JP2010040982A - Equipment for treating board material surface - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide equipment for treating a board material surface where reliability, yield, mass productivity, and the like of an electronic circuit board are improved by promoting the equalization of treatment liquid updating, surface treatment, and a circuit with regard to the board material. <P>SOLUTION: The surface treating equipment 1 is used in a process manufacturing the electronic circuit board, and has a liquid tank 5 in which the treatment liquid F is filled, a conveyer 3 that conveys the board material E in the liquid inside the liquid tank 5, and a spray nozzle 4 that jets the treatment liquid F to the board material E in the liquid inside the liquid tank 5. Aspirators 15 of the treatment liquid F jetted in the liquid from the spray nozzle 4 are provided inside the liquid tank 5, the aspirators 15 are provided between before and after spray tubes of the spray nozzle 4, one that performs sucking in the right direction and another that performs sucking in the left direction are alternately disposed, and an aspirated amount of the aspirator 15 is controllable so as to be able to cope with a jetted amount in the liquid of the spray nozzle 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate material surface treatment apparatus. That is, the present invention relates to a surface treatment apparatus that is used in a manufacturing process of an electronic circuit board and performs a surface treatment with a treatment liquid while conveying a substrate material.

《Technical background》
Electronic circuit boards used in electronic equipment, from general household appliances to computers, have made remarkable progress in miniaturization, weight reduction, ultrathinning, and flexibility, and miniaturization and higher density of electronic circuits formed are also remarkable.
And in the manufacturing process of such an electronic circuit board, various surface treatment apparatuses are used, and each substrate material conveyed by a conveyor is surface-treated with a treatment liquid sprayed from a spray nozzle. Yes. For example, processing solutions such as a developing solution, an etching solution, a stripping solution, and a cleaning solution are sprayed, and surface treatments such as development, etching, stripping, and cleaning are sequentially performed.

<Conventional technology>
Conventionally, in this type of surface treatment apparatus, conveyors and spray nozzles are arranged in the atmosphere and in the air, and the substrate material is surface-treated with a treatment liquid sprayed in the atmosphere and in the air. However, with the recent progress of ultra-thinning, the substrate material that is ultra-thin and has no waist is shaken, bent, or dropped due to the spray pressure and weight of the sprayed processing liquid in the air transport and air jet systems. Or accidents of falling.
Therefore, in order to deal with these problems and avoid the above-mentioned accidents, surface treatment devices in which conveyors and spray nozzles are arranged in a liquid tank filled with a treatment liquid have been developed and used. In the processing apparatus, the substrate material is transported in the liquid and surface-treated with a processing liquid sprayed in the liquid.
Furthermore, in this submerged transport and submerged jet type surface treatment device, a type of conveyor has been developed that transports the substrate material without contact with the circuit forming surface of the substrate material, sandwiching only the left and right end faces of the substrate material. It has been adopted. In other words, with the method of feeding across the entire outer surface of the substrate material, damage such as scratches, scratches, damage, etc. was likely to occur on the circuit forming surface of the substrate material. It has been developed and adopted.

《Information on prior art documents》
As the above-mentioned surface treatment apparatus of the air conveyance and air injection method, for example, the one shown in the following Patent Document 1 can be cited. As a surface treatment apparatus of the submerged conveyance and submerged jet system, for example, the one shown in the following Patent Document 2 can be cited. An example of the end surface transfer type surface treatment apparatus is shown in Patent Document 3 below.
JP 2002-68435 A Japanese Patent Laid-Open No. 10-079565 JP 2008-085119 A

About the problem
By the way, the following problems have been pointed out with respect to the end surface transport type surface treatment apparatus using such a submerged transport and submerged jet system.
That is, the processing liquid sprayed onto the substrate material is not uniformly renewed after the surface treatment of the substrate material, that is, it is not immediately discharged smoothly, and the substrate material surface becomes turbulent in the forward and backward transport directions, etc. It has been pointed out that it stays as a liquid pool stagnating at the center of the substrate material surface.
On the surface of the substrate material, it is necessary to continuously inject and update fresh processing liquids one after another to promote reaction processing. However, due to such turbulent flow and liquid pooling, the processing liquid is uniformly updated. The place where the hindrance occurred was generated in various places on the surface of the substrate material. And due to such non-uniformity of processing liquid renewal, surface treatment on the circuit forming surface of the substrate material may vary, excessive or insufficient, slow spots, etc., resulting in non-uniform surface treatment and surface treatment accuracy. As a result, the formation of a uniform circuit was hindered.

FIG. 5B is a schematic plan view of the main part of the substrate circuit. As shown in the figure, the circuit B of the electronic circuit board A is formed in the vertical direction (front-rear direction C), the horizontal direction (left-right direction D), and the oblique direction. As a matter of course, these circuit widths are required to have the same dimensions within an allowable range of design dimensions.
However, for the circuit B to be formed, due to the turbulent flow described above, the left and right conveying rollers and the frame partition walls of the conveyor obstruct, and the flow of the processing liquid on the substrate material surface is centered on the left and right portions. The width of the circuit is such that the vertical one is thick and large, the horizontal one is thin and small, or the central one is thin due to the liquid pool mentioned above. A non-uniform phenomenon occurred.
These points have become more prominent with the progress of miniaturization and higher density of the circuit B. When the required circuit width is, for example, about 20 μm, the circuit width becomes more difficult to uniform, which is a serious problem in terms of the reliability, yield, mass production, and productivity of the electronic circuit board A.

<< About the present invention >>
In view of such a situation, the surface treatment apparatus for a substrate material of the present invention has been made in order to solve the problems of the conventional example.
An object of the present invention is to propose a surface treatment apparatus for a substrate material that can achieve uniform renewal of processing liquid, uniform treatment of a substrate material, and uniform circuit formation.

<About each claim>
The technical means of the present invention for solving such a problem is as follows. First, claim 1 is as follows.
The surface treatment apparatus for a substrate material according to claim 1 is used in a manufacturing process of an electronic circuit board. And a liquid tank filled with the processing liquid, a conveyor for transporting the substrate material in the liquid tank, and a spray nozzle for injecting the processing liquid onto the substrate material in the liquid tank. is doing.
In addition, a suction device is provided in the liquid tank for sucking the processing liquid sprayed from the spray nozzle in the liquid immediately after the surface treatment of the substrate material. Uniformity, surface treatment uniformity, and circuit uniformity are promoted.

About Claim 2, it is as follows. In a substrate material surface treatment apparatus according to a second aspect of the present invention, in the first aspect, a large number of spray nozzles are provided in spray tubes that are directed in the left-right direction and provided in a plurality of rows in the front-rear transport direction. And this suction device is provided in the front-back space | interval of this spray tube, It is characterized by the above-mentioned.
About Claim 3, it is as follows. The surface treatment apparatus for substrate material according to claim 3 is characterized in that, in claim 2, the suction device is composed of a suction pipe, and the suction device in the right direction and the suction device in the left direction are alternately arranged. It is characterized by that.
About Claim 4, it is as follows. In a substrate material surface treatment apparatus according to a fourth aspect of the present invention, in the second aspect of the present invention, the suction device can be controlled so that the suction amount of the processing liquid corresponds to the injection amount of the processing liquid from the spray nozzle. It is characterized by that.
About Claim 5, it is as follows. The substrate material surface treatment apparatus according to claim 5 is the substrate material surface treatment apparatus according to claim 2, wherein a partition wall for partitioning the aspirator is provided in the liquid tank, and the flow of the treatment liquid is rectified to the aspirator. It is characterized by being possible.
About Claim 6, it is as follows. The substrate material surface treatment apparatus according to claim 6, wherein the conveyor is transported across the left and right end surfaces of the substrate material without contacting the circuit forming surface of the substrate material. It is characterized by doing.
About Claim 7, it is as follows. The surface treatment apparatus for a substrate material according to claim 7, wherein the spray nozzle is disposed above and below the substrate material to be transported, and the spray tube, suction device, partition wall Is also arranged vertically.

<About the action>
Since the present invention comprises such means, the following is achieved.
(1) This surface treatment apparatus is used in an electronic circuit board manufacturing process.
(2) Then, while the substrate material is transported in the liquid by a conveyor in the liquid tank, the processing liquid is sprayed from the spray nozzle into the liquid, thereby surface-treating the substrate material.
(3) In this surface treatment apparatus, the treatment liquid sprayed from the spray nozzle is sucked from the vicinity of the substrate material toward the suction device after the surface treatment of the substrate material.
(4) The suction device is provided at the front and rear intervals of the spray tube, and the partition is provided between the suction devices, so that the flow of the processing liquid toward the suction device is rectified and formed smoothly and reliably. .
(5) Further, the suction amount of the suction device can correspond to the spray amount of the spray nozzle.
(6) Now, in this surface treatment apparatus, the treatment liquid sprayed in the liquid is immediately sucked, discharged and removed from the vicinity of the substrate material after the surface treatment of the substrate material, and then freshly treated in the liquid. Instead, the liquid surface-treats the substrate material.
(7) Therefore, the treated liquid after the surface treatment is sucked, discharged, and removed before turbulent flow or liquid accumulation.
(8) In this way, uniform renewal of the processing liquid is promoted, and uniform surface treatment and uniform circuit formation can be achieved without the occurrence of variations, excess or deficiency, slow spots, etc. in the surface treatment of the substrate material. Realized.
(9) Therefore, the phenomenon of non-uniform circuit width is also prevented. In addition, since the suction device absorbs the left and right alternately, the above-described uniform suction, renewal, circuit width, and the like are more reliably realized from this aspect.
(10) Thus, the substrate material surface treatment apparatus of the present invention exhibits the following effects.

In the surface treatment apparatus of the present invention, uniform update of the treatment liquid, uniform treatment of the substrate material, and uniform circuit formation are realized.
That is, the surface treatment apparatus of the present invention is provided with a suction device that uniformly sucks and removes the processing liquid sprayed in the liquid from the vicinity of the substrate material immediately after the surface treatment of the substrate material. The suction device alternately sucks left and right, has a partition between them, and can also control the suction amount corresponding to the injection amount of the processing liquid.
Therefore, in the present invention, a situation in which the processing liquid sprayed in the liquid is not discharged from the vicinity of the substrate material after the substrate material processing is avoided as in the above-described conventional example. Accordingly, the turbulent flow of the processing liquid and the generation of the liquid pool are eliminated, and the uniform renewal of the processing liquid is promoted, so that the processing accuracy of the substrate material is improved, and the uniform surface treatment and the uniform circuit formation are realized. Furthermore, the surface treatment speed can be greatly improved.
These points are particularly significant as electronic circuit boards become smaller and more dense, and the reliability, yield, mass productivity, and productivity of electronic circuit boards are greatly improved. It becomes like this.
As described above, the effects exhibited by the present invention are remarkably large, such as all the problems existing in this type of conventional example are solved.

《About drawing》
Hereinafter, a substrate material surface treatment apparatus of the present invention will be described in detail based on the best mode for carrying out the invention shown in the drawings. FIGS. 1 to 5 (1) are used to explain the best mode for carrying out the present invention.
1 is a front sectional view, FIG. 2 is a side sectional view, FIG. 3 is a plan sectional view, FIG. 4 is a plan view of a plate, etc., and FIG. It is a bottom view of a vessel.
FIG. 5B is a schematic plan view of the main part of the substrate circuit. 6 and 7 are used for general description of the substrate material surface treatment apparatus. FIG. 6 is a front sectional view, and FIG. 7 is a side sectional view.

<< Electronic circuit board A >>
The surface treatment apparatus 1 for the substrate material E of the present invention is used in the manufacturing process of the electronic circuit board A. First, the electronic circuit board A will be described.
Electronic circuit boards A such as printed wiring boards used in electronic equipment, from general household appliances to computers, are reduced in size and weight, made ultrathin, flexible, and circuit B is made finer and higher in density. Progress such as multilayering is remarkable. For example, regarding the size, a small semiconductor package substrate on which a semiconductor element and a component are integrated and mounted integrally with the circuit B is rapidly spread along with a relatively large mother board. With regard to hardness and softness, the development and increase of flexible substrates and other ultra-thin and flexible flexible substrates are remarkable compared to conventional rigid substrates such as rigid substrates. The electronic circuit board A includes a double-sided board type in which a circuit B is formed on both sides, and a single-sided board type in which a circuit B is formed only on one side.
The recent requirements for the electronic circuit board A are that the total plate thickness is about 100 μm to 25 μm, the circuit width is about 20 μm, and the inter-circuit space is about 10 μm. The circuit width has reached about 20 μm from the conventional 35 μm era, and is about to reach the 15 to 10 μm era.
As a manufacturing method of such an electronic circuit board A, an etching method and a semi-additive method (plating method) are typical. In the etching method, a photosensitive resist is applied or pasted on the outer surface of the substrate material E made of a copper-clad laminate, and then exposed by applying a negative film of circuit B, and then a resist other than the circuit forming portion is applied. The film is dissolved and removed by development, and the copper foil other than the circuit formation part is dissolved and removed by etching, and then the resist at the circuit formation part is removed. → Thereby, the electronic circuit B is formed with the copper foil remaining on the outer surface of the substrate material E, and thus the electronic circuit board A is manufactured. The present invention relates to an etching method that follows such a process.
The electronic circuit board A is as described above.

<< About the surface treatment apparatus 1 >>
The surface treatment apparatus 1 is used in the manufacturing process of such an electronic circuit board A, and surface-treats the substrate material E with the treatment liquid F. First, the surface treatment apparatus 1 will be generally described with reference to FIGS.
The surface treatment apparatus 1 is used as a developing device, an etching device, a peeling device, and a cleaning device in a manufacturing process of the electronic circuit board A, for example, in a developing process, an etching process, a peeling process, and a cleaning process.
In each surface treatment apparatus 1, for example, a developing solution, an etching solution, or the like is applied from a spray nozzle 4 to a substrate material E made of a copper clad laminate that is conveyed by a conveyor 3 and is attached with a photosensitive resist in the treatment chamber 2. A treatment liquid F such as a stripping liquid or a cleaning liquid is sequentially ejected, so that the substrate material E is subjected to a surface treatment such as a chemical treatment or a cleaning treatment.

And this surface treatment apparatus 1 consists of a submerged conveyance, a submerged injection system, and also an end surface conveyance system, and is equipped with the liquid tank 5, the conveyor 3, the spray nozzle 4, the storage tank 6, etc. in the process chamber 2. Yes.
First, the liquid tank 5 is filled with the processing liquid F. That is, the liquid tank 5 is formed in the upper part of the processing chamber 2 using the frame partition wall 7 that also serves as a conveyor frame, and is filled with the same processing liquid F as the processing liquid F sprayed from the spray nozzle 4. .
The conveyor 3 is disposed in the processing liquid F of the liquid tank 5, and transports the substrate material A in the liquid tank 5 in the transport direction (front-rear direction) C. And it is equipped with many conveyance rollers 8 in the right and left, up and down, and each conveyance roller 8 is non-contact with the circuit formation surface G of the board | substrate material E, and sandwiches the left and right both end surfaces H of the board | substrate material E from upper and lower sides, Transport horizontally.
A large number of spray nozzles 4 are arranged above and below the substrate material E to be conveyed in the processing liquid F in the liquid tank 5. As shown in the drawing, a large number of upper and lower spray tubes 9 are provided in the horizontal direction D and provided in a plurality of rows in the conveyance direction (front-rear direction) C. The processing liquid F is sprayed from above and below onto the circuit forming surface G of the substrate material E to be formed.

The processing liquid F is pumped from the storage tank 6 at the lower part of the processing chamber 2 to each spray nozzle 4 via the pump 10, the pipe 11, each spray pipe 9, etc., and is injected into the substrate material E in the liquid. The circuit forming surface G on the surface of the substrate material E is absorbed in the processing liquid F in the liquid tank 5 after the reaction processing. In this type of conventional example, as a result, all of the corresponding processing liquid F overflows from the liquid tank 5 and is collected and stored in the storage tank 6, and then circulated again after use.
The substrate material E is composed of a circuit forming surface G having a wide central portion and front and rear end surfaces and left and right side end surfaces H having a narrow outer peripheral edge. The front and rear end surfaces and both side end surfaces H have a width of about 10 mm. It is also referred to as a portion, and is a non-circuit forming surface. Also, the substrate material E in the illustrated example is of a type (a double-sided board type electronic circuit board A) in which a circuit forming surface G, front and rear end surfaces, and both end surfaces are formed on both front and back surfaces.
In addition, the conveyance roller 8 of the conveyor 3 consists of a drive roller (drive roller), and is connected to drive mechanisms (not shown), such as a motor, via the shaft 12, each gear 13, and the drive shaft 14.
The surface treatment apparatus 1 is generally configured as described above.

<< Outline of the Present Invention >>
The present invention will be described below with reference to FIGS. 1 to 5 (1). In the surface treatment apparatus 1 for a substrate material E according to the present invention, an aspirator 15 is provided in the liquid tank 5 for sucking the processing liquid F injected into the liquid from each spray nozzle 4.
The suction unit 15 is provided at the front-rear interval of the spray tube 9, and in the illustrated example, includes a suction pipe 17 provided with a suction slit hole 16, and the one that sucks in the right direction and the one that sucks in the left direction are Alternatingly arranged.
The suction unit 15 can control the suction amount of the processing liquid F so as to correspond to the in-liquid injection amount of the processing liquid F from the spray nozzle 4. In the liquid tank 5, partition walls 18 that partition the suction units 15 are disposed. Thus, the flow of the processing liquid F after being sprayed into the liquid and surface-treating the substrate material E is used as the suction unit 15. Can be rectified.
In the illustrated example, in consideration of the spray tube 9 and the spray nozzle 4 being arranged opposite to the upper and lower sides of the substrate material E to be conveyed, the suction units 15 and the partition walls 18 are also arranged above and below the substrate material E. Opposed to each other.
The surface treatment apparatus 1 of the present invention is roughly as described above.

<About the plate 19>
Such a surface treatment apparatus 1 will be further described in detail. First, the plate 19 will be described. 4, the plate 19 shown in FIG. 4 is arranged up and down facing the circuit forming surfaces G on the front and back of the substrate material E to be conveyed, as shown in FIGS. It is installed.
The plate 19 is substantially flat and flat in the horizontal direction, and the vertical distance J in the vertical direction J between the two plates 19 is about 3 mm to 5 mm. Is transported. A large number of nozzle holes 20 and suction holes 21 are formed in the plate 19 as upper and lower through holes.
The nozzle holes 20 are arranged in a large number along the left-right direction D, and a plurality of rows are arranged in the front-rear direction (conveying direction) C with a gap. Each nozzle hole 20 is integrally connected to each spray nozzle 4 of the spray tube 9 described above.
The suction hole 21 sucks and discharges the treatment liquid F sprayed into the substrate material E in the liquid after being reflected from the substrate material E after the surface treatment of the substrate material E, that is, immediately near the substrate material E. A large number are provided so as to pass through the suction device 15 toward the suction device 15. The suction holes 21 are both open at the top and bottom in the liquid tank 5 and are arranged in front of and behind each row of the nozzle holes 20, respectively. That is, the suction holes 21 are arranged in multiple rows along the left-right direction D, and a plurality of rows are arranged in the front-rear direction (conveying direction) C.
The plate 19 is like this.

<About the aspirator 15>
Next, the aspirator 15 will be described. The suction unit 15 includes a suction pipe 17 in the illustrated example, and a suction slit hole 16 is formed on the lower surface or the upper surface in the axial direction (left-right direction D) as shown in FIG. In addition, you may make it form many holes in an axial direction irrespective of the example of illustration.
The aspirator 15 is connected to the storage tank 6 (see FIG. 7) via a pipe, a suction pump (not shown), and the like, and collects and supplies the suctioned processing liquid F to the storage tank 6. . As shown in FIG. 3, the suction device 15 is provided at an intermediate position between the front and rear intervals of the spray tubes 9 arranged in the front-rear direction (conveyance direction) C in the liquid tank 5. As shown in FIG. 2, the vertical direction J is provided with a vertical interval.
Further, as shown in FIG. 3, the suction device 15 is alternately arranged in the front-rear direction (conveying direction) C to suck rightward in the left-right direction D and to suck leftward. .
Further, the processing liquid F suction amount of the suction device 15 can be automatically controlled so as to correspond to the spray amount in the processing liquid F of each spray nozzle 4 to be sucked. In the illustrated example, the suction amount of the suction device 15 including one suction pipe 17 is the total processing liquid F spray amount sprayed from each spray nozzle 4 of the two spray tubes 9 partitioned by the partition wall 18. For example, it is automatically set to substantially the same amount so as to match.
The aspirator 15 is as described above.

<About the partition wall 18>
Next, the partition wall 18 will be described. The partition wall 18 is disposed in the liquid tank 5, and as shown in FIGS. 1 to 4, the partition wall 18 on the upper side of the substrate material E to be transported includes left and right walls, front and rear walls, and in the illustrated example. And a top wall. Such a partition wall 18 forms a substantially elongated box-shaped liquid submerged area surrounded by a plate 19 positioned on the lower side, and in the illustrated example, a sealed liquid submerged area.
The lower partition 18 of the substrate material E also includes left and right walls, front and rear walls, and a bottom wall in the illustrated example, and is a substantially long box-like shape surrounded by a plate 19 positioned on the upper side. In the illustrated example, the submerged area is defined as a sealed submerged area.
In the illustrated example, one suction pipe 17 and two spray pipes 9 are arranged in the submerged area defined by the partition walls 18 and the like.
By forming such a submerged area, the processing liquid F after being sprayed in the liquid and surface-treating the substrate material E is transferred from each suction hole 21 of the plate 19 to each suction unit 15, that is, the suction pipe 17. Smoothly sucked and flows. A flow flowing in the left direction and absorbed into the left suction pipe 17 and a flow flowing in the right direction and absorbed into the right suction pipe 17 are smoothly partitioned.

<Others>
Now, the suction pipe 17, the suction device 15, the partition wall 18, the plate 19, the spray tube 9, the spray nozzle 4 and the like are arranged above and below the substrate material E to be conveyed.
Further, in the processing chamber 2 of the surface treatment apparatus 1 of the present invention, the liquid tank 5 provided with these is one unit, and the liquid tank 5 of each such unit is along the front-rear direction (conveying direction) C. Thus, a large number are disposed in the processing chamber 2. Each liquid tank 5 is formed by a frame partition wall 7 (in the example of FIGS. 6 and 7 described above, one liquid tank 5 is formed in one processing chamber 2, It ’s different).
Furthermore, although the surface treatment apparatus 1 in the illustrated example has a horizontal conveyance method, the present invention is not limited to this, and is also applicable to an inclined conveyance method and a vertical conveyance method. That is, the present invention can also be applied to a system in which the conveyor 3 conveys the substrate material E in the liquid while being inclined obliquely instead of horizontally or vertically. In that case, the spray tube 9, the spray nozzle 4, the suction device 15, the partition wall 18 and the like are also arranged so as to correspond to the substrate material E conveyed in an inclined posture or a vertical posture.
In FIG. 1 to FIG. 3, reference numeral 22 denotes a liquid supply pipe interposed from the storage tank 6 in the middle of the spray pipe 9, and reference numeral 23 denotes a longitudinal direction for supplying the processing liquid F from the liquid supply pipe 22 to each spray pipe 9. It is a tube.
The surface treatment apparatus 1 of the present invention is as described above.

《Action etc.》
The substrate material surface treatment apparatus 1 of the present invention is configured as described above. Therefore, it becomes as follows.
(1) The surface treatment apparatus 1 is used in the manufacturing process of the electronic circuit board A. That is, it is used as a developing device, an etching device, a peeling device, or a cleaning device in a developing process, an etching process, a peeling process, or a cleaning process that forms the core of the manufacturing process of the electronic circuit board A.

  (2) And the surface treatment apparatus 1 surface-treats the substrate material E with the treatment liquid F. That is, while the substrate material E is transported in the liquid tank 5 by the conveyor 3 and transported at the end face, the processing liquid F such as developer, etching liquid, stripping liquid, or cleaning liquid is sprayed from the spray nozzle 4 into the liquid. Accordingly, the substrate material E is surface-treated for forming the circuit B (see FIG. 5, (2), FIG. 6, and FIG. 7).

  (3) Now, in this surface treatment apparatus 1, the treatment liquid F sprayed from the spray nozzles 4 toward the substrate material E through the nozzle holes 20 of the plate 19 is subjected to surface treatment of the substrate material E → Reflected from the substrate material E and bounces back, and is sucked from the vicinity of the substrate material E toward the suction pipe 17 of the suction device 15 through the suction holes 21 of the plate 19 (see FIGS. 1 to 4).

  (4) The suction device 15 is provided at a vertical position in the center of the front-rear distance in the front-rear direction (conveying direction) C between the spray tubes 9, and a partition wall 18 is provided between the suction devices 15. Such a positional relationship and the presence of the partition wall 18 rectify the flow of the processing liquid F toward the aspirator 15 described above, so that it is smoothly and reliably formed (see FIGS. 1 to 3).

(5) Further, the processing liquid F suction amount of the suction device 15 can correspond to the processing liquid F injection amount of the spray nozzle 4, and also from this surface, the processing liquid F directed toward the suction device 15 described above. The flow is formed smoothly and reliably.
However, the above-described suction amount in liquid and the injection amount in liquid do not need to completely match, and in many cases, the injection amount in liquid is slightly larger. The surplus treatment liquid F overflows K from the liquid tank 5 (see FIG. 1) and is collected in the storage tank 6 (see FIG. 7).
That is, most of the processing liquid F sprayed in the liquid from the spray nozzle 4 is absorbed in the processing liquid F in the liquid tank 5, but the liquid tank 5 that has absorbed the liquid spray in this way. Since the processing liquid F in the inside → the suction device 15 sequentially sucks the processing liquid F substantially corresponding to the amount of liquid injected from the spray nozzle 4 → only the processing liquid F remaining as a surplus is Overflow K will occur.

  (6) Therefore, in the surface treatment apparatus 1, fresh treatment liquid F is continuously supplied to the surface of the substrate material E. That is, the processing liquid F sprayed in the liquid toward the surface of the substrate material E is sucked, discharged, and removed from the vicinity of the substrate material E immediately after the processing reaction on the surface of the substrate material E. Then, instead of this, the fresh processing liquid F sprayed in the liquid surface-treats the substrate material E, and the surface treatment of the substrate material E is promoted.

  (7) The treatment liquid F after the surface treatment is sucked, discharged, and removed before turbulent flow and before the liquid pools. The processing liquid F is prevented from flowing as a turbulent flow in the transport direction (front-rear direction) C on the surface of the substrate material E or staying as a liquid pool stagnating at the center of the surface of the substrate material E.

  (8) Now, in this way, uniform renewal of the processing liquid F injected from the spray nozzle 4 into the liquid is promoted, and turbulent flow and liquid accumulation are avoided. Therefore, the surface treatment of the circuit forming surface G of the substrate material E does not cause variations, excess or deficiency, slow speed portions, etc., and uniform surface treatment and uniform circuit formation are realized.

(9) As shown in FIG. 5 (2), the circuit B of the electronic circuit board A is formed in the vertical direction (front-rear direction C), the horizontal direction (left-right direction D), the diagonal direction, etc. These circuit widths are made uniform. Due to the turbulent flow, the circuit B in the vertical direction becomes large, or the circuit B in the central portion becomes thin due to the liquid pool, so that the circuit width nonuniformity phenomenon can be reliably prevented.
Furthermore, since the suction device 15 absorbs the treatment liquid F alternately in the left and right directions, uniform suction, renewal, and circuit width can be more reliably realized from this surface. Updates that are biased to the left or right are avoided, and a situation in which only the left side or the right side of the formed circuit B is surface-treated intensively is prevented.
The operation of the present invention is as described above.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front sectional view of a surface treatment apparatus for a substrate material according to the present invention for explaining the best mode for carrying out the invention. FIG. 4 is a side sectional view for explaining the best mode for carrying out the invention. FIG. 2 is a plan sectional view for explaining the best mode for carrying out the invention. FIG. 5 is a plan view of a plate and the like for explaining the best mode for carrying out the invention. (1) The figure is a bottom view of the upper suction device for explaining the best mode for carrying out the invention. (2) The figure is a schematic plan view of the main part for explaining the substrate circuit. It is used for general description of the surface treatment apparatus of a substrate material, and is a front sectional view. It is a sectional view of a side surface for general description of a surface treatment apparatus for a substrate material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface treatment apparatus 2 Processing chamber 3 Conveyor 4 Spray nozzle 5 Liquid tank 6 Storage tank 7 Frame partition wall 8 Conveyance roller 9 Spray pipe 10 Pump 11 Pipe 12 Shaft 13 Gear 14 Drive shaft 15 Suction machine 16 Suction slit hole 17 Suction pipe 18 Bulkhead 19 Plate 20 Nozzle hole 21 Suction hole 22 Liquid supply pipe 23 Vertical pipe A Electronic circuit board B Circuit C Transport direction (front-back direction)
D Left-right direction E Substrate material F Processing solution G Circuit forming surface H Both end surfaces J Vertical direction K Overflow

Claims (7)

A substrate material surface treatment apparatus used in a manufacturing process of an electronic circuit board, a liquid tank filled with a processing liquid, a conveyor for transporting the substrate material in liquid in the liquid tank, and the liquid tank A spray nozzle for injecting a processing liquid into the substrate material in the liquid,
Furthermore, a suction device is provided in the liquid tank for sucking the processing liquid sprayed from the spray nozzle in the liquid immediately after the surface treatment of the substrate material. Surface treatment apparatus for substrate material, characterized in that uniform surface treatment and uniform circuit are promoted.   In the surface treatment apparatus for a substrate material according to claim 1, a plurality of the spray nozzles are provided in a spray tube that is directed in the left-right direction and provided in a plurality of rows in the front-rear transport direction, and the suction device includes A surface treatment apparatus for a substrate material, characterized in that the apparatus is provided at a front-rear interval of a spray tube.   The surface treatment apparatus for a substrate material according to claim 2, wherein the aspirator is composed of a suction pipe, and the one that sucks in the right direction and the one that sucks in the left direction are alternately arranged. A substrate material surface treatment apparatus.   3. The surface treatment apparatus for a substrate material according to claim 2, wherein the suction device is controllable so that the suction amount of the processing liquid corresponds to the injection amount of the processing liquid from the spray nozzle. A substrate material surface treatment apparatus characterized by the above.   In the surface treatment apparatus for a substrate material according to claim 2, a partition wall for partitioning between the suction devices is provided in the liquid tank, so that the flow of the processing solution can be rectified to the suction device. A surface treatment apparatus for a substrate material.   In the surface treatment apparatus for a substrate material according to claim 3, 4, or 5, the conveyor is transported across the left and right end surfaces of the substrate material without contact with the circuit forming surface of the substrate material. A substrate material surface treatment apparatus.   6. The surface treatment apparatus for a substrate material according to claim 3, 4, or 5, wherein the spray nozzles are disposed above and below the substrate material to be transported, and the spray tube, the suction device, and the partition wall are also disposed above and below the substrate material. A surface treatment apparatus for a substrate material, wherein

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