JP2008085119A - Chemical treatment device - Google Patents

Chemical treatment device Download PDF

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Publication number
JP2008085119A
JP2008085119A JP2006264189A JP2006264189A JP2008085119A JP 2008085119 A JP2008085119 A JP 2008085119A JP 2006264189 A JP2006264189 A JP 2006264189A JP 2006264189 A JP2006264189 A JP 2006264189A JP 2008085119 A JP2008085119 A JP 2008085119A
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substrate material
chemical
processing apparatus
liquid
substrate
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Kisaburo Niiyama
喜三郎 新山
Seiji Sugawara
清司 菅原
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Tokyo Kakoki Co Ltd
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Tokyo Kakoki Co Ltd
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Priority to JP2006264189A priority Critical patent/JP2008085119A/en
Priority to TW095139274A priority patent/TWI323187B/en
Priority to CNA2007100867350A priority patent/CN101155477A/en
Priority to CNA2007101541508A priority patent/CN101155479A/en
Priority to KR1020070096166A priority patent/KR20080029820A/en
Publication of JP2008085119A publication Critical patent/JP2008085119A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Spray Control Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chemical treatment device of which, firstly, troubles of turbulent flow, liquid pooling, and deflection caused by jetted chemical are solved, and secondly, transportation troubles, of rising in liquid, swinging, deflection, and the like are prevented, preventing damages on a circuit formation service. <P>SOLUTION: The chemical treatment device 1 is used in a substrate manufacturing process, in which a substrate material A is surface-treated with a chemical B. It comprises a liquid bath 5 which is filled with the chemical B, a conveyor 3 which is arranged in the liquid bath 5 to transport the substrate material A, and a spray nozzle 4 which is arranged in the liquid bath 5 and jets the chemical B to the substrate material A. The conveyor 3 comprises pinch rollers 8 and 9 which feed the substrate material A. The pinch rollers 8 and 9 consist of a drive roller which sandwiches and feeds both side end faces D of the base material A. For example, one pinch roller 8 for sandwiching and feeding is made from soft material, and the other pinch roller 9 is made from a hard material of which a groove 21 is formed on its outer peripheral surface. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、薬液処理装置に関する。すなわち、基板の製造工程で使用され、基板材を薬液にて表面処理する薬液処理装置に関する。   The present invention relates to a chemical processing apparatus. That is, the present invention relates to a chemical processing apparatus that is used in a substrate manufacturing process and performs surface treatment of a substrate material with a chemical.

《技術的背景》
電子機器に用いられる回路基板は、小型軽量化，極薄化，フレキシブル化の進展がめざましく、形成される回路も微細化，高密度化が著しい。
そして、このような基板の製造工程では、薬液処理装置が用いられており、基板材が、噴射される薬液にて表面処理される。例えば、現像液，エッチング液，剥離液等の薬液が噴射され、もって、現像，エッチング，剥離等の表面処理が行われている。 《Technical background》
Circuit boards used in electronic devices are remarkably progressing in miniaturization, weight reduction, ultrathinning, and flexibility, and circuits to be formed are remarkably miniaturized and densified.
In such a substrate manufacturing process, a chemical processing apparatus is used, and the substrate material is surface-treated with the injected chemical. For example, a chemical solution such as a developing solution, an etching solution, or a stripping solution is sprayed, and surface treatment such as development, etching, or stripping is performed.

《従来技術》
さて、この種従来例の薬液処理装置では、基板材が、コンベアの搬送ローラーにて搬送されつつ、スプレーノズルから薬液が噴射され、もって、現像，エッチング，剥離等の表面処理が順次施されて、回路が形成され基板が製造されている。そして、コンベアやスプレーノズルは、一般的には雰囲気中・空中に配設されており、基板材は、雰囲気中・空中で噴射された薬液にて、表面処理されていた。
これに対し、コンベアやスプレーノズルを薬液中に配設して、表面処理する薬液処理装置も、開発されている。すなわち、薬液で満たされた液槽中にコンベアやスプレーノズルを配設し、もって基板材を、液中噴射された薬液にて表面処理する薬液処理装置も出現している。 <Conventional technology>
Now, in this type of conventional chemical processing apparatus, the substrate material is transported by the transport rollers of the conveyor, and the chemical liquid is sprayed from the spray nozzle, so that surface treatments such as development, etching, and peeling are sequentially performed. The circuit is formed and the substrate is manufactured. In general, the conveyor and the spray nozzle are disposed in the atmosphere / air, and the substrate material is surface-treated with a chemical solution injected in the atmosphere / air.
On the other hand, a chemical processing apparatus has also been developed in which conveyors and spray nozzles are arranged in the chemical to perform surface treatment. In other words, a chemical processing apparatus has also emerged in which a conveyor or a spray nozzle is disposed in a liquid tank filled with a chemical solution, and thus the substrate material is surface-treated with the chemical solution jetted in the liquid.

《先行技術文献情報》
このような薬液処理装置としては、例えば、次の特許文献１，２中に示されたものが挙げられる。特許文献１は、空中噴射処理方式のものに関し、特許文献２は、液中噴射処理方式のものに関する。 《Information on prior art documents》
Examples of such a chemical processing apparatus include those shown in the following Patent Documents 1 and 2. Patent Document 1 relates to an aerial injection processing method, and Patent Document 2 relates to an in-liquid injection processing method.

特開２００２−６８４３５号公報JP 2002-68435 A

特開平１０−０７９５６５号公報Japanese Patent Application Laid-Open No. 10-079565

ところで、このような従来例については、次の問題が指摘されていた。
《第１の問題点》
第１に、空中噴射処理方式の薬液処理装置については、次の問題が指摘されていた。すなわち、噴射された薬液は、基板材の表面を、前後の搬送方向とは直交する左右の幅方向に流れつつ表面処理した後、左右両サイドから流下することになる。しかしながら、すべての薬液が所期の通り左右の幅方向に流れる訳ではなく、副次的に、前後の搬送方向に乱流となって流れたり、中央部に液溜まりとなって滞留し易かった。
そして、このような乱流や液溜まりが発生すると、薬液の更新が妨げられて、表面処理の遅速・過不足・バラツキが生じてしまい、均一な回路形成に支障が生じ、回路の微細化，高密度化が進む基板にとって、大きな問題となっていた。
又、この種の基板材は、極薄化が著しく腰が弱く軟らかいが、このような基板材に対して、薬液が噴射圧や重量を伴って噴射される。そこで、基板材がコンベアにて安定搬送されないことが多い、という問題も指摘されていた。噴射された薬液の圧や重量に起因して、搬送される基板材について撓み，湾曲，腰折れ，しわ，めくれ，落下等の事故が、多発していた。 By the way, the following problems have been pointed out with respect to such a conventional example.
<First problem>
First, the following problems have been pointed out with respect to the chemical treatment apparatus of the air injection treatment method. That is, the sprayed chemical liquid flows down from both the left and right sides after the surface of the substrate material is surface-treated while flowing in the left and right width directions orthogonal to the front and rear transport directions. However, not all chemicals flow in the left and right width directions as expected, but they flow as turbulent flow in the front and rear transport directions, or easily accumulate as liquid pools in the center. .
And when such turbulent flow or liquid pool occurs, the renewal of the chemical solution is hindered, and the surface treatment is slow, excessive or insufficient, and variations occur, causing problems in uniform circuit formation, circuit miniaturization, This has been a big problem for substrates with higher density.
In addition, this type of substrate material is extremely thin and extremely soft and soft, but a chemical solution is sprayed onto such a substrate material with an injection pressure and weight. Therefore, it has been pointed out that the substrate material is often not stably conveyed by the conveyor. Due to the pressure and weight of the injected chemicals, there were many accidents such as bending, bending, hip folding, wrinkling, turning over, dropping, etc. with respect to the conveyed substrate material.

《第２の問題点》
第２に、液中噴射処理方式の薬液処理装置については、次の問題が指摘されていた。この薬液処理装置は、上述した第１の問題点、つまり空中噴射処理方式の薬液処理装置の問題点を解決すべく開発されたものであるが、液中をコンベアの上下のストレートローラー群やホイール群にて挟まれて搬送される基板材について、その回路形成面が、ストレートローラーやホイールに接触して損傷する、という問題が指摘されていた。 << Second problem >>
Secondly, the following problems have been pointed out with respect to the chemical treatment apparatus of the submerged jet treatment method. This chemical processing apparatus has been developed to solve the first problem described above, that is, the problem of the chemical processing apparatus of the aerial injection processing method. A problem has been pointed out that the circuit forming surface of the substrate material sandwiched and transported by the group is damaged by contact with the straight roller or the wheel.

《本発明について》
本発明の薬液処理装置は、このような実情に鑑み、上記従来例の課題を解決すべくなされたものである。そして本発明は、第１に、噴射された薬液による乱流，液溜まり，撓み事故が、解消されると共に、第２に、搬送中に回路形成面を損傷する虞もない、薬液処理装置を提案することを、目的とする。 << About the present invention >>
In view of such a situation, the chemical treatment apparatus of the present invention has been made to solve the problems of the conventional example. According to the present invention, firstly, a turbulent flow, a liquid pool, and a bending accident due to the injected chemical are eliminated, and secondly, there is no possibility of damaging a circuit forming surface during transportation. The purpose is to propose.

《請求項について》
このような課題を解決する本発明の技術的手段は、次のとおりである。まず、請求項１については、次のとおり。
請求項１の薬液処理装置は、基板の製造工程で使用され、基板材を薬液にて表面処理するものであり、該薬液で満たされた液槽と、該液槽内に配設され該基板材を搬送するコンベアと、該液槽内に配設され該基板材に該薬液を噴射するスプレーノズルと、を有してなる。そして該コンベアは、回路形成面に無接触で該基板材を送る挟みローラー群を備えており、該挟みローラーは、該基板材の両側端面を挟んで送る駆動ローラーよりなること、を特徴とする。
請求項２については、次のとおり。請求項２の薬液処理装置では、請求項１において、該基板材を挟んで送る対をなす一方の該挟みローラーは、例えば硬質ゴム製の軟質材よりなり、他方の該挟みローラーは、例えば金属製の硬質材よりなり、外周面に溝が形成されている。そして、このような両該挟みローラー間にて、該基板材を圧接，挟持しつつ滑り，蛇行なく送ること、を特徴とする。
請求項３については、次のとおり。請求項３の薬液処理装置では、請求項１において、該薬液処理装置は、基板の製造工程の現像工程，エッチング工程，又は剥離工程で使用され、該薬液は、現像液，エッチング液，又は剥離液よりなる。そして該基板材は、フレキシブル基板材，その他の極薄材よりなること、を特徴とする。
請求項４については、次のとおり。請求項４の薬液処理装置では、請求項１において、該コンベアは、該基板材を水平搬送する。そして、その該挟みローラーは、上下で対をなすと共に左右に配されており、該基板材の左右両側端面をそれぞれ上下から挟んで送ること、を特徴とする。 <About Claim>
The technical means of the present invention for solving such a problem is as follows. First, claim 1 is as follows.
The chemical processing apparatus according to claim 1 is used in a substrate manufacturing process, and surface-treats a substrate material with a chemical liquid. A liquid tank filled with the chemical liquid, and a base disposed in the liquid tank. It has a conveyor that conveys a plate material, and a spray nozzle that is disposed in the liquid tank and injects the chemical liquid onto the substrate material. And this conveyor is provided with the pinching roller group which sends this board | substrate material without contact to a circuit formation surface, and this pinching roller consists of a driving roller which pinches | interposes the both end surfaces of this board | substrate material, It is characterized by the above-mentioned. .
About Claim 2, it is as follows. According to a second aspect of the chemical processing apparatus of the present invention, in the first aspect, one of the sandwiching rollers forming a pair that sandwiches and feeds the substrate material is made of, for example, a soft material made of hard rubber, and the other sandwiching roller is made of, for example, a metal It consists of the hard material made from, and the groove | channel is formed in the outer peripheral surface. The substrate material is fed between the both sandwiching rollers without being slipped and meandered while being pressed and sandwiched.
About Claim 3, it is as follows. According to a third aspect of the present invention, there is provided the chemical processing apparatus according to the first aspect, wherein the chemical processing apparatus is used in a developing process, an etching process, or a peeling process in a substrate manufacturing process. Made of liquid. And this board | substrate material consists of a flexible board | substrate material and another ultra-thin material, It is characterized by the above-mentioned.
About Claim 4, it is as follows. In the chemical processing apparatus according to a fourth aspect, in the first aspect, the conveyor horizontally conveys the substrate material. The sandwiching rollers form a pair in the vertical direction and are arranged on the left and right sides, and feed the both side end surfaces of the substrate material from above and below.

《作用等について》
本発明は、このような手段よりなるので、次のようになる。
（１）この薬液処理装置は、基板の製造工程で使用され、基板材を薬液処理する。
（２）例えば、現像工程，エッチング工程，又は剥離工程において、基板材をコンベアにて搬送しつつ、スプレーノズルから薬液を噴射して表面処理する。
（３）そして、噴射される薬液と同じ薬液で満たされた液槽中に、コンベアとスプレーノズルが配設されている。
（４）そこで、噴射された薬液は、液中を直進して、基板材の回路形成面を表面処理した後、基板材表面を流れることなく反射されて、液槽の薬液中に吸収される。
（５）この薬液処理装置では、このように薬液が基板材表面を流れることはなく、薬液の乱流，液溜まり，滞留等は発生しない。又、噴射された薬液の圧や重量に起因した、基板材の撓み，湾曲，腰折れ，しわ，落下等も発生しない。
（６）さて、この薬液処理装置では、コンベアの挟みローラーは、基板材の両側端面を挟んで送る。
（７）そこで、液中搬送される基板材の回路形成面が損傷する虞はない。すなわち、挟みローラーは基板材の両側端面を挟んで送り、基板材の回路形成面には接触しない。
（８）なお、挟みローラーと基板材の両側端面とは、薬液介在によりスリップして滑り易く、基板材が蛇行する虞もあるが、挟みローラーとして、硬質ゴムローラーと溝付の金属ローラーとを組み合わせて採用すると、強い摩擦力と係止力で、これらは確実に防止される。
（９）さてそこで、この薬液処理装置は、次の効果を発揮する。 <About the action>
Since the present invention comprises such means, the following is achieved.
(1) This chemical processing apparatus is used in a substrate manufacturing process and performs chemical processing on a substrate material.
(2) For example, in the development process, the etching process, or the peeling process, the substrate material is transported by a conveyor, and a chemical solution is sprayed from the spray nozzle to perform surface treatment.
(3) A conveyor and a spray nozzle are disposed in a liquid tank filled with the same chemical as the chemical to be ejected.
(4) Therefore, the sprayed chemical solution travels straight in the solution, surface-treats the circuit forming surface of the substrate material, is reflected without flowing on the substrate material surface, and is absorbed into the chemical solution in the liquid tank. .
(5) In this chemical processing apparatus, the chemical does not flow on the surface of the substrate material in this way, and chemical turbulence, liquid accumulation, stagnation, etc. do not occur. In addition, the substrate material does not bend, bend, buckle, wrinkle, drop, or the like due to the pressure or weight of the injected chemical.
(6) Now, in this chemical processing apparatus, the sandwiching roller of the conveyor feeds the both end faces of the substrate material.
(7) Therefore, there is no possibility that the circuit forming surface of the substrate material conveyed in the liquid is damaged. In other words, the sandwiching roller feeds the both end surfaces of the substrate material and does not contact the circuit forming surface of the substrate material.
(8) Note that the sandwiching roller and both side end surfaces of the substrate material are slippery and slippery due to the intervening chemicals, and the substrate material may meander, but as the sandwiching roller, a hard rubber roller and a grooved metal roller are used. When used in combination, these are reliably prevented by strong frictional force and locking force.
(9) Now, this chemical processing apparatus exhibits the following effects.

《第１の効果》
第１に、本発明の薬液処理装置は、液中噴射処理方式よりなるので、噴射された薬液による乱流，液溜まり，撓み等の事故は、解消される。
すなわち、この薬液処理装置は、基板材を液中噴射させた薬液にて表面処理するので、空中噴射処理方式の前述したこの種従来例のように、つまりこの種従来例のような挟みローラーの接触搬送とは違って、回路の損傷がなく、又、噴射された薬液の乱流，液溜まり，滞留等も発生しない。従って、表面処理の遅速・過不足・バラツキも解消され、均一な回路形成が実現される。又、空中噴射された薬液の圧や重量に起因した、基板材の撓み，湾曲，腰折れ，しわ，めくれ，落下等の事故も回避される。 << First effect >>
1stly, since the chemical | medical solution processing apparatus of this invention consists of a submerged injection processing system, accidents, such as a turbulent flow by the injected chemical | medical solution, a liquid pool, a bending, are eliminated.
That is, since this chemical processing apparatus performs a surface treatment with the chemical liquid in which the substrate material is jetted in the liquid, as in the above-described conventional example of the aerial jet processing method, that is, the pinching roller as in this type of conventional example. Unlike contact transport, there is no damage to the circuit, and there is no turbulent flow, liquid accumulation, or stagnation of the injected chemical. Accordingly, the slowness, excess, deficiency, and variation of the surface treatment are eliminated, and uniform circuit formation is realized. In addition, accidents such as bending, bending, bending of the substrate, wrinkles, turning over, and dropping due to the pressure and weight of the chemical injected in the air can be avoided.

《第２の効果》
第２に、この薬液処理装置は、液中噴射処理方式よりなるが、液中搬送される基板材の回路形成面が損傷する虞はない。
すなわち、この薬液処理装置のコンベアは、挟みローラーが、基板材の両側端面を挟んで送るので、前述した液中噴射処理方式のこの種従来例のように、つまりこの種従来例のような挟みローラーの接触搬送とは違って、基板材の回路形成面を損傷することはない。又、挟みローラーについて、対をなす一方を硬質ゴム製とし、他方を溝付の金属製とした場合は、基板材の滑りや蛇行等も確実に防止され、もって搬送トラブルも防止される。
このように、この種従来例に存した課題がすべて解決される等、本発明の発揮する効果は、顕著にして大なるものがある。 << Second effect >>
Secondly, this chemical processing apparatus comprises a submerged jet processing method, but there is no possibility that the circuit forming surface of the substrate material transported in the liquid is damaged.
In other words, the conveyor of this chemical solution processing apparatus feeds the both end surfaces of the substrate material with the sandwiching rollers sandwiched between the both ends of the substrate material. Unlike the contact conveyance of the roller, the circuit forming surface of the substrate material is not damaged. Further, if one of the sandwiching rollers is made of hard rubber and the other is made of a metal with a groove, the substrate material can be prevented from slipping and meandering, and transport troubles can be prevented.
As described above, the effects exerted by the present invention are remarkably large, such as all the problems existing in this type of conventional example are solved.

《図面について》
以下、本発明の薬液処理装置を、図面に示した発明を実施するための最良の形態に基づいて、詳細に説明する。
図１，図２は、本発明を実施するための最良の形態の説明に供する。そして図１は、全体の側断面説明図であり、図２は、要部の正断面説明図である。 《About drawing》
Hereinafter, the chemical processing apparatus of the present invention will be described in detail based on the best mode for carrying out the invention shown in the drawings.
1 and 2 serve to explain the best mode for carrying out the present invention. 1 is an explanatory side sectional view of the whole, and FIG. 2 is an explanatory front sectional view of the main part.

《基板について》
本発明の薬液処理装置１は、基板の製造工程で使用される。そこで、まず基板について説明しておく。
電子機器に使用されるプリント配線基板等の回路基板は、小型軽量化，極薄化，微細回路化，高密度回路化，多層化等の進展がめざましい。回路基板の硬軟についても、従来よりのリジット基板等の硬性基板に比し、フレキシブル基板その他の極薄で柔軟な軟性基板の進展，増加が著しく、半導体部品が回路と一体的に組み込まれた半導体パッケージ基板の普及も急速である。
そこで、最近の基板要求度としては、板厚が５０μｍ〜２５μｍ程度、回路幅Ｌや回路間スペースＳが２０μｍ〜３０μｍ程度まで、極薄化，微細化されてきている。
そして、このような基板は、例えば次の製造工程を辿ることにより、製造される。すなわち、銅張り積層板よりなる基板材Ａの外表面に、→感光性レジストを塗布又は張り付けてから、→回路のネガフィルムを当てて露光した後、→回路形成部分以外のレジストを、現像により溶解除去し、→回路形成部分以外の銅箔を、エッチングにより溶解除去してから、→回路形成部分のレジストを、剥膜除去することにより、→基板材Ａの外表面に、銅箔にて回路が形成され、→もって、基板が製造されている。
基板は、このようになっている。 <About the board>
The chemical treatment apparatus 1 of the present invention is used in a substrate manufacturing process. First, the substrate will be described.
Circuit boards such as printed wiring boards used in electronic devices have made remarkable progress in miniaturization and weight reduction, ultrathinning, microcircuits, high density circuits, and multilayers. As for the hardness and softness of circuit boards, the development and increase of flexible boards and other ultra-thin and flexible flexible boards are significant compared to conventional rigid boards such as rigid boards, and semiconductor components are integrated into the circuit. The spread of package substrates is also rapid.
Therefore, as recent substrate requirements, the thickness is reduced to about 50 μm to 25 μm, and the circuit width L and the inter-circuit space S are about 20 μm to 30 μm.
And such a board | substrate is manufactured by following the next manufacturing process, for example. That is, after applying or pasting a photosensitive resist on the outer surface of the substrate material A made of a copper-clad laminate, and then exposing by applying a negative film of a circuit, developing a resist other than a circuit forming portion by development After dissolving and removing the copper foil other than the circuit forming portion by etching, removing the resist of the circuit forming portion by stripping the copper foil on the outer surface of the substrate material A with the copper foil A circuit is formed and thus a substrate is manufactured.
The substrate is like this.

《薬液処理装置１について》
そして薬液処理装置１は、このような基板の製造工程で使用され、基板材Ａを薬液Ｂにて表面処理する。このような薬液処理装置について、更に詳述する。
この薬液処理装置１は、基板の製造工程中、例えば、現像工程，エッチング工程，又は剥離工程において、現像装置，エッチング装置，又は剥離装置として使用される。そして、その処理室２内において、コンベア３で搬送される基板材Ａに対し、スプレーノズル４から例えば現像液，エッチング液，剥離液等の薬液Ｂが噴射され、もって基板材Ａが薬液処理、表面処理される。
現像液としては、炭酸ナトリウム溶液，その他のアルカリ溶液が使用され、エッチング液としては、塩化第二銅溶液，塩化第二鉄溶液，その他の酸性溶液，腐食液が使用され、剥離液としては、水酸化ナトリウム溶液，水酸化カリウム溶液，その他のアルカリ溶液が使用される。 << About the chemical processing apparatus 1 >>
And the chemical | medical solution processing apparatus 1 is used in the manufacturing process of such a board | substrate, and surface-treats the board | substrate material A with the chemical | medical solution B. FIG. Such a chemical processing apparatus will be further described in detail.
The chemical processing apparatus 1 is used as a developing device, an etching device, or a peeling device in a substrate manufacturing process, for example, in a developing step, an etching step, or a peeling step. In the processing chamber 2, for example, a chemical solution B such as a developing solution, an etching solution, or a stripping solution is sprayed from the spray nozzle 4 to the substrate material A conveyed by the conveyor 3. Surface treated.
As the developer, a sodium carbonate solution or other alkaline solution is used. As the etchant, cupric chloride solution, ferric chloride solution, other acidic solution or corrosive solution is used. Sodium hydroxide solution, potassium hydroxide solution, and other alkaline solutions are used.

そして薬液処理装置１は、その処理室２内に、液槽５，コンベア３，スプレーノズル４，貯槽６等、を有している。
まず液槽５は、薬液Ｂで満たされている。すなわち液槽５は、処理室２の上部に形成されており、コンベアフレームとしても兼用されるフレーム区画壁７を使用して形成され、スプレーノズル４から噴射される薬液Ｂと同じ薬液Ｂで満たされている。
コンベア３は、液槽５の薬液Ｂ内に配設されており、基板材Ａを搬送方向Ｃに搬送し、後で詳述するように、基板材Ａを送る多数の挟みローラー８，９群を備えている。スプレーノズル４は、液槽５の薬液Ｂ内に多数配設されており、搬送される基板材Ａに対向位置して、基板材Ａに薬液Ｂを噴射する。
薬液Ｂは、処理室２の下部の貯槽６から、ポンプ１０や配管１１を介して、各スプレーノズル４に圧送され、もって基板材Ａに向け噴射される。そして、噴射されて基板材Ａから反射され，跳ね返った薬液Ｂは、液槽５中の薬液Ｂに吸収，同化されるが、その結果、液槽５からオーバーフローした薬液Ｂが、下部の貯槽６へと回収される。貯槽６に回収された薬液Ｂは、貯蔵されると共に、事後再び各スプレーノズル４へと圧送されて、循環使用される。
なお、スプレーノズル４としては、フルコーンノズルを始め各種タイプのものが使用可能であり、スリットノズルも使用可能である。又、図示したスプレーノズル４は、基板材Ａの表裏両面に向け対向配設されているが、基板材Ａが、回路形成面Ｅが片面のみの片面基板の場合は、その片面に向けてのみ対向配設されるケースも考えられる。
薬液処理装置装置１は、このようになっている。 And the chemical | medical solution processing apparatus 1 has the liquid tank 5, the conveyor 3, the spray nozzle 4, the storage tank 6, etc. in the processing chamber 2. FIG.
First, the liquid tank 5 is filled with the chemical solution B. That is, the liquid tank 5 is formed in the upper part of the processing chamber 2, is formed using the frame partition wall 7 that is also used as a conveyor frame, and is filled with the same chemical liquid B as the chemical liquid B sprayed from the spray nozzle 4. Has been.
The conveyor 3 is disposed in the chemical solution B of the liquid tank 5, and transports the substrate material A in the transport direction C, and as will be described in detail later, a group of a plurality of sandwiching rollers 8 and 9 for feeding the substrate material A. It has. A large number of spray nozzles 4 are arranged in the chemical solution B of the liquid tank 5, and are opposed to the substrate material A being conveyed, and spray the chemical solution B onto the substrate material A.
The chemical solution B is pumped from the storage tank 6 in the lower part of the processing chamber 2 to the spray nozzles 4 via the pumps 10 and the pipes 11 and is sprayed toward the substrate material A. Then, the chemical liquid B that is jetted, reflected from the substrate material A, and bounced back is absorbed and assimilated by the chemical liquid B in the liquid tank 5, and as a result, the chemical liquid B overflowed from the liquid tank 5 becomes the lower storage tank 6. Is recovered. The chemical solution B collected in the storage tank 6 is stored and then pumped again to the spray nozzles 4 for circulation.
As the spray nozzle 4, various types including a full cone nozzle can be used, and a slit nozzle can also be used. Also, the spray nozzle 4 shown in the figure is disposed facing both the front and back surfaces of the substrate material A. However, when the substrate material A is a single-sided substrate with the circuit forming surface E only on one side, it is directed only on one side. Cases that are arranged opposite each other are also conceivable.
The chemical solution processing apparatus 1 is as described above.

《コンベア３の概要について》
以下、薬液処理装置１のコンベア３について、更に詳述する。コンベア３は、多数の挟みローラー８，９群を備えている。そして、搬送ローラーである挟みローラー８，９群は、液槽５内において、上下等でそれぞれ対をなすと共に、搬送方向Ｃに沿って、前後相互間でそれぞれ前後間隔を存しつつ、多数列設されている。
又、図示例のコンベア３は、基板材Ａを水平搬送するようになっており、その挟みローラー８，９とは、それぞれ上下対をなして配設されており、基板材Ａは、液槽５中を水平搬送される。しかし、このような水平搬送方式に限定されるものではなく、垂直搬送方式や傾斜搬送方式のコンベア３も可能である。すなわち、その挟みローラー８，９を、それぞれ、左右対をなして配設したり傾斜しつつ対をなして配設し、もって、基板材Ａを垂直搬送したり傾斜搬送したりする方式も可能である。
コンベア３は、概略このようになっている。 << About the outline of the conveyor 3 >>
Hereinafter, the conveyor 3 of the chemical processing apparatus 1 will be further described in detail. The conveyor 3 includes a large number of sandwiching rollers 8 and 9. In addition, the sandwiching rollers 8 and 9 that are transport rollers are paired vertically in the liquid tank 5, and a plurality of rows are provided along the transport direction C with a front-rear interval between the front and rear. It is installed.
Further, the conveyor 3 in the illustrated example is configured to horizontally convey the substrate material A, and the sandwiching rollers 8 and 9 are arranged in a pair with each other, and the substrate material A is a liquid tank. 5 is transported horizontally. However, it is not limited to such a horizontal conveyance method, and a conveyor 3 of a vertical conveyance method or an inclined conveyance method is also possible. That is, it is possible to arrange the sandwiching rollers 8 and 9 in a left-right pair or in a tilted pair so that the substrate material A can be conveyed vertically or inclinedly. It is.
The conveyor 3 is roughly like this.

《挟みローラー８，９について》
次に、コンベア３の挟みローラー８，９について、説明する。挟みローラー８，９は、基板材Ａの両側端面Ｄを挟んで送る、駆動ローラーよりなる。
このような挟みローラー８，９について、更に詳述する。挟みローラー８，９は、まず、回転駆動される駆動ローラーよりなり、軸１２，１３、伝達ギヤ１４，１５，１６、駆動ギヤ１７、駆動シャフト１８等を介し、モータ等の駆動機構（図示せず）に接続されている。
図中１９は押え調整部、２０はレベル出し調整部であり、両者は、上位の軸１２そして上位の挟みローラー８の上下位置、および下位の軸１３そして下位の挟みローラー９の上下位置を、それぞれ調整するために使用される。すなわち両者により、上下対をなす上位の挟みローラー８と下位の挟みローラー９との間の僅かな上下間隔を、規制，調整可能となっている。つまり、上位の押え調整部１９にて上位の軸１２の高さ位置を調整し、下位のレベル出し調整部２０にて下位の軸１３の高さ位置を調整することにより、ローラー間の上下間隔を規制，調整可能となっている。
そして、図示のコンベア３は基板材Ａを水平搬送するので、その挟みローラー８，９は、上下で対をなすと共に左右に配されており、基板材Ａの左右両側端面Ｄを、それぞれ上下から挟んで送る。
ところで基板材Ａは、中央部の回路形成面Ｅと、その外周縁の前後端や左右両側端面Ｄと、から構成されており、前後端や両側端面Ｄはみみ部とも称され、非回路形成面となっている。そして挟みローラー８，９は、このような基板材Ａの左右両側端面Ｄを、図示例では上下から挟んで送るべく、左右に配設されている。 <About the pinching rollers 8 and 9>
Next, the sandwiching rollers 8 and 9 of the conveyor 3 will be described. The sandwiching rollers 8 and 9 are drive rollers that feed the both end surfaces D of the substrate material A.
Such pinching rollers 8 and 9 will be further described in detail. The sandwiching rollers 8 and 9 are first composed of rotationally driven drive rollers, and are driven by a drive mechanism (not shown) such as a motor via shafts 12 and 13, transmission gears 14, 15 and 16, drive gear 17, drive shaft 18 and the like. Connected).
In the figure, 19 is a presser adjusting unit, 20 is a leveling adjusting unit, both of which indicate the upper and lower positions of the upper shaft 12 and the upper sandwiching roller 8, and the upper and lower positions of the lower shaft 13 and the lower sandwiching roller 9. Used to adjust each. That is, by both, a slight vertical distance between the upper sandwiching roller 8 and the lower sandwiching roller 9 that make up and down pairs can be regulated and adjusted. In other words, the upper presser adjustment unit 19 adjusts the height position of the upper shaft 12 and the lower level adjustment unit 20 adjusts the height position of the lower shaft 13 so that the vertical distance between the rollers is increased. Can be regulated and adjusted.
The conveyor 3 shown in the figure horizontally transports the substrate material A, so that the sandwiching rollers 8 and 9 are paired up and down and are arranged on the left and right sides. Send it across.
By the way, the substrate material A is composed of a circuit forming surface E in the center, and front and rear ends and left and right side end surfaces D of the outer peripheral edge thereof. It is a surface. The sandwiching rollers 8 and 9 are arranged on the left and right sides so that the left and right end faces D of the substrate material A are sandwiched from above and below in the illustrated example.

又、図２に示した例では、このように基板材Ａを挟んで送る対をなす一方の挟みローラー８は、例えば硬質ゴム製の軟質材よりなり、他方の挟みローラー９は、例えば金属製の硬質材よりなり、外周面に溝２１が形成されている。そして、このような両挟みローラー８，９間にて、基板材Ａの両側端面Ｄを、圧接，挟持しつつ滑り，蛇行なく送るようになっている。
すなわち図示例では、上下対をなす上位の挟みローラー８が、硬質ゴムローラーＦよりなり、下位の挟みローラー９が、溝２１付の金属ローラーＧよりなっている。溝２１は、外周面に形成され、図示例では周縦溝として形成されているが、その他各種の溝形状が可能であり、例えば横溝，傾斜溝，湾曲溝，分散溝等も可能である。そして、このような上下の、例えば硬質ゴムローラーＦ製の軟質材と、溝２１付の例えば金属ローラーＧ製の硬質材との組み合せにより、基板材Ａの両側端面Ｄが、上下から強い摩擦力と係止力で圧接，挟持されるようになる。
なお、基板材Ａの両側端面Ｄを挟み込む挟みローラー８，９間の間隔，図示例では上位の左右の挟みローラー８間の左右間隔、および下位の左右の挟みローラー９間の左右間隔は、基板材Ａの左右寸法に対応して、可変としておくことが望ましい。すなわち、搬送される基板材Ａの左右寸法、つまりその両側端面Ｄの位置に対応すべく、挟みローラー８，９をそれぞれ左右移動可能としておくと、各種寸法の基板材Ａに容易に適用可能となる。
挟みローラー８，９は、このようになっている。 Further, in the example shown in FIG. 2, one of the sandwiching rollers 8 paired with the substrate material A is made of a soft material made of hard rubber, for example, and the other sandwiching roller 9 is made of, for example, a metal. The groove 21 is formed on the outer peripheral surface. The both end surfaces D of the substrate material A are fed between the both sandwiching rollers 8 and 9 without slipping or meandering while being pressed and sandwiched.
That is, in the illustrated example, the upper sandwiching roller 8 that is paired up and down is made of a hard rubber roller F, and the lower sandwiching roller 9 is made of a metal roller G with a groove 21. The groove 21 is formed on the outer peripheral surface and is formed as a circumferential longitudinal groove in the illustrated example, but various other groove shapes are possible, for example, a lateral groove, an inclined groove, a curved groove, a dispersion groove, and the like. Then, due to the combination of the upper and lower soft material made of, for example, hard rubber roller F and the hard material made of, for example, metal roller G with the groove 21, both end surfaces D of the substrate material A have a strong frictional force from above and below. And it comes to be pressed and clamped by the locking force.
The interval between the sandwiching rollers 8 and 9 that sandwich the both end surfaces D of the substrate material A, the left and right spacing between the upper left and right sandwiching rollers 8 in the illustrated example, and the left and right spacing between the lower left and right sandwiching rollers 9 are as follows. It is desirable to make it variable according to the left and right dimensions of the plate material A. That is, if the sandwiching rollers 8 and 9 can be moved to the left and right in order to correspond to the left and right dimensions of the substrate material A to be conveyed, that is, the positions of both side end surfaces D, it can be easily applied to the substrate material A of various dimensions. Become.
The sandwiching rollers 8 and 9 are as described above.

《作用等》
本発明の薬液処理装置１は、以上説明したように構成されている。そこで、以下のようになる。
（１）この薬液処理装置１は、回路基板の製造工程で使用され、基板材Ａを薬液Ｂにて表面処理する。例えば、フレキシブル基板，その他の軟性基板の製造工程で使用され、もって、極薄で柔軟な基板材Ａを、薬液Ｂにて表面処理する。 《Action etc.》
The chemical treatment apparatus 1 of the present invention is configured as described above. Therefore, it becomes as follows.
(1) This chemical processing apparatus 1 is used in a circuit board manufacturing process, and surface-treats a substrate material A with a chemical B. For example, the substrate material A is used in the manufacturing process of a flexible substrate or other flexible substrate, and thus the ultrathin and flexible substrate material A is surface-treated with the chemical solution B.

（２）すなわち薬液処理装置１は、基板の製造工程の中核をなす例えば現像工程，エッチング工程，又は剥離工程において、現像装置，エッチング装置，又は剥離装置として使用される。そして、基板材Ａをコンベア３にて搬送しつつ、スプレーノズル４から、現像液，エッチング液，又は剥離液等の薬液Ｂを噴射し、もって、基板材Ａを回路形成用に表面処理する。   (2) That is, the chemical processing apparatus 1 is used as a developing device, an etching device, or a peeling device in, for example, a developing step, an etching step, or a peeling step that forms the core of the substrate manufacturing process. Then, while transporting the substrate material A on the conveyor 3, a chemical solution B such as a developer, an etching solution, or a stripping solution is sprayed from the spray nozzle 4, so that the substrate material A is surface-treated for circuit formation.

（３）さて、この薬液処理装置１は、噴射される薬液Ｂと同じ薬液Ｂで満たされた液槽５を備えており、薬槽５の薬液Ｂ中に、コンベア３とスプレーノズル４が、配設されている。そして基板材Ａは、スプレーノズル４から液中噴射された薬液Ｂにて、表面処理される。   (3) Now, this chemical processing apparatus 1 is provided with a liquid tank 5 filled with the same chemical liquid B as the chemical liquid B to be injected, and in the chemical liquid B of the chemical tank 5, the conveyor 3 and the spray nozzle 4 are It is arranged. Then, the substrate material A is surface-treated with a chemical solution B ejected from the spray nozzle 4 into the solution.

（４）すなわち、スプレーノズル４から噴射された薬液Ｂは、液槽５中の周囲の薬液Ｂの抵抗を受けて規制され、もって液槽５の薬液Ｂ中を、拡散されることなくストレートに直進して、基板材Ａの回路形成面Ｅを直射して表面処理する。
それから、この薬液Ｂは、周囲の液槽５中の薬液Ｂの抵抗を受けて規制され、もって、基板材Ａの回路形成面Ｅを流れることなく、回路形成面Ｅから反射されて、液槽５中の薬液Ｂ中を跳ね返りつつ、液槽５中の薬液Ｂに吸収，同化される。 (4) That is, the chemical liquid B sprayed from the spray nozzle 4 is regulated by the resistance of the surrounding chemical liquid B in the liquid tank 5, so that the chemical liquid B in the liquid tank 5 is straightened without being diffused. It goes straight, and the circuit formation surface E of the board | substrate material A is directly irradiated and surface-treated.
Then, this chemical solution B is regulated by the resistance of the chemical solution B in the surrounding liquid tank 5, and is reflected from the circuit formation surface E without flowing through the circuit formation surface E of the substrate material A. The chemical solution B in the liquid tank 5 is absorbed and assimilated while rebounding in the chemical solution B in the liquid tank 5.

（５）この薬液処理装置１では、このように薬液Ｂが液中噴射されるので、噴射された薬液Ｂが、基板材Ａび回路形成面Ｅを流れることはなく、もって、噴射された薬液Ｂの基板材Ａの回路形成面Ｅでの乱流，液溜まり，滞留等は発生しない。薬液Ｂは、基板材Ａに対し遂時更新される。又、薬液Ｂが液中噴射されるので、噴射された薬液Ｂの圧や重量に起因して、基板材Ａの撓み，湾曲，腰折れ，しわ，落下等が、発生することもない。   (5) In this chemical solution processing apparatus 1, since the chemical solution B is injected in the liquid in this way, the injected chemical solution B does not flow through the substrate material A and the circuit forming surface E, and thus the injected chemical solution No turbulent flow, liquid accumulation, stagnation or the like occurs on the circuit forming surface E of the substrate material A of B. The chemical solution B is updated with respect to the substrate material A at the time. Further, since the chemical liquid B is injected into the liquid, the substrate material A is not bent, bent, bent, wrinkled, dropped, or the like due to the pressure or weight of the injected chemical liquid B.

（６）さて、この薬液処理装置１では、コンベア３が、液槽５の薬液Ｂ中に配設されると共に、コンベア３が、挟みローラー８，９群を備えている。そして挟みローラー８，９は、基板材Ａの非回路形成面である両側端面Ｄを挟んで、基板材Ａを搬送方向Ｃに送る。   (6) Now, in this chemical processing apparatus 1, the conveyor 3 is disposed in the chemical B of the liquid tank 5, and the conveyor 3 includes sandwiching rollers 8 and 9. The sandwiching rollers 8 and 9 feed the substrate material A in the transport direction C with the both side end surfaces D that are non-circuit forming surfaces of the substrate material A being sandwiched.

（７）この薬液処理装置１のコンベア３は、このような搬送用の挟みローラー８，９を備えており、もって、基板材Ａの回路形成面Ｅが損傷される虞はほとんどない。すなわち挟みローラー８，９は、基板材Ａの回路形成面Ｅ以外の両側端面Ｄを挟んで送るので、基板材Ａの回路形成面Ｅが、搬送途中に損傷を受ける可能性はない。   (7) The conveyor 3 of the chemical solution processing apparatus 1 includes such conveying pinching rollers 8 and 9, so that there is almost no possibility that the circuit forming surface E of the substrate material A is damaged. That is, since the sandwiching rollers 8 and 9 sandwich and send both end surfaces D other than the circuit forming surface E of the substrate material A, there is no possibility that the circuit forming surface E of the substrate material A is damaged during conveyance.

（８）なお、コンベア３の挟みローラー８，９について、基板材Ａの両側端面Ｄを挟んで送るために上下等で対をなす一方を、硬質ゴムローラーＦとし、他方を、溝２１付の金属ローラーＧとした場合は、次のようになる。
すなわち、この種の薬液Ｂ（例えば現像液や剥離液等のアルカリ溶液）は、ぬめりが強くヌルヌルしており、このような薬液Ｂ中においては、対をなす挟みローラー８，９と、これに挟み込まれる基板材Ａの両側端面Ｄとは、このような薬液Ｂ介在により、スリップして滑り易く、もって基板材Ａが搬送方向Ｃに搬送されず、蛇行してしまう虞もある。
これに対し、例えば硬質ゴムローラーＦ製の軟質材と、溝２１付の例えば金属ローラーＧ製の硬質材とを組み合わせると、このようなスリップ，滑り，蛇行等は、確実に防止される。基板材Ａの両側端面Ｄは、薬液Ｂの介在下であるにもかかわらず、このような組み合わせの挟みローラー８間の強い摩擦力と係止力とで、圧接，挟持されて送られる。 (8) Regarding the sandwiching rollers 8 and 9 of the conveyor 3, in order to sandwich and send the both side end surfaces D of the substrate material A, one paired with the upper and lower sides is a hard rubber roller F, and the other is provided with a groove 21 When it is set as the metal roller G, it becomes as follows.
That is, this type of chemical solution B (for example, an alkaline solution such as a developing solution or a stripping solution) is strongly slimy, and in such a chemical solution B, the pair of sandwiching rollers 8 and 9 and The both side end surfaces D of the sandwiched substrate material A are slippery and slippery due to the interposition of the chemical solution B, and thus the substrate material A may not be transported in the transport direction C and may meander.
On the other hand, when a soft material made of, for example, a hard rubber roller F and a hard material made of, for example, a metal roller G with a groove 21 are combined, such slipping, slipping, meandering, etc. are reliably prevented. Although both side end surfaces D of the substrate material A are under the intervention of the chemical solution B, they are pressed and clamped and fed by the strong frictional force and the locking force between the sandwiching rollers 8 of such a combination.

《その他》
ここで、本発明と最近のこの種従来例とを比較し、搬送システムに関する技術上の根本的相違点について、述べておく。
本発明の薬液処理装置１のコンベア３では、以上説明したように、腰が弱く軟らかい極薄材等の基板材Ａの搬送に際し、挟みローラー８，９が、基板材Ａの非回路形成面である左右等の両側端面Ｄを、上下等から挟んで送る搬送システムを採用した。基板材Ａ中央部の回路形成面には、全く無接触となっている。
これに対し、最近のこの種従来例では、腰が弱く軟らかい極薄材等の基板材Ａの搬送に際し、その中央付近に、前後の搬送方向Ｃに沿って非回路形成面をライン状に設定し、このようにライン状に設定された非回路形成面を、上下のホイール等よりなる挟みローラーで、挟んで，保持して，送る搬送システムよりなる。
このように本発明では、左右の２点支持で基板材Ａを送るのに対し、最近のこの種従来例では、中央の１点支持、又は中央を含む３点支持、代表的には中央付近の３点支持で、基板材Ａを送るようになっており、搬送システムに関する技術思想が根本的に相違している。
本発明とこの種従来例とは、このように左右支持か中央支持かで明確に異なっており、本発明では、中央にわざわざ非回路形成面を設定する必要がなく、中央部はすべて回路形成面として使用可能であり、基板材の回路形成が面積的にも効率化される等、大きな利点を備えている。 <Others>
Here, the present invention and a recent conventional example of this kind will be compared and the fundamental technical differences regarding the transport system will be described.
In the conveyor 3 of the chemical processing apparatus 1 of the present invention, as described above, the sandwiching rollers 8 and 9 are formed on the non-circuit-forming surface of the substrate material A when the substrate material A such as an extremely thin material that is weak and soft is conveyed. A conveying system that feeds both end faces D such as left and right from above and below is adopted. There is no contact with the circuit forming surface in the center of the substrate material A.
On the other hand, in the recent conventional example of this type, when the substrate material A such as an extremely thin material that is weak and soft is transported, a non-circuit forming surface is set in a line shape in the vicinity of the center along the front and rear transport direction C. The non-circuit forming surface set in a line shape as described above is composed of a conveyance system that is sandwiched and held by a sandwiching roller composed of upper and lower wheels and the like.
As described above, in the present invention, the substrate material A is fed with left and right two-point support, whereas in this type of conventional example, the central one-point support or the three-point support including the center, typically near the center. The substrate material A is fed with the three-point support, and the technical idea regarding the transport system is fundamentally different.
The present invention and this type of conventional example are thus clearly different depending on the left / right support or the center support, and in the present invention, there is no need to set a non-circuit formation surface in the center, and all the central portions are formed with circuits. It can be used as a surface, and has great advantages such as efficient circuit formation of the substrate material in terms of area.

本発明に係る薬液処理装置について、発明を実施するための最良の形態の説明に供し、全体の側断面説明図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side cross-sectional explanatory diagram of the chemical liquid processing apparatus according to the present invention for explaining the best mode for carrying out the invention. 同発明を実施するための最良の形態の説明に供し、要部の正断面説明図である。It is a front cross-sectional explanatory drawing of the principal part for description of the best mode for carrying out the invention.

符号の説明Explanation of symbols

１ 薬液処理装置
２ 処理室
３ コンベア
４ スプレーノズル
５ 液槽
６ 貯槽
７ フレーム区画壁
８ 挟みローラー（上位）
９ 挟みローラー（下位）
１０ ポンプ
１１ 配管
１２ 軸（上位）
１３ 軸（下位）
１４ 伝達ギヤ
１５ 伝達ギヤ
１６ 伝達ギヤ
１７ 駆動ギヤ
１８ 駆動シャフト
１９ 押え調整部
２０ レベル出し調整部
２１ 溝
Ａ 基板材
Ｂ 薬液
Ｃ 搬送方向
Ｄ 両側端面
Ｅ 回路形成面
Ｆ 硬質ゴムローラー
Ｇ 金属ローラー DESCRIPTION OF SYMBOLS 1 Chemical processing apparatus 2 Processing chamber 3 Conveyor 4 Spray nozzle 5 Liquid tank 6 Storage tank 7 Frame partition wall 8 Clamping roller (upper)
9 Pinching roller (lower)
10 Pump 11 Pipe 12 Axis (upper)
13th axis (lower)
DESCRIPTION OF SYMBOLS 14 Transmission gear 15 Transmission gear 16 Transmission gear 17 Drive gear 18 Drive shaft 19 Presser adjusting part 20 Leveling adjustment part 21 Groove A Substrate material B Chemical solution C Conveying direction D Both end faces E Circuit formation surface F Hard rubber roller G Metal roller

Claims (4)

基板の製造工程で使用され、基板材を薬液にて表面処理する薬液処理装置であって、該薬液で満たされた液槽と、該液槽内に配設され該基板材を搬送するコンベアと、該液槽内に配設され該基板材に該薬液を噴射するスプレーノズルと、を有してなり、
該コンベアは、回路形成面に無接触で該基板材を送る挟みローラー群を備えており、該挟みローラーは、該基板材の両側端面を挟んで送る駆動ローラーよりなること、を特徴とする薬液処理装置。 A chemical processing apparatus used in a substrate manufacturing process for surface-treating a substrate material with a chemical solution, a liquid tank filled with the chemical solution, and a conveyor disposed in the liquid tank and conveying the substrate material A spray nozzle that is disposed in the liquid tank and injects the chemical liquid onto the substrate material,
The conveyor includes a group of pinching rollers that send the substrate material in a non-contact manner to the circuit forming surface, and the pinching rollers include driving rollers that feed the both side end surfaces of the substrate material. Processing equipment. 請求項１に記載した薬液処理装置において、該基板材を挟んで送る対をなす一方の該挟みローラーは、軟質材よりなり、他方の該挟みローラーは、硬質材よりなり外周面に溝が形成されており、
このような両該挟みローラー間にて、該基板材を圧接，挟持しつつ滑り，蛇行なく送ること、を特徴とする薬液処理装置。 2. The chemical processing apparatus according to claim 1, wherein one of the pair of sandwiching rollers that are paired and fed while sandwiching the substrate material is made of a soft material, and the other sandwiching roller is made of a hard material and has a groove formed on the outer peripheral surface. Has been
A chemical processing apparatus characterized in that the substrate material is fed between the both sandwiching rollers without being slipped and meandered while being pressed and sandwiched. 請求項１に記載した薬液処理装置において、該薬液処理装置は、基板の製造工程の現像工程，エッチング工程，又は剥離工程で使用され、該薬液は、現像液，エッチング液，又は剥離液よりなり、該基板材は、フレキシブル基板材，その他の極薄材よりなること、を特徴とする薬液処理装置。   2. The chemical processing apparatus according to claim 1, wherein the chemical processing apparatus is used in a development process, an etching process, or a peeling process of a substrate manufacturing process, and the chemical liquid is composed of a developer, an etching liquid, or a peeling liquid. The chemical treatment apparatus is characterized in that the substrate material is made of a flexible substrate material or other ultrathin material. 請求項１に記載した薬液処理装置において、該コンベアは、該基板材を水平搬送し、その該挟みローラーは、上下で対をなすと共に左右に配されており、該基板材の左右両側端面をそれぞれ上下から挟んで送ること、を特徴とする薬液処理装置。   2. The chemical processing apparatus according to claim 1, wherein the conveyor horizontally conveys the substrate material, and the sandwiching rollers are paired up and down and arranged on the left and right sides. A chemical processing apparatus characterized in that each of them is sent from above and below.
JP2006264189A 2006-09-28 2006-09-28 Chemical treatment device Pending JP2008085119A (en)

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CNA2007100867350A CN101155477A (en) 2006-09-28 2007-03-13 Liquid medicine processing device
CNA2007101541508A CN101155479A (en) 2006-09-28 2007-09-19 Liquid medicine processing device
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