JP2003218497A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which have a first function to prevent scratched damages or the like, a second function to prevent attaching of contaminations or the like, a third function of uniform processing for an injected processing liquid, further, these processes are realized simply, easily, surely, and automatically. <P>SOLUTION: The substrate processing apparatus 1 is employed in the process of manufacturing a printed wiring board, holds the printed wiring board E with a conveyer 2 having a group of vertically grooved wheels 5, and executes each process by conveying the board without the printed circuit formed face J contacting with the wheels. Further; the group of vertically grooved wheels 5 can be adjusted in vertical distance; and right and left side injection nozzles 3 can be adjusted for injection angle in symmetrically facing arrangement, in vertical position N or slanting position, and at, deviated point from a right- angle position Q. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a substrate processing apparatus. That is, the present invention relates to a substrate processing apparatus that is used in a manufacturing process of a printed wiring board and performs various processing while conveying a printed wiring board material.

[0002]

2. Description of the Related Art << Technical Background >> As electronic equipment becomes higher in performance, higher in functionality, smaller in size and lighter in weight, printed wiring boards are also becoming more precise, finer, and extremely thin, and are formed on the outer surface thereof. The progress of high density and miniaturization of circuits is remarkable. Then, in each step of the manufacturing process of such a printed wiring board, the following various processes are performed on the conveyed printed wiring board material. For example, processing solutions such as a developing solution, an etching solution, and a stripping solution are sequentially sprayed, so that the developing process of the photosensitive resist, the etching process of the copper foil, and the stripping process of the photosensitive resist are sequentially performed. The circuit was formed by. For example, dipping in electroless copper plating solution, →
Spraying of developing solution, → immersion in electrolytic copper plating solution, → spraying of stripping solution, → spraying of quick etching solution, etc.
Therefore, a circuit is formed by sequentially performing a chemical copper plating process, a photosensitive resist development process, an electrolytic copper plating process, a photosensitive resist stripping process, and an electroless copper plating quick etching process. Was there. Further, for example, as a pre-treatment and a post-treatment of each of these treatments, a treatment liquid such as a washing liquid or a chemical liquid is sprayed on the conveyed printed wiring board material, so that the cleaning treatment is performed.

<< Prior Art >> Now, in each step of the manufacturing process of such a printed wiring board, the printed wiring board material is conventionally supplied to each substrate processing apparatus and thus conveyed in a horizontal posture by a conveyor. Various processes were being performed. That is, in the above-mentioned developing step, etching step, peeling step, chemical copper plating step, electroplating step, quick etching step, cleaning step, etc.,
In each substrate processing device, → Printed wiring board material is horizontally (horizontally) oriented by the transport rollers and wheels.
While transporting with →, each processing solution is jetted from a large number of nozzles arranged facing each other, or immersed in the plating solution in the solution tank,
→ As a result, the prescribed processing was being performed.

[0004]

<Problem to be Solved by the Invention><FirstProblem> The following problems have been pointed out in such a conventional example. First, it has been pointed out that there is a frequent problem that scratches and the like frequently occur on the circuit forming surface of the printed wiring board material that is transported. That is, in this type of conventional substrate processing apparatus, a printed wiring board material (for example, a double-sided board having circuit forming surfaces on both front and back surfaces) is placed on a transport roller or a wheel (in many cases, sandwiched from above and below). , Various processing was performed while being transported in a horizontal posture. Therefore, the outer surface of the printed wiring board material to be processed, that is, the circuit formation surface, contacts the transport roller or wheel,
The pressure was likely to cause contact scratches and abrasions. That is, the photosensitive resist on the circuit formation surface, copper foil, plating,
Crushing, denting, deformation, and other scratches on the circuit were unavoidable. These were particularly noticeable on the back and bottom surfaces of the double-sided board. The occurrence of such scratches causes variations in processing, causes of impediment to uniformity, causes of defects, etc., and is likely to be a fatal defect for a printed wiring board in which circuit densification and miniaturization are progressing, and the yield is also increased. It was bad.

<Regarding Second Problem> Secondly, it has been pointed out that there is a problem that dust or the like adheres to the circuit forming surface of the printed wiring board material being conveyed. That is, in the manufacturing process of a printed wiring board, first, a copper-clad laminate in which a copper foil is pasted on an insulating base material,
Although it is cut to the work size, in the printed wiring board material prepared in this way, at the cutting point (peripheral edge),
Cutting powder, dust, surrounding dust, etc., generated during cutting are attached. In this type of conventional substrate processing apparatus, a printed wiring board material (for example, a double-sided board having circuit forming surfaces on both front and back surfaces) is placed on a carrying roller or a wheel (in many cases, sandwiched from above and below). ), Because it is conveyed in a horizontal position, → such dust, etc. → from the cutting point (peripheral edge) of the printed wiring board material → once adheres to the transfer roller or wheel, → It has been pointed out that it may be reattached to the circuit forming surface, or may be reattached to the circuit forming surface of the printed wiring board material to be conveyed next. That is, it was easy for dust to adhere to the photosensitive resist, copper foil, plating, circuits, etc. on the circuit formation surface. In particular, these were remarkable on the back surface (lower surface) side of the double-sided substrate. The adhesion of dust and the like causes the above-mentioned scratches and the like, and also causes the variation in processing,
The density of the circuit is increased due to the cause of non-uniformity, the cause of defects, etc.
For a printed wiring board that is becoming more and more miniaturized, it is likely to cause a fatal defect and the yield is low.

<Third Problem> Thirdly, regarding each step of injecting the processing liquid, a liquid pool is generated on the circuit forming surface of the printed wiring board material being conveyed, and the liquid is often taken out. The problem was pointed out. That is, in this type of conventional substrate processing apparatus, the printed wiring board material,
Since it is transported horizontally with the transport rollers and wheels,
The treatment liquid ejected from the nozzles is likely to accumulate in the central portion on the circuit forming surface and accumulate, which hinders the renewal of the treatment liquid. In the case of both front substrates, liquid pool was remarkable on the surface (upper surface). The occurrence of such liquid pools causes the processing speed to be slow / excessive or insufficient, and causes the processing to be uneven, hinders uniformity, causes defects, etc., resulting in higher density and finer circuit wiring. For the substrate, it was likely to be a fatal defect and the yield was low. Also, due to the occurrence of such a liquid pool,
It has also been pointed out that the amount of processing liquid taken out becomes large and the waste and loss of processing liquid becomes remarkable.

<Regarding Fourth Problem> Fourthly, in view of such a situation, a substrate processing apparatus which carries out various kinds of processing while conveying a printed wiring board material in a vertical posture or an oblique posture has recently been proposed. Was being developed. The recently developed substrate processing device for transporting in a vertical posture or a diagonal posture is a method in which the front and back sides of the printed wiring board material are sandwiched between the left and right roller conveyor groups from the left and right, and the inclined printed wiring board material is transported. A method of holding and conveying the back side (lower surface) side and the lower end side of the roller conveyor group, or sandwiching the upper and lower ends of the printed wiring board material by the left and right belt conveyors,
It consisted of a method of locking and conveying with a conveyor with locking members such as upper and lower clips, and so on. However, in these types of substrate processing apparatuses, first, since the roller conveyor comes into contact with the circuit forming surface of the printed wiring board material to be conveyed, the problem that scratches and the like still occur and dust and the like adhere, In the belt conveyor, the clamping and holding of the printed wiring board material is not stable, and the transport may be uncertain, and the circuit forming surface may come into contact with the belt conveyor. It has been pointed out that the manual operation is troublesome and it is against the continuation and automation of the process.

<Regarding the Present Invention> The substrate processing apparatus of the present invention has been made as a result of earnest research efforts by the inventor in order to solve the above-mentioned problems of the conventional example in view of the above circumstances. Then, in each step of the manufacturing process of the printed wiring board, the conveyor equipped with the upper and lower groove type wheel groups holds the upper and lower ends of the printed wiring board material and conveys them to the circuit formation surface in a non-contact manner while performing various treatments. Is performed. Furthermore, it is possible to change and set the vertical spacing between the upper and lower groove type wheel groups, to arrange the injection nozzles on the left and right and to symmetrically oppose each other, and to change and set the posture between upright and inclined postures. The injection angle can be changed and set between the right angle position and the deflection position. In addition, in the chemical copper plating process or the electrolytic copper plating process, it is carried while being immersed in a bath of a plating solution. Therefore, the present invention firstly prevents the occurrence of scratches and the like, secondly, prevents the adhesion of dust and the like, and thirdly, realizes a uniform treatment with the jetted treatment liquid, Fourthly, it is an object of the present invention to propose a substrate processing apparatus which realizes these simply, easily, surely and automatically.

[0009]

<< About Each Claim >> The technical means of the present invention for solving such a problem are as follows. First, claim 1 is as follows. The substrate processing apparatus according to claim 1 is used in a manufacturing process of a printed wiring board, and variously processes the printed wiring board material. The printed wiring board material is processed while being conveyed vertically by a conveyor, and the conveyor holds the upper and lower ends of the printed wiring board material and conveys the printed wiring board material in a non-contact state to a circuit forming surface. And Claim 2 is as follows. According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the printed wiring board material is provided with the circuit forming surfaces on both front and back surfaces, and the conveyor is a groove type vertically arranged in the transport direction. It has a group of wheels. The upper and lower groove type wheel groups hold the upper and lower ends of the printed wiring board material, respectively, and convey the printed wiring board material by rotation. Claim 3 is as follows. According to a third aspect of the substrate processing apparatus of the second aspect, the upper and lower groove type wheel groups of the conveyor can be vertically moved symmetrically in the opposite directions and can be positioned and fixed. Therefore, it is possible to change and set the vertical interval between them, and to cope with various sizes of the printed wiring board material.

Claim 4 is as follows. Claim 4
3. The substrate processing apparatus according to claim 2, wherein the substrate processing apparatus comprises a photosensitive resist developing step of the printed wiring board material, a copper foil etching step, a photosensitive resist peeling step, and an electroless copper plating quick etching step. It is used in a process or a cleaning process for pre-processing and post-processing, and is provided with an injection nozzle unit. The spray nozzles are disposed opposite to each other on the left and right of the printed wiring board material to be conveyed, and a processing liquid, that is, a developing liquid, an etching liquid, a stripping liquid, and a cleaning liquid that is a cleaning liquid are provided on the front and back circuit forming surfaces. , Or a treatment liquid such as a chemical liquid as a cleaning liquid is sprayed. Claim 5 is as follows. According to a fifth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the ejection nozzle portions are arranged in a large number on the left and right sides of the printed wiring board material to be conveyed, with a front-rear spacing therebetween. It is characterized in that they are symmetrically opposed to each other.

Claim 6 is as follows. Claim 6
In the substrate processing apparatus according to claim 5, the injection nozzle portion is provided with a vertically long slit-shaped injection port, and thus the processing liquid is ejected in a film form from the slit-shaped ejection port, or vertically. The present invention is characterized in that it is provided with a row of hole-shaped jetting ports, so that the treatment liquid is diffused and jetted from each of the hole-shaped jetting ports. Claim 7 is as follows. In the substrate processing apparatus of claim 7, in the injection nozzle part according to claim 6, the posture is changed between a vertical upright posture and a tilted posture which is inclined forward and backward along the transport direction in a vertical plane. The feature is that it can be set. Claim 8 is as follows. A substrate processing apparatus according to claim 8 is the substrate processing apparatus according to claim 6, wherein the injection nozzle portion has a right angle position facing the circuit forming surface of the printed wiring board material, and a deflection position angled frontward or rearward. It is characterized in that the injection angle can be changed and set, and the injection angle can be changed and set.

Claim 9 is as follows. Claim 9
The substrate processing apparatus according to claim 2, wherein the substrate processing apparatus is used in a step of plating the printed wiring board material,
It is equipped with a bath of plating liquid. Further, the groove type wheel group of the conveyor is arranged in the plating solution in the solution tank and conveys the printed wiring board material while being immersed in the plating solution. Claim 10 is as follows. According to a tenth aspect of the present invention, in the substrate treatment apparatus according to the ninth aspect, the substrate treatment apparatus is used in a chemical copper plating step of the printed wiring board material, and the liquid bath contains an electroless copper plating solution. There is. The printed wiring board material is characterized in that the outer surface of the insulating layer is plated with electroless copper. Claim 11 is as follows. The substrate processing apparatus according to claim 11 is the substrate processing apparatus according to claim 9, wherein the substrate processing apparatus is used in an electrolytic copper plating step of the printed wiring board material, and an anode is provided in the liquid tank and copper is provided. An electrolytic copper plating solution containing ions is stored. Then, the printed wiring board material which has been subjected to electroless copper plating in advance is connected to the cathode through the groove type wheel group of the conveyor, and by applying electricity, the outer surface of the electroless copper plating is subjected to electrolytic copper plating. Being featured.

<Regarding Operation> Since the present invention has such a configuration, it is as follows. This substrate processing apparatus is used in a manufacturing process of a printed wiring board, and variously processes a printed wiring board material. In this substrate processing apparatus, for example, a printed wiring board material having circuit forming surfaces on both front and back sides is rotated by the upper and lower groove type wheel groups of the conveyor being rotated,
It is conveyed in a vertical position without contacting the circuit formation surface. The upper and lower groove type wheel groups can be set by changing the vertical distance between them, and can correspond to various sizes of printed wiring board materials.

When applied to a developing process, an etching process, a peeling process, a quick etching process, a cleaning process, etc., this substrate processing apparatus is equipped with an injection nozzle portion, and is applied to a circuit forming surface of a printed wiring board material. , Developer,
A processing liquid such as an etching liquid, a peeling liquid, or a cleaning liquid is sprayed.
In this way, since the processing liquid is sprayed onto the printed wiring board material in the vertical position, the processing liquid does not stay as a liquid pool on the circuit formation surface. Further, the injection nozzle portions are provided in a large number of rows on the left and right of the printed wiring board material and are symmetrically opposed to each other on the left and right. Therefore, the printed wiring board material is held from the left and right by the jetting pressure of the treatment liquid, and there is no fear of bending, bending, or flying. The injection nozzle section injects the treatment liquid from a slit-shaped injection port or a row-shaped injection port, but the posture can be changed between the upright posture and the inclined posture, and the circuit formation surface can be set. The injection angle can be changed and set between the right-angled position facing the front and the deflection position facing the front side or the rear side. The circuit on the circuit forming surface of the printed wiring board material is often formed vertically and horizontally. In that case, by changing the setting of the injection nozzle part to the inclined posture or the deflected position, the processing liquid can be formed on the circuit forming surface. It is tilted and angled, so that it is uniformly ejected to the vertical and horizontal circuits.

When applied to the plating process, this substrate processing apparatus is provided with a liquid tank, the conveyor is arranged in the plating liquid of the liquid tank, and the printed wiring board material is conveyed while being immersed in the plating liquid. To be done. And in the case of the chemical copper plating process, the liquid bath contains the electroless copper plating liquid,
The printed wiring board material has an insulating layer plated with electroless copper. In the case of the electrolytic copper plating process, the electrolytic bath is filled with an electrolytic copper plating solution, and the printed wiring board material that had been electroless copper plated is the cathode via the grooved wheel group of the conveyor. And electroless copper plating is applied to the electroless copper plating by energization.

In each of the steps ,,,,, in the substrate processing apparatus, the upper and lower groove type wheel groups of the conveyor convey the printed wiring board material in a non-contact state with the circuit forming surface as in. Therefore, the circuit forming surface of the printed wiring board material is not crushed, dented, deformed, or otherwise contacted or scratched, and the cutting powder, dust, surrounding dust, etc. adhering to the cutting location is reattached. Nothing. Further, since the printed wiring board material is held at the upper and lower ends between the groove type wheel groups of the conveyor, the conveyance thereof is reliable and stable. Further, it suffices to supply the printed wiring board material between the upper and lower groove type wheel groups, which simplifies the operation and facilitates the continuation and automation of the process. Moreover, this substrate processing apparatus has a simple structure in which a conveyor equipped with a grooved wheel group is combined with an injection nozzle and a liquid tank.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION
A detailed description will be given based on an embodiment of the invention shown in the drawings. 1, FIG. 2, FIG. 3, FIG. 4, FIG. 5 and the like are provided for explaining the embodiment of the substrate processing apparatus according to the present invention. And FIG. 1 is a front view. 2 (1) is a side view, and FIG. 2 (2) is a plan view of a main part.

FIG. 3 (1) is a front view of the groove type wheel when the printed wiring board material is a large size, and FIG. 3 (2) is
It is a front view of a groove type wheel when a printed wiring board material is a small size. FIG. 3 (3) is a front view of the injection nozzle portion at the rearward deflection position, FIG. 4 (4) is a front view of the injection nozzle portion at a right angle position, and FIG. It is a front view of a nozzle part. (6) is a side view of the main portion of the injection nozzle portion at the rearward deflection position, (7) is a side view of the main portion of the injection nozzle portion at a right angle position, and (8) is a front side deflection position. It is a principal part side view of an injection nozzle part. FIG. 4 is a side view of an example of the injection nozzle unit. FIG. 4 (1) shows a front tilted posture, FIG. 2 (2) shows an upright posture, and FIG.
The figure shows the state of the rearward tilted posture. 5A and 5B are side views of another example of the injection nozzle portion. FIG. 5A is a front tilted posture, FIG. 5B is an upright posture, and FIG. Indicates the posture state. FIG. 6A is a side view of the chemical plating step, and FIG. 6B is a side view of the electroplating step.

FIG. 7 shows a first step of manufacturing a printed wiring board.
It is a section explanatory view of the important section which shows an example. Then, (1) is a prepared printed wiring board material, (2) is a state where a photosensitive resist film is formed, (3) is a state after a developing step, and (4) is a state. Shows the state after the etching step, and FIG. 5 (5) shows the state after the peeling step.
FIG. 8 shows another example of the manufacturing process of the printed wiring board,
It is sectional explanatory drawing of a principal part. Then, (1) is the printed wiring board material after the chemical copper plating step, (2) is the state where the photosensitive resist film is formed, and (3) is the state after the developing step ( 4) shows the state after the electrolytic copper plating step, (5) shows the state after the stripping step, and (6) shows the state after the quick etching step. Figure 9
[FIG. 3] is a plan view of a printed wiring board (material).

<< Regarding Printed Wiring Board A >> This substrate processing apparatus 1 is used in the manufacturing process of the printed wiring board A. Therefore, first, the outline of the premised printed wiring board A will be described with reference to FIG. The printed wiring board A, which is also called an electronic circuit board, is widely used as a board for various OA equipments and a board for other electronic equipments, such as a single-sided board, a double-sided board, and a multilayer board (including,
There are various types such as the latest build-up method),
As part of this, CSP and PBGA related to semiconductor chip packages in which semiconductor components are integrally loaded have also appeared. The printed wiring board A has become more and more precise, finer, ultra-thin, multi-layered, etc. in recent years as the performance, functionality, and size and weight of electronic equipment have increased. The circuit B formed on one or both of them) is remarkably increased in density and size. The printed wiring board A has a length and width of, for example, from about 500 mm × 500 mm to 330 m
It has a size of about m × 250 mm, and the thickness of the insulating layer portion made of resin or glass cloth is 1.0 mm to 60 mm.
.mu.m, the circuit B portion is 75 .mu.m to 35 .mu.m, and in recent years it has been extremely thinned to about 25 .mu.m to 10 .mu.m.
It is becoming extremely thin to about m. The width of the circuit B and the space (distance) between the circuits B are also 0.1 mm or less,
There is a tendency for miniaturization to be about 25 μm to 25 μm. The printed wiring board A is roughly as described above.

<< Manufacturing Method Shown in FIG. 7 >> Next,
Printed wiring board A in which this substrate processing apparatus 1 is used
The manufacturing method of is described. The printed wiring board A is manufactured by following the steps shown in FIG. 7, for example. First, as shown in FIG. 7 (1), after the copper foil D is attached to the outer surface of the insulating layer C (insulating base material) made of resin or glass cloth by hot pressing or the like, the copper foil D is The surface is roughened by soft etching and cut into a work size. Then, with respect to the printed wiring board material E which is the copper clad laminate prepared in this way, in many cases, a large number of through holes for through holes are carried out by using a laser or the like. The through hole is also referred to as a through via hole or a via hole, and is formed by a through hole having both open surfaces on both outer surfaces (both front and back surfaces) of the printed wiring board material E. ), A large number of ultra-small diameters are formed to the extent of hundreds or thousands, and the diameters are often 0.5 mm to 0.2 mm or less. The through holes are used for connection between the circuits B on both outer surfaces (both front and back surfaces) and for mounting / attaching the base of a (thin type) component mounted on the circuit B.

Then, as shown in FIG. 7 (2), a photosensitive resist F as a protective film is applied or attached in a film form on the outer surface of the copper foil D of the printed wiring board material E. . The thickness / thickness of the photosensitive resist F has been reduced to about 25 μm to about 10 μm from the conventional thickness of about 35 μm. It should be noted that the recent printed wiring board material E is often a double-sided board having circuits B formed on both outer surfaces (both front and back surfaces) as in the illustrated example, and a double-sided copper-clad laminate is often used. However, the present invention is also applicable to a single-sided copper-clad laminate, which is a single-sided board in which the circuit B is formed only on one outer surface. Then, a circuit photograph, which is a negative film of the circuit B, is applied to the printed wiring board material E and exposed. Accordingly, the photosensitive resist F that has covered the outer surface of the printed wiring board material E leaves the portion where the circuit B is exposed and cured,
Other unnecessary portions are dissolved and removed by spraying the developing solution, as shown in FIG. 7 (3).

Thereafter, the copper foil D on the outer surface of the printed wiring board material E is left with the portion of the circuit B formed which is covered with and protected by the photosensitive resist F and is protected by the above-described development. The unnecessary portion from which F has been dissolved and removed is dissolved and removed / etched by spraying an etching solution (corrosion solution) as shown in FIG. 7 (4). Then, the remaining photosensitive resist F of the cured circuit B forming portion is peeled and removed by the spray of the peeling liquid, and therefore, FIG.
As shown in FIG. 5 (5), a predetermined circuit B is formed on the outer surface of the printed wiring board material E by the remaining copper foil D on which the circuit B is formed, and thus the printed wiring board A is manufactured. . The developing process, the etching process, and the peeling process described above are each provided with a cleaning process for spraying a washing liquid or a chemical liquid for post-treatment, and therefore, the cleaning process is performed on the outer surface of the printed wiring board material E. The developing solution, etching solution, stripping solution, etc. are washed and removed. Finally, there is also provided a drying process for drying the washing liquid or the chemical liquid by using a furnace or hot air jet. The method of manufacturing the printed wiring board A shown in FIG. 7 is as described above.

<< Regarding the Manufacturing Method Shown in FIG. 8 >> Next,
A method of manufacturing the printed wiring board A shown in FIG. 8 will be described. First, the manufacturing method of the printed wiring board A of FIG. 7 described above has been more typical than before, but recently, the manufacturing method of FIG.
The manufacturing method shown in FIG. The manufacturing method of FIG. 8 is also called a semi-additive method, and the cross section of the formed circuit B has an ideal shape close to a square or a square (quadrangle or rectangle), and the circuit B is becoming higher in density and finer. It is said to be suitable for. In other words, it can be said that the cross section of the circuit B obtained by the manufacturing method of FIG. 7 overcomes a weak point that tends to be a so-called Mt. Fuji type in which the top portion is tapered, and thus the yield is improved.

In the manufacturing method of FIG. 8, the printed wiring board A is manufactured by following the steps below. First, as shown in FIG. 8 (1), the outer surface of the insulating layer C, that is, the printed wiring board material E which has already been subjected to a large number of holes for through holes (in the illustrated example, both outer surfaces.
Electroless copper plating G is applied to both sides (front and back sides), and the work size is cut. This electroless copper plating G
Functions as a base (undercoating) of the electrolytic copper plating H performed after the fact, is thinned with a thickness of about 4 μm to 2 μm, and makes the entire outer surface of the insulating layer C conductive. Then, as shown in FIG. 8 (2), the photosensitive resist F (dry film) is applied or adhered in a film form on the outer surface of the electroless copper plating G of the printed wiring board material E. To be Next, a circuit photograph which is a film of the circuit B is applied to the printed wiring board material E and exposed. As a result, the photosensitive resist F covering the outer surface of the printed wiring board material E leaves the exposed and hardened portion, and the other portion, that is, the portion where the circuit B is formed is (3) in FIG.
As shown in the figure, the developer is dissolved and removed by spraying.

Thereafter, as shown in FIG. 8 (4), the circuit B forming portion of the printed wiring board material E, that is, the plating pattern portion in which the photosensitive resist F has been dissolved and removed by the development, that is, the base layer as described above. Electroless copper plating H is applied to the exposed portion of electroless copper plating G
Is applied. The thickness of the electrolytic copper plating H pattern-plated in this manner is about 35 μm to 25 μm. Then, as shown in FIG. 8 (5), the remaining photosensitive resist F other than the cured circuit B forming portion is peeled and removed by spraying a peeling liquid. Then, as shown in FIG. 8 (6), the electroless copper plating G exposed by peeling and removing the photosensitive resist F is melted and removed by spraying the chemical liquid (by spraying the etching liquid, as shown in FIG. 8 (6)). Quick etched). Of course, a cleaning process and a drying process are additionally provided for post-processing of each of these processes. The washing process and the drying process are the same as those described above in the example of FIG. 7. In this way, the circuit B is formed on the insulating layer C by the electrolytic copper plating H through the electroless copper plating G, and thus the printed wiring board A is manufactured. Figure 8
The method of manufacturing the printed wiring board A shown in FIG.

<< Outline of Substrate Processing Apparatus 1 >>
The substrate processing apparatus 1 of the present invention will be described in detail with reference to FIGS. First, the use and application range of the substrate processing apparatus 1 will be described. This substrate processing apparatus 1 is
It is applied to each step of the manufacturing process of the printed wiring board A described above, and the substrate processing apparatus 1 for each step is used. Each substrate processing apparatus 1 conveys the printed wiring board material E, and Perform processing.

That is, the substrate processing apparatus 1 is used, for example, in each manufacturing step of the manufacturing method shown in FIG. 7, that is, in its developing step, etching step, peeling step, cleaning step, and the like. In each of these steps, the processing chamber 6 of each substrate processing apparatus 1 is commonly shown in FIGS.
As shown in FIG. 3, the conveyor 2 and the injection nozzle unit 3 are provided. The substrate processing apparatus 1 is used, for example, in each manufacturing step of the manufacturing method shown in FIG. 8, that is, in a chemical copper plating step, a developing step, an electrolytic copper plating step, a peeling step, a quick etching step, and the like. Then, in the chemical copper plating step and the electrolytic copper plating step, the processing chamber 6 of the substrate processing apparatus 1 has a conveyor 2 and a liquid tank 4 as shown in FIG.
It has and. On the other hand, in the developing process, the peeling process, the quick etching process, etc., the processing chamber 6 of the substrate processing apparatus 1 is provided with the conveyor 2 and the injection nozzle portion 3 as shown in FIGS. The outline of the substrate processing apparatus 1 is as described above.

<< Regarding Conveyor 2 >> First, the conveyor 2 of the substrate processing apparatus 1 will be described. As shown in FIG. 1, FIG. 2, FIG. 6, etc., this conveyor 2 conveys the printed wiring board material E in a vertical posture. That is, the conveyor 2
The upper and lower ends of the printed wiring board material E are sandwiched and held, and conveyed to the circuit forming surface J (see FIG. 9) in a non-contact state. The printed wiring board material E in the illustrated example includes circuit forming surfaces J on both front and back surfaces. The conveyor 2 is provided with a group of groove type wheels 5 vertically arranged in the transport direction. The group of groove type wheels 5 on the upper and lower sides hold the upper and lower ends of the printed wiring board material E and rotate by rotation. The printed wiring board material E is conveyed.

The conveyor 2 will be described in more detail. The upper and lower groove-type wheel groups 5 are vertically arranged in the upper space of the processing chamber 6 of the substrate processing apparatus 1 at a vertical interval corresponding to the vertical size of the printed wiring board material E. The upper and lower groove type wheel groups 5 are each composed of a group of groove type wheels 5 with their axes oriented in the left-right direction and a large number of which are arranged in a row in the transport direction K. Each groove type wheel 5 has a substantially V-shaped cross section, a U-shaped cross section, a concave shape,
Other grooves are formed on the outer peripheral surface, and in this groove,
The upper and lower ends of the printed wiring board material E, that is, the edge portions L (see FIG. 9) of the outer peripheral surface of the circuit forming surface J are sandwiched and held from above and below.

At the same time, at least one of the upper and lower groove-type wheel groups 5, that is, at least one of the upper groove-type wheel group 5 and the lower groove-type wheel group 5, or both, is driven to rotate. Therefore, the printed wiring board material E is transported in the transport direction K. In FIG. 1, reference numeral 7 denotes a drive shaft, which is connected to a drive motor (not shown) and which is provided with a transverse gear for each groove type wheel 5 via a pair of drive gears 8 such as a screw gear. Shaft 9
Is connected to each of the groove type wheels 5 to rotate the groove type wheels 5. In the illustrated example, the upper and lower groove type wheel groups 5 are both rotationally driven. It should be noted that the printed wiring board material E is conveyed in a vertical posture by the conveyor 2 having such a group of upper and lower groove type wheels 5, but this vertical posture needs to be exactly vertical along the conveyance direction K. However, it also includes postures that are slightly inclined to the left and right.

Further, the upper and lower groove type wheel groups 5 can be symmetrically moved up and down in the opposite directions and can be positioned and fixed, and the vertical distance between them can be changed and set.
It is possible to correspond to various sizes of the printed wiring board material E. That is, reference numeral 10 in FIG. 1 is a lifting motor,
The drive of the motor 10 for raising and lowering is transmitted to the groove wheels 5 above and below the conveyor 2 via a transmission shaft 11 arranged vertically and horizontally, a pair of transmission gears 12 such as a screw gear and other horizontal gears 9 and the like. To be done. And each transmission shaft 1
The directions of the screws of the pair of transmission gears 12 that transmit the drive from 1 to the horizontal shaft 9 are set to be opposite for the upper horizontal shaft 9 and the lower horizontal shaft 9. Then, when the motor 10 is driven, the upper and lower groove-type wheel groups 5 move up and down symmetrically in opposite directions so as to approach or separate in the vertical direction. Therefore, in the case of a large size corresponding to various sizes of the printed wiring board material E, the upper and lower groove type wheel groups 5 are separated and positioned and fixed as shown in FIG. In the case of a small size, as shown in FIG. 3B, the upper and lower groove type wheel groups 5 approach each other and are positioned and fixed.
In this way, the conveyor 2 can change and set the vertical gap between the upper and lower groove type wheel groups 5 and can easily cope with various vertical sizes of the printed wiring board material E. Reference numeral 13 in FIGS. 1 and 2 (2) denotes a holder with a hole for holding the lateral shaft 9 at a predetermined height position. The conveyor 2 has such a structure.

<< Injection Nozzle Unit 3 >> Next, the injection nozzle unit 3 of the substrate processing apparatus 1 will be described. Figure 1,
As shown in FIG. 2A, the printed wiring board material E
When used in the developing process of the photosensitive resist F, the etching process of the copper foil D, the removing process of the photosensitive resist F, the quick etching process of the electroless copper plating G, or the cleaning process for pre-processing and post-processing, this substrate Processing chamber 6 of processing apparatus 1
Comprises an injection nozzle section 3 together with the conveyor 2 described above. The jet nozzle portions 3 are disposed on the left and right sides of the conveyed printed wiring board material E so as to face the circuit forming surfaces J on both front and back surfaces thereof, that is, a developing solution, an etching solution, a stripping solution, and a cleaning solution. A treatment liquid M such as a rinsing water washing liquid or a cleaning liquid chemical is sprayed. In addition, even in such an illustrated example, that is, in the case where the printed wiring board material E is a single-sided board, regardless of the double-sided board having the circuit forming surfaces J on both front and back surfaces,
This substrate processing apparatus 1 is applicable, but in that case, the jet nozzle portions 3 are arranged on both left and right sides (for example, 2
A single-sided substrate is conveyed back to back), or it is arranged on either the left or right side (for example, when only one single-sided substrate is conveyed).

The injection nozzle section 3 will be described in more detail. First, the injection nozzle unit 3 in the illustrated example is provided with the printed wiring board material E conveyed by the conveyor 2 as described above.
A large number of rows are provided on the left and right sides of the left and right sides, respectively, and the left and right sides are symmetrically opposed to each other. That is, the injection nozzle units 3 are arranged in a large number on the left and right sides of the printed wiring board material E which is conveyed in a vertical position, with a front-rear interval therebetween along the conveyance direction K (FIG. (See Figure 2 (1)). Then, the left and right injection nozzle portions 3 are located at the same height level, direction, and size, with the same distance in the left-right direction, centering on the printed wiring board material E interposed therebetween. They are arranged symmetrically (see Figure 1).

As shown in FIG. 4 (further, FIG. 1, FIG. 2, FIG. 3), the injection nozzle portion 3 is provided with a vertically long slit-shaped injection port 14, and the slit-shaped injection port 14 is provided. The treatment liquid M is ejected in a film form from the above, or as shown in FIG. 5, it is provided with a large number of hole-like ejection ports 15 which are vertically arranged, and the treatment liquid M is ejected from each hole-like ejection port 15. Diffuse injection. That is, the ejection nozzle portion 3 has a vertically long rectangular tube shape, and on the surface facing the printed wiring board material E, in the example of FIG.
The slit-shaped jet port 14 is vertically elongated with a narrow front-rear width. Then, the treatment liquid M is sprayed straight toward the circuit forming surface J of the conveyed printed wiring board material E in a vertical curtain shape. In addition, in the example of FIG. 5, a large number of hole-shaped injection ports 15 are vertically arranged. Then, the treatment liquid M is directed toward the circuit forming surface J of the printed wiring board material E that has been conveyed,
While spraying in the form of sprays, they are sprayed in a generally curtain shape having a vertical width as a whole. Further, in addition to the slit-shaped ejection port 14 and the hole-shaped ejection port 15 shown in the drawing, various other nozzles / injection ports can be adopted as the ejection nozzle unit 3.

In FIG. 1 and FIG. 2 (1), 16 is
It is a liquid tank for the processing liquid M. That is, this substrate processing apparatus 1
The processing chamber 6 is divided into an upper part and a lower part by a partition wall 17, and a liquid tank 16 is arranged in the lower part. The liquid tank 16 is
The treatment liquid M in the liquid tank 16 is filled with the treatment liquid M.
Is pumped up and supplied to each of the upper injection nozzle portions 3 via a pump 18 and a pipe 19. Further, the processing liquid M sprayed by each of the spray nozzles 3 on the upper side is recovered to the liquid tank 16 on the lower side through a pipe (not shown) or the like, and is thus circulated and used. In the figure, reference numeral 20 denotes a holding member for the jet nozzle unit 3, which holds the jet nozzle unit 3 in the upper part of the processing chamber 6 and holds it. The injection nozzle unit 3 has such a configuration.

<< Regarding Posture Change and Angle Change of Jet Nozzle Unit 3 >> This jet nozzle unit 3 is between a vertical upright posture N and a tilted posture P inclined from the vertical direction to the front and rear in the carrying direction K in a vertical plane. The posture can be changed and set. That is, as shown in FIG. 3, FIG. 4, FIG. 5, etc., the upper end of the injection nozzle unit 3 is attached to the plate 22 by the adjusting screw 21, and the plate 22 is attached by the upper set screw 23 to the upper holding member. 20 (see FIG. 1). The lower end of the injection nozzle unit 3 is attached to the angle 24 by the adjusting screw 21, and the angle 24 is attached to the lower holding member 20 (see FIG. 1) by the lower set screw 23. The plate 22 is formed with a slightly curved laterally long guide hole 25, and the upper set screw 23
Can be relatively displaced in the guide hole 25 left and right (that is, in the front-back direction of the transport direction K). Therefore, the injection nozzle unit 3 can be loosened by loosening the upper set screw 23.
In the drawing, the lower set screw 23 on the vertical plane can be swung to the left and right (front and rear direction in the transport direction K) in the drawing, and by tightening both set screws 23, positioning and fixing can be performed in a desired posture.

As a result, the injection nozzle unit 3 can change its posture. That is, as shown in FIG. 4 (2) and FIG. 5 (2), as shown in FIG. 4 (1) and FIG. , An inclined posture P whose upper part is inclined from the vertical to the front side in the transport direction K, and FIG. 4 (3), FIG. 5 (3), and FIG. 2 (1).
As shown in the drawings and the like, the posture can be freely changed and set between an inclined posture P in which the upper portion is inclined from the vertical toward the rear side in the transport direction K. That is, the injection nozzle unit 3 is
It is possible to set, fix, and change the position in a desired posture at any angle between the angles inclined to the left and right (front and rear direction of the transport direction K) in the drawing from the vertical to about 30 degrees. The processing liquid M can be jetted from the desired posture onto the circuit forming surface J of the printed wiring board material E being conveyed. In this way, the posture of the injection nozzle unit 3 can be changed.

At the same time, the angle of the jet nozzle portion 3 can be changed. The jet nozzle portion 3 jets the treatment liquid M to the circuit forming surface J of the printed wiring board material E in a confronting manner at a right angle position Q and at a deflecting position R for jetting the treatment liquid M at an angle to the front side or the rear side. , And the position can be fixed by rotation about the vertical axis, and the injection angle can be changed and set. That is, as described above with reference to FIG. 3, FIG. 4, FIG. 5, etc., the injection nozzle unit 3 has its upper end attached to the plate 22 with the adjusting screw 21 and its lower end attached to the angle 24 with the adjusting screw 21. There is. Therefore, the injection nozzle unit 3 can be rotated around the axis about the vertical axis by loosening the upper and lower adjusting screws 21, and by tightening the adjusting screw 21, positioning and fixing can be performed at a desired angle. There is.

As a result, the injection nozzle unit 3 can change and set the injection angle. That is, (4) in FIG.
As shown in FIG. 7, (7), FIG. 1, etc., the treatment liquid M is jetted to the circuit forming surface J of the conveyed printed wiring board material E from the front side in a right-angled position Q (jetted). The treatment liquid M and the circuit forming surface J form a right angle in the horizontal plane.)
And (3) and (6) in FIG. 3 and (5) in FIG.
(8) As shown in the figure, the deflection position R at which the treatment liquid M is ejected at an angle in the rearward direction or the frontward direction (the ejected treatment liquid M and the circuit forming surface J are perpendicular to each other in a horizontal plane). (There is an angle on the front side or the rear side), the injection angle can be freely changed and set.

Incidentally, such an angle change of the injection nozzle portion 3 can be carried out in combination with the above-mentioned posture change. That is, the jet nozzle unit 3 can employ various combinations of the posture set between the upright posture N and the inclined posture P and the jet angle set between the right angle position Q and the deflection position R described above. is there. Incidentally, in the example of FIG. 1, the upright posture N and the right angle position Q are combined, and in the example of FIG.
And the right-angled position Q are combined, and (3) in FIG.
Figure, (4) Figure, (5) Figure, (6) Figure, (7) Figure, (8)
In each example of the drawings, the upright posture N and the right angle position Q and each deflection position R are combined, and in each of the examples of FIGS. 4 and 5, the upright posture N and the inclined position P and the right angle position Q are combined. ing.
In this way, the injection nozzle unit 3 can change the posture and the angle.

<< When used in plating process >>
Next, a case where the substrate processing apparatus 1 is used in the plating process shown in FIG. 6 will be described. When used in the plating process, the processing chamber 6 of the substrate processing apparatus 1 comprises a conveyor 2 and a liquid tank 4 for the plating liquids S and T. Then, in this substrate processing apparatus 1, the groove type wheel group 5 of the conveyor 2 is disposed in the plating liquids S and T of the liquid tank 4, and the printed wiring board material E is immersed in the liquid pool of the plating liquids S and T. While being conveyed, the printed wiring board material E is plated during passage. In addition, this printed wiring board material E
In the example shown in the figure, a double-sided board is used, but it is of course applicable to a single-sided board.

The plating process will be described in more detail. First, the example of FIG. 6 (1) is as follows. The substrate processing apparatus 1 of FIG. 6 (1) is used in the chemical copper plating process of the printed wiring board material E, and the liquid bath 4 stores the electroless copper plating liquid S. The outer surface of the insulating layer C of the printed wiring board material E, which is conveyed vertically in the conveyor 2, is electroless copper-plated G. The chemical copper plating process will be described in more detail. The electroless copper plating solution S has a composition in which a reducing agent or the like such as formalin is added to copper sulfate or the like as a copper ion source, and is placed outside the non-conductive insulating layer C of the immersed printed wiring board material E. Copper is deposited on the surface by a chemical reduction reaction, electroless copper plating G is applied, and conductivity is thereby imparted. Then, the electroless copper plating solution S is supplied from its storage tank (not shown).
It is pumped up and distributed to the liquid tank 4 via the pump 26 and the pipe 27, and after that, it is collected again in the storage tank via the pipe 27,
Used in circulation. Chemical copper plating process and electroless copper plating G
Regarding the manufacturing method of FIG. 7, refer to the above-mentioned description of FIG.

Next, the example of FIG. 6B is as follows. The substrate processing apparatus 1 of FIG. 6 (2) is used in the electrolytic copper plating process of the printed wiring board material E, and the electrode 29 of the anode 28 is arranged in the liquid bath 4 and the copper An electrolytic copper plating solution T containing ions is stored. Then, the printed wiring board material E, which has been subjected to the electroless copper plating G in advance in the chemical copper plating step shown in FIG. 6A, is connected to the cathode 30 via the groove type wheel group 5 of the conveyor 2. Electrolytic copper plating H is applied by energization while being conveyed, and a circuit B is formed.

The electrolytic copper plating process will be described in more detail. The electrolytic copper plating solution T is generated by electrolyzing copper in the generation tank (not shown) containing the precipitated copper ions, and is circulated and supplied to the storage tank (not shown), and then the pump. It is pumped up and supplied to the liquid tank 4 via 26, the pipe 27, etc., and after that, it is collected again in the storage tank via the pipe 27 and is circulated and used. In the liquid tank 4, which is an electrolytic cell tank, the printed wiring board material E is conveyed in a vertical posture while being immersed in the electrolytic copper plating solution T by the groove type wheel group 5 of the conveyor 2 connected to the cathode 30. An electrode 29 of an insoluble anode 28 is arranged in the liquid tank 4, and an exposed portion (circuit B forming portion) of the electroless copper plating G of the printed wiring board material E which is negatively charged by energization is provided. Copper ions in the electrolytic copper plating solution T are discharged to deposit copper, and electrolytic copper plating H is applied to form a circuit B. For electrolytic copper plating process and electrolytic copper plating H,
In the manufacturing method of FIG. 7, refer to the above description regarding the diagram (4). In the plating process, the substrate processing apparatus 1 is used in this way.

<< Regarding Operation and the Like >> The substrate processing apparatus 1 according to the present invention is configured as described above. Therefore, it becomes as follows. The substrate processing apparatus 1 is used in the manufacturing process of the printed wiring board A, and variously processes the printed wiring board material E by following the steps below. First, as a premise, this substrate processing apparatus 1 is applied to the following various steps for the printed wiring board material E in the manufacturing process of the printed wiring board A, and the substrate processing apparatus 1 for each step is used. . For example, a. Step of developing photosensitive resist F (FIG. 7 (3), FIG. 8 (3))
(See the figure), the etching process of the copper foil D (see FIG. 7 (4)), and the peeling process of the photosensitive resist F ((5) of FIG. 7).
8 and FIG. 8 (see FIG. 8), the electroless copper plating G quick etching step (see FIG. 8 (6)), and the like. Also, for example, b. It is used in the plating process (see FIG. 8 (1) and FIG. 8 (4)).
Further, for example, c. It is used in these pre- and post-treatment cleaning steps.

The printed wiring board material E supplied to the substrate processing apparatus 1 has a circuit forming surface J on both front and back surfaces.
It is composed of a double-sided board provided with and is conveyed by the conveyor 2 in a vertical posture (see FIGS. 1 and 2 (1) and FIG. 6). That is, the conveyor 2 of the substrate processing apparatus 1 holds the upper and lower ends of the printed wiring board material E and conveys it to the circuit forming surface J in a non-contact state. The conveyor 2 is provided with a group of groove type wheels 5 arranged in the transport direction K at the top and bottom, respectively.
The upper and lower groove type wheel groups 5 hold the upper and lower ends of the printed wiring board material E, respectively, and convey the printed wiring board material E by rotation. In addition, the upper and lower groove type wheel groups 5 of the conveyor 2 are
It is possible to move up and down symmetrically in the opposite direction, and to position and fix it. Therefore, it is possible to change and set the vertical interval between them (see (1) and (2) in FIG. 3). ). Therefore, the substrate processing apparatus 1 is used in correspondence with various sizes of the printed wiring board material E by changing and setting the vertical interval of the groove type wheel group 5 corresponding to the size of the printed wiring board material E. It is possible.

Now, a. Development process, etching process,
When applied to a peeling process or a quick etching process, or c. When applied to the cleaning step, the substrate processing apparatus 1 includes the conveyor 2 and the injection nozzle unit 3 (see FIGS. 1 and 2 (1)). And conveyor 2
With respect to the circuit forming surfaces J on the front and back of the printed wiring board material E conveyed by, the developing solution, the etching solution, the stripping solution, the washing solution as the washing solution, and the chemical solution as the washing solution from the jet nozzle section 3 which is disposed on the left and right sides. , Etc. are sprayed. As described above, in the substrate processing apparatus 1, the printed wiring board material E is jetted with the treatment liquid M while being conveyed in a vertical posture, and thus the jetted treatment liquid M forms a liquid pool on the circuit formation surface J thereof. It doesn't stay. The processing liquid M sprayed from the spray nozzle unit 3 is a printed wiring board material E in a vertical posture.
After performing a predetermined process on the circuit forming surface J, the circuit forming surface J is flowed down and collected without staying.

By the way, the jet nozzle portions 3 of the substrate processing apparatus 1 are arranged in a large number on the left and right sides of the printed wiring board material E to be conveyed, with a front-rear spacing therebetween, and the left and right ones are symmetrical. (See FIG. 1 and FIG. 2 (1)). Therefore, although the printed wiring board material E is becoming extremely thin, the jetting pressure of the treatment liquid M jetted from the jet nozzle portion 3 holds and balances it from both left and right sides, and causes bending, bending, and flying. There is no risk of being cut.

Further, the jet nozzle unit 3 of the substrate processing apparatus 1 is provided with a vertically long slit-like jet port 14 (see FIG. 4 etc.), and is the process liquid M jetted straight in a film form or in a straight line form? Alternatively, it is provided with the hole-shaped injection holes 15 arranged in a line in a vertical direction (see FIG. 5), and thus the treatment liquid M is formed into a substantially film-like shape in total.
Diffuse injection in a substantially straight line. The jet nozzle unit 3 has a vertical upright posture N on a vertical plane and a transport direction K from the vertical.
The posture can be changed and set between the inclined posture P that is inclined to the front and the rear (see FIGS. 4 and 5). Further, between the right-angled position Q at which the treatment liquid M is jetted to the circuit forming surface J of the printed wiring board material E in a confronting manner and the deflection position R at which the treatment liquid M is jetted at an angle to the front side or the rear side, It is possible to change and set the injection angle (Fig. 3 (4), (5),
See (6), (7), (8), (9), etc.).
The circuit B on the circuit forming surface J of the printed wiring board material E is often formed vertically and horizontally (see FIG. 9). In that case, the attitude and the injection angle of the injection nozzle unit 3 are set to the inclined attitude P and The deflection position R is changed and set. Then, the processing liquid M is the circuit B
Since it will not be jetted against the top surface of the circuit or the space between the circuits, it is inclined and angled toward the side surface of the circuit B or the space between the circuits B without scattering, uneven distribution, or direct current flow on the circuit forming surface J. Since it is ejected as a result, it is evenly and uniformly ejected to the vertical and horizontal circuits B.

On the other hand, when applied to the plating process, the substrate processing apparatus 1 comprises a liquid tank 4 (see FIG. 6).
See). That is, a. When applied to development process, etching process, peeling process, quick etching process, and c. Unlike when applied to the cleaning step, b. When applied to this plating process, the substrate processing apparatus 1 includes a liquid bath 4 for the plating liquids S and T. The groove type wheel group 5 of the conveyor 2 is disposed in the plating liquids S and T in the liquid tank 4, and the printed wiring board material E is conveyed while being immersed in the plating liquids S and T in a vertical posture. It When used in the chemical copper plating step (see FIG. 6 (1)), the electroless copper plating solution S is stored in the liquid bath 4 of the substrate processing apparatus 1, and the printed wiring board material is used. For E, electroless copper plating G is applied to the outer surface of the insulating layer C (see also FIG. 8 (1)). Next, when used in the electrolytic copper plating step (see FIG. 6 (2)), the electrode 2 of the anode 28 is provided in the liquid bath 4 of the substrate processing apparatus 1.
9 is provided, the electrolytic copper plating solution T containing copper ions is stored therein, and the printed wiring board material E preliminarily subjected to the electroless copper plating G is the groove type wheel 5 of the conveyor 2.
It is connected to the cathode 30 through the group and electrolytic copper plating H is applied by energization (see FIG. 8 (4)).

By the way, a. Developing step, etching step, peeling step, b. Plating process,
c. In the case of a cleaning step or the like, in each processing, in each substrate processing apparatus 1, as described above, the upper and lower groove type wheel groups 5 of the conveyor 2 vertically move the printed wiring board material E to the upper and lower ends. It is held and conveyed without contacting the circuit forming surface J (see FIGS. 1 and 2 (1) and FIG. 6). Therefore, contact scratches and abrasions such as crush, dent, deformation, and other scratches occur on the photosensitive resist F, the copper foil D, the platings G, H, the circuit B, etc. on the circuit forming surface J of the printed wiring board material E. Doing so is avoided (see also FIGS. 7 and 8). In addition, the cut portion (peripheral edge) of the printed wiring board material E
Cutting powder, dust, surrounding dust, etc. adhering to the surface of the printed wiring board material E on the circuit forming surface J of the printed wiring board material E, copper foil D, plating G, H, circuit B, etc. To
It is not redeposited (see also FIGS. 7 and 8).

Further, in this substrate processing apparatus 1, the printed wiring board material E is conveyed between the upper and lower groove type wheel groups 5 of the conveyor 2 which are rotated while holding the upper and lower ends thereof, so that the conveyance is reliable. And stable (Figs. 1 and 2
(See (1) figure and FIG. 6). Further, in this substrate processing apparatus 1, it is sufficient to supply the printed wiring board material E between the upper and lower groove type wheel groups 5 of the conveyor 2, the operation is simplified, and the continuation and automation of the steps are easy. . Moreover, the substrate processing apparatus 1 includes the conveyor 2 having the upper and lower groove type wheel groups 5, the injection nozzle portion 3 of the processing liquid M, the plating liquid S,
It has a simple configuration in combination with the T liquid tank 4 (see FIGS. 1 and 2 (1) and FIG. 6).

<< Others >> The substrate processing apparatus 1 is
It is applicable to all the steps of manufacturing the printed wiring board A. That is, in the manufacturing process of the printed wiring board A in which the circuit B is highly densified and miniaturized, the substrate processing apparatus 1 conveys the printed wiring board material E to the circuit formation surface J in a vertical position in a non-contact state. Since the processing is performed, its action and effect are great. Therefore, its application is desired also in each process other than the developing process, etching process, peeling process, plating process, and cleaning process described above. For example, also in the drying process after the cleaning process, the substrate processing apparatus 1 is applied, and the printed wiring board material E is conveyed in the processing chamber 6 in a vertical position in a non-contact state while the ejection nozzle unit 3 is being used.
It is also conceivable to inject hot air or hot air from the above or to dry the processing chamber 6 by using a furnace. Further, when the substrate processing apparatus 1 is commonly applied to each manufacturing process of the printed wiring board A as described above, there is also an advantage that it is not necessary to change the posture of the printed wiring board material E on the way. In other words, there is also an advantage that the printed wiring board material E can be conveyed in the vertical posture over the entire process without changing the posture from the horizontal posture to the vertical posture in the middle, and the entire structure is simplified. The substrate processing apparatus 1 is thus applicable to all the manufacturing steps of the printed wiring board A.

[0055]

<Characteristics of the present invention> As described above, the substrate processing apparatus according to the present invention, in each step of the manufacturing process of the printed wiring board, by the conveyor provided with the upper and lower groove type wheel group, Hold the upper and lower ends of the printed wiring board material,
Various features are characterized in that the treatment liquid is ejected from the ejection nozzle portion or dipped in a bath of the plating liquid while being conveyed in a non-contact state to the circuit formation surface to perform various treatments.

<< Regarding the First Effect >> First, the occurrence of scratches or the like on the circuit formation surface is prevented. According to this substrate processing apparatus, since the grooved wheel group of the conveyor conveys the printed wiring board material in a non-contact state with the circuit forming surface, the circuit forming surface is not damaged. That is, the conveyor rollers and wheels of the conveyor are in contact with the circuit formation surface, as in the substrate processing apparatus of this type that conveys in a horizontal posture and the substrate processing apparatus that conveys in a vertical posture using a roller conveyor or a belt conveyor. Therefore, troubles such as contact scratches and abrasions can be avoided. For example, in the case of a double-sided substrate, the occurrence of scratches or the like is prevented on both the front and back circuit forming surfaces. When it is used in the electrolytic copper plating step, the occurrence of scratches and the like is prevented, so that the variation in the energization is avoided and the variation in the electrolytic copper plating process is avoided. As described above, since the processing is uniformized and the processing variation is avoided, the significance is great for a printed wiring board in which the circuit density and miniaturization are advanced. Of course, the yield is also improved.

<< Regarding the Second Effect >> Secondly, dust and the like are prevented from adhering to the circuit formation surface. According to this substrate processing apparatus, the groove type wheel group of the conveyor conveys the printed wiring board material in a non-contact state with the circuit forming surface, so that adhesion of dust or the like to the circuit forming surface is avoided. That is, as in the substrate processing apparatus of this type that conveys in a horizontal posture, or the substrate processing apparatus that conveys in a vertical posture by using a roller conveyor or a belt conveyor, the printed wiring board material is cut at a cutting point (peripheral edge). The attached cutting powder, dust, and surrounding dust will not be reattached to the circuit forming surface of the printed wiring board material via the conveyor. With respect to the double-sided substrate, dust and the like are prevented from adhering to both front and back surfaces. So,
These prevent the occurrence of scratches and the like due to the attachment of dust and the like, and also make the processing uniform and avoid the processing variations, which is of significance to printed wiring boards in which circuit density and miniaturization are progressing. Has a great deal. Of course,
Yield is also improved.

<< Third Effect >> Thirdly, uniform treatment is realized by the jetted treatment liquid. According to this substrate processing apparatus, the groove type wheel group of the conveyor makes the printed wiring board material in the vertical posture, so that the processing liquid jetted from the jet nozzle portion accumulates on the circuit forming surface as a liquid pool. There is no. That is, unlike the substrate processing apparatus of this type in which the substrate is conveyed in a horizontal position, the processing liquid does not accumulate in the central portion on the circuit forming surface and does not accumulate. With respect to the double-sided substrate, the occurrence of liquid pool on both the front and back sides is avoided. Therefore, by avoiding the occurrence of such a liquid pool, the renewal of the processing liquid on the circuit formation surface is promoted, and the processing speed is slowed down and the occurrence of excess / deficiency points is prevented. Variation is avoided.
Therefore, it has great significance for a printed wiring board in which circuit density and miniaturization are progressing. Of course, the yield is also improved. Further, since the occurrence of the liquid pool is avoided, the carry-out of the processing liquid is reduced, the processing liquid is efficiently used, and the waste / loss of the processing liquid is eliminated.

Further, in this substrate processing apparatus, the posture of the jet nozzle portion can be changed and set to the upright posture and the inclined posture, and the jet angle of the jet nozzle portion can be changed and set to the right angle position and the deflection position. The following effects are exhibited.
That is, the circuit on the circuit forming surface of the printed wiring board material is
In many cases, it is formed vertically and horizontally, but in this case, by changing and setting the posture and jetting angle to the tilted posture and deflection position, the jetted processing liquid can be evenly and evenly distributed, and the circuit of the printed wiring board material can be made uniform. It will be injected into the circuit on the forming surface. As a result, the processing is made uniform from this aspect as well, and variations in the processing can be avoided.

<Regarding Fourth Effect> Fourthly, and yet, these are easily, easily, surely and automatically realized.
That is, first, in this substrate processing apparatus, the printed wiring board material is conveyed by the groove type wheels above and below the conveyor. Is reliable and stable. Further, in this substrate processing apparatus, it suffices to supply the printed wiring board material to the upper and lower groove type wheel groups, which is more than the conventional substrate processing apparatus of this type using a conveyor with a locking member such as a clip. The operation is simplified and the process is continuous and automated. Further, in this substrate processing apparatus, the vertical spacing between the upper and lower groove type wheel groups of the conveyor is
Since it can be changed and set, it can be used for various sizes of printed wiring board materials. Further, in this substrate processing apparatus, the jet nozzle portions are symmetrically opposed to each other, and the printed wiring board material is held from the left and right sides by the jet pressure of the treatment liquid. Therefore, although it is a printed wiring board material that is becoming extremely thin, there is no danger of accidents such as bending, bending, and flying due to jet pressure. And, this substrate processing apparatus, a conveyor equipped with a groove type wheel group, by a simple configuration combining the injection nozzle unit and the liquid tank,
The above-mentioned first, second, and third points are surely realized. As described above, the effects of the present invention are remarkably large, such that all the problems existing in this type of conventional example are solved.

[Brief description of drawings]

FIG. 1 is a front view of a substrate processing apparatus according to the present invention, which is used for describing an embodiment of the invention.

2A and 2B are views for explaining the embodiment of the invention, FIG. 1A is a side view, and FIG. 2B is a plan view of a main part.

FIG. 3 is a view for explaining the embodiment of the present invention. (1) is a front view of a groove type wheel when the printed wiring board material is large, and (2) is a small printed wiring board material. It is a front view of a groove type wheel in the case of size. (3) The figure shows
FIG. 4 is a front view of the injection nozzle portion at the rearward deflection position, FIG. 4 (4) is a front view of the injection nozzle portion at a right angle position, and FIG. 5 (5) is a front view of the ejection nozzle portion at the frontward deflection position. (6)
The figure is a side view of the main part of the injection nozzle unit in the rearward deflection position,
(7) The figure is a side view of the main part of the injection nozzle section at a right angle position,
(8) FIG. 8 is a side view of the main part of the injection nozzle unit at the frontward deflection position.

4A and 4B are side views of an example of the injection nozzle unit, which is used for the description of the embodiment of the present invention. FIG. 4A is a front tilted posture, and FIG. 2B is an upright posture. FIG. 3C shows the state of the rearward tilted posture.

FIG. 5 is a side view of another example of the injection nozzle portion, which is used for the description of the embodiment of the present invention, in which (1) is a front tilted posture and (2) is an upright posture. Figure (3) shows the state
The state of a back inclination posture is shown.

6 is a side view of a chemical copper plating step, and FIG. 6 (2) is a side view of an electrolytic copper plating step.

FIG. 7 is a cross-sectional explanatory view of a main part, showing an example of a manufacturing process of a printed wiring board. Then, (1) is a prepared printed wiring board material, (2) is a state where a photosensitive resist film is formed, (3) is a state after a developing step, and (4) is a state. Shows the state after the etching step, and FIG. 5 (5) shows the state after the peeling step.

FIG. 8 shows another example of a manufacturing process of a printed wiring board,
It is sectional explanatory drawing of a principal part. Then, (1) is the printed wiring board material after the chemical copper plating step, (2) is the state where the photosensitive resist film is formed, and (3) is the state after the developing step ( 4) shows the state after the electrolytic copper plating step, (5) shows the state after the stripping step, and (6) shows the state after the quick etching step.

FIG. 9 is an explanatory plan view of a printed wiring board (material).

[Explanation of symbols]

1 Substrate processing equipment 2 conveyor 3 injection nozzle 4 liquid tank 5 groove type wheel 6 processing room 7 drive shaft 8 drive gears 9 Horizontal shaft 10 motors 11 Transmission shaft 12 transmission gears 13 holder 14 Slit-shaped injection port 15 hole injection port 16 liquid tank 17 division walls 18 pumps 19 plumbing 20 Holding member 21 Adjustment screw 22 plates 23 Set screw 24 angles 25 guide hole 26 pumps 27 piping 28 Anode 29 electrodes 30 cathode A printed wiring board B circuit C insulating layer D copper foil E Printed wiring board material F Photosensitive resist G Electroless copper plating H electrolytic copper plating J Circuit formation surface K transport direction L edge part M treatment liquid N upright posture P tilt posture Q right angle position R deflection position S Electroless copper plating solution (plating solution) T Electrolytic copper plating solution (plating solution)

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/18 H05K 3/18 N 3/26 3/26 AF term (reference) 2H096 AA26 GA24 GA26 HA20 5E339 AB02 AD01 AD03 BC02 BD06 BD08 BE13 BE16 CD01 CE12 CE15 CF17 CG04 EE04 EE10 5E343 AA02 AA12 BB16 BB24 BB71 CC62 DD33 DD43 EE04 EE17 ER18 FF09 FF16 FF23 FF28 GG11

Claims (11)

[Claims] 1. A substrate processing apparatus used in a manufacturing process of a printed wiring board, for processing a printed wiring board material, wherein the printed wiring board material is processed while being conveyed in a vertical posture by a conveyor, Holds the upper and lower ends of the printed wiring board material, and conveys the printed wiring board material to the circuit formation surface in a non-contact state. 2. The substrate processing apparatus according to claim 1, wherein the printed wiring board material is provided with the circuit forming surfaces on both front and back surfaces, and the conveyors are vertically arranged in a line in a transfer direction. A substrate processing comprising a groove type wheel group, wherein the upper and lower groove type wheel groups respectively hold the upper and lower ends of the printed wiring board material and convey the printed wiring board material by rotation. apparatus. 3. The substrate processing apparatus according to claim 2, wherein the upper and lower groove type wheel groups of the conveyor are symmetrically movable up and down in opposite directions and positionally fixed, and a vertical interval between them is set. A substrate processing apparatus, which can be changed and set and can be adapted to various sizes of the printed wiring board material. 4. The substrate processing apparatus according to claim 2, wherein the substrate processing apparatus includes a step of developing a photosensitive resist for the printed wiring board material, a step of etching a copper foil, a step of removing the photosensitive resist, and an electroless method. It is used in a copper plating quick etching process, a cleaning process for pre-processing and post-processing, etc., and is provided with an injection nozzle part, and the injection nozzle part is disposed opposite to the left and right of the printed wiring board material to be conveyed. A substrate processing apparatus characterized in that a processing liquid, that is, a processing liquid such as a developing liquid, an etching liquid, a stripping liquid, a cleaning liquid that is a cleaning liquid, or a chemical liquid that is a cleaning liquid is sprayed onto the front and back circuit forming surfaces. 5. The substrate processing apparatus according to claim 4, wherein the jet nozzle portions are arranged in a plurality of rows at left and right sides of the printed wiring board material to be transported, with a front-rear spacing therebetween, A substrate processing apparatus characterized in that objects are symmetrically opposed to each other. 6. The substrate processing apparatus according to claim 5, wherein the jet nozzle portion is provided with a vertically long slit-shaped jet port, so that the treatment liquid is jetted in a film form from the slit-shaped jet port. Alternatively, the substrate processing apparatus is provided with vertically-arranged hole-shaped ejection ports, and diffuses and ejects the processing liquid from each of the hole-shaped ejection ports. 7. The substrate processing apparatus according to claim 6, wherein the jet nozzle unit is provided on a vertical plane between a vertical upright posture and an inclined posture inclined from the vertical in the transport direction to the front and back. The substrate processing apparatus is characterized in that it can be changed and set. 8. The substrate processing apparatus according to claim 6, wherein the injection nozzle portion is deflected at a right angle position facing a circuit forming surface of the printed wiring board material and at a front side or a rear side. A substrate processing apparatus, which is rotatable about its vertical axis and positionable and fixed between a position and a position, and is capable of changing and setting an ejection angle. 9. The substrate processing apparatus according to claim 2, wherein the substrate processing apparatus is used in a plating process of the printed wiring board material, and is provided with a bath of a plating liquid, and a groove type of the conveyor. A substrate processing apparatus, wherein a wheel group is arranged in a plating solution in the solution tank and conveys the printed wiring board material while being immersed in the plating solution. 10. The substrate processing apparatus according to claim 9, wherein the substrate processing apparatus is used in a chemical copper plating step of the printed wiring board material, and the liquid bath contains an electroless copper plating solution. The printed wiring board material is provided with electroless copper plating on the outer surface of the insulating layer. 11. The substrate processing apparatus according to claim 9, wherein the substrate processing apparatus is used in an electrolytic copper plating step of the printed wiring board material, and an anode is provided in the liquid tank. The printed wiring board material containing an electrolytic copper plating solution containing copper ions and previously subjected to electroless copper plating is connected to the cathode through the grooved wheel group of the conveyor, and the non-conductive A substrate processing apparatus, wherein electrolytic copper plating is applied to the outer surface of electrolytic copper plating.