進行了藥液處理、 g 表面處理。 作爲顯影液，使用碳酸鈉溶液、其他的鹼性溶液；作 爲蝕刻液，則使用氯化銅（Π)溶液、氯化鐵（冚）溶液、其他 的酸性溶液、腐蝕液；作爲剝離液，則使用氫氧化鈉溶液、 氫氧化鉀溶液、其他的鹼性溶液。 然後，藥液處理裝置1係在此處理室2內，具有液槽 5、輸送裝置3、噴嘴4、貯槽6等等。 首先，液槽5係被藥液B所塡滿。亦即，液槽5係被 形成在處理室2的上部，並使用兼作爲輸送裝置框架的框 -14- 1323187 架劃分壁7而被形成，且被與從噴嘴4噴射的藥液B相同 的藥液B所塡滿。 輸送裝置3係被配設在液槽5的藥液B內，在搬送方 向C上搬送基板材A，如同後面所詳述’具備運送基板材 A的多數夾持滾筒8' 9群。多數噴嘴4係配設在液槽5的 藥液B內，且位於面對被搬送之基板材A的位置’對基板 材A噴射藥液B » 藥液B係從處理室2下部的貯槽6，介由泵浦10和配 設管線11，被各噴嘴4以壓力推送，因而朝向基板材A噴 射。然後，被噴射後從基板材A反射’反彈回來的藥液B 係被液槽5中的藥液B所吸收、同化，其結果’從液槽5 溢出的藥液B係在下部的貯槽6被回收。被貯槽6回收的 藥液B係在被儲存的同時，事後再被壓力推送至各噴嘴4, 而被循環使用。 此外，作爲噴嘴4，以實心圓錐噴嘴爲首，可使用各 種類型者，亦可使用細縫噴嘴。此外，圖示的噴嘴4係朝 向基板材A的內外兩面而被配設成互相面對，但是也考慮 到了基板材A在電路形成面E只有單面的單面基板之情況 下，僅朝向此單面而被配設成互相面對的情況。 藥液處理裝置1係以此方式形成。 <<關於輸送裝置3的槪要>> 以下，進一步詳述關於藥液處理裝置1的輸送裝置3。 輸送裝置3係具備多數夾持滾筒8、9群。然後，作爲搬送 滾筒的夾持滾筒8、9群係在液槽5內，在上下等等分別成 -15- 1323187 對的同時，沿著搬送方向c，在前後相互之間分別在前後 隔著間隔，而被列設成多數。 此外，圖示範例的輸送裝置3係變成可水平搬送基板 材A，該夾持滾筒8、9則是被配設成分別上下成對，基板 材A係被水平搬送於液槽5中。不過，並非被限定於這種 水平搬送方式，垂直搬送方式和傾斜搬送方式的輸送裝置 3也可以。亦即，將此夾持滾筒8、9分別配設成左右成對、 或配設成傾斜成對，因而也有可能是將基板材A進行垂直 搬送或傾斜搬送的方式。 輸送裝置3係大致上以此方式形成。 <<關於夾持滾筒8、9>> 接著，說明關於輸送裝置3的夾持滾筒8、9。夾持滾 筒8、9係由夾持基板材A的兩側端面D並運送之的驅動 滾筒所形成。 進一步詳述關於這種夾持滾筒8、9。首先，夾持滾筒 8、9係由被轉動驅動的驅動滾筒所形成，並介由軸12、13、 傳達齒輪14、15、16、驅動齒輪17、驅動軸18等等，而 被連接至馬達等等的驅動機構（未圖示）。 圖中的1 9係控制調整部、20係位準調整部，兩者係分 別被使用來調整上位的軸1 2、然後上位之夾持滾筒8的上 下位置、以及下位的軸13、然後下位之夾持滾筒9的上下 位置。亦即，藉由兩者，成爲可限制、調整上下成對的上 位之夾持滾筒8與下位之夾持滾筒9之間的些微上下間 隔。換言之，藉由上位的控制調整部1 9來調整上位之軸12 -16- 1323187 的高度位置，藉由下位之位準調整部20來調整下位之軸13 的高度位置，藉以限制、調整滾筒之間的上下間隔。 然後，圖示的輸送裝置3係因爲水平搬送基板材A ’ 所以該夾持滾筒8、9係在上下成對的同時被左右配設，分 別從上下夾持基板材A的左右兩側端面D並搬送之。 另外，基板材A係由中央部的電路形成面E、其外周 緣的前後端及左右兩側端面D所構成，前後端和兩側端面 D也被稱做耳部，並成爲非電路形成面。然後，夾持滾筒8, 9係在圖示範例中，從上下夾持這種基板材A的左右兩側 端面D並搬送之，且被左右配設。 另外，在第2圖所示的範例中，以此方式夾持基板材 A並搬送之成對的一邊的滚筒8係由例如硬質橡膠製的軟 胃材料所構成，另一邊的滾筒9係由例如金屬製的硬質材 料所構成，且在外周面形成溝槽21。然後，在這種兩個夾 持滚筒8、9之間，能夠壓接、挾持基板材A的兩側端面向 D ’且不會造成滑動、蛇行地進行搬送。 亦即，在圖示範例中，上下成對的上位之夾持滾筒8 係由硬質橡膠滾筒F所構成，下位之夾持滾筒9係由附有 '德槽2〗的金屬滾筒G所構成。溝槽2 1係被形成於外周面， ®!示範例中，係被形成爲周縱溝槽，但可以是其他各種溝 憎形狀，例如橫溝槽、傾斜溝槽、彎曲溝槽 '分散溝槽等 等亦可。然後，藉由這種上下之例如硬質橡膠滾筒F製之 軟質材料以及附有溝槽2 1之例如金屬滾筒G製之硬質材料 的組合，基板材A的兩側端面D係被來自上下的強大摩擦 1323187 力和止動力所壓接、挾持。 此外’夾入基板材A之兩側端面d的滾筒8、9間的 間隔' 圖示範例中上位之左右的夾持滾筒8之間的左右間 隔、以及下位之左右的夾持滾筒9之間的左右間隔係較佳 爲對應基板材A的左右尺寸而作爲可變動。亦即，對應被 搬送之基板材A的左右尺寸’也就是該兩側端面d的位 置，能使夾持滾筒8、9分別左右移動時，能容易地應用於 各種尺寸的基板材A® 夾持滚筒8、9係以此方式構成。 <<作用等等>> 本發明的藥液處理裝置】係如同以上所說明地構成。 因而，如以下所形成。 (1) 此藥液處理裝置1，係被用於基板之製造步驟中， 藉由藥液B來對基板材A進行表面處理。例如，在撓性基 板 '其他的軟性基板之製造步驟中被使用，因而，藉由藥 液B來對極薄且柔軟的基板材A進行表面處理。 (2) 亦即，藥液處理裝置1係在成爲基板之製造步驟 的核心之例如顯影步驟、蝕刻步驟、或者剝離步驟中，被 使用作爲顯影裝置、鈾刻裝置或者剝離裝置。然後，用輸 送裝置3來搬送基板材A，並且從噴嘴4噴射顯影液、蝕 刻液、或者剝離液的藥液B，因而對基板材A進行用於形 成電路的表面處理。 (3) 那麼，此藥液處理裝置1係具備與被噴射之藥液 B相同的藥液B所塡滿的液槽5，在藥槽5的藥液B中， -18- 1323187 配設有輸送裝置3和噴嘴4。然後’基板材A係藉由從噴 嘴4被液中噴射的藥液B，而被進行表面處理。 (4) 亦即，從噴嘴4噴射的藥液B係受到液槽5中之 周遭的藥液B的抵抗而被限制，因而在液槽5之藥液B中 不擴散地前進直行，直射基板材A的電路形成面E並進行 表面處理。 然後，此藥液B係受到液槽5中之周遭的藥液B的抵 抗而被限制，因而不會流動於基板材A的電路形成面E， 而是從電路形成面E反射，彈回至液槽5中的藥液B，被 液槽5中的藥液所吸收、同化。 (5) 在此藥液處理裝置1中，藥液B係以此方式被液 中噴射，所以被噴射的藥液B係不會流動於基板材A的電 路形成面E，因而被噴射的藥液B之在基板材A的電路形 成面E上形成的亂流、儲液、滞留等等就不會發生。藥液 B係對應於基板材A而遂時更新。另外，因爲藥液B被液 中噴射，所以肇因於被噴射之藥液B的壓力或重量，基板 材A之變形、彎曲、折斷、皴折、捲縮、落下等等也不會 發生。 (6) 那麼，在此藥液處理裝置1中，輸送裝置3係被 配設在液槽5之藥液B中的同時，輸送裝置3係具備夾持 滾筒8、9群。然後，夾持滾筒8、9係夾持作爲基板材A 之非電路形成面的兩側端面D，並在搬送方向c上運送基 板材A'。 (7) 此藥液處理裝置1的輸送裝置3係具備這種搬送 -19- 1323187 用的夾持滾筒8' 9，因而，幾乎不會有基板材A的電路形 成面E被損傷的疑慮。亦即，夾持滾筒8、9係因爲夾持基 板材A之電路形成面E之外的兩側端面D而運送之，所以 基板材A的電路形成面E不可能在搬送途中受到損傷。 (8)此外，關於輸送裝置3的夾持滾筒8、9，在用以 挾持基板材A之兩側端面D並運送之的在上下成對的其中 一邊被作爲硬質橡膠滾筒F，另一邊則被作爲附有溝槽21 的金屬滾筒G的時候，成爲如以下所述。 亦即，這種藥液B(例如：顯影液和剝離液等等的鹼性 溶液）係非常黏滑而滑溜，在這種藥液B中，成對的夾持滾 筒8、9與被其所夾持的基板材A之兩側端面D係由於這 種藥液B的介入，變得滑溜而容易滑動，因而基板材A不 在搬送方向C上被搬送，也有蛇行的疑慮。 相對於此，將例如硬質橡膠滾筒F製的軟質材料、和 附有溝槽2 1之例如金屬滾筒G製的硬質材料進行組合時， 這種滑動，滑行，蛇行等等被確實地防止。基板材A的兩 側端面D係無關於藥液B的介入，藉由這種組合之夾持滾 筒8、9之間的強大摩擦力與止動力，而被壓接、挾持而被 運送。 <<其他>> 在此，比較本發明與最近的這種習知範例，並描述關 於搬送系統之相關技術上的根本相異點。 在本發明之藥液處理裝置1的輸送裝置3中，如以上 所說明，在搬送虛弱柔軟的極薄材等等之基板材A的時 -20- 1323187 候’夾持滾筒8、9係已採用一種搬送系統，該搬送系統係 從上下等等夾持基板材A之非電路形成面的左右等之兩側 端面D並搬送之。變成完全不需接觸到基板材a中央部的 電路形成面。 相對於此，最近的這種習知範例係由搬送系統所形 成’該搬送系統係爲：在搬送虛弱柔軟的極薄材等等之基 板材A的時候，在其中央附近，沿著前後的搬送方向c而 將非電路形成面設定成線狀，並藉由以上下的滾輪等等所 形成之夾持滾筒，將以此方式設定爲線狀的非電路形成面 夾持、保持並搬送之。 如這般，在本發明中，相對於以左右2點支持來運送 基板材A，最近的這種習知範例中，係以中央的1點支持、 或者是包括中央的3點支持，代表性地以中央附近的3點 支持來運送基板材A，搬送系統的相關技術思想係根本上 完全不同。 本發明和這種習知範例係如同這般地在左右支持或者 中央支持方面明確地不同，在本發明中，係具備以下重大 的優點：不需要刻意在中央設定非電路形成面，中央部係 可以全部使用作爲電路形成面，基板材之電路形成係在面 積方面變得有效率等等。 【圖式簡單說明】 第1圖係關於本發明之藥液處理裝置，用於說明實施 發明的最佳形態，全體的側截面說明圖。 第2圖係用於說明實施同發明的最佳形態，主要部分 -21- 1323187 的正截面說明圖。1323187 IX. Description of the Invention: [Technical Field to Which the Invention Is Along] The present invention relates to a chemical treatment apparatus. That is, with respect to a chemical processing apparatus which is employed in the manufacturing step of the substrate, the substrate is surface-treated by the chemical liquid. [Prior Art] <<Technical Background>> The circuit board for an electronic device is small in size, lighter in thickness, and more flexible, and the circuit is formed to be finer. Significant. Then, in the manufacturing step of such a substrate, a chemical processing apparatus is used, and the base sheet is subjected to the treatment surface by the injected chemical liquid. For example, a chemical solution such as a developing solution, an etching solution, a stripping solution, or the like is applied, and thus a surface treatment such as development, etching, peeling, or the like is performed. <<Conventional Technology>> In the chemical solution processing apparatus of the above-described conventional example, the base material sheet is conveyed by the transport roller of the transport device, and the chemical liquid is ejected from the nozzle, thereby sequentially performing development, etching, and Surface treatment such as peeling, and manufacturing of a substrate on which a circuit is formed. Then, the conveying device or the nozzle system is generally disposed in the atmosphere and air, and the base plate is subjected to the treatment surface by the liquid medicine sprayed in the atmosphere and the air. On the other hand, a chemical processing apparatus that performs surface treatment by disposing a transport device or a nozzle in a chemical solution is also being developed. That is, the transport device or the nozzle is disposed in the liquid tank filled with the chemical liquid, and thus the chemical liquid processing apparatus for surface-treating the base material by the chemical liquid sprayed by the liquid spray 1323187 also appears. <<Prior Art Document Information> As such a chemical liquid processing apparatus, for example, those shown in the following Patent Documents 1 and 2 can be cited. Patent Document 1 relates to an air jet processing method. Patent Document 2 relates to a liquid in-liquid jet processing method. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. . <<First Problem Point>> First, the following problem is pointed out in the chemical liquid processing apparatus of the air jet processing method. In other words, the liquid chemical to be ejected flows in the left-right width direction orthogonal to the front-rear transport direction, and the surface of the base material sheet is subjected to surface treatment, and then flows down from the left and right sides. However, not all of the liquid medicine flows in the width direction of the left and right as expected, and on the other hand, it is easy to become turbulent in the direction of the front and rear conveyance, and it becomes a liquid in the center and stays. Then, if such turbulence and liquid storage occur, it will hinder the renewal of the liquid medicine, and cause the surface treatment to be delayed, too late, and uneven, which may cause obstacles to the circuit forming the uniform sentence, and the circuit is fine. The high density and high density have become a big problem in the progress of the substrate. Further, such a base sheet is weak and soft due to extremely thinning, but for this base sheet, the liquid medicine is sprayed with the ejection pressure or weight. Therefore, it has been pointed out that most of the base sheets cannot be stably transported by the conveying device. Due to the pressure or weight of the sprayed liquid of 1323187, the substrate to be conveyed is often deformed, bent, broken, wrinkled, curled, dropped, and the like. <<Second Problem Point>> The second liquid chemical treatment device for the liquid-injection treatment method is pointed out as follows. This chemical processing apparatus has been developed to solve the above-mentioned first problem, that is, the problem of the liquid chemical processing apparatus of the air jet processing method, but it is sandwiched between the continuous roller group and the roller group above and below the conveyor. The base material to be conveyed in the middle is pointed out that the circuit forming surface is in contact with the continuous roller and the roller to be damaged. <<>>>>> The medical liquid processing apparatus of the present invention has been developed in order to solve the problems of the above-described conventional examples. Then, an object of the present invention is to provide a chemical liquid processing apparatus. First, the turbulent flow, liquid storage, and deformation accident caused by the sprayed chemical liquid are solved, and at the same time, the second circuit is not formed during transport. The face is causing damage. [Method for Solving the Problem] <<About Patent Application Range>> The technical means of the present invention for solving such a problem is as follows. First, regarding the first item of the scope of patent application, as described below. The chemical liquid processing apparatus according to claim 1 is used in the manufacturing step of the substrate, and the base material is surface-treated by the chemical liquid, and is characterized in that: the liquid tank is filled with the chemical liquid; a conveying device disposed in the liquid tank and conveying the base plate; and a nozzle disposed in the liquid tank and spraying the chemical liquid to the base plate; wherein the conveying device is provided with a circuit that does not connect to the 1323187 A nip roller group for transporting the base material is formed by forming a surface, and the nip roller is constituted by a driving roller that sandwiches both end faces of the base material and is conveyed. Regarding item 2 of the scope of patent application, it is as follows. In the liquid chemical processing device of claim 2, in the first item of the patent application scope, the roller which sandwiches and transports the base plate and one of the pair is made of a soft material; the other roller is composed of The hard material is formed, and a groove is formed on the outer peripheral surface, and between the two such holding rollers, the base plate is crimped and held, and the base plate is not slid and serpentinely conveyed. Regarding item 3 of the scope of patent application, it is as follows. In the liquid chemical processing apparatus of claim 3, in the first aspect of the patent application, the chemical processing apparatus is used in a developing step, an etching step' or a peeling step of a substrate manufacturing step, the liquid medicine is The composition of the developer, the etching solution, or the stripping liquid is composed of a flexible substrate and other extremely thin materials. Regarding item 4 of the scope of patent application, it is as follows. In the liquid chemical processing device of claim 4, in the first aspect of the patent application, the conveying device horizontally conveys the base plate, and the holding roller is disposed in the upper and lower sides while being disposed on the left and right respectively The left and right end faces of the base plate are clamped and transported. <<About Effect, etc.>> The present invention is constituted by these means, and is as follows. (1) This chemical processing apparatus is used in the substrate manufacturing step to perform chemical treatment on the substrate. -10- 1323187 (2) For example, in the developing step, the etching step, or the peeling step, the substrate is conveyed by the conveying device and the liquid is ejected from the nozzle to perform surface treatment. (3) Then, a conveying device and a nozzle are disposed in a tank filled with the same chemical solution as the liquid medicine to be sprayed. (4) Therefore, the liquid chemical to be ejected advances immediately in the liquid, and after the surface of the circuit formation surface of the substrate material is subjected to surface treatment, it is not reflected on the surface of the substrate and is reflected, and is absorbed into the chemical liquid of the liquid tank. (5) In this chemical treatment device, the chemical liquid does not flow on the surface of the base material, and turbulent flow, liquid storage, retention, and the like of the chemical liquid do not occur. In addition, the deformation, bending, breaking, wrinkling, curling, dropping, etc. of the base sheet due to the pressure or weight of the sprayed chemical liquid may not occur. (6) Then, in the liquid chemical processing apparatus The clamping roller of the conveying device clamps the end faces of both sides of the base plate and transports them. (7) Therefore, there is no doubt that the surface of the substrate circuit to be transferred by the liquid may be damaged. That is, the nip roller holds the both end faces of the base material and carries it and does not contact the circuit forming surface of the base material. (8) In addition, the 'end faces of the holding roller and the base plate slide and slippery due to the intervention of the liquid, and the base plate also has the suspicion of snakes as a clamping roller'. If the hard rubber roller is combined with a groove The metal drum of the groove can be used to prevent these problems with strong friction and stopping power. (9) Then, the chemical treatment device has the following effects. [Effect of the Invention] <<First Effect>> -11- 1323187 First, the chemical solution processing apparatus of the present invention is formed by a liquid-injection treatment method, thereby solving the disorder caused by the injected chemical liquid. Accidents such as flow, liquid storage, deformation, etc. That is, the chemical treatment device is a surface treatment of the base material by the liquid medicine sprayed in the liquid, and thus is a conventional example like the above-described air jet treatment method, in other words, like this conventional example. The contact transfer of the holding roller is different, there is no circuit damage, and the turbulent flow, liquid storage, retention, etc. of the injected chemical liquid will not occur. Therefore, the retardation, the overshoot, and the unevenness of the surface treatment are also eliminated, and a uniform circuit is formed. In addition, it is also possible to avoid the deformation, bending, breaking, wrinkling, curling, falling, and the like of the base plate due to the pressure or weight of the liquid sprayed by the air. <<Second effect>> Second, the chemical liquid processing apparatus is formed by a liquid-injection treatment method, but there is no doubt that the surface of the substrate circuit to be transferred by the liquid is damaged. That is, in the conveying device of the liquid chemical processing device, the holding roller is carried by the both end faces of the base plate and is transported, so that it is similar to the conventional example of the above-described liquid jet processing method, in other words, similar The contact transfer of the gripping roller of this conventional example is different, and does not cause damage to the circuit forming surface of the base plate. Further, in the case where the pair of the holding rolls is made of a hard rubber and the other side is made of a metal having a groove, it is possible to surely prevent the sliding and the meandering of the base plate, and the like, thereby preventing the trouble of conveyance. 3187 As such, the problems in the conventional examples are all solved, and the effects of the present invention are remarkable and large. [Embodiment] <<About Drawing>>> Hereinafter, the chemical liquid processing apparatus of the present invention will be described in detail based on the best mode for carrying out the invention shown in the drawings. Fig. 1 and Fig. 2 are diagrams showing the best mode for carrying out the invention. 1 is a side cross-sectional explanatory view of the whole, and FIG. 2 is a front cross-sectional explanatory view of a main part. <<About Substrate> The chemical processing apparatus 1 of the present invention is used in the manufacturing step of the substrate. Therefore, the substrate will first be described. Circuit boards used for printed wiring boards and the like of electronic equipment have been progressing significantly in terms of small size, light weight, extremely thin circuit, fine circuit, high-density circuit, multilayer, and the like. Regarding the softness and hardness of the circuit board, compared with the rigid substrate of the conventional hard solid substrate, the development and increase of other extremely thin and flexible flexible substrates of the flexible substrate are remarkable, and the semiconductor component and the circuit are combined into a single semiconductor package. The popularization of substrates has also proceeded rapidly. Therefore, the most recent substrate requirement is extremely thinned and miniaturized to a thickness of about 50/zm to 25/zm, and the circuit width L and the space S between the circuits are about 2 〇em to 30; Then, such a substrate is manufactured by, for example, following the following manufacturing steps. That is, on the outer surface of the base material A formed by the copper tensile laminate, after y coating or affixing the photosensitive hunger, the negative 1323187 of the circuit is arranged and exposed. To dissolve and remove the photoresist other than the circuit forming portion '-> after etching to remove the copper foil other than the circuit forming portion'--by removing the photoresist of the circuit forming portion by stripping, by copper foil, An electric circuit is formed on the outer surface of the base material A, and thus, a substrate is manufactured. The substrate becomes this type. <<Regarding chemical liquid processing apparatus 1>> Then, the chemical liquid processing apparatus 1 is used for the manufacturing step of such a substrate, and the base material A is surface-treated by the chemical liquid B. This chemical treatment apparatus will be described in further detail. This chemical processing apparatus 1 is used as a developing device, an etching device, or a peeling device in a manufacturing step of a substrate (e.g., a developing step, an etching step, or a peeling step). Then, in the processing chamber 2, the nozzle 4 ejects the chemical liquid B such as a developing solution, an etching liquid, a peeling liquid, and the like to the base material A conveyed by the conveying device 3, whereby the base material A is subjected to the chemical liquid treatment. , g surface treatment. As the developer, a sodium carbonate solution or another alkaline solution is used. As the etching solution, a copper chloride solution, a ferric chloride solution, another acidic solution, or an etching solution is used. A sodium hydroxide solution, a potassium hydroxide solution, and other alkaline solutions are used. Then, the chemical processing apparatus 1 is housed in the processing chamber 2, and has a liquid tank 5, a conveying device 3, a nozzle 4, a storage tank 6, and the like. First, the liquid tank 5 is filled with the chemical liquid B. That is, the liquid tank 5 is formed in the upper portion of the processing chamber 2, and is formed using the frame partition wall 7 which also serves as the frame of the conveying device, and is the same as the chemical liquid B sprayed from the nozzle 4. Liquid medicine B is full. The transport device 3 is disposed in the chemical solution B of the liquid tank 5, and transports the base material A in the transport direction C, as will be described later in detail as a plurality of gripping drums 8' 9 having the transport base sheet A. A plurality of nozzles 4 are disposed in the chemical solution B of the liquid tank 5, and are located at a position facing the substrate A to be conveyed, 'spraying the chemical liquid B to the base material A» The chemical liquid B is from the storage tank 6 at the lower portion of the processing chamber 2. The pump 10 and the distribution line 11 are pushed by the respective nozzles 4 by pressure, and thus are sprayed toward the base material A. Then, the chemical liquid B which is bounced back from the base material A after being sprayed is absorbed and assimilated by the chemical liquid B in the liquid tank 5, and as a result, the chemical liquid B overflowing from the liquid tank 5 is tied to the lower storage tank 6. Be recycled. The chemical liquid B recovered by the storage tank 6 is stored and simultaneously pressurized by pressure to the respective nozzles 4 to be recycled. Further, as the nozzle 4, a solid conical nozzle is used, and various types can be used, and a slit nozzle can also be used. Further, the illustrated nozzles 4 are disposed to face each other toward the inner and outer surfaces of the base material sheet A, but it is also considered that the base sheet material A is only facing the single-sided substrate having one side of the circuit forming surface E. One side is arranged to face each other. The chemical treatment device 1 is formed in this manner. <<About the conveyance device 3>> Hereinafter, the transport device 3 of the chemical solution processing device 1 will be described in further detail. The transport device 3 is provided with a plurality of grip rollers 8 and 9 groups. Then, the group of the holding drums 8 and 9 as the conveying rollers are attached to the liquid tank 5, and the pair of upper and lower sides are respectively -15 - 1323187 pairs, and the conveying direction c is interposed between the front and the rear. Interval, and is listed as a majority. Further, the transport device 3 of the illustrated example is configured to horizontally transport the substrate material A, and the nip rollers 8 and 9 are disposed so as to be vertically paired, and the substrate material A is horizontally transported into the liquid tank 5. However, it is not limited to such a horizontal transport method, and the transport apparatus 3 of the vertical transport method and the tilt transport method may be used. In other words, the holding rollers 8 and 9 are disposed in pairs or in pairs, or are arranged in a paired manner. Therefore, the base sheet A may be vertically conveyed or tilted. The conveying device 3 is formed substantially in this manner. <<About the gripper drums 8, 9>> Next, the grip rollers 8 and 9 of the transport device 3 will be described. The nip rolls 8, 9 are formed by a drive roller that holds the both end faces D of the base sheet A and conveys them. Further details regarding such gripping drums 8, 9 are described. First, the nip rollers 8, 9 are formed by a rotationally driven drive roller and are coupled to the motor via the shafts 12, 13, the communication gears 14, 15, 16, the drive gear 17, the drive shaft 18, and the like. Drive mechanism (not shown). In the figure, the ninth system control adjustment unit and the 20-series level adjustment unit are used to adjust the upper shaft 1 and then the upper and lower positions of the upper clamping drum 8, and the lower shaft 13, and then the lower position. The upper and lower positions of the grip roller 9 are clamped. That is, by both of them, it is possible to restrict and adjust the slight upper and lower intervals between the upper and lower nip rollers 8 and the lower nip roller 9. In other words, the height position of the upper axis 12-16-1323187 is adjusted by the upper control adjusting unit 19, and the height position of the lower axis 13 is adjusted by the lower level adjusting unit 20, thereby limiting and adjusting the roller. The upper and lower intervals. Then, the transport apparatus 3 shown in the figure is configured to convey the base material A' horizontally, so that the clamp drums 8 and 9 are arranged side by side while being paired up and down, and the left and right end faces D of the base sheet A are respectively clamped from above and below. And transport it. Further, the base sheet A is composed of a circuit forming surface E at the center portion, front and rear ends of the outer peripheral edge, and right and left end faces D. The front and rear ends and the side end faces D are also referred to as ear portions, and become non-circuit forming faces. . Then, the grip rollers 8, 9 are held in the illustrated example, and the left and right end faces D of the base material A are sandwiched from above and below and transported, and are disposed to the left and right. Further, in the example shown in Fig. 2, the roller 8 which sandwiches the base material A in this manner and conveys the paired side is composed of, for example, a soft stomach material made of hard rubber, and the roller 9 on the other side is composed of For example, it is composed of a hard material made of metal, and a groove 21 is formed on the outer peripheral surface. Then, between the two holding drums 8, 9, the both end faces of the base material A can be crimped and held so as not to cause sliding or meandering. That is, in the illustrated example, the upper and lower pair of holding rollers 8 are composed of a hard rubber roller F, and the lower holding roller 9 is composed of a metal roller G with a 'de groove 2'. The groove 2 1 is formed on the outer peripheral surface, and in the ®! example, it is formed as a circumferential longitudinal groove, but may be in various other groove shapes, such as a lateral groove, an inclined groove, and a curved groove. Slots and so on. Then, by the combination of the upper and lower soft materials such as the hard rubber roller F and the hard material made of the groove 21, such as the metal roller G, the both end faces D of the base plate A are strongly from the top and bottom. Friction 1323187 Force and stop power are crimped and held. Further, 'the interval between the rollers 8 and 9 sandwiching the both end faces d of the base material A' is shown in the example where the left and right intervals between the upper and lower grip rollers 8 and the lower left and right grip rollers 9 are The left and right intervals are preferably variably corresponding to the left and right dimensions of the base sheet A. That is, corresponding to the left and right dimensions ' of the substrate A to be conveyed, that is, the positions of the both end faces d, the clamp rollers 8 and 9 can be easily applied to the base plate A® clips of various sizes when moving left and right, respectively. The holding rollers 8, 9 are constructed in this manner. <<Action, etc.>> The chemical solution processing apparatus of the present invention is configured as described above. Thus, it is formed as follows. (1) This chemical processing apparatus 1 is used in the manufacturing process of a substrate, and the base material A is surface-treated by the chemical liquid B. For example, it is used in the manufacturing step of the flexible substrate 'other flexible substrate. Therefore, the extremely thin and flexible base material A is surface-treated by the chemical liquid B. (2) That is, the chemical processing apparatus 1 is used as a developing device, an uranium engraving device, or a peeling device in a developing step, an etching step, or a peeling step which is the core of the manufacturing step of the substrate. Then, the base material A is conveyed by the conveying device 3, and the developing liquid, the etching liquid, or the chemical liquid B of the peeling liquid is ejected from the nozzle 4, whereby the base material A is subjected to surface treatment for forming the circuit. (3) Then, the chemical solution processing apparatus 1 is provided with a liquid tank 5 filled with the same chemical liquid B as the chemical liquid B to be sprayed, and in the chemical liquid B of the medicine tank 5, -18-1323187 is provided. Conveying device 3 and nozzle 4. Then, the base sheet A is surface-treated by the chemical liquid B sprayed from the liquid to the nozzle 4. (4) In other words, the chemical liquid B ejected from the nozzle 4 is restricted by the resistance of the chemical liquid B surrounding the liquid tank 5, so that the chemical liquid B in the liquid tank 5 advances straight without diffusion, and the direct basis The circuit of the sheet A forms the face E and is subjected to surface treatment. Then, the chemical liquid B is restricted by the resistance of the chemical liquid B around the liquid tank 5, and therefore does not flow on the circuit forming surface E of the base material A, but is reflected from the circuit forming surface E, and bounces back to The chemical liquid B in the liquid tank 5 is absorbed and assimilated by the chemical liquid in the liquid tank 5. (5) In the chemical solution processing apparatus 1, the chemical liquid B is ejected in the liquid in this manner, so that the chemical liquid B to be ejected does not flow on the circuit forming surface E of the base material A, and thus the medicine to be ejected is used. The turbulent flow, liquid storage, retention, and the like formed on the circuit forming surface E of the base material A of the liquid B do not occur. The chemical liquid B is updated in response to the base material A. Further, since the chemical liquid B is ejected from the liquid, the deformation, bending, breaking, folding, curling, dropping, and the like of the substrate A do not occur due to the pressure or weight of the chemical liquid B to be ejected. (6) In the chemical solution processing apparatus 1, the transport apparatus 3 is disposed in the chemical liquid B of the liquid tank 5, and the transport apparatus 3 is provided with the holding drums 8 and 9. Then, the grip rollers 8 and 9 sandwich the both end faces D which are the non-circuit forming faces of the base sheet A, and convey the substrate A' in the transport direction c. (7) The conveying device 3 of the chemical processing device 1 is provided with the holding roller 8' for transporting 190-1323187. Therefore, there is almost no fear that the circuit forming surface E of the base material A is damaged. That is, since the nip rollers 8 and 9 are conveyed by the both end faces D other than the circuit forming surface E of the base material A, the circuit forming surface E of the base material A is unlikely to be damaged during transportation. (8) Further, the grip rollers 8 and 9 of the transport device 3 are used as the hard rubber roller F on one side of the upper and lower pairs, which are used to hold the both end faces D of the base material A, and are transported on the other side. When it is used as the metal roll G with the groove 21, it is as follows. That is, the chemical solution B (for example, an alkaline solution of a developing solution and a stripping solution, etc.) is very viscous and slippery, in which the pair of holding rollers 8, 9 are The end faces D on both sides of the sandwiched base material A are slippery and easy to slide due to the intervention of the chemical liquid B, and therefore the base material A is not conveyed in the conveyance direction C, and there is a concern that the meandering is performed. On the other hand, when a soft material made of, for example, a hard rubber roller F and a hard material made of, for example, a metal roller G with a groove 21 are combined, such sliding, sliding, meandering, and the like are reliably prevented. The both end faces D of the base sheet A are not involved in the chemical liquid B, and are pressed and held by the combined frictional force and the stopping force between the holding rollers 8, 9. <<Other>> Here, the present invention and the most recent such conventional example are compared, and a fundamental difference in the related art regarding the transport system is described. In the conveying device 3 of the chemical processing apparatus 1 of the present invention, as described above, when the base sheet A of the weak and soft ultra-thin material or the like is conveyed, the -20- 1323 187 'clamping drums 8, 9 have been A transfer system is used which holds the both end faces D of the left and right sides of the non-circuit forming surface of the base material A from the top and bottom, and the like. It becomes a circuit forming surface which does not need to be in contact with the central portion of the base material a at all. On the other hand, this recent conventional example is formed by a transport system in which the transfer system is: near the center of the base sheet A of the weak soft ultra-thin material, etc., along the front and rear In the conveyance direction c, the non-circuit forming surface is set in a line shape, and the non-circuit forming surface which is set in a line shape in this manner is held, held, and conveyed by the holding roller formed by the above-described roller or the like. . As described above, in the present invention, the base material A is transported with respect to the support of the left and right points. In the recent conventional example, the central point is supported by one point, or the central point is supported by three points. The ground plate A is transported at a three-point support near the center, and the related technical ideas of the transport system are fundamentally different. The present invention and such conventional examples are clearly different in terms of left and right support or central support as in this case, and in the present invention, there is a significant advantage that there is no need to deliberately set a non-circuit forming surface in the center, and the central portion is It can be used all as a circuit forming surface, and the circuit formation of the base material becomes efficient in terms of area and the like. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a preferred embodiment of the invention and a side cross-sectional view of the entire invention. Fig. 2 is a front cross-sectional explanatory view for explaining the best mode of the invention, and the main portion -21 - 1323187.
【主要元件符號說明】 1 藥液處理裝置 2 處理室 3 輸送裝置 4 5 液槽 6 貯槽 7 框架劃分壁 8 夾持滚筒（上位） 9 夾持滚筒（下位） 10 泵浦 11 配設管線 12 軸（上位） 13 軸（下位） 14 傳達齒輪 15 傳達齒輪 16 傳達齒輪 17 驅動齒輪 18 驅動軸 19 控制調整部 20 位準調整部 21 溝槽 A 基板材 -22 1323187 B 藥液 C 搬送方向 D 兩側端面 E 電路形成面 F 硬質橡膠滾筒 G 金屬滾筒[Main component symbol description] 1 Chemical liquid processing device 2 Processing chamber 3 Conveying device 4 5 Liquid tank 6 Storage tank 7 Frame partition wall 8 Clamping drum (upper position) 9 Clamping drum (lower position) 10 Pump 11 Distribution line 12 shaft (Upper) 13 Axis (lower position) 14 Communication gear 15 Communication gear 16 Communication gear 17 Drive gear 18 Drive shaft 19 Control adjustment unit 20 Position adjustment unit 21 Groove A Base plate-22 1323187 B Liquid C Direction of transport D End face E circuit forming surface F hard rubber roller G metal roller