CN101155479A - Liquid medicine processing device - Google Patents
Liquid medicine processing device Download PDFInfo
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- CN101155479A CN101155479A CNA2007101541508A CN200710154150A CN101155479A CN 101155479 A CN101155479 A CN 101155479A CN A2007101541508 A CNA2007101541508 A CN A2007101541508A CN 200710154150 A CN200710154150 A CN 200710154150A CN 101155479 A CN101155479 A CN 101155479A
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- baseplate material
- clamping
- chemical solution
- treating device
- liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
Abstract
The present invention relates to a medicine liquid processing device, first, resolves turbulence, liquid storage, and deformation problem caused by injected medicine liquid, second prevents floatation, instigation and deformation conveying puzzles in liquid, and can not damage the circuit forming surface yet. The medicine liquid processing device is used in the substrate manufacturing working procedure, to process surface process to the substrate material by medicine liquid. And it has a liquid tank filled with medicine liquid; a conveying machine arranged in the liquid tank and conveying the substrate material; a nuzzle arranged in the liquid tank and injecting the medicine liquid to the substrate material. The conveying machine has a clamping cylinder group for conveying the substrate material, these clamping cylinders are composed of a drive cylinder for clamping the substrate material both sides end surfaces and conveying, such as clamping cylinder of one side for clamping and conveying is composed of soft material; clamping cylinder of the other side is composed of hard material forming with groove at peripheral surface.
Description
Technical field
The present invention is about a kind of chemical solution treating device.That is, be used for the manufacturing process of substrate and utilize soup that baseplate material is carried out the surface-treated chemical solution treating device about a kind of.
Background technology
All the time, the progress of miniaturization and, ultra-thinization, flexibleization that is used for the circuit substrate of e-machine is very remarkable, and the miniaturization of the circuit of formation, densification are also very remarkable.
And, in the manufacturing process of this substrate, be used chemical solution treating device, utilize the soup that sprays that baseplate material is carried out surface treatment.For example, soups such as spray developing liquid, etching solution, stripper develop thus, etching, surface treatment such as peel off.
In the chemical solution treating device of this conventional example, the conveyance cylinder conveyance of baseplate material by conveyer simultaneously from the nozzle ejection soup, developed successively thus, etching, surface treatment such as peeled off, and forms circuit, makes substrate.Then, general conveyer, the nozzle of in atmosphere, setting in the air, the aerial soup that sprays that utilizes carries out surface treatment to baseplate material in atmosphere.
To this, also developing and conveyer, nozzle are provided in the soup and carry out the surface-treated chemical solution treating device.That is, conveyer, nozzle are provided in the liquid bath that is full of soup, have also occurred utilizing the soup that sprays in the liquid that baseplate material is carried out the surface-treated chemical solution treating device thus.
As this chemical solution treating device, for example, can enumerate the device shown in the following patent documentation 1,2.Patent documentation 1 is the device about aerial injection processing mode, and patent documentation 2 is the devices about inject process mode in the liquid.
[patent documentation 1] TOHKEMY 2002-68435 communique
[patent documentation 2] Japanese kokai publication hei 10-079565 communique
Summary of the invention
There is following problem in existing example about such.
The 1st, about the chemical solution treating device of aerial injection processing mode, there is following problem.That is, the soup of injection carries out surface treatment to the baseplate material surface when transversely flowing about vertical with front and back conveyance direction, flow down from limit, the left and right sides then.But, not all soup is all according to transversely flowing about being expected at, and in addition, forms turbulent flow easily on front and back conveyance direction and flows, at central portion formation liquid storage and be detained.
And, if this turbulent flow and liquid storage take place, can hinder the renewal of soup, it is slow too much or very few inhomogeneous to produce surface-treated, produces obstacle to forming uniform circuit, and the miniaturization that improves circuit, the substrate of densification are formed very big problem.
In addition, ultra-thinization of this baseplate material is remarkable, and be easy to break and soft, but since expulsion pressure or weight be ejected on this baseplate material with soup, so exist baseplate material can't be transferred the problem that machine is stablized conveyance mostly.Because the pressure or the weight of the soup that sprays, the baseplate material of conveyance is often deformed, crooked, fracture, gauffer, accident such as crispatura, fall.
The 2nd, there is following problem in the chemical solution treating device about inject process mode in the liquid.This chemical solution treating device is the device of inventing in order to solve above-mentioned the 1st problem points, that is, and and for the problem points of the chemical solution treating device that solves aerial injection processing mode.But,, then exist its circuit to form face and continuous cylinder or roller and contact and impaired problem for the continuous cylinder group about the conveyer in liquid or the baseplate material of roller group clamping conveyance.
Chemical solution treating device of the present invention is in view of such practical problem, for the problem that solves above-mentioned conventional example is set up.And, the object of the present invention is to provide a kind of chemical solution treating device, the 1st, turbulent flow, liquid storage, distortion situation that the soup that solution is sprayed causes; The 2nd, in conveyance, do not exist circuit to form the impaired problem of face.
The technological means of the present invention that addresses this problem is as described below.At first, as described below about technical scheme 1.
The chemical solution treating device of technical scheme 1 is the manufacturing process that is used for substrate, utilizes soup that baseplate material is carried out the surface-treated device, and it has: liquid bath, and this liquid bath fills with this soup; Conveyer, this conveyer are provided in this liquid bath and the conveyance baseplate material; Nozzle, this mouth of disputing are provided in this liquid bath and to this baseplate material and spray this soup.And, it is characterized in that this conveyer possesses the clamping cylinder group that the mode that forms face with contact circuit is not transported this baseplate material, this clamping cylinder is made of clamping, the head roll that transports the both sides end face of this baseplate material.
As described below about technical scheme 2.The chemical solution treating device of technical scheme 2 in technical scheme 1, clamping, transports this baseplate material and paired wherein on one side this clamping cylinder, and for example the soft material by vulcanie system constitutes; This clamping cylinder of another side for example is made of metal hard material, and forms groove at outer peripheral face.And, it is characterized in that, between two these clamping cylinders, crimping, seize this baseplate material on both sides by the arms, and can not slide, transport agley.
As described below about technical scheme 3.The chemical solution treating device of technical scheme 3, in technical scheme 1, this chemical solution treating device is used in developing procedure, etching work procedure or the stripping process of the manufacturing process of substrate, and this soup is made of developer solution, etching solution or stripper.And, it is characterized in that this baseplate material is characterised in that by flexible substrate material, other ultra-thin materials and constitutes.
As described below about technical scheme 4.The chemical solution treating device of technical scheme 4, in technical scheme 1, this baseplate material of the horizontal conveyance of this conveyer.And, it is characterized in that, about this clamping cylinder is disposed in paired up and down, respectively from clamping up and down, transport the left and right sides end face of this baseplate material.
Because the present invention is made of such means, so act on as described below.
(1) this chemical solution treating device is used for the manufacturing process of substrate, baseplate material is carried out soup handle.
(2) for example, in developing procedure, etching work procedure or stripping process, in the time of with conveyer conveyance baseplate material, spray soup from the mouth of disputing and carry out surface treatment.
(3) then, in the liquid bath that utilizes the soup identical to fill with, set conveyer and nozzle with the soup that sprays.
(4) therefore, the soup of injection advances at the liquid cathetus, and the circuit formation face of baseplate material is carried out surface treatment, then, does not flow through the baseplate material surface and is reflected, and taken in the soup of liquid bath.
(5) in this chemical solution treating device, soup can be in the baseplate material Surface runoff, and turbulent flow, liquid storage, delay of soup etc. can not take place.In addition, can not take place owing to distortion, the bending of the pressure of the soup that sprays or the baseplate material that weight causes, fracture, gauffer, crispatura, fall etc. yet.
(6) in this chemical solution treating device, the clamping cylinder clamping of conveyer, transport the both sides end face of baseplate material.
(7) therefore, the circuit formation face that can not worry the baseplate material of conveyance in the liquid causes damage.That is, the clamping of clamping cylinder, transport the both sides end face of baseplate material, and the circuit of contact substrate material forms face.
(8) in addition, the both sides end face of clamping cylinder and baseplate material is owing to existing soup to slide and easily sliding, and baseplate material also has the problem that bends.As the clamping cylinder, if in conjunction with adopting the vulcanie cylinder and, then can preventing these problems really with powerful frictional force and stopping power with the metal roller of groove.
(9) therefore, the following effect of this chemical solution treating device performance.
The 1st, chemical solution treating device of the present invention is because constitute by inject process mode in the liquid, so solved because situations such as the turbulent flow that the soup penetrated of disputing causes, liquid storage, distortion.
Promptly, this chemical solution treating device is because carry out surface treatment with the soup that sprays in the liquid to baseplate material, so with different as aforesaid this conventional example of aerial injection processing mode, in other words, different with the contact conveyance of clamping cylinder as this conventional example, there is not the damage of circuit, and turbulent flow of the soup that also can not spray, liquid storage, delay etc.Thereby it is slow, too much or very few, inhomogeneous to eliminate surface-treated, and realizes forming uniform circuit.In addition, also can avoid owing to distortion, the bending of the pressure of the aerial soup that sprays or the baseplate material that weight causes, fracture, gauffer, situation such as crispatura, fall.
The 2nd, because constitute by inject process mode in the liquid, but there is not the problem that the circuit formation face of the baseplate material of conveyance in the liquid is caused damage in this chemical solution treating device.
Promptly, in the conveyer of this chemical solution treating device, the clamping cylinder transports because of the both sides end face of clamping baseplate material, so it is different like that with this conventional example of inject process mode in the liquid as described above, in other words, different with the contact conveyance of the clamping cylinder of similar this conventional example, can not cause damage to the circuit formation face of baseplate material.In addition, about the clamping cylinder, Yi Bian paired wherein be under vulcanie system, the metal situation of another side for subsidiary groove, also can prevent the slip of baseplate material and bending etc. really, and then prevent that carrying from damaging.
The problems that exist in this conventional example of whole like this solutions etc., it is remarkable that the present invention brings into play effect.
Description of drawings
Fig. 1 is used to illustrate the optimal morphology that carries out an invention about chemical solution treating device of the present invention, is all sectional side views.
Fig. 2 is used to the optimal morphology of implementing with invention is described, is the orthogonal view of major part.
Embodiment
Below, according to the optimal morphology that is used to implement the represented invention of drawing, chemical solution treating device of the present invention is elaborated.
Fig. 1, Fig. 2 provide the explanation of implementing optimal morphology of the present invention.Fig. 1 is all sectional side views, and Fig. 2 is the orthogonal view of major part.
Chemical solution treating device 1 of the present invention is used for the manufacturing process of substrate.Thereby, at first describe with regard to substrate.
Be used for electronic equipment printed wiring board etc. circuit substrate progress such as miniaturization and, ultra-thinization, fine circuitsization, high-density circuitization, multiple stratification significantly.Soft or hard about circuit substrate, compare with rigid substrates such as existing hard substrate admittedly more early, the progress of the flexible base plate that other of flexible substrate is ultra-thin and soft, increase very significantly, popularizing also of semiconductor device and combination of circuits all-in-one-piece conductor package substrate develops rapidly.
Therefore, as nearest substrate requirement degree, ultra-thinization, miniaturization to thickness of slab are about 50 μ m～25 μ m, the space S between circuit width L and the circuit is about 20 μ m～30 μ m.
And this substrate is made by for example following manufacturing process.Promptly, on the outer surface of the baseplate material A that forms by copper clad laminate, → be coated with or stick after the light sensitivity resist, → block and with after it exposure with the negative film of circuit, → remove circuit by the dissolving of developing to form resist beyond the part, → remove circuit by the etching dissolving to form after the Copper Foil outside the part, → remove the resist that circuit forms part by stripping, → on the outer surface of baseplate material A, form circuit with Copper Foil, → thus, make substrate.
Substrate is to form like this.
Then, chemical solution treating device 1 is used for the manufacturing process of this substrate, and utilizes medical liquid B that baseplate material A is carried out surface treatment.About this chemical solution treating device, will be described in further detail.
In the manufacturing process of substrate, for example in developing procedure, etching work procedure or the stripping process, this chemical solution treating device 1 is used for as developing apparatus, Etaching device or stripping off device.Then, in its process chamber 2,, spray for example medical liquid B such as developer solution, etching solution, stripper, thus baseplate material A is carried out soup processing, surface treatment from the baseplate material A of 4 pairs of conveyer 3 conveyances of nozzle.
As developer solution, use sodium carbonate liquor, other alkaline solution; As etching solution, use copper chloride (II) solution, iron chloride (III) solution, other acid solution, corrosive liquid; As stripper, use sodium hydroxide solution, potassium hydroxide solution, other alkaline solution.
And, in the process chamber 2 of chemical solution treating device 1, have liquid bath 5, conveyer 3, nozzle 4, storage tank 6 etc.
At first, liquid bath 5 fills with medical liquid B.That is, liquid bath 5 is formed on the top of process chamber 2, and uses double as to divide wall 7 as the framework of conveyor frame to form, and fills with and the identical medical liquid B of medical liquid B from nozzle 4 injections.
Conveyer 3 is provided in the medical liquid B of liquid bath 5, and conveyance baseplate material A on conveyance direction C as the back is described in detail, possesses 8,9 groups on a plurality of clamping cylinders that transport baseplate material A.A plurality of mouths 4 of disputing are provided in the medical liquid B of liquid bath 5, and in the face of being positioned at the baseplate material A of conveyance, baseplate material A are sprayed medical liquid B.
Medical liquid B is from the storage tank 6 of process chamber 2 bottoms, by pump 10 with set pipeline 11, is sent to the mouth 4 of respectively disputing, and sprays towards baseplate material A thus.Then, spray the medical liquid B of returning from baseplate material A reflection, bounce-back the back by medical liquid B inspiration, assimilation the liquid bath 5, its result, the medical liquid B of overflowing from liquid bath 5 is recovered to the storage tank 6 of bottom.The medical liquid B that is recovered to storage tank 6 is stored, and then, is pressed to each nozzle 4 again and recycles.
In addition,, can use the solid circular cone various types of nozzles such as mouth of disputing, also can use the slit mouth of disputing as the mouth 4 of disputing.In addition, illustrated nozzle 4 faces one another and sets towards the inside and outside two sides of baseplate material A, but has considered that also baseplate material A forms under the situation of single face substrate that face E has only single face at circuit, only is adapted to situation about facing one another towards this single face.
Chemical solution treating device 1 forms in this way.
Below, be described in further detail conveyer 3 about chemical solution treating device 1.Conveyer 3 possesses 8,9 groups on a plurality of clamping cylinders.And, as 8,9 groups on the clamping cylinder of conveyance cylinder in liquid bath 5, wait up and down paired respectively in, along conveyance direction C, in front and back each other respectively in front and back at interval a plurality of row establish.
In addition, 3 one-tenth horizontal conveyance baseplate material A of the conveyer of illustrated example, its clamping cylinder 8,9 sets up and down respectively in pairs, and baseplate material A is horizontal conveyance in liquid bath 5.But, be not to be defined to this horizontal conveyance mode, the conveyer 3 of vertical conveyance mode or inclination conveyance mode also can.That is, this clamping cylinder 8,9 is set in pairs or is inclined to about respectively setting, thereby also might be the mode of baseplate material A being carried out vertical conveyance or inclination conveyance.
Conveyer 3 forms haply in this way.
Then, clamping cylinder 8,9 about conveyer 3 is described.Clamping cylinder 8,9 is formed by clamping and the head roll that transports the both sides end face D of baseplate material A.
Be described in further detail about this clamping cylinder 8,9.At first, clamping cylinder 8,9 is that the head roll by rotating drive forms, and by axle 12,13, pass on gear 14,15,16, driven wheel 17, driving shaft 18 etc., and be connected to the driving mechanism (not icon) of engine etc.
Number in the figure 19 is that to push adjustment part, label 20 are accurate adjustment parts, position, and both are used for adjusting the upper-lower position of the upper-lower position of upper axle 12 and upper clamping cylinder 8 and the next axle 13 and the next clamping cylinder 9 respectively.That is, by both, can limit and adjust between paired up and down upper clamping cylinder 8 and the next clamping cylinder 9 trickle between the upper and lower every.In other words, adjust the height and position of upper axle 12, adjust the height and position of the next axle 13 with accurate adjustment part 20, the next position with upper control adjustment part 19, thus, can limit and adjust between the cylinder between the upper and lower every.
And, because illustrated conveyer 3 horizontal conveyance baseplate material A, thus its clamping cylinder 8,9 set about in paired up and down, respectively from left and right sides end face D and the conveyance of clamping baseplate material A up and down.
In addition, baseplate material A is made of front and back end or the left and right sides end face D that the circuit of central portion forms face E, its outer peripheral edges, and front and back end or both sides end face D also are known as and do ear, and becomes inverter circuit and form face.Then, in illustrated example, for from up and down clamping and conveyance as the left and right sides end face D of baseplate material A, about set clamping cylinder 8,9.
In addition, in example shown in Figure 2, the clamping cylinder 8 on paired one side of clamping and conveyance baseplate material A is made of the soft material of for example vulcanie system in this way, and the clamping cylinder 9 of another side is made of for example metal hard material, and forms groove 21 at outer peripheral face.Then, as two clamping cylinders 8,9 between, can crimping and seize the both sides end face D of baseplate material A on both sides by the arms, and can not cause slip, carry out conveyance agley.
That is, in illustrated example, paired up and down upper clamping cylinder 8 is made of vulcanie cylinder F, and the next clamping cylinder 9 is made of the metal roller G with groove 21.Groove 21 is formed at outer peripheral face, though form with the periphery pod in illustrated example, can be other various groove shape, for example also can be translot, tipper, curved slot, dispersion slot etc.And, by as so up and down for example vulcanie cylinder F system soft material and with the combination of the hard material of for example metal roller G system of groove 21, the both sides end face D of baseplate material A is from up and down with powerful frictional force and stopping power crimping and seize on both sides by the arms.
In addition, sandwich between the interval, the clamping cylinder 8 in illustrated example about upper of 8,9 on clamping cylinder of both sides end face D of baseplate material A between left and right every and the next about clamping cylinder 9 between between left and right every, be preferably the side-to-side dimensions of prior counterpart substrate materials A and can change.That is,, in other words,, so that clamping cylinder 8,9 prior move left and right respectively, then can be applied to the baseplate material A of various sizes easily for the position of corresponding its both sides end face D for the side-to-side dimensions of the baseplate material A of corresponding conveyance.
Clamping cylinder 8,9 constitutes in this way.
Chemical solution treating device 1 of the present invention constitutes in above-mentioned illustrated mode.Thereby, as following effect.
(1) this chemical solution treating device 1 is used for the manufacturing process of substrate, utilizes medical liquid B that baseplate material A is carried out surface treatment.For example, be used for flexible substrate, other the manufacturing process of flexible base plate, thereby, utilize medical liquid B that ultra-thin and soft baseplate material A is carried out surface treatment.
(2) promptly, chemical solution treating device 1 in for example developing procedure, etching work procedure or the stripping process of the core of the manufacturing process of substrate, uses as developing apparatus, Etaching device or stripping off device.Then, with conveyer 3 conveyance baseplate material A, and, thus baseplate material A is used to form the surface treatment of circuit from medical liquid B such as nozzle 4 spray developing liquid, etching solution or strippers.
(3) so, this chemical solution treating device 1 possesses the liquid bath 5 that fills with the medical liquid B identical with the medical liquid B of spraying, and in the medical liquid B of medicine groove 5, is equipped with conveyer 3 and nozzle 4.And,, baseplate material A is carried out surface treatment by the medical liquid B of from nozzle 4 liquid, spraying.
(4) promptly, the medical liquid B of spraying from nozzle 4 be subjected to the liquid bath 5 around medical liquid B opposing and be limited, in the medical liquid B of liquid bath 5, can not spread thus but craspedodromes of advancing, the circuit formation face E of direct projection baseplate material A also carries out surface treatment.
Then, this medical liquid B is subjected to the opposing of the medical liquid B on every side in the liquid bath 5 and is limited, and can not form face E at the circuit of baseplate material A thus flows, but forms face E reflection from circuit, spring back to the medical liquid B in the liquid bath 5, by the inspiration of the institute of the medical liquid B in the liquid bath 5, assimilation.
(5) in this chemical solution treating device 1, because medical liquid B is sprayed in the liquid by this way, so can not forming face E at the circuit of baseplate material A, the medical liquid B of spraying flows, so form on the face E the not turbulent flow that can form, liquid storage, delay etc. at the circuit of the baseplate material A of the medical liquid B of spraying.Medical liquid B is upgraded at any time corresponding to baseplate material A.In addition, because spray medical liquid B in the liquid, so also can not take place by distortion, the bending of the pressure of the medical liquid B of spraying or the baseplate material A that weight causes, fracture, gauffer, crispatura, fall etc.
(6) so, in this chemical solution treating device 1, conveyer 3 is provided in the medical liquid B of liquid bath 5, and conveyer 3 possesses 8,9 groups on clamping cylinder.And 8,9 clampings of clamping cylinder are transported baseplate material A as the both sides end face D of the inverter circuit formation face of baseplate material A on conveyance direction C.
(7) conveyer 3 of this chemical solution treating device 1 possesses the clamping cylinder 8,9 that such conveyance is used, and the circuit that has baseplate material A thus hardly forms the problem that face E is damaged.That is,,, the circuit of baseplate material A can not in the conveyance way, sustain damage so forming face E because 8,9 clampings of clamping cylinder and the circuit that transports baseplate material A form the both sides end face D beyond the face E.
(8) in addition, about the clamping cylinder 8,9 of conveyer 3, wherein be vulcanie cylinder F on one side in order to clamping, both sides end face D paired up and down that transport baseplate material A, another side is under the situation with the metal roller G of groove 21, and is as described below.
Promptly, this medical liquid B (for example, alkaline solution such as developer solution and stripper) unusual stick-slip, in this medical liquid B, paired clamping cylinder 8,9 and by the both sides end face D of the baseplate material A of its clamping is because the existence of this medical liquid B becomes smooth and easy slip, also there is crooked problem in baseplate material A not along conveyance direction C conveyance thus.
To this, when making up, positively prevent this slip, slide, bending etc. with the soft material of for example vulcanie cylinder F system with the hard material of for example metal roller G system of groove 21.No matter the existence of medical liquid B, by powerful frictional force and the stopping power between the clamping cylinder 8 of this combination, crimping is also seized the both sides end face D of baseplate material A on both sides by the arms and is transported.
At this,, and describe about the relevant technical fundamental difference point of conveyer with the present invention and nearest this existing example comparison.
In the conveyer 3 of chemical solution treating device 1 of the present invention, as discussed above, in the easy to break and soft baseplate material A such as ultra-thin materials of conveyance, clamping cylinder 8,9 has adopted a kind of conveyer, this conveyer system from the inverter circuit of last inferior clamping, conveyance baseplate material A form face about etc. both sides end face D.Form face for the circuit of baseplate material A central portion, become fully not contact condition.
To this, in nearest this existing example, form by conveyer, this conveyer forms: in the easy to break and soft baseplate material A such as ultra-thin materials of conveyance, in the central, conveyance direction C along front and back is set at wire with inverter circuit formation face, and the clamping cylinder that forms such as the roller by up and down, clamping, keep as be set at the inverter circuit formation face of wire and conveyance.
As, in the present invention, with respect to about 2 supports transport baseplate material A, in nearest this existing example, support or comprise 3 support of central authorities, transport baseplate material A near the mode of 3 supports the central authorities typically with 1 of central authorities, fundamentally different fully with the technological thought that conveyer is correlated with.
The present invention and this existing example support about such or central authorities support obviously different, in the present invention, possesses following major advantage: do not need specially to set inverter circuit and form face in central authorities, central portion can be used as circuit and forms face and all use, and the circuit of baseplate material is formed on the area also efficient etc.
Claims (4)
1. chemical solution treating device, the manufacturing process that it is used for substrate utilizes soup that baseplate material is carried out surface treatment, and this chemical solution treating device has: liquid bath, this liquid bath fills with this soup; Conveyer, this conveyer are provided in this liquid bath and this baseplate material of conveyance; Nozzle, this nozzle are provided in this liquid bath and to this baseplate material and spray this soup,
It is characterized in that this conveyer possesses the clamping cylinder group that the mode that forms face with contact circuit is not transported this baseplate material, this clamping cylinder is made of clamping, the head roll that transports the both sides end face of this baseplate material.
2. chemical solution treating device according to claim 1 wherein, clamping, transports this baseplate material and paired wherein on one side this clamping cylinder, is made of soft material; This clamping cylinder of another side is made of hard material, and forms groove at outer peripheral face,
It is characterized in that, between two such these clamping cylinders, crimping, seize this baseplate material on both sides by the arms, and can not slide, transport agley.
3. chemical solution treating device according to claim 1, this chemical solution treating device is used for developing procedure, etching work procedure or the stripping process of the manufacturing process of substrate, this soup is made up of developer solution, etching solution or stripper, it is characterized in that this baseplate material is made of flexible substrate material, other ultra-thin materials.
4. chemical solution treating device according to claim 1, this baseplate material of the horizontal conveyance of this conveyer is characterized in that, this clamping cylinder is up and down in pairs and about being disposed at, respectively from clamping up and down, transport the left and right sides end face of this baseplate material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006264189 | 2006-09-28 | ||
| JP2006264189A JP2008085119A (en) | 2006-09-28 | 2006-09-28 | Chemical treatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101155479A true CN101155479A (en) | 2008-04-02 |
Family
ID=39256819
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100867350A Pending CN101155477A (en) | 2006-09-28 | 2007-03-13 | Liquid medicine processing device |
| CNA2007101541508A Pending CN101155479A (en) | 2006-09-28 | 2007-09-19 | Liquid medicine processing device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100867350A Pending CN101155477A (en) | 2006-09-28 | 2007-03-13 | Liquid medicine processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008085119A (en) |
| KR (1) | KR20080029820A (en) |
| CN (2) | CN101155477A (en) |
| TW (1) | TWI323187B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102259746A (en) * | 2010-05-24 | 2011-11-30 | 郭明宏 | Roller blade type conveying device of vertical etching machine |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010014939A (en) * | 2008-07-03 | 2010-01-21 | Nikon Corp | Manufacturing apparatus and manufacturing method for circuit element |
| JP2010040982A (en) * | 2008-08-08 | 2010-02-18 | Tokyo Kakoki Kk | Equipment for treating board material surface |
| WO2010130445A1 (en) | 2009-05-13 | 2010-11-18 | Atotech Deutschland Gmbh | Method and system for the treatment of flat feedstock, and device for removing or keeping away treatment liquid |
| DE102009032217A1 (en) * | 2009-07-06 | 2011-01-13 | Gebr. Schmid Gmbh & Co. | Method and device for the treatment of substrates |
| US20140000649A1 (en) * | 2011-12-22 | 2014-01-02 | First Solar, Inc. | Photovoltaic substrate cleaning system and method |
| CN104891223A (en) * | 2015-04-10 | 2015-09-09 | 宇宙电路板设备(深圳)有限公司 | Flexible printed circuit board conveying apparatus |
| KR101783882B1 (en) * | 2016-02-15 | 2017-11-06 | 한화테크윈 주식회사 | Etching apparatus and method, flexible film etched by the method |
| CN110993529B (en) * | 2019-11-14 | 2022-07-26 | Tcl华星光电技术有限公司 | Wet etching device and substrate wet etching method |
| CN114615815B8 (en) * | 2022-03-29 | 2024-04-09 | 深圳市鹏宇兴业科技有限公司 | Multilayer flexible circuit board etching combination device and application method thereof |
-
2006
- 2006-09-28 JP JP2006264189A patent/JP2008085119A/en active Pending
- 2006-10-25 TW TW095139274A patent/TWI323187B/en not_active IP Right Cessation
-
2007
- 2007-03-13 CN CNA2007100867350A patent/CN101155477A/en active Pending
- 2007-09-19 CN CNA2007101541508A patent/CN101155479A/en active Pending
- 2007-09-20 KR KR1020070096166A patent/KR20080029820A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102259746A (en) * | 2010-05-24 | 2011-11-30 | 郭明宏 | Roller blade type conveying device of vertical etching machine |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200815106A (en) | 2008-04-01 |
| CN101155477A (en) | 2008-04-02 |
| TWI323187B (en) | 2010-04-11 |
| KR20080029820A (en) | 2008-04-03 |
| JP2008085119A (en) | 2008-04-10 |
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