TWI699833B - Conductor forming device and conductor manufacturing method - Google Patents

Abstract

The conveying device (11) has: a movable part (36) that can move along a rail (31) provided on the conveying path (20), and a workpiece holding member (34) that can detachably hold the upper part of the substrate (1) , And an arm portion (35) connecting the movable portion (36) and the workpiece holding member (34). The substrate (1) is held by the workpiece holding member (34) at the workpiece supply position (25), and in the conveying path (20) from the developing device (12) to the pattern plating device (13), The conveying device (11) is continuously conveyed along the rail (31) in a slightly vertical posture.

Description

Conductor forming device and conductor manufacturing method

The present invention relates to a conductor forming device such as a printed circuit board and a conductor manufacturing method.

As a method of forming a circuit on a printed circuit board or the like, an additive process is widely known. In the additive method, for example, as described in Patent Document 1, a plating resist (developing process) is formed on the conductive film on the surface of the object to be processed in a reverse pattern to the conductive pattern (development process). Cover the surface area of the resist material to form a conductive pattern (pattern plating process), peel the plating resist from the conductive film (peel process), and remove the conductive film outside the area under the conductive pattern through a specified etching Liquid chemical etching to remove (etching process) to form circuit patterns.

In conventional conductor forming apparatuses, there are a mixture of horizontal conveying in which the processing target is moved in a flattened state, and vertical conveying in which the processing target is raised in a substantially vertical state. The object to be processed is, for example, horizontally transported in the development process (developing device), vertically transported in the pattern plating process (pattern plating device), and horizontally transported in the peeling process (stripping device) and etching process (etching device).

[Prior technical literature] 〔Patent Literature〕

[Patent Document 1] Japanese Patent Publication No. 6-164104

In the above-mentioned conventional general conductor forming apparatus, in each process of the developing device, the peeling device, and the etching device, the object to be processed is carried horizontally. In such horizontal conveyance, because the conveying roller contacts the object to be processed, the greater the load on the surface (circuit pattern) of the object to be processed, and the thinner the wire, the collapse of the barrier material or the missing corners will occur. As a result, defects such as pattern disconnection or short-circuiting tend to occur.

In addition, between the developing device and the pattern plating device, the object to be processed is removed from the horizontal conveying type conveying device of the developing device (received from the conveying roller), and installed to the vertical conveying of the pattern plating device. Type of handling device is necessary. Similarly, between the pattern plating device and the peeling device, the object to be processed is removed from the vertical conveying type conveying device of the pattern plating device, and replaced with a horizontal conveying type conveying device attached to the peeling device (placed again in the conveying device). On the roller) is necessary. For this reason, a decrease in work efficiency, an increase in man-hours, or an increase in the size or complexity of the device due to the division of the conveying device is incurred, and defects due to the removal and installation of the processing object are likely to occur.

Here, the object of the present invention is to provide a conductor forming apparatus and a conductor manufacturing method, which can achieve quality stability and improvement of work efficiency.

In order to achieve the above-mentioned object, the conductor forming apparatus of the first aspect of the present invention includes a conveying unit, a developing device, and a pattern plating device.

The transport unit transports the object to be processed with a conductive film on the surface of the insulating substrate along a designated transport path from the upstream side to the downstream side. The developing device is formed on the conductive film of the object to be processed that is conveyed along the conveying path, and a plating resist is formed in a reverse pattern to the conductor pattern. The pattern plating device is arranged on the downstream side of the developing device, and the conductive film is formed on the surface area where the plating resist has not yet been formed to form a conductive pattern. The peeling device is arranged on the downstream side of the pattern plating device to peel the plating resist from the conductive film. The etching device is arranged on the downstream side of the stripping device, and the conductive thin film outside the area under the conductor pattern is removed by chemical etching with a specified etching solution.

The transport unit has a movable part that can move along a rail provided in the transport path, a grip part that detachably grips the upper part of the processing object, and an arm part that connects the movable part and the grip part. The object to be processed is held by the gripper at the supply position on the upstream side of the developing device, and is continuously conveyed in a substantially vertical posture by the conveying unit in the conveying path from the developing device to the pattern plating device.

Furthermore, the conductor manufacturing method of the first aspect of the present invention includes a development process and a pattern plating process.

In the development process, on the conductive film of the object to be processed that has a conductive film on the surface of an insulating substrate and is conveyed along a specified conveying path, a plating resist is formed in a reverse pattern to the conductor pattern. In the pattern plating process, in the conductive thin film of the processing object conveyed along the conveying path in the self-development process, the area where the plating resist has not been formed is formed to form a conductive pattern.

The transport unit that transports the object to be processed along the transport path has: a movable part that can move along a rail provided on the transport path, a grip that detachably grips the upper part of the object to be processed, and one that connects the movable part and the grip. Arm. At the feed position on the upstream side of the developing device, the object to be processed is held by the gripper, and the object to be processed is erected in a slightly vertical posture by the transport unit in the transport path from the development process to the pattern plating process. Continuous handling.

According to the apparatus and method of the first aspect described above, the object to be processed is in a conveying path from the developing device (development process) to the pattern plating device (pattern plating process) in a vertical posture. Carry out continuous handling. For this reason, in the development process and pattern plating process, it is possible to prevent the object to be processed from contacting the conveyance roller, etc., so that the collapse or chipping of the resist material is difficult to occur, and the occurrence of defects such as pattern disconnection or short circuit can be suppressed .

Furthermore, because the conveying path between the development process and the pattern plating process is continuous, it is not necessary to remove or install the object to be processed between the processes. For this reason, there is no reduction in work efficiency, an increase in man-hours, or an increase in the size or complexity of the device due to the division of the conveying device, and there is no occurrence of defects due to the removal and installation of the processing object.

The conductor forming apparatus of the second aspect of the present invention includes a conveying unit, a pattern plating device, and a peeling device.

The conveying unit conveys the object to be processed in which a plating resist having a pattern reverse to the conductor pattern is formed on the conductive film on the surface of the insulating substrate, and conveys it from the upstream side to the downstream side along a designated conveying path. The pattern plating device forms a conductive pattern on the surface area where the plating resist has not yet been formed in the conductive thin film of the processing object conveyed along the conveying path. The peeling device is arranged on the downstream side of the pattern plating device and peels the plating resist from the conductive film. The transport unit has a movable part that can move along a rail provided in the transport path, a grip part that detachably grips the upper part of the processing object, and an arm part that connects the movable part and the grip part. The object to be processed is continuously conveyed in a substantially vertical posture by the conveying unit in a conveying path from the pattern plating device to the peeling device, and is separated from the grip portion at a take-out position on the downstream side of the peeling device.

The conductor manufacturing method of the second aspect of the present invention includes a pattern plating process and a peeling process. In a pattern plating device, a plating resist is formed on a conductive film on the surface of an insulating substrate in a pattern that is inverse to the conductor pattern. The conductive film of the object to be processed is not included in the conductive film that is transported along a designated transport path. The surface area of the plating resist is formed to form a conductor pattern. In the peeling process, the plating resist is peeled from the conductive film of the object to be processed that is carried along the conveying path from the pattern plating process.

The transport unit that transports the object to be processed along the transport path has: a movable part that can move along a rail provided in the transport path, a grip part that detachably holds the upper part of the object to be processed, and connects the movable part and the grip part The arm. In the conveying path from the pattern plating process to the peeling process, the processing target is continuously conveyed in a slightly vertical posture by the conveying unit, and the processing target is held from the take-out position on the downstream side of the peeling device部detached.

According to the above-mentioned second aspect of the apparatus and method, the object to be processed is continuously conveyed in a vertical position in the conveying path from the pattern plating device (pattern plating process) to the peeling device (peeling process). . For this reason, in the pattern plating process and the peeling process, the object to be processed can be prevented from contacting the conveyance roller, etc., damage to the pattern can be reduced or eliminated, and the occurrence of defects such as pattern disconnection or short circuit can be suppressed.

Moreover, because the conveying path is continuous between the pattern plating process and the peeling process, it is not necessary to remove or install the processing object between the processes. For this reason, there is no reduction in work efficiency, an increase in man-hours, or an increase in the size or complexity of the device due to the division of the conveying device, and there is no occurrence of defects due to the removal and installation of the processing object.

The conductor forming apparatus of the third aspect of the present invention is the conductor forming apparatus of the second aspect, and includes an etching device, which is on the downstream side of the peeling device and is arranged on the upstream side of the take-out position. The chemical etching of the etching solution removes the conductive film except the area under the conductor pattern.

The conductor manufacturing method of the third aspect of the present invention includes an etching process in the conductor forming method of the second aspect, which is on the downstream side of the peeling process and on the upstream side of the take-out position, using a designated etching The chemical etching of the liquid removes the conductive film except for the area under the conductor pattern of the object to be processed that is conveyed along the conveying path from the peeling process.

The conductor forming apparatus of the fourth aspect of the present invention is the conductor forming apparatus of the first aspect, and includes: a device disposed between the developing device and the pattern plating device and passing through the object to be conveyed along the conveyance path The first transfer room. In the first transfer room, in order to prevent drying of the processed objects, a first humidification unit for humidifying the first transfer room is provided.

According to the conductor forming apparatus of the fourth aspect, it is possible to supply the object to be processed in a state where substantially the entire surface of the substrate is covered with a water film to the pattern plating apparatus. With this, the air oxidation on the surface of the substrate can be suppressed to a minimum, and the strong oxide film removal treatment due to chemicals in the pre-plating treatment becomes unnecessary. Furthermore, since the hydrophilicity of the surface of the substrate can be maintained well, the amount of water required for the water washing process can be greatly reduced.

In addition, since the entire surface of the substrate is continuously covered with water film from development to pattern plating, it is possible to significantly reduce plating caused by bubbles trapped in the recesses of the resist film circuit formed on the surface of the substrate. The precipitation is poor.

The conductor forming apparatus of the fifth aspect of the present invention is the conductor forming apparatus of the second or third aspect, and includes: a processing object that is disposed between the pattern plating device and the peeling device and is conveyed along the conveyance path The second transfer room through which the property passes. In the second transfer room, in order to prevent drying of the processed objects, a second humidification unit is provided to humidify the second transfer room.

According to the conductor forming apparatus of the fifth aspect, it is possible to supply the processing target in a non-dry state (wet state) to the peeling process. With this, the surface of the substrate can be kept in a state where it is always wetted by water, and the hydrophilicity can be maintained well.

In addition, when the entire area of the substrate after pattern plating is kept as a thin water film, the object to be processed is delivered to the peeling process. In particular, the effect of preventing adhesion of oil film or foreign matter to the resist film can be obtained, which is sufficient And surely eliminate factors that hinder the contact between the barrier stripping liquid and the barrier film.

According to the present invention, it is possible to stabilize the quality and improve the work efficiency.

1‧‧‧Base material (substrate, processing object)

2‧‧‧Conductive film

3‧‧‧Plating resistance material

4‧‧‧Conductor pattern

10‧‧‧Conductor forming device

11‧‧‧Transporting device (transporting unit)

12‧‧‧Developing device

13‧‧‧Pattern plating device

14‧‧‧Peeling device

15‧‧‧Etching device

16‧‧‧Cleaning device

20‧‧‧Transportation path

21‧‧‧Route 1

22‧‧‧Route 2

23‧‧‧Route 3

24‧‧‧Route 4

25‧‧‧Workpiece supply position

26‧‧‧Workpiece removal position

30‧‧‧Workpiece holding member

31‧‧‧rail

32‧‧‧The first direction conversion mechanism

33‧‧‧The second direction switching mechanism

41‧‧‧The first transfer room

42‧‧‧The second transfer room

43‧‧‧Spray nozzle (1st humidification unit)

44‧‧‧Spray nozzle (2nd humidification unit)

M‧‧‧operator

Fig. 1 is a plan view schematically showing the entire conductor forming device according to an embodiment of the present invention.

[Fig. 2] is a plan view schematically showing the developing device and the first direction switching mechanism of Fig. 1. [Fig.

[Fig. 3] is a side view schematically showing the developing device of Fig. 1. [Fig.

[Fig. 4] is a plan view schematically showing the second direction changing mechanism, the peeling device, and the etching device of Fig. 1. [Fig.

Fig. 5 is a perspective view schematically showing a state in which the processing object is vertically conveyed.

[Fig. 6] is a schematic diagram for explaining the process caused by the additive method, respectively showing (a) the substrate, (b) the state where the conductive thin film is formed, (c) the state where the plating resist is formed, (d ) The state where the conductive layer is formed, (e) the state where the plating resist is peeled off, and (f) the state where the conductive thin film is removed by chemical etching.

Hereinafter, a conductor forming apparatus 10 according to an embodiment of the present invention will be described based on the drawings.

First, the outline of the manufacturing method of the printed wiring board using the additive method of the conductor forming device 10 will be described with reference to FIG. 6.

In the additive method, as shown in FIG. 6(a), a base material (substrate) 1 composed of an insulating layer is prepared. The substrate 1 is an insulating thin fleshy film or sheet made of, for example, epoxy, polyimide, or other resins. Furthermore, it is also possible to form the base material 1 by coating resin on the board|substrate which consists of a copper laminated board or metal foil.

Next, as shown in FIG. 6(b), a conductive thin film 2 is formed on the surface of the substrate 1 with a predetermined thickness (for example, 10 μm or less) by sputtering, electroless copper plating, or the like. Furthermore, the copper foil may be used as the conductive film 2 by using a copper-clad laminate for the base material 1.

Next, as shown in FIG. 6(c), through, for example, laminating, exposing, and developing a dry film on the conductive thin film 2, a plating resist 3 that is a reverse pattern to the conductor pattern 4 formed in the subsequent process is formed ( Development process).

Next, as shown in FIG. 6(d), in the conductive thin film 2 where the plating resist 3 has not yet been formed, for example, a copper sulfate plating solution is used to form a conductive pattern made of copper by electrical plating 4 (Pattern plating process). As the material of the conductor pattern 4, metals or alloys other than copper may be used.

Next, as shown in FIG. 6(e), the plating resist 3 is removed through peeling or the like (peeling process).

Next, as shown in Figure 6(f), the conductive thin film (removed layer) 2 outside the area under the conductor pattern 4 is chemically etched with a designated etching solution (for example, a mixture of sulfuric acid, hydrogen peroxide and water) To remove (etching process). Through this, a printed wiring board having the designated conductor pattern 4 on the substrate 1 is formed. Furthermore, the substrate 1 on which the conductive film 2 is formed becomes the object to be processed. Hereinafter, the object to be processed may be simply referred to as the substrate 1.

As shown in FIG. 1, the conductor forming apparatus 10 includes a conveying device (conveying unit) 11, a developing device 12, a pattern plating device 13, a peeling device 14, an etching device 15, and a plurality of washing devices 16. The cleaning device 16 is attached to each of the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15. Furthermore, in FIG. 6, the case where the conductor pattern 4 is formed only on one surface of the base material 1 is illustrated, but in this embodiment, the case where the conductor pattern 4 is formed on both surfaces of the base material 1 will be described. That is, the conductive film 2 is formed on both sides (surfaces on both sides) of the substrate 1 and subjected to processing from the development process to the etching process. Furthermore, the base material 1 of this embodiment is a flat plate cut into a predetermined size.

The conveying device 11 conveys the substrate 1 on which the conductive film 2 is formed along a designated conveying path 20 from the upstream side to the downstream side. The conveyance path 20 has a first route 21 that extends in a straight line, a second route 22 that is arranged to be parallel to the first route 21 and extends in a straight line, and connects one end of the first route 21 and the second route 22 The third route 23 at one end of and the fourth route 24 connecting the other end of the second route 22 and the other end of the first route 21 are rectangular loops. The peeling device 14, the etching device 15 and the developing device 12 are arranged along the first route 21, and the pattern plating device 13 is arranged to extend along the second route 22. Between the etching device 15 and the developing device 12 of the first route 21, it is set that the operator M on the upstream side of the developing device 12 supplies the substrate 1 to the workpiece supply position 25 of the conveying path 20 and downstream of the etching device 15 The worker M on the side takes out the workpiece take-out position 26 of the substrate 1 on which the circuit formation is completed from the conveyance path 20. The conveying path 20 returns to the developing device 12 from the workpiece supply position 25 through the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15 in this order.

The conveying device 11 includes: a workpiece holding member 30 that holds the base material 1, a linear rail 31 (see FIG. 5) provided in correspondence with the first route 21 and the second route 22, and the third route 23 and the fourth route The first direction changing mechanism 32, the second direction changing mechanism 33, and the driving mechanism 37 are respectively provided along the route 24 (see FIG. 3).

As shown in Figure 5, the workpiece holding member 30 (see Figure 1 To FIG. 4) has: a workpiece holding portion 34 that freely detachably holds the upper edge of the base material 1, an arm portion 35 extending from the workpiece holding portion 34 to a slightly horizontal direction, and a movable movable along the rail 31 Section 36; The movable section 36 is moved along the rail 31 by the drive mechanism 37 (see Figure 3). That is, in the first route 21 and the second route 22, the workpiece holding member 30 moves along the rail 31. Furthermore, the base material 1 mounted to the workpiece holding member 30 at the workpiece supply position 25 is maintained in the state of being mounted to the workpiece holding member 30 and moved to the workpiece removal position 26, and then removed from the workpiece holding member at the workpiece removal position 26 30 was taken out.

As shown in FIG. 2, the first direction switching mechanism 32 slidably moves the workpiece holding member 30 that has reached one end of the first route 21 along the third route 23 in the first transfer chamber 41 to the second route 22 One end. Furthermore, as shown in FIG. 4, the second direction switching mechanism 33 slidably moves the workpiece holding member 30 that has reached the other end of the second route 22 to the first route along the fourth route 24 in the second transfer chamber 42 21 at the other end. Therefore, in the first route 21 and the second route 22, the movement direction 38 of the workpiece holding member 30 is reversed.

In addition, in the first transfer chamber 41 and the second transfer chamber 42, a plurality of spray nozzles (humidification chambers) in the humidification chamber for spraying fine water (mist) are provided for the purpose of preventing the moving substrate 1 from drying. Unit) 43, 44. By humidifying the inside of the first transfer chamber 41, the substrate 1 in a state where almost the entire surface is covered with a water film can be supplied to the pattern plating process. With this, the air oxidation of the exposed copper surface of the base material 1 can be suppressed to a minimum, and the strong oxide film removal treatment due to chemicals before plating becomes unnecessary. In addition, the hydrophilicity of the surface of the substrate 1 can be maintained well, and the necessary water washing treatment that has been excessive in the past can be largely omitted, which can bring about a great effect in saving water resources. Furthermore, by humidifying the inside of the second transfer chamber 42, the base material 1 in a non-dry state (wet state) can be supplied to the peeling process. With this, the surface of the substrate 1 can be kept in a state of being always wetted by water, and the hydrophilicity can be maintained well. Moreover, the means for humidifying the inside of each transfer chamber 41, 42 is not limited to the spray nozzles 43, 44 for spraying the mist, and other means (for example, a humidifier using ultrasonic waves, etc.) are also possible.

The operator M, as shown in FIG. 2, in the workpiece supply position 25, the upper edge of the substrate 1 is mounted on the workpiece holding portion 34 of the workpiece holding member 30 (see FIG. 5), as shown in FIG. 4, in the workpiece At the take-out position 26, the base material 1 is taken out from the workpiece holding portion 34 (see FIG. 5) of the workpiece holding member 30. The base material 1 mounted on the workpiece holding member 30 is hung from the workpiece holding portion 34 in a slightly vertical direction, and in the first route 21 and the second route 22 along the respective routes 21, 22 ( The movement direction 38) of the substrate 1 moves slightly horizontally. In the third route 23 and the fourth route 24, the surface direction of the substrate 1 and the respective routes 23, 24 (the movement direction 38 of the substrate 1) are slightly Move slightly horizontally in an orthogonal posture. In this way, the conveying device 11 is in a continuous conveying path 20 from the workpiece supply position 25 through the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15 to the workpiece removal position 26 to transport the substrate 1 Stand up and carry it in a slightly vertical position. Furthermore, the moving direction 38 of the base material 1 (work holding member 30) of the present embodiment is counterclockwise in Fig. 1, but it may be set to the opposite direction to the moving direction 38 (clockwise).

The developing device 12 is formed on the conductive film 2 of the substrate 1 conveyed along the conveying path 20 to form a plating resist 3 in a reverse pattern to the conductive pattern 4 (development process). Specifically, a dry film resist is laminated on the conductive film 2, and the image is exposed by irradiating ultraviolet rays through a mask, and then spraying a developer (for example, sodium carbonate) from a plurality of spray nozzles 40 toward both sides of the substrate 1. Develop to form a plating resist 3 (see Figure 3).

The pattern plating device 13 has: a plurality of plating chambers 13a arranged in a straight line along the second route 22 arranged on the downstream side of the developing device 12; in each plating chamber 13a, the conductive film 2 has not The surface area of the plating resist 3 is formed, and the conductive pattern 4 is formed (pattern plating process). Specifically, the substrate 1 is transported while being immersed in a specified plating solution (such as a copper sulfate plating solution) in a plating tank (not shown) in a standing state, and immersed while being transported. The conductor pattern 4 is formed by covering.

The pattern plating process performed in the pattern plating device 13 includes: pre-plating treatment, plating treatment, and post-plating treatment. The substrate 1 moves in sequence in the state of being immersed in the treatment liquid in each treatment tank: a plurality of treatment tanks for pre-plating treatment, a plurality of treatment tanks (plating tanks) for plating treatment, And multiple treatment tanks for post-plating treatment. The rails 31 of the second route 22 are set at the height position of the processing liquid to fully immerse the substrate 1 in each processing tank. Before and after each processing tank, the processing liquid is provided with the substrate 1 ( Lifting device for descending) and taking out (ascending). The lifting device raises the workpiece holding member 30, disengages the movable part 36 from the rail 31, moves the workpiece holding member 30 a predetermined distance to the downstream side and then descends, and then places the movable part 36 on the rail 31. After this, the substrate 1 that has been processed before plating is reached, from the first (most upstream) treatment tank to the last (most downstream) treatment tank, and it is repeated to lower the upstream end of the treatment tank and immerse it in the treatment liquid. Then it moves in the treatment liquid, moves up to the next treatment tank at the downstream end of the treatment tank, and then moves toward the plating treatment. The substrate 1 that has reached the plating treatment is from the first (most upstream) plating tank to the last (most downstream) plating tank, and it is repeated to lower the upstream end of the plating tank and immerse it in the treatment liquid. After moving in the treatment solution and moving toward the next plating tank at the downstream end of the plating tank, it moves toward the post-plating treatment. The substrate 1 that has reached the post-plating treatment is processed from the first (most upstream) treatment tank to the last (most downstream) treatment tank. The upstream end of the treatment tank is lowered and then immersed in the treatment liquid before treatment. After the movement in the liquid, the downstream end of the treatment tank rises and moves toward the next treatment tank, and then moves to the fourth route 24 (the second transfer chamber 42).

The peeling device 14 is arranged on the downstream side of the pattern plating device 13 to peel the plating resist 3 from the conductive film 2 (peeling process). Specifically, a predetermined peeling liquid (for example, an amine-based peeling liquid) is sprayed from a plurality of spray nozzles (not shown) toward both sides of the substrate 1 as in the case of the above-mentioned developing device 12 to peel the plating resist 3.

The etching device 15 is arranged on the downstream side of the peeling device 14 and removes the conductive film 2 outside the area under the conductor pattern 4 through chemical etching with a designated etching solution (etching process). Specifically, the designated etching solution (processing solution) is sprayed from a plurality of spray nozzles (not shown) toward both sides of the substrate 1 in the same manner as in the case of the above-mentioned developing device 12 to remove the conductivity other than the area under the conductor pattern 4 Film 2.

The cleaning device 16 is attached to the downstream side of each process (each process) of the devices 12, 13, 14, and 15 (the developing device 12 is the downstream side of the development process, and the pattern plating device 13 is the plating The downstream side of the pre-coating process and the downstream side of the plating process and the downstream side of the post-plating process, the peeling device 14 is the downstream side of the peeling process, and the etching device 15 is the downstream side of the etching process), and the substrate 1 is cleaned The two sides. Specifically, water or hot water is sprayed from a plurality of spray nozzles (not shown) toward both surfaces of the substrate 1 as in the case of the above-mentioned developing device 12 to wash both surfaces of the substrate 1. Furthermore, the cleaning device 16 attached to the pattern plating device 13 may also be a cleaning tank for storing a cleaning solution. In this case, before and after the washing tank, a lifting device for inserting and removing the substrate 1 with respect to the washing liquid is provided, and the substrate 1 is washed in a state of being immersed in the washing liquid.

According to the present embodiment, in the entire area where the continuous conveying path 20 from the workpiece supply position 25 through the development process, the pattern plating process, the peeling process, and the etching process to the workpiece removal position 26 is the continuous conveyance path 20, the substrate 1 is slightly erected. Transport in a vertical position (vertical transport). For this reason, it is possible to prevent contact between the base material 1 and the conveyance roller, etc., and it is possible to suppress the occurrence of defects such as wire breakage.

Furthermore, because the transport path 20 is continuous between the processes, it is not necessary to remove or install the substrate 1 between the processes. For this reason, there is no decrease in work efficiency, increase in man-hours, or enlargement or complication of the device due to the division of the conveying device, and no defects due to removal and installation of the substrate 1 occur.

As mentioned above, the present invention has been described based on the above-mentioned embodiment, but the present invention is not limited to the content of the above-mentioned embodiment, and of course, it can be appropriately changed without departing from the scope of the present invention.

For example, in the above embodiment, the substrate 1 is continuously conveyed vertically in the entire area of the conveying path 20 from the developing device 12 through the pattern plating device 13 and the peeling device 14 to the etching device 15; however, it may be continuously conveyed from the developing device 12 The substrate 1 is vertically transported within the range to the pattern plating device 13, and the substrate 1 is transported horizontally in the other ranges; and it may be from the pattern plating device 13 to the peeling device 14 (or the etching device 15) The base material 1 is conveyed vertically in the range up to this point, and the base material 1 is conveyed horizontally in the other ranges.

Moreover, the conveyance path 20 may not be formed in a loop shape, but may be formed in a linear shape (for example, a linear shape). Furthermore, the first direction switching mechanism 32 and the second direction switching mechanism 33 may not be provided, and the rail may be formed in a ring shape. By using a conveying device that does not have the direction change mechanism 32, 33 (for example, the conveying path is made into a linear shape or the rail is made into a loop, etc.), the substrate drawn from the roll can be continuous Keep it long and carry it.

[Industrial availability]

The present invention can be widely used as a conductor forming device and conductor manufacturing method such as a printed wiring board.

1‧‧‧Base material (substrate, processing object)

10‧‧‧Conductor forming device

11‧‧‧Transporting device (transporting unit)

12‧‧‧Developing device

13‧‧‧Pattern plating device

13a‧‧‧Plating room

14‧‧‧Peeling device

15‧‧‧Etching device

16‧‧‧Cleaning device

20‧‧‧Transportation path

21‧‧‧Route 1

22‧‧‧Route 2

23‧‧‧Route 3

24‧‧‧Route 4

25‧‧‧Workpiece supply position

26‧‧‧Workpiece removal position

30‧‧‧Workpiece holding member

32‧‧‧The first direction conversion mechanism

33‧‧‧The second direction switching mechanism

38‧‧‧Movement direction

41‧‧‧The first transfer room

42‧‧‧The second transfer room

M‧‧‧operator

Claims (6)

A conductor forming device includes: a conveying unit that conveys an object to be processed with a conductive thin film on the surface of an insulating substrate along a designated conveying path from the upstream side to the downstream side; and a developing device that is arranged along the aforementioned On the conductive film of the object to be processed that is conveyed by the conveying path, a plating resist is formed in a reverse pattern with the conductor pattern; and a pattern plating device is arranged on the downstream side of the developing device, and the conductive film The conductive pattern is formed on the surface area of the non-plating resist in the sexual film; the conveying unit has a movable part that can move along the rails provided in the conveying path, and detachably holds the processed object The upper part of the holding part, and the arm part that connects the movable part and the holding part; the processing object is held by the holding part at the supply position on the upstream side of the developing device, and then from the developing device The conveyance path to the pattern plating device is continuously conveyed in a substantially vertical posture by the conveying unit. The conductor forming apparatus according to claim 1, which is provided with a conveyance room through which the processing object that is conveyed along the conveyance path is arranged between the developing device and the pattern plating device; in the conveyance room, for To prevent the drying of the object to be processed, a humidification unit for humidifying the transport room is provided. A conductor forming apparatus including: a conveying unit that forms an object to be processed on a conductive film on the surface of an insulating substrate with a plating resist in a pattern that is inverse to the conductor pattern, and follows a designated conveyance path from upstream The side is conveyed toward the downstream side; a pattern plating device that forms the conductor pattern on the surface area where the plating resist has not yet been formed in the conductive film of the processing object conveyed along the conveying path; and The peeling device is arranged on the downstream side of the pattern plating device to peel the plating resist from the conductive film; the conveying unit has a movable part that can move along a rail provided in the conveying path, and a free A grip part that detachably grips the upper part of the object to be processed, and an arm that connects the movable part and the grip part; the object to be processed is in the conveying path from the pattern plating device to the peeling device Among them, the conveying unit is continuously conveyed in a substantially vertical posture by the conveying unit, and is separated from the grip part at the take-out position on the downstream side of the peeling device. The conductor forming apparatus according to claim 3, wherein an etching device is provided, which is located on the downstream side of the stripping device and is arranged on the upstream side of the removal position, and chemical etching using a designated etching solution is used to remove the conductor The aforementioned conductive film other than the area under the pattern. A conductor manufacturing method, comprising: a development process of forming a conductive film on the conductive film of an object to be processed that has a conductive film on the surface of an insulating substrate and is conveyed along a designated conveying path, forming a pattern that is inverse to the conductor pattern The plating resist; and the pattern plating process, which is formed in the surface area where the plating resist has not yet been formed in the conductive film of the object to be processed that is transported along the transport path from the development process The conductor pattern; a transport unit for transporting the object to be processed along the transport path has: a movable portion that can move along a rail provided in the transport path, a gripping portion that detachably holds the upper portion of the object to be processed, and The arm portion that connects the movable portion and the holding portion; the processing object is held by the holding portion at the supply position on the upstream side of the developing device, and during the transportation from the development process to the pattern plating process In the path, the object to be processed is erected in a slightly vertical posture by the transport unit to carry out continuous transport. A conductor manufacturing method comprising: a pattern plating process in which a plating resist is formed on a conductive film on the surface of an insulating substrate in a reverse pattern to the conductor pattern, and the foregoing process is carried along a designated transport path The conductive pattern is formed in the surface area of the conductive film of the object where the plating resist has not yet been formed; and the peeling process is from the process of the object to be processed that is transported along the transport path from the pattern plating process On the conductive film, the plating resist is peeled off; the conveying unit that conveys the object to be processed along the conveying path has a movable part that can move along the rails provided in the conveying path, and holds the processed object in a detachable manner The upper part of the object, and the arm that connects the movable part and the holding part; in the conveying path from the pattern plating process to the peeling process, the processing object is erected by the conveying unit The continuous conveyance is carried out in a slightly vertical posture, and the processing target object is detached from the grip portion at a take-out position on the downstream side of the peeling device.

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